JP5591850B2 - Game machine - Google Patents

Description

The present invention also relates to the gaming machine such as a slot machine.

  A gaming machine such as a slot machine is provided with a control board. A large number of electronic components are mounted on the control board, and a printed wiring pattern that is electrically connected to each electronic component is formed. And control regarding a series of games in a game machine, etc. are realized by operation of each electronic component.

  There are a wide variety of electronic components mounted on the control board, and these include components that generate heat during operation. When other electronic components become high temperature due to the heat generated from the electronic components serving as the heat source, the electronic components may be deteriorated or a malfunction of the circuit (thermal runaway) may occur.

  For this reason, various countermeasures against heat are taken on the control board. As a general countermeasure method, for example, there is a method in which a heat sink is provided in close contact with an electronic component serving as a heat source, and heat generated by the electronic component is dissipated from the heat sink into the air. Further, there is a method in which a fan is provided and air is supplied to the periphery of the electronic component serving as a heat source to cool the electronic component.

JP 2009-76505 A

  However, it has been found that simply cooling an electronic component serving as a heat source is insufficient for heat countermeasures for an electronic component having a low allowable temperature.

An object of the present invention can prevent overheating of the lower electronic component relatively allowable temperature in the electronic components mounted on a substrate to provide a Yu technique machine.

In order to achieve the above object, a gaming machine according to the present invention includes a housing and a control board disposed in the housing, and the control board includes a plurality of stacked boards and one outer layer. And a plurality of electronic components mounted on the mounting substrate, and a conductor pattern formed on each substrate. The electronic component includes a vanadium lithium secondary battery having a relatively low allowable temperature and a high heat resistant component having a relatively high allowable temperature. And the said conductor pattern avoids the part which opposes the said vanadium lithium secondary battery in a lamination direction in each board | substrate. Further, the vanadium lithium secondary battery is disposed at one end portion of the mounting substrate, the control substrate is disposed such that the one end portion of the mounting substrate is a lower end, and in the substrate other than the mounting substrate, The conductor pattern is not formed on a portion facing the vanadium lithium secondary battery in the stacking direction and an annular portion having a predetermined width around the portion, and in the mounting substrate, the vanadium lithium secondary battery is stacked in the stacking direction. A positive wiring and a negative wiring connected to the vanadium lithium secondary battery are formed in the facing portion and the annular portion of the predetermined width around the opposite portion, and the conductor pattern other than the positive wiring and the negative wiring is formed. Not .

  The substrate is an insulating substrate such as a glass epoxy substrate or a glass composite substrate. The conductor pattern formed on the substrate is made of a metal material such as a copper material and has a higher thermal conductivity than the insulating substrate. Therefore, when an electronic component serving as a heat source is mounted on the substrate, heat generated from the electronic component serving as the heat source spreads through the conductor pattern.

The conductor pattern is formed on each substrate so as to avoid a portion facing the vanadium lithium secondary battery having a low allowable temperature. Therefore, even if an electronic component serving as a heat source is mounted on the substrate, it is possible to suppress heat generated from the electronic component from being transmitted to the vanadium lithium secondary battery via the conductor pattern. As a result, overheating of the vanadium lithium secondary battery can be prevented.
In addition, since heat is easily transmitted upward, the vanadium lithium secondary battery is arranged at one end which is the lower end of the mounting board, so that even if an electronic component serving as a heat source is mounted on the mounting board, the electron It can suppress that the heat_generation | fever from components is transmitted to a vanadium lithium secondary battery .

In a substrate other than the mounting substrate, a conductor pattern is not formed on a portion facing the vanadium lithium secondary battery in the stacking direction and an annular portion having a predetermined width around the portion. Further, in the mounting substrate, the portion and the annular portion of a predetermined width around its opposed in the laminating direction vanadium lithium secondary battery positive electrode wiring and the anode wiring is connected to a vanadium lithium secondary batteries is formed, the positive electrode Conductor patterns other than the wiring and the negative electrode wiring are not formed.

Since no conductor pattern other than the positive electrode wiring and the negative electrode wiring is formed around the vanadium lithium secondary battery , heat can be satisfactorily suppressed from being transmitted to the vanadium lithium secondary battery through the conductor pattern, and the vanadium lithium secondary battery. Can be prevented from overheating.

Around the vanadium lithium secondary battery, it is preferable that slits and cutouts are formed through each substrate in the stacking direction.

By forming the slit, it is possible to prevent heat from an electronic component serving as a heat source from being transmitted to the vanadium lithium secondary battery via the substrate. As a result, overheating of the vanadium lithium secondary battery can be further prevented.

ADVANTAGE OF THE INVENTION According to this invention, even if the electronic component used as a heat source is mounted in the board | substrate, it can suppress that the heat_generation | fever from the electronic component is transmitted to a vanadium lithium secondary battery via a conductor pattern. As a result, overheating of the vanadium lithium secondary battery can be prevented, and consequently thermal destruction of the vanadium lithium secondary battery can be prevented.

FIG. 1 is a perspective view of a slot machine according to an embodiment of the present invention. FIG. 2 is a perspective view showing an internal configuration of the main body of the slot machine. FIG. 3 is a perspective view showing an internal configuration of the main body of the slot machine, and shows a state where three reels are removed. FIG. 4 is a silk diagram showing the arrangement of electronic components in one outer layer of the sub-board. FIG. 5 is a plan view showing a wiring pattern layout in one outer layer of the sub-board. FIG. 6 is a plan view showing a wiring pattern layout in the other outer layer of the sub-board. FIG. 7 is a plan view of the first inner layer of the sub-board. FIG. 8 is a plan view of the second inner layer of the sub-board.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
<External configuration of slot machine>

  FIG. 1 is a perspective view of a slot machine according to an embodiment of the present invention.

  The slot machine 1 includes a box-shaped main body 2 having an open front surface, and a front door 3 provided so that the front surface of the main body 2 can be opened and closed.

  In the main body 2, three reels 4L, 4C, 4R are arranged side by side at a position slightly above the central portion in the vertical direction. Each of the reels 4L, 4C, 4R has a configuration in which a reel band is wound around a peripheral surface of a drum-shaped reel frame, and is provided to be rotatable around an axis extending in the left-right direction at the center of the reel frame. Yes. In the reel band, for example, 21 types of symbols of multiple types are arranged side by side in the circumferential direction.

  The front door 3 is provided with a panel display unit 5, an operation unit 6 and an effect display unit 7.

  The panel display unit 5 is formed with a reel window 8 so that the three reels 4L, 4C, and 4R face all at once. During the rotation of the reels 4L, 4C, 4R, the symbols of the reels 4L, 4C, 4R appear one after another in the reel window 8. When the reels 4L, 4C, 4R are stopped, three symbols (9 symbols in total) of each reel 4L, 4C, 4R are displayed in the reel window 8.

  The operation unit 6 is disposed below the panel display unit 5. The operation unit 6 protrudes from the panel display unit 5 to the front, and has an upper surface 9 and a front surface 10 continuous with the front edge of the upper surface 9.

  A medal slot 11 is provided at the right end of the upper surface 9.

  When a medal is inserted (betted) from the medal insertion slot 11, the number of winning lines corresponding to the number of inserted coins (the number of bets) is activated. A maximum of three medals can be bet per game. When three or more medals are inserted from the medal slot 11, medals inserted in excess of three are deposited in the slot machine 1.

  Further, a MAX bet button 12, a 1-bet button 13, and a 2-bet bet button 14 are provided at the left end portion of the upper surface 9. The one bet button 13 and the two bet buttons 14 are arranged side by side on the left side of the MAX bet button 12.

  When the MAX bet button 12 is operated in a state where three or more medals are deposited in the slot machine 1, three medals are bet from the deposited medals. When the single bet button 13 is operated, one medal is bet from the medals deposited in the slot machine 1. When the two-bet button 14 is operated, two medals are bet from the medals deposited in the slot machine 1.

  On the front face 10, a start lever 15, a left stop button 16L, a middle stop button 16C, a right stop button 16R, and a settlement button 17 are provided. The left stop button 16L, the middle stop button 16C, and the right stop button 16R are arranged in this order from the left at the center of the front surface 10 in the left-right direction. The start lever 15 is disposed to the left of the left stop button 16L. The settlement button 17 is arranged further to the left of the start lever 15.

  When the start lever 15 is operated after one or more medals are bet, the reels 4L, 4C, and 4R start to rotate all at once. In response to the operation of the start lever 15, a lottery (internal lottery) is performed for a plurality of winning combinations. Thereafter, when the left stop button 16L, middle stop button 16C, and right stop button 16R are operated, the rotation of the reels 4L, 4C, and 4R stops. When all the reels 4L, 4C, 4R are stopped, one game is over.

  If a combination of symbols corresponding to any combination is arranged on the winning line that is activated when all the reels 4L, 4C, and 4R are stopped, the combination is won. Depending on the combination, a predetermined number of medals are paid out. The medals to be paid out for the winning are deposited in the slot machine 1 with an upper limit of 50, and the portion exceeding 50 is discharged to the tray 18 provided at the bottom of the front door 3.

  When the checkout button 17 is operated, medals deposited in the slot machine 1 are returned. The returned medal is discharged to the tray 18.

The effect display unit 7 is provided with a liquid crystal display 19 for displaying an effect image in accordance with the progress of the game. In addition, the effect display unit 7 is provided with speakers 20 that output sound effects and the like for increasing the atmosphere during the game on the left and right sides of the liquid crystal display 19.
<Internal configuration of slot machine>

  FIG. 2 is a perspective view showing an internal configuration of the main body of the slot machine. FIG. 3 is a perspective view showing an internal configuration of the main body of the slot machine, and shows a state where three reels are removed.

  The inside of the main body 2 is exposed by opening the front door 3 shown in FIG.

  Inside the main body 2, three reels 4L, 4C, 4R are arranged substantially at the center.

  A medal hopper 21 is provided below the three reels 4L, 4C, 4R. The medals inserted from the medal insertion slot 11 (see FIG. 1) are stored in the medal hopper 21. Further, medals paid out for winning a prize cannot be deposited in the slot machine 1 and are discharged from the medal hopper 21 to the tray 18.

A board case 22 is provided on the left side of the left reel 4L. The substrate case 22 is made of resin and has a substantially rectangular parallelepiped shape. The substrate case 22 is fixed to the left inner surface of the main body 2 and arranged in a posture extending in the vertical direction along the left inner surface. On the right side surface of the substrate case 22 (the surface facing the reel 4L), air holes 23 made up of a number of round holes are formed.
<Control board>

  FIG. 4 is a silk diagram showing the arrangement of electronic components in one outer layer of the sub-board. FIG. 5 is a plan view showing a wiring pattern layout in one outer layer of the sub-board. FIG. 6 is a plan view showing a wiring pattern layout in the other outer layer of the sub-board. FIG. 7 is a plan view of the first inner layer of the sub-board. FIG. 8 is a plan view of the second inner layer of the sub-board.

  The slot machine 1 is provided with a main board for central control related to a series of games in the slot machine, and a sub board for control of effects associated with the game. The sub board includes an audio control board 31 for controlling the output of the sound effect from the speaker 20. The voice control board 31 is accommodated in the board case 22 (see FIGS. 2 and 3).

  The voice control board 31 is composed of a multilayer printed wiring board having a structure in which four boards 32, 33, 34, and 35 are laminated. Each board | substrate 32-35 consists of a glass epoxy board | substrate, for example.

  As shown in FIG. 4, a plurality of electronic components are mounted on the substrate 32 forming one outer layer. The electronic components include a CPU 41 that is a control center, an SPU (sound processor IC) 42 for volume and sound quality control, a ROM 43 that stores a control program, a digital amplifier IC 44 that amplifies a digital audio signal, and LED lamp lighting control. And a secondary battery 46 as a backup power source. The secondary battery 46 is, for example, a vanadium lithium secondary battery, and has a lower allowable temperature (about 60 ° C.) than other electronic components.

  FIG. 4 is a silk diagram showing the arrangement of each electronic component, and the CPU 41, SPU 42, ROM 43, digital amplifier IC 44, LED driver IC 45, and secondary battery 46 are virtually shown.

  The arrangement of the CPU 41, the SPU 42, the ROM 43, the digital amplifier IC 44, the LED driver IC 45, and the secondary battery 46 will be described with reference to the time when the voice control board 31 accommodated in the board case 22 is viewed from the right side of the slot machine 1.

  The CPU 41 is disposed at a position slightly above the central portion of the substrate 32.

  The SPU 42 is positioned at the lower right side of the CPU 41 and is disposed substantially at the center of the substrate 32.

  Two ROMs 43 are provided. One ROM 43 is arranged on the right side of the CPU 41 with an interval. The other ROM 43 is arranged on the right side of the SPU 42 with an interval, and is located below the one ROM 43.

  Three digital amplifier ICs 44 are provided. One digital amplifier IC 44 is arranged below the SPU 42 with an interval. The other one digital amplifier IC 44 is arranged at a lower left side of the SPU 42 with a space therebetween. The remaining one digital amplifier IC 44 is arranged at the lower right side of the SPU 42 with a gap.

  The LED driver IC 45 is disposed above the CPU 41 with an interval.

  The secondary battery 46 is disposed at the lower left corner of the substrate 32. That is, a rectangular arrangement region 47 for arranging the secondary battery 46 is provided in the lower left corner of the substrate 32, and the secondary battery 46 is arranged in the arrangement region 47.

  Further, two slits 48 and 49 are formed in the substrate 32 along the periphery of the arrangement region 47. One slit 48 extends to the left and right along the upper edge of the arrangement region 47. A space is provided between the left end portion of the slit 48 and the left end edge of the substrate 32. The other slit 49 extends vertically along the right edge of the arrangement region 47. A space is provided between the lower end portion of the slit 49 and the lower end edge of the substrate 32.

  Further, as shown in FIG. 5, a wiring pattern 51 that is electrically connected to each electronic component is formed on the substrate 32. The wiring pattern 51 is made of a metal thin film such as a copper thin film, for example. The wiring pattern 51 is formed avoiding the arrangement region 47, and only the positive electrode wiring 52 and the negative electrode wiring 53 that are electrically connected to the secondary battery 46 are formed as the wiring pattern 51 in the arrangement region 47. . The positive electrode wiring 52 is led out from the arrangement region 47 through the space between the left end portion of the slit 48 and the left end edge of the substrate 32. The negative electrode wiring 53 is drawn from the arrangement region 47 to the outside through the space between the lower end portion of the slit 49 and the lower end edge of the substrate 32.

  A wiring pattern 61 is formed on the substrate 33 constituting the other outer layer, as shown in FIG. The wiring pattern 61 is not formed in the rectangular region 62 at the lower left corner of the substrate 33. The region 62 overlaps with the arrangement region 47 in the lower left corner of the substrate 32 in the stacking direction of the substrates 32 to 35.

  Further, two slits 63 and 64 are formed in the substrate 33 along the periphery of the region 62. One slit 63 extends right and left along the upper edge of the region 62. The other slit 64 extends vertically along the right edge of the region 62. The slits 63 and 64 overlap with the slits 48 and 49 of the substrate 32 in the stacking direction of the substrates 32 to 35, respectively.

  As shown in FIGS. 7 and 8, a plurality of vias 71 and 81 are provided through the substrates 34 and 35 forming the inner layer, respectively. The wiring patterns 51 of the substrate 32 and the wiring patterns 61 of the substrate 33 are electrically connected by the vias 71 and 81. The vias 71 and 81 are made of a metal material such as a copper material.

  The lower left corners of the substrates 34 and 35 are each cut out in a rectangular shape. Thereby, the slits 48 and 49 of the substrate 32 and the slits 63 and 64 of the substrate 33 communicate with each other in a state where the substrates 32 to 35 are overlapped with each other, and the sound control substrate 31 has the substrates 32 to 35 stacked in the stacking direction. Two slits penetrating through are formed.

  As described above, the substrates 32 to 35 are glass epoxy substrates. The wiring patterns 51 and 61 formed on the substrates 32 and 33 and the vias 71 and 81 formed on the substrates 34 and 35, respectively, are made of a metal material and have higher thermal conductivity than the substrates 32-35. ing. Therefore, when an electronic component serving as a heat source is mounted on the substrate 32, heat generated from the electronic component serving as the heat source spreads through the wiring patterns 51 and 61 and the vias 71 and 81.

  The wiring patterns 51 and 61 and the vias 71 and 81 are formed on each of the substrates 32 to 35 so as to avoid a portion facing the secondary battery 46 that is a low heat-resistant component having a low allowable temperature. Therefore, even if electronic components serving as heat sources are mounted on the substrates 32 to 35, heat generated from the electronic components can be prevented from being transmitted to the secondary battery 46 via the wiring patterns 51 and 61 and the vias 71 and 81. As a result, overheating of the secondary battery 46 can be prevented.

  The wiring pattern 61 is not formed in the rectangular region 62 in the lower left corner of the substrate 33. The lower left corners of the substrates 34 and 35 are cut out in a rectangular shape, and the vias 71 and 81 are naturally not formed in the cut out portions. Only the positive wiring 52 and the negative wiring 53 that are electrically connected to the secondary battery 46 are formed in the arrangement region 47 in the lower left corner of the substrate 32 that is the mounting substrate, and the wiring patterns 51 other than these are formed. Absent.

  Since the conductor patterns 51 and 61 and the vias 71 and 81 other than the positive electrode wiring 52 and the negative electrode wiring 53 are not formed around the secondary battery 46, heat is secondary through the conductor patterns 51 and 61 and the vias 71 and 81. Propagation to the battery 46 can be well suppressed, and overheating of the secondary battery 46 can be prevented.

  Around the secondary battery 46, it is preferable that two slits made of slits 48, 49, 63, 64 are formed so as to penetrate the substrates 32 to 35 in the stacking direction.

  By forming the slit, it is possible to prevent the heat from the electronic component serving as the heat source from being transmitted to the secondary battery 46 via the substrates 32 to 35. As a result, overheating of the secondary battery 46 can be further prevented.

  The secondary battery 46 is disposed at one end of the substrate 32, and the sound control substrate 31 is disposed such that one end of the substrate 32 is at the lower end.

  Since heat is easily transmitted upward, the secondary battery 46 is disposed at one end which is the lower end of the substrate 32, so that even if an electronic component serving as a heat source is mounted on the substrate 32, It is possible to suppress heat generation from being transmitted to the secondary battery 46. Therefore, overheating of the secondary battery 46 can be further prevented.

  As mentioned above, although one Embodiment of this invention was described, this invention can also be implemented with another form.

  For example, although the secondary battery 46 is illustrated as the low heat resistant component, other power storage devices such as an electric double layer capacitor can be illustrated in addition to the secondary battery 46.

  The substrates 32 to 35 are not limited to glass epoxy substrates but may be other types of insulating substrates such as glass composite substrates.

  Furthermore, although the case where this invention was applied to the slot machine 1 was taken as an example, this invention can be widely applied to game machines other than the slot machine 1, such as a pachinko machine.

  In addition, various design changes can be made to the above-described configuration within the scope of the matters described in the claims.

1 slot machine (game machine)
2 Body (housing)
31 Voice control board (control board for gaming machines)
32 substrate (mounting substrate)
33 Substrate 34 Substrate 35 Substrate 41 CPU (electronic component, high heat-resistant component)
42 SPU (electronic parts, high heat-resistant parts)
43 ROM (electronic parts, high heat-resistant parts)
44 Digital amplifier IC (electronic parts, high heat-resistant parts)
45 LED driver IC (electronic parts, high heat-resistant parts)
46 Secondary batteries (electronic parts, low heat-resistant parts, power storage devices)
47 Arrangement area 48 Slit 49 Slit 51 Wiring pattern (conductor pattern)
52 Positive electrode wiring 53 Negative electrode wiring 61 Wiring pattern (conductor pattern)
62 area 63 slit 64 slit 71 via (conductor pattern)
81 Via (conductor pattern)

Claims (2)

A housing,
A control board disposed in the housing,
The control board is
A plurality of stacked substrates;
A plurality of electronic components mounted on a mounting substrate forming one outer layer;
A conductor pattern formed on each substrate,
The electronic component includes a vanadium lithium secondary battery having a relatively low allowable temperature and a high heat-resistant component having a relatively high allowable temperature,
The conductor pattern is formed to avoid a portion facing each other in the stacking direction with the vanadium lithium secondary battery in each substrate,
The vanadium lithium secondary battery is disposed at one end of the mounting substrate,
The control board is arranged such that the one end of the mounting board is the lower end,
In the substrate other than the mounting substrate, the conductor pattern is not formed on the portion facing the vanadium lithium secondary battery in the stacking direction and the annular portion having a predetermined width around the portion,
In the mounting substrate, a positive electrode wiring and a negative electrode wiring connected to the vanadium lithium secondary battery are formed in a portion facing the vanadium lithium secondary battery in a stacking direction and an annular portion of the predetermined width around the portion. A gaming machine in which the conductor pattern other than the positive electrode wiring and the negative electrode wiring is not formed. The gaming machine according to claim 1, wherein a slit and a notch are formed around the vanadium lithium secondary battery so as to penetrate each substrate in the stacking direction.

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