JP5589112B2 - Joining method - Google Patents

Description

  The present invention relates to a joining method for joining two members with solder.

  Laser modules are widely used as devices that allow laser light to enter an optical fiber. The laser module includes a laser light source that emits laser light, an optical fiber that receives the laser light, and a heat dissipation substrate to which both the laser light source and the optical fiber are attached. The laser light source and the optical fiber are fixed to the heat dissipation substrate after being aligned so that the laser light emitted from the laser light source efficiently enters the optical fiber.

  In a laser module, normally, a laser light source and an optical fiber are not directly bonded to a heat dissipation substrate, but first a laser mount and a fiber mount are bonded to the heat dissipation substrate, and further, the laser light source and the optical fiber are laser bonded. A structure that joins the mount and the fiber mount is employed. For joining these members, Au—Sn (gold / tin) 90% solder, Au—Sn 20% solder or the like is frequently used. As a document disclosing the optical fiber having such a configuration, for example, Patent Document 1 is cited.

  Further, in Patent Document 2, a plurality of members constituting a laser module are joined in order without remelting the previously joined solder using Au—Sn solder having a Sn weight percentage concentration of 13% or less. A joining method is disclosed.

US Pat. No. 6,758,610 (registration date: June 6, 2004) JP2003-200289 (release date: July 15, 2003)

  However, the Au—Sn solder described above has the following problems.

  In other words, since the melting point of Au—Sn 20% solder is as high as 278 ° C., bonding members using Au—Sn 20% solder causes thermal strain on the members. Therefore, it is not suitable for joining members that are vulnerable to thermal strain, such as a semiconductor laser chip. Further, the Au—Sn solder described in Patent Document 2 has a melting point of 300 ° C. or higher, and is not suitable for joining members that are vulnerable to thermal strain.

  On the other hand, Au—Sn 90% solder has a melting point of 217 ° C. and is often used for joining semiconductor laser chips. However, since Au—Sn 90% solder is a soft solder having a small Young's modulus, there is a problem that the positional accuracy of the member is likely to be lowered.

  The present invention has been made in view of the above problems, and an object of the present invention is to realize a joining method in which a soft Au-Sn 90% solder having a low melting point can be used as a hard solder after joining.

  In order to solve the above-described problem, a joining method according to the present invention is a joining method in which a first member and a second member are joined by Au—Sn solder, and Sn in the Au—Sn solder before joining. The weight percent concentration of Sn is greater than 82.3%, and the weight percent concentration of Sn in the Au—Sn solder after bonding is 38.0% or more and 82.3% or less. In order to solve the above-mentioned problem, a joining method according to the present invention is a joining method in which a first member and a second member are joined with Au—Sn solder, and the Au—Sn solder before joining is provided. Is an Au—Sn 90% solder, and the weight percentage concentration of Sn in the Au—Sn solder after bonding is 38.0% or more and 82.3% or less.

  According to said structure, the Au-Sn solder after joining is hard solder containing the eutectic of (epsilon) -AuSn and (eta) -AuSn (weight% concentration of Sn in the said Au-Sn solder after joining is 55. 0% or more and 82.3% or less) or a hard solder containing a eutectic of δ-AuSn and ε-AuSn (the Sn wt% concentration in the Au-Sn solder after bonding is 38.0) % Or more and 61.0% or less). Further, when used in combination with the Au layer formed on the bonding surface of the first member or the second member, the Au-Sn solder or the Au-Sn 90% solder in which the Sn wt% concentration is more than 82.3%. Can be used as a hard solder after bonding.

  In the bonding method according to the present invention, an Au layer is formed on at least one of the bonding surface of the first member before bonding and the bonding surface of the second member before bonding, When the mass of Sn contained in the Au—Sn solder before joining is x and the total mass of Au contained in the Au—Sn solder and the Au layer before joining is y, 0.380 ≦ x / ( x + y) ≦ 0.823.

  According to the above configuration, the Au—Sn 90% solder can be easily used as the hard solder after joining by simply adjusting the thickness of the Au layer so that the mass of Au contained in the Au layer satisfies the above conditions. It becomes possible.

  In the bonding method according to the present invention, the Au—Sn solder before bonding is preferably Au—Sn 90% solder.

  According to the above configuration, hard solder can be realized by using widely used Au-Sn 90% solder.

  In addition, this invention is applicable also to the manufacturing method of the laser module including the joining process using the said joining method.

  The joining method according to the present invention is a joining method in which the first member and the second member are joined by Au—Sn solder, and the weight percentage concentration of Sn in the Au—Sn solder after joining is 38. It is 0% or more and 82.3% or less. Therefore, Au—Sn solder or Au—Sn 90% solder having a Sn wt% concentration greater than 82.3% can be used as the hard solder after bonding.

It is sectional drawing which shows the structure of two members joined by Au-Sn solder and this Au-Sn solder. (A) shows the state before joining, (b) shows the state after joining. It is a state figure (phase diagram) of Au-Sn solder. It is a perspective view which shows the whole image of the semiconductor laser module manufactured by the manufacturing method to which the joining method shown in FIG. 1 is applied. It is a schematic diagram which shows the manufacturing method of the semiconductor optical module shown in FIG.

[Outline of joining method]
A joining method according to an embodiment of the present invention will be described with reference to FIG. The joining method according to the present embodiment is a joining method in which two members A and B are joined by Au—Sn (gold / tin) solder S.

  Note that the two members A and B that are the object only need to have at least one plane. In this case, when these planes (hereinafter referred to as “joint surfaces”) are joined with the Au—Sn solder S, the joining method according to this embodiment can be applied. The materials of the members A and B are not particularly limited, but in the present embodiment, materials frequently used for optical devices such as laser modules such as AlN (aluminum nitride) and CuW (copper tungsten) are assumed.

  FIG. 1A is a cross-sectional view showing a state before the two members A and B are joined.

  An Au layer MA is formed on the bonding surface of the member A as shown in FIG. Similarly, an Au layer MB is also formed on the bonding surface of the member B as shown in FIG. These Au layers MA and MB are formed on the joint surfaces of the members A and B by plating, vapor deposition, or the like, and are sometimes referred to as “metallization”.

  The Au—Sn solder S is Au—Sn 90% solder formed into a plate shape. The melting point of the Au—Sn solder S is 217 ° C. and is often used for joining a semiconductor laser or the like that is vulnerable to thermal stress.

  The joining of the two members A and B with the Au—Sn solder S is performed by bringing the joining surface of the member A into contact with one main surface of the Au—Sn solder S and the joining surface of the member B with the Au—Sn solder S. The member B is heated by a heater stage or the like while being in contact with the other main surface. The heat conducted from the heater stage to the member B is further conducted from the member B to the Au—Sn solder S, and the temperature of the Au—Sn solder S is increased.

  When the temperature of the Au—Sn solder S exceeds the melting point 217 ° C., the Au—Sn solder S melts and diffuses into the Au—Sn solder S in which the Au contained in the Au layers MA to MB is melted. Therefore, the Sn wt% concentration in the molten Au—Sn solder S ″ (not shown) is smaller than the Sn wt% concentration in the Au—Sn solder S before bonding. This is because Au diffused from the MB increases the amount of Au contained in the Au—Sn solder S ″ in the molten state, and the proportion of Sn in the entire Au—Sn solder S ″ decreases.

  By cooling Au—Sn solder S ″ in the molten state, (1) eutectic of η-AuSn and β-Sn, (2) eutectic of ε-AuSn and η-AuSn, or (3 ) Eutectics of ε-AuSn and δ-AuSn can be precipitated. Which eutectic is precipitated is determined by the wt% concentration of Sn in the Au—Sn solder S ″ in the molten state. When the Au—Sn solder S ″ is further rapidly cooled, the Au—Sn solder S ″ solidifies while maintaining any eutectic composition. Thereby, joining of member A and member B is completed. Note that which eutectic is precipitated from the molten Au—Sn solder S ″ will be described later with reference to another drawing.

  FIG. 1B is a cross-sectional view showing a state after the two members A and B are joined.

  When all of Au constituting the Au layers MA to MB diffuses into the molten Au—Sn solder S ″, as shown in FIG. 1B, the member A is interposed via the joined Au—Sn solder S ′. And the member B. In the Au—Sn solder S ′ after joining, the wt% concentration of Sn is equal to the wt% concentration of the Au—Sn solder S ″ in the molten state. It is smaller than the wt% concentration of Sn in the previous Au—Sn solder S.

  When all Au constituting the Au layers MA to MB diffuses into the Au—Sn solder S ″ in the molten state, the weight percentage concentration of Sn in the Au—Sn solder S ′ after joining is given as follows. That is, the mass of Sn contained in the Au—Sn solder S before joining is x, the mass of Au contained in the Au—Sn solder S before joining is yS, and the mass of Au contained in the Au layer MA is yMA, Au Assuming that the mass of Au contained in the layer MB is yMB and the total mass of Au contained in these layers is y = yS + yMA + yMB, the Sn wt% concentration P ′ in the Au—Sn solder S ′ after joining is P ′ = 100 × x / (x + y).

  Next, physical properties of the Sn—Au solder S ′ after bonding will be described with reference to FIG. FIG. 2 is a phase diagram (phase diagram) of the Sn—Au alloy. In the state diagram of FIG. 2, the horizontal axis represents the Sn wt% concentration [wt%], and the vertical axis represents the temperature [° C.].

  First, the melting point of the Sn—Au solder S ′ after bonding will be described with reference to FIG.

  The melting point of the Sn—Au solder S ′ after bonding is determined according to the weight percentage concentration of Sn in the Sn—Au solder S ′ after bonding. Specifically, as shown in FIG. 2, if the Sn wt% concentration is 38% or more, the melting point of the Sn—Au solder S ′ after bonding increases as the Sn wt% concentration decreases. As described above, the Sn wt% concentration in the Sn—Au solder S ′ after bonding is smaller than the Sn wt% concentration in the Sn—An solder S before bonding. Therefore, the melting point of the Sn—Au solder S ′ after bonding is higher than the melting point of the Sn—An solder S before bonding.

  This property is very advantageous for joining members. That is, when the member B is joined to the member A and further the member C is joined to the member B, the melting point of the Sn—Au solder S ′ interposed between the already joined member A and the member B is joined from now on. The melting point of the Sn—Au solder S interposed between the member B and the member C is higher than 217 ° C. Therefore, even if the temperature of the member B is increased to 217 ° C. in order to melt the Sn—Au solder S interposed between the member B and the member C, it is interposed between the already joined member A and the member B. The Sn—Au solder S ′ does not melt.

  Next, the eutectic composition of the Sn—Au solder S ′ after bonding will be described with reference to FIG.

  As is apparent from FIG. 2, when the Sn weight percentage concentration in the molten Sn—Au solder S ″ is 82.3% or more and 90.0% or less, the Sn—Au solder S ′ after bonding is (1) It becomes a eutectic of η-AuSn and β-Sn. On the other hand, when the Sn wt% concentration in the molten Sn-Au solder S "is 55.0% or more and 82.3% or less, The Sn—Au solder S ′ after bonding includes (2) eutectic of ε-AuSn and η-AuSn. In addition, when the Sn weight percentage concentration in the molten Sn—Au solder S ″ is 38.0% or more and 61.0% or less, the Sn—Au solder S ′ after bonding is (3) δ-AuSn. And eutectic of ε-AuSn.

  By the way, the Young's modulus of ε-AuSn is 103 GPa, which is higher than that of AuSn 90% (40 GPa) and that of β-Sn (41.4 GPa). Further, the Young's modulus of δ-AuSn is 87 ± 9 GPa, which is also higher than the Young's modulus of AuSn 90% and β-Sn. Therefore, the Sn-Au solder S "in the molten state can function as a soft solder by setting the Sn weight% concentration to 38.0% or more and 82.3% or less. Au—Sn 90% solder can be made to function as a hard solder (hard solder) having a Young's modulus about twice that of the solder.

  This property is also a very suitable property for joining members. In other words, by appropriately changing the thickness of the Au layer formed on the surface of the target member, the bonding strength can be varied for each bonding point. For example, in a place where stress relaxation is important, the thickness of the Au layer is reduced to make Sn-Au solder function as a soft solder, and in a place where fixing of the member is important, the thickness of the Au layer is increased and Sn-Au is made thicker. It is possible to make the solder function as a hard solder.

  Note that the mass of Sn contained in the Au—Sn solder S before joining is x, the mass of Au contained in the Au—Sn solder S before joining is yS, the mass of Au contained in the Au layer MA is yMA, and the Au layer. Assuming that the mass of Au contained in MB is yMB and the total mass of Au contained in these is y = yS + yMA + yMB, the condition for functioning Au—Sn solder S as a hard solder is 0.380 ≦ x / (x + y ) ≦ 0.823.

[Application example]
Next, application examples of the bonding method according to the present embodiment will be described with reference to FIGS.

  First, the configuration of the semiconductor laser module 1 manufactured by applying the bonding method according to the present embodiment will be described with reference to FIG. FIG. 3 is a perspective view showing an overall image of the laser module 1 manufactured by applying the bonding method according to the present embodiment.

  The semiconductor laser module 1 is a laser module attached to the end of the optical fiber 2, and includes a substrate 10, a submount 20, a CoS (Chip on Submount) 30, a fiber mount 40, and a case 50 as shown in FIG. 3. I have. In FIG. 3, in order to clarify the internal structure of the semiconductor laser module 1, a part of the top plate and the side plate of the case 50 is omitted.

  The substrate 10 is a bottom plate of the semiconductor laser module 1. In this application example, as shown in FIG. 3, a plate-like member having a rounded rectangular main surface is used as the substrate 10. The substrate 10 functions as a heat sink for dissipating heat generated inside the semiconductor laser module 1 (particularly CoS 30) to the outside of the semiconductor laser module 1. For this reason, the board | substrate 10 is comprised with material with high heat conductivity, for example, Cu (copper), for example.

  As shown in FIG. 3, four convex portions 11 a to 11 d are provided on the upper surface of the substrate 10. These four convex portions 11 a to 11 d function as spacers for separating the lower surface of the submount 20 from the upper surface of the substrate 10. These four convex portions 11a to 11d are integrated with the substrate 10 and formed by punching or cutting.

  As shown in FIG. 3, the submount 20 is placed on the upper surface of the substrate 10.

  The submount 20 is a support that supports the CoS 30 and the fiber mount 40. In this application example, as shown in FIG. 3, a plate-shaped member having a rectangular main surface is used as the submount 20, and the lower surface of the submount 20 is parallel to the upper surface of the substrate 10. The long side of the main surface is arranged so as to be parallel to the long side of the main surface of the substrate 10. The submount 20 is joined to the upper surface of the substrate 10 by a soft solder 61 spreading between the lower surface of the submount 20 and the upper surface of the substrate 10. In joining the submount 20 and the substrate 10, 90% of Au—Sn solder is used as the soft solder 61 as described later.

  As shown in FIG. 3, the CoS 30 and the fiber mount 40 are placed on the upper surface of the submount 20. On the upper surface of the submount 20, the fiber mount 40 is disposed on the side from which the optical fiber 2 is drawn (right front side in FIG. 3, hereinafter referred to as “fiber side”), and the CoS 30 is the side from which the optical fiber 2 is drawn. It is arranged on the opposite side (the left rear side in FIG. 3, hereinafter referred to as “lead side”).

  The CoS 30 is obtained by integrating a laser mount 31 and a semiconductor laser chip 32.

  The laser mount 31 is a support that supports the semiconductor laser chip 32. In this application example, as shown in FIG. 3, a plate-like member having a rectangular main surface is used as the laser mount 31, and the lower surface of the laser mount 31 is parallel to the upper surface of the submount 20, and The long side of the main surface is arranged so as to be parallel to the long side of the main surface of the submount 20. The laser mount 31 is joined to the upper surface of the submount 20 by hard solder 62 spreading between the lower surface of the laser mount 31 and the upper surface of the submount 20. When joining the laser mount 31 and the submount 20, 90% of Au—Sn solder is used as the hard solder 62 as described later.

  A semiconductor laser chip 32 is mounted on the upper surface of the laser mount 31 as shown in FIG. The semiconductor laser chip 32 is a laser light source that emits laser light from its end face 32a. In this application example, a high-power semiconductor laser mainly made of GaAs (gallium arsenide) and having a cavity length of 5 mm or more is used. As shown in FIG. 3, the semiconductor laser chip 32 is disposed so that its extending direction is parallel to the long side of the main surface of the laser mount 31, and its lower surface is bonded to the upper surface of the laser mount 31. As shown in FIG. 3, the semiconductor laser chip 32 is connected to a circuit formed on the upper surface of the laser mount 31 via a wire 33, and is driven by a current supplied from this circuit.

  The fiber mount 40 is a support that supports the optical fiber 2. In this application example, as shown in FIG. 3, as the fiber mount 40, a plate-shaped member having a rectangular main surface is used, and the lower surface of the fiber mount 40 is parallel to the submount 20 and The main surface is arranged so that the long side thereof is perpendicular to the long side of the main surface of the submount 20. The fiber mount 40 is joined to the upper surface of the submount 20 by hard solder 63 spreading between the lower surface of the fiber mount 40 and the upper surface of the submount 20.

  As shown in FIG. 3, the optical fiber 2 drawn into the semiconductor laser module 1 through the insertion pipe 51 provided in the case 50 is placed on the fiber mount 40. The optical fiber 2 is disposed so that the tip 2 a processed into a wedge shape faces the end surface 32 a of the semiconductor laser chip 32, and is joined to the upper surface of the fiber mount 40 by the solder 64. Laser light emitted from the end face 32 a of the semiconductor laser chip 32 enters the optical fiber 2 from the tip 2 a and propagates through the optical fiber 2.

  Next, a manufacturing method of the laser module 1 to which the bonding method according to this embodiment is applied will be described with reference to FIG. Here, attention is particularly paid to the step of bonding the submount 20 to the substrate 10 and the step of bonding the laser mount 31 to the submount 20.

  First, a process of bonding the lower surface of the laser mount 31 to the upper surface of the submount 20 will be described.

  Before joining the laser mount 31 to the submount 20, as shown in FIG. 4, an Au layer 31b and an Au layer 20b are formed on the lower surface of the laser mount 31 and the upper surface of the submount 20, respectively. The thicknesses of these Au layers 31b and 20b are determined as follows. That is, the mass of Sn contained in the Au—Sn solder 62 before joining, which is Au—Sn 90% solder, is x, and the mass of Au contained in the Au—Sn solder 62 before joining is contained in y62 and the Au layer 31b. The mass of Au is y31b, the mass of Au contained in the Au layer 20b is y20b, and the total mass of Au contained in these is y = y62 + y31b + y20b, so that 0.380 ≦ x / (x + y) ≦ 0.823 Decide. In this case, the Au—Sn solder 62 after bonding functions as a hard solder, as already described with reference to FIG. In addition, as the Au—Sn solder 62 before joining, Au—Sn 90% solder formed in a plate shape is used.

  After performing the above preparation, the laser mount 31 and the submount 20 are joined by the following steps S1 to S8.

  Step S1: The submount 20 is placed on the heater stage.

  Step S2: The Au—Sn solder 62 formed in a plate shape is placed on the substrate 10.

  Step S3: The laser mount 31 is placed on the Au—Sn solder 62.

  Step S4: Heating of the submount 20 by the heater stage is started.

  When heating of the submount 20 by the heater stage is started, the temperature of the submount 20 gradually increases. When the temperature of the submount 20 reaches 217 ° C., the Au—Sn solder 62 starts to melt from the submount 20 side. At this time, Au constituting the Au layer 31b and the Au layer 20b diffuses into the molten Au—Sn solder 62, and the weight percentage concentration of Sn in the molten Au—Sn solder 62 is 38.0% or more and 82.3% or less. become. In order to promote the diffusion of Au, the Au—Sn solder 62 is heated as high as possible within a range that does not adversely affect the semiconductor laser chip 32, that is, the Au—Sn solder 62 is heated to 240 ° C. to 250 ° C. It is desirable to heat to about ° C.

  Step S5: When the Au—Sn solder 62 is completely melted, the laser mount 31 is scrubbed. Note that scrubbing the laser mount 31 refers to sliding the laser mount 31 several times in a plane parallel to the upper surface of the submount 20. Thereby, bubbles mixed between the Au—Sn solder 62 and the laser mount 31 are eliminated.

  Step S6: Stop the heating of the submount 20 by the heater stage. When the heating of the submount 20 by the heater stage is stopped, the temperature of the submount 20 gradually decreases.

  Step S7: The Au—Sn solder 62 is rapidly cooled. At this time, since the wt% concentration of Sn in the molten Au—Sn solder 62 is 38.0% or more and 82.3% or less, eutectic of ε-AuSn and η-AuSn, or δ-AuSn and ε-AuSn. And a eutectic.

  As described above, the joining of the laser mount 31 and the submount 20 is realized. The Au—Sn solder 62 after bonding becomes a hard solder having a large Young's modulus.

  Next, a process of bonding the lower surface of the submount 20 to the upper surface of the substrate 10 will be described. The step of bonding the submount 20 to the substrate 10 is performed after the step of bonding the laser mount 31 to the submount 20.

  Before bonding the submount 20 to the substrate 10, an Au layer 20a and an Au layer 10a are formed on the lower surface of the submount 20 and the upper surface of the substrate 10, respectively. The thicknesses of these Au layers 20a and 10a are determined as follows. That is, the mass of Sn contained in the Au—Sn solder 61 before joining is x, the mass of Au contained in the Au—Sn solder 61 before joining is y61, the mass of Au contained in the Au layer 20a is y20a, and the Au layer. Assuming that the mass of Au contained in 10a is y10a and the total mass of Au contained therein is y = y61 + y20a + y10a, it is determined to satisfy 0.823 ≦ x / (x + y) ≦ 0.900. In this case, the Au—Sn solder 61 after bonding functions as a soft solder, as already described with reference to FIG. In addition, as the Au—Sn solder 61 before joining, Au—Sn 90% solder formed in a plate shape is used.

  After performing the above preparation, the submount 20 and the substrate 10 are joined by the following steps T1 to T8.

  Step T1: The substrate 10 is placed on the heater stage.

  Step T2: The Au—Sn solder 61 formed in a plate shape is placed on the substrate 10.

  Step T3: The submount 20 is placed on the Au—Sn solder 61.

  Step T4: Heating of the substrate 10 by the heater stage is started.

  When heating of the substrate 10 by the heater stage is started, the temperature of the substrate 10 gradually increases. When the temperature of the substrate 10 reaches 217 ° C., the Au—Sn solder 61 starts to melt from the substrate 10 side. At this time, Au constituting the Au layer 20 diffuses into the molten Au—Sn solder 61, and the weight percentage concentration of Sn in the molten Au—Sn solder 61 becomes 82.3% or more and 90.0% or less.

  Step T5: When the Au—Sn solder 61 is completely melted, the submount 20 is scrubbed.

  Step T6: Stop the heating of the substrate 10 by the heater stage. When the heating of the substrate 10 by the heater stage is stopped, the temperature of the substrate 10 gradually decreases.

  Step T7: The Au—Sn solder 61 is rapidly cooled. At this time, since the wt% concentration of Sn in the molten Au—Sn solder 61 is 82.3% or more and 90.0% or less, a eutectic of η-AuSn and β-Sn is formed.

  As described above, the bonding between the submount 20 and the substrate 10 is realized. The Au—Sn solder 61 after joining becomes a soft solder having a small Young's modulus.

[Additional Notes]
The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

  The present invention can be widely applied to the joining of members using Au-Sn 90% solder. In particular, it can be widely applied to the joining of optical components using Au-Sn 90% solder.

A member (first member)
MA Au layer B member (second member)
MB Au layer S Au—Sn solder (before bonding) (Au—Sn 90% solder)
S 'Au-Sn solder (after bonding)
1 Semiconductor laser module (laser module)
10 Substrate 11a to 11d Protrusion 20 Submount 30 CoS
31 Laser mount 32 Semiconductor laser chip (laser light source)
40 Fiber mount 50 Case 61 Soft solder 62 Hard solder

Claims (5)

A joining method of joining a first member and a second member with Au-Sn solder,
An Au layer is formed on at least one of the bonding surface of the first member before bonding and the bonding surface of the second member before bonding,
The weight percent Sn concentration in the Au-Sn solder before bonding is greater than 82.3%,
A joining method, wherein a weight percent concentration of Sn in the Au—Sn solder after joining is 38.0% or more and 82.3% or less. A joining method of joining a first member and a second member with Au-Sn solder,
An Au layer is formed on at least one of the bonding surface of the first member before bonding and the bonding surface of the second member before bonding,
The Au—Sn solder before joining is Au—Sn 90% solder,
A joining method, wherein a weight percent concentration of Sn in the Au—Sn solder after joining is 38.0% or more and 82.3% or less. The mass of Sn contained in the Au-Sn solder before junction x, the total mass of Au is taken as y contained in the Au-Sn solder and the Au layer before bonding, 0.380 ≦ x / The bonding method according to claim 1, wherein (x + y) ≦ 0.823.   The joining method according to any one of claims 1 to 3, wherein a weight percent concentration of Sn in the Au-Sn solder after joining is 55.0% or more and 82.3% or less. .   The joining method according to any one of claims 1 to 3, wherein a weight percent concentration of Sn in the Au-Sn solder after joining is 38.0% or more and 61.0% or less. .

Images