JP5588287B2 - Thermosetting resin composition and semiconductor component mounting substrate - Google Patents

Description

  The present invention relates to a conductive paste for component mounting, particularly a thermosetting resin composition used as a solder paste containing a thermosetting resin binder, and a semiconductor component mounting in which components are mounted using this thermosetting resin composition. It relates to a substrate.

  In recent years, with the increase in the density and the number of pins of semiconductor components such as semiconductor packages, the BGA (BallGrid Array) is used instead of the method of mounting on the circuit board by soldering using leads like the conventional QFP (Quad Flat Package). ) And CSP (Chip Size Package), etc., a method of mounting on circuit boards using solder balls (solder bumps) is rapidly increasing (see, for example, Patent Document 1).

  BGA and CSP are often used for mobile devices such as mobile phones. For this reason, the BGA and CSP mounting structures are required to have a drop impact resistance, but in the case of joining only with solder balls, the drop impact resistance is lowered due to the brittleness of the solder.

  Therefore, the present inventor, in Japanese Patent Application No. 2009-77666, uses a thermosetting resin composition containing solder particles, and forms a joint portion between the solder portion and the resin cured portion covering the periphery of the solder portion. This solves the problem of reduced drop impact resistance.

Japanese Patent Laid-Open No. 2004-185884

  Incidentally, double-sided mounting is performed as the mounting of the semiconductor component 2 on the circuit board 3 as the semiconductor component 2 becomes denser and thinner. For example, as shown in FIG. 2, in the mounting of CSP or the like, the thermosetting resin composition 1 containing the solder particles described above is used, and the solder part 4 and the resin cured part 5 covering the periphery of the solder part 4 are used. The method of forming the joint 6 is very effective.

  However, the double-sided mounting is performed by mounting the semiconductor component 2 on the circuit board 3 one side at a time as shown in FIG. That is, as shown in FIG. 2 (a), after the semiconductor component 2 is first mounted on one surface of the circuit board 3 by the first heating in the reflow furnace, the circuit board 3 is turned over, and the circuit shown in FIG. Thus, the semiconductor component 2 is mounted on the other surface by the second heating in the reflow furnace. Therefore, the circuit board 3 is exposed twice to the high temperature by the reflow furnace. In this case, the solder part 4 of the joint part 6 formed first on the lower surface side of the circuit board 3 shown in FIG. Is melted again, and the solder jumps out of the joint portion 6 and the electrical connection between the semiconductor component 2 and the circuit board 3 is interrupted. Further, even if the periphery of the solder portion 4 is covered with the resin cured portion 5, the solder that has been remelted and liquefied by reflowing expands, so that the solder has a gap between the resin cured portion 5 and the circuit board 3, etc. By flowing into and spreading, a defect that short-circuits (flashes) with an adjacent electrode is likely to occur.

  In the above-mentioned Japanese Patent Application No. 2009-77666, the resin hardened portion 5 covers and reinforces the periphery of the solder portion 4, so that it is effective for drop impact resistance, but in order to prevent solder flash at the time of reflow. There is room for improvement. This is because the resin cured portion 5 that covers the periphery of the solder portion 4 is hard, but the solder portion 4 undergoes volume expansion due to reflow, and as a result, the solder is formed between the resin cured portion 5 and the circuit board 3. This is considered to be for jumping out of the gap or the like.

  The present invention has been made in view of the above points, and makes it difficult to cause solder flash even when a semiconductor component is mounted on a circuit board by re-flow while maintaining excellent drop impact resistance. It is an object of the present invention to provide a thermosetting resin composition and a semiconductor component mounting substrate that can be manufactured.

The thermosetting resin composition according to the present invention includes a solder particle having a melting point of 240 ° C. or less, a thermosetting resin binder, a silicone resin compound, and a compound represented by the following structural formula (1) or (2) as a flux component. At least one of them is contained, 1 to 30 parts by mass of the silicone resin compound is contained with respect to 100 parts by mass of the solder particles, the thermosetting resin binder becomes a continuous phase (sea component), and the silicone resin compound Becomes a dispersed phase (island component) to form a microdomain structure (sea-island structure), and is heated, whereby a solder portion in which the solder particles are fused and integrated, and a resin cured portion that covers the periphery of the solder portion, There is characterized in der Rukoto those formed.

式中、Ｒ_１〜Ｒ_４は水素、アルキル基又は水酸基を示し、Ｘは金属が配位可能な孤立電子対又は二重結合性π電子を有する原子団を示し、Ｙは主鎖骨格を形成する下記構造式（９）〜（１２）で示される原子又は原子団のうちの少なくとも１種類以上を示す。

式中、Ｒ _５ 及びＲ _６ は水素、アルキル基又は水酸基を示す。

In the formula, R _{1 to} R ₄ represent hydrogen, an alkyl group, or a hydroxyl group, X represents an atomic group having a lone electron pair or a double bond π electron to which a metal can coordinate, and Y forms a main chain skeleton And at least one of atoms or atomic groups represented by the following structural formulas (9) to (12) .

In the formula, R ₅ and R ₆ represent hydrogen, an alkyl group or a hydroxyl group.

  In the thermosetting resin composition, an epoxy resin is preferably used as the thermosetting resin binder.

  In the thermosetting resin composition, the silicone resin compound is preferably at least one of silicone oil, silicone gel, and silicone powder.

  In the thermosetting resin composition, X in the structural formula (1) or (2) may be at least one of atomic groups represented by the following structural formulas (3) to (8). preferable.

式中、Ｒは水素、アルキル基又は水酸基を示す。

In the formula, R represents hydrogen, an alkyl group or a hydroxyl group.

  In the thermosetting resin composition, the compound represented by the structural formula (1) or (2) is levulinic acid, glutaric acid, dimethylglutaric acid, succinic acid, malic acid, 5-ketohexanoic acid, 4-aminobutyric acid. , 3-phenylpropionic acid and 4-phenylbutyric acid are preferable.

  In the thermosetting resin composition, the compound represented by the structural formula (1) or (2) may be at least one of the compounds represented by the following structural formulas (13) to (15). preferable.

前記熱硬化性樹脂組成物において、前記熱硬化性樹脂バインダーに対して、前記フラックス成分が１〜５０ＰＨＲ含有されていることが好ましい。

In the thermosetting resin composition, the flux component is preferably contained in an amount of 1 to 50 PHR with respect to the thermosetting resin binder.

  The said thermosetting resin composition WHEREIN: It is preferable that the total amount of the said thermosetting resin binder and the said flux component is 3-50 mass% with respect to the said thermosetting resin composition whole quantity.

  The semiconductor component mounting board according to the present invention is characterized in that a semiconductor component is mounted on a circuit board using the thermosetting resin composition.

  According to the thermosetting resin composition according to the present invention, the solder part in which the solder particles are fused and integrated, and the resin cured part covering the periphery of the solder part, the joining part for joining the semiconductor component and the circuit board is provided. Silicone in the resin hardened part can be formed and can maintain excellent drop impact resistance by the resin hardened part, and even when a semiconductor component is mounted on a circuit board by reflow. The resin compound can make solder flash less likely to occur.

An example of the semiconductor component mounting substrate which concerns on this invention is shown, (a) (b) is a schematic sectional drawing. An example of the conventional semiconductor component mounting board | substrate is shown, (a) (b) is a schematic sectional drawing.

  Embodiments of the present invention will be described below.

  The thermosetting resin composition 1 according to the present invention is represented by the above structural formula (1) or (2) as a solder particle having a melting point of 240 ° C. or less, a thermosetting resin binder, a silicone resin compound, and a flux component. At least one of the compounds is contained as an essential component.

  The compounds represented by the structural formulas (1) and (2), which are flux components, have a carboxyl group and various functional groups at their terminals, and the flux activity at room temperature is not so great. When heated to a temperature of 100 ° C. or higher, chelates as shown in the following structural formulas (16) and (17) are formed and localized on the surface of the solder particles (M), and excellent activity power (reducing power) is obtained. As a result, the reaction between the carboxyl group and the metal oxide film (oxide film) on the surface of the solder particles is efficiently promoted, and the oxide film can be effectively removed from the solder particles.

なお、上記構造式（１６）及び（１７）中、Ｍははんだ粒子であって、Ａｇ、Ｂｉ、Ｃｕ、Ｉｎ、Ｓｎ等の金属を示し、またＲ_１〜Ｒ_４は省略している。

In the above structural formulas (16) and (17), M is a solder particle and represents a metal such as Ag, Bi, Cu, In, or Sn, and R _{1 to} R ₄ are omitted.

  Here, X in the structural formulas (1) and (2) represents an atomic group having a lone electron pair or a double bond π electron to which a metal can coordinate, specifically, a nitrogen atom, A group having a lone electron pair such as an oxygen atom or a sulfur atom and capable of forming a chelate, an organic group having a carbon / heteroatom double bond π electron such as a carbonyl group, a carboxyl group, a thiocarbonyl group or an imino group, Examples thereof include aromatic groups such as phenyl group, pyridyl group, imidazolyl group, vinyl group having carbon-carbon double bond, and organic group having conjugated double bond.

  In particular, X in the structural formula (1) or (2) is preferably at least one of the atomic groups represented by the structural formulas (3) to (8). Thereby, compared with the case where X is other atomic groups, the oxide film of a solder particle can be removed effectively.

  Y in the structural formulas (1) and (2) represents an atom or atomic group forming a main chain skeleton, and among the atoms or atomic groups represented by the structural formulas (9) to (12), It is preferable that it is at least 1 type or more. Thereby, compared with the case where Y is another atom or atomic group, the oxide film of a solder particle can fully be removed.

  Specifically, the compound represented by the structural formula (1) or (2) includes levulinic acid, glutaric acid, dimethylglutaric acid, succinic acid, malic acid, 5-ketohexanoic acid, 4-aminobutyric acid, 3- It is preferably at least one of phenylpropionic acid and 4-phenylbutyric acid. Thereby, compared with other flux components, the oxide film of the solder particles can be removed more effectively.

  Examples of the compound having a carboxyl group at both ends generally include an adipic acid, pimelic acid, sebacic acid and corkic acid having an aliphatic skeleton. However, they cannot be expected to have a sufficient reducing action on the oxide film on the metal surface, and the reducing power is sufficiently satisfactory as compared with the compounds represented by the structural formulas (1) and (2). is not. This is because the ability to form chelates as shown in the above structural formulas (16) and (17) is inferior due to the large molecular weight of adipic acid, pimelic acid, sebacic acid, corkic acid and the like. Inferred.

  In addition, the compound represented by the structural formula (1) or (2) includes a compound represented by the structural formula (13) (diglycolic acid) and a compound represented by the structural formula (14) (thiodiglycolic acid). The compound represented by the structural formula (15) is preferably at least one of the compounds (dithiodiglycolic acid). As shown in the above structural formulas (13) to (15), a compound having a structure in which an oxygen atom or one or two sulfur atoms are bonded to the main skeleton is superior to an aliphatic skeleton compound. Can demonstrate power. The reason for this is that the oxygen and sulfur atoms in the main skeleton are electron-donating atoms, so the coordination bond with the metal is enhanced, and as a result, it exhibits superior reducing power compared to aliphatic skeleton compounds. It is presumed that this is possible. Therefore, the compound represented by the structural formula (1) or (2) is at least one or more of the compounds represented by the structural formulas (13) to (15), thereby comparing with other flux components. Thus, an excellent reducing power can be exhibited, and the oxide film of the solder particles can be removed more effectively.

  In the present invention, at least one of the compounds represented by the structural formula (1) or (2) is used. However, other commonly used flux components may be used in combination. Absent.

  The thermosetting resin composition 1 according to the present invention contains a silicone resin compound. Thermosetting resin binders such as epoxy resins have the disadvantage of hardness, but this drawback can be compensated by the softness that is an advantage of the silicone resin compound. Then, when such a thermosetting resin composition 1 is heated between the terminals of the semiconductor component 2 and the electrodes of the circuit board 3 by reflow or the like, the semiconductor component 2 and the circuit board 3 are melted and integrated by solder particles. Can be formed. At the same time, a resin cured portion 5 having expandability can be formed around the solder portion 4. Therefore, even if the solder part 4 is remelted and expanded by re-flow or the like, the resin cured part 5 around it also expands, so that the solder is prevented from seeping out from the gap or the like of the resin cured part 5 and the solder flash. Can be made difficult to occur. And since the resin hardening part 5 not only has expansibility but also remains to some extent, it is maintaining the outstanding drop impact resistance.

  In particular, the thermosetting resin composition 1 may form a microdomain structure (sea-island structure) with a thermosetting resin binder as a continuous phase (sea component) and a silicone resin compound as a dispersed phase (island component). preferable. Thereby, low elasticity of the resin cured portion 5 can be achieved, generation of gaps such as cracks can be suppressed, and solder flash can be further prevented. Here, whether or not a microdomain structure (sea-island structure) is formed is related to the compatibility and ratio of the thermosetting resin binder and the silicone resin compound. For example, when an epoxy resin is used as a thermosetting resin binder and dimethylsiloxane alone is used as a silicone resin compound, the two are usually poorly compatible, so they are separated into two layers. The compatibility with the epoxy resin is improved to the extent that it does not dissolve, and a microdomain structure (sea-island structure) is formed. The higher ratio is the continuous phase (sea component), and the lower ratio is the dispersed phase (island component), but the thermosetting resin binder needs to be the continuous phase (sea component). Resin binder: silicone resin compound (mass ratio) = 60: 40 to 90:10 is preferable. In this case, the thermosetting resin binder includes a curing agent and a curing accelerator.

  The silicone resin compound is preferably at least one of silicone oil, silicone gel, and silicone powder. As a result, solder flash can be made less likely to occur than when other silicone resin compounds are used.

  Here, when using an epoxy resin as a thermosetting resin binder, it is preferable to use a silicone oil having an epoxy group at the side chain or terminal of the silicone resin. Originally, the epoxy resin and the silicone resin compound are easy to separate into two layers and have poor compatibility. However, the use of silicone oil having an epoxy group at the side chain or terminal improves the compatibility with the epoxy resin and the microdomain structure. (Sea island structure) can be formed. Specific examples of silicone oil include product numbers “BY16-855”, “SF8411” and “SF8421” manufactured by Toray Dow Corning Co., Ltd., and product numbers “X22-163” and “KF-105” manufactured by Shin-Etsu Chemical Co., Ltd. Etc.

Silicone gel is a general term for a cured jelly-like silicone resin obtained by reacting a silicone resin having a vinyl group: —SiCH═CH ₂ and a silicone resin having hydrogen: —SiH using a platinum catalyst. And by performing said reaction in thermosetting resin binders, such as an epoxy resin, it becomes possible to form the micro domain structure (sea island structure) in which the silicone gel became the dispersed phase (island component). Specific examples of the silicone gel include product numbers “KE-1056”, “KE-1151” and “FE-57” manufactured by Shin-Etsu Chemical Co., Ltd.

  Silicone powder is obtained by pulverizing three-dimensionally crosslinked silicone rubber to a size of several microns. By applying shape control and surface treatment, familiarity with thermosetting resin binders such as epoxy resin is improved and dispersed uniformly in thermosetting resin binders to form a microdomain structure (sea-island structure). It becomes possible. As a specific example of the silicone powder, a product number “Torefill Series” manufactured by Toray Dow Corning Co., Ltd. can be cited.

  Moreover, it is preferable that 1-30 mass parts of silicone resin compounds are contained with respect to 100 mass parts of solder particles. Thereby, the hardness of the hardened | cured material of thermosetting resin binders, such as an epoxy resin, can be relieve | moderated. Due to this relaxation effect, the cured resin portion 5 formed around the solder portion 4 can be softened, and when reflowing, the solder portion 4 melts and expands and penetrates into the gaps of the cured resin portion 5 and spreads. It is possible to suppress galling and to prevent solder flash. However, if the content of the silicone resin compound is less than 1 part by mass, the solder flash prevention effect may not be sufficiently obtained. On the contrary, if the content of the silicone resin compound is more than 30 parts by mass, the connection strength between the semiconductor component 2 and the circuit board 3 by the resin curing part 5 may be reduced.

  The solder particles may have a melting point of 240 ° C. or lower. Although the minimum of melting | fusing point of a solder particle is not specifically limited, It is preferable that it is 80 degreeC or more. As long as these conditions are satisfied, the composition of the solder particles is not particularly limited, and examples thereof include alloys with metals such as Bi, Zn, and In based on Sn. Specifically, Sn42Bi58 (melting point: 139 ° C.) and Sn96.5Ag3.0Cu0.5 (melting point: 218 ° C.) can be exemplified.

  Moreover, it is preferable that content of a solder particle is 50-97 mass% with respect to the thermosetting resin composition 1 whole quantity. If the content of the solder particles is less than 50% by mass, the joint portion (solder portion 4) formed by melting and integrating the solder particles becomes too small, and the conductivity may be deteriorated. On the other hand, when the content of the solder particles exceeds 97% by mass, the reinforcing effect by the thermosetting resin binder may be reduced.

  Further, the thermosetting resin binder is not particularly limited. For example, an appropriate thermosetting resin such as an epoxy resin, a polyimide resin, a cyanate ester resin, a benzoxazine resin, or a polyester resin may be used. it can. Among these, it is particularly preferable to use an epoxy resin as the thermosetting resin binder. Epoxy resin cures at a relatively low temperature and has high adhesiveness. Therefore, it exhibits sufficient curability even at a temperature lower than the temperature of conventional solder reflow processing (about 240 ° C.), enabling component mounting and sufficient. A reinforcing effect can be exhibited.

  Moreover, when using a liquid epoxy resin as a thermosetting resin binder, the thermosetting resin composition 1 is made to contain a hardening | curing agent and a hardening accelerator as needed.

  Although it does not specifically limit as a hardening | curing agent, For example, a phenol novolak resin, a naphthalene skeleton containing phenol resin, a dicyclopentadiene type phenol resin, a phenol aralkyl resin, etc. can be used. Although content of a hardening | curing agent can be set suitably, a hardening | curing agent is included so that the stoichiometric equivalent ratio of the hardening | curing agent with respect to the epoxy equivalent of an epoxy resin may become the range of 0.8-1.2. Is preferred. Further, the curing accelerator is not particularly limited, and examples thereof include organic phosphorus compounds such as triphenylphosphine and trimethylphosphine, 2-methylimidazole, 2-phenyl-4-methylimidazole, 2-phenylimidazole and the like. Imidazoles, tertiary amines such as 1,8-diazabicyclo (5,4,0) undecene-7, triethanolamine and benzyldimethylamine can be used.

  Moreover, it is preferable that 1-50 PHR of flux components are contained with respect to the thermosetting resin binder. Thereby, while being able to fully exhibit the effect | action of a flux component, the reinforcement property after hardening of the thermosetting resin composition 1 can be acquired highly. However, if the content of the flux component is less than 1 PHR, the concentration may be too thin to exhibit a sufficient effect as the flux component, so that the fusion integration of the solder particles is hindered and the connection resistance is high. There is a risk of becoming. On the other hand, if the content of the flux component exceeds 50 PHR, tackiness may remain after the thermosetting resin composition 1 is cured, or the reinforcing property may not be sufficiently high. The flux component (PHR) can be calculated by {(mass of flux component / mass of thermosetting resin binder) × 100}. In this case, the thermosetting resin binder includes a curing agent and a curing accelerator.

  Moreover, it is preferable that the total amount of a thermosetting resin binder and a flux component is 3-50 mass% with respect to the thermosetting resin composition 1 whole quantity. In this case, the thermosetting resin binder includes a curing agent and a curing accelerator. Thereby, the flowable thermosetting resin composition 1 can be obtained. Further, a resin cured portion 5 made of a cured product of a thermosetting resin binder having no voids is formed around the solder portion 4 formed by melting and integrating the solder particles, and the resin cured portion 5 provides sufficient reinforcement. It is possible to obtain sex. Furthermore, it is possible to prevent the fusion and integration of solder particles from being hindered, and a sufficiently low connection resistance can be obtained. However, when the total amount of the thermosetting resin binder and the flux component is less than 3% by mass, there is a possibility that the thermosetting resin composition 1 that is flowable or powdery cannot be obtained. In addition, after the solder particles are melted and integrated, a resin cured portion 5 made of a cured product of a thermosetting resin binder is formed around the solder portion 4, and the resin cured portion 5 contains a lot of voids. Accordingly, there is a possibility that sufficient reinforcing properties cannot be obtained depending on such a resin cured portion 5. On the contrary, when the total amount of the thermosetting resin binder and the flux component exceeds 50% by mass, the proportion of the solder particles is too small to inhibit the fusion integration, and a sufficiently low connection resistance can be obtained. There is a risk of loss.

  In addition, the thermosetting resin composition 1 which concerns on this invention may contain the modifier, additive, etc. which are used normally other than the said essential component. Moreover, a low boiling-point solvent and a plasticizer can also be added in order to reduce the viscosity of the thermosetting resin composition 1 and to impart fluidity. Furthermore, it is also effective to add hardened castor oil or stearamide as a thixotropic agent for maintaining the printed shape.

  And the thermosetting resin composition 1 which concerns on this invention uses a disper etc. for a solder particle whose melting | fusing point is 240 degrees C or less, a thermosetting resin binder, a silicone resin compound, a flux component, and other components as needed. It can be produced by uniformly mixing and kneading.

  Next, the semiconductor component mounting board according to the present invention will be described. As shown in FIG. 1, the semiconductor component mounting substrate is formed by mounting a semiconductor component 2 on a circuit substrate 3 using a thermosetting resin composition 1. As the semiconductor component 2, not only BGA and CSP but also QFP can be used.

  The semiconductor component mounting substrate shown in FIG. 1 is formed by mounting a semiconductor component 2 such as BGA or CSP on both surfaces of a circuit substrate 3 such as FR-4 using a thermosetting resin composition 1. It can be manufactured as follows. First, the thermosetting resin composition 1 is applied to each electrode provided on one surface of the circuit board 3, and the semiconductor component 2 is further placed thereon. Then, as shown in FIG. The semiconductor component 2 is first mounted on one surface of the circuit board 3 by the second heating. At this time, the thermosetting resin composition 1 is cured to form a joint 6 that joins the terminal of the semiconductor component 2 and the electrode of the circuit board 3. The joint portion 6 is formed by a solder portion 4 in which solder particles are fused and integrated, and a resin cured portion 5 that covers the periphery of the solder portion 4. Next, the circuit board 3 is turned over, the thermosetting resin composition 1 is applied to each of the electrodes provided on the other surface of the circuit board 3, and the semiconductor component 2 is further placed thereon. As shown in (b), the semiconductor component 2 is mounted on the other surface of the circuit board 3 by the second heating in the reflow furnace. At this time, the thermosetting resin composition 1 is cured in the same manner as described above, and the joint portion 6 that joins the terminal of the semiconductor component 2 and the electrode of the circuit board 3 is formed. The joint portion 6 is also formed by a solder portion 4 in which solder particles are fused and integrated, and a resin cured portion 5 that covers the periphery of the solder portion 4.

  Conventionally, due to the second heating (re-reflow) described above, the solder part 4 of the joint part 6 between the semiconductor component 2 and the circuit board 3 mounted earlier is remelted and expanded, so that FIG. As shown, the solder may ooze out from the gap between the resin cured portion 5 and the circuit board 3, cracks generated in the resin cured portion 5, or the like. Therefore, the electrical connection between the semiconductor component 2 and the circuit board 3 is interrupted, or the solder flows into the gap between the resin-cured portion 5 and the circuit board 3 and spreads to cause a short circuit (flash) with the adjacent electrode. It was easy for a defect to occur.

  However, in the semiconductor component mounting substrate shown in FIG. 1, even if the solder portion 4 of the joint portion 6 between the semiconductor component 2 and the circuit substrate 3 mounted earlier is remelted and expanded by the second heating, the solder The resin cured portion 5 having expansibility surrounds the periphery of the portion 4, and the resin cured portion 5 also expands and does not form a gap, so that solder does not ooze out from the joint portion 6 and solder flash occurs. It is difficult. That is, since the resin cured portion 5 contains a silicone resin compound, the softness that is an advantage of the silicone resin compound can compensate for the hardness that is a defect of a thermosetting resin binder such as an epoxy resin. Therefore, it is possible to achieve both the reinforcement of the solder portion 4 and the prevention of flashing when the solder portion 4 is remelted by such a resin cured portion 5.

  As described above, in the thermosetting resin composition 1 according to the present invention, the semiconductor component 2 includes the solder part 4 in which the solder particles are fused and integrated, and the resin cured part 5 that covers the periphery of the solder part 4. And the circuit board 3 can be joined together. And excellent drop impact resistance can be maintained by the cured resin portion 5 that reinforces the solder portion 4. Further, even when the semiconductor component 2 is mounted on the circuit board 3 by re-flow, the solder flash can be made difficult to occur by the silicone resin compound in the resin cured portion 5.

  Hereinafter, the present invention will be specifically described by way of examples.

Example 1
Sn42Bi58 (Sn42 mass%, Bi58 mass%) was used as the solder particles. The average particle size of the solder particles was 20 μm, and the melting point was 139 ° C. 80 parts by mass of solder particles, 11 parts by mass of liquid epoxy resin (product number “YD128”, manufactured by Toto Kasei Co., Ltd.) as a thermosetting resin binder, and silicone oil (product number, manufactured by Shin-Etsu Chemical Co., Ltd.) as a silicone resin compound 3 parts by weight of “X22-163C”), 2 parts by weight of a curing accelerator (manufactured by Ajinomoto Fine Techno Co., Ltd., product number “Amicure PN23”), 2 parts by weight of levulinic acid as a flux component, and uniformly using a disper By mixing and kneading, a paste-like thermosetting resin composition was obtained.

(Example 2)
A thermosetting resin composition was obtained in the same manner as in Example 1 except that glutaric acid was used as the flux component.

(Example 3)
A thermosetting resin composition was obtained in the same manner as in Example 1 except that 2,2-dimethylglutaric acid was used as the flux component.

Example 4
A thermosetting resin composition was obtained in the same manner as in Example 1 except that succinic acid was used as the flux component.

(Example 5)
A thermosetting resin composition was obtained in the same manner as in Example 1 except that malic acid was used as the flux component.

(Example 6)
A thermosetting resin composition was obtained in the same manner as in Example 1 except that 4-phenylbutyric acid was used as the flux component.

(Example 7)
A thermosetting resin composition was obtained in the same manner as in Example 1 except that diglycolic acid was used as the flux component.

(Example 8)
A thermosetting resin composition was obtained in the same manner as in Example 1 except that silicone powder (manufactured by Toray Dow Corning Co., Ltd., product number “Trefil 601”) was used as the silicone resin compound.

Example 9
A thermosetting resin composition was obtained in the same manner as in Example 1 except that 6 parts by mass of silicone oil (manufactured by Shin-Etsu Chemical Co., Ltd., product number “X22-163C”) was used as the silicone resin compound.

(Example 10)
Sn42Bi58 (Sn42 mass%, Bi58 mass%) was used as the solder particles. The average particle size of the solder particles was 20 μm, and the melting point was 139 ° C. 80 parts by mass of solder particles, 13 parts by mass of cyanate ester resin (manufactured by Lonza, product number “L-10”) as a thermosetting resin binder, and silicone oil (manufactured by Shin-Etsu Chemical Co., Ltd.) as a silicone resin compound 3 parts by mass of product number “X22-163C”), 0.1 part by mass of Fe acetylacetonate as a curing accelerator, and 2 parts by mass of levulinic acid as a flux component, and uniformly mixing and kneading using a disper Thus, a paste-like thermosetting resin composition was obtained.

(Example 11)
Sn96.5Ag3.0Cu0.5 (Sn96.5% by mass, Ag3.0% by mass, Cu0.5% by mass) was used as the solder particles. The average particle size of the solder particles was 20 μm, and the melting point was 218 ° C. 80 parts by mass of solder particles, 11 parts by mass of liquid epoxy resin (product number “YD128”, manufactured by Toto Kasei Co., Ltd.) as a thermosetting resin binder, and silicone oil (product number, manufactured by Shin-Etsu Chemical Co., Ltd.) as a silicone resin compound 3 parts by mass of “X22-163C”), 2 parts by mass of a curing accelerator (manufactured by Ajinomoto Fine Techno Co., Ltd., product number “Amicure PN23”), 2 parts by mass of glutaric acid as a flux component, and uniformly using a disper By mixing and kneading, a paste-like thermosetting resin composition was obtained.

  The thermosetting resin compositions of Examples 1 to 11 form a microdomain structure (sea-island structure) in which the thermosetting resin binder is a continuous phase (sea component) and the silicone resin compound is a dispersed phase (island component). Was. Whether or not a microdomain structure (sea-island structure) was formed was confirmed by curing only the thermosetting resin composition and observing it with a microscope.

(Comparative Example 1)
Sn42Bi58 (Sn42 mass%, Bi58 mass%) was used as the solder particles. The average particle size of the solder particles was 20 μm, and the melting point was 139 ° C. 80 parts by mass of solder particles, 12 parts by mass of a liquid epoxy resin (product number “YD128” manufactured by Toto Kasei Co., Ltd.) as a thermosetting resin binder, and silicone oil (manufactured by Shin-Etsu Chemical Co., Ltd., product number) as a silicone resin compound 3 parts by mass of “X22-163C”) and 3 parts by mass of a curing accelerator (manufactured by Ajinomoto Fine Techno Co., Ltd., product number “Amicure PN23”) are mixed and kneaded uniformly using a disper to form a paste A thermosetting resin composition was obtained.

(Comparative Example 2)
Sn42Bi58 (Sn42 mass%, Bi58 mass%) was used as the solder particles. The average particle size of the solder particles was 20 μm, and the melting point was 139 ° C. Then, 80 parts by mass of solder particles, 14 parts by mass of liquid epoxy resin (product number “YD128”, manufactured by Toto Kasei Co., Ltd.) as a thermosetting resin binder, and a curing accelerator (product number “Amure PN23, manufactured by Ajinomoto Fine Techno Co., Ltd.) )) And 3 parts by mass of levulinic acid as a flux component were mixed, and uniformly mixed and kneaded using a disper to obtain a paste-like thermosetting resin composition.

(Comparative Example 3)
Sn42Bi58 (Sn42 mass%, Bi58 mass%) was used as the solder particles. The average particle size of the solder particles was 20 μm, and the melting point was 139 ° C. And 85 parts by mass of solder particles, 3 parts by mass of silicone oil (manufactured by Shin-Etsu Chemical Co., Ltd., product number “X22-163C”) as a silicone resin compound, 5 parts by mass of levulinic acid as a flux component are mixed, and a disper is used. By mixing and kneading uniformly, a paste-like composition was obtained.

(Comparative Example 4)
A thermosetting resin composition was obtained in the same manner as in Example 1 except that silver powder having a melting point of 950 ° C. was used instead of the solder particles.

(Evaluation test)
The following evaluation tests were performed using the thermosetting resin compositions obtained in the respective Examples and Comparative Examples. In addition, the composition of Comparative Example 3 was used in place of the thermosetting resin composition.

1. Component shear strength evaluation A terminal (pad) plated with Au is formed on the surface of a wiring board (FR-4 grade), and a thermosetting resin composition is screen printed on the surface of the pad according to a normal method. It was applied with. The thickness of the thermosetting resin composition after coating was about 70 μm. Thus, after applying the thermosetting resin composition to the pad of the wiring board, a 0Ω 1608 chip resistor was mounted on the pad. The wiring board on which this component is mounted is heated in a reflow furnace at 150 ° C. for 10 minutes for Examples 1 to 10 and Comparative Examples 1 to 4, and for 10 minutes at 240 ° C. for Example 11 to be thermosetting. The resin composition was cured. And the component shear strength (connection strength) of this chip resistor after hardening was measured with the shear tester.

2. Flash resistance evaluation In the same manner as in “1. Component share strength evaluation” above, a component is mounted on a wiring board, and this component is sealed with a liquid sealing material (product number “CV5420” manufactured by Panasonic Electric Works Co., Ltd.). This was further subjected to moisture absorption under conditions of 60 ° C., 90% RH and 168 hours, and then reflowed at a peak temperature of 240 ° C. for 6 minutes. Thereafter, the presence or absence of solder flash was confirmed with a soft X-ray transmission device.

  The evaluation results from the above evaluation tests are shown in Tables 1 and 2 below.

DESCRIPTION OF SYMBOLS 1 Thermosetting resin composition 2 Semiconductor component 3 Circuit board

Claims (9)

At least one of solder particles having a melting point of 240 ° C. or less, a thermosetting resin binder, a silicone resin compound, and a compound represented by the following structural formula (1) or (2) as a flux component is contained, and the solder particles 100 The silicone resin compound is contained in an amount of 1 to 30 parts by mass with respect to parts by mass, the thermosetting resin binder becomes a continuous phase (sea component), and the silicone resin compound becomes a dispersed phase (island component). to form a structure (sea-island structure), by heating, a solder portion wherein the solder particles are melted integrated and characterized der Rukoto that the resin curing portion is formed covering the external surface of the solder portion A thermosetting resin composition.

In the formula, R _{1 to} R ₄ represent hydrogen, an alkyl group, or a hydroxyl group, X represents an atomic group having a lone electron pair or a double bond π electron to which a metal can coordinate, and Y forms a main chain skeleton And at least one of atoms or atomic groups represented by the following structural formulas (9) to (12).

In the formula, R ₅ and R ₆ represent hydrogen, an alkyl group or a hydroxyl group.   The thermosetting resin composition according to claim 1, wherein an epoxy resin is used as the thermosetting resin binder.   The thermosetting resin composition according to claim 1 or 2, wherein the silicone resin compound is at least one of silicone oil, silicone gel, and silicone powder. X in the structural formula (1) or (2), the following structural formula (3) to the claims 1 to 3, characterized in that indicated at least one of the atomic groups are more than (8) The thermosetting resin composition according to any one of the above.

In the formula, R represents hydrogen, an alkyl group or a hydroxyl group. The compound represented by the structural formula (1) or (2) is levulinic acid, glutaric acid, dimethylglutaric acid, succinic acid, malic acid, 5-ketohexanoic acid, 4-aminobutyric acid, 3-phenylpropionic acid, 4- the thermosetting resin composition according to any one of claims 1 to 4, characterized in that at least one or more of phenylbutyrate. Compound represented by the structural formula (1) or (2), the following structural formula (13) to (15) of the compounds represented by the claims 1 to 5, characterized in that at least one or more The thermosetting resin composition according to any one of the above.

The thermosetting resin composition according to any one of claims 1 to 6 , wherein the flux component is contained in an amount of 1 to 50 PHR with respect to the thermosetting resin binder. The total amount of the said thermosetting resin binder and the said flux component is 3-50 mass% with respect to the said thermosetting resin composition whole quantity, The any one of Claims 1 thru | or 7 characterized by the above-mentioned. Thermosetting resin composition. A semiconductor component mounting board, wherein a semiconductor component is mounted on a circuit board using the thermosetting resin composition according to any one of claims 1 to 8 .

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