JP5586728B1 - High voltage generator, method of manufacturing the same, and high voltage DC power supply - Google Patents

Abstract

An object of the present invention is to improve the working efficiency, to suppress creeping discharge inside the mold, and to reduce the size.
A printed circuit board mounted with a component on which a booster circuit that boosts a low voltage from one side to the other is formed is floated, and the low voltage side of the printed circuit board is fixed to a container with a support. (S1), resin is poured into the container so that the printed circuit board is immersed except for the introduction terminal connected to the printed circuit board and the output end (S2), and a high pressure generator molded with the resin is manufactured (S3). .
[Selection] Figure 1

Description

  The present invention relates to a high voltage generator that generates a DC high voltage, a manufacturing method thereof, and a high voltage DC power supply.

  The high voltage DC power supply device is a DC power supply device that uses a commercial AC power supply or a DC power supply as a power source and supplies a high voltage DC to a load. For example, in a case where a commercial AC power source is used as a power source, a DC voltage obtained by rectifying AC from the commercial AC power source with a rectifier circuit is boosted to obtain a high voltage DC. In the case of using a DC power source as a power source, a DC voltage from the DC power source is boosted to obtain a high voltage DC.

  Normally, when boosting a direct current in a high voltage direct current power supply device, the direct current is once converted to alternating current and boosted by a transformer, and the alternating current boosted by the transformer is converted to direct current. Then, the alternating current boosted by the transformer is converted into direct current by the high pressure generator. The high voltage generator has a CW circuit (Cockcroft-Walton circuit) as a booster circuit, and inputs an AC voltage from a transformer to generate a DC high voltage.

  Such a high voltage generator of the high voltage DC power supply is molded with an insulator (for example, see Patent Document 1). The high-voltage generator has components that form a booster circuit (CW circuit) that boosts a low voltage to a high voltage, and is configured by supporting a mounting plate on which the components are mounted with a support and molding with resin. Thereby, high voltage insulation is maintained.

JP 7-245950 A

  However, in order to maintain high insulation, it is necessary to withstand creeping discharge along the support column, so the high voltage generator has been increased in size. Further, since the parts are mounted on the mounting plate and the connections between the parts are attached by lead wires, the number of assembling steps is increased and the cost is high. Further, since the lead wires are connected manually, skill is required and there is room for improvement in workability.

  An object of the present invention is to provide a high-voltage generator, a manufacturing method thereof, and a high-voltage DC power supply device that can suppress creeping discharge inside the mold, can be downsized, and can improve work efficiency. is there.

The high voltage generator of the present invention includes a plurality of printed circuit boards on which components forming a boosting circuit that boosts a low voltage from one side to the other side are mounted, and a print for connecting the printed circuit boards. Except for a substrate, a supporting portion provided on the printed circuit board for connection, which floats the high voltage side of the printed circuit board and fixes the low voltage side of the printed circuit board to the container, and an introduction terminal and an output end connected to the printed circuit board And a resin that is poured into the container so as to immerse the printed board and molds the printed board.

The manufacturing method of the high voltage generator of the present invention connects a plurality of printed circuit boards mounted with components forming a booster circuit that boosts a low voltage from one side to the other side with a printed circuit board for communication. The high voltage side of the printed circuit board is floated, and the low voltage side of the printed circuit board is fixed to the container with a support provided on the communication printed circuit board, except for the introduction terminal and the output end connected to the printed circuit board. A resin is injected into the container so that the printed circuit board is immersed, and a high-pressure generator molded with the resin is manufactured.

  The high voltage DC power supply device of the present invention includes an inverter that converts direct current into alternating current of a predetermined frequency, a transformer that boosts the alternating current obtained by the inverter, and an alternating current boosted by the transformer. And a high voltage generator manufactured by the method of manufacturing the high voltage generator of the present invention that generates and outputs to a load.

  According to the present invention, creeping discharge inside the mold can be suppressed, the size can be reduced, and work efficiency can be improved.

The flowchart which shows the process of the manufacturing method of the high voltage generator which concerns on embodiment of this invention. Explanatory drawing of a printed circuit board in case the printed circuit board of the high voltage generator of embodiment of this invention is one sheet. Explanatory drawing of an example of a printed circuit board structure in case the number of the printed circuit boards of the high voltage generator of embodiment of this invention is two sheets. The top view which shows an example of the printed circuit board for a communication in embodiment of this invention. The top view seen from the upper part which shows an example of arrangement | positioning of the printed circuit board and contact printed circuit board in embodiment of this invention. The side view of an example which has arrange | positioned the printed circuit board of the high voltage generator of embodiment of this invention in the container. The top view seen from the upper part of the container of FIG. The side view of another example which has arrange | positioned the printed circuit board of the high voltage generator of embodiment of this invention in the container. Explanatory drawing of another example of a printed circuit board structure in case the number of the printed circuit boards of the high voltage generator of embodiment of this invention is two sheets. The top view which shows another example of the printed circuit board for connection in embodiment of this invention. The top view seen from the upper part which shows another example of arrangement | positioning of the printed circuit board and contact printed circuit board in embodiment of this invention. Explanatory drawing at the time of providing the introduction terminal of the high voltage generator of embodiment of this invention in a support part. It is explanatory drawing of the cutting operation which left the support part in which the introduction terminal in embodiment of this invention was provided. The perspective view which shows an example of the state which disassembled the container in the state which resin hardened | cured in the manufacturing process of the high voltage | pressure generator which concerns on embodiment of this invention. 1 is an external view of an example of a high-pressure generator according to an embodiment of the present invention. The perspective view which shows another example of the state which disassembled the container in the state which resin hardened | cured in the manufacturing process of the high voltage | pressure generator which concerns on embodiment of this invention. The external view of another example of the high voltage | pressure generator which concerns on embodiment of this invention. The block block diagram of the high voltage DC power supply device which concerns on embodiment of this invention.

  Embodiments of the present invention will be described below. FIG. 1 is a flowchart showing the steps of a method for manufacturing a high voltage generator according to an embodiment of the present invention. First, the high voltage side of the printed circuit board on which the components of the high voltage generator are mounted is floated, and the low voltage side is fixed to the container with the support (S1). This is because creeping discharge inside the mold can be suppressed.

  Lifting the high voltage side of the printed circuit board means a state where the high voltage side of the printed circuit board is not supported by a support or the like in the resin when the printed circuit board is molded with resin. In order to float the high voltage side of the printed circuit board, for example, the printed circuit board is vertically suspended from the upper part of the container by the support portion on the low voltage side of the printed circuit board. Alternatively, the low-pressure side of the printed circuit board is supported by the lower part or the side part of the container by the support part.

  As described above, the high voltage generator has a booster circuit, and the printed circuit board of the high voltage generator is mounted with components that form a booster circuit that boosts the low voltage from one side to the other side. Is done. The booster circuit is, for example, a CW circuit (cockcroft-Walton circuit), and components mounted on the printed circuit board are capacitors, diodes, resistors, and the like.

  The container is for injecting a resin for molding the printed circuit board, and the printed circuit board is disposed in the container. The container is made of a material that does not leak resin, such as a metal plate such as aluminum. With this container, the shape of the mold with the injected resin can be determined.

  Next, resin is poured into the container and the printed board is immersed in the resin (S2). In this case, the introduction terminal and the output end connected to the printed circuit board are exposed to the outside. Moreover, a part of support part is also exposed outside. Other than these, the resin is poured into the container so as to be immersed in the resin. Thereby, parts other than the introduction terminal of the printed circuit board, the output end part, and the support part are immersed in the resin.

  As a result, a high-pressure generator in which the printed board is molded with resin is obtained (S3). That is, when the resin is cured, the container is disassembled as necessary, and further, a part of the support portion exposed to the outside is cut off, the surface of the resin is polished, and a conductive paint is applied. The conductive paint is applied for easy grounding. Note that the container may not be disassembled, and a part of the support portion exposed to the outside may not be cut off. Moreover, it is not necessary to apply a conductive paint.

  As described above, in the embodiment of the present invention, the printed circuit board on which the components are mounted is fixed to the container with the support portion, and the printed circuit board is molded with the resin while the high pressure side is floated. The cost can be reduced and the size can be reduced. In addition, since a support for supporting the high-voltage side of the printed circuit board is not required, creeping discharge along the support in the mold can be suppressed, and the dielectric strength can be enhanced.

  FIG. 2 is an explanatory diagram of a printed circuit board when a supporting part for fixing to a container in the high voltage generator of the embodiment of the present invention is integrally provided on the printed circuit board, and FIG. FIG. 2B is a schematic plan view of an example of a printed circuit board, and FIG.

  For example, when there is one printed circuit board of the high voltage generator, as shown in FIG. 2A, a support portion 12 for fixing the printed circuit board 11a to the container is integrally provided on the printed circuit board 11a. The printed circuit board 11a is used.

  Further, the printed circuit board 11a has n boosting circuits 13 that boost the low voltage to the high voltage from one side to the other side. Each booster circuit 13 is mounted with components, the first booster circuit 13 of the printed circuit board 11a is mounted with low voltage side circuit components, and the nth booster circuit 13 of the printed circuit board 11a is mounted with circuit components on the high voltage side. ing.

  The first booster circuit 13 is provided with an introduction terminal 14. An AC voltage is input to the introduction terminal 14, and the DC voltage is boosted by n booster circuits 13 to output a DC high voltage from an output end (not shown). . The printed circuit board 11a is provided with a detection unit 15 that detects the voltage of the booster circuit 13. For example, a total voltage value obtained by adding up the voltages boosted by the respective boosting circuits 13 detected by the detection unit 15 is output from the signal line 16 as a detection voltage value.

  Here, as shown in FIG. 2B, the component 17 of the booster circuit 13 is mounted so as to be positioned in an oblique direction. This is to prevent air bubbles from staying between the upper and lower parts 17 when the printed circuit board 11a is immersed in the resin. Therefore, the component 17 may be mounted in the vertical direction instead of being mounted in the oblique direction. That is, when the component 17 is mounted flat, when the printed board 11a is immersed in the resin, the air on the back surface of the component may remain in the back surface of the component. In that case, bubbles remain in the molded resin, and the insulation strength is lowered, so that it is avoided.

  Next, FIG. 3 is an explanatory diagram of an example of the configuration of the printed circuit board when the number of printed circuit boards of the high voltage generator according to the embodiment of the present invention is two, and FIG. 3A is the first printed circuit board. FIG. 3B is a schematic plan view of an example of a second printed board.

  As shown in FIG. 3A, the first printed board 11a has a support portion 12 for fixing the printed board 11a to the container with respect to the printed board 11a shown in FIG. There is no difference. Since other configurations are the same, the same elements are denoted by the same reference numerals, and redundant description is omitted. As shown in FIG. 3B, the second printed circuit board 11b has n booster circuits 13 that boost the low voltage to the high voltage from one side to the other side.

FIG. 4 is a plan view showing an example of a printed circuit board for connection in the embodiment of the present invention for connecting the printed circuit boards shown in FIGS. 3A and 3B, and FIG. 4B is a plan view of a communication printed board with a support portion and a gripping portion, and FIG. 4C is a communication printed board with a support portion and a locking portion. FIG.

  As shown in FIG. 4A, the communication printed circuit board 18a with a support part has a support part 12 on one side of the board connection part 19a. The length h in the vertical direction of the board connecting portion 19a of the contact printed board 18a is the same as the length in the vertical direction of the two printed boards 11a and 11b, and the two printed boards 11a and 11b are connected at this portion. It will be. The support part 12 side becomes the low pressure side of the two printed circuit boards 11a and 11b, and the two printed circuit boards 11a and 11b are fixed to the container by the support part 12.

As shown in FIG. 4 (b), the printed circuit board 18b with a support part and a holding part has a support part 12 on one side of the board connection part 19b, and holds the member on the other side of the board connection part 19b. Part 20. The holding part 20 holds a high- voltage wiring conduit, which will be described later, on the high- voltage side, and the high-voltage wiring conduit is also safely floated in the molded resin. The length h in the vertical direction of the board connecting portion 19b of the contact printed circuit board 18b is the same as the length in the vertical direction of the two printed boards 11a and 11b in the same manner as the contact printed board 18a. Thus, the two printed boards 11a and 11b are connected, and the two printed boards 11a and 11b are fixed to the container by the support portion 12.

As shown in FIG. 4C, the printed circuit board 19c with a support part and a locking part has a support part 12 on one side of the board connection part 19c and locks a member on the other side of the board connection part 19c. It has the latching | locking part 34 to do. The locking portion 34 locks an end portion of a high voltage wiring conduit , which will be described later, on the high voltage side, and locks the high voltage wiring conduit in the molded resin. The vertical length h of the board connecting portion 19c of the communication printed board 18c is the same as the vertical length of the two printed boards 11a and 11b, similarly to the communication printed board 18a. Thus, the two printed boards 11a and 11b are connected, and the two printed boards 11a and 11b are fixed to the container by the support portion 12.

FIG. 5 is a plan view seen from above showing an example of the arrangement of the printed circuit board and the communication printed circuit board in the embodiment of the present invention. As shown in FIG. 5, the two printed circuit boards 11a and 11b are mechanically and electrically connected by connecting printed circuit boards 18b and 18c. In FIG. 5, the printed circuit board 11b is not connected to the communication printed circuit board 18a. However, like the communication printed circuit boards 18b and 18c, the two printed circuit boards 11a and 11b are mechanically and mechanically connected to the communication printed circuit board 18a. It may be electrically connected. In addition, some components forming the detection unit 15 of the printed circuit board 11a may be attached to the communication printed circuit board 18a, 18b, or 18c. And the low voltage | pressure side of printed circuit board 11a, 11b is fixed to a container in the support part 12 of the printed circuit boards 18a, 18b, 18c for communication. Further, a high-voltage wiring conduit ( to be described later) on the high- voltage side is held by the holding portion 20 of the communication printed board 18b.

  FIG. 6 is a side view of an example in which the printed circuit board of the high-voltage generator according to the embodiment of the present invention is arranged in a container, and shows a state in which the front side plate is removed so that the inside can be seen in a rectangular parallelepiped container. . In FIG. 6, the low pressure side of the two printed circuit boards 11a and 11b shown in FIG. 3 is suspended by the support 12 at the top of the container, and the high voltage side of the printed circuit boards 11a and 11b is floated. It is.

  As shown in FIG. 6, the support portion 12 attached to the communication printed circuit boards 18 a, 18 b, 18 c is fixed to the upper portion of the container 21. Thereby, the printed circuit board 11a (11b) is arranged so that the high-pressure side is floated in the container 21.

The high voltage wiring 22 drawn from the high voltage side of the printed circuit boards 11 a and 11 b is connected to the high voltage wiring in the high voltage wiring conduit 24 via the conductor portion 23. The high voltage wiring in the high voltage wiring conduit 24 is output from the output end portion 26 via the tapered portion 27 . The high-voltage wiring conduit 24 is gripped by the gripping portion 20 of the communication printed circuit board 18b and safely floats the high-voltage side of the printed circuit boards 11a and 11b. Further, the end of the high-voltage wiring conduit 24 is locked by the locking portion 34 of the communication printed circuit board 18c, and the end of the high-voltage wiring conduit 24 is fixed.

  FIG. 7 is a plan view seen from the top of the container 21 of FIG. As shown in FIG. 7, printed circuit boards 11 a and 11 b fixed by the support portion 12 are arranged in the container 21, and an opening is provided in a part of the upper surface of the container 21 so that resin can be injected into the container 21. doing. A fixing auxiliary member 35 is provided on the upper surface of the container 21 in the lateral direction, and the support portion 12 of the communication printed circuit boards 18a, 18b, 18c is attached.

  In addition, a signal line 16 that outputs a voltage obtained by adding the voltages of the respective booster circuits 13 detected by the detection unit 15 as a detection value is drawn out of the container 21. Further, an introduction terminal 14 for inputting an AC voltage to the booster circuit 13 on the low voltage side of the printed circuit board 11 is provided on the outer surface of the container 21. Then, by injecting the resin into the container 21, the printed circuit boards 11a and 11b are immersed in the resin except for the introduction terminal 14, the signal line 16 and the output end portion 26 to which the introduction line is connected.

  In the above description, the printed circuit boards 11a and 11b are suspended from the upper portion of the container 21 by the support portion 12 on the low pressure side of the printed circuit boards 11a and 11b, and the high pressure side of the printed circuit boards 11a and 11b is floated. As shown in FIG. 5, the low pressure side of the printed circuit boards 11a and 11b may be supported by the support 12 at the lower part of the container, and the high pressure side of the printed circuit boards 11a and 11b may be floated. In this case, an opening for injecting resin is provided in a portion where the high voltage side of the printed circuit boards 11a and 11b that are the upper part of the container 21 is located.

  In the above description, the case where two printed boards 11a and 11b are placed in the container 21 and molded with resin has been described. However, one printed board 11a is placed in the container 21 and molded with resin. In the same manner, the low pressure side of the printed circuit board 11a is fixed to the container 21 by the support portion 12, the high pressure side of the printed circuit board 11a is floated, the printed circuit board 11a is placed in the container 21, and the resin is injected into the container 21. By doing so, the printed circuit boards 11a and 11b are dipped in resin and molded except for the introduction terminal 14, the signal line 16, and the output end.

  In addition, when there are two printed circuit boards 11a and 11b fixed to the container, the printed circuit boards 11a and 11b are not provided with the support 12 integrally, and the communication printed circuit boards 18a and 18b having the support part 12 are used. The two printed circuit boards 11a and 11b are connected to each other, but at least one of the printed circuit boards 11a and 11b is integrally provided with the support portion 12, and the communication printed circuit boards 18a and 18b are not necessarily provided with the support portion 12. May be.

  FIG. 9 is an explanatory diagram of another example of the configuration of the printed circuit board when the number of printed circuit boards of the high voltage generator according to the embodiment of the present invention is two, and FIG. 9A is a diagram of the first printed circuit board. FIG. 9B is a schematic plan view of an example of a second printed circuit board.

FIG. 10 is a plan view showing another example of the printed circuit board for connection in the embodiment of the present invention for connecting the printed circuit boards shown in FIGS. 9A and 9B. FIG. 10B is a plan view of an example of a printed circuit board for communication that does not have the support portion 12 and the grip portion 20, and FIG. FIG. 10C is a plan view of an example of a printed circuit board for connection that has the locking portion 34 and does not have the support portion 12. FIG. 11 is a plan view seen from above showing another example of the arrangement of the two printed boards 11a and 11b and the contact printed boards 18a, 18b and 18c.

  In FIG. 9, the printed circuit board 11a is integrally provided with the support part 12, the printed circuit board 11b is not provided with the support part 12, and the communication printed circuit boards 18a, 18b without the support part 12 shown in FIG. In 18c, the printed circuit board 11a and the printed circuit board 11b are connected.

  In this case, the support portion 12 may be provided on the printed board 11b, and the support portion 12 may also be provided on the communication printed boards 18a, 18b, and 18c. As described above, at least one of the printed boards 11a and 11b is integrally provided with the support portion 12, and the communication printed boards 18a, 18b, and 18c are not necessarily provided with the support portion 12.

  Next, although the case where the introduction terminal 14 connected to the printed circuit board 11 is provided so as to be positioned on the outer surface of the container 21 is described, it may be provided on the support portion 12 as shown in FIG.

FIG. 12 is an explanatory diagram of the printed circuit board 11a when the introduction terminal 14 of the high voltage generator according to the embodiment of the present invention is provided on the support portion 12 , and FIG. 12 (a) shows the introduction terminal 14 of the printed circuit board 11a. FIG. 12B is a plan view when the introduction terminal 14 is provided on the support portion 12 of the communication printed circuit board 18a without the gripping portion, and FIG. 12C is an introduction terminal. FIG. 12D is a plan view when 14 is provided on the support portion 12 of the communication printed circuit board 18b with the gripping portion 20, and FIG. It is a top view at the time of providing. By providing the introduction terminal 14 on the support portion 12, the introduction terminal 14 can be easily pulled out when the printed board 11 is molded with resin.

  Here, as will be described later, in a state where the resin is cured, the container 21 is normally disassembled and the support portion 12 is cut off. However, as the introduction terminal 14 is provided on the support portion 12, the resin is cured. In this state, the support part 12 cannot be completely removed. Therefore, as shown in FIG. 13, the support portion 12 provided with the introduction terminal 14 is not removed.

  FIG. 13 is an explanatory diagram of the cutting operation leaving the support portion 12 provided with the introduction terminal 14. As shown in FIG. 13A, for example, when the support portion 12 has three cutout portions 36a, 36b, and 36c, as shown in FIG. The support part 12 is cut by X-rays. Accordingly, as shown in FIG. 13C, the portion 12a of the support portion 12 having the introduction terminal 14 and the portions 12b and 12c of the support portion 12 not having the introduction terminal 14 remain. Then, as shown in FIG. 13D, the portion 12 a of the support portion 12 having the introduction terminal 14 is left, and the portions 12 b and 12 c of the support portion 12 not having the introduction terminal 14 are removed. Thereby, the part 12a of the support part 12 provided with the introduction terminal 14 is left.

  FIG. 14 is a perspective view showing an example of a state in which the container is disassembled in a state where the resin is cured in the manufacturing process of the high-pressure generator according to the embodiment of the present invention. FIG. 14 shows the state shown in FIG. An example in which a printed circuit board is placed in the container 21 and resin is injected is shown. As the resin is cured, as shown in FIG. 14, the printed circuit board is molded with the resin 25, the support portion 12 protrudes outside the resin 25, and the introduction terminal 14, the signal line 16, and the output end portion 26 are pulled out. It is.

  The high voltage wiring in the high voltage wiring conduit 24 is output from the output end portion 26. Further, a tapered portion 27 is formed around the output end portion 26. This is to prevent the concentration of the electric field strength at the output end 26 from which the high-voltage distribution line is taken out and to increase the insulation strength.

  Then, from the state of FIG. 14, the support portion 12 of the printed board is cut out, the surface of the resin 25 is polished, and a conductive paint is applied. As a result, a high-pressure generator is obtained as shown in FIG. The reason why the conductive paint is applied is to protect the surface of the resin and to facilitate grounding. In addition, the appearance is improved by selecting the color of the resin.

  FIG. 16 is a perspective view showing another example of a state in which the container is disassembled in a state where the resin is cured in the manufacturing process of the high-pressure generator according to the embodiment of the present invention. FIG. 16 shows an example in which the printed circuit board 11 in the case where the introduction terminal 14 is provided on the support portion 12 shown in FIG. 12 is placed in the container 21 shown in FIG. 6 or FIG. . As the resin is cured, as shown in FIG. 16, the printed circuit board is molded with the resin 25, and the support portion 12 and the support portion 12 with the introduction terminal 14 project outside the resin 25, and the signal line 16 and the output The end portion 26 is pulled out.

  Then, from the state of FIG. 16, as shown in FIG. 17, the support portion 12 without the introduction terminal 14 of the printed circuit board is cut out, and the support portion 12 with the introduction terminal 14 is a portion 12a of the support portion 12 where the introduction terminal 14 is provided. Leave. As a result, the support portion 12 serves as a mounting portion for the introduction terminal 14.

  Here, the container 21 is disassembled, but the container 21 does not necessarily have to be disassembled, and the support portion 12 without the introduction terminal 14 exposed to the outside does not have to be cut off. Further, the conductive paint may not be applied to the surface of the resin 21.

  Next, FIG. 18 is a block configuration diagram of the high-voltage DC power supply device according to the embodiment of the present invention. The high-voltage DC power supply device is a device that supplies a DC power by outputting a DC high voltage from the output terminal 28. For example, a mask drawing device or an electron microscope that requires a charged particle beam such as an electron beam or an ion beam. Used for.

  The high voltage DC power supply uses a DC power supply 29 as a power source. The DC power supply device 29 is, for example, a solar power generation facility, a fuel cell, a wind power generation facility, or a DC power supply facility that rectifies alternating current from a commercial power source with a rectifier and supplies direct current. The direct current from the direct current power supply device 29 is input to the inverter 30, and the inverter 30 converts the alternating current into a predetermined frequency. The alternating current obtained by the inverter 30 is boosted by the transformer 31 and input to the high voltage generator 32 according to the embodiment of the present invention.

  The high voltage generator 32 receives the alternating current boosted by the transformer 31 to generate a high voltage, and outputs the direct high voltage from the output terminal 28 to the load. The control circuit 33 inputs the voltage detected by the detection unit 15 of the high voltage generator 32, and controls the output voltage of the inverter 30 so that the voltage at each stage from the low voltage to the high voltage of the boost circuit becomes a predetermined value. Note that a plurality of high-voltage generators 32 may be connected in parallel to the transformer 31, for example, according to the power requirement of a load externally attached to the output terminal 28.

  As described above, in the high voltage generator 32 according to the embodiment of the present invention, the low voltage side of the printed circuit board on which the component is mounted is fixed to the container by the support portion, the high voltage side of the printed circuit board is floated, and the printed circuit board is made of resin. Since it is formed by molding, the assembly man-hour is reduced, the workability is improved, and the cost can be reduced. In addition, since a support for supporting the printed circuit board is not required, creeping discharge in the mold can be suppressed, and the dielectric strength can be enhanced.

  Since the high voltage DC power supply device according to the embodiment of the present invention uses such a high voltage generator according to the embodiment of the present invention, the number of assembly steps is small, the workability is improved, the cost can be reduced, and the size can be reduced. In addition, a high-voltage DC power supply device that can enhance the dielectric strength can be obtained.

  As mentioned above, although some embodiment of this invention was described, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 11 ... Printed circuit board, 12 ... Support part, 13 ... Booster circuit, 14 ... Introduction terminal, 15 ... Detection part, 16 ... Signal line, 17 ... Parts, 18 ... Printed circuit board for connection, 19 ... Board connection part, 20 ... Gripping , 21 ... container, 22 ... high-voltage wiring, 23 ... conductor part, 24 ... high-voltage wiring conduit, 25 ... resin, 26 ... output end, 27 ... taper-shaped part, 28 ... output terminal, 29 ... DC power supply device, 30 ... Inverter, 31 ... Transformer, 32 ... High voltage generator, 33 ... Control circuit, 34 ... Locking portion, 35 ... Auxiliary member for fixing

Claims (15)

A plurality of printed circuit boards mounted with components forming a booster circuit that boosts low pressure to high pressure from one side to the other;
A printed circuit board for connecting the printed circuit boards;
A support portion provided on the printed circuit board for communication, and a high-pressure side of the printed circuit board floating to fix the low-pressure side of the printed circuit board to a container;
A high voltage generator comprising: a resin that is injected into the container so as to immerse the printed board except for an introduction terminal and an output end connected to the printed board, and molds the printed board. The high voltage generator according to claim 1, wherein the support portion is provided on at least one printed board among the plurality of printed boards instead of the communication printed board . The high voltage generator according to claim 1 , wherein the introduction terminal is provided in the support portion. 4. The height according to claim 1 , wherein when the printed circuit board is fixed to the container, the component is mounted so that the component of the printed circuit board is positioned obliquely or vertically. 5. Voltage generator. The high voltage generator according to any one of claims 1 to 4 , wherein a tapered portion is formed around the output end portion. In a state in which the resin is cured, high voltage generator according to any one of claims 1 to 5, characterized in that removing the supporting portion not having said feedthrough. The high-voltage generator according to any one of claims 1 to 6 , wherein the container is removed in a state where the resin is cured. Connecting multiple printed circuit boards with components that form a booster circuit that boosts low pressure to high pressure from one side to the other side with a printed circuit board for communication,
The high pressure side of the printed circuit board is floated and the low pressure side of the printed circuit board is fixed to the container with a support provided on the communication printed circuit board ,
Injecting resin into the container so that the printed circuit board is immersed except for the introduction terminal and the output end connected to the printed circuit board,
A method of manufacturing a high voltage generator, wherein the high voltage generator molded with the resin is manufactured. 9. The method of manufacturing a high-voltage generator according to claim 8 , wherein the support portion is provided on at least one printed board among the plurality of printed boards instead of the communication printed board . The method for manufacturing a high-voltage generator according to claim 8 or 9 , wherein the introduction terminal is provided in the support portion. 11. The height according to claim 8 , wherein when the printed circuit board is fixed to the container, the component is mounted such that the printed circuit board component is positioned obliquely or vertically. Manufacturing method of voltage generator. The method for manufacturing a high voltage generator according to claim 8, wherein a tapered portion is formed around the output end portion. The method for manufacturing a high-voltage generator according to any one of claims 8 to 12 , wherein a support portion that does not have the introduction terminal is removed in a state where the resin is cured. The method for manufacturing a high-voltage generator according to any one of claims 8 to 13 , wherein the container is removed in a state where the resin is cured. An inverter that converts direct current into alternating current of a predetermined frequency;
A transformer that boosts the alternating current obtained by the inverter;
The high voltage generator according to any one of claims 1 to 7 or any one of claims 8 to 14, wherein an alternating current boosted by the transformer is input to generate a high voltage and output the load to a load. A high-voltage DC power supply device comprising: a high-voltage generator manufactured by the method for manufacturing a high-voltage generator according to claim 1;

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