JP5582323B2

JP5582323B2 - Electronic devices

Info

Publication number: JP5582323B2
Application number: JP2013089261A
Authority: JP
Inventors: 雅敬松永
Original assignee: Seiko Epson Corp
Current assignee: Seiko Epson Corp
Priority date: 2013-04-22
Filing date: 2013-04-22
Publication date: 2014-09-03
Anticipated expiration: 2028-12-16
Also published as: JP2013150357A

Description

本発明は電子デバイスに係り、特にＩＣ等に対する検査・書込み用端子を備える電子デバイスに関する。 The present invention relates to an electronic device, and more particularly to an electronic device provided with a test / write terminal for an IC.

パッケージ部品におけるパッケージ内部に収容される圧電振動片等の素子と、ＩＣとを電気的に接続して構成される発振器やジャイロセンサ、加速度センサ等の電子デバイスは、素子に直接、すなわちＩＣを介さずに電気的に接続された検査用端子（具体的には、水晶検査端子等と呼ばれている）や、電子デバイスの出力信号（発振信号や検出した角速度、加速度等の物理量）の温度特性や出力ゲイン、検出感度等を調整するためデータをＩＣのメモリに書き込むためのデータ書込み用端子等の検査・書込み用端子を電子デバイスの表面に露出させる形で設ける必要がある。 Electronic devices such as an oscillator, a gyro sensor, and an acceleration sensor configured by electrically connecting an element such as a piezoelectric vibrating piece housed inside a package in a package component and an IC are directly connected to the element, that is, via the IC. Temperature characteristics of inspection terminals (specifically called crystal inspection terminals, etc.) that are electrically connected to each other, and output signals of electronic devices (physical quantities such as oscillation signals, detected angular velocities, and accelerations) In addition, in order to adjust the output gain, detection sensitivity, etc., it is necessary to provide inspection / writing terminals such as data writing terminals for writing data to the IC memory so as to be exposed on the surface of the electronic device.

従来、検査・書込み用端子は特許文献１に示すように、実装用リードの一部として実装端子に並列して設けられ、温度特性調整用のデータの書き込みや、検査工程におけるパッケージ部品内の素子やＩＣの測定用の信号の入出力が行われていた。 Conventionally, as shown in Patent Document 1, an inspection / write terminal is provided in parallel with a mounting terminal as a part of a mounting lead, and is used for writing data for temperature characteristic adjustment or an element in a package component in an inspection process. And input / output of signals for IC measurement.

特開２００５−３３７６１号公報JP 2005-33761 A

しかし、製造時にしか使用しない検査・書込み用端子が実装用リードとして形成されているとユーザは、検査・書込み用端子を固定するために実装基板にパターンを形成してハンダ付けする必要があったり、検査・書込み用端子と実装用端子との間のショートの虞が生じるといった問題がある。 However, if inspection / writing terminals that are used only during manufacturing are formed as mounting leads, the user needs to form a pattern on the mounting board and solder it to fix the inspection / writing terminals. There is a problem that a short circuit may occur between the inspection / writing terminal and the mounting terminal.

そこで本願発明では、検査・書込み用端子を個別にハンダ付けする必要性を無くし、検査・書込み用端子と実装用端子との間のショートを抑制することのできる構造の電子デバイスを提供することを目的とする。 In view of this, the present invention provides an electronic device having a structure that eliminates the need for soldering the test / write terminals individually and suppresses a short circuit between the test / write terminals and the mounting terminals. Objective.

本発明は、上述の課題の少なくとも一部を解決するためになされたものであり、以下の形態又は適用例として実現することが可能である。
本発明のある形態に係る電子デバイスは、端子形成面を有すると共に、前記端子形成面の第１の辺に沿って配置された複数の接続端子を有するパッケージ部品と、前記接続端子と接続された一端部を有し、前記端子形成面を平面視して前記一端部から前記第１の辺を跨いで前記端子形成面と重なる領域の外側に延設され、且つ他端部に第１の外部端子が設けられた第１リードと、前記接続端子と接続された一端部を有し、前記端子形成面を平面視して前記一端部から前記端子形成面の前記第１の辺と交差する辺を跨いで前記端子形成面と重なる領域の外側に延設され、且つ他端部に第２の外部端子が設けられている第２リードと、を備えることを特徴とする。
本発明のある形態に係る電子デバイスは、端子形成面を有すると共に、前記端子形成面の第１の辺に沿って配置された複数の接続端子を有するパッケージ部品と、前記パッケージ部品を覆う樹脂部と、前記接続端子と接続された一端部を有し、前記端子形成面を平面視して前記一端部から前記第１の辺を跨いで前記端子形成面と重なる領域の外側に延設され、且つ前記他端部に前記樹脂部の外部に露出する第１の外部端子が設けられた第１リードと、前記接続端子と接続された一端部を有し、前記端子形成面を平面視して前記一端部から前記端子形成面の前記第１の辺と交差する辺を跨いで前記端子形成面と重なる領域の外側に延設され、且つ前記他端部に前記樹脂部の外部に露出する第２の外部端子が設けられている第２リードと、を備えることを特徴とする。
本発明のある形態に係る電子デバイスは、端子形成面を有すると共に、前記端子形成面の第１の辺に沿って設けられた複数の接続端子である第１接続端子群、及び前記第１の辺と対向する第２の辺に沿って設けられた複数の接続端子である第２接続端子群を有するパッケージ部品と、前記第１接続端子群を構成する前記接続端子に接続された一端部を有する複数のリードと、を備え、前記複数のリードは、前記端子形成面を平面視して、前記一端部から前記第１の辺を跨いで前記端子形成面と重なる領域の外側に延設され、且つ前記他端部に第１の外部端子が設けられた第１リードと、前記端子形成面を平面視して、前記一端部から前記第１接続端子群のうち少なくとも１つの前記接続端子と前記第２接続端子群との間を通り、前記第１の辺とは異なる辺を跨いで前記端子形成面と重なる領域の外側に延設され、且つ他端部に第２の外部端子が設けられている第２リードと、を含むとを特徴とする。
本発明のある形態に係る電子デバイスは、端子形成面を有すると共に、前記端子形成面の第１の辺に沿って設けられた複数の接続端子である第１接続端子群、及び前記第１の辺と対向する第２の辺に沿って設けられた複数の接続端子である第２接続端子群を有するパッケージ部品と、前記パッケージ部品を覆う樹脂部と、前記第１接続端子群を構成する前記接続端子に接続され且つ前記樹脂部に覆われた一端部を有する複数のリードと、を備え、前記複数のリードは、前記端子形成面を平面視して、前記一端部から前記第１の辺を跨いで前記端子形成面と重なる領域の外側に延設され、且つ他端部に前記樹脂部の外部に露出する第１の外部端子が設けられている第１リードと、前記端子形成面を平面視して、前記一端部から前記第１接続端子群のうち少なくとも１つの前記接続端子と前記第２接続端子群との間を通り、前記第１の辺とは異なる辺を跨いで前記端子形成面と重なる領域の外側に延設され、且つ他端部に前記樹脂部の外部に露出する第２の外部端子が設けられている第２リードと、を含むことを特徴とする。
本発明のある形態に係る電子デバイスは、前記第１の外部端子および前記第２の外部端子のうち、一方は実装端子を構成し、他方は前記電子デバイスの検査端子及び前記電子デバイスに対するデータの書込み端子の少なくとも一方である検査・書込み用端子を構成し、前記検査・書込み用端子は、複数の前記実装端子と接する仮想平面から離れていることを特徴とする。
本発明のある形態に係る電子デバイスは、前記第１の外部端子および前記第２の外部端子のうち、一方は実装端子を構成し、他方は前記電子デバイスの検査端子及び前記電子デバイスに対するデータの書込み端子の少なくとも一方である検査・書込み用端子を構成し、前記検査・書込み用端子と前記樹脂部との間に、前記検査・書込み用端子の撓み形状に応じた隙間が設けられていることを特徴とする。
本発明のある形態に係る電子デバイスは、前記第１の外部端子および前記第２の外部端子のうち、一方は実装端子を構成し、他方は前記電子デバイスの検査端子及び前記電子デバイスに対するデータの書込み端子の少なくとも一方である検査・書込み用端子を構成し、前記樹脂部には、当該樹脂部の外形に対して切欠き部が設けられており、前記検査・書込み用端子は、前記切欠き部に配置されていることを特徴とする。
本発明のある形態に係る電子デバイスは、前記第１の外部端子および前記第２の外部端子のうち、一方は実装端子を構成し、他方は前記電子デバイスの検査端子及び前記電子デバイスに対するデータの書込み端子の少なくとも一方である検査・書込み用端子を構成し、前記実装端子と前記検査・書込み用端子とが前記樹脂部の同一面側に露出していることを特徴とする。
［適用例１］パッケージ部品と、前記パッケージ部品を覆う樹脂部と、一端部が前記パッケージ部品に接続され前記樹脂部に覆われ、他端部が前記樹脂部の外部に露出している複数のリードとを備え、前記パッケージ部品は端子形成面に複数の接続端子が形成され、前記複数の接続端子は前記端子形成面上において前記端子形成面の外形のうち対向する一対の辺に沿って形成された一対の接続端子列を有し、前記一対の接続端子列のうち前記一対の辺の少なくとも何れか一方の辺である第１の辺に沿って形成された前記接続端子列は、その接続端子列を構成する前記接続端子に前記複数のリードが接続され、前記複数のリードは、第１リード群と第２リード群を有し、前記第１リード群を構成する各リードは、前記端子形成面を平面視して、前記接続端子と接続される前記一端部から前記第１の辺を跨いで前記端子形成面と重なる領域の外側に延設され、前記第１リード群を構成する各リードは、前記他端部に前記樹脂部の外部に露出する第１の外部端子が形成され、前記第２リード群を構成する各リードは、前記端子形成面を平面視して、前記端子形成面上において、前記接続端子と接続される前記一端部から前記一対の接続端子列の間を通り前記第１の辺と隣接する辺を跨いで前記端子形成面と重なる領域の外側に延設され、前記第２リード群を構成する各リードは、前記他端部に前記樹脂部の外部に露出する第２の外部端子が形成されていることを特徴とする電子デバイス。 SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
An electronic device according to an aspect of the present invention has a terminal forming surface and a package component having a plurality of connecting terminals arranged along a first side of the terminal forming surface, and is connected to the connecting terminal. has one end portion, it extends the terminal forming surface from the plan view the one end on the outside of the area overlapping the terminal forming surface across the first side, and a first external to the other end a first lead terminal is provided, said connection terminal and has one end connected portion, the side that intersects the first side of the terminal formation surface of the end portion in plan view the terminal forming surface the extending outside an area overlapping with the terminal forming surface across, and to a second lead second external terminal at the other end is provided, comprising: a.
An electronic device according to an aspect of the present invention includes a package part having a terminal forming surface and a plurality of connection terminals arranged along a first side of the terminal forming surface, and a resin portion covering the package part When, the connection terminal and has one end connected portion is extended outside of the at the terminal formation surface of the end portion in plan view across the first side overlaps the terminal forming surface region, and a first lead first external terminal is provided to be exposed to the outside of the resin portion on the other end, the connecting terminal and having a connected end, in plan view the terminal forming surface The first end portion extends outside the region overlapping the terminal forming surface across the side intersecting the first side of the terminal forming surface, and is exposed to the outside of the resin portion at the other end portion. comprising a second lead and second external terminals are provided, the It is characterized in.
An electronic device according to an aspect of the present invention has a terminal forming surface, a first connecting terminal group that is a plurality of connecting terminals provided along a first side of the terminal forming surface, and the first packaging component and one end connected to the front Kise' connection terminals constituting the first connecting terminal groups having a second second connecting terminal groups is a side plurality of connection terminals provided along the sides facing comprising a plurality of leads having a section, wherein the plurality of leads, wherein the terminal formation surface in plan view, extending outside the region overlapped with the terminal forming surface across the first side from the one end is set, and a first lead first external terminal is provided on the other end, in plan view the terminal formation surface, at least one of said connection of said first connection terminal group from the one end It passes between the said terminal second connection terminal group, the first side It characterized as including the extended outside the region overlapping with the terminal forming surface across different sides, and a second lead that the second external terminal is provided at the other end, the.
An electronic device according to an aspect of the present invention has a terminal forming surface, a first connecting terminal group that is a plurality of connecting terminals provided along a first side of the terminal forming surface, and the first A package component having a second connection terminal group which is a plurality of connection terminals provided along a second side facing the side; a resin portion covering the package component; and the first connection terminal group constituting the first connection terminal group and a plurality of leads having one end covered connected to and the resin portion to the connection terminal, wherein the plurality of leads, in a plan view of the terminal formation surface, the first side from the one end A first lead having a first external terminal extending outside the region overlapping the terminal forming surface and being exposed to the outside of the resin portion at the other end; and the terminal forming surface. in plan view, the first connection terminal from said one end portion At least one pass between the connecting terminal and the second connecting terminal groups, and the first side is extended to the outside of the area overlapping the terminal forming surface across different sides, and the other end of the And a second lead provided with a second external terminal exposed to the outside of the resin part.
In the electronic device according to an aspect of the present invention, one of the first external terminal and the second external terminal constitutes a mounting terminal, and the other constitutes an inspection terminal of the electronic device and data for the electronic device. An inspection / writing terminal which is at least one of the writing terminals is configured, and the inspection / writing terminal is separated from a virtual plane in contact with the plurality of mounting terminals.
In the electronic device according to an aspect of the present invention, one of the first external terminal and the second external terminal constitutes a mounting terminal, and the other constitutes an inspection terminal of the electronic device and data for the electronic device. The inspection / writing terminal which is at least one of the writing terminals is configured, and a gap corresponding to the bending shape of the inspection / writing terminal is provided between the inspection / writing terminal and the resin portion. It is characterized by.
In the electronic device according to an aspect of the present invention, one of the first external terminal and the second external terminal constitutes a mounting terminal, and the other constitutes an inspection terminal of the electronic device and data for the electronic device. An inspection / writing terminal which is at least one of the writing terminals is configured, and the resin portion is provided with a notch with respect to the outer shape of the resin portion, and the inspection / writing terminal is notched with the notch. It is arrange | positioned at the part.
In the electronic device according to an aspect of the present invention, one of the first external terminal and the second external terminal constitutes a mounting terminal, and the other constitutes an inspection terminal of the electronic device and data for the electronic device. An inspection / writing terminal which is at least one of the writing terminals is configured, and the mounting terminal and the inspection / writing terminal are exposed on the same surface side of the resin portion.
Application Example 1 A plurality of package parts, a resin part covering the package parts, one end part connected to the package part and covered by the resin part, and the other end part exposed to the outside of the resin part A plurality of connection terminals formed on a terminal formation surface, and the plurality of connection terminals are formed on the terminal formation surface along a pair of opposing sides of the outer shape of the terminal formation surface. The connection terminal row formed along a first side which is at least one of the pair of sides of the pair of connection terminal rows. The plurality of leads are connected to the connection terminals constituting the terminal row, and the plurality of leads have a first lead group and a second lead group, and each lead constituting the first lead group has the terminal In plan view of the formation surface, Extending from the one end connected to the connection terminal to the outside of the region overlapping the terminal forming surface across the first side, and each lead constituting the first lead group is connected to the other end A first external terminal exposed to the outside of the resin portion is formed, and each of the leads constituting the second lead group has a plan view of the terminal forming surface and the connection terminal on the terminal forming surface. The second lead group is configured to extend outside the region overlapping the terminal forming surface from the one end to be connected across the pair of connection terminal rows and across the side adjacent to the first side. Each lead to be formed has a second external terminal exposed to the outside of the resin portion at the other end portion.

このような構成の電子デバイスによれば、第１リード群の第１の外部端子及び第２リード群の第２の外部端子のうち、いずれか一方を検査・書込み用端子、他方を実装用端子として使用することにより、電子デバイスの実装面上において実装用端子が形成されている辺と異なる辺に検査・書込み用端子を配置することができる。また、実装用端子を配置する辺と検査・書込み用端子を配置する辺とが異なるため、実装用端子と検査・書込み用端子との間でのショートを抑制することができる。また、第２リード群に属するリードは端子形成面上において２列に形成された接続端子列間に引き回されるため、パッケージ部品の実装安定性を向上させることができる。また、このような構成の電子デバイスであれば、検査・書込み用端子は実装用端子とは異なる辺に配置されるため、検査・書込み用端子を個別にハンダ付けする必要性が無い。 According to the electronic device having such a configuration, one of the first external terminal of the first lead group and the second external terminal of the second lead group is an inspection / write terminal, and the other is a mounting terminal. As a result, the inspection / writing terminals can be arranged on a side different from the side where the mounting terminals are formed on the mounting surface of the electronic device. In addition, since the side where the mounting terminal is arranged is different from the side where the inspection / writing terminal is arranged, a short circuit between the mounting terminal and the inspection / writing terminal can be suppressed. In addition, since the leads belonging to the second lead group are routed between the connection terminal rows formed in two rows on the terminal formation surface, the mounting stability of the package component can be improved. Further, in the case of the electronic device having such a configuration, since the inspection / writing terminals are arranged on different sides from the mounting terminals, there is no need to solder the inspection / writing terminals individually.

［適用例２］適用例１に記載の電子デバイスであって、前記第１の外部端子および前記第２の外部端子のうち、何れか一方は実装端子を構成し、他方は検査・書込み用端子を構成し、前記検査・書込み用端子の下端部が前記実装端子の下端部よりも上方に位置することを特徴とする電子デバイス。
このような構成とすることにより、実装用端子と検査・書込み用端子との間のショートを確実に防止することが可能となる。また、検査・書込み用端子のためのパターン形成も不要であることが明確となる。 [Application Example 2] The electronic device according to Application Example 1, wherein one of the first external terminal and the second external terminal constitutes a mounting terminal, and the other is an inspection / writing terminal. The electronic device is characterized in that the lower end portion of the inspection / writing terminal is located above the lower end portion of the mounting terminal.
With such a configuration, it is possible to reliably prevent a short circuit between the mounting terminal and the inspection / writing terminal. Further, it becomes clear that pattern formation for the inspection / writing terminal is unnecessary.

［適用例３］適用例１または適用例２に記載の電子デバイスであって、前記樹脂部に、前記検査・書込み用端子の撓み形状に応じた逃げ部が形成されていることを特徴とする電子デバイス。
このような構成とすることによれば、樹脂部と検査・書込み用端子との間に隙間を設けることができる。このため、検査・書込み用のプローブが検査・書込み用端子に接触した場合に、接触時の衝撃を緩和することができ、プローブの摩耗を減らすことができる。また、プローブを押し込んで接触させることができるため、接触不良の防止も図ることができる。 [Application Example 3] The electronic device according to Application Example 1 or Application Example 2, wherein an escape portion corresponding to a bending shape of the inspection / writing terminal is formed in the resin portion. Electronic devices.
According to such a configuration, a gap can be provided between the resin portion and the inspection / writing terminal. For this reason, when the probe for inspection / writing contacts the terminal for inspection / writing, the impact at the time of contact can be alleviated and the wear of the probe can be reduced. In addition, since the probe can be pushed in and brought into contact, it is possible to prevent contact failure.

［適用例４］適用例２または適用例３のいずれかに記載の電子デバイスであって、前記樹脂部には、当該樹脂部上面側から平面視した際に前記検査・書込み用端子が隠れる切欠き部を設けたことを特徴とする電子デバイス。
このような構成とすることによれば、実装基板に電子デバイスを実装した際に電子デバイスを平面視しても、検査・書込み用端子が晒されることが無い。このため、誤って他の電子部品等の電極が接触してしまう危険性を低下させることができる。 [Application Example 4] The electronic device according to any one of Application Example 2 and Application Example 3, wherein the inspection / writing terminal is hidden in the resin portion when viewed in plan from the upper surface side of the resin portion. An electronic device characterized by providing a notch.
According to such a configuration, when the electronic device is mounted on the mounting substrate, the inspection / writing terminal is not exposed even when the electronic device is viewed in plan. For this reason, the danger that electrodes, such as another electronic component, will contact accidentally can be reduced.

［適用例５］適用例２乃至適用例４のいずれかに記載の電子デバイスであって、前記実装端子と前記検査・書込み用端子とが前記樹脂部の同一面側に露出していることを特徴とする電子デバイス。
このような構成とすることによれば、検査・書込み用のプローブと駆動電力供給用のプローブとを同一方向から押し当てて検査や書込み等を行うことが可能となる。 Application Example 5 In the electronic device according to any one of Application Examples 2 to 4, the mounting terminal and the inspection / writing terminal are exposed on the same surface side of the resin portion. A featured electronic device.
With this configuration, it is possible to perform inspection, writing, and the like by pressing the inspection / writing probe and the driving power supply probe from the same direction.

第１の実施形態に係る電子デバイスの構成を示す図である。It is a figure which shows the structure of the electronic device which concerns on 1st Embodiment. 検査・書込み用端子にプローブを接触させる様子を示す図である。It is a figure which shows a mode that a probe is made to contact the terminal for an inspection and writing. 第２の実施形態に係る電子デバイスの構成を示す図である。It is a figure which shows the structure of the electronic device which concerns on 2nd Embodiment.

以下、本発明の電子デバイスに係る実施の形態について、図面を参照して詳細に説明する。
まず、図１を参照して本発明の電子デバイスに係る第１の実施形態について説明する。なお、図１において図１（Ａ）は電子デバイスの正面図であり、図１（Ｂ）は電子デバイスの右側面図である。 Hereinafter, embodiments of the electronic device of the present invention will be described in detail with reference to the drawings.
First, a first embodiment according to the electronic device of the present invention will be described with reference to FIG. 1A is a front view of the electronic device, and FIG. 1B is a right side view of the electronic device.

本実施形態に係る電子デバイス１０は、パッケージ部品１２と複数のリード１８ａ〜１８ｊ、及び樹脂部４０を有する。パッケージ部品１２は、外表面における端子形成面に、複数の接続端子１４ａ〜１４ｊを有する。パッケージ部品１２を構成する各面は矩形状を成し、複数の接続端子１４ａ〜１４ｊは、端子形成面における対向する一対の辺に沿って形成される。パッケージ部品１２の内部構成は、電子デバイス１０の用途によって異ならせることができる。例えば電子デバイス１０をジャイロセンサ装置とする場合、パッケージ部品１２はジャイロセンサである必要が生ずる。この場合、パッケージ部品１２を構成するパッケージの内部には、ジャイロセンサを構成する角速度検出素子や入出力信号を制御するための集積回路であるＩＣ等（いずれも不図示）が搭載されることとなる。 The electronic device 10 according to the present embodiment includes a package component 12, a plurality of leads 18a to 18j, and a resin portion 40. The package component 12 has a plurality of connection terminals 14a to 14j on the terminal formation surface on the outer surface. Each surface constituting the package component 12 has a rectangular shape, and the plurality of connection terminals 14a to 14j are formed along a pair of opposing sides on the terminal formation surface. The internal configuration of the package component 12 can vary depending on the application of the electronic device 10. For example, when the electronic device 10 is a gyro sensor device, the package component 12 needs to be a gyro sensor. In this case, an IC or the like (not shown) that is an integrated circuit for controlling an input / output signal, an angular velocity detection element constituting the gyro sensor, and the like are mounted inside the package constituting the package component 12. Become.

複数のリード１８ａ〜１８ｊは、第１リード群１６ａと第２リード群１６ｂとより成る。第１リード群１６ａに属するリード１８ｂ〜１８ｄ、１８ｇ〜１８ｉは、パッケージ部品１２における接続端子１４ｂ〜１４ｄ、１４ｇ〜１４ｉと電気的に接続される一端部２０ａと、電子デバイスの実装用端子となる他端部２４ａとを有する導電性の平板を折り曲げ形成されて成る。また、一端部２０ａと他端部２４ａとの間には中間部２２ａが設けられる。実施形態に係る電子デバイス１０において中間部２２ａは、第１リード群１６ａに属するリード１８ｂ〜１８ｄ、１８ｇ〜１８ｉの延設方向を変える役割を担い、中間部２２ａには一端部２０ａから他端部２４ａへ向かって延びる平板の延設方向を変える角度付け部２８が設けられる。 The plurality of leads 18a to 18j includes a first lead group 16a and a second lead group 16b. The leads 18b to 18d and 18g to 18i belonging to the first lead group 16a serve as one end 20a that is electrically connected to the connection terminals 14b to 14d and 14g to 14i in the package component 12, and a mounting terminal for the electronic device. A conductive flat plate having the other end 24a is formed by bending. An intermediate portion 22a is provided between the one end portion 20a and the other end portion 24a. In the electronic device 10 according to the embodiment, the intermediate portion 22a plays a role of changing the extending direction of the leads 18b to 18d and 18g to 18i belonging to the first lead group 16a, and the intermediate portion 22a has one end portion 20a to the other end portion. An angled portion 28 is provided to change the extending direction of the flat plate extending toward 24a.

また、第１リード群１６ａは、一端部２０ａを接続端子１４ｂ〜１４ｄ、１４ｇ〜１４ｉに接続された状態で、端子形成面における一対の辺からパッケージ部品の外側へ向かって延設されるように配置される。延設されたリード１８ｂ〜１８ｄ、１８ｇ〜１８ｉは、詳細を後述する樹脂部４０から露出することとなる。そして、樹脂部４０からの露出部分には、第１の曲げ部２５と第２の曲げ部２６が設けられる。第１の曲げ部２５は、一段部２０ａと中間部２２ａとの間に位置し、第２の曲げ部２６は、中間部２２ａと他端部２４ａとの間に位置する。そして、中間部２２ａ、他端部２４ａはそれぞれ、樹脂部４０に沿って配置される。このような構成とすることで、第１のリード群１６ａに属するリード１８ｂ〜１８ｄ、１８ｇ〜１８ｉは、樹脂部４０を抱え込むような形態を採ることとなる。 Further, the first lead group 16a is extended from the pair of sides on the terminal forming surface toward the outside of the package component in a state where the one end portion 20a is connected to the connection terminals 14b to 14d and 14g to 14i. Be placed. The extended leads 18b to 18d and 18g to 18i are exposed from the resin portion 40 described later in detail. Then, the first bent portion 25 and the second bent portion 26 are provided in the exposed portion from the resin portion 40. The first bent portion 25 is located between the first step portion 20a and the intermediate portion 22a, and the second bent portion 26 is located between the intermediate portion 22a and the other end portion 24a. The intermediate portion 22a and the other end portion 24a are disposed along the resin portion 40, respectively. With such a configuration, the leads 18b to 18d and 18g to 18i belonging to the first lead group 16a take a form in which the resin portion 40 is held.

第２のリード群１６ｂに属するリード１８ａ、１８ｅ、１８ｆ、１８ｊは、パッケージ部品１２における接続端子１４ａ、１４ｅ、１４ｆ、１４ｊと電気的に接続される一端部２０ｂと、電子デバイス１０の検査・書込み用端子となる他端部２４ｂとを有する導電性の平板を折り曲げ形成されて成る。また、第１のリード群１６ａを構成するリード１８ｂ〜１８ｄ、１８ｇ〜１８ｉと同様に、一端部２０ｂと他端部２４ｂとの間に中間部２２ｂを有する。実施形態に係る電子デバイス１０において中間部２２ｂは、一端部２０ｂ側が樹脂部４０内に埋設され、他端部２４ｂが樹脂部４０から露出する。 The leads 18a, 18e, 18f, and 18j belonging to the second lead group 16b are one end 20b that is electrically connected to the connection terminals 14a, 14e, 14f, and 14j in the package component 12, and inspection / writing of the electronic device 10. A conductive flat plate having the other end 24b serving as a service terminal is formed by bending. Further, similarly to the leads 18b to 18d and 18g to 18i constituting the first lead group 16a, an intermediate portion 22b is provided between the one end portion 20b and the other end portion 24b. In the electronic device 10 according to the embodiment, the intermediate portion 22 b is embedded in the resin portion 40 at the one end portion 20 b side, and the other end portion 24 b is exposed from the resin portion 40.

また、第２リード群１６ｂは、一端部２０ｂを接続端子１４ａ、１４ｅ、１４ｆ、１４ｊに接続された状態で、端子形成面の一対の辺に沿って形成された２列の接続端子１４ａ〜１４ｊの間を引き回され、一対の辺に交差する他の辺からパッケージ部品１２の外側へと延設される。この際リード１８ａ〜１８ｄ１８ｇ〜１８ｉの中間部２２ｂは、他のリード１８ｂ〜１８ｄ、１８ｇ〜１８ｉや接続端子１４ｂ〜１４ｄ、１４ｇ〜１４ｉと電気的に接続されないように形成され、配設される。中間部２２ｂと他端部２４ｂとの間には第１の曲げ部３０が設けられる。また、他端部２４ｂには先端部２０ｂを樹脂部４０に沿って配置するための第２の曲げ部３２が設けられる。なお、第２リード群１６ｂを構成する各リード１８ｂ〜１８ｅ、１８ｇ〜１８ｉの他端部２４ｂと樹脂部５０との間には、僅かに隙間（逃げ部３２）を設けるようにして第１の曲げ部３０や第２の曲げ部３２を設けるようにすると良い。他端部２４ｂを検査・書き込み用端子として使用する際、検査・書き込み用のプローブの接触に伴って他端部２４ｂが樹脂部４０側に撓むこととなるからである（図２参照：図２において図２（Ａ）はプローブ接触前、図２（Ｂ）はプローブ接触時の様子を示す。）。 The second lead group 16b has two rows of connection terminals 14a to 14j formed along a pair of sides of the terminal formation surface with one end 20b connected to the connection terminals 14a, 14e, 14f, and 14j. And is extended from the other side crossing the pair of sides to the outside of the package component 12. At this time, the intermediate portion 22b of the leads 18a to 18d and 18g to 18i is formed and disposed so as not to be electrically connected to the other leads 18b to 18d and 18g to 18i and the connection terminals 14b to 14d and 14g to 14i. A first bent portion 30 is provided between the intermediate portion 22b and the other end portion 24b. Further, the second end portion 24 b is provided with a second bent portion 32 for arranging the tip portion 20 b along the resin portion 40. The first lead 18b to 18e and 18g to 18i constituting the second lead group 16b are provided with a slight gap (relief part 32) between the other end 24b and the resin part 50. A bent portion 30 and a second bent portion 32 may be provided. This is because when the other end 24b is used as an inspection / writing terminal, the other end 24b bends toward the resin portion 40 with the contact of the inspection / writing probe (see FIG. 2). 2 (A) shows a state before probe contact, and FIG. 2 (B) shows a state at the time of probe contact.

このような作用により、プローブ先端部の摩耗の低減が図れる。また、端子形成時の曲げ角度のズレなどによって検査・書込み用端子にズレなどが生じた場合であっても、検査・書込み用プローブを押し込むことができるため、接触不良の防止を図ることができる。 By such an action, the wear of the probe tip can be reduced. In addition, even if the inspection / writing terminal is misaligned due to a bend angle misalignment during terminal formation, the inspection / writing probe can be pushed in, so that contact failure can be prevented. .

樹脂部４０は、接続端子１４ａ〜１４ｊとリード１８ａ〜１８ｊとの接続面の保護等を目的とした樹脂であり、接続面とパッケージ部品１２を被覆する。樹脂部４０には、第２のリード群１６ｂにおける他端部２４ｂを配置するための切欠き部４２が設けられる。切欠き部４２は、樹脂部の外形に対して凹状に形成され、実装状態の電子デバイス１０の樹脂部４０を平面視した際には、検査・書込み端子としての他端部２４ｂが隠れた状態となる。このため、当該切欠き部４２に配置される第２リード群１６ｂに属するリード１８ａ、１８ｅ、１８ｆ、１８ｊの他端部２４ｂの下端部は、樹脂部４０の底面側に配置される台１リード群１６ａに属するリード１８ｂ〜１８ｄ、１８ｇ〜１８ｉの他端部２４ａの下端部よりも上方に位置することとなる。 The resin portion 40 is a resin for the purpose of protecting the connection surfaces of the connection terminals 14 a to 14 j and the leads 18 a to 18 j and covers the connection surfaces and the package component 12. The resin part 40 is provided with a notch part 42 for disposing the other end part 24b of the second lead group 16b. The notch portion 42 is formed in a concave shape with respect to the outer shape of the resin portion, and the other end portion 24b serving as an inspection / writing terminal is hidden when the resin portion 40 of the mounted electronic device 10 is viewed in plan view. It becomes. Therefore, the lower end portion of the other end portion 24b of the leads 18a, 18e, 18f, and 18j belonging to the second lead group 16b disposed in the notch portion 42 is a base 1 lead disposed on the bottom surface side of the resin portion 40. The leads 18b to 18d and 18g to 18i belonging to the group 16a are positioned above the lower end of the other end 24a.

このような構成によれば、実装基板に電子デバイス１０を実装した際に検査・書込み用端子としての他端部２４ｂが晒されることが無く、他の電子部品等の電極が誤って接触してしまう危険性を低下させることができる。また、実装用端子としての他端部２４ａと検査・書込み用端子としての他端部２４ｂとの間に段差ができるため、両者間のショートを確実に防止することが可能となる。また、他端部２４ｂは、実装面から浮いた状態となるため、他端部２４ｂを実装するためのパターンを実装基板に形成することが不要であることが明確となる。 According to such a configuration, when the electronic device 10 is mounted on the mounting substrate, the other end 24b as the inspection / writing terminal is not exposed, and electrodes of other electronic components or the like are in contact with each other by mistake. The risk of endangering can be reduced. Further, since a step is formed between the other end 24a as the mounting terminal and the other end 24b as the inspection / writing terminal, it is possible to reliably prevent a short circuit between them. Further, since the other end portion 24b is in a state of floating from the mounting surface, it becomes clear that it is not necessary to form a pattern for mounting the other end portion 24b on the mounting substrate.

上記のような構成の電子デバイス１０において、接続端子１４ａ〜１４ｊとリード１８ａ〜１８ｊとは、導電性接着剤や、接着剤と金属ワイヤ（いずれも不図示）により電気的な接続、物理的な固定が図られる。また、第１リード群１６ａを構成するリード１８ｂ〜１８ｄ、１８ｇ〜１８ｉの第１の曲げ部２５、第２の曲げ部２６、及び第２リード群１６ｂを構成するリード１８ａ、１８ｅ、１８ｇ、１８ｊの第１の曲げ部３０、第２の曲げ部３２は、樹脂部４０の形成の後に形成される。また、樹脂部４０の形成は、金型を用いたモールド加工により行う。 In the electronic device 10 configured as described above, the connection terminals 14a to 14j and the leads 18a to 18j are electrically connected and physically connected by a conductive adhesive, an adhesive and a metal wire (both not shown). Fixed. Further, the leads 18b to 18d and 18g to 18i constituting the first lead group 16a, the first bent portion 25, the second bent portion 26, and the leads 18a, 18e, 18g, and 18j constituting the second lead group 16b. The first bent portion 30 and the second bent portion 32 are formed after the resin portion 40 is formed. The resin portion 40 is formed by molding using a mold.

上記のような構成の電子デバイス１０を製造するための具体的な製造手順としては、まず、第１リード群１６ａ、第２リード群１６ｂに属する各リード１８ａ〜１８ｊの形成を行う。次に、形成したリード１８ａ〜１８ｊと、別途製造したパッケージ部品１２との物理的固定、および電気的接続を行う。次に、リード１８ａ〜１８ｊを接続したパッケージ部品１２を金型へ導入して樹脂により被覆し、所望形状の樹脂部４０を形成する。その後、第１リード群１６ａ、第２リード群１６ｂを構成する各リード１８ａ〜１８ｊに折り曲げ加工を施し、第１の曲げ部２５、３０、第２の曲げ部２６、３２を構成する。 As a specific manufacturing procedure for manufacturing the electronic device 10 having the above-described configuration, first, the leads 18a to 18j belonging to the first lead group 16a and the second lead group 16b are formed. Next, physical fixing and electrical connection between the formed leads 18a to 18j and the separately manufactured package component 12 are performed. Next, the package component 12 to which the leads 18a to 18j are connected is introduced into a mold and covered with a resin to form a resin portion 40 having a desired shape. Thereafter, the leads 18a to 18j constituting the first lead group 16a and the second lead group 16b are bent to form the first bent portions 25 and 30, and the second bent portions 26 and 32.

このような構成の電子デバイス１０によれば、ユーザ端子（実装用端子）としての他端部２４ａと検査・書込み用端子としての他端部２４ｂとを電子デバイス１０の底面の異なる辺に形成することができる。このため、実装用端子と検査・書込み用端子と間でのショートを抑制することができる。 According to the electronic device 10 having such a configuration, the other end 24 a as a user terminal (mounting terminal) and the other end 24 b as a test / write terminal are formed on different sides of the bottom surface of the electronic device 10. be able to. For this reason, a short circuit between the mounting terminal and the inspection / writing terminal can be suppressed.

また、第２リード群１６ｂを構成するリード１８ａ、１８ｅ、１８ｆ、１８ｊは、パッケージ部品１２における端子形成面上を引き回されているため、パッケージ部品１２をリード１８ａ〜１８ｊに搭載する際の実装安定性を向上させることができる。このような実装安定性は、角速度センサや加速度センサ等、パッケージ部品１２に内蔵されている素子の実装面と実装基板との成す角度（実装角度）のバラツキが問題となる電子デバイスにおいては、検出精度の向上にも寄与することとなる。 Further, since the leads 18a, 18e, 18f, and 18j constituting the second lead group 16b are routed on the terminal formation surface of the package component 12, the mounting when the package component 12 is mounted on the leads 18a to 18j. Stability can be improved. Such mounting stability is detected in an electronic device such as an angular velocity sensor, an acceleration sensor, or the like in which variation in the angle (mounting angle) between the mounting surface of the element incorporated in the package component 12 and the mounting substrate is a problem. It will also contribute to the improvement of accuracy.

なお、上記実施形態では、第１リード群１６ａに属するリード１８ｂ〜１８ｄ、１８ｇ〜１８ｉの中間部２２ａに角度付け部２８を設けることでパッケージ部品１２の端子形成面と、電子デバイス１０の実装面とを実装基板に対して異なる角度で実装可能とする構成としている。しかしながら、中間部２２ａの平面形状を扇型、すなわち中間部２２ａを円弧状に延設することで端子形成面と実装面との間の角度付けを行うようにしても良い。このような構成によれば、中間部２２ａの長さによって端子形成面と実装面との間の角度を変えることが可能となるからである。 In the above embodiment, the terminal forming surface of the package component 12 and the mounting surface of the electronic device 10 are provided by providing the angled portion 28 in the intermediate portion 22a of the leads 18b to 18d and 18g to 18i belonging to the first lead group 16a. Can be mounted at different angles with respect to the mounting board. However, the intermediate portion 22a may be fan-shaped, that is, the intermediate portion 22a may be extended in an arc shape to angle the terminal forming surface and the mounting surface. This is because the angle between the terminal forming surface and the mounting surface can be changed depending on the length of the intermediate portion 22a.

次に、本発明の電子デバイスに係る第２の実施形態について、図２を参照して詳細に説明する。なお、図２において、図２（Ａ）は電子デバイスの透過平面図であり、図２（Ｂ）は透過正面図、図２（Ｃ）は正面図、図２（Ｄ）は右側面図を示す。また、本実施形態に係る電子デバイスは、上記第１の実施形態に係る電子デバイス１０とは異なり、パッケージ部品の端子形成面と電子デバイスの実装面とが平行となるような配置形態を採るが、その構成要素としては第１の実施形態に係る電子デバイスと大差が無い。このため、同一の機能を有する構成要素には図面に１００を足した符号を付して、その詳細な説明は省略することとする。 Next, a second embodiment of the electronic device of the present invention will be described in detail with reference to FIG. 2A is a transmission plan view of the electronic device, FIG. 2B is a transmission front view, FIG. 2C is a front view, and FIG. 2D is a right side view. Show. In addition, unlike the electronic device 10 according to the first embodiment, the electronic device according to the present embodiment adopts an arrangement form in which the terminal formation surface of the package component and the mounting surface of the electronic device are parallel to each other. The constituent elements are not much different from those of the electronic device according to the first embodiment. For this reason, components having the same function are denoted by reference numerals added with 100 in the drawings, and detailed description thereof will be omitted.

本実施形態に係る電子デバイス１１０も、第１のリード群１１６ａに属するリードが端子形成面から外側に延設され、第２のリード群１１６ｂに属するリードが端子形成面の内側（接続端子１１４ａ〜１１４ｈの間）を引き回される点に相違は無い。しかし本実施形態に係る電子デバイス１１０では、第１のリード群１１６ａに属する各リードの形態、第２のリード群１１６ｂに属する各リードの形態、及び樹脂部１４０の形態を異ならせることで、上記のようなパッケージ部品１１２の配置形態の相違を生じさせている。なお、第１の実施形態に係る電子デバイス１０は、第１リード群１６ａを構成するリードの数を６としていたのに対し、本実施形態に係る電子デバイス１１０では第１リード群１１６ａを構成するリードの数を４としている。このため、本実施形態に係る電子デバイスでは、第１リード群１１６ａに属するリードはリード１１８ｂ、１１８ｃ、１１８ｆ、１１８ｇであり、第２リード群１１６ｂに属するリードがリード１１８ａ、１１８ｄ、１１８ｅ、１１８ｈとなる。なお、この相違については、パッケージ部品１１２の機能等の相違による設計上の変更点に過ぎない。例えば本実施形態のようにパッケージ部品１１２の接続端子の数を８とするものとしては、温度補償型電圧制御発振器等を挙げることができる。 Also in the electronic device 110 according to the present embodiment, the leads belonging to the first lead group 116a extend outward from the terminal formation surface, and the leads belonging to the second lead group 116b are located inside the terminal formation surface (connection terminals 114a to 114a). 114h) is not different. However, in the electronic device 110 according to the present embodiment, the form of each lead belonging to the first lead group 116a, the form of each lead belonging to the second lead group 116b, and the form of the resin portion 140 are different. Thus, the arrangement of the package parts 112 is different. In the electronic device 10 according to the first embodiment, the number of leads constituting the first lead group 16a is six, whereas in the electronic device 110 according to the present embodiment, the first lead group 116a is configured. The number of leads is four. Therefore, in the electronic device according to the present embodiment, the leads belonging to the first lead group 116a are the leads 118b, 118c, 118f, and 118g, and the leads belonging to the second lead group 116b are the leads 118a, 118d, 118e, and 118h. Become. This difference is only a design change due to a difference in the function and the like of the package component 112. For example, as in the present embodiment, the number of connection terminals of the package component 112 is 8, for example, a temperature compensated voltage controlled oscillator.

上記のような点を踏まえた上で、本実施形態に係る電子デバイス１１０と第１の実施形態に係る電子デバイス１０との具体的な相違点は以下のような点ということができる。まず、第１のリード群１１６ａを構成するリード１１８ｂ、１１８ｃ、１１８ｆ、１１８ｇは、中間部１２２ａに角度付け分を設けないストレート構造とした。このような構成とすることで第１のリード群１１６ａを構成するリード１１８ｂ、１１８ｃ、１１８ｆ、１１８ｇは、樹脂部１４０を介してパッケージ部品１１２を包み込むような形態を採ることとなり、パッケージ部品１１２の端子形成面と電子デバイス１１０の実装面とを平行にすることができる。また、本実施形態では、一端部１２０ａにオフセット部１２１を設け、リード１１８ｂ、１１８ｃ、１１８ｆ、１１８ｇの延設位置を幅方向に板幅半分程度ずらし、隣接するリードの中間部１２２ａ間の幅が、一端部１２０ａ間の幅よりも広くなるように構成している。このような構成とすることで、実装端子の役割を担う他端部１２４ａ間の距離を広げることができ、実装時のショート等を抑制することが可能となる。 Based on the above points, specific differences between the electronic device 110 according to the present embodiment and the electronic device 10 according to the first embodiment can be said to be as follows. First, the leads 118b, 118c, 118f, and 118g constituting the first lead group 116a have a straight structure in which an angle portion is not provided in the intermediate portion 122a. By adopting such a configuration, the leads 118b, 118c, 118f, and 118g constituting the first lead group 116a take a form of enclosing the package part 112 via the resin portion 140. The terminal formation surface and the mounting surface of the electronic device 110 can be made parallel. In the present embodiment, the offset portion 121 is provided at the one end portion 120a, the extending positions of the leads 118b, 118c, 118f, and 118g are shifted by about half the plate width in the width direction, and the width between the intermediate portions 122a of adjacent leads is increased. The width is larger than the width between the one end portions 120a. With such a configuration, the distance between the other end portions 124a serving as mounting terminals can be increased, and a short circuit or the like during mounting can be suppressed.

また、本実施形態に係る電子デバイス１１０では、第２のリード群１１６ｂを構成するリード１１８ａ、１１８ｄ、１１８ｅ、１１８ｈの一端部１２０ｂと中間部１２２ｂとの間に、第３の曲げ部１３４が設けられている。第３の曲げ部１３４は、第１の曲げ部１３０や第２の曲げ部１３２とは反対方向、すなわちパッケージ部品１１２の側面に沿う方向へ折り曲げ形成される。各リード１１８ａ、１１８ｄ、１１８ｅ、１１８ｈに第３の曲げ部１３４を設けることで、検査・書込み用端子としての他端部１２４ｂを実装端子配置面側（電子デバイス１１０の底面側）に配置することが可能となり、検査・書き込み用プローブと駆動制御用プローブ（不図示）とを同一面側から各端子へ当接させることが可能となる。
その他の構成、作用、効果等については、上述した第１の実施形態に係る電子デバイス１０と同様である。 In the electronic device 110 according to the present embodiment, the third bent portion 134 is provided between the one end portion 120b and the intermediate portion 122b of the leads 118a, 118d, 118e, and 118h constituting the second lead group 116b. It has been. The third bent portion 134 is formed to be bent in a direction opposite to the first bent portion 130 and the second bent portion 132, that is, in a direction along the side surface of the package component 112. By providing the third bent portion 134 in each of the leads 118a, 118d, 118e, and 118h, the other end portion 124b as a test / write terminal is disposed on the mounting terminal arrangement surface side (the bottom surface side of the electronic device 110). Thus, the inspection / writing probe and the drive control probe (not shown) can be brought into contact with each terminal from the same surface side.
Other configurations, operations, effects, and the like are the same as those of the electronic device 10 according to the first embodiment described above.

１０………電子デバイス、１２………パッケージ部品、１４ａ〜１４ｊ………接続端子、１６ａ………第１リード群、１６ｂ………第２リード群、１８ａ〜１８ｊ………リード、２０ａ，２０ｂ………一端部、２２ａ，２２ｂ………中間部、２４ａ，２４ｂ………他端部、２５………第１の曲げ部、２６………第２の曲げ部、２８………角度付け部、３０………第１の曲げ部、３２………第２の曲げ部、４０………樹脂部、４２………切欠き部、４４………逃げ部。 DESCRIPTION OF SYMBOLS 10 ......... Electronic device, 12 ......... Package parts, 14a-14j ......... Connection terminal, 16a ......... First lead group, 16b ......... Second lead group, 18a-18j ......... Lead, 20a , 20b ......... one end, 22a, 22b ......... intermediate, 24a, 24b ......... other end, 25 ......... first bend, 26 ......... second bend, 28 ... ... An angled portion, 30 ......... first bent portion, 32 ......... second bent portion, 40 ......... resin portion, 42 ......... notched portion, 44 ......... relief portion.

Claims

A package component having a terminal forming surface and having a plurality of connection terminals arranged along a first side of the terminal forming surface ;
Said connection terminal and has one end connected portion is extended to the terminal forming surface from the plan view the one end on the outside of the area overlapping the terminal forming surface across the first side, and the other A first lead having a first external terminal at an end;
It has the connection terminal and the connected end, overlapping the said terminal formation surface of the end portion in plan view across the side intersecting the first side of the terminal formation surface terminal formation surface region extending the outside and a second lead that the second external terminal is provided on the other end,
Electronic device comprising: a.

A package component having a terminal forming surface and having a plurality of connection terminals arranged along a first side of the terminal forming surface ;
A resin portion covering the package component ;
It said connection terminal and has one end connected portion is extended to the terminal forming surface from the plan view the one end on the outside of the area overlapping the terminal forming surface across the first side, and wherein A first lead provided at the other end with a first external terminal exposed to the outside of the resin portion;
It has the connection terminal and the connected end, overlapping the said terminal formation surface of the end portion in plan view across the side intersecting the first side of the terminal formation surface terminal formation surface region A second lead provided on the other end and provided with a second external terminal exposed to the outside of the resin portion at the other end ,
Electronic device comprising: a.

A first connection terminal group which is a plurality of connection terminals provided along a first side of the terminal formation surface and has a terminal formation surface, and a second side opposite to the first side A package component having a second connection terminal group which is a plurality of connection terminals provided ;
A plurality of leads having one end connected to the front Kise' connection terminals constituting the first connecting terminal groups,
With
The plurality of leads,
In plan view the terminal forming surface is extended to the outside of the area overlapping the said terminal formation surface across the first side from the one end, and the first external terminal is provided on the other end The first lead ,
In plan view the terminal formation surface, passes between the one end of at least one of said connecting terminal and said second connecting terminal groups of said first connection terminal group, different from the first side edge across at extending outside an area overlapping with the terminal formation surface, and a second lead second external terminal at the other end is provided with,
An electronic device comprising:

A first connection terminal group which is a plurality of connection terminals provided along a first side of the terminal formation surface and has a terminal formation surface, and a second side opposite to the first side A package component having a second connection terminal group which is a plurality of connection terminals provided ;
A resin portion covering the package component;
A plurality of leads having one end connected to the connection terminals constituting the first connection terminal group and covered with the resin portion ;
With
Wherein the plurality of leads,
In plan view the terminal forming surface is extended to the outside of the overlapping with the terminal formation surface region across the first side from the one end, and the exposed to the other end to the outside of the resin portion A first lead provided with one external terminal;
In plan view the terminal formation surface, passes between the one end of at least one of said connecting terminal and said second connecting terminal groups of said first connection terminal group, different from the first side edge the extending outside an area overlapping with the terminal forming surface across, and a second lead that the second external terminal is provided to and exposed to the outside of the resin portion at the other end,
An electronic device comprising:

An electronic device according to any one of claims 1 to 4,
One of the first external terminal and the second external terminal constitutes a mounting terminal, and the other is at least one of a test terminal of the electronic device and a data write terminal for the electronic device. Configure the terminal,
The electronic device is characterized in that the inspection / writing terminal is separated from a virtual plane in contact with the plurality of mounting terminals.

An electronic device according to claim 2 or 4,
One of the first external terminal and the second external terminal constitutes a mounting terminal, and the other is at least one of a test terminal of the electronic device and a data write terminal for the electronic device. Configure the terminal,
An electronic device, wherein a gap corresponding to a bending shape of the inspection / writing terminal is provided between the inspection / writing terminal and the resin portion.

An electronic device according to any one of claims 2, 4, and 6, comprising:
One of the first external terminal and the second external terminal constitutes a mounting terminal, and the other is at least one of a test terminal of the electronic device and a data write terminal for the electronic device. Configure the terminal,
The resin part is provided with a notch with respect to the outer shape of the resin part,
The electronic device according to claim 1, wherein the inspection / writing terminal is disposed in the notch.

An electronic device according to any one of claims 2, 4, 6, and 7,
One of the first external terminal and the second external terminal constitutes a mounting terminal, and the other is at least one of a test terminal of the electronic device and a data write terminal for the electronic device. Configure the terminal,
The electronic device, wherein the mounting terminal and the inspection / writing terminal are exposed on the same surface side of the resin portion.