JP5574530B2 - Mounting board inspection apparatus and mounting board inspection method - Google Patents

Description

  In the present invention, a plurality of inspection areas are set in an inspection target area of a mounting board on which a component is mounted, and the plurality of inspection areas are sequentially imaged by a camera to inspect a component mounting state in the inspection area. It is invention regarding the mounting board inspection apparatus and mounting board inspection method which perform.

  When the size of the inspection target area of the mounting board is larger than the visual field size of the inspection camera, the inspection target area of the mounting board is divided into a plurality of inspection areas (imaging areas that can be inspected by one imaging). It is necessary to perform multiple imaging.

  Therefore, in Patent Document 1 (Japanese Patent Application Laid-Open No. 8-62275), the inspection target area of the mounting substrate is divided into a lattice shape with the width of the visual field size of the camera so as to partition a plurality of inspection areas (imaging areas). Yes. Further, this Patent Document 1 includes a component with a low priority order by obtaining a defect rate for each component and assigning a priority of inspection based on the component defect rate in order to reduce the inspection time of the mounting board. An embodiment is described in which the inspection of the inspection area is omitted.

  Further, in Patent Document 2 (Japanese Patent Application Laid-Open No. 2006-78206), imaging of an area (inspection unnecessary area) in which a component is not mounted on the mounting board is skipped and should be in each inspection area (imaging area). The position of each inspection area, the number of areas (number of times of imaging), and the imaging order are calculated so that the number of times of imaging is the smallest, including many parts.

JP-A-8-62275 (see paragraphs [0013], [0014], FIG. 5 and FIG. 7) JP 2006-78206 A (see paragraph [0056], FIG. 16)

  In the above-mentioned Patent Document 1, inspection priority is given by the defect rate of parts, and inspection of an inspection area (imaging area) including parts with low priority is omitted, but in general, in one inspection area Includes a plurality of parts, so even if the priority of inspection of one part included in the inspection area is low, if the priority of other parts is high, it is necessary to inspect the inspection area. . For this reason, the number of non-inspection areas where the inspection can be omitted is very small, and it seems that the effect of shortening the inspection time of the mounting board is small.

  Generally, a mounting board inspection device is installed in the middle or downstream of a component mounting line, and if the processing time per mounting board is balanced between the inspection process and the preceding and following processes, the tact of the entire line is achieved. However, if the inspection time per mounting board becomes longer than the processing time of the preceding and following processes, the tact of the entire line is extended and the production efficiency is lowered.

  In Patent Document 2, since imaging of an area where no components are mounted is only skipped, all components on the mounting board must be imaged and inspected, and there is a limit to shortening the inspection time. For this reason, the inspection time may be longer than the processing time of the preceding and following processes, and in this case, the tact of the entire line is extended.

  In order to shorten the inspection time, it is effective to reduce the number of inspection areas to be actually inspected. However, if the position of the inspection area is fixed as in Patent Document 1, the parts that are not inspected are given priority. Even if it is specified by order, etc., if at least one of the parts in the inspection area requires inspection, the inspection area must be inspected. The number becomes very small, and the inspection time cannot be shortened sufficiently.

  Therefore, in the prior art, in order to shorten the inspection time, it is necessary for an operator to designate a non-inspection area, but this work requires a considerable skill and experience. For this reason, if a worker with insufficient skill level or experience specifies a non-inspection area, the inspection area containing parts that actually need to be inspected may be erroneously specified as the non-inspection area. There was a problem that would decrease.

  Therefore, the problem to be solved by the present invention is to ensure inspection quality in a system in which a plurality of inspection areas set in the inspection target area of the mounting board are imaged one by one in order and the component mounting state is inspected. However, it is to provide a mounting board inspection apparatus and a mounting board inspection method capable of shortening the inspection time per mounting board according to the target tact.

In order to solve the above-described problem, the invention according to claim 1 sets a plurality of inspection areas in an inspection target area of a mounting board on which a component is mounted, and images the plurality of inspection areas one by one in order. In the mounting board inspection apparatus for inspecting the component mounting state in the inspection area, inspection importance setting means for setting the importance of inspection of each component mounted on the mounting board, and target tact setting for setting the target tact The inspection area sequence is created by excluding a part having a lower importance of inspection from the inspection object according to the target tact when creating the inspection area sequence for determining the position, the number of areas and the imaging order of the inspection area. and a test area sequence creating means for creating to fit in any of the inspection area all inspected components on the mounting substrate to a smaller number of areas, before The inspection area sequence creating means arranges the first inspection area around any one corner of the mounting substrate so as to include more parts to be inspected, and thereafter moves to a position moved from the previously arranged inspection area. By repeating the process of placing the next inspection area so that more parts to be inspected are included, an inspection area sequence is created so that all the parts to be inspected on the mounting board fit within one of the inspection areas. It is characterized by doing.

  As in the present invention, the importance of inspection of each part is set, the part with the lower importance of inspection is excluded from the inspection object according to the target tact, and the position, the number of areas and the imaging order of the inspection area are set. If the inspection area sequence to be determined is created so that all parts to be inspected on the mounting board fit in one of the inspection areas with a smaller number of areas, the inspection time can be reduced by reducing the number of areas to be inspected according to the target tact. It can be shortened and the target tact can be realized. In addition, since only the parts with the lower importance of the inspection are excluded from the inspection target and all the parts with the higher importance of the inspection can be inspected, the inspection quality can be ensured.

  In short, in the present invention, since the parts are excluded from the inspection target in units of parts, the number of parts to be inspected is increased even in the same inspection time (the same number of areas) as compared with the prior art in which the inspection areas are excluded from the inspection targets. Therefore, the number of parts to be excluded from the inspection target can be reduced, and both shortening the inspection time and ensuring the inspection quality can be achieved.

In this case, the importance level and target tact of the inspection of each component may be automatically set based on various data and production jobs used in each process of the component mounting line.
Or, if the data that sets the importance of inspection of each part by a specialist engineer is stored in the inspection target part library in advance, the operator sets the importance of inspection of each part when creating the inspection area sequence. There is no need, and it is possible to reliably prevent a drop in inspection quality due to an operator's setting mistake.

However, according to the present invention, when creating an inspection area sequence, an operator may set the importance of inspection of each part, and even in this case, it is compared with the conventional work that is excluded from inspection targets in units of inspection areas. For example, since it is easy to set the inspection importance level for each part, even a worker with little skill or experience can work sufficiently, and the setting mistake of the worker can be greatly reduced.
Furthermore, in the present invention, when creating the inspection area sequence, the first inspection area is arranged so as to include more parts to be inspected around any one corner of the mounting substrate, and then arranged first. By repeating the process of arranging the next inspection area so that more parts to be inspected are included at the position moved from the inspection area, all the parts to be inspected on the mounting board can be accommodated in one of the inspection areas. Since the inspection area sequence is created at the same time, if the first inspection area is arranged around any one corner of the mounting board, the imaging order of the inspection areas is only clockwise or counterclockwise. Thus, the inspection area sequence can be created, and the moving distance of the camera can be shortened.

  Further, the importance of inspection of each component may be set in consideration of at least the interval between components on the mounting board, the component size, and the lead pitch of the components. Here, the interval between components, the component size, and the component lead pitch may be obtained by using component mounting data used in a component mounter. For example, the smaller the interval between components, the higher the importance and the component size. The smaller the value, the higher the importance. The narrower the component lead pitch, the higher the importance. This makes it possible to easily and accurately set the importance of inspection of each part based on the interval between parts, the size of the part, and the lead pitch of the part, and it is also possible to automate the setting of the importance of inspection of each part. is there.

Further, as described in claim 3 , when the inspection area sequence is created, the inspection areas are sequentially arranged in the clockwise direction from the first inspection area arranged around each of the four corners of the mounting board. The inspection area sequence creation processing in the clockwise direction and the inspection area sequence creation processing in the counterclockwise direction in which the inspection areas are sequentially arranged in the counterclockwise direction are performed to create a total of eight inspection area sequences. Only one inspection area sequence having a smaller number of areas and a smaller camera moving distance may be adopted from the inspection area sequences. In this way, it is possible to adopt an inspection area sequence that minimizes the number of areas and the camera movement distance.

The invention according to claim 4 describes the technical idea substantially the same as the invention of the mounting board inspection apparatus according to claim 1 as an invention of a mounting board inspection method of a different category.

FIG. 1 is a block diagram schematically showing the configuration of a mounting board inspection apparatus according to an embodiment of the present invention. FIG. 2 is a diagram illustrating an arrangement example of the inspection areas K1 to K3 when all the components A to J on the mounting substrate are to be inspected. FIG. 3 is a diagram showing an arrangement example of the inspection areas K1 and K2 when the parts A to I except the part J having the lowest importance of inspection are to be inspected. FIG. 4 is a diagram for explaining a method of creating an inspection area sequence. FIG. 5 is a diagram illustrating a specific example of creating an inspection area sequence in the counterclockwise direction. FIG. 6 is a flowchart showing the flow of processing of the inspection area sequence creation program.

Hereinafter, an embodiment embodying a mode for carrying out the present invention will be described.
As shown in FIG. 1, the mounting board inspection apparatus conveys a camera 11 that images the inspection area of the mounting board, an XY moving device 12 that moves the camera 11 in the XY directions, and a mounting board on which components are mounted. A substrate transport device 13 and a control device 14 for controlling these operations are provided.

  The control device 14 of this mounting board inspection apparatus is mainly composed of a computer such as a personal computer, and includes an input device 15 such as a keyboard and a mouse, a display device 16 such as a liquid crystal display and a CRT, and an inspection area shown in FIG. A storage device 17 for storing a sequence creation program, a created inspection area sequence, an inspection target component library storing data in which the degree of importance of inspection of each component is set in advance by a specialized engineer, and the like are connected.

  The control device 14 sets a plurality of inspection areas in the inspection target area of the mounting board, picks up the plurality of inspection areas one by one in order, processes the picked-up images, and processes the picked-up images in the inspection area. Inspect the component mounting status.

  By the way, if the mounting board inspection device is installed in the middle or downstream of the component mounting line and the processing time per mounting board is balanced between the inspection process and the preceding and following processes, the tact of the entire line is achieved. However, if the inspection time per mounting board becomes longer than the processing time of the preceding and following processes, the tact of the entire line is extended and the production efficiency is lowered.

  As a countermeasure, it is necessary to reduce the inspection time by reducing the number of areas to be inspected, but the work to reduce the number of areas to be inspected requires considerable skill and experience. If a worker who does this, mistakes are likely to occur, and the inspection quality will deteriorate.

  Therefore, in this embodiment, the control device 14 executes the inspection area sequence creation program shown in FIG. 6 to set the importance and target tact of inspection of each component mounted on the mounting board, and according to the set target tact. The inspection area sequence that determines the position of the inspection area, the number of areas, and the imaging order is excluded from the inspection target parts with the least important parts. Create to fit in one of the inspection areas.

  In this case, the position of the inspection area is not fixed, and the position of the inspection area is moved according to the position of the component on the mounting board. For example, FIG. 2 shows an arrangement example of inspection areas K1 to K3 when all the components A to J on the mounting board are to be inspected. In this example, the components in the inspection areas K1 to K3 are shown. Three inspection areas K1 to K3 are arranged on the mounting substrate so as to average the number as much as possible.

  On the other hand, FIG. 3 shows an arrangement example of the inspection areas K1 and K2 when the parts A to I except the part J having the lowest importance of inspection are to be inspected. In this example, two inspection areas are shown. K1 and K2 are arranged. In the example of FIG. 3, the effect of reducing one inspection area can be obtained by removing only one part J having the lowest importance of inspection from the inspection target.

Next, a method of creating an inspection area sequence that determines the position of the inspection area, the number of areas, and the imaging order will be described with reference to FIG.
When creating an inspection area sequence, first, place the first inspection area at one of the corners of the mounting board so that more parts to be inspected are included, and then inspect clockwise from the first inspection area. The inspection area sequence creation process in the clockwise direction for arranging the inspection areas and the inspection area sequence creation process in the counterclockwise direction for arranging the inspection areas in the counterclockwise direction are performed. In each inspection area sequence creation process, all inspections on the mounting board are repeated by repeating the process of arranging the next inspection area so that more parts to be inspected are included at the position moved from the inspection area previously arranged. An inspection area sequence is created so that the target part fits in one of the inspection areas.

  For the four corners of the mounting board, the inspection area sequence creation process in the clockwise direction and the inspection area sequence creation process in the counterclockwise direction are respectively performed to create a total of eight inspection area sequences. Only one inspection area sequence with a smaller number of areas and a smaller camera moving distance is adopted.

Here, a specific example in which the first inspection area is arranged at the upper left corner of the mounting substrate and the inspection area sequence in the counterclockwise direction is created will be described with reference to FIG.
In the example of FIG. 5, the second inspection area is arranged at a position moved downward from the first inspection area arranged at the upper left corner of the mounting board. At this time, the component C having the largest Y coordinate and the smallest X coordinate among the candidate components to be accommodated in the second inspection area is stored in the upper left end of the second inspection area. In general, when the next inspection area is arranged at a position moved downward from the previous inspection area, the Y coordinate is the largest and the X coordinate is the smallest among the candidate parts to be placed in the next inspection area. Arrange the parts in the upper left corner of the next inspection area.

  When the third inspection area is arranged at a position moved to the right from the second inspection area, the Y coordinate is the smallest and the X coordinate is one among the candidate parts to be stored in the third inspection area. The smallest part G is stored in the lower left end of the third inspection area. In general, when the next inspection area is arranged at a position moved rightward from the previous inspection area, the Y coordinate is the smallest and the X coordinate is the smallest among the candidate parts to be placed in the next inspection area. Arrange the parts in the lower left corner of the next inspection area.

  When the fourth inspection area is arranged at a position moved upward from the third inspection area, the Y coordinate is the smallest and the X coordinate is the smallest among the parts that are candidates to be accommodated in the third inspection area. The large part I is stored at the lower right end of the fourth inspection area. In general, when the next inspection area is arranged at a position moved upward from the previous inspection area, the Y coordinate is the smallest and the X coordinate is the largest among the candidate parts to be placed in the next inspection area. Arrange the parts in the lower right corner of the next inspection area.

  Although not shown in FIG. 5, when the fifth inspection area is arranged at a position moved leftward from the fourth inspection area, the component having the largest Y coordinate and the largest X coordinate is the fifth. Fit in the upper right corner of the inspection area. In general, when the next inspection area is arranged at a position moved leftward from the previous inspection area, the Y coordinate is the largest and the X coordinate is the largest among the candidate parts to be placed in the next inspection area. Arrange large parts to fit in the upper right corner of the next inspection area.

All inspection areas are arranged so as not to protrude from the area of the mounting substrate.
In addition, in the case of creating the inspection area sequence in the clockwise direction by arranging the first inspection area at the upper right corner of the mounting substrate, in the description of the method for creating the inspection area sequence in the counterclockwise direction described above, “X coordinate is the largest” is read as “X coordinate is the smallest”, “X coordinate is the smallest” and “X coordinate is the largest” respectively. “Right” is “Left” Should be read as “right” respectively.

  The inspection area sequence creation processing of the present embodiment described above is executed by the control device 14 according to the inspection area sequence creation program of FIG. This program serves as inspection area sequence creation means in the claims.

  In this program, a specialized engineer sets the importance of inspection of each part in advance, and stores a parts library storing data on the importance of inspection of each part in the storage device 17 (step 101). At this time, the importance of inspection of each component may be set in consideration of at least the interval between components on the mounting substrate, the component size, and the lead pitch of the component.

  Here, the interval between components, the component size, and the component lead pitch may be obtained by using component mounting data used in a component mounter. For example, the smaller the interval between components, the higher the importance and the component size. The smaller the value, the higher the importance. The narrower the component lead pitch, the higher the importance. Accordingly, it is possible to automatically set the importance of inspection of each part based on the interval between parts, the part size, the lead pitch of the part, and the like. Note that the processing in step 101 serves as inspection importance setting means in the claims.

  Thereafter, in step 102, the inspection area sequence creation processing in the clockwise direction and the inspection area sequence creation processing in the counterclockwise direction are respectively performed on the four corners of the mounting board by the above-described method. An inspection area sequence is created, and only one inspection area sequence with a smaller number of areas and a smaller camera moving distance is adopted from these inspection area sequences.

  Thereafter, the process proceeds to step 103, where it is determined whether the target tact is set. If the target tact is not set, it is determined that there is no need to change the inspection area sequence, and this program is terminated. Here, the target tact may be set automatically based on various data and production jobs used in each process of the component mounting line, or may be set by the operator in consideration of the tact of the entire line. . This function corresponds to the target tact setting means in the claims.

  On the other hand, if it is determined in step 103 that the target tact is set, the process proceeds to step 104, and the tact when the inspection is performed using the inspection area sequence finally adopted in step 102 is the target. It is determined whether or not it is within the tact, and if it is within the target tact, there is no need to change the inspection area sequence, so this program is terminated.

  On the other hand, if it is determined in step 104 that it is not within the target tact, the process proceeds to step 105, a predetermined number of parts having lower importance of inspection are excluded from inspection targets, and the process returns to step 102. Again, for each of the four corners of the mounting board, the inspection area sequence creation process in the clockwise direction and the inspection area sequence creation process in the counterclockwise direction are respectively performed to create a total of eight inspection area sequences. Only one inspection area sequence in which the number of areas and the camera movement distance are smaller is adopted from the area sequences.

  Thereafter, in step 104, it is determined whether or not it is within the target tact. If it is not within the target tact, a predetermined number of parts having a lower importance of inspection are again excluded from inspection targets in step 105. In step 102, the inspection area sequence creation process in the clockwise direction and the inspection area sequence creation process in the counterclockwise direction are respectively performed on the four corners of the mounting board again to create a total of eight inspection area sequences. Of these inspection area sequences, only one inspection area sequence having a smaller number of areas and a smaller camera moving distance is employed.

  As described above, the process according to the target tact is repeated by repeating the process of creating the inspection area sequence by excluding the predetermined number of parts having the lower importance of inspection from the inspection target until the target tact is reached. The inspection area sequence is created by excluding the component with the lower importance from the inspection target.

  According to the present embodiment described above, the inspection importance of each part is set, the part with the lower importance of inspection is excluded from the inspection object according to the target tact, and the position and the number of areas of the inspection area are excluded. Since the inspection area sequence that determines the imaging order is created so that all parts to be inspected on the mounting board fit within one of the inspection areas with a smaller number of areas, the number of areas to be inspected is reduced according to the target tact. The inspection time can be shortened and the target tact can be realized. In addition, since only the parts with the lower importance of the inspection are excluded from the inspection target and all the parts with the higher importance of the inspection can be inspected, the inspection quality can be ensured.

  In short, in this embodiment, since the parts are excluded from the inspection target in units of parts, the number of parts to be inspected is increased even in the same inspection time (the same number of areas) as compared with the prior art in which the inspection areas are excluded from the inspection targets. Therefore, both shortening of inspection time and ensuring of inspection quality can be achieved.

  In addition, if the data that sets the importance of inspection of each part by a specialist engineer is stored in the inspection target part library in advance, the operator needs to set the importance of inspection of each part when creating the inspection area sequence. Therefore, it is possible to reliably prevent the deterioration of inspection quality due to an operator's setting mistake.

  However, according to the present invention, when creating an inspection area sequence, an operator may set the importance of inspection of each part, and even in this case, it is compared with the conventional work that is excluded from inspection targets in units of inspection areas. For example, since it is easy to set the inspection importance level for each part, even a worker with little skill or experience can work sufficiently, and the setting mistake of the worker can be greatly reduced.

  DESCRIPTION OF SYMBOLS 11 ... Camera, 12 ... XY movement apparatus, 13 ... Board | substrate conveyance apparatus, 14 ... Control apparatus (inspection area sequence creation means, inspection importance setting means, target tact setting means), 15 ... Input device, 16 ... Display apparatus, 17 …Storage device

Claims (4)

Mounting board inspection in which a plurality of inspection areas are set in the inspection target area of the mounting board on which the component is mounted, and the plurality of inspection areas are sequentially imaged by a camera to inspect the component mounting state in the inspection area. In the device
Inspection importance setting means for setting the importance of inspection of each component mounted on the mounting board;
Target tact setting means for setting the target tact;
When creating an inspection area sequence that determines the position, the number of areas, and the imaging order of the inspection area, the inspection area sequence is reduced by excluding the parts with the lower importance of the inspection from the inspection target according to the target tact. An inspection area sequence creating means for creating all the inspection target parts on the mounting board so as to fit in any inspection area in the number of areas ,
The inspection area sequence creation means arranges the first inspection area around any one corner of the mounting substrate so as to include more parts to be inspected, and then moves from the inspection area previously arranged. By repeating the process of arranging the next inspection area so that more parts to be inspected are included, the inspection area sequence is set so that all the parts to be inspected on the mounting board are within one of the inspection areas. A mounting board inspection apparatus characterized by being produced .   The mounting board inspection apparatus according to claim 1, wherein the importance of the inspection of each component is set in consideration of at least an interval between components on the mounting substrate, a component size, and a lead pitch of the component. . The inspection area sequence creation means creates a clockwise inspection area sequence in which the inspection areas are sequentially arranged in the clockwise direction from the first inspection area arranged around each corner of the four corners of the mounting substrate. The inspection area sequence creation processing in the counterclockwise direction in which the inspection areas are sequentially arranged in the counterclockwise direction is performed to create a total of eight inspection area sequences. From these inspection area sequences, the number of areas mounting board inspection apparatus according to claim 1 or 2 camera movement distance is equal to or to employ only one fewer test area sequence. Mounting board inspection in which a plurality of inspection areas are set in the inspection target area of the mounting board on which the component is mounted, and the plurality of inspection areas are sequentially imaged by a camera to inspect the component mounting state in the inspection area. In the method
Set the importance and target tact of inspection of each component mounted on the mounting board,
According to the target tact, an inspection area sequence that determines the position, the number of areas, and the imaging order of the inspection area by excluding the part having the lower importance of the inspection from the inspection target on the mounting board. A mounting board inspection method for creating all inspection target parts so as to fit within any inspection area ,
The first inspection area is arranged around any one corner of the mounting substrate so as to include more parts to be inspected, and then the next inspection area is inspected at a position moved from the inspection area previously arranged. Mounting is characterized in that an inspection area sequence is created so that all inspection target parts on the mounting board fit within one of the inspection areas by repeating the process of arranging so as to include more parts. Board inspection method.

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