JP5572005B2 - Plate member support device - Google Patents

Description

The present invention relates to a support equipment for supporting the plate-like member.

2. Description of the Related Art Conventionally, as a support device for transporting a semiconductor wafer (hereinafter sometimes simply referred to as a wafer) in a semiconductor manufacturing process, a support device having a disk-shaped suction region facing the wafer is known (for example, a patent Reference 1). In this support device, the suction area is configured to have innumerable fine holes, and the entire surface of the wafer is sucked by sucking air through these holes.
On the other hand, in the pre-dicing process in the semiconductor manufacturing process, the back surface of the wafer is ground to reduce the thickness of the semiconductor chip. In this grinding process, the inside of the wafer is ground deeper than the outer edge. Thus, a semiconductor wafer is known in which the inner side is formed thinner than the outer edge part, that is, the outer edge part has an annular convex part protruding in the thickness direction and the inner part surrounded by the convex part has a concave part (for example, , See Patent Document 2).

JP 2001-24051 A JP 2007-19461 A

  By the way, when a wafer having a convex portion at the outer edge as described in Patent Document 2 is sucked and held by a conventional support device as described in Patent Document 1, the gap between the concave portion of the wafer and the suction region is set. As a result, the space formed is reduced in pressure, and the stress acting on the concave portion is bent toward the suction region side, so that the wafer is damaged. In particular, with recent increase in wafer outer diameter and wafer thinning, wafer breakage due to stress applied to the wafer during transport has become a problem, and improvement thereof is desired.

An object of the present invention, provides one even when the projections and recesses on the surface of the side is formed, the supporting equipment of the plate-like member can be reliably held without damaging the plate-like member plate-like member There is to do.

In order to achieve the above object, a plate-like member support device of the present invention comprises a holding means for sucking and holding the plate-like member from one surface side, and a suction means for applying a suction force to the holding means, retaining means towards the one surface of the plate and the frame body formed along cormorants annular and hollow to the outer edge of member, the plate-like member is formed in the frame body has an opening therein opening And a closing means capable of closing the opening of the frame body from the opposite side of the plate-like member to form a space together with the plate-like member and the frame body, and making the inside of the space in a decompressed state. The closing means closes the opening of the frame body with a gap, a lid that can close the opening of the frame body, a position that completely closes the opening of the frame body, and the opening of the frame body Pressure adjusting hand that adjusts the pressure in the space by moving the lid between the positions Characterized in that it is configured to have and.

In this case, in the plate-shaped member support device of the present invention, the holding means has a separating means that protrudes from the frame body through the suction port and can come into contact with one surface of the plate-shaped member. It is preferable that the plate-like member can be held in a state of being separated from the frame body by the separation means.
Furthermore, the holding means includes a separation distance changing means capable of changing a separation distance between the frame body and the plate-like member by adjusting a protruding amount of the separation means from the frame body. it is not preferable.

  According to the present invention as described above, by sucking fluid such as air from the suction port of the frame body along the outer edge of the plate-like member and sucking and holding the plate-like member from one surface side, the plate-like member The plate-like member can be supported without applying a suction force to the intermediate portion. Therefore, for example, even when a wafer having a convex portion at the outer edge portion and a concave portion at the intermediate portion is targeted as the plate-like member, the convex portion at the outer edge portion is sucked so that the concave portion is not sucked. In addition, by supporting the wafer without applying stress to the concave portion, it is possible to appropriately hold the wafer while preventing the wafer from being damaged.

  Further, by holding the plate-like member in a state of being separated from the frame body by bringing the separating means into contact with the plate-like member, the holding means can suck and hold without disturbing the flow of fluid such as air sucked in. In addition, the stress applied to the plate-like member can be further suppressed by holding the plate-like member other than the position where the separating means abuts in a non-contact manner. Furthermore, the suction holding force can be easily adjusted by changing the separation distance between the frame and the plate-like member by the separation distance changing means. Here, as a means for adjusting the suction holding force, in addition to changing the separation distance, the suction amount of the fluid sucked from the suction port may be changed. The suction holding force can be adjusted, and it becomes possible to easily cope with plate-like members having different sizes and weights.

Further, if the suction ports are continuously formed along the annular frame, the suction can be performed uniformly along the outer edge of the plate-like member, and the stress on the plate-like member can be further reduced. .
Further, by providing a closing means for forming a space together with the plate-like member and the frame body, the inside of the formed space is brought into a reduced pressure state, and in addition to a suction holding force due to suction of fluid from the suction port, a negative pressure in which the space is reduced A holding force by pressure can be applied. Therefore, for example, if a holding force due to negative pressure is applied so as to balance the dead weight of the intermediate portion of the plate-like member, the whole plate-like member is caused by the suction holding force by the suction port while suppressing the bending of the intermediate portion due to its own weight. Suction holding can be ensured. Further, by adjusting the pressure in the space by the pressure adjusting means, the holding force due to the negative pressure can be adjusted as appropriate to further reduce the stress on the plate-like member.

The perspective view of the support device concerning a 1st embodiment of the present invention. FIG. 2 is a partial cross-sectional view of the support device of FIG. 1. The bottom view of the support apparatus of FIG. The fragmentary sectional view of the support device concerning a 2nd embodiment of the present invention.

Hereinafter, each embodiment of the present invention will be described with reference to the drawings.
In the second and subsequent embodiments, the same constituent members as those described in the first embodiment and the constituent members having the same functions are denoted by the same reference numerals as those in the first embodiment. Those descriptions are omitted or simplified.

[First Embodiment]
In FIG. 1, a support device 1 constitutes a part of a transfer device that transfers a wafer W as a plate-like member, and a back surface side (upper surface in FIG. 2) that is one surface of the wafer W during transfer. ) To hold by suction. The support device 1 is attached to a distal arm 2A of a transfer device 2 such as an articulated robot as a drive device. Here, as shown in FIG. 2, a circuit is formed on the front surface (lower surface in FIG. 2) WA of the wafer W, and the inner peripheral portion other than the outer edge portion on the rear surface is thinly ground. An annular convex portion WB protruding in the thickness direction is formed on the outer edge portion, and a concave portion WC is formed on the inner side surrounded by the convex portion WB, and a protective sheet S is formed on the surface WA of the wafer W. Is affixed.

  The support device 1 includes a holding unit 3 that sucks and holds the wafer W from the back surface side, and a suction tube 4 that is connected to a suction pump (not shown) and applies suction force to the holding unit 3. ing. The holding means 3 has a frame 5 that is formed in an annular and hollow shape along the outer edge of the wafer W, and a hollow extension 6 that extends to the side of the transfer arm 2 continuously from the frame 5. Is formed. Further, the suction pipe 4 is composed of a total of six, three connected to the frame body 5 and three connected to the extension part 6, and the frame body 5 and the extension part 6 are constituted by these six suction pipes 4. A predetermined flow rate of air (fluid) can be sucked from the inside of each.

  As shown in FIG. 2, the holding means 3 according to the present embodiment includes a suction port 7 that is formed at the end of the frame body 5 and opens toward the surface of the convex portion WB on the back surface of the wafer W. A plurality of (eight in this embodiment) pins 8 as spacing means that protrude from the inside through the suction port 7 and can come into contact with the surface of the convex portion WB, and the amount of protrusion of each pin 8 is adjusted to adjust the frame body 5 and a linear motion motor 9 which is a driving device as a separation distance changing means capable of changing a separation distance between the surface of the convex portion WB.

  The frame body 5 has an opening O inside and is formed in an annular shape as a whole, and an upper surface portion 51 located on the opposite side of the wafer W to be supported, an inner side surface portion 52 extending from the inner edge of the upper surface portion 51, An outer surface 53 extending from the outer edge of the upper surface 51, an inner inclined surface 54 and an outer inclined surface 55 extending in an inclined manner in a direction approaching the inner surface 52 and the outer surface 53, an inner inclined surface 54 and an outer inclined A bottom surface portion 56 that connects the front ends of the surface portion 55 is formed. The suction pipe 4 is connected to three locations on the upper surface portion 51, and the linear motion motor 9 is fixed to the other eight locations on the upper surface portion 51.

  As shown in FIG. 3, the suction port 7 is composed of four long holes 71 that are formed in an elongated and substantially ¼ arc shape by cutting out an annular bottom surface portion 56. Note that the suction port 7 is not limited to the one divided into the four long holes 71, and these may be connected to be continuously formed endlessly over the entire circumference of the bottom surface portion 56. Two of the long holes 71 may be connected to each other so as to be continuous with the substantially half circumference of the bottom surface portion 56. Further, the suction port 7 is not limited to the long hole 71 but may be configured by arranging a plurality of small-diameter round holes or the like in parallel.

  The eight pins 8 are arranged at equal intervals of approximately 45 ° along the circumferential direction of the frame 5, and two pins 8 are inserted through the four long holes 71. Further, the three suction pipes 4 connected to the frame body 5 are provided at a position deviating from the opening position of the long hole 71, that is, on the upper surface portion 51 opposite to the intermediate position between the adjacent long holes 71. Note that the number and installation positions of the pins 8 and the suction pipes 4 are not particularly limited, and may be set as appropriate.

  In the holding means 3 as described above, each pin 8 whose projection amount is adjusted by the linear motion motor 9 is brought into contact with the surface of the convex portion WB, so that the convex portion WB is separated from the suction port 7 of the frame 5 by a predetermined distance L. And a gap K is formed between the frame 5 and the wafer W. Further, by sucking air from the inside of each of the frame 5 and the extension 6 by the suction pipe 4, the holding means 3 allows the air to be drawn from above the opening O of the frame 5 and from the outside of the frame 5 toward the suction port 7. The air is drawn in from the suction port 7 through the gap K so that an air flow toward the suction port 7 is formed at the surface position of the convex portion WB, and the wafer W can be sucked and held by this air flow. Yes.

  Further, when the suction holding force of the wafer W by the holding means 3 is increased, the suction force of the suction tube 4 may be increased to increase the amount of air sucked from the suction port 7, or by driving the linear motor 9. The pin 8 may be immersed to reduce the interval dimension of the gap K (the separation distance L between the suction port 7 and the convex portion WB). Thereby, the suction holding force can be strengthened by increasing the flow velocity of the airflow toward the suction port 7 at the convex portion WB surface position. On the other hand, when weakening the suction holding force of the wafer W by the holding means 3, the suction force of the suction tube 4 may be lowered to reduce the amount of air sucked from the suction port 7, or the linear motion motor 9 is driven. Thus, the projecting amount of the pin 8 may be increased to widen the gap K. Thereby, the suction holding force can also be weakened because the flow velocity of the airflow toward the suction port 7 at the surface position of the convex portion WB decreases.

According to this embodiment as described above, the following effects are obtained.
That is, by sucking air from the suction port 7 facing the surface of the convex portion WB of the wafer W, a negative pressure region is generated on the surface of the convex portion WB, and the wafer W is attracted and supported. The wafer W can be sucked and held by the holding means 3 with almost no suction force acting on the concave portion WC of W, and the wafer W can be appropriately held while reducing the stress acting on the wafer W. Further, by bringing the pins 8 into contact with the surface of the convex portion WB, the wafer W is held in a non-contact state in which the convex portion WB is separated from the suction port 7 of the frame 5 by a predetermined distance L. Compared with the case where the suction means or the like is held in close contact with the surface, the stress applied to the wafer W can be reliably suppressed, and damage to the wafer W can be prevented.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIG.
The holding means 3A in the supporting device 1A of the present embodiment is different from the first embodiment in that the holding means 3A includes a closing means 10 that closes the opening O of the frame 5 and can form the space SP together with the wafer W and the frame 5. To do. That is, the closing means 10 is a driving device as a pressure adjusting means in which the lid 11 capable of closing the opening O and the output shaft 12A are coupled to the lid 11 and fixed to the inner side surface portion 52 of the frame 5. And a linear motion motor 12. Then, the closing means 10 drives the lid 11 up and down in FIG. 4 with the linear motor 12 to completely close the opening O with the lid 11 or between the frame 5 and the lid 11. Can be closed with a slight gap K1. Then, the space SP is decompressed by sucking air from the suction port 7, and the pressure in the space SP is adjusted by increasing or eliminating the gap K1 by driving the linear motor 12. It is configured to be able to. Accordingly, in the holding means 3A, in addition to sucking and holding the convex portion WB by sucking air from the suction port 7, the entire wafer W including the concave portion WC is sucked by the negative pressure in the space SP in a reduced pressure state. Can be done. Thereby, the bending of the concave portion WC due to its own weight can be suppressed, and the stress on the wafer W can be further reduced.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, although the case where the plate-like member is a semiconductor wafer is shown in the embodiment, the plate-like member is not limited to the semiconductor wafer W, and other plates such as a glass plate, a steel plate, or a resin plate are used. Shaped members can also be targeted, and examples of semiconductor wafers include silicon semiconductor wafers and compound semiconductor wafers.
Moreover, in the said embodiment, although the wafer W which has the convex part WB of the outer edge part and the recessed part WC enclosed by this convex part WB was made into the plate-shaped member to be supported, a plate-shaped member is convex part WB or A flat plate having no recess WC may be used. Furthermore, the plate-like member is not limited to a circular shape in a plan view, and may be an arbitrary shape such as a polygonal shape, and the shape is not particularly limited. And since the frame of the holding means only needs to be formed in an annular shape along the outer edge of the plate-like member, it is not limited to the annular frame 5 as in the above embodiment, but of any shape A frame can be used.

Moreover, in the said embodiment, although the pin 8 which protrudes from the suction port 7 of the frame 5 was made to contact | abut to the convex part WB surface of the wafer W, the clearance gap K was formed, but not only this but a suction port is provided in the convex part WB. You may employ | adopt the contact-type holding | maintenance means to which 7 is made to contact and hold | maintain.
Furthermore, in the embodiment, the distance between the gaps K can be adjusted by changing the protruding amount of the pins 8 with the linear motion motor 9. It may be fixed to the suction port 7 portion. Further, the separating means is not limited to the needle-like one such as the pin 8, and a member made of an appropriate form or material can be adopted. For example, if the separating means is constituted by an elastic body such as rubber, a plate shape The impact on the member can be reduced.
Furthermore, in the said embodiment, although the support apparatuses 1 and 1A which comprise a part of conveying apparatus were demonstrated, the supporting apparatus of this invention is not restricted to what comprises a part of conveying apparatus. And the support apparatus of this invention is not restricted to what supports a wafer (plate-shaped member) from upper direction, You may support a wafer (plate-shaped member) from the bottom like a support table.
In addition, the driving device in the embodiment employs electric devices such as a rotation motor, a linear motion motor, a single axis robot, and an articulated robot, actuators such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition, a combination of them directly or indirectly can be adopted (some of them overlap with those exemplified in the embodiment).

1, 1A support device 3, 3A holding means 4 suction pipe (suction means)
5 Frame 7 Suction port 8 Pin (separation means)
9 Linear motor (separation distance changing means)
10 Blocking means 12 Linear motion motor (pressure adjusting means)
SP space W wafer (plate member)

Claims (3)

Holding means for sucking and holding the plate-like member from one surface side;
A suction means for applying a suction force to the holding means,
Said retaining means towards the one surface of the plate and the frame body formed along cormorants annular and hollow to the outer edge of member, the plate-like member is formed on the frame body having an opening therein Opening suction port and closing means capable of closing the opening of the frame body from the opposite side of the plate-like member to form a space together with the plate-like member and the frame body and making the inside of the space in a reduced pressure state It is configured to have the door,
The closing means includes a lid capable of closing the opening of the frame body, and a lid between a position where the opening of the frame body is completely closed and a position where the opening of the frame body is closed with a gap. A plate-like member support device comprising pressure adjusting means for adjusting the pressure in the space by moving a body .   The holding means has a separating means that protrudes from the frame body through the suction port and can come into contact with one surface of the plate-like member, and is separated from the frame body by the separating means. The plate-like member support device according to claim 1, wherein the plate-like member is configured to be held.   The holding means includes a separation distance changing means capable of changing a separation distance between the frame body and the plate-like member by adjusting a protruding amount of the separation means from the frame body. The plate-like member support device according to claim 2, wherein the device is a support member.

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