JP5571320B2 - Wiring / pipe material support fixing method and wiring / pipe material support method - Google Patents

Wiring / pipe material support fixing method and wiring / pipe material support method Download PDF

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JP5571320B2
JP5571320B2 JP2009099397A JP2009099397A JP5571320B2 JP 5571320 B2 JP5571320 B2 JP 5571320B2 JP 2009099397 A JP2009099397 A JP 2009099397A JP 2009099397 A JP2009099397 A JP 2009099397A JP 5571320 B2 JP5571320 B2 JP 5571320B2
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adhesive
wiring
substrate
piping material
support
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JP2010216647A (en
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真之 安田
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Mirai Kogyo KK
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Mirai Kogyo KK
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この発明は、建造物の構築面に接着固定されて、配線・配管材を支持する、配線・配管材支持具の、固定方法、および、その配線・配管材支持具を用いた、配線・配管材の支持方法に関するものである。   The present invention relates to a fixing method for a wiring / piping material support that is bonded and fixed to a construction surface of a building and supports the wiring / piping material, and wiring / piping using the wiring / piping material support The present invention relates to a method for supporting a material.

従来、建造物の構築面としての天井に、配線・配管材を支持する配線・配管材支持具を固定するに当たって、接着材を用いることがあった（例えば、特許文献１参照）。この配線・配管材支持具は、基板と、その基板から下方に延設されて配線・配管材を支持する支持部とから構成されていた。そして、前記基板部分が、接着材を用いて天井に固定された。   Conventionally, an adhesive is sometimes used to fix a wiring / piping material support for supporting wiring / piping material on a ceiling as a construction surface of a building (see, for example, Patent Document 1). This wiring / piping material support tool is composed of a substrate and a support portion that extends downward from the substrate and supports the wiring / piping material. And the said board | substrate part was fixed to the ceiling using the adhesive material.

特開２００８−１７５３２８号公報JP 2008-175328 A

しかし、前記従来の配線・配管材支持具にあっては、その配線・配管材支持具を天井へ固定した後に、接着材が基板のほぼ全体に広がっているか否かを確認することができなかった。また、基板を天井に押し付けたときに接着材が基板の周囲からはみ出るように、接着材を多めに塗布することもあったが、この場合には、接着材を必要以上に使用しなければならず、無駄であった。   However, in the conventional wiring / piping material support, after the wiring / piping material support is fixed to the ceiling, it cannot be confirmed whether or not the adhesive spreads over almost the entire substrate. It was. In addition, a large amount of adhesive was sometimes applied so that the adhesive protruded from the periphery of the board when it was pressed against the ceiling. In this case, the adhesive must be used more than necessary. It was useless.

この発明は、上記した従来の欠点を解決するためになされたものであり、その目的とするところは、接着材が基板の周囲からはみ出していなくとも接着材の広がりの適否を確認することができる、配線・配管材支持具の固定方法、および、その配線・配管材支持具を用いた、配線・配管材の支持方法を提供することにある。   The present invention has been made to solve the above-described conventional drawbacks, and the object of the present invention is to confirm the appropriateness of the spread of the adhesive even if the adhesive does not protrude from the periphery of the substrate. Another object of the present invention is to provide a method for fixing a wiring / piping material support and a method for supporting the wiring / piping material using the wiring / piping material supporting tool.

この発明に係る配線・配管材支持具の固定方法および配線・配管材の支持方法は、前記目的を達成するために、次の構成からなる。すなわち、
請求項１に記載の発明に係る配線・配管材支持具の固定方法は、建造物の構築面に配線・配管材支持具を固定する、固定方法である。
ここで、前記配線・配管材支持具は、前記構築面に接着固定されて、配線・配管材を支持する支持具であって、前記構築面に接着材により貼り付けられる基板と、前記配線・配管材を支持する支持部とを備える。そして、前記基板は、全体が、その基板の向こう側が透けて見えるように透明または半透明の材料で形成されている。
そこで、この配線・配管材支持具の固定方法は、前記配線・配管材を支持する前の前記配線・配管材支持具において、前記基板に、硬化によって見え方が変わる接着材を塗布し、前記基板を前記構築面へ押し付けるとともに、前記基板を透かして前記接着材の広がりの状態を確認する。その後、前記基板を透かして、前記接着材の前記見え方の変化を見ることでその接着材の硬化状態を確認する。
このように、接着材が、硬化によって見え方が変わると、基板を透かして接着材の硬化状態を確認することができ、この硬化状態を確認することで、配線・配管材支持具が配線・配管材を支持可能となる時期を見計らうことができる。 The wiring / pipe material support fixing method and the wiring / pipe material support method according to the present invention have the following configurations in order to achieve the object. That is,
The fixing method of the wiring / piping material support according to the invention described in claim 1 is a fixing method of fixing the wiring / piping material supporting tool to the construction surface of the building.
Here, the wiring / piping material support is a support that is bonded and fixed to the construction surface to support the wiring / piping material, and a substrate that is attached to the construction surface with an adhesive; And a support portion for supporting the piping material. The entire substrate is formed of a transparent or translucent material so that the other side of the substrate can be seen through.
Therefore, in this wiring / piping material support method, the wiring / piping material support before applying the wiring / piping material is coated on the substrate with an adhesive that changes its appearance by curing, The substrate is pressed against the construction surface, and the spread state of the adhesive is confirmed through the substrate. Thereafter, the cured state of the adhesive is confirmed by seeing the change in the appearance of the adhesive through the substrate.
In this way, when the adhesive changes in appearance due to curing, the cured state of the adhesive can be confirmed through the substrate, and by confirming this cured state, the wiring / pipe material support can be The time when the piping material can be supported can be expected.

また、請求項２に記載の発明に係る配線・配管材の支持方法は、請求項１に記載の配線・配管材支持具の固定方法により、建造物の構築面に配線・配管材支持具を固定し、前記接着材の硬化によりその接着材の見え方が変化した後、前記配線・配管材支持具の支持部で、配線・配管材を支持する。   Moreover, the wiring / pipe material support method according to the invention of claim 2 is a method of fixing the wiring / pipe material support on the construction surface of the building by the wiring / pipe material support fixing method of claim 1. After fixing and changing the appearance of the adhesive due to the curing of the adhesive, the wiring / piping material is supported by the support portion of the wiring / piping material support.

この発明に係る配線・配管材支持具の固定方法および配線・配管材の支持方法によれば、基板を透かして接着材の広がりを見ることで、接着材が基板の周囲からはみ出していなくとも接着材の広がりの適否を確認することができる。そして、接着材が、硬化によって見え方が変わるため、基板を透かして接着材の硬化状態を確認することができ、配線・配管材支持具が配線・配管材を支持可能となる時期を見計らうことができる。   According to the fixing method of the wiring / piping material support and the wiring / piping material supporting method according to the present invention, the adhesive can be seen through the substrate to see the spread of the adhesive so that the adhesive does not protrude from the periphery of the substrate. Appropriateness of the spread of the material can be confirmed. Since the appearance of the adhesive changes due to curing, the cured state of the adhesive can be confirmed through the substrate, and the time when the wiring / piping material support can support the wiring / piping material is expected. I can.

この発明の一実施の形態の、断面図である。It is sectional drawing of one embodiment of this invention. 同じく、配線・配管材支持具の斜視図である。Similarly, it is a perspective view of a wiring and piping material support. 同じく、本体部材の正面図である。Similarly, it is a front view of a main body member. 同じく、本体部材の平面図である。Similarly, it is a top view of a main-body member. 同じく、本体部材の底面図である。Similarly, it is a bottom view of the main body member. 同じく、図４におけるＡ−Ａ線による断面図である。Similarly, it is sectional drawing by the AA in FIG. 同じく、図４におけるＢ−Ｂ線による断面図である。Similarly, it is sectional drawing by the BB line in FIG. 同じく、図４におけるＣ−Ｃ線による断面図である。Similarly, it is sectional drawing by CC line in FIG. 同じく、本体部材の斜視図である。Similarly, it is a perspective view of a body member.

以下、この発明に係る配線・配管材支持具の固定方法および配線・配管材の支持方法を実施するための形態を図面に基づいて説明する。   EMBODIMENT OF THE INVENTION Hereinafter, the form for implementing the fixing method of the wiring and piping material support which concerns on this invention, and the supporting method of wiring and piping material is demonstrated based on drawing.

図１〜図９は、本発明の一実施の形態を示す。図中符号１は、建造物（すなわち、建築物とか構築物）の、天井面等の構築面であって、例えば、二重天井における上側の天井面からなる。２は、配線・配管材であって、電力線、信号線等の配線材とか、給水管、給湯管、ガス管等の配管材からなる。３は、配線・配管材支持具であって、前記構築面１に接着固定されて、配線・配管材２を支持する、支持具である。   1 to 9 show an embodiment of the present invention. Reference numeral 1 in the figure denotes a construction surface such as a ceiling surface of a building (that is, a building or a structure), and includes, for example, an upper ceiling surface in a double ceiling. Reference numeral 2 denotes wiring / piping materials, which are composed of wiring materials such as power lines and signal lines, and piping materials such as water supply pipes, hot water supply pipes and gas pipes. Reference numeral 3 denotes a wiring / piping material support, which is bonded to the construction surface 1 and supports the wiring / piping material 2.

配線・配管材支持具３は、構築面１に接着材４により貼り付けられる基板３ａと、配線・配管材２を支持する支持部３ｂとを備える。すなわち、基板３ａは、その一方の面が、構築面１に接着される接着面３ｃとなり、他方の面となる裏面３ｄ側に、前記支持部３ｂが設けられる。そして、基板３ａは、その基板３ａの向こう側が透けて見えるように透明または半透明の材料で形成されている。   The wiring / piping material support 3 includes a substrate 3 a attached to the construction surface 1 with an adhesive 4 and a support portion 3 b that supports the wiring / piping material 2. That is, one surface of the substrate 3a is an adhesive surface 3c bonded to the construction surface 1, and the support portion 3b is provided on the back surface 3d side which is the other surface. The substrate 3a is formed of a transparent or translucent material so that the other side of the substrate 3a can be seen through.

そして、前記配線・配管材支持具３を建造物の構築面１に固定する、固定方法にあっては、始めに、基板３ａ（詳細には、後述する充填凹部３ｆ）に接着材４を塗布する。そして、基板３ａを構築面１へ押し付けるとともに、基板３ａを透かして接着材４の広がりの状態を確認する。ここで、接着材４として、硬化によって色が変わる等見え方が変わる接着材を用いた場合には、その後、基板３ａを透かして、接着材４の前記見え方の変化を見ることでその接着材４の硬化状態を確認する。さらに、この配線・配管材支持具３を用いた配線・配管材２の支持方法は、前記固定方法により配線・配管材支持具３を建造物の構築面１に固定し、その後（つまり、接着材４の硬化後）、配線・配管材支持具３の支持部３ｂで配線・配管材２を支持する。   In the fixing method of fixing the wiring / piping material support 3 to the construction surface 1 of the building, first, the adhesive 4 is applied to the substrate 3a (in detail, a filling recess 3f to be described later). To do. Then, the substrate 3a is pressed against the construction surface 1, and the spread state of the adhesive 4 is confirmed through the substrate 3a. Here, when an adhesive material that changes its appearance such as a color change due to curing is used as the adhesive material 4, the adhesive material 4 is bonded by seeing the change in the appearance of the adhesive material 4 through the substrate 3 a. The cured state of the material 4 is confirmed. Furthermore, the method of supporting the wiring / piping material 2 using the wiring / piping material support 3 fixes the wiring / piping material support 3 to the construction surface 1 of the building by the fixing method, and thereafter (that is, adhesion) After the material 4 is cured), the wiring / pipe material 2 is supported by the support portion 3b of the wiring / pipe material support 3.

具体的には、配線・配管材支持具３は、前記基板３ａを有する本体部材５と、針金、紐、帯等の線状材６とからなる。ここにおいて、本体部材５は、前記基板３ａの裏面３ｄから突出形成される取付部５ａを有する。この取付部５ａには、取付孔５ｂが明けられており、線状材６は、取付孔５ｂに通されることで取付部５ａに取り付けられる。そこで、これら取付部５ａと線状材６とで、前記支持部３ｂが構成される。そして、配線・配管材２は、線状材６によって取付部５ａに結び止められ、これにより、配線・配管材２は、支持部３ｂに支持される。   Specifically, the wiring / piping material support 3 includes a main body member 5 having the substrate 3a and a linear material 6 such as a wire, a string, and a band. Here, the main body member 5 has a mounting portion 5a formed to protrude from the back surface 3d of the substrate 3a. An attachment hole 5b is opened in the attachment portion 5a, and the wire 6 is attached to the attachment portion 5a by passing through the attachment hole 5b. Thus, the mounting portion 5a and the linear member 6 constitute the support portion 3b. Then, the wiring / pipe material 2 is tied to the mounting portion 5a by the linear material 6, whereby the wiring / pipe material 2 is supported by the support portion 3b.

本体部材５は、合成樹脂製であって、図示実施の形態においては、前記基板３ａの他に取付部５ａを含めた本体部材５全体が、透明または半透明の材料（合成樹脂材料）で一体に形成されている。基板３ａは、角部がアール状に面取りされた正方形の板状形状をしている。ここで、基板３ａは、前記接着面３ｃに、その基板３ａを構築面１へ押し付けたときの接着材４の広がりの範囲を確認すべく、押し広げられた接着材４が流入する確認用の接着材流入部を有する。   The main body member 5 is made of synthetic resin, and in the illustrated embodiment, the entire main body member 5 including the mounting portion 5a in addition to the substrate 3a is integrated with a transparent or translucent material (synthetic resin material). Is formed. The substrate 3a has a square plate shape whose corners are chamfered in a round shape. Here, the substrate 3a is used for confirming that the adhesive 4 that has been spread flows into the adhesive surface 3c in order to confirm the extent of the adhesive 4 when the substrate 3a is pressed against the construction surface 1. It has an adhesive inflow part.

詳細には、基板３ａは、その基板３ａを構築面１へ押し付けたときに接着材４が基板３ａの周縁側に広がるように、接着材４を案内する、前記接着材流入部としての溝３ｅを有する。より詳細には、基板３ａは、中央に（つまり、接着面３ｃの中央に）、接着材４が塗布される充填凹部３ｆを有し、前記溝３ｅが充填凹部３ｆから放射状に形成されている。図示実施の形態においては、充填凹部３ｆは、円形に形成され、溝３ｅ、３ｅは、充填凹部３ｆから基板３ａの周縁付近まで延びている。   Specifically, the substrate 3a guides the adhesive 4 so that the adhesive 4 spreads to the peripheral side of the substrate 3a when the substrate 3a is pressed against the construction surface 1, and the groove 3e as the adhesive inflow portion. Have More specifically, the substrate 3a has a filling recess 3f to which the adhesive 4 is applied at the center (that is, in the center of the bonding surface 3c), and the grooves 3e are formed radially from the filling recess 3f. . In the illustrated embodiment, the filling recess 3f is formed in a circular shape, and the grooves 3e and 3e extend from the filling recess 3f to the vicinity of the periphery of the substrate 3a.

また、基板３ａは、その板厚方向に貫通する、前記接着材流入部としての貫通孔３ｇを有する。この貫通孔３ｇは、複数設けられ、それら貫通孔３ｇ、３ｇは、基板３ａの中心を中心とする円上に位置する。図示実施の形態においては、貫通孔３ｇ、３ｇは、第１グループに属する複数の第１貫通孔３０１、３０１と、第２グループに属する複数の第２貫通孔３０２、３０２とに分けられ、内側から順に、第１グループの第１貫通孔３０１、３０１と、第２グループの第２貫通孔３０２、３０２とが、基板３ａの中心を中心とする同心円上に位置する。そして、これら貫通孔３ｇ、３ｇ（第１貫通孔３０１、第２貫通孔３０２）は、溝３ｅ、３ｅに設けられており、図示実施の形態においては、第１貫通孔３０１と第２貫通孔３０２とは、特に、充填凹部３ｆの周方向に並ぶ溝３ｅ、３ｅに、交互に設けられる。また、これら貫通孔３ｇ、３ｇは、一つを除いて、接着面３ｃ側が径小となり裏面３ｄ側が径大となるテーパー孔となっている。   Moreover, the board | substrate 3a has the through-hole 3g as said adhesive material inflow part penetrated in the plate | board thickness direction. A plurality of the through holes 3g are provided, and the through holes 3g and 3g are located on a circle centered on the center of the substrate 3a. In the illustrated embodiment, the through holes 3g and 3g are divided into a plurality of first through holes 301 and 301 belonging to the first group and a plurality of second through holes 302 and 302 belonging to the second group. The first through holes 301 and 301 in the first group and the second through holes 302 and 302 in the second group are located on a concentric circle with the center of the substrate 3a as the center. These through holes 3g and 3g (the first through hole 301 and the second through hole 302) are provided in the grooves 3e and 3e. In the illustrated embodiment, the first through hole 301 and the second through hole are provided. 302 is provided alternately in the grooves 3e and 3e arranged in the circumferential direction of the filling recess 3f. Further, except for one of these through-holes 3g and 3g, the through-holes 3g and 3g are tapered holes having a small diameter on the bonding surface 3c side and a large diameter on the back surface 3d side.

また、基板３ａは、その接着面３ｃに、前記充填凹部３ｆとは別に、前記接着材流入部としての凹部３ｈ、３ｈを有している。この凹部３ｈ、３ｈは、隣合う溝３ｅ、３ｅの間に設けられており、基板３ａを構築面１へ押し付けたときに、溝３ｅからはみ出した接着材４が、この凹部３ｈに流れ込む。そして、基板３ａは、その裏面３ｄに、補強のために、周縁に沿って延びる凸縁部３ｉを有している。   Moreover, the board | substrate 3a has the recessed parts 3h and 3h as the said adhesive material inflow part on the adhesion surface 3c separately from the said filling recessed part 3f. The recesses 3h and 3h are provided between the adjacent grooves 3e and 3e. When the substrate 3a is pressed against the construction surface 1, the adhesive 4 protruding from the groove 3e flows into the recess 3h. And the board | substrate 3a has the convex edge part 3i extended along a periphery on the back surface 3d for reinforcement.

次に、以上の構成からなる配線・配管材支持具３、およびその固定方法の作用効果について説明する。この配線・配管材支持具３によると、配線・配管材支持具３は、基板３ａが構築面１に接着材４により貼り付けられることで、その構築面１に固定される。ここで、基板３ａは、透明または半透明の材料で形成されて、基板３ａの向こう側が透けて見える。このため、この基板３ａを構築面１へ押し付ける際とか、この基板３ａを構築面１に接着した後に、基板３ａを透かしてその基板３ａと構築面１との間の接着材４の広がりを見ることができる。そして、このように基板３ａを透かして接着材４の広がりを見ることで、接着材４が基板３ａの周囲からはみ出していなくとも接着材４の広がりの適否（つまり、必要な接着強度を得るための接着材４の広がりの面積とか位置を満たすか否か）を、接着直後だけでなく施工後の検査においても確認することができる。そして、この必要な接着強度を得るための接着材４の広がりの面積とか位置を満たすことで、十分な接着強度に達していることが裏付けられる。図示実施の形態においては、溝３ｅが、必要な接着強度を得るための接着材４の広がりの面積とか位置の目安となるものであり、この溝３ｅを接着材４で埋めることで、十分な接着強度を得ることができる。   Next, the effect of the wiring / pipe material support 3 having the above-described configuration and its fixing method will be described. According to the wiring / piping material support 3, the wiring / piping material support 3 is fixed to the construction surface 1 by attaching the substrate 3 a to the construction surface 1 with the adhesive 4. Here, the substrate 3a is formed of a transparent or translucent material, and the other side of the substrate 3a can be seen through. For this reason, when the substrate 3a is pressed against the construction surface 1, or after the substrate 3a is bonded to the construction surface 1, the spread of the adhesive 4 between the substrate 3a and the construction surface 1 is seen through the substrate 3a. be able to. Then, by seeing the spread of the adhesive 4 through the substrate 3a in this way, even if the adhesive 4 does not protrude from the periphery of the substrate 3a, whether or not the spread of the adhesive 4 is appropriate (that is, in order to obtain a necessary adhesive strength). Whether or not the expansion area or position of the adhesive 4 is satisfied) can be confirmed not only immediately after bonding but also in inspection after construction. Then, by satisfying the area or position of the spread of the adhesive 4 for obtaining the necessary adhesive strength, it is proved that sufficient adhesive strength has been reached. In the illustrated embodiment, the groove 3e is a measure of the area or position of the adhesive material 4 for obtaining the required adhesive strength. By filling the groove 3e with the adhesive material 4, sufficient Adhesive strength can be obtained.

また、この際、接着材４が、有色であって、構築面１とは色が異なれば、前記広がりの状態を容易に確認することができる。また、広がりの状態を確認するために、接着材４を基板３ａの周囲からはみ出させる必要がないことから、接着材４を必要以上に使用することもなく、経済的である。   At this time, if the adhesive 4 is colored and has a different color from the construction surface 1, the spread state can be easily confirmed. Further, since it is not necessary to cause the adhesive 4 to protrude from the periphery of the substrate 3a in order to confirm the spread state, it is economical without using the adhesive 4 more than necessary.

また、接着材４が、硬化によって、色が変わる等見え方が変わる場合には、透明または半透明の基板３ａを透かして、接着材４の硬化状態を確認することができる。そして、このように基板３ａを透かして接着材４の硬化状態を確認することで、配線・配管材支持具３が配線・配管材２を支持可能となる時期を見計らうことができる。   Further, when the adhesive 4 changes its appearance such as color change due to curing, the cured state of the adhesive 4 can be confirmed through the transparent or translucent substrate 3a. In this way, by confirming the cured state of the adhesive 4 through the substrate 3a, it is possible to estimate the time when the wiring / piping material support 3 can support the wiring / piping material 2.

また、基板３ａが透明または半透明であることで、接着材４として紫外線硬化型接着材を用いることができ、基板３ａの裏面３ｄ側から紫外線を照射して、速やかに接着材４を硬化させることができる。   Further, since the substrate 3a is transparent or translucent, an ultraviolet curable adhesive can be used as the adhesive 4, and the adhesive 4 is quickly cured by irradiating ultraviolet rays from the back surface 3d side of the substrate 3a. be able to.

また、基板３ａは、接着材４が塗布される充填凹部３ｆを有している。したがって、この充填凹部３ｆに接着材４を所定の高さ以上となるよう塗布することで、その接着材４の必要塗布量を確保することができる。そして、この接着材４の塗布する高さを管理することで、接着材４の使用量を抑えることができる。また、この充填凹部３ｆは、基板３ａの中央に設けられており、基板３ａを構築面１へ押し付けたときに、基板３ａの中央の充填凹部３ｆに塗布された接着材４は、その中央の充填凹部３ｆから、基板３ａの周縁側に押し広げられる。特に、充填凹部３ｆは、円形形状をしており、この円形形状の充填凹部３ｆに塗布された接着材４は、その充填凹部３ｆから、基板３ａの周縁側に向かって円形に広がる。   The substrate 3a has a filling recess 3f to which the adhesive 4 is applied. Therefore, by applying the adhesive 4 to the filling recess 3f so as to have a predetermined height or more, a necessary application amount of the adhesive 4 can be ensured. And the usage-amount of the adhesive material 4 can be restrained by managing the height which this adhesive material 4 applies. The filling recess 3f is provided at the center of the substrate 3a. When the substrate 3a is pressed against the construction surface 1, the adhesive 4 applied to the filling recess 3f at the center of the substrate 3a From the filling recess 3f, it is spread out to the peripheral side of the substrate 3a. In particular, the filling recess 3f has a circular shape, and the adhesive 4 applied to the circular filling recess 3f spreads circularly from the filling recess 3f toward the peripheral side of the substrate 3a.

また、基板３ａは、構築面１への基板３ａの押し付けにより広げられた接着材４が流入する接着材流入部（詳細には、溝３ｅ、貫通孔３ｇおよび凹部３ｈ）を有している。これにより、接着材流入部への接着材４の流入を確認することで、接着材４の広がりの範囲を確認することができる。   Further, the substrate 3a has an adhesive inflow portion (specifically, a groove 3e, a through hole 3g, and a recess 3h) into which the adhesive 4 spread by pressing the substrate 3a against the construction surface 1 flows. Thereby, the range of the spreading | diffusion of the adhesive material 4 can be confirmed by confirming the inflow of the adhesive material 4 to the adhesive material inflow part.

ここで、溝３ｅにおいては、基板３ａを構築面１へ押し付けたときに、接着材４が溝３ｅ、３ｅ伝いに流れて基板３ａの周縁側に押し広げられることで、少ない量の接着材４で、その接着材４を基板３ａの周縁側に押し広げることができる。特に、溝３ｅ、３ｅは、中央の充填凹部３ｆから放射状に形成されており、基板３ａを構築面１へ押し付けたときに、基板３ａの中央の充填凹部３ｆに塗布された接着材４は、その中央の充填凹部３ｆから、放射状に形成された溝３ｅ、３ｅ伝いに流れて、効率良く基板３ａの周縁側に押し広げられる。そして、図示実施の形態においては、溝３ｅ、３ｅは、充填凹部３ｆから基板３ａの周縁付近まで延びており、少ない量の接着材４で、その接着材４を基板３ａの周辺まで行き渡らせることができる。   Here, in the groove 3e, when the substrate 3a is pressed against the construction surface 1, the adhesive 4 flows along the grooves 3e and 3e and is spread to the peripheral side of the substrate 3a, so that a small amount of the adhesive 4 is obtained. Thus, the adhesive 4 can be pushed and spread to the peripheral side of the substrate 3a. In particular, the grooves 3e, 3e are formed radially from the central filling recess 3f, and when the substrate 3a is pressed against the construction surface 1, the adhesive 4 applied to the central filling recess 3f of the substrate 3a is: From the central filling recess 3f, it flows along the radially formed grooves 3e and 3e and is efficiently spread to the peripheral side of the substrate 3a. In the illustrated embodiment, the grooves 3e and 3e extend from the filling recess 3f to the vicinity of the periphery of the substrate 3a, and the adhesive 4 is spread to the periphery of the substrate 3a with a small amount of the adhesive 4. Can do.

また、貫通孔３ｇにおいては、その貫通孔３ｇが接着材４で埋まると、基板３ａに対する接着材４の付着が強固となる。特に、貫通孔３ｇは、溝３ｅに設けられており、このため、接着材４が溝３ｅを伝って貫通孔３ｇに進入し易い。また、図示実施の形態においては、複数の貫通孔３ｇ、３ｇが、基板３ａの中心を中心とする円上に位置しており、これら貫通孔３ｇ、３ｇが接着材４で埋まったときの、基板３ａに対する接着材４の付着のバランスが良い。   Further, in the through hole 3g, when the through hole 3g is filled with the adhesive material 4, the adhesion of the adhesive material 4 to the substrate 3a becomes strong. In particular, the through hole 3g is provided in the groove 3e. Therefore, the adhesive 4 easily enters the through hole 3g through the groove 3e. In the illustrated embodiment, the plurality of through holes 3g and 3g are located on a circle centered on the center of the substrate 3a, and when these through holes 3g and 3g are filled with the adhesive 4, Good balance of adhesion of the adhesive 4 to the substrate 3a.

なお、本発明は、上述した実施の形態に限定されるわけではなく、その他種々の変更が可能である。例えば、構築面１は、天井面でなくとも、壁面等であってもよい。   In addition, this invention is not necessarily limited to embodiment mentioned above, A various other change is possible. For example, the construction surface 1 may not be a ceiling surface but a wall surface or the like.

また、基板３ａには、充填凹部３ｆとか溝３ｅとか凹部３ｈが設けられているが、これらは無くともよい。また、基板３ａは、溝３ｅに、貫通孔３ｇが設けられているが、この貫通孔３ｇは、溝３ｅとか充填凹部３ｆ等のない位置に設けられてもよい。また、この貫通孔３ｇは、テーパー孔とかストレート孔でなくとも、接着面３ｃ側が径小となり裏面３ｄ側が径大となる段付き孔であってもよい。また、この貫通孔３ｇは、無くともよい。   Further, the substrate 3a is provided with the filling recess 3f, the groove 3e, or the recess 3h, but these may not be provided. Further, in the substrate 3a, the through hole 3g is provided in the groove 3e. However, the through hole 3g may be provided in a position without the groove 3e or the filling recess 3f. Further, the through hole 3g may be a stepped hole having a small diameter on the bonding surface 3c side and a large diameter on the back surface 3d side, even if it is not a tapered hole or a straight hole. Further, the through hole 3g may be omitted.

また、溝３ｅは、放射状に形成されなくとも、渦巻き状とか格子状とか、その他の形状に形成されてもよい。   Further, the grooves 3e may not be formed in a radial shape but may be formed in a spiral shape, a lattice shape, or other shapes.

また、基板３ａには、その接着面３ｃに、接着材流入部としての溝３ｅや凹部３ｈと、充填凹部３ｆとが、別々に設けられているが、接着材流入部と充填凹部３ｆとを兼ねる窪み部が、接着面３ｃの周縁部を残して一段下がるように設けられてもよい。これにより、窪み部の中央等の適宜位置に接着材４が塗布されて、構築面１への基板３ａの押し付けにより、押し広げられた接着材４が周縁部に達することで、その接着材４の広がりの範囲を確認することができる。   Further, the substrate 3a is provided with a groove 3e or a recess 3h as an adhesive inflow portion and a filling recess 3f separately on the adhesive surface 3c. However, the adhesive inflow portion and the filling recess 3f are provided on the substrate 3a. The recessed part which serves also may be provided so that it may go down one step leaving the peripheral part of the adhesion surface 3c. As a result, the adhesive 4 is applied to an appropriate position such as the center of the recess, and the adhesive 4 that has been spread by reaching the peripheral portion by pressing the substrate 3a against the construction surface 1 causes the adhesive 4 to be spread. The extent of the spread can be confirmed.

また、基板３ａは、補強のための凸縁部３ｉを有しているが、この凸縁部３ｉは無くともよい。さらに、基板３ａに柔らかい材料を用いたり、基板３ａの厚さを薄くしたりして、基板３ａを湾曲可能に形成してもよい。このように、基板３ａが湾曲可能であると、構築面１に凹凸や段差があっても、基板３ａを構築面１に押し付けることで、基板３ａを構築面１になじむように貼り付けることができる。そして、基板３ａが透明または半透明の材料で形成されて、基板３ａの向こう側が透けて見えることから、基板３ａを構築面１に押し付けてその基板３ａを構築面１になじませる過程で、押し広げられる接着材４の広がり具合を、基板３ａを透かして確認することができ、これにより、基板３ａと構築面１との間で、接着材４を的確に行き渡らせることができる。また、ここで、基板３ａの厚さについては、全体を薄くするのではなく、支持部３ｂ（詳細には、取付部５ａ）が設けられる部分の厚さについては、周囲よりも厚くしてもよい。   Moreover, although the board | substrate 3a has the convex edge part 3i for reinforcement, this convex edge part 3i does not need to be. Furthermore, the substrate 3a may be formed to be bendable by using a soft material for the substrate 3a or by reducing the thickness of the substrate 3a. As described above, if the substrate 3a is bendable, the substrate 3a can be adhered to the construction surface 1 by pressing the substrate 3a against the construction surface 1 even if the construction surface 1 has irregularities or steps. it can. Since the substrate 3a is formed of a transparent or translucent material and the other side of the substrate 3a can be seen through, in the process of pressing the substrate 3a against the construction surface 1 and allowing the substrate 3a to conform to the construction surface 1, The spread degree of the adhesive material 4 to be spread can be confirmed through the substrate 3a, whereby the adhesive material 4 can be accurately distributed between the substrate 3a and the construction surface 1. Here, the thickness of the substrate 3a is not reduced as a whole, but the thickness of the portion where the support portion 3b (specifically, the attachment portion 5a) is provided may be thicker than the surroundings. Good.

また、基板３ａは、例えば、円形、楕円形、正方形以外の多角形など、正方形以外の形状をしていても構わない。   The substrate 3a may have a shape other than a square, such as a circle, an ellipse, or a polygon other than a square.

また、支持部３ｂは、取付部５ａと線状材６とで構成されなくとも、例えば合成樹脂成形により基板３ａと一体に形成される、フックとかリング等からなっていてもよい。   Further, the support portion 3b may be formed of a hook, a ring, or the like formed integrally with the substrate 3a by, for example, synthetic resin molding, without being configured by the attachment portion 5a and the linear material 6.

１ 構築面
２ 配線・配管材
３ 配線・配管材支持具
３ａ 基板
３ｂ 支持部
３ｅ 溝（接着材流入部）
３ｆ 充填凹部
３ｇ 貫通孔（接着材流入部）
３ｈ 凹部（接着材流入部）
４ 接着材 DESCRIPTION OF SYMBOLS 1 Construction surface 2 Wiring and piping material 3 Wiring and piping material support 3a Substrate 3b Support part 3e Groove (adhesive material inflow part)
3f Filling recess 3g Through hole (adhesive material inflow part)
3h Concave part (adhesive material inflow part)
4 Adhesive

Claims (2)

建造物の構築面に配線・配管材支持具を固定する、固定方法であって、
前記配線・配管材支持具は、前記構築面に接着固定されて、配線・配管材を支持する支持具であって、前記構築面に接着材により貼り付けられる基板と、前記配線・配管材を支持する支持部とを備え、前記基板は、全体が、その基板の向こう側が透けて見えるように透明または半透明の材料で形成されてなり、
前記固定方法は、
前記配線・配管材を支持する前の前記配線・配管材支持具において、前記基板に、硬化によって見え方が変わる接着材を塗布し、
前記基板を前記構築面へ押し付けるとともに、前記基板を透かして前記接着材の広がりの状態を確認し、その後、
前記基板を透かして、前記接着材の前記見え方の変化を見ることでその接着材の硬化状態を確認することを特徴とする、配線・配管材支持具の固定方法。 A fixing method for fixing a wiring / piping material support to a construction surface of a building,
The wiring / piping material support is a support that is bonded and fixed to the construction surface to support the wiring / piping material, and includes a substrate attached to the construction surface with an adhesive, and the wiring / piping material. and a support portion for supporting the substrate is entirely made are formed of a transparent or translucent material so as to show through the other side of the substrate,
The fixing method is as follows:
In the wiring / piping material support before supporting the wiring / piping material, an adhesive that changes its appearance by curing is applied to the substrate,
While pressing the substrate against the construction surface, confirm the state of spread of the adhesive through the substrate,
A method of fixing a wiring / piping material support, wherein the cured state of the adhesive is confirmed by seeing the change in the appearance of the adhesive through the substrate. 請求項１に記載の配線・配管材支持具の固定方法により、建造物の構築面に配線・配管材支持具を固定し、前記接着材の硬化によりその接着材の見え方が変化した後、前記配線・配管材支持具の支持部で、配線・配管材を支持することを特徴とする、配線・配管材の支持方法。   After fixing the wiring / piping material support to the construction surface of the building by the fixing method of the wiring / piping material supporting device according to claim 1, the appearance of the adhesive is changed by curing the adhesive, A method for supporting a wiring / piping material, wherein the wiring / piping material is supported by a support portion of the wiring / piping material support.
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