JP5570527B2 - 回路試験装置及びそれを実施する方法 - Google Patents

回路試験装置及びそれを実施する方法 Download PDF

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Publication number
JP5570527B2
JP5570527B2 JP2011541553A JP2011541553A JP5570527B2 JP 5570527 B2 JP5570527 B2 JP 5570527B2 JP 2011541553 A JP2011541553 A JP 2011541553A JP 2011541553 A JP2011541553 A JP 2011541553A JP 5570527 B2 JP5570527 B2 JP 5570527B2
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JP
Japan
Prior art keywords
electrical resistance
processing circuit
circuit
peak
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011541553A
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English (en)
Japanese (ja)
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JP2012512411A (ja
Inventor
モロー，カテル
グリュ，マルク
Original Assignee
ヨーロピアン・アエロノーティック・ディフェンス・アンド・スペース・カンパニー・イーデス・フランス
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Application filed by ヨーロピアン・アエロノーティック・ディフェンス・アンド・スペース・カンパニー・イーデス・フランス filed Critical ヨーロピアン・アエロノーティック・ディフェンス・アンド・スペース・カンパニー・イーデス・フランス
Publication of JP2012512411A publication Critical patent/JP2012512411A/ja
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Publication of JP5570527B2 publication Critical patent/JP5570527B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/70—Testing of connections between components and printed circuit boards
    • G01R31/71—Testing of solder joints

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2011541553A 2008-12-17 2009-12-15 回路試験装置及びそれを実施する方法 Expired - Fee Related JP5570527B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0858735A FR2939925B1 (fr) 2008-12-17 2008-12-17 Dispositif de test d'un circuit et procede de mise en oeuvre
FR0858735 2008-12-17
PCT/FR2009/052538 WO2010076482A1 (fr) 2008-12-17 2009-12-15 Dispositif de test d'un circuit et procede de mise en oeuvre

Publications (2)

Publication Number Publication Date
JP2012512411A JP2012512411A (ja) 2012-05-31
JP5570527B2 true JP5570527B2 (ja) 2014-08-13

Family

ID=41066508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011541553A Expired - Fee Related JP5570527B2 (ja) 2008-12-17 2009-12-15 回路試験装置及びそれを実施する方法

Country Status (7)

Country Link
US (1) US8901952B2 (fr)
EP (1) EP2359153B1 (fr)
JP (1) JP5570527B2 (fr)
ES (1) ES2436533T3 (fr)
FR (1) FR2939925B1 (fr)
IL (1) IL213535A (fr)
WO (1) WO2010076482A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101262950B1 (ko) * 2012-12-20 2013-05-09 (주)온테스트 전자기기의 접촉부 균열 검출 장치 및 방법
GB2528630A (en) * 2014-04-28 2016-02-03 Univ Central Lancashire Computer based system and method of functionally testing aircraft subsystems
CN104891100B (zh) * 2015-05-12 2017-03-29 广元欣源设备制造有限公司 阻抗检测输送机
CN110473797B (zh) * 2019-07-08 2021-12-17 深圳市晶凯电子技术有限公司 半导体集成电路装置的检查系统及方法
US11493549B2 (en) * 2020-06-16 2022-11-08 Hewlett Packard Enterprise Development Lp System and method for performing loopback test on PCIe interface

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3181208B2 (ja) * 1995-09-20 2001-07-03 トヨタ自動車株式会社 抵抗接合電極の劣化状態検出装置
JP4089034B2 (ja) * 1998-09-28 2008-05-21 ソニー株式会社 ねじり試験機
US6750899B1 (en) * 2000-01-07 2004-06-15 Cyberoptics Corporation Solder paste inspection system
US6564986B1 (en) * 2001-03-08 2003-05-20 Xilinx, Inc. Method and assembly for testing solder joint fractures between integrated circuit package and printed circuit board
US6614253B2 (en) * 2001-08-03 2003-09-02 Northrop Grumman Corporation On-circuit board continuity tester
US6847900B2 (en) * 2001-12-17 2005-01-25 Agilent Technologies, Inc. System and method for identifying solder joint defects
US7492449B2 (en) * 2004-04-12 2009-02-17 Georgia Tech Research Corporation Inspection systems and methods
JP4831670B2 (ja) * 2006-02-24 2011-12-07 富士通株式会社 試料抵抗測定装置
JP5034781B2 (ja) * 2007-08-27 2012-09-26 富士通株式会社 半田バンプの高感度抵抗測定装置及び監視方法

Also Published As

Publication number Publication date
JP2012512411A (ja) 2012-05-31
WO2010076482A1 (fr) 2010-07-08
ES2436533T3 (es) 2014-01-02
US20120025864A1 (en) 2012-02-02
EP2359153B1 (fr) 2013-10-16
FR2939925A1 (fr) 2010-06-18
EP2359153A1 (fr) 2011-08-24
FR2939925B1 (fr) 2011-01-14
IL213535A0 (en) 2011-07-31
IL213535A (en) 2016-03-31
US8901952B2 (en) 2014-12-02

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