JP5563440B2 - Resin lens, LED device with lens, and manufacturing method of LED device with lens - Google Patents

Description

  The present invention relates to a resin lens for providing a condensing mechanism to an LED device, an LED device with a lens including the lens, and a method for manufacturing the LED device with a lens.

  In recent years, the use of LED devices, which are light emitting devices using light emitting diodes (LEDs), has been expanding. Specifically, for example, it is used in general indoor lighting fixtures, spotlights such as interior lights, backlights of flat-screen televisions and information terminal devices, automobile tail lamps, and the like.

  The light emitted from the LED has straightness, but is somewhat dispersed in other directions. The directivity required for light emission of the LED device differs depending on the application. For example, in applications such as general indoor lighting fixtures, spotlights, and automobile tail lamps, it is required to illuminate a relatively narrow range more brightly, so a narrow directivity angle is required. On the other hand, a wide directivity angle is required for use in backlights of flat-screen televisions and information terminal devices.

  A general LED device includes a sealing body made of a transparent resin for protecting the LED chip from outside air and mechanical shock. As a means for condensing or diffusing light emitted from an LED chip, an optical lens mechanism in which the shape of a sealing body that seals the LED chip is formed into a lens shape is known (for example, Patent Document 1). However, in the industrial production of LED devices, there has been a problem that it is difficult in terms of cost to mold the shape of the sealing body into a lens shape according to the application. As a method for solving such a problem, a sealing body is obtained by placing a pre-formed lens on the surface of an uncured sealing resin for sealing an LED chip, and then curing the sealing resin. A method for integrating the lens and the lens is also known (see, for example, Patent Document 2). A method is also known in which a primer layer having adhesiveness is formed on a resin layer for sealing an LED element, and a lens is adhered by the primer layer (see, for example, Patent Document 3).

  By the way, as a sealing body of the LED device, an epoxy resin or a silicone resin is widely used. The epoxy resin has a problem of yellowing when receiving heat. In particular, in recent years, yellowing of the sealing body has often become a practical problem due to the high output of LED devices and continuous use for a long time. When yellowing occurs in the sealing body, there is a problem that the light extraction rate decreases. In order to solve such a problem, a sealing body made of a silicone resin has begun to be used. Since a sealing body made of a silicone resin is excellent in heat resistance, it is difficult to yellow even when used for a long time in a high-power LED device. However, since the silicone resin has higher gas permeability than the epoxy resin, it causes the following problems.

  On the surface of the substrate on which the LED chip of the LED device is mounted, a silver plating layer is usually formed as a reflective layer. When a sealing body made of silicone resin is used, the gas barrier property is low, so that a corrosive gas such as nitrogen oxide or sulfur oxide permeates and contacts the silver plating layer, so that the silver plating layer becomes black. Discoloration and light extraction efficiency decreases. In addition, there is a problem in that the electrode or the like is deteriorated by contacting the corrosive gas or moisture that has passed through the sealing body with the electrode or the like. As a technique for solving such a problem, Patent Document 4 below discloses a method in which a film having excellent gas barrier properties is bonded to the surface of a sealing body at the time of manufacturing an LED device and cured.

Japanese Patent Laid-Open No. 2006-203201 JP 2010-110894 A JP 2010-206206 A JP 2000-174347 A

  Conventionally, an epoxy resin lens has been widely used as a lens member provided on a light emitting surface of an LED device. When an epoxy resin lens is bonded to an LED device using a silicone resin as a sealing body, gas passes through the sealing body so that the epoxy resin lens having a relatively high gas barrier property covers the sealing body made of silicone resin. Was suppressed. For this reason, the blackening of the silver plating layer of the LED device is difficult to occur. However, in a high-power LED device equipped with an epoxy resin lens, there is a problem in that the light extraction efficiency is lowered due to yellowing of the epoxy resin lens due to heat generated when the LED device emits light when used for a long period of time. .

  Therefore, an attempt was made to adhere a silicone lens to an LED device using a silicone resin as a sealing body. However, since the silicone lens has a low gas barrier property, it cannot exhibit a gas barrier effect like an epoxy resin lens. However, the blackening of the silver plating layer of the LED device due to the permeation of the gas through the sealing body made of silicone resin is not suppressed.

  Moreover, as disclosed in the cited document 4, according to the method of bonding and curing a film having excellent gas barrier properties on the surface of the sealing body at the time of manufacturing the LED device, the gas inside the sealing body is surely Permeation seems to be suppressed by the film on the surface of the encapsulant. However, the general-purpose LED device has an outer dimension of about several millimeters, and it seems that it is poor in industrial productivity to attach a thin film to the surface of such a small device.

  This invention makes it a subject to provide the resin lens which can suppress the fall of the light quantity of a LED apparatus with a lens by adhere | attaching with respect to the sealing body of an LED apparatus in order to solve the problem mentioned above.

One aspect of the present invention is a resin lens that is bonded to a transparent resin sealing body of an LED device including a transparent resin sealing body that seals LED elements, and is bonded to the lens portion and the transparent resin sealing body. that a lens body comprising a silicone resin molded article having an adherend surface, and a gas barrier layer formed on the bonded surface, has high gas barrier properties than silicone resin gas barrier layer to form a lens body, silicone resin , epoxy resins and silicone modified resins, silicone-modified resins of the acrylic resin, at least one transparent resin layer and the glass layer is selected from urethane resins and silicone modified resins, and this comprises at least one layer selected from This is a resin lens. Such a resin lens is not easily yellowed even when used for a long period of time in a high-power LED device, and can provide a gas barrier property to the sealing body of the LED device simply by bonding the lens.

The gas barrier layer, TogaYoshimi Masui child containing glass layer. The glass layer has a particularly high gas barrier effect on the sealing body.

As another example of the gas barrier layer, a transparent resin layer having high gas barrier properties than silicone resin forming the lens body, especially, the adhesive or tacky transparent adhesive layer is a transparent resin layer having a Is preferable from the viewpoint that the resin lens can be bonded to the surface of the cured transparent resin sealing body without applying an adhesive.

  Moreover, it is preferable that the center part of the adherend surface is raised. In the case where the central portion of the adherend surface is raised, when it is bonded to the sealing body of the LED device, it is difficult for air to be involved and it is difficult to leave a void at the interface.

  Moreover, it is preferable that the surface to be bonded is subjected to a surface modification treatment from the viewpoint of improving the adhesiveness with the gas barrier layer. Examples of the surface modification treatment include plasma treatment, corona treatment, UV treatment, itro treatment, and primer treatment.

  Another aspect of the present invention is a resin lens that is bonded to a transparent resin sealing body of an LED device including a transparent resin sealing body that seals an LED element, the lens portion and the transparent resin sealing. A resin lens comprising a lens body made of an epoxy resin molded body having an adherend surface to be bonded to a body, and a silicone resin layer formed on the adherend surface. According to such a resin lens, since the silicone resin layer having high heat resistance is interposed between the sealing body and the epoxy resin lens, discoloration due to heat generation of the light emitting element of the epoxy resin lens can be suppressed.

  Another aspect of the present invention is a lens array including a plurality of resin lenses arranged in a planar shape. By using such a lens array, a lens structure can be imparted to a plurality of LED devices at a time.

  Another aspect of the present invention includes an LED device including a transparent resin sealing body that seals an LED element, and any of the resin lenses bonded to the transparent resin sealing body. It is the LED device with a lens characterized by these.

  Another aspect of the present invention is a method for manufacturing a lens-equipped LED device including a step of adhering the lens array to a plurality of LED devices arranged on a substrate. By using such a manufacturing method, a lens structure can be imparted to a plurality of LED devices at a time, so that the mass productivity of the LED device with a lens is improved. In addition, in such a manufacturing method, it is possible to efficiently produce a large number of LED devices with a lens by further comprising a step of cutting and individualizing the plurality of LED devices with lenses formed by bonding. To preferred.

  Moreover, it is a manufacturing method of the LED device with a lens formed by forming a 1 or more LED apparatus in a circuit board, and attaching a silicone lens later. Along with recent chip-on-board (COB) manufacturing methods, LED devices are pre-arranged on the circuit board, and according to the light distribution characteristics, a method of selecting a lens and bonding it later is required. According to the lens of the present invention, more efficient production can be achieved. If this invention is used, the lens according to a use can be adhere | attached firmly.

  ADVANTAGE OF THE INVENTION According to this invention, the resin lens which can suppress the fall of the light quantity of a LED apparatus with a lens can be provided by adhere | attaching a lens with respect to the sealing body of an LED apparatus.

The cross-sectional schematic diagram of the LED device 20 with a lens of this embodiment is shown. The perspective schematic diagram of the silicone lens 11 is shown. The cross-sectional schematic diagram of the silicone lens 21 which the center part of the to-be-adhered surface protrudes is shown. It is explanatory drawing explaining an example of the method of adhere | attaching the silicone lens 11 on the LED apparatus 10. FIG. It is explanatory drawing explaining a mode that the large sized silicone lens 61 was adhere | attached on the LED device. It is explanatory drawing explaining an example of the method of adhere | attaching the silicone lens 11 on the LED apparatus 10. FIG. It is explanatory drawing explaining an example of the method of adhere | attaching the silicone lens 11 on the LED apparatus 10. FIG. It is explanatory drawing explaining an example of the method of adhere | attaching the silicone lens 11 on the LED apparatus 10. FIG. It is a perspective schematic diagram explaining the method to adhere | attach the lens array 30 and the LED array 40. FIG. It is a perspective schematic diagram explaining the method to cut | disconnect the board | substrate provided with several LED with a lens. It is a schematic cross section explaining a manufacturing method of a plurality of LED devices with a lens. The cross-sectional schematic diagram of the LED device 120 with a lens of this embodiment is shown. The perspective schematic diagram of the epoxy resin lens 111 is shown.

[First Embodiment]
The lens-equipped LED device 20 including the silicone lens 11 of the present embodiment will be described in detail.

  FIG. 1 is a schematic cross-sectional view of a lens-equipped LED device 20 including a silicone lens 11. In FIG. 1, reference numeral 10 denotes a surface mount type LED device.

  The LED device 10 includes a light emitter housing member 3 having a recess having an upper surface opened. An inner surface reflection film 8 is formed on the surface of the recess in order to increase the extraction efficiency of light emitted from the LED element 1. Specific examples of the internal reflection film 8 include a silver thin film formed by plating or vapor deposition. A pair of leads 5 a and 5 b extend from the bottom of the recess to the outside of the light emitter housing member 3. One electrode of the LED element 1 is die-bonded to the lead 5b on the bottom surface of the recess, and the other electrode is wire-bonded to the lead 5a with a gold wire 5c. And the recessed part which accommodates LED element 1 is sealed with the transparent resin sealing body 2 which is the hardened | cured material of the sealing agent which consists of a silicone resin etc. which were potted in the recessed part using dispensers etc. And the silicone lens 11 is adhere | attached on the surface of the transparent resin sealing body 2. FIG.

  As shown in FIG. 2, the silicone lens 11 includes a silicone lens body including a lens portion 11a and an adherend surface 11b, and a gas barrier layer 11c formed on the adherend surface 11b. The lens unit 11a has a lens shape that is optically designed according to the application. The silicone lens body has a high light transmittance, and the silicone resin is preferably 90% or more, more preferably 92% or more. Moreover, since it is formed from a silicone resin, it has high heat resistance and is not easily discolored by heat generated from the LED element 1.

  The shape of the lens portion 11a of the silicone lens 11 is molded into an optically designed shape according to the application. Specifically, a shape is selected that changes the optical path when transmitting incident light such as light collection, diffusion, refraction, or reflection. Examples of such lens shapes include convex lenses, concave lenses, cylindrical lenses, and Fresnel lenses.

  A gas barrier layer 11c, which is a layer having a higher gas barrier property than the silicone resin forming the lens body, is formed on the adherend surface 11b of the silicone lens 11. Details of the gas barrier layer will be described later.

  The shape of the adherend surface 11b of the silicone lens 11 is not limited to a flat surface. For example, even if it is a concave shape along the dome shape of the sealing body of the LED device formed into a dome shape, the center as shown in FIG. A convex shape with raised portions may be used. Moreover, the concave shape in which the center part was depressed may be sufficient. A gas barrier layer 21c is formed on the convex adherend surface of the silicone lens 21 in which the central portion of the adherend surface is raised. When such a silicone lens 21 is used, it becomes difficult to entrain air when it is bonded to an adhesive or a sealant. As for the height of the bulge, for example, it is preferable that the central portion is gently bulged about 1 to 10% with respect to the lens diameter as compared with a flat adherend surface. The depth of the dent may be a shape that matches the shape of the LED device sealing body. For example, if the surface shape of a hemispherical sealing body having a diameter of 3 mm, the dent has a slightly larger dent. That's fine.

  Next, a method for manufacturing a silicone lens will be described in detail. A silicone lens is obtained by forming a gas barrier layer on the adherend surface of a silicone lens body obtained by molding a silicone resin.

  The silicone lens body is molded by a known method used for molding a silicone resin, specifically, cast molding, compression molding, injection molding, or the like. Cast molding using a liquid addition reaction curable silicone resin composition is particularly preferred from the viewpoint that precise molding is possible at low temperatures.

  The silicone resin for molding the silicone lens body is not particularly limited as long as it is a silicone resin excellent in light transmittance, and may be a silicone rubber or a silicone elastomer in addition to a hard silicone resin.

  The addition reaction curable silicone resin composition is not particularly limited as long as it is an uncured silicone resin composition that forms a transparent silicone resin by curing. Specifically, for example, a composition comprising an organopolysiloxane as a base polymer and containing a heavy metal catalyst such as an organohydrogenpolysiloxane and a platinum catalyst.

Specific examples of the organopolysiloxane include, for example, the following general formula (1):
R _a SiO _{(4-a) / 2} (1)
(In the formula, R is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, which may be the same or different, and a is a positive number of 0.8 to 2.) The thing shown by is mentioned.

  Specific examples of R which is an unsubstituted or substituted monovalent hydrocarbon group include alkyl groups such as methyl group, ethyl group, propyl group and butyl group; alkenyl groups such as vinyl group, allyl group and butenyl group; phenyl group, Aryl groups such as tolyl groups; aralkyl groups such as benzyl groups; chloromethyl groups, chloropropyl groups, 3,3,3-trialkyls in which some or all of the hydrogen atoms bonded to these carbon atoms are substituted with halogen atoms A halogen-substituted hydrocarbon group such as a fluoropropyl group; or a cyano group-substituted hydrocarbon group such as a 2-cyanoethyl group substituted with a cyano group; Among these, those in which 5 to 80 mol% of all R are phenyl groups are particularly preferable from the viewpoint of excellent heat resistance and transparency of the optical lens.

  Further, those containing an alkenyl group such as a vinyl group as R, particularly those in which 1 to 20 mol% of all R are alkenyl groups are preferred, and those having two or more alkenyl groups in one molecule are preferably used. It is done. Examples of such an organopolysiloxane include terminal alkenyl group-containing diorganopolysiloxanes such as dimethylpolysiloxane having a terminal alkenyl group such as vinyl group and dimethylsiloxane / methylphenylsiloxane copolymer, particularly at room temperature. A liquid one is preferably used.

  Specific examples of the organohydrogenpolysiloxane include methylhydrogenpolysiloxane and methylphenylhydrogenpolysiloxane. Examples of the catalyst include platinum, platinum compounds, organometallic compounds such as dibutyltin diacetate and dibutyltin dilaurate, and metal fatty acid salts such as tin octenoate. The types and amounts of these organohydrogenpolysiloxanes and catalysts are appropriately selected in consideration of the degree of crosslinking and the curing rate.

  Examples of commercially available silicone resin compositions include “KJR632” manufactured by Shin-Etsu Chemical Co., Ltd.

  In addition, the silicone resin composition is a range that does not impair the effects of the present invention, and if necessary, by converting the wavelength of light emitted from the LED element, a phosphor for converting the emission color, and light. A light diffusing agent for diffusing may be included. Further, a phosphor layer, a color filter layer, or a light diffusion layer may be further provided inside or on the surface of the silicone lens 11. Further, when the silicone lens 11 is a lens provided with a buffer layer such as silicone gel or silicone elastomer on the surface to be bonded, the internal stress due to the difference in thermal expansion between the sealing body of the LED device and the silicone lens 11 is relieved. This is preferable.

Specific examples of the phosphor blended in the silicone resin composition as necessary include, for example, (Ca, Sr, Ba) ₅ (PO ₄ ) ₃ Cl: Eu ²⁺ , ZnS: Ag whose emission color is blue. BaMg ₂ Al ₁₆ O ₂₇ : Eu ²⁺ , Mn ²⁺ , ZnS: Cu, Al, Au, SrAl ₂ O ₄ : Eu ²⁺ , Zn ₂ Si (Ge) O whose emission color is green, such as CaS: Bi ₄ : Y ₂ O ₂ S, which emits red, such as Eu ²⁺ S: Eu ³⁺ , 3.5 MgO · 0.5 MgF ₂ · GeO ₂ : Mn, LiEuW ₂ O ₈ , BaO · Gd ₂ O ₃ · Ta ₂ O ₅ : Mn, K ₅ Eu _2.5 (WO ₄ ) _{6.25 and the} like.

  Specific examples of the light diffusing agent include glass powder and inorganic fillers such as calcium carbonate, titanium oxide, and zinc oxide.

  Next, the gas barrier layer 11c formed on the adherend surface 11b of the silicone lens body will be described in detail.

  The gas barrier layer can be selected without any limitation as long as it is a layer formed of a material having a higher gas barrier property than the silicone resin forming the silicone lens body. Specific examples of such a layer include a vapor-deposited film containing a transparent inorganic compound, a glass layer, and a transparent resin layer having a gas barrier property higher than that of the silicone resin forming the silicone lens body.

  Specific examples of the deposited film include a deposited film containing a transparent inorganic compound such as silicon oxide, titanium oxide, aluminum oxide, or magnesium fluoride having high gas barrier properties.

  A vapor deposition film is formed in the to-be-adhered surface of a silicone lens using the well-known vapor-phase thin film formation method. During vapor deposition, the vapor deposition film can be formed only on the adherend surface of the silicone lens by masking and vapor deposition the other surface so that only the adherend surface of the silicone lens is exposed. In addition, if it is the thickness of the range which does not inhibit the effect of this invention, a vapor deposition film may be formed also in a lens part. The film thickness of such a deposited film is preferably about several nm to several hundred nm. When the thickness of the deposited film is too thick, the light transmittance tends to decrease or cause large irregular reflection. Moreover, when the film thickness of a vapor deposition film is too thin, there exists a tendency for gas barrier property not to fully improve.

  Specific examples of the glass layer include, for example, a glass layer formed by a glass thin film forming method using a sol-gel method capable of forming a glass film at a low temperature, an ultrathin plate glass (manufactured by Matsunami Glass Industrial Co., Ltd.), and the like. Used.

Examples of the glass composition formed by the sol-gel method include a composition obtained by mixing SiO ₂ or SiO ₂ with PBO, ZnO, _{Al 2} O ₃ or the like. The film thickness of the glass thin film obtained using such a sol-gel method is preferably about 0.1 to 500 μm, more preferably about 10 to 200 μm.

  Moreover, as a film thickness of ultra-thin plate glass, it is preferable that it is about 10-500 micrometers, Furthermore, about 50-300 micrometers.

  Specific examples of the transparent resin layer include a transparent resin layer made of a silicone resin, an epoxy resin, an acrylic resin, a urethane resin, or the like having a higher gas barrier property than the silicone resin forming the lens body. In these, an epoxy resin is preferable from the point which is excellent in the balance of gas-barrier property and adhesiveness.

  Further, as the transparent resin layer, a transparent adhesive layer having an adhesive action composed of a silicone resin, an epoxy resin, an acrylic resin, a urethane resin, and these silicone-modified resins, specifically, for example, uncured When a transparent adhesive layer, a semi-cured transparent adhesive layer, an adhesive silicone resin layer, or the like is provided, the silicone lens is firmly adhered to the surface of the cured sealing body 2 of the LED device 10 without applying an adhesive. This is preferable from the viewpoint of labor saving in the manufacturing process. The transparent adhesive layer is a pressure-sensitive adhesive layer or adhesive layer formed from epoxy resin, acrylic resin, urethane resin and these silicone-modified resins, or a pressure-sensitive adhesive formed from silicone gel, silicone rubber, or silicone elastomer. For example, a functional silicone resin layer. In addition, since the adhesive silicone resin layer is excellent in stress relaxation properties, it is preferable from the viewpoint that the effect of suppressing delamination is relieved by reducing internal stress due to the difference in linear expansion coefficient between the sealing body and the silicone lens material. . Moreover, the silicone resin-based transparent adhesive layer is excellent in heat resistance, and the acrylic, urethane, and epoxy-based transparent adhesive layers are excellent in adhesive strength.

  Although it can select suitably according to a use as thickness of a transparent resin layer, it is preferable that it is the range of 3-2000 micrometers, and also 20-500 micrometers. If the thickness of the transparent resin layer is too thin, it will not be able to follow the unevenness of the sealing resin and sufficient adhesion will not be achieved, and productivity will tend to decrease.If it is too thick, the light distribution characteristics will tend to be impaired. is there.

  Moreover, when the transparent resin layer formed in the to-be-adhered surface is a transparent adhesive layer, it is preferable that the release sheet is bonded on the surface. By sticking the release sheet to the surface of such a transparent adhesive layer such as an uncured transparent adhesive layer or an adhesive silicone layer, handling properties such as storage and transfer of the silicone lens are improved. In addition, when manufacturing an LED device with a lens, a transparent adhesive layer or an adhesive silicone layer that is exposed by peeling off the release paper without applying an adhesive to the surface of the cured transparent resin encapsulant. It is preferable from the point that the silicone lens can be fixed to the surface of the transparent resin sealing body by pressing and bonding the pressure-sensitive adhesive layer to the surface of the sealing body. Further, particularly preferably, a double-sided pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer such as an uncured transparent resin or adhesive silicone whose one surface is covered with a release paper is particularly preferably bonded to the surface to be bonded of the silicone lens. . Forming a transparent resin layer on the adherend surface using a double-sided adhesive tape is excellent in productivity, and the transparent resin layer is exposed by peeling off the release paper. It becomes easy to adhere to the surface.

  When forming the gas barrier layer as described above, it is preferable to subject the adherend surface of the lens body to a surface modification treatment. Here, the surface modification treatment is a treatment for activating the surface of the adherend surface. Specifically, for example, plasma treatment, corona treatment, UV treatment, flame treatment, itro treatment, primer treatment, etc. In addition, this is a process for improving the adhesion to the gas barrier layer by generating a polar group on the surface of the adherend surface. By applying such a surface modification treatment to the adherend surface on which the gas barrier layer is formed, the adhesive force between the adherend surface and the gas barrier layer is improved.

  The surface modification method by plasma treatment, corona treatment, UV treatment, flame treatment, or intro treatment can be performed by using a conventionally known plasma treatment device, corona treatment device, UV treatment device, frame treatment device, intro treatment device, etc. The processing method used is not particularly limited.

  Moreover, as a primer agent used for a primer process, the process liquid containing a silane coupling agent or its partial hydrolysis-condensation product etc. is mentioned. Specific examples of the silane coupling agent include, for example, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltriacetoxysilane, γ-aminopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycidoxy. Propyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ- (3,4-epoxycyclohexyl) ethyltriethoxysilane, γ- (meth) acryloxypropyltrimethoxysilane, phenyltrimethoxy Silane, phenyltriacetoxysilane, γ-mercaptopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, β-cyanoethyltriethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, methyltripro Kishishiran, methyl tributoxy silane, ethyl trimethoxy silane, ethyl triethoxy silane, tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetrabutoxysilane and the like.

  As the surface modification treatment, it is particularly preferable to perform primer treatment after plasma treatment, corona treatment, UV treatment, flame treatment, or intro treatment. Specifically, it is preferable that the primer treatment liquid is thinly applied to the surface to be bonded that has been subjected to plasma treatment, corona treatment, UV treatment, flame treatment, or ittro treatment, and then dried in an atmosphere of room temperature to 170 ° C.

  In addition, it is preferable that the surface to be bonded that has been subjected to the above-described plasma treatment, corona treatment, UV treatment, frame treatment, or ittro treatment has a contact angle with respect to water of 90 degrees or less, and the lower limit for efficiency. Is preferably in the range of 1 to 90 degrees, more preferably 1 to 50 degrees. When the contact angle of the adherend surface with respect to water is in such a range, the wettability with the adhesive or the sealant is improved, thereby improving the adhesion with the sealing body. In addition, the to-be-adhered surface before a surface modification process is about 100 to 120 degree | times normally. It is preferable that the contact angle with respect to water of the adherend surface is reduced by about 1 to 90 degrees by the surface treatment. When the surface treatment is a primer treatment, the contact angle with respect to water is larger than 90 degrees, and for example 100 to 120, sufficient adhesive strength is obtained. Such a contact angle is measured according to JIS K3257 “Test method for wet glass substrate surface”.

  Next, a method for bonding the above-described silicone lens to the LED device will be described. As a specific example of the method of adhering the silicone lens to the LED device, for example, (I) When manufacturing the surface-mount type LED device, after the silicone lens is placed on the sealant before curing, the sealant is cured. (II) a method of adhering a silicone lens to the surface of a cured encapsulant of a surface-mounted LED device via an adhesive, and (III) a surface. Method of adhering to the surface of the cured encapsulant of the mountable LED device using a transparent adhesive layer, (IV) Adhering to the surface of the cured encapsulant of the surface mounted LED device using a transparent adhesive layer Methods and the like.

  FIG. 4 is a diagram schematically illustrating the method (I). As shown in FIG. 4, the surface of the gas barrier layer 11 c formed on the adherend surface of the silicone lens 11 on the surface of the uncured sealant 2 a potted in the concave portion of the light emitter housing member 3 when the LED device 10 is manufactured. The sealant is cured by heating or light irradiation. According to such a method, since the silicone lens can be bonded and integrated when the LED device 10 is manufactured, it is preferable from the viewpoint that the lens is easily bonded. However, such a method also causes the following problems. In the industrial production of LED devices, the pitch interval between adjacent LED devices on the support substrate is narrowed in order to increase the number of multi-chips. Since the pitch interval between adjacent LED devices on the support substrate is thus narrow, in industrial production, for example, as shown in FIG. 5, a large silicone lens 61 that greatly changes the directivity is used as the LED device. It was difficult to give to. In order to bond the large silicone lens 61, it is necessary to widen the pitch interval of the LED device. In such a case, there is a problem that it is disadvantageous for mass productivity.

  FIG. 6 is a diagram schematically illustrating the method (II). As shown in FIG. 6, the adhesive 14 is applied to the surface of the cured encapsulant 2 of the LED device 10, and the encapsulant 2 and the gas barrier layer 11 c formed on the adherend surface of the silicone lens 11 are adhered to each other. After the contact is made through 14, the adhesive 14 is cured. According to such a method, since a silicone lens can be bonded to an individual LED device, a large lens 61 as shown in FIG.

  FIG. 7 is a diagram schematically illustrating the method (III). As shown in FIG. 7, an uncured resin layer 21c, which is also a gas barrier layer formed on the adherend surface of the silicone lens 11, is brought into close contact with the surface of the cured sealing body 2 of the LED device 10, and then cured. . According to such a method, since it is not necessary to apply an adhesive to the surface of the sealing body when the lens is bonded, it is preferable because the manufacturing process can be largely omitted.

  FIG. 8 is a diagram schematically illustrating the method (IV). As shown in FIG. 8, an adhesive silicone layer 31c, which is also a gas barrier layer formed on the adherend surface of the silicone lens 11, is adhered to the surface of the cured encapsulant 2 of the LED device 10 so as to adhere to the adhesive force or between molecules. Adhere between solids by adsorption force. According to such a method, it is not necessary to harden the interface when the lens is bonded, which is preferable because the manufacturing process can be largely omitted.

  According to the silicone lens in which the gas barrier layer is formed on the adherend surface to be bonded to the transparent resin sealing body of the LED device according to the present embodiment as described above, the gas permeation to the sealing body of the LED device is achieved. Can be suppressed.

[Second Embodiment]
As a method of adhering a silicone lens to an LED device, in addition to a method of adhering a silicone lens to an individual LED device, a lens array having a plurality of silicone lenses is adhered to a plurality of LED devices. Also good. In this embodiment, FIG. 9 shows a method for bonding a plurality of silicone lenses at a time to each of a plurality of LED devices arranged on a substrate by using a lens array in which a plurality of silicone lenses are arranged. The description will be given with reference.

  In FIG. 9, reference numeral 30 denotes a single lens array in which a plurality of silicone lenses are arranged in a planar shape. The lens array 30 is an integrally molded body of silicone resin having a plurality of silicone lens regions 21. A gas barrier layer is formed on the surface to be bonded which is the back surface of the lens array 30 in the same manner as described in the first embodiment. Reference numeral 40 denotes an LED array in which a plurality of LED devices 10 are arranged and mounted on a single circuit board.

  A gas barrier layer is formed on the adherend surface of the silicone lens region 21 on the back surface of the lens array 30 as described in the first embodiment. Further, as described in the first embodiment, the surface to be bonded may be previously subjected to surface modification treatment on which the gas barrier layer is formed.

  As shown in FIG. 9A, the lens array 30 is arranged on the LED array 40 so that each LED device 10 of the LED array 40 and each silicone lens region 21 of the lens array 30 face each other. ) Overlay as shown. And the adhesive agent or sealing agent of an adhesive surface is hardened as needed in the piled-up state. According to such a method, since a lens structure can be provided to a plurality of LED devices at a time, the mass productivity of the lens-equipped LED device is improved.

  When the circuit on the circuit board connects a plurality of LED devices 10, the bonding structure of the LED array 40 and the lens array 30 formed in this way remains as it is, and a plurality of LED with lenses is used. The device array can be used for, for example, automobile headlamps, LED illumination devices, and LED display backlight illumination. When the circuit on the circuit board is independent for each LED device 10, as shown in FIG. 10, the formed LED device with lens is cut by the laser device 100, a dicing saw, or the like. A plurality of LED devices with a lens can be obtained by cutting individually.

  Another manufacturing method will be described with reference to FIG. In FIG. 11, reference numeral 50 denotes a single lens array in which a plurality of silicone lens regions 51 are arranged in a planar shape, and is an integrally molded body of silicone resin. Each silicone lens region 51 includes a concave LED device accommodating portion 52 that can accommodate the LED device 10. Note that a gas barrier layer is formed on the surface to be bonded of the lens body, which is the surface of the LED device housing portion 52, as described in the first embodiment. In this manufacturing method, as shown in FIG. 11, the LED device 10 is inserted into each LED device housing portion 52 of the lens array 50 with the light emitting surface disposed on the lens side, and is bonded via an adhesive or the like. According to such a method, since a lens structure can be provided to a plurality of LED devices at a time, the mass productivity of the lens-equipped LED device is improved. In addition, the distance between the lenses can be freely increased. In addition, as shown in FIG. 11, the plurality of lens-equipped LED devices obtained by such a method is also cut by a laser device, a dicing saw, or the like at a portion indicated by a broken line, so that a plurality of lens-attached LED devices are obtained. It can also be divided into LED devices.

[Third Embodiment]
Epoxy resins are widely used as sealing bodies from the viewpoint of preventing deterioration of the reflective layer of the silver thin film because of their high gas barrier properties. However, there is a drawback that the color is easily deteriorated due to heat emitted from the LED element or light having a short wavelength. On the other hand, the silicone resin is not easily discolored by short-wavelength light or heat emitted from the LED element, but has a drawback that the reflective layer of the silver thin film is likely to be blackened due to its low gas barrier property. Thus, when an epoxy resin is used as the sealing body, the amount of light tends to decrease due to the discoloration of the resin, etc., and when a silicone resin is used as the sealing body, the amount is reduced due to the blackening of the silver thin film. There was a tendency to decrease. In such a case, it is possible to suppress gas permeation with respect to the silicone resin sealing body by using a silicone resin as the sealing body and bonding an epoxy resin lens having a high gas barrier property to the sealing body. . However, there is a problem that the adhesiveness of the epoxy resin lens to the sealing body made of silicone resin is low. Moreover, there also existed a problem that an epoxy resin lens discolored by the heat | fever emitted from an LED element being transmitted.

  The problem of low adhesion of the epoxy resin lens to the sealing body made of silicone resin is that the surface to be adhered to the epoxy resin lens is a surface such as plasma treatment, corona treatment, UV treatment, frame treatment, itro treatment, or primer treatment. Adhesion can be significantly improved by applying a primer treatment after the modification treatment, preferably plasma treatment, corona treatment, UV treatment, flame treatment, or ittro treatment. In addition, the problem that the epoxy resin lens is discolored depending on the type of the epoxy resin selected in the selection of the LED light emitting element and optical design due to the heat generated from the LED element is as follows. This can be solved by forming the silicone resin layer described in (1).

  In the present embodiment, a lens body made of an epoxy resin molded body having a lens portion and a surface to be bonded to the transparent resin sealing body, and a silicone pressure-sensitive adhesive or a silicone adhesive formed on the surface to be bonded A resin lens provided with a silicone resin layer will be described in detail. According to such a configuration, it is possible to suppress the discoloration of the epoxy resin lens by suppressing the heat transmitted from the transparent resin sealing body to the epoxy resin lens, thereby improving the light extraction efficiency due to the discoloration of the lens. The decrease can be suppressed. In addition, description is abbreviate | omitted about the part which is common in 1st Embodiment and 2nd Embodiment.

  The lens-equipped LED device 120 including the epoxy resin lens 111 of the present embodiment will be described in detail.

  FIG. 12 is a schematic cross-sectional view of the lens-equipped LED device 120 including the epoxy resin lens 111. An epoxy resin lens 111 is bonded to the surface of the transparent resin sealing body 2.

  As shown in FIG. 12, the epoxy resin lens 111 includes an epoxy resin lens body including a lens portion 111a and an adherend surface 111b, and a silicone resin layer 111c formed on the adherend surface 111b. The lens part 111a has a lens shape that is optically designed according to the application. The lens body made of the epoxy resin molded body of the epoxy resin lens 111 is bonded so as to be located far from the LED element 1 through the silicone resin layer 111c having high heat resistance, and therefore is not easily deteriorated against heat and light. Maru. In addition, since the epoxy resin lens 111 is mainly composed of an epoxy resin, it functions as a gas barrier layer on the surface of the silicone resin sealing body, so that the blackening of the reflective layer of the silver thin film can be suppressed. Note that the adhesion surface of the epoxy resin lens is subjected to a surface modification treatment such as a primer treatment after a plasma treatment, a corona treatment, a UV treatment, a frame treatment, or an intro treatment, thereby obtaining strong adhesion. Preferably, the lens-attached LED device is firmly bonded by forming a silicone resin layer 111c such as a silicone adhesive having high heat resistance or a silicone adhesive on the adherend surface 111b. By interposing the silicone resin layer 111c between the surface of the transparent resin sealing body 2 of the LED device 10 and the epoxy resin lens main body, the epoxy resin lens main body is moved away from the vicinity of the LED element 1 whose temperature is increased by heat generation. Thus, discoloration of the epoxy resin lens can be suppressed. The thickness of the silicone resin layer 111c is preferably about 6 to 4000 μm, preferably about 25 to 600 μm from the viewpoint of heat conduction.

  Hereinafter, the present invention will be described more specifically with reference to examples. The scope of the present invention is not limited by the examples.

[ Reference Example 1]
A chip type LED device in which the LED element was sealed with a sealing body made of silicone resin was used. In addition, the reflective film which consists of a silver thin film was formed in the surface of the light-emitting body accommodating member in which the LED element of this LED device was arrange | positioned. In the LED devices used in the following examples and comparative examples, all of the LED devices on which a reflective film was formed were used.

  KJR632 (manufactured by Shin-Etsu Chemical Co., Ltd.), a silicone resin raw material composition based on an organopolysiloxane with a phenyl group bonded to a silicon atom, is poured into a mold having a lens shape as a cavity, and thermoset at 150 ° C. By doing so, a silicone lens X1 having a plano-convex lens shape was obtained. The silicone lens X1 has a substantially circular outer periphery with a diameter of 5 mm, and the lens part has a convex part with a height of 4.2 mm at the center part, and the central part of the adherend surface has a convex part with a convexity of about 0.2 mm. Was.

  The surface to be bonded of the silicone lens X1 was plasma treated. The plasma treatment was performed for 3 minutes on the whole while rotating the silicone lens X1 using an atmospheric pressure plasma apparatus. Similarly, the surface of the sealing body of the LED device was also plasma treated. In addition, the contact angle with respect to the water of the to-be-adhered surface of the silicone lens X1 before a plasma process was 110 degree | times, and the contact angle with respect to the water of the to-be-adhered surface of the silicone lens X1 after a plasma process was 5 degree | times.

  Parts other than the adherend surface of the plasma-treated silicone lens X1 were masked by applying a masking tape. Then, the silicone lens X1 was introduced into the vacuum chamber of the vapor deposition apparatus, and the silicon lens X2 was obtained by depositing a silicon oxide film on the silicone lens X1 while flowing oxygen gas into the vacuum chamber using silicon as a target. The thickness of the obtained silicon oxide film was 10 nm.

  And the adhesion layer was formed by apply | coating uncured silicone type resin (Momentive Performance Materials TSE3221S one-component thermosetting type silicone adhesive) to the to-be-adhered surface of the silicone lens X2. And the sealing body and the silicone lens X2 were integrated by pressing the adhesive layer of the back surface of the silicone lens X2 against the sealing body of an LED apparatus, and pressing. And the silicone lens X2 was adhere | attached on the surface of the sealing body by thermosetting a silicone type adhesive layer on the conditions of 150 degreeC x 4 hours. In this way, LED device A with a lens was obtained.

  When the lens-attached LED device A was left in a sulfurous acid gas atmosphere for 24 hours, no silver contamination was observed in which the silver thin film in the LED seal was partially blackened. Further, the adhesion between the LED device sealing body and the silicone lens X2 was evaluated by a micro-weight measuring device. As a result, the adhesive strength was 10N or more. Further, when the adhesion interface was observed using a 10 × magnifier, no void was found. And when the LED device A with a lens was turned on for 5 minutes and then turned off for 2 minutes, the light amount after emitting light for 5000 hours was measured, and no change was observed. In addition, no delamination occurred on the adhesion surface between the sealing body and the silicone lens X2.

[Example 2]
Liquid glass, which is a sol-gel glass solution, was applied to the adherend surface of the plasma-treated silicone lens X1. And the glass thin film of thickness 5 micrometers was formed by drying at room temperature for 1 hour. In this way, a silicone lens X3 was obtained. Then , in the same manner as in Reference Example 1, the surface to be bonded of the silicone lens X3 on which the glass thin film was formed was bonded to the surface of the sealing body with a silicone resin adhesive. In this way, LED device B with a lens was obtained. And it was evaluated lenses with LED device B in the same manner as in Reference Example 1. When the LED device B with a lens was left in a sulfurous acid gas atmosphere for 24 hours, silver contamination in which the silver thin film in the LED seal was partially blackened was not observed. In addition, the adhesion between the LED device sealing body and the silicone lens X3 was evaluated by a micro-weight measuring device. As a result, the adhesive strength was 10N or more. Further, when the adhesion interface was observed using a 10 × magnifier, no void was found. Then, when the LED device B with a lens was turned on for 5 minutes and then cycled for 2 minutes to turn off the light and measured for 5000 hours, no change was found. Further, no delamination occurred on the adhesion surface between the sealing body and the silicone lens X3.

[Example 3]
An uncured epoxy resin (Inabata Sangyo Co., Ltd., trade name: EH1600-G2) is applied to the adherend surface of the plasma-treated silicone lens X1 to form an uncured epoxy adhesive layer having a thickness of 50 μm. did. In this way, a silicone lens X4 was obtained. And, similarly as in Reference Example 1, from the pressing by pressing the epoxy adhesive layer on the back surface of the silicone lens X4 the sealing of the LED device, the sealing body and the silicone lens X4 are integrated. And the silicone lens X4 was adhere | attached on the surface of the sealing body by thermosetting an epoxy-type adhesive bond layer on conditions of 150 degreeC x 4 hours. In this way, an LED device C with a lens was obtained. And the LED device C with a lens was evaluated in the same manner as in Reference Example 1. When the lens-attached LED device C was left in a sulfurous acid gas atmosphere for 24 hours, no silver contamination was observed in which the silver thin film in the LED seal was partially blackened. Moreover, the adhesiveness of the LED device sealing body and the silicone lens X4 was evaluated with a micro-weight measuring device. As a result, the adhesive strength was 10N. Further, when the adhesion interface was observed using a 10 × magnifier, no void was found. Then, when the LED device C with lens was turned on for 5 minutes and then turned off for 2 minutes to repeat the light emission for 5000 hours, the amount of light was measured and almost no change was observed. Further, no delamination occurred on the adhesion surface between the sealing body and the silicone lens X4.

[Example 4]
In the manufacturing process of the LED device, an uncured epoxy resin (Inabata Sangyo Co., Ltd., trade name: EH1600-G2) is filled as a resin for forming a sealing body, and an uncured epoxy having a thickness of 50 μm is further filled thereon. The silicone lens X4 of Example 3 on which a system adhesive layer was formed was placed and heat-cured at 150 ° C. for 4 hours to obtain an LED device D with a lens.

And, in the same manner as in Reference Example 1 to evaluate LED device D with a lens. When the lens-attached LED device D was left in a sulfurous acid gas atmosphere for 24 hours, no silver contamination was observed in which the silver thin film in the LED seal was partially blackened. Moreover, the adhesiveness of the LED device sealing body and the silicone lens X4 was evaluated with a micro-weight measuring device. As a result, the adhesive strength was 10N or more. Further, when the adhesion interface was observed using a 10 × magnifier, no void was found. Then, when the LED light with lens D was turned on for 5 minutes and then turned off for 2 minutes, the light quantity after emitting light for 5000 hours was measured, and no change was observed. Further, no delamination occurred on the adhesion surface between the sealing body and the silicone lens X4.

[Example 5]
The adherend surface of the epoxy resin lens was plasma treated. Then, an uncured silicone resin having a thickness of 50 μm was applied to the adherend surface of the epoxy resin lens to form a silicone resin adhesive layer. Then, in the manufacturing process of the LED device, an epoxy resin lens in which the same uncured silicone resin is filled as the resin forming the sealing body and the above-mentioned silicone resin adhesive layer having a thickness of 50 μm is formed thereon is used. After pressure-contacting and pressing and mounting, heat curing was performed at 150 ° C. for 4 hours to obtain LED device E with a lens.

  When the lens-equipped LED device E was left in a sulfurous acid gas atmosphere for 24 hours, no silver contamination in the LED seal was observed. Moreover, the adhesiveness of the sealing body of LED device E with a lens and an epoxy resin lens was evaluated using the micro load measuring device. As a result, the adhesive strength was 10 N or more, and there was no problem. Moreover, when the void which remains in an adhesion interface was observed using a 10 times magnifier, it was not found at all. In addition, when the LED light E with the lens was turned on for 5 minutes and turned off for 2 minutes and light was emitted for 5,000 hours, no change was observed. There was no delamination. In addition, since the silicone resin layer was provided in the vicinity of the LED element whose temperature increases due to heat generation, discoloration of the epoxy resin lens was suppressed.

[Example 6]
The back surface, which is the surface to be bonded, of a silicone lens array provided with 10 × 10 hemispherical lenses of 10 × 10 in a 100 mm × 100 mm sheet was plasma treated. Then, an uncured epoxy adhesive layer having a thickness of 50 μm was formed on the adherend surface, and a release paper was provided thereon to form a silicone lens array with an adhesive layer. Then, the release paper was peeled off and pressure-bonded to the surface of the silicone sealing body of the LED device aligned in 10 × 10 pieces. In this way, 100 LED devices F with a lens were formed. And these were individualized.

  When the lens-attached LED device F was left in a sulfurous acid gas atmosphere for 24 hours, no silver contamination in the LED seal was observed. Moreover, the adhesiveness of the LED device sealing body and the silicone lens was evaluated with a minute load measuring device. As a result, the adhesive strength was 10N or more. Further, when the adhesion interface was observed using a 10 × magnifier, no void was found. And when the light quantity after 5000-hour light emission was repeated by repeating the cycle of light-extinguishing for 2 minutes after lighting LED device F with a lens for 5 minutes, the change was not seen. Further, no delamination occurred on the adhesive surface between the sealing body and the silicone lens.

[Comparative Example 1]
A chip type LED device in which the LED element was sealed with a sealing body made of silicone resin was used. In addition, the reflecting film which consists of a silver thin film is formed in the surface of the light-emitting body accommodating member in which the LED element of this LED device is arrange | positioned.

  An adhesive layer was formed by applying an uncured silicone resin, which is a transparent adhesive, one hour after the plasma treatment was completed on the adherend surface of the plasma-treated silicone lens X1. And the sealing body and the silicone lens X1 were integrated by pressing the adhesive layer of the back surface of the silicone lens X1 against the sealing body of an LED device, and pressing it. And the silicone lens X1 was adhere | attached on the surface of the sealing body by thermosetting a silicone type adhesive layer on the conditions of 150 degreeC x 4 hours. In this way, a lensed LED device G was obtained.

And, in the same manner as in Reference Example 1 to evaluate the lens with LED device G. When the lens-attached LED device G was left in a sulfurous acid gas atmosphere for 24 hours, silver contamination in which the silver thin film in the LED seal was blackened was observed. Further, the adhesion between the LED device sealing body and the silicone lens X1 was evaluated by a micro-weight measuring device. As a result, the adhesive strength was 10N or more. Further, when the adhesion interface was observed using a 10 × magnifier, no void was found. And when the LED device G with a lens was turned on for 5 minutes and then cycled for 2 minutes to turn off the light and measured for 5000 hours, it was found that the amount of light was reduced. Further, no delamination occurred on the adhesion surface between the sealing body and the silicone lens X1.

DESCRIPTION OF SYMBOLS 1 LED element 2 Transparent resin sealing body 3 Light-emitting body accommodating member 5a, 5b Lead 5c Gold wire 11c Gas barrier layer 8 Inner surface reflection film 10 Surface mount type LED device 11, 21, 61 Silicone lens 11a Lens part 11b Bonded surface 14 Adhesion Agent layer 20 LED device with lens 21 Silicone lens region 21C Uncured resin layer 30 Lens array 31c Adhesive silicone layer 40, 50 LED array

Claims (14)

A resin lens adhered to the transparent resin sealing body of an LED device provided with a transparent resin sealing body for sealing an LED element,
A lens body composed of a silicone resin molded body having a lens portion and a bonded surface to be bonded to the transparent resin sealing body, and a gas barrier layer formed on the bonded surface,
The gas barrier layer comprises :
Than silicone resin forming the lenses body has high gas barrier properties, silicone resins, epoxy resins and silicone modified resins, silicone-modified resins of the acrylic resin, at least one transparent resin selected from urethane resins and silicone-modified resin resin lens which is characterized that you comprising at least one layer selected from a layer and the glass layer. The resin lens according to claim 1, wherein the gas barrier layer includes the glass layer. The resin lens according to claim 2, wherein the glass layer is a glass layer formed by a sol-gel method. The resin lens according to claim 2, wherein the glass layer is a glass layer including an ultrathin plate glass having a thickness of 10 to 500 μm. The resin lens according to claim 1, the gas barrier layer comprises said transparent resin layer is permeable Akiraneba adhesive layer.   The resin lens according to claim 1, wherein a center portion of the adherend surface is raised.   The resin lens according to claim 1, wherein the adherend surface is subjected to a surface modification treatment. A resin lens adhered to the transparent resin sealing body of an LED device provided with a transparent resin sealing body for sealing an LED element,
A resin lens comprising: a lens body made of an epoxy resin molded body having a lens portion and a bonded surface to be bonded to the transparent resin sealing body; and a silicone resin layer formed on the bonded surface. .   A lens array comprising a plurality of resin lenses according to any one of claims 1 to 8 arranged in a plane.   An LED device including a transparent resin sealing body that seals an LED element, and the resin lens according to any one of claims 1 to 8 adhered to the transparent resin sealing body. An LED device with a lens. The LED device with a lens according to claim 10, wherein the transparent resin sealing body is made of a silicone resin.   The step of adhering the lens array according to claim 9, wherein the resin lens is disposed on a plurality of the LED devices arranged on a substrate so as to face the LED devices. Manufacturing method of LED device with lens. The manufacturing method of the LED device with a lens of Claim 12 further equipped with the process of cut | disconnecting and individualizing the said several LED device with a lens formed by adhere | attaching.   The manufacturing method of the LED device with a lens formed by forming the 1 or more LED apparatus in a circuit board, and retrofitting the resin lens of Claims 1-8.

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