JP5559134B2 - Imaging device - Google Patents

Description

  The present invention relates to an imaging apparatus in which a camera unit including an imaging element is rotatably supported.

  2. Description of the Related Art In recent years, heat radiation of an imaging device has been an issue. For example, with the increase in power consumption due to an increase in the number of pixels of an imaging device, cooling of the imaging device has become an important issue.

  In a conventional camera device having a movable part, there is a dome type camera disclosed in Patent Document 1 as a camera device provided with means for radiating heat of an image sensor without using a cooling device such as a fan.

  The dome type camera includes an imaging unit including a lens unit having a rotation mechanism and an imaging circuit unit that is a heating element, and a casing unit having high thermal conductivity, and the entire circumference inside the casing unit. Or a rotation mechanism support part is provided in a part of circumference. Furthermore, by supporting the above-described imaging unit by surface contact with this rotation mechanism support unit, the thermal resistance between the imaging circuit unit that is a heating element and the housing that is a heat dissipation portion can be suppressed low.

  Moreover, in a conventional camera device having a movable part, there is a video camera disclosed in Patent Document 2 as another camera device provided with another means for radiating the heat of the image sensor without using a cooling device such as a fan. .

  The video camera has a housing, a display unit held by the housing, the holding posture of which is displaceable, a flat surface at one end thereof connected to the back surface of the display unit as a heat dissipation area, and a flat surface at the other end. Has a plate-like heat conduction member connected as a heating element. Further, the plate-like heat conducting member is inserted and installed in a support shaft portion that can displace the holding posture of the display portion.

JP 2009-017245 A JP 2002-158904 A

  However, in a pan-tilt camera that can be driven electrically, the sliding load associated with the tilt rotation increases, so that the member that supports the camera unit including the image sensor and the like and the tilt rotation mechanism support portion are brought into surface contact so as to transfer heat. It is difficult to take a simple structure. Therefore, the camera unit is isolated from the heat dissipation structure with the tilt rotation unit as a boundary.

  As a method of dissipating heat from a section (camera unit) isolated from the heat dissipation structure, conventionally, a cooling fan is sometimes provided inside the camera unit. In addition, the exterior casing of the camera unit is composed of a metal or other highly conductive member, and heat from the heating element inside the camera unit is transferred to the exterior casing via a heat dissipation sheet or the like. Sometimes it was taken.

  However, when a cooling fan is provided inside the camera unit, the camera must be newly equipped with a control system for controlling the fan, the circuit configuration of the entire camera becomes complicated, and power consumption is also reduced. It will increase. In addition, air convection (flow) is forcibly caused in the vicinity of the image sensor and the optical system, so there is a concern that dust from the outside may enter the inside of the image sensor and the optical system, and a dust-proof measure is necessary. There was a problem of becoming.

  In addition, when the exterior casing of the camera unit is configured with a member having high thermal conductivity such as metal, the cost is higher than when the exterior casing is configured with a member such as resin. In addition, since a member having high thermal conductivity has a high specific gravity, there is a problem in that torque and inertia accompanying tilt rotation of the camera unit increase, which obstructs tilt rotation driving.

  If the heat conduction member is passed through the tilt rotation support shaft and heat in the camera unit is transferred by the heat conduction member, the heat conduction member is twisted along with the tilt rotation. For this reason, in addition to the torsional durability of the heat conducting member itself, there is a problem that a larger tilt rotation driving torque is required to twist the heat conducting member.

  The present invention has been made in view of the above points. In other words, without using a cooling device such as a fan, the heat of the camera unit that is rotatably supported and that includes the image sensor can be efficiently radiated, preventing an increase in cost, a decrease in durability, and an increase in driving torque. It is an object of the present invention to provide an imaging device that is advantageous for the purpose.

In order to achieve the above object, an imaging apparatus of the present invention is provided with a casing, a rotation axis, a camera unit including an imaging element, and a bearing that rotatably supports the rotation axis with respect to the casing. An image pickup apparatus comprising: a motor for rotating the rotating shaft; the bearing transmits heat from the camera unit to an external surface of the housing; and the motor is interposed through a heat insulating member. characterized Rukoto provided in the housing.

  According to the present invention, it is possible to efficiently dissipate heat of a camera unit that is rotatably supported and includes an image sensor without using a cooling device such as a fan, thereby increasing costs, reducing durability, and increasing driving torque. It is possible to provide an imaging apparatus that is advantageous in preventing each of the above.

1 is a schematic configuration diagram of a pan / tilt camera according to an embodiment of the present invention. It is a detailed view around the camera unit according to the embodiment of the present invention. It is sectional drawing of a pan rotation base part periphery which concerns on embodiment of this invention. It is a detailed view of the periphery of the imaging processing circuit according to the embodiment of the present invention. FIG. 3 is a detailed view around the power supply circuit according to the embodiment of the present invention.

  Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is a schematic configuration diagram of an imaging apparatus, specifically, a pan / tilt camera 1 according to an embodiment of the present invention.

  The camera unit 10 in FIG. 1 is supported by a pan rotation base 21 so as to be capable of tilt rotation (rotation in the tilt direction), and is covered with a camera exterior casing 11. A tilt drive motor 201 for tilting and driving the camera unit 10 is provided on one of both side surfaces of the pan rotation base unit 21, and an imaging signal from the camera unit 10 is transmitted to the other side surface. The imaging signal cable 110 is wired (arranged).

  In addition, each of the both side surfaces of the pan rotation base portion 21 is covered with a pair of pan side surface housings 22. More specifically, one of these pan side surface outer casings 22 covers the tilt drive motor 201 and covers one of both side surfaces of the pan rotation base portion 21, and the other pan side surface outer casing 22 The signal cable 110 is covered and the other side surface of the pan rotation base 21 is covered.

  In addition, although the imaging signal cable 110 in this embodiment shall be a flexible printed circuit board, it is not restricted to this. For example, a coaxial cable (a thin coaxial cable) may be used as the imaging signal cable 110.

  The substrate 202 includes an imaging processing circuit, and the imaging processing circuit processes an imaging signal transmitted by the imaging signal cable 110. Also, a pan driving motor 203 for driving the pan rotation base 21 to rotate (rotate in the pan direction) is fixed to the bottom surface of the pan rotation base 21. Further, a slip ring 204 that transmits electric power and a processing signal processed by an imaging processing circuit mounted on the substrate 202 is provided on the bottom surface of the pan rotation base 21.

  The fixed base portion 31 supports the pan rotation base portion 21 so as to be able to rotate the pan, the substrate 301 is fixed thereto, and further includes a power circuit heat radiating sheet metal 302. Here, the substrate 301 includes a power supply circuit, and the power supply circuit supplies power to each part of the pan / tilt camera 1 via the slip ring 204 or the like. Further, the power supply circuit heat radiating sheet metal 302 transmits the heat of the heating element provided on the substrate 301 to the fixed base 31.

  The fixed base portion 31 is covered with the fixed base outer casing 32 together with the substrate 301 and the power circuit heat radiating sheet metal 302. The fixing base 31 is made of a highly heat conductive member such as a sheet metal, and supports the substrate 301.

  Next, FIG. 2 is a detailed view around the camera unit 10 according to the embodiment of the present invention. The two figures show the camera unit 10 from different viewpoints. The imaging optical system 101 in FIG. 2 includes a focus lens (not shown), a zoom lens (not shown), and the like, and is fixedly supported together with the imaging element 104 by a lens support metal plate 102 and a lens support metal plate 103.

  The lens support metal plate 102 has an L-shaped cross section in the short direction of the imaging optical system 101, and is provided (connected) with a bending portion 102b and a tilt rotation shaft 102a. The lens support metal plate 103 has an L-shaped cross section in the short direction of the imaging optical system 101, and includes a bending portion 103b and a tilt rotation shaft 103a. The lens support metal plate 102 and the lens support metal plate 103 cover the imaging optical system 101 and the like.

The image sensor 104 is bonded and fixed to an alignment sheet metal 106. The alignment sheet metal 106 accommodates the image sensor 104 at a predetermined position 101a in the image pickup optical system 101 and the rear part (rear end) of the image pickup optical system 101. It is fixed to the boss 101b provided in the.
The image sensor 104 is mounted on a substrate 105, and the substrate 105 is fixed to the lens support metal plate 103.

  When the substrate 105 includes a heating element (not shown) other than the image sensor 104, for example, a heat dissipation sheet 109 as a heat dissipation member is provided between the substrate 105 and the lens support metal plate 103, and the substrate 105 is provided with the lens support metal plate 103. It may be fixed to. As a result, the heat generated by the heating element other than the imaging element 104 that is the heating element of the substrate 105 can be transmitted.

  Further, a signal from the substrate 105 on which the image sensor 104 is mounted is transmitted to the outside through the image signal cable 110. The imaging signal cable 110 is passed through a hollow portion 102 c provided on the tilt rotation shaft 102. The heat absorbed by the lens support metal plate 102 and the lens support metal plate 103 is transmitted to the outside through the tilt rotation shaft 102a and the tilt rotation shaft 103a.

  The substrate 105 is provided (formed) with a hole 105a that exposes the bottom surface (the surface opposite to the imaging surface of the imaging device 104) of the package of the imaging device 104 (imaging device package). The heat of the image sensor 104 is transmitted from the hole 105a to the bent portion 102b for heat dissipation provided on the lens support metal plate 102 through the heat dissipation sheet 107. For example, the heat dissipation sheet 107 is inserted into the hole 105a so as to be in contact with the bottom surface of the image sensor package.

  The heat of the image sensor 104 is also transmitted to the alignment sheet metal 106 to which the image sensor 104 is bonded and fixed via an adhesive that bonds the image sensor 104 to the alignment sheet metal 106. However, the efficiency of heat transfer between the image sensor 104 and the alignment sheet metal 106 is lower than the efficiency of heat transfer between the image sensor 104 and the bent portion 102b via the heat radiation sheet 107.

  Then, the heat of the image sensor 104 can be absorbed (radiated) by transmitting the heat of the alignment metal plate 106 to the bent portion 103b for heat dissipation provided on the lens support metal plate 103 via the heat dissipation sheet 108. . The heat dissipation sheet 108 is provided between the alignment sheet metal 106 and the bent portion 103b.

  In this embodiment, the heat of the image sensor 104 causes the heat radiating sheet 107 to be in direct contact with the image sensor package. For this purpose, a hole 105a is formed in the substrate 105 on which the image sensor 104 is mounted. The bottom of the package is exposed. However, the area of the bottom surface of the image pickup device package exposed from the hole 105a is small, and there are cases where sufficient heat dissipation cannot be performed. Therefore, in the present embodiment, the heat of the image sensor 104 is also transferred from the alignment sheet metal 106 that fixes the image sensor 104 with an adhesive or the like through the heat dissipation sheet 108, so that the heat is more effectively dissipated (heat is removed. Can escape).

  Further, the bent portion 102b of the lens support metal plate 102 and the bent portion 103b of the lens support metal plate 103 are shaped so as to cover the substrate 105 on which the imaging element 104 is mounted. If it is provided), it is difficult to assemble.

  Therefore, instead of the bent portion 102b and the bent portion 103b, an imaging element heat radiating sheet metal (not shown) that contacts the imaging element 104 or the alignment sheet metal 106 via a heat radiating sheet may be provided. Further, by fixing the imaging element heat radiating metal plate to the lens supporting metal plate 102 and the lens supporting metal plate 103, heat is transferred from the imaging element 104 and the like to the lens supporting metal plate 102 and the lens supporting metal plate 103. Also good.

  Next, FIG. 3 is a cross-sectional view around the pan rotation base 21 in the embodiment of the present invention. The camera unit 10 in FIG. 3 is supported by a pan rotation base 21 so as to be tiltable. The pan rotation base 21 is made of a member having high thermal conductivity such as metal.

  The tilt rotation shaft 102 a is fitted on the inner diameter side of the bearing 205. Further, the outer diameter side of the bearing 205 is fitted into and in contact with the pan rotation base portion 21. With this configuration, heat from the tilt rotation shaft 102 a can be transmitted to the pan rotation base portion 21 via the bearing 205 and radiated from the external surface 21 b of the pan rotation base portion 21. The external surface 21b is in contact with the outside air.

  The tilt rotation shaft 103a is fitted and brought into contact with the inner diameter side of a tilt drive motor 201 incorporating a bearing and a rotation shaft. The outer diameter side of the tilt drive motor 201 is fixed so as to be in contact with the pan rotation base 21. According to this structure, the heat of the tilt rotation shaft 103a and the heat of the tilt drive motor 201 are transferred to the pan rotation base 21 through the lens support plate 103, the lens support plate 102, the tilt rotation shaft 102a, and the bearing 205. Heat can be transferred to the outer surface 21b to dissipate heat.

  Next, FIG. 4 is a detailed view of the periphery of the imaging processing circuit in the present embodiment. The substrate 202 including the imaging processing circuit is directly fixed to the pan rotation base unit 21. In addition, a plurality of ribs 21 a corresponding to the plurality of heating elements 209 on the substrate 202 protrude from the pan rotation base portion 21.

  Further, a plurality of heat radiation sheets 207 corresponding to each of the plurality of heating elements 209 are provided between the pan rotation base portion 21 and the substrate 202. Each of the plurality of heating elements 209 on the substrate 202 is in contact with the corresponding rib 21a via the corresponding heat dissipation sheet 207. Here, each of the plurality of ribs 21a is formed so as to match the height and size of the corresponding heat generating element 209, and the heat of the heat generating element 209 absorbed by the pan rotation base 21 is from the external surface 21b. Heat is dissipated.

  As a result, heat from the imaging processing system element that consumes a large amount of power and whose operating temperature specification (operating temperature range) is relatively strict is directly dissipated to the pan rotation base 21 that is in contact with the outside air. , Can effectively dissipate heat.

  In addition, since the mounting area may be insufficient with only the substrate 202, the auxiliary circuit substrate 206 may be directly fixed to the side surface side of the pan rotation base portion 21 as in the embodiment of the present invention. Good. Further, a plurality of ribs 21c corresponding to a plurality of heating elements (not shown) on the auxiliary circuit board 206 may be provided so as to protrude from the pan rotation base portion 21. In addition, a heat dissipation sheet 208 corresponding to each of the plurality of heat generating elements may be provided between the side surface side of the pan rotation base portion 21 and the auxiliary circuit board 206.

  If comprised in this way, each of the several heat generating element on the auxiliary circuit board 206 will contact the corresponding rib 21c via the corresponding heat dissipation sheet 208. FIG. Here, each of the plurality of ribs 21c is formed so as to match the height and size of the corresponding heating element, and the heat of the heating element on the auxiliary circuit board 206 is absorbed by the pan rotation base portion 21. Heat is radiated from the external surface 21b.

  The pan drive motor 203 includes a bearing and a rotating shaft. The pan driving motor 203 supports the pan rotation base 21 so as to be able to rotate the pan, and is fixed to the center of the bottom surface of the pan rotation base 21. And the hollow part is formed in the rotating shaft of the pan drive motor 203, The slip ring 204 is arrange | positioned in this hollow part.

  Note that the means for transmitting the processing signal from the imaging processing circuit of the substrate 202 and the power from the power supply circuit mounted on the substrate 301 is not limited to the slip ring 204. For example, a cable or a flexible printed board may be used instead of the slip ring 204.

  Next, FIG. 5 is a detailed view of the periphery of the power supply circuit in the present embodiment. The pan drive motor 203 in FIG. 5 is fixed to the fixed base 31 and supports the pan rotation base 21 so that the pan can rotate.

  A substrate 301 including a power supply circuit is fixed to the fixed base 31 and receives (receives) a processing signal from the slip ring 204 and supplies power. Further, the heating element 303 on the substrate 301 is in contact with the throttle portion 31 a that protrudes from the fixed base portion 31 via the heat dissipation sheet 304. Thereby, the heat generated in the heating element 303 is transmitted (transmitted) to the fixed base 31 via the heat dissipation sheet 304 and the narrowed portion 31a.

  In addition, although the heat generating body 303 in this embodiment is comprised so that the fixing base part 31 may be contacted via the thermal radiation sheet | seat 304, it is not restricted to this. You may comprise so that the heat generating body 303 may contact the fixing base part 31 directly.

  The heating element 305 on the substrate 301 is a heating element different from the heating element 303, and the height of the heating element 305 does not reach (does not reach) the fixed base 31. For this reason, the heating element 305 contacts the power circuit heat radiating metal plate 302 via the heat radiating sheet 306, and the power circuit heat radiating metal plate 302 is connected to the fixing base 31. As a result, the heat generated in the heating element 305 is transmitted to the fixed base 31 via the heat dissipation sheet 306 and the power circuit heat dissipation sheet metal 302. In the present embodiment, each of the heating element 303 and the heating element 305 is an element.

  In addition, although the heat generating body 305 in this embodiment is comprised so that the power supply circuit heat sink sheet metal 302 may be contacted via the heat radiating sheet 306, it is not restricted to this. You may comprise so that the heat generating body 305 may contact the fixed base part 31 directly.

  The heat absorbed by the fixed base 31 (heat transferred to the fixed base 31) is transmitted to the pan rotation base 21 via a bearing and a rotary shaft built in the pan drive motor 203, and rotates the pan. Heat is radiated from the external surface 21 b of the base 21. Further, the fixed base outer casing 32 covers the fixed base portion 31. The fixed base outer casing 32 is made of an inexpensive resin material that has low heat dissipation but good moldability if the heat of the pan / tilt camera 1 is sufficiently dissipated from the pan rotation base 21. May be.

  As described above, the pan / tilt camera 1 according to the present embodiment includes the camera unit 10 including the image sensor 104 that is provided with the tilt rotation shaft 102a. Furthermore, the pan / tilt camera 1 includes a bearing 205 that rotatably supports the tilt rotation shaft 102a. In addition, the bearing 205 is for transferring heat from the camera unit 10 to the external surface 21 b of the pan rotation base 21.

  Thereby, without using a cooling device for a fan or the like, without forming an exterior housing of the camera unit 10 with a member having high heat conductivity such as metal, and without passing the heat conduction member into the tilt rotation shaft 102a, Heat from the camera unit 10 can be dissipated. As a result, it is advantageous to prevent cost increase, durability decrease and drive torque increase.

  Note that the tilt rotation shaft 102 a is disposed near the center of the imaging optical system 101 due to the weight balance of the camera unit 10. The image sensor 104 is disposed at the rear part of the imaging optical system 101. Therefore, although depending on the overall length of the imaging optical system, the tilt rotation shaft 102a and the image sensor 104 are relatively close to each other, so the tilt rotation shaft 102a is effective as a heat transfer path for transferring heat from the image sensor 104. It is.

  Further, in order to efficiently transfer the heat of the image sensor 104 to the tilt rotation shaft 102a, it is necessary to configure a heat transfer path with as few parts as possible in order to be as short as possible and avoid deterioration in transfer efficiency due to contact resistance. Therefore, as in the present embodiment, heat is transmitted directly to the lens support metal plate 102 to which the tilt rotation shaft 102a is connected via the heat radiation sheet 107, or in order to improve the assemblability and avoid complication of the part shape, It is desirable to conduct heat through one component, the imaging element heat radiating sheet metal.

  Further, as the bearing 205 in the present embodiment, a metal bearing or ball bearing impregnated with oil may be used in order to ensure the durability of tilt driving. The metal bearing impregnated with oil is made of metal and has high thermal conductivity. Also, inside the ball bearing, the slidable sphere is only in point contact, but the inside is filled with grease. Conductivity is high.

  Further, as the bearing 205 in the present embodiment, a bearing having a large inner diameter that can secure a large contact area with the tilt rotation shaft 102a, and a bearing having a small thickness (thickness) between the outer diameter and the inner diameter are used. The thermal conductivity of 205 can be further improved.

  Here, the image sensor 104 is a heating element, and heat dissipation is indispensable because the performance deteriorates when the temperature exceeds a specified temperature. However, compared with electric elements such as a signal processing circuit and a power supply circuit, power consumption and heat generation. The amount itself is not large. Therefore, as described above, heat transfer efficiency is improved by shortening the heat transfer path, reducing contact resistance, expanding the inner diameter of the bearing 205, and reducing the thickness of the bearing 205, etc., so that heat is transferred only through the tilt rotation shaft 102a. Even in this case, a sufficient heat dissipation effect can be expected.

  In addition, since the thermal conductivity of the tilt rotation shaft 102a mainly depends on the contact area, the cable that transmits the imaging signal from the image sensor 104 is connected to the tilt rotation shaft 102a by making the tilt rotation shaft 102a hollow. It is also possible to wire through the hollow part.

  Further, the pan rotation base 21 is made of metal in order to obtain sufficient rigidity, assuming that the pan / tilt drive is speeded up and the camera unit 10 is heavy. Since the pan rotation base 21 is in contact with the tilt rotation shaft 102a via the bearing 205, the heat of the camera unit 10 can be absorbed. Furthermore, by making a part of the pan rotation base portion 21 an appearance surface 21b that comes into contact with the outside air, the absorbed heat of the camera unit 10 can be radiated to the outside (outside air).

  As a result, the pan rotation base 21 can have a necessary (sufficient) rigidity and can also be used as a heat dissipation mechanism.

  In addition, heat from the substrate 202 including the imaging processing circuit passes through the heat dissipation sheet 207, and heat from the substrate 301 including the power supply circuit passes through the bearing and the rotation shaft built in the pan driving motor 203. It is transmitted to the base part 21. As a result, the heat of the entire pan / tilt camera 1 can be concentrated on the pan exterior casing (the pan rotation base 21 and the like) of the pan / tilt camera 1 and can be radiated by only one heat radiation mechanism. In addition, since an air flow is generated around the pan exterior casing as the pan / tilt rotation occurs, the pan exterior casing is also effective as a heat dissipation mechanism of the pan drive motor 203.

  Further, the tilt drive motor 201 and the pan drive motor 203 generate heat during excitation and drive, but are fixed to the pan rotation base 21 so that heat generated by the heat generation is an external surface 21 b of the pan rotation base 21. More heat can be dissipated. However, when the amount of heat generated by the tilt drive motor 201 or the pan drive motor 203 is large, the heat of the pan rotation base portion 21 rises, and there is a possibility that heat dissipation from the tilt rotation shaft 102a is hindered.

  Here, the tilt drive motor 201 generates heat only during tilt rotation drive when stop excitation is not applied. On the other hand, the pan rotation base portion 21 generates air convection around the pan rotation base portion 21 when the camera unit 10 adjacent to the pan rotation base portion 21 moves in accordance with the tilt rotation. The amount of heat dissipation is improved during tilt rotation drive. Therefore, when the improved heat dissipation amount exceeds the heat generation amount of the tilt drive motor 201, it is desirable to fix the tilt drive motor 201 to the pan rotation base 21.

  Similarly, the pan driving motor 203 generates heat only during pan rotation driving when stop excitation is not applied. On the other hand, the pan rotation base portion 21 generates air convection associated with the pan rotation around the appearance surface 21b, so that the heat radiation amount is improved during the pan rotation drive. When the improved heat dissipation amount exceeds the heat generation amount of the pan drive motor 203, it is desirable to fix the pan drive motor 203 to the pan rotation base portion 21.

  It is also conceivable to provide a reduction gear for transmitting the rotational force from the tilt drive motor 201 to the tilt rotation shaft 103a between the tilt drive motor 201 and the tilt rotation shaft 103a.

  When configured in this manner, like the tilt rotation shaft 102a, a bearing (not shown) whose inner diameter side is fitted with the tilt rotation shaft 103a and whose outer diameter side is fitted with and contacted with the pan rotation base 21 is newly provided. What is necessary is just to comprise so that it may provide. The same configuration is desirable when the tilt drive motor 201 generates a large amount of heat and the heat radiation from the tilt rotation shaft 103a is hindered.

  At this time, the tilt drive motor 201 is not fixed to the pan rotation base 21 or the tilt drive motor 201 is fixed to the pan rotation base 21 via a member having low thermal conductivity (for example, a heat insulating member). Is desirable.

  It is also conceivable to provide a reduction gear for transmitting the rotational force from the pan drive motor 203 to the pan rotation base unit 21 between the pan drive motor 203 and the pan rotation base unit 21.

  When configured in this manner, as with the tilt rotation shaft 102a, the pan rotation shaft (not shown) and its inner diameter side fit into the pan rotation shaft and its outer diameter side fits into the center of the bottom surface of the pan rotation base 21. What is necessary is just to comprise so that the pan bearing (not shown) which contacts together may be newly provided.

  At this time, by making the pan rotation shaft hollow, the slip ring 204 or a cable or a flexible printed circuit board is routed through the hollow portion of the pan rotation shaft to transmit power and processing signals from the imaging processing circuit. What is necessary is just to be the structure to do. The pan rotation base 21 is supported by these pan rotation shafts (not shown) and pan bearings.

  Further, there may be a case where the pan drive motor 203 generates a large amount of heat and the heat dissipation of the substrate 202 or the like is hindered. In such a case, the pan drive motor 203 is not fixed to the pan rotation base 21 or the pan drive motor 203 is fixed to the pan rotation base through a member having low thermal conductivity (for example, a heat insulating member). It is desirable.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

DESCRIPTION OF SYMBOLS 1 Pan tilt camera 10 Camera unit 21b Appearance surface 101 Imaging optical system 102a Tilt rotating shaft 104 Image pick-up element 205 Bearing

Claims (3)

An imaging apparatus comprising a housing, a camera unit provided with a rotation shaft and including an image sensor, and a bearing that rotatably supports the rotation shaft with respect to the housing,
A motor for rotating the rotary shaft;
The bearing transmits heat from the camera unit to the exterior surface of the housing ,
Wherein the motor is an imaging apparatus according to claim Rukoto provided to the housing via a heat insulating member.   The imaging apparatus according to claim 1, wherein the rotation shaft transmits heat from the imaging element to the bearing. A lens support sheet metal connected to the rotating shaft and supporting the camera unit;
The image pickup apparatus according to claim 2, wherein the lens support metal plate is in contact with the image pickup element or an alignment metal plate to which the image pickup element is fixed via a heat radiation sheet.

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