JP5557614B2 - Polishing equipment - Google Patents

Description

  The present invention relates to a polishing apparatus for polishing and deburring a workpiece.

  As this type of polishing apparatus, for example, there is JP-A-5-337812 (Patent Document 1).

  Briefly explaining this Patent Document 1, a belt conveyor on which a workpiece is placed and transferred, and a workpiece placed on the conveyor line of the conveyor and polished in a state where the workpiece on the conveyor is pressed on the lower surface (polishing surface). And a plurality of rotating abrasive bodies.

  In addition, this type of polishing apparatus is configured so that the height of the polishing body can be adjusted by a mechanical operation, depending on the height (thickness) of the workpiece or the wear condition of the polishing body. A desired pressing force against the workpiece can be realized by adjusting the height accordingly.

  That is, for example, for a workpiece having a height, the polishing body is raised, for a workpiece having no height, the polishing body is lowered, and when the polishing surface of the polishing body is worn, the polishing body is lowered. It is comprised so that it can respond by doing.

Japanese Patent Laid-Open No. 5-337812

  The height adjustment of the polishing body of this type of polishing apparatus is adjusted while observing the polishing surface of the polishing body slightly pressed against the workpiece, but it is very difficult to perform this work with high accuracy. It was time consuming and labor intensive.

  The present invention pays attention to the drawbacks of such a conventional polishing apparatus and tries to solve it. Even if the polishing surface of the polishing body is consumed, the polishing surface moves to the set workpiece polishing position. A polishing apparatus that performs controlled and stable polishing work is provided.

  The gist of the present invention will be described with reference to the accompanying drawings.

A support portion 1 for placing or fixing the workpiece W, a polishing body 2 provided above the support portion 1 for polishing the workpiece W placed or fixed on the support portion 1, and the polishing body 2 for the workpiece In a polishing apparatus including an elevating mechanism 4 that can move up and down with respect to the support portion 1 according to the height of W, the polishing body 2 is moved up or down with respect to the support portion 1 via the elevating mechanism 4. Reference position detection means 5 for detecting that the polishing surface 3 at the lower end of the polishing body 2 is located at a preset reference position P1 when moved, and the polishing body where the reference position detection means 5 is located at the reference position P1. When the second polishing surface 3 is detected, the polishing body 2 is moved up or down by a predetermined movement amount L from the reference position P1, and the polishing surface 3 of the polishing body 2 is positioned at the workpiece polishing position P2. As the elevator 4 includes a control unit for controlling driving, provided unexpected workpiece detecting means 6 for detecting a workpiece W having a height above the height of which is set in advance, when the unexpected workpiece detection means 6 detects the workpiece W An emergency stop means for stopping the polishing operation is provided in the control unit, and the support unit 1 is provided with a transfer mechanism 7 for transferring the workpiece W by placing or fixing it, and a transfer start end of the transfer mechanism 7 of the support unit 1 The unexpected workpiece detection means 6 is provided on the side, and the unexpected workpiece detection means 6 is provided so as to be movable up and down with respect to the support portion 1, and the height of the workpiece W detected by the unexpected workpiece detection means 6 is determined. The present invention relates to a polishing apparatus characterized in that the configuration can be changed .

  Further, based on the setting value of the polishing position setting means and the polishing position setting means capable of changing the setting of the work polishing position P2 of the polishing surface 3 of the polishing body 2 according to the height of the work W, the reference The polishing apparatus according to claim 1, wherein a movement amount setting means for automatically setting the movement amount L of the polishing body 2 from a position P1 to the workpiece polishing position P2 is provided in the control unit. is there.

  The reference position detection means 5 is provided at a position higher than the upper surface of the workpiece W placed or fixed on the support portion 1, and the reference position detection means 5 moves up and down via the elevating mechanism 4. The polishing surface 3 of the polishing body 2 is configured to be detected at the reference position P1 above the upper surface of the workpiece W, and when the reference position detection unit 5 detects the polishing surface 3 at the reference position P1, The control unit drives the lifting mechanism 4 so that the polishing body 2 is moved downward from the reference position P1 by a preset movement amount L so that the polishing surface 3 of the polishing body 2 is positioned at the workpiece polishing position P2. The polishing apparatus according to claim 1, wherein the polishing apparatus is controlled.

  Further, after the polishing operation of one workpiece W, after the polishing operation of a predetermined number of workpieces W, or after a predetermined time has elapsed from the start of the polishing operation, the polishing body 2 is moved up or down to move the reference position detecting means 5. The periodical drive means which drive-controls the said raising / lowering mechanism 4 so that the reference | standard position detection of the grinding | polishing surface 3 of the said grinding | polishing body 2 by said may be provided in the said control part. This relates to the polishing apparatus according to the item.

  5. The photoelectric sensor 5 according to claim 1, wherein the reference position detection unit 5 employs a photoelectric sensor 5 capable of detecting the polishing surface 3 in a non-contact manner with respect to the polishing body 2. This relates to a polishing apparatus.

  Since the present invention is configured as described above, even if the polishing surface of the polishing body is worn, a new reference position is set again on the worn polishing surface, and the movement amount set in advance from the reference position is set. Therefore, the polishing body at this workpiece polishing position is positioned at the same position as the polishing surface of the polishing body at the initial workpiece polishing position. Therefore, by detecting the reference position of the polished surface in a timely manner, the desired pressing force against the workpiece equivalent to that at the beginning of polishing can be automatically realized even on a worn polished surface, and stable polishing performance can always be exhibited. Thus, the polishing apparatus is extremely practical.

Further, in the present invention, the workpieces transferred by the transfer mechanism can be polished one after another to efficiently perform the polishing operation, and a workpiece with a height higher than expected that may cause a failure has been transferred. In this case, the polishing operation can be stopped before the workpiece is polished to prevent a failure, and the height of the workpiece detected by the unexpected workpiece detection means can be changed. For example, a polishing apparatus having a configuration that is more practical.

  In the invention described in claim 2, stable polishing performance can be exhibited corresponding to workpieces of different heights, and the workpiece polishing position can be changed from the reference position only by setting the workpiece polishing position by the polishing position setting means. Thus, the polishing apparatus having a more practical configuration in which the amount of movement of the polishing body is set automatically.

  In the invention according to claim 3, the polishing apparatus has a configuration excellent in practicality and suitable for polishing a plate-like workpiece having no height.

  Further, in the invention described in claim 4, since the reference position detection of the polishing surface of the polishing body is automatically and periodically performed by the reference position detecting means, a more stable polishing operation can be realized. The polishing apparatus has an excellent configuration.

  Further, the invention according to claim 5 is an apparatus configuration in which the reference position of the polishing surface with high reliability can be detected by the photoelectric sensor, and the polishing body rotates or a plurality of polishing bodies revolves. However, the polishing apparatus can be surely detected at the reference position and has a more practical configuration.

It is a schematic explanatory side view which shows a present Example. It is a schematic explanatory perspective view which shows the principal part of a present Example. It is the general | schematic explanatory front view which showed a mode that the grinding | polishing surface of the grinding | polishing body grind | polished with a desired pressing force with respect to a workpiece | work in the use condition of a present Example. It is the schematic explanatory front view which showed a mode that the grinding | polishing surface of the grinding | polishing body was worn in the use condition of a present Example. It is the rough explanatory front view which showed a mode that the grinding | polishing surface which abraded up and moved and was worn with the reference | standard position detection means in the use condition of a present Example. Following FIG. 5, the polishing body moves downward from the reference position by a predetermined amount of movement and is positioned at the workpiece polishing position, and the polishing surface of the polishing body is polished with a desired pressing force against the workpiece. FIG. It is operation | movement explanatory drawing of the unexpected workpiece | work detection means of a present Example.

  An embodiment of the present invention which is considered to be suitable will be briefly described with reference to the drawings showing the operation of the present invention.

  Based on the reference position P1 detected in advance by the reference position detection means 5 and the relationship between the reference position P1 and the height (thickness) of the workpiece W, the polishing body 2 from the reference position P1 to the workpiece polishing position P2 is described above. A movement amount L is set in advance.

  When the workpiece W is placed on or fixed to the support portion 1 and the polishing body 2 provided above the support portion 1 is positioned at the workpiece polishing position P2, the workpiece W is polished by the polishing surface 3 at the lower end of the polishing body 2. can do.

  If this polishing operation is continued, the polishing surface 3 of the polishing body 2 will be worn, but if the polishing body 2 is moved up or down with respect to the support portion 1 via the lifting mechanism 4 in a timely manner, the reference position The detecting means 5 detects that the polishing surface 3 at the lower end of the polishing body 2 is located at the preset reference position P1, and at this time, the control unit moves the preset polishing body 2 from the reference position P1. The lifting mechanism 4 is driven and controlled so that the polishing surface 3 of the polishing body 2 is positioned at the workpiece polishing position P2 by being moved up or down by an amount L.

  That is, even if the polishing surface 3 of the polishing body 2 is worn, the worn polishing surface 3 is reset to a new reference position P1, and then the polishing body is moved by a preset amount L from the reference position P1. 2 is moved to the workpiece polishing position P2, the polishing body 2 at the workpiece polishing position P2 has a polishing surface 3 whose position is the same as the polishing surface 3 of the polishing body 2 at the workpiece polishing position P2 at the beginning of the polishing operation. It will be located at the same position.

  Therefore, even if the polishing surface 3 is worn, the desired pressing force against the workpiece W equivalent to the beginning of polishing can be automatically realized by detecting the worn polishing surface 3 at the reference position P1, so that the polishing surface By performing the detection of the third reference position P1 in a timely manner, a stable polishing performance can always be exhibited.

  Further, for example, based on the polishing position setting means capable of setting and changing the workpiece polishing position P2 of the polishing surface 3 of the polishing body 2 according to the height of the workpiece W, and the set value of the polishing position setting means, If a movement amount setting means for automatically setting the movement amount L of the polishing body 2 from the reference position P1 to the workpiece polishing position P2 is provided in the control unit, even workpieces W of different heights can be polished. This can be satisfactorily handled by changing the setting of the workpiece polishing position P2 by the position setting means. When the workpiece polishing position P2 is set by the polishing position setting means, the polishing body 2 from the reference position P1 to the workpiece polishing position P2 can be adjusted. The movement amount L is automatically set by the movement amount setting means.

  Further, for example, the reference position detection means 5 is provided at a position higher than the upper surface of the work W placed or fixed on the support portion 1, and the reference position detection means 5 moves up and down via the lifting mechanism 4. The polishing surface 3 of the polishing body 2 is configured so as to be detected at the reference position P1 above the upper surface of the work W, and when the reference position detection means 5 detects the polishing surface 3 at the reference position P1. The controller 4 moves the polishing body 2 downward from the reference position P1 by a preset movement amount L so that the polishing surface 3 of the polishing body 2 is positioned at the workpiece polishing position P2. If the polishing body 2 is lifted and moved with respect to the support portion 1 via the lifting mechanism 4, the reference position detection means 5 sets the polishing surface 3 at the lower end of the polishing body 2 in advance. Position at reference position P1 When this is detected, the control unit moves the polishing body 2 downward from the reference position P1 by the preset movement amount L so that the polishing surface 3 of the polishing body 2 is positioned at the workpiece polishing position P2. The elevating mechanism 4 is driven and controlled.

  Therefore, for example, when polishing a plate-shaped workpiece W having no height, it is assumed that a stroke for moving the polishing body 2 downward cannot be secured. Since the reference position P1 can be detected at a position higher than the upper surface of the workpiece W and can be moved downward from the reference position P1 to the workpiece polishing position P2 without any trouble, it is suitable for polishing the workpiece W having no height. It is.

  Further, for example, the reference position detection is performed by moving the polishing body 2 up or down after the polishing operation of one workpiece W, after the polishing operation of a predetermined number of workpieces W, or after a predetermined time has elapsed from the start of the polishing operation. If periodic control means for driving and controlling the lifting mechanism 4 is provided in the control unit so that the reference position of the polishing surface 3 of the polishing body 2 is detected by the means 5, the polishing body 2 by the reference position detection means 5 is provided. The reference position of the polished surface 3 is automatically and periodically detected.

  In particular, if the periodic drive means is configured to drive and control the lifting mechanism 4 after the polishing operation of a predetermined number of workpieces W or after a predetermined time has elapsed from the start of the polishing operation, the polishing operation efficiency is not significantly reduced. Since the reference position can be detected, it becomes practical.

  Further, for example, if the photoelectric sensor 5 capable of detecting the polishing surface 3 in a non-contact manner with respect to the polishing body 2 is used as the reference position detection means 5, the polishing surface 3 can be accurately obtained by the highly reliable photoelectric sensor 5. The reference position P1 can be detected, and even when the polishing body 2 rotates or the plurality of polishing bodies 2 revolve, the non-contact photoelectric sensor 5 does not interfere with these operations. The reference position P1 can be reliably detected.

  Further, for example, an unexpected workpiece detection means 6 for detecting a workpiece W having a height higher than a preset height is provided, and the polishing operation is stopped when the unexpected workpiece detection means 6 detects the workpiece W. If the emergency stop means is provided in the control unit, a workpiece W that is too high and may cause a failure in the polishing body 2 or the apparatus itself is detected by the unexpected work detection means 6 and polished by the emergency stop means. Since work is stopped, failure can be prevented.

  Further, for example, the support unit 1 includes a transfer mechanism 7 that transfers the workpiece W by placing or fixing the work W, and the unexpected workpiece detection means 6 is provided on the transfer start end side of the transfer mechanism 7 of the support unit 1. If the unexpected work detection means 6 is provided so as to be movable up and down with respect to the support portion 1 and the height of the work W detected by the unexpected work detection means 6 can be set and changed, the transfer mechanism 7 can be changed. Since the workpieces W transferred by the above can be polished one after another by the polishing body 2, an efficient polishing operation is performed.

  However, when a workpiece W that is too high and has a possibility of failure is transferred, the workpiece W is detected by the unexpected workpiece detection means 6 on the transfer start end side of the transfer mechanism 7, and polishing by the polishing body 2 is performed. Since the polishing operation is stopped before being performed, a failure caused by polishing an unexpected workpiece W is prevented in advance.

  Moreover, since the unexpected workpiece | work detection means 6 can be moved up and down with respect to the support part 1, the setting change of the height of the workpiece | work W detected by this unexpected workpiece | work detection means 6 can be carried out according to the height of the workpiece | work W to grind | polish. is there.

  Specific embodiments of the present invention will be described with reference to the drawings.

  The present embodiment is applied to a polishing apparatus for polishing or deburring a plate-like workpiece W. The apparatus main body 8 is provided with a support 1 for mounting or fixing the workpiece W, and this apparatus main body. 8 above the support portion 1, a polishing body 2 for polishing the workpiece W placed or fixed on the support portion 1, and the polishing body 2 with respect to the support portion 1 according to the height of the workpiece W An elevating mechanism 4 that can move up and down is provided.

  Specifically, the support portion 1 of the present embodiment is configured by a belt conveyor 7 as a transfer mechanism 7 for placing and transferring the workpiece W, and the belt conveyor 7 is disposed horizontally on the apparatus main body 8. The workpiece W transfer direction is horizontal. Although not shown, the support 1 is provided with a fixing means (such as a suction device) for transferring the workpiece W placed on the belt conveyor 7 while fixing it.

  Further, the polishing body 2 of the present embodiment employs a polishing brush 2 in which a large number of equal-length brush hairs protrude downwardly from a disk-shaped substrate portion, and the many brushes of the polishing brush 2 are used. A lower end of the horizontal polishing body 2 formed by gathering the lower ends of the bristles is used as a polishing surface 3 for polishing the surface of the plate-like workpiece W.

  A plurality (four in the drawing) of the polishing bodies 2 are provided so as to be horizontally rotatable with respect to the base plate 9 disposed above the support portion 1 in the apparatus main body 8.

  The base plate 9 is provided so as to be rotatable in the horizontal direction with respect to the apparatus main body 8.

  In this embodiment, a polishing drive motor 10 is provided in the apparatus main body 8 as a rotational drive source for both the polishing body 2 and the base plate 9, and the polishing body 2 is driven to rotate relative to the base plate 9 by the polishing drive motor 10. At the same time, the base plate 9 is also driven to rotate (revolve) in the direction opposite to the rotation direction of the polishing body 2 with respect to the apparatus main body 8 to polish the surface of the workpiece W placed on the support portion 1. Yes.

  Further, the elevating mechanism 4 of this embodiment is provided so as to be rotatable with the screw rod 11 standing on the base plate 9, and the screw rod 11 is screwed into a female screw portion 12 provided in the apparatus main body 8. As a structure that is attached and supported, the base plate 9 (polishing body 2) is moved up and down with respect to the apparatus main body 8 (supporting portion 1) when the screw rod 11 is rotated and screwed with respect to the female screw portion 12. It is configured.

  Further, the screw rod 11 is provided with a sprocket 13, and on the other hand, a sprocket 13 is also provided on an elevating drive motor 14 as an elevating drive source provided at an upper portion in the apparatus main body 8. The sprocket 13 of the motor 14 is connected by a chain 15. Therefore, the rotational driving force of the elevating drive motor 14 is transmitted to the screw rod 11 through the chain 15, and the base plate 9 (polishing body 2) moves up and down.

  In this embodiment, when the polishing body 2 is moved up or down with respect to the support portion 1 via the lifting mechanism 4, the polishing surface 3 at the lower end of the polishing body 2 is positioned at a preset reference position P1. When the reference position detecting means 5 for detecting that the polishing position is detected, and when the reference position detecting means 5 detects the polishing surface 3 of the polishing body 2 located at the reference position P1, the polishing body 2 is set in advance from the reference position P1. A controller for driving and controlling the elevating mechanism 4 is provided so that the polishing surface 3 of the polishing body 2 is positioned at the workpiece polishing position P2 by being moved up or down by the amount of movement L.

  Specifically, the reference position detection means 5 of the present embodiment employs a photoelectric sensor 5 that can detect the polishing surface 3 in a non-contact manner with respect to the polishing body 2, and this photoelectric sensor 5 is used as the support portion 1. Provided at a position higher than the upper surface of the workpiece W placed or fixed, the reference surface detection means 5 moves the polishing surface 3 of the polishing body 2 that moves up via the elevating mechanism 4 above the upper surface of the workpiece W. It is configured so that it can be detected at the reference position P1.

  In other words, in this embodiment, when the polishing body 2 is moved upward with respect to the support portion 1 via the lifting mechanism 4, the photoelectric sensor 5 is brought into the reference position P1 where the polishing surface 3 at the lower end of the polishing body 2 is set in advance. In this case, the controller detects that the polishing body 2 is moved downward from the reference position P1 by the predetermined movement amount L, and the polishing surface 3 of the polishing body 2 is positioned at the workpiece polishing position P2. Thus, the elevating mechanism 4 is driven and controlled.

  More specifically, the photoelectric sensor 5 employs a highly reliable transmission type optical fiber sensor 5 capable of stable detection even in a dust scattering environment during deburring, and a transmitter 5A and a receiver of the optical fiber sensor 5 are used. 5B is fixed to both outer positions in the direction orthogonal to the transfer direction of the support portion 1 (belt conveyor 7), and the polishing surface of the polishing body 2 is controlled by the amount of light that the polishing body 2 blocks the signal light from the transmitter 5A. 3 is detected, and this detection signal is transmitted to the control unit.

  The control unit (not shown) of the present embodiment is provided in the apparatus main body 8, but may be provided at a position remote from the apparatus main body 8.

  When the control unit receives the movement amount storage means for storing the movement amount L of the polishing body 2 from the reference position P1 to the workpiece polishing position P2, and the detection signal from the reference position detection means 5, the controller drives the lift. The motor 14 (elevating mechanism 4) is provided with drive signal transmission means for transmitting a drive signal of the movement amount L stored in the movement amount storage means. For example, a stepping motor is used as the elevation drive motor 14 so that the movement amount L is always a constant amount. Further, the movement amount L may always be a constant amount by performing control using an encoder (for example, a rotary encoder that reads the rotation of the sprocket 13) without using a stepping motor.

  Further, in this embodiment, the workpiece polishing position P2 of the polishing surface 3 of the polishing body 2 can be set and changed according to the height of the workpiece W, and the set value of the polishing position setting means Based on this, a movement amount setting means for automatically setting the movement amount L of the polishing body 2 from the reference position P1 to the workpiece polishing position P2 is provided in the control unit.

  Specifically, the workpiece polishing position P2 referred to in the present embodiment is set by the height of the polishing surface 3 from the support portion 1 (belt conveyor 7), and the polishing position setting means is the workpiece polishing position P2. An input device (not shown) for inputting a numerical value of (the set height H of the polishing surface 3) is provided.

  The moving amount setting means stores reference height storage means for storing the height of the reference position detection means 5 from the support portion 1 (height of the reference position P1), and stores the reference height storage means. The amount of movement L of the polishing body 2 from the reference position P1 to the workpiece polishing position P2 is calculated by subtracting the set value (set height H) of the polishing position setting means from the height of the reference position detecting means 5 thus determined. A calculation means for calculating, and a calculation signal calculated by the calculation means is stored in the movement amount storage means.

  Further, in this embodiment, the polishing surface of the polishing body 2 by the reference position detection means 5 is moved up by moving the polishing body 2 after a predetermined number of workpieces W have been polished or after a predetermined time has elapsed since the start of the polishing operation. Periodic driving means for driving and controlling the lifting mechanism 4 is provided in the control unit so that the reference position detection of 3 is performed.

  The periodic drive means includes a count means for counting the number of polishing of the workpiece W or counting an elapsed time from the start of the polishing operation, a periodic storage means for storing a preset number of polishing or elapsed time, and the periodic storage means. The stored polishing number or elapsed time is compared with the count signal output from the counting means, and when the count signal matches the stored number or storage time, the lift drive motor 14 (lifting mechanism 4) polishes. And a detection operation command transmission means for transmitting a drive signal for moving the body 2 upward.

  In addition, every time the polishing operation of one workpiece W is completed, the polishing body 2 is moved up and periodically driven so that the reference position of the polishing surface 3 of the polishing body 2 is detected by the reference position detecting means 5. Means may be configured.

  Further, in this embodiment, an unexpected workpiece detection means 6 for detecting a workpiece W having a height higher than a preset height is provided on the transfer start end side of the support portion 1 (belt conveyor 7). An emergency stop means for stopping the polishing operation when the detection means 6 detects the workpiece W is provided in the control unit.

  Specifically, the unexpected workpiece detection means 6 of this embodiment employs a reflective photoelectric sensor 6 that can detect the height of the workpiece W in a non-contact manner, and a transmitter / receiver 6A of the photoelectric sensor 6 is used. And the reflector 6B are provided at positions higher than the support portion 1 at both outer positions in the direction perpendicular to the transfer direction of the support portion 1 (belt conveyor 7). The signal hole reflected by 6B is detected by the work W being shielded from light, and this detection signal is transmitted to the emergency stop means.

  The unexpected work detection means 6 is provided so as to be movable up and down with respect to the support unit 1 (belt conveyor 7), and the height of the work W detected by the unexpected work detection means 6 can be set and changed. Yes.

  Specifically, a sensor mounting portion 16 is provided in the apparatus main body 8, and the transmitter / receiver 6 </ b> A of the photoelectric sensor 6 is mounted on the vertically long guide long window 17 provided in the sensor mounting portion 16. The receiver 6A is mounted so as to be driven up and down by an appropriate driving source using the guide long window 17 as a guide.

  That is, the unexpected work detection means 6 of the present embodiment is provided with only the transmitter / receiver 6A so as to be movable up and down, and the reflector 6B transmits the signal light regardless of the position of the transmitter / receiver 6A that moves up and down. A large reflective object is fixed.

  In this embodiment, the transmitter / receiver 6A is configured to automatically move up and down in synchronization with the change in the set height H of the polishing position setting means. Specifically, the position of the transmitter / receiver 6A is determined in advance by the set height H + predetermined value α (the predetermined value α is the height of the workpiece W that may be damaged when polished by the polishing body 2, for example. It is configured to automatically move up and down to a height position obtained by adding a predetermined value α to the set value (height H) input to the polishing position setting means. In addition, it is good also as a structure which the raising / lowering movement of the transmission / reception device 6A does not synchronize with the change of the setting height H of a grinding | polishing position setting means.

  The emergency stop means includes drive stop signal transmission means for transmitting a drive stop signal to the polishing drive motor 10 and the drive source of the belt conveyor 7 when receiving the detection signal from the unexpected work detection means 6. ing.

  Next, the operation of this embodiment will be described.

  The set height H is input to the polishing position setting means in advance, and the movement amount L of the polishing body 2 from the reference position P1 to the workpiece polishing position P2 is set in advance.

  When the workpiece W is placed and fixed on the belt conveyor 7 and the polishing body 2 is positioned at the workpiece polishing position P2 and the apparatus is driven, the workpieces W transferred by the belt conveyor 7 are successively polished on the polishing surface 3 of the polishing body 2. (See FIG. 3).

  While the polishing operation is continued, the polishing surface 3 of the polishing body 2 gradually wears (see FIG. 4), but after a predetermined number of workpieces W have been polished or for a predetermined time from the start of the polishing operation. After the elapse of time, the regular driving means drives and controls the elevating mechanism 4 to automatically move the polishing body 2 upward, and at this time, the reference position detection means 5 detects the reference position of the polishing surface 3 of the polishing body 2 ( (See FIG. 5).

  Then, in response to the detection signal of the reference position detecting means 5, the control unit moves the polishing body 2 downward from the reference position P1 by the movement amount L set in advance, and the polishing body 2 is moved. The elevating mechanism 4 is driven and controlled so that the polishing surface 3 is positioned at the workpiece polishing position P2 (see FIG. 6).

  That is, even if the polishing surface 3 of the polishing body 2 is worn, the worn polishing surface 3 is reset to a new reference position P1, and then the polishing body is moved by a preset amount L from the reference position P1. 2 is moved to the workpiece polishing position P2, the polishing body 2 at the workpiece polishing position P2 has a polishing surface 3 whose position is the same as the polishing surface 3 of the polishing body 2 at the workpiece polishing position P2 at the beginning of the polishing operation. It will be located in the same position, and the desired pressing force with respect to the workpiece | work W equivalent to the beginning of grinding | polishing can be implement | achieved automatically.

  Further, if a workpiece W that is too high and has a possibility of failure is transferred during the polishing operation, the workpiece W is detected by the unexpected workpiece detection means 6 on the transfer start end side of the transfer mechanism 7 and polished. The polishing operation is stopped before the polishing by the body 2 is performed (see FIG. 7).

  Note that the present invention is not limited to this embodiment, and the specific configuration of each component can be designed as appropriate.

DESCRIPTION OF SYMBOLS 1 Support part 2 Polishing body 3 Polishing surface 4 Lifting mechanism 5 Reference position detection means (photoelectric sensor)
6 Unexpected workpiece detection means 7 Transfer mechanism L Travel distance P1 Reference position P2 Work polishing position W Workpiece

Claims (5)

A support part for placing or fixing the work, a polishing body provided above the support part for polishing the work placed or fixed on the support part, and the polishing body according to the height of the work In a polishing apparatus provided with an elevating mechanism that can move up and down with respect to a support part, when the polishing body is moved up and down with respect to the support part 1 via the elevating mechanism, the polishing surface at the lower end of the polishing body is Reference position detection means for detecting that the position is set at a preset reference position, and when the reference position detection means detects the polishing surface of the polishing body located at the reference position, the polishing body is preset from the reference position. Yes was by the amount of movement is moved upward or downward movement and a control unit for the polishing surface of the polishing body is driving and controlling the lifting mechanism so as to be positioned in the workpiece polishing position, the more high-preset of the height An unexpected work detection means for detecting a workpiece to be detected, and an emergency stop means for stopping a polishing operation when the unexpected work detection means detects the work is provided in the control unit, and the support unit mounts the work. And a transfer mechanism that moves in a fixed or fixed manner, and provides the unexpected workpiece detection means on the transfer start end side of the transfer mechanism of the support portion, and the unexpected workpiece detection means is provided so as to be movable up and down relative to the support portion. A polishing apparatus characterized in that the height of the workpiece detected by the unexpected workpiece detection means can be set and changed .   Polishing position setting means capable of setting and changing the workpiece polishing position of the polishing surface of the polishing body according to the height of the workpiece, and the workpiece polishing position from the reference position based on the set value of the polishing position setting means The polishing apparatus according to claim 1, wherein a movement amount setting means for automatically setting the movement amount of the polishing body up to is provided in the control unit.   The reference position detection means is provided at a position higher than the upper surface of the work placed or fixed on the support portion, and the polishing surface of the polishing body on which the reference position detection means moves up and down via the lifting mechanism It is configured to be able to detect at the reference position above the upper surface, and when the reference position detecting means detects the polishing surface at the reference position, the control unit presets the polishing body from the reference position. 3. The structure according to claim 1, wherein the elevating mechanism is driven and controlled so that the polishing surface of the polishing body is positioned at the workpiece polishing position by being moved downward by the amount of movement. The polishing apparatus as described.   Polishing of the polishing body by the reference position detecting means by moving the polishing body up or down after the polishing work of one work, after the polishing work of a predetermined number of works, or after a predetermined time has elapsed since the start of the polishing work. The polishing apparatus according to claim 1, wherein a periodical drive unit that drives and controls the lifting mechanism is provided in the control unit so that a reference position of the surface is detected.   The polishing apparatus according to claim 1, wherein the reference position detection unit employs a photoelectric sensor capable of detecting the polishing surface in a non-contact manner with respect to the polishing body.

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