JP5557162B2 - Light emitting device and lighting apparatus - Google Patents

Description

  Embodiments described herein relate generally to a light-emitting device and a lighting fixture that use light-emitting elements such as LEDs.

  Recently, along with the high output, high efficiency, and widespread use of LEDs, lighting fixtures that can be used indoors or outdoors using LEDs as light sources have been developed. Such a lighting fixture is obtained by mounting a plurality of LEDs on a substrate to obtain a predetermined amount of light.

On the other hand, when a light emitting element such as an LED emits light, the light output decreases as the temperature increases, and the service life is shortened. For this reason, for lighting fixtures that use solid light emitting elements such as LEDs and EL elements as light sources, it is possible to suppress the temperature of the light emitting elements from rising in order to extend the service life or improve characteristics such as light emission efficiency. It is necessary.
2. Description of the Related Art Conventionally, there is a lighting fixture that uses an LED as a light source, in which adjacent metal plates that support the LED are arranged apart from each other.

JP 2008-124008 A

  However, the above-described conventional lighting fixtures are provided with a special metal plate, which increases the cost and may complicate the manufacturing process.

  The present invention has been made in view of the above problems, and this type of light-emitting element focuses on the fact that the temperature of the cathode-side electrode mainly increases during light emission, and effectively utilizes the wiring pattern layer to produce a light-emitting element. It aims at providing the light-emitting device and lighting fixture which can suppress the temperature rise of this.

A light-emitting device according to an embodiment of the present invention includes a substrate formed in a substantially circle shape, and a plurality of rows arranged along the circumferential direction on the substrate, and an anode-side electrode and a cathode-side electrode are radially arranged. And a plurality of light emitting elements mounted on the surface of the substrate, the light emitting elements being mounted so that a separation distance between adjacent rows is larger than a separation distance between adjacent rows in the same row, and the light emission And a wiring pattern layer in which a region to which the cathode side electrode is connected is formed wider than a region to which the anode side electrode in the device is connected.

  According to the embodiment of the present invention, it is possible to provide a light emitting device and a lighting fixture that can effectively suppress the temperature rise of the light emitting element by effectively using the wiring pattern layer.

It is a perspective view which shows the lighting fixture which concerns on embodiment of this invention. It is a disassembled perspective view which shows the same lighting fixture. It is a schematic top view which removes a cover member and a lighting device cover in the same lighting fixture, and shows it from below. It is sectional drawing which shows the same lighting fixture. It is an enlarged view which shows the range enclosed with the dotted line in FIG. It is a top view which shows the board | substrate in the same lighting fixture. It is a top view which shows the same board | substrate. It is a top view which shows the wiring pattern layer of the board | substrate. It is a top view which shows the state which formed the reflection layer in the board | substrate. It is a top view which shows the positional relationship of a light emitting element in FIG. It is the elements on larger scale in FIG. It is a top view which shows the positional relationship of a light emitting element in FIG. It is a connection diagram which shows the connection state of a light emitting element. It is sectional drawing which shows the attachment completion state to the ceiling surface of the lighting fixture.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. In each drawing, the wiring connection relationship using lead wires or the like may be omitted. In addition, the same code | symbol is attached | subjected to the same part and the overlapping description is abbreviate | omitted.

  The lighting fixture of this embodiment is for a general house that is used by being attached to a hanging sealing body as a wiring fixture installed on the fixture mounting surface, and has a plurality of light emitting elements mounted on a substrate. Indoor lighting is performed by light emitted from the apparatus.

  1 to 4, the lighting fixture includes a fixture body 1, a light emitting device 2, a diffusion member 3, a lighting device 4, a lighting device cover 5, a mounting portion 6, and a cover member 7. . Moreover, the adapter A electrically and mechanically connected to the hooking sealing body Cb installed in the ceiling surface C as an instrument mounting surface is provided. Such a lighting fixture is formed in a round and circular appearance, and the front side is a light irradiation surface and the back side is a mounting surface to the ceiling surface C.

  As shown in FIGS. 2 to 5, the main body 1 is a chassis formed in a circular shape from a flat plate of a metal material such as a cold-rolled steel plate, and is provided with a mounting portion 6 to be described later at a substantially central portion. The circular opening 11 is formed. Further, on the outer peripheral side of the flat portion 12 on the inner surface side to which the light emitting device 2 is attached, a stepped portion 13 is formed toward the back surface to form a bowl-shaped concave portion 14. A cover receiving member to which the cover member 7 is detachably attached is disposed at the step portion 13. More specifically, the cover receiving member is a cover metal fitting 75, and is arranged in the concave portion 14 formed by the stepped portion 13. Further, lighting fixture mounting spring members 15 are provided at four locations on the back side of the main body 1. The spring member 15 is made of metal such as stainless steel, and is formed by bending a substantially rectangular plate spring.

  2 to 6, the light emitting device 2 includes a substrate 21 and a plurality of light emitting elements 22 mounted on the substrate 21 (illustration of the light emitting elements 22 is omitted in FIG. 2). ) The substrate 21 is disposed so that four arc-shaped substrates 21 having a predetermined width dimension are connected to each other, and is formed in a substantially circle shape as a whole. That is, the substrate 21 formed in a substantially circle shape as a whole is composed of four divided substrates 21.

  By using the substrate 21 thus divided, it is possible to suppress the deformation of the substrate 21 by absorbing thermal contraction at the divided portion of the substrate 21. In addition, although it is preferable to use the board | substrate 21 divided | segmented into plurality, you may make it use the board | substrate of 1 sheet integrally formed in the substantially circle shape.

  The board | substrate 21 consists of a flat plate of the glass epoxy resin which is an insulating material, and the wiring pattern is formed with the copper foil on the surface side. Further, a white resist layer acting as a reflective layer is applied on the wiring pattern, that is, on the surface of the substrate 21. The material of the substrate 21 can be a ceramic material or a synthetic resin material when an insulating material is used. Furthermore, when it is made of metal, a metal base substrate in which an insulating layer is laminated on one surface of a base plate having good thermal conductivity such as aluminum and excellent heat dissipation can be applied.

The light emitting element 22 is an LED, which is a surface mount type LED package. A plurality of LED packages are arranged along the circumferential direction of a plurality of circle-shaped substrates 21, that is, in a plurality of rows on a substantially circumference centered on the mounting portion 6, and in this embodiment, two rows on the inner peripheral side and the outer peripheral side. Has been implemented. In addition, the LED package has a light emission color of daylight white N and a light bulb color L, which are alternately or mixedly arranged, and the adjacent light emitting elements 22 in each column are predetermined. Are arranged at intervals.
Furthermore, the light emitting elements are mounted such that the separation distance between adjacent rows is larger than the separation distance between adjacent rows in the same row.

A light emitting element 22a for nightlight is mounted on a specific substrate 21A (right side in FIGS. 3 and 6). For the light emitting element 22a, an LED package having the same specifications as the light bulb color of the main light source mounted in a circle is used. Thereby, the common use of the member is achieved.

Note that the number and the number of columns of the light emitting elements 22 can be appropriately set according to a desired output.

  The LED package is roughly composed of an LED chip disposed in a main body formed of ceramics or synthetic resin, and a translucent resin for molding such as epoxy resin or silicone resin that seals the LED chip. It is configured. The LED chip is a blue LED chip that emits blue light. The translucent resin is mixed with a phosphor so that daylight white or light bulb color light can be emitted. The main body is provided with an anode side electrode and a cathode side electrode connected to the LED chip.

  Next, the configuration of the light emitting device 2 will be described in detail with reference to FIGS. 7 to 13. 7 to 10 show one of the divided substrates 21, and FIGS. 11 and 12 show a partially enlarged state.

First, in FIG. 7, the substrate 21 is formed by laminating a wiring pattern layer 21a on an insulating surface, and further laminating a reflective layer 21b thereon. A plurality of surface-mount type LED packages, which are light emitting elements 22, are mounted on the substrate 21 over two rows. The external shape of the LED package is a substantially rectangular parallelepiped shape, and an anode side electrode Ae is provided on one short side, and a cathode side electrode Ce is provided on the other short side. . Further, the anode side electrode and the cathode side electrode are arranged in the radial direction. For the sake of explanation, the short side of the cathode-side electrode Ce is indicated by a bold line.

  FIG. 8 shows the wiring pattern layer 21 a on the substrate 21. The wiring pattern layer 21a has a copper foil pattern formed by etching, and is formed so as to cover substantially the entire surface of the substrate 21.

  The wiring pattern layer 21a is divided into a plurality of blocks corresponding to the number of mounted light emitting elements 22 by a linear insulating region i, and the anode side electrode Ae and the cathode side electrode Ce of the light emitting element 22 are arranged between the blocks. Are connected across a relatively narrow linear insulating region i.

  The wiring pattern layer 21 a is an electrical conduction path that supplies electric power to the light emitting element 22, and has a function as a heat spreader that diffuses heat generated from the light emitting element 22.

  FIG. 9 shows a state in which the reflective layer 21b is formed on the wiring pattern layer 21a in the substrate 21. The reflective layer 21b is formed over substantially the entire surface except for the portion where each light emitting element 22 is mounted and the electrodes Ae and Ce are connected and the portion where the connector is connected. That is, the wiring pattern layer 21a is exposed on the surface of the portion where each light emitting element 22 is mounted and the electrodes Ae and Ce are connected and the portion where the connector is connected.

  Specifically, the reflective layer 21b is formed using a white photo solder type resist ink material, and is a white resist layer having a good light reflectance. This resist layer has a thickness of about 40 μm.

  FIG. 10 shows a state in which the reflective layer 21b is formed on the wiring pattern layer 21a, that is, the wiring pattern layer 21a corresponding to the portion where the anode-side electrode Ae and the cathode-side electrode Ce of the light emitting element 22 are connected. In order to show the positional relationship with the light emitting element 22 in a state where the surface of the light emitting element 22 is exposed, only a part (two) of the light emitting elements 22 are mounted for explanation.

  Next, FIG. 11 shows an enlarged part of the wiring pattern layer 21a, and FIG. 12 shows the positional relationship when the light emitting element 22 (shown by a dotted line) is mounted on the wiring pattern layer 21a. ing.

  As shown in FIG. 12, the anode-side electrode Ae and the cathode-side electrode Ce of the light-emitting element 22 straddle a relatively narrow linear insulating region i between a plurality of blocks partitioned by the linear insulating region i. Are connected to the wiring pattern layer 21a by soldering.

  More specifically, the area Sc on the wiring pattern layer 21a side to which the cathode electrode Ce is connected is larger than the area Sa on the wiring pattern layer 21a side to which the anode electrode Ae of the light emitting element 22 is connected. It is formed as follows. That is, it is formed so that Sa <Sc.

  In this type, the light-emitting element 22 generates heat mainly on the cathode side during light emission, and the temperature of the cathode-side electrode Ce increases. Therefore, by widening the region Sc on the side of the wiring pattern layer 21a to which the cathode-side electrode Ce is connected, the generated heat is effectively diffused over a wide area and dissipated to suppress the temperature rise of the light emitting element 22. It becomes possible to do.

  The region Sc on the wiring pattern layer 21a side to which the anode-side electrode Ae of the light emitting element 22 is connected and the region Sc on the wiring pattern layer 21a side to which the cathode-side electrode Ce is connected are wide. If it can form in this way, the shape etc. will not be exceptionally limited.

  FIG. 13 shows a connection state of each light emitting element 22 on one substrate 21. Specifically, a series circuit in which six light emitting elements 22 are connected in series is composed of two lines connected in parallel. Therefore, a total of 48 light emitting elements 22 are connected. In addition, these series circuits are divided into a white light emitting element group and a light bulb colored light emitting element group. That is, no daylight white and light bulb-colored light emitting elements 22 are mixed in one series circuit. Furthermore, the end portions of the two lines are connected to the connector Cn, and can be connected to the connector of the adjacent substrate 21 or the connector on the power source side.

  The diffusing member 3 is a lens member, and is made of, for example, a transparent synthetic resin having an insulating property such as polycarbonate or acrylic resin as shown in FIG. 5, and has a substantially circular shape along the arrangement of the light emitting elements 22. And is disposed so as to cover the entire surface of the substrate 21 including the light emitting element 22.

In addition, the lens member has two ridges in the circumferential direction facing the light emitting element 22 on the substantially circular inner peripheral side portion and outer peripheral side portion, and a continuous ridge portion 31 having a constant cross-sectional shape is continuous. Is formed. A U-shaped groove 32 is continuously formed along the circumferential direction inside the protruding portion 31. Therefore, the U-shaped groove 32 is arranged to face the plurality of light-emitting elements 22, and the plurality of light-emitting elements 22 are accommodated and covered in the U-shaped groove 32. It is in a state.
Further, a flat portion 33 extending in the width direction is formed from the protruding portions 31 so that the entire surface of the substrate 21 is covered.

  According to the lens member configured as described above, the light emitted from the plurality of light emitting elements 22 is diffused and radiated mainly by the protrusions 31 in the inner circumferential direction and the outer circumferential direction on the circumference. That is, the light emitted from the light emitting element 22 is mainly diffused and emitted in the radial direction with the circle-shaped center where the light emitting element 22 is disposed as the origin.

Therefore, it is possible to improve the uniformity of the irradiation light by the light emitted from the plurality of light emitting elements 22 by the lens member. Further, the graininess due to the luminance of each light emitting element 22 can be suppressed.
Moreover, since the flat part 33 is formed in the diffusing member 3 so as to cover the entire surface of the substrate 21, the charging part is covered and protected by the diffusing member 3.

Note that the diffusing member 3 may not be integrally formed in a substantially circle shape. For example, corresponding to the divided substrates 21, the substrates 21 may be divided and formed. In this case, the plurality of light emitting elements 22 mounted on one substrate 21 are continuously covered with the diffusing member 3.
Further, the diffusion member 3 is not limited to a lens member, and a diffusion sheet or the like may be applied.

  In the light emitting device 2 configured as described above, as representatively shown in FIGS. 4 and 5, the substrate 21 is positioned around the mounting portion 6, and the mounting surface of the light emitting element 22 is the front side, that is, It is arranged so as to face the lower irradiation direction. Further, the substrate 21 is attached in surface contact so that the back surface side of the substrate 21 is in close contact with the flat portion 12 on the inner surface side of the body 1. Specifically, the diffusing member 3 is overlapped from the front side of the substrate 21, and the diffusing member 3 is attached to the main body 1 by a fixing means such as a screw S, so that the substrate 21 is connected to the main body 1 and the diffusing member 3. It is sandwiched between and pressed and fixed. That is, the substrate 21 and the diffusing member 3 are fastened together by one screw S.

  Accordingly, the substrate 21 is thermally coupled to the main body 1 so that heat from the substrate 21 is conducted from the back surface side to the main body 1 and radiated. The surface contact between the substrate 21 and the main body 1 is not limited to the case where the entire surface of the substrate 21 is in contact with the main body 1. It may be a partial surface contact.

  In addition, since the flat portion 33 of the diffusion member 3 is in surface contact with the mounting surface side of the substrate 21, heat is transmitted from the mounting surface side of the substrate 21 to the diffusion member 3 and passes through the diffusion member 3. Heat can be dissipated. That is, heat can be radiated from the front side of the substrate 21.

As shown in FIGS. 2 to 4, the lighting device 4 includes a circuit board 41 and circuit components 42 such as a control IC, a transformer, and a capacitor mounted on the circuit board 41. The circuit board 41 is formed in a substantially arc shape so as to surround the periphery of the mounting portion 6, and the adapter A side is electrically connected, and is connected to a commercial AC power source via the adapter A. Accordingly, the lighting device 4 receives this AC power supply, generates a DC output, supplies the DC output to the light emitting element 22 via the lead wire, and controls the light emitting element 22 to be turned on.
Such a lighting device 4 is disposed between the mounting portion 6 and the light emitting device 2, that is, the substrate 21.

  As shown in FIGS. 2 and 4, the lighting device cover 5 is formed in a substantially short cylindrical shape by a metal material such as a cold-rolled steel plate and is attached to the main body 1 so as to cover the lighting device 4. The side wall 51 is inclined so as to expand toward the back side, and an opening 53 is formed in the front wall 52 so as to correspond to the attachment portion 6. Therefore, a part of the light emitted from the light emitting element 22 is reflected to the front side by the side wall 51 and effectively used. In addition, an arcuate guide recess 54 that is recessed toward the back surface is formed at the periphery of the opening 53.

  The attachment portion 6 is an adapter guide formed in a substantially cylindrical shape, and an engagement port 61 through which the adapter A is inserted and engaged is provided at the center portion of the adapter guide. The adapter guide is disposed corresponding to the opening 11 formed in the central portion of the main body 1. A base is formed on the outer periphery of the adapter guide so as to protrude from the outer periphery, and an electrical auxiliary component 62 such as an infrared remote control signal receiver or an illuminance sensor is disposed on the base. .

  Note that the attachment portion 6 is not necessarily a member referred to as an adapter guide or the like. For example, it may be an opening formed in the main body 1 or the like, and in essence, it means a member or a part that is opposed to the hooking sealing body Cb as a wiring device and to which the adapter A is engaged.

  The cover member 7 is formed in a substantially circular shape from a translucent material such as an acrylic resin, and has a milky white diffusibility, and has a non-translucent circular decorative cover 71 in the center. Is installed. The decorative cover 71 is formed with a light receiving window 72 having a substantially triangular translucency so as to face the electrical auxiliary component 62. Further, a projecting pin 73 projecting in the inner surface direction is formed near the center of the cover member 7 on the inner surface side.

  The cover member 7 is detachably attached to the outer peripheral edge of the main body 1 so as to cover the front side of the main body 1 including the light emitting device 2. Specifically, by rotating the cover member 7, the cover mounting bracket 74 provided on the cover member 7 is engaged with the cover receiving bracket 75 disposed in the recess 14 in the step portion 13 on the outer peripheral portion of the main body 1. Can be installed by joining. Further, when removing the cover member 7, the cover member 7 can be removed by rotating the cover member 7 in a direction opposite to that at the time of attachment and releasing the engagement between the cover attachment fitting 74 and the cover receiving fitting 75.

  Thus, in the state where the cover member 7 is attached to the main body 1, as shown mainly in FIG. 5, the inner surface side of the cover member 7 comes into surface contact with the front wall 52 of the lighting device cover 5. Therefore, heat generated from the lighting device 4 or the like can be conducted to the lighting device cover 5 and further conducted to the cover member 7 to promote heat dissipation.

  Here, the cover member 7 is rotated and attached to the main body 1. However, it is necessary to align the position of the light receiving window 72 so as to face the electrical auxiliary component 62. For this reason, in this embodiment, although detailed description is abbreviate | omitted, the position control means is comprised by the protrusion pin 73 formed in the cover member 7 side, and the guide recessed part 54 formed in the lighting device cover 5. FIG. . By this position restricting means, the light receiving window 72 is positioned to face the electrical auxiliary component 62, and for example, the infrared remote control signal receiving unit can receive a control signal from the infrared remote control transmitter.

  The adapter A is electrically and mechanically connected to a hooking sealing body Cb installed on the ceiling surface C by a hooking blade provided on the upper surface side, and has a substantially cylindrical shape. Is provided so that it always protrudes to the outer peripheral side by a built-in spring. The locking portion A1 is immersed by operating a lever provided on the lower surface side. Further, a power cord for connecting to the lighting device 4 is led out from the adapter A, and is connected to the lighting device 4 via a connector (see FIG. 3).

  Next, the attachment state to the ceiling surface C of a lighting fixture is demonstrated with reference to FIG. First, the adapter A is electrically and mechanically connected to the hanging sealing body Cb installed on the ceiling surface C in advance. From this state, the fixture body 1 is mounted on the lighting fixture until the engaging portion 61 of the adapter A is securely engaged with the engaging port 61 of the adapter guide while the engaging portion 61 of the adapter guide as the mounting portion 6 is aligned with the adapter A. The mounting operation is performed by manually pushing up from the lower side against the elastic force of the spring member 15.

  Next, the cover member 7 is attached to the main body 1. This is attached by rotating the cover member 7 to engage the cover mounting bracket 74 provided on the cover member 7 with the cover receiving bracket 75 of the main body 1.

  Further, when removing the luminaire, it can be removed by removing the cover member 7 and operating the lever provided on the adapter A to disengage the engaging portion A1 of the adapter A.

When power is supplied to the lighting device 4 in a state where the lighting fixture is attached to the ceiling surface C, the anode side electrode Ae and the cathode side electrode Ce of each light emitting element 22 are energized through the wiring pattern layer 21a of the substrate 21. Each light emitting element 22 lights up. The light emitted from the light emitting element 22 is diffused in the radial direction by the diffusion member 3 that continuously covers the plurality of light emitting elements 22 and is emitted to the front side. The light emitted to the front side is diffused and transmitted by the cover member 7 and irradiated outward. Therefore, it is possible to improve the uniformity of the irradiated light and to suppress the graininess due to the brightness of each light emitting element 22.
Further, a part of the light traveling toward the inner peripheral side in the radial direction is reflected to the front side by the inclined side wall 51 in the lighting device cover 5 and is effectively used.

  On the other hand, the heat generated from the light emitting element 22 is diffused and dissipated by the region Sc formed in a wide area on the wiring pattern layer 21a side to which the cathode-side electrode Ce is connected.

  Further, since the back surface side of the substrate 21 is thermally coupled to the main body 1, it is effectively conducted to the main body 1 and is radiated in a wide area of the main body 1. Further, since the step portion 13 is located along the outer periphery of the substrate 21 in the vicinity of the outer peripheral side of the substrate 21, the heat radiation area can be increased by the step portion 13, and the heat dissipation effect at the outer peripheral portion of the main body 1. Can be increased.

  Since the lighting device 4 is disposed between the mounting portion 6 and the substrate 21, the lighting device 4 can be reduced from being thermally affected by the substrate 21. This is because the heat of the substrate 21 is conducted toward the outer peripheral direction of the main body 1 and tends to be radiated.

  Further, since the cover member 7 comes into surface contact with the lighting device cover 5, heat generated from the lighting device 4 is conducted to the lighting device cover 5 and further conducted to the cover member 7 for heat dissipation. Can do.

In addition, since the flat portion 33 of the diffusing member 3 is in surface contact with the mounting surface side of the substrate 21, heat can be radiated from the mounting surface side of the substrate 21 through the diffusing member 3 and also from the front surface side. Become. Further, in this case, since the diffusing member 3 covers the entire surface of the substrate 21, the charging unit is protected.
As described above, according to the present embodiment, it is possible to provide a light emitting device and a lighting fixture that can effectively suppress the temperature increase of the light emitting element by effectively using the wiring pattern layer.

  The present invention is not limited to the configuration of each of the embodiments described above, and various modifications can be made without departing from the spirit of the invention. For example, for example, a solid-state light-emitting element such as an LED or an organic EL can be applied as the light-emitting element. In this case, the number of light-emitting elements is not particularly limited. Moreover, as a lighting fixture, it is applicable to the various lighting fixtures, a display apparatus, etc. which are used indoors or outdoors.

DESCRIPTION OF SYMBOLS 1 ... Instrument main body, 2 ... Light-emitting device, 3 ... Diffusing member (lens member),
4 ... lighting device, 5 ... lighting device cover, 6 ... mounting part (adapter guide),
7 ... cover member, 21 ... substrate, 21a ... wiring pattern layer,
22 ... Light emitting element (LED), Ae ... Anode side electrode,
Sa ... Area to which the anode side electrode is connected, Ce ... Cathode side electrode,
Sc: region where cathode side electrode is connected, A: adapter,
C ... fixture mounting surface (ceiling surface), Cb ... wiring fixture (hook ceiling body)

Claims (2)

A substrate formed in a substantially circle shape;
The substrate is arranged in a plurality of rows along the circumferential direction, and the anode-side electrode and the cathode-side electrode are arranged in the radial direction, and are adjacent to each other in an adjacent separation distance of the same row. A plurality of light emitting elements mounted so as to increase the separation distance ;
A wiring pattern layer formed on the surface of the substrate and having a region to which a cathode-side electrode is connected wider than a region to which an anode-side electrode in the light-emitting element is connected;
A light-emitting device comprising: An instrument body;
The light-emitting device according to claim 1 disposed on the instrument body;
The lighting fixture characterized by comprising.

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