JP5542851B2 - Photosensitive resin composition, method for producing cured film, cured film, organic EL display device and liquid crystal display device - Google Patents

Description

The present invention relates to a photosensitive resin composition. In particular, the present invention relates to a chemically amplified positive photosensitive resin composition. The present invention also relates to a method for producing a cured film using the photosensitive resin composition, a cured film obtained by curing the photosensitive composition, and various image display devices using the cured film.
More specifically, a positive photosensitive resin composition suitable for forming a flattening film, a protective film, and an interlayer insulating film of electronic components such as a liquid crystal display device, an organic EL display device, an integrated circuit element, and a solid-state imaging device, and the same The present invention relates to a method for producing a cured film using the above.

  An organic EL display device, a liquid crystal display device, and the like are provided with an interlayer insulating film from the viewpoint of improving luminance and reducing power consumption. In forming the interlayer insulating film, photosensitive resin compositions are widely used because the number of steps for obtaining a required pattern shape is small and sufficient flatness is obtained.

  Here, the interlayer dielectric film patterned using the photosensitive resin composition as described above is required to have a low relative dielectric constant. In recent years, in order to produce organic EL display devices and liquid crystal display devices with high productivity, high sensitivity of the photosensitive resin composition is required.

  Conventionally, as an interlayer insulating film having a low relative dielectric constant, Patent Document 1 in which a (fluorinated) hydrocarbon group is introduced into a main binder is known. Further, as a highly sensitive photosensitive resin composition, for example, Patent Document 2 using a binder having an acetal structure or a ketal structure is known. However, these compositions cannot achieve both sensitivity and relative dielectric constant performance.

Japanese Patent Laid-Open No. 10-026829 JP2011-221494A

  The object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a photosensitive resin composition excellent in both sensitivity and relative dielectric constant.

As a result of intensive studies to solve the above problems by the present inventors, the photosensitive resin composition has at least one of a hydroxyphenyl group, a hydroxyalkyl group, an epoxy group, and an acid anhydride group, and has a molecular weight. It has been found that the above-mentioned problems can be solved by adding a fluorine-containing compound that is 100 to 1000, and the present invention has been completed.
As described above, it is known that a low dielectric constant can be achieved by including fluorine in the binder component of the photosensitive composition. However, as a result of studies by the present inventors, it has been found that even a compound containing a fluorine atom tends to lower the sensitivity in the case of a polymer compound. Moreover, even if it is a low molecular weight compound, high sensitivity and a dielectric constant are not necessarily achieved, and it has been found that the above problem can be solved only in the case of a specific compound that is a hydrophilic compound.

（式中、Ｒ¹およびＲ²は、それぞれ、水素原子、アルキル基またはアリール基を表し、少なくともＲ¹およびＲ²のいずれか一方がアルキル基またはアリール基であり、Ｒ³は、アルキル基またはアリール基を表し、Ｒ¹またはＲ²と、Ｒ³とが連結して環状エーテルを形成してもよく、Ｒ⁴は、水素原子またはメチル基を表し、Ｘは単結合またはアリーレン基を表す。）
＜７＞上記架橋性基が、エポキシ基、オキセタン基、−ＮＨ−ＣＨ₂−ＯＲ（Ｒは炭素数１〜２０のアルキル基）から選ばれる少なくとも１種である＜１＞〜＜６＞のいずれかに記載の感光性樹脂組成物。
＜８＞上記感光性樹脂組成物が、化学増幅型ポジ型感光性樹脂組成物である、＜１＞〜＜７＞のいずれかに記載の感光性樹脂組成物。
＜９＞上記（Ｂ）酸発生剤が、オキシムスルホネート化合物またはオニウム塩化合物である、＜１＞〜＜８＞のいずれかに記載の感光性樹脂組成物。
＜１０＞（１）＜１＞〜＜９＞のいずれかに記載の感光性樹脂組成物を基板上に適用する工程、
（２）適用された感光性樹脂組成物から溶剤を除去する工程、
（３）活性放射線で露光する工程、
（４）水性現像液で現像する工程、および、
（５）熱硬化するポストベーク工程、を含むことを特徴とする硬化膜の製造方法。
＜１１＞上記現像工程後、ポストベーク工程前に、全面露光する工程を含む、＜１０＞に記載の硬化膜の製造方法。
＜１２＞上記基板が金属基板である、＜１０＞または＜１１＞に記載の硬化膜の製造方法。
＜１３＞＜１＞〜＜９＞のいずれかに記載の感光性樹脂組成物を硬化してなる硬化膜。
＜１４＞層間絶縁膜である、＜１３＞に記載の硬化膜。
＜１５＞＜１３＞または＜１４＞に記載の硬化膜を有する、液晶表示装置または有機ＥＬ表示装置。 Specifically, the above-mentioned problem has been solved by the following means <1>, preferably <2> to <15>.
<1> (A) a polymer component that satisfies at least one of the following (1) and (2):
(1) (a1) a structural unit having a residue in which an acid group is protected with an acid-decomposable group, and (a2) a polymer having a structural unit having a crosslinkable group,
(2) (a1) a polymer having a structural unit having a residue in which an acid group is protected with an acid-decomposable group, and (a2) a polymer having a structural unit having a crosslinkable group,
(B) a photoacid generator,
(C) a fluorine-containing compound, and
(D) a photosensitive resin composition containing a solvent,
The photosensitive resin composition in which the (C) fluorine-containing compound has at least one of a hydroxyphenyl group, a hydroxyalkyl group, an epoxy group, and an acid anhydride group, and has a molecular weight of 100 to 1,000.
<2> The photosensitive resin composition according to <1>, wherein the number of carbons substituted with fluorine atoms in the (C) fluorine-containing compound is 2 to 6.
<3> The photosensitive resin composition according to <1>, wherein the number of carbon atoms substituted with fluorine atoms in the (C) fluorine-containing compound is 2 to 4.
<4> The photosensitive resin composition according to any one of <1> to <3>, wherein the (C) fluorine-containing compound contains two or more hydroxyphenyl groups, hydroxyalkyl groups, epoxy groups, or acid anhydride groups. .
<5> The photosensitive resin composition according to any one of <1> to <4>, wherein the structural unit (a1) is a structural unit having a residue in which a carboxy group is protected in the form of an acetal.
<6> The photosensitive resin composition according to any one of <1> to <4>, wherein the structural unit (a1) is a structural unit represented by the following formula (A2 ′).
Formula (A2 ′)

(Wherein R ¹ and R ² each represent a hydrogen atom, an alkyl group or an aryl group, at least ^one of R ¹ and R ² is an alkyl group or an aryl group, and R ³ is an alkyl group or Represents an aryl group, R ¹ or R ² and R ³ may be linked to form a cyclic ether, R ⁴ represents a hydrogen atom or a methyl group, and X represents a single bond or an arylene group; )
<7> The crosslinkable group is at least one selected from an epoxy group, an oxetane group, and —NH—CH ₂ —OR (where R is an alkyl group having 1 to 20 carbon atoms). The photosensitive resin composition in any one.
<8> The photosensitive resin composition according to any one of <1> to <7>, wherein the photosensitive resin composition is a chemically amplified positive photosensitive resin composition.
<9> The photosensitive resin composition according to any one of <1> to <8>, wherein the acid generator (B) is an oxime sulfonate compound or an onium salt compound.
<10> (1) A step of applying the photosensitive resin composition according to any one of <1> to <9> on a substrate,
(2) a step of removing the solvent from the applied photosensitive resin composition;
(3) a step of exposing with actinic radiation,
(4) a step of developing with an aqueous developer, and
(5) A method for producing a cured film, comprising a post-baking step of thermosetting.
<11> The method for producing a cured film according to <10>, including a step of exposing the entire surface after the development step and before the post-bake step.
<12> The method for producing a cured film according to <10> or <11>, wherein the substrate is a metal substrate.
<13> A cured film obtained by curing the photosensitive resin composition according to any one of <1> to <9>.
<14> The cured film according to <13>, which is an interlayer insulating film.
<15> A liquid crystal display device or an organic EL display device having the cured film according to <13> or <14>.

  According to the present invention, a photosensitive resin composition excellent in both sensitivity and relative dielectric constant can be provided.

1 shows a conceptual diagram of a configuration of an example of an organic EL display device. A schematic cross-sectional view of a substrate in a bottom emission type organic EL display device is shown, and a planarizing film 4 is provided. 1 is a conceptual diagram of a configuration of an example of a liquid crystal display device. The schematic sectional drawing of the active matrix substrate in a liquid crystal display device is shown, and it has the cured film 17 which is an interlayer insulation film.

  Hereinafter, the contents of the present invention will be described in detail. The description of the constituent elements described below may be made based on typical embodiments of the present invention, but the present invention is not limited to such embodiments. In the present specification, “to” is used to mean that the numerical values described before and after it are included as a lower limit value and an upper limit value.

[Photosensitive resin composition]
The photosensitive resin composition of the present invention comprises ((A) a polymer component that satisfies at least one of the following (1) and (2), (B) a photoacid generator, (C) a fluorine-containing compound, and (D) a solvent. The (C) fluorine-containing compound has at least one of a hydroxyphenyl group, a hydroxyalkyl group, an epoxy group, and an acid anhydride group, and has a molecular weight of 100 to 1000. It is characterized by being.
(1) (a1) a structural unit having a residue in which an acid group is protected with an acid-decomposable group, and (a2) a polymer having a structural unit having a crosslinkable group,
(2) (a1) a polymer having a structural unit having a residue whose acid group is protected by an acid-decomposable group, and (a2) a polymer having a structural unit having a crosslinkable group

The photosensitive resin composition of the present invention is a positive photosensitive resin composition. The photosensitive resin composition of the present invention is preferably a chemically amplified positive photosensitive resin composition (chemically amplified positive photosensitive resin composition).
Hereinafter, the preferable aspect of each component is demonstrated in order about the photosensitive resin composition of this invention.

<(A) component>
The photosensitive resin composition of this invention contains the polymer component which satisfy | fills at least one of (A) following (1) and (2) as (A) component.
(1) (a1) a structural unit having a residue in which an acid group is protected with an acid-decomposable group, and (a2) a polymer having a structural unit having a crosslinkable group,
(2) (a1) a polymer having a structural unit having a residue in which an acid group is protected by an acid-decomposable group, and (a2) a polymer having a structural unit having a crosslinkable group. In the embodiment of the present invention, the polymer comprises at least one polymer, the polymer comprising (a1) a structural unit having a residue in which an acid group is protected with an acid-decomposable group, and (a2) a structural unit having a crosslinkable group. It is the aspect which has. Such a polymer may further contain other repeating units. Each of the structural unit (a1) and the structural unit (a2) may include two or more types.
In the aspect (2), at least two types of polymers are included, at least one of the polymers has the structural unit (a1), and at least one other type of the polymer is the structural unit (a2). ).
Furthermore, in the aspect of (2), the polymer containing the structural unit (a1) may further contain the structural unit (a2) and other structural units. Similarly, the polymer containing the structural unit (a2) may contain the structural unit (a1) or another structural unit. In such a case, the aspect satisfies both (1) and (2). In the present specification, the term “component A” refers to any of the above polymer components without particular notice.

As a preferred first embodiment of the present invention, the component (A) contains two or more types of polymers, and at least one of the polymers has a residue in which at least an acid group is protected with an acid-decomposable group. It is a polymer having a structural unit, and at least one other polymer is a polymer having a structural unit having at least a crosslinkable group. From the viewpoint of the degree of freedom in molecular design, the polymer having a structural unit having a residue in which at least an acid group is protected with an acid-decomposable group is substantially free of the structural unit (a2) and is at least crosslinkable. More preferably, the polymer having a structural unit having a group does not substantially contain the structural unit (a1). Here, “substantially free” means, for example, that the ratio to the total structural units is 3 mol% or less, and further 1 mol% or less.
A preferred second embodiment of the present invention includes an aspect in which the polymer containing the structural unit (a1) contains the structural unit (a2) from the viewpoint of compatibility.
Furthermore, as the third aspect, an aspect in which the polymer of the first embodiment and the polymer of the second embodiment coexist can be considered as the polymer component (A).

The component (A) is preferably an addition polymerization type resin, and more preferably a polymer containing a structural unit derived from (meth) acrylic acid and / or an ester thereof. In addition, you may have structural units other than the structural unit derived from (meth) acrylic acid and / or its ester, for example, the structural unit derived from styrene, the structural unit derived from a vinyl compound, etc.
The component (A) preferably contains 50 mol% or more, and 90 mol% or more of the structural unit derived from (meth) acrylic acid and / or its ester with respect to all the structural units in the polymer. Is more preferable, and a polymer composed only of structural units derived from (meth) acrylic acid and / or its ester is particularly preferable.
The “structural unit derived from (meth) acrylic acid and / or its ester” is also referred to as “acrylic structural unit”. “(Meth) acrylic acid” means “methacrylic acid and / or acrylic acid”.

The component (A) is preferably insoluble in alkali, and is preferably a resin that becomes alkali-soluble when the acid-decomposable group in the structural unit (a1) is decomposed. Here, the acid-decomposable group means a functional group that can be decomposed in the presence of an acid. That is, the structural unit having a protected carboxyl group in which the carboxyl group is protected with an acid-decomposable group can generate a carboxyl group by the decomposition of the protective group with an acid, and the phenolic hydroxyl group is an acid-decomposable group. The structural unit having a protected phenolic hydroxyl group protected with can generate a phenolic hydroxyl group by the decomposition of the protecting group with an acid. Here, in the present invention, “alkali-soluble” means a coating film (thickness) of the compound (resin) formed by applying a solution of the compound (resin) on a substrate and heating at 90 ° C. for 2 minutes. 3 μm) is a dissolution rate in a 0.4% tetramethylammonium hydroxide aqueous solution at 23 ° C. of 0.01 μm / second or more. “Alkali insoluble” means that the solution of the compound (resin) is a substrate. The dissolution rate of the coating film (thickness 3 μm) of the compound (resin) formed by applying the coating on the substrate and heating at 90 ° C. for 2 minutes in a 0.4% tetramethylammonium hydroxide aqueous solution at 23 ° C. It means less than 0.01 μm / second.
The (A) copolymer may have a carboxyl group described later, a structure derived from a carboxylic anhydride, and / or other structural units having a phenolic hydroxyl group. However, when introducing an acidic group, it is preferable to introduce it in the range which keeps the whole (A) copolymer insoluble in alkali.

<< (a1) Structural Unit Having Residue Protected with Acid-Decomposable Group >>
The component (A) has (a1) at least a structural unit having a residue in which an acid group is protected with an acid-decomposable group. When the component (A) has the structural unit (a1), a highly sensitive photosensitive resin composition can be obtained.
The structural unit (a1) in the present invention preferably contains a structural unit having a protected carboxyl group protected with an acid-decomposable group or a structural unit having a protected phenolic hydroxyl group protected with an acid-decomposable group.
Hereinafter, the structural unit (a1-1) having a protected carboxyl group protected with an acid-decomposable group and the structural unit (a1-2) having a protected phenolic hydroxyl group protected with an acid-decomposable group will be described in this order. To do.

<<< (a1-1) Structural Unit Having a Protected Carboxyl Group Protected with an Acid-Decomposable Group >>>
The structural unit (a1-1) having a protected carboxyl group protected with an acid-decomposable group is a protected carboxyl in which the carboxyl group of the structural unit having a carboxyl group is protected by an acid-decomposable group described in detail below. A structural unit having a group.
There is no restriction | limiting in particular as a structural unit which has the said carboxyl group as a structural unit which can be used for the structural unit (a1-1) which has the protected carboxyl group protected by the said acid-decomposable group, A well-known structural unit can be used. For example, a structural unit (a1-1-1) derived from an unsaturated carboxylic acid having at least one carboxyl group in the molecule, such as an unsaturated monocarboxylic acid, an unsaturated dicarboxylic acid, or an unsaturated tricarboxylic acid, And a structural unit (a1-1-2) having both an ethylenically unsaturated group and a structure derived from an acid anhydride.
Hereinafter, (a1-1-1) used as a structural unit having a carboxyl group, a structural unit derived from an unsaturated carboxylic acid having at least one carboxyl group in the molecule, and (a1-1-2) ethylene The structural units having both the unsaturated group and the structure derived from the acid anhydride will be described in order.

<<<<< (a1-1-1) Constituent Unit Derived from Unsaturated Carboxylic Acid Having at least One Carboxyl Group in the Molecule >>>>
Examples of the unsaturated carboxylic acid used in the present invention as the structural unit (a1-1-1) derived from an unsaturated carboxylic acid having at least one carboxyl group in the molecule include those listed below. . That is, examples of the unsaturated monocarboxylic acid include acrylic acid, methacrylic acid, crotonic acid, α-chloroacrylic acid, and cinnamic acid. Examples of the unsaturated dicarboxylic acid include maleic acid, fumaric acid, itaconic acid, citraconic acid, and mesaconic acid. Moreover, the acid anhydride may be sufficient as unsaturated polyhydric carboxylic acid used in order to obtain the structural unit which has a carboxyl group. Specific examples include maleic anhydride, itaconic anhydride, citraconic anhydride, and the like. The unsaturated polyvalent carboxylic acid may be a mono (2-methacryloyloxyalkyl) ester of a polyvalent carboxylic acid, such as succinic acid mono (2-acryloyloxyethyl), succinic acid mono (2 -Methacryloyloxyethyl), mono (2-acryloyloxyethyl) phthalate, mono (2-methacryloyloxyethyl) phthalate and the like. Further, the unsaturated polyvalent carboxylic acid may be a mono (meth) acrylate of the dicarboxy polymer at both ends, and examples thereof include ω-carboxypolycaprolactone monoacrylate and ω-carboxypolycaprolactone monomethacrylate. As the unsaturated carboxylic acid, acrylic acid-2-carboxyethyl ester, methacrylic acid-2-carboxyethyl ester, maleic acid monoalkyl ester, fumaric acid monoalkyl ester, 4-carboxystyrene and the like can also be used.
Among them, from the viewpoint of developability, in order to form the structural unit (a1-1-1) derived from an unsaturated carboxylic acid having at least one carboxyl group in the molecule, acrylic acid, methacrylic acid, Alternatively, an unsaturated polycarboxylic acid anhydride or the like is preferably used, and acrylic acid or methacrylic acid is more preferably used.
The structural unit (a1-1-1) derived from an unsaturated carboxylic acid having at least one carboxyl group in the molecule may be composed of one kind alone or two or more kinds. May be.

<<<<< (a1-1-2) Structural unit having both an ethylenically unsaturated group and a structure derived from an acid anhydride >>>>
The structural unit (a1-1-2) having both an ethylenically unsaturated group and a structure derived from an acid anhydride reacts a hydroxyl group present in the structural unit having an ethylenically unsaturated group with an acid anhydride. A unit derived from the obtained monomer is preferred.
As the acid anhydride, known ones can be used, and specifically, maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, chlorendic anhydride, etc. Dibasic acid anhydrides; acid anhydrides such as trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, biphenyltetracarboxylic anhydride, and the like. Among these, phthalic anhydride, tetrahydrophthalic anhydride, or succinic anhydride is preferable from the viewpoint of developability.
The reaction rate of the acid anhydride with respect to the hydroxyl group is preferably 10 to 100 mol%, more preferably 30 to 100 mol%, from the viewpoint of developability.

<<<< acid-decomposable group that can be used for the structural unit (a1-1) >>>>
The acid-decomposable group that can be used for the structural unit (a1-1) having a protected carboxyl group protected by the acid-decomposable group can be any known acid-decomposable group, and is not particularly limited. Conventionally, as an acid-decomposable group, a group that is relatively easily decomposed by an acid (for example, an acetal functional group such as a tetrahydropyranyl group) or a group that is relatively difficult to be decomposed by an acid (for example, a tert-butyl ester group, a tert-butyl ester group, -Tert-butyl functional groups such as butyl carbonate groups) are known.
Among these acid-decomposable groups, an acetal functional group is preferable from the viewpoint of basic physical properties of the photosensitive resin composition, particularly sensitivity, pattern shape, contact hole formability, and storage stability of the photosensitive resin composition. Further, among the protected carboxyl groups protected with an acid-decomposable group, the carboxyl group is more preferably a protected carboxyl group protected in the form of an acetal represented by the following general formula (a1-1) from the viewpoint of sensitivity. . In addition, when the carboxyl group is a protected carboxyl group protected in the form of an acetal represented by the following general formula (a1-1), the entire protected carboxyl group is-(C = O) -O-CR ^101. The structure is R ¹⁰² (OR ¹⁰³ ).

（式（ａ１−１）中、Ｒ¹⁰¹およびＲ¹⁰²は、それぞれ独立に水素原子またはアルキル基を表し、但し、Ｒ¹⁰¹とＲ¹⁰²とが共に水素原子の場合を除く。Ｒ¹⁰³は、アルキル基を表す。Ｒ¹⁰¹またはＲ¹⁰²と、Ｒ¹⁰³とが連結して環状エーテルを形成してもよい。） Formula (a1-1)

(In formula (a1-1), R ¹⁰¹ and R ¹⁰² each independently represents a hydrogen atom or an alkyl group, except that R ¹⁰¹ and R ¹⁰² are both hydrogen atoms. R ¹⁰³ is an alkyl group. R ¹⁰¹ or R ¹⁰² and R ¹⁰³ may be linked to form a cyclic ether.)

In the general formula (a1-1), R ^{101 to} R ¹⁰³ each independently represent a hydrogen atom or an alkyl group, and the alkyl group may be linear, branched, or cyclic. Here, both R ¹⁰¹ and R ¹⁰² do not represent a hydrogen atom, and at least one of R ¹⁰¹ and R ¹⁰² represents an alkyl group.

In the general formula (a1-1), when R ¹⁰¹ , R ^102, and R ¹⁰³ represent an alkyl group, the alkyl group may be linear, branched, or cyclic.
The linear or branched alkyl group preferably has 1 to 12 carbon atoms, more preferably 1 to 6 carbon atoms, and still more preferably 1 to 4 carbon atoms. Specifically, methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, sec-butyl group, tert-butyl group, n-pentyl group, neopentyl group, n Examples include -hexyl group, texyl group (2,3-dimethyl-2-butyl group), n-heptyl group, n-octyl group, 2-ethylhexyl group, n-nonyl group, and n-decyl group.

  The cyclic alkyl group preferably has 3 to 12 carbon atoms, more preferably 4 to 8 carbon atoms, and still more preferably 4 to 6 carbon atoms. Examples of the cyclic alkyl group include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, a norbornyl group, and an isobornyl group.

The alkyl group may have a substituent, and examples of the substituent include a halogen atom, an aryl group, and an alkoxy group. When it has a halogen atom as a substituent, R ¹⁰¹ , R ¹⁰² and R ¹⁰³ become a haloalkyl group, and when it has an aryl group as a substituent, R ¹⁰¹ , R ¹⁰² and R ¹⁰³ become an aralkyl group.
Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom, and among these, a fluorine atom or a chlorine atom is preferable.
Moreover, as said aryl group, a C6-C20 aryl group is preferable, More preferably, it is C6-C12, Specifically, a phenyl group, (alpha) -methylphenyl group, a naphthyl group etc. can be illustrated. Examples of the entire alkyl group substituted with an aryl group, that is, an aralkyl group, include a benzyl group, an α-methylbenzyl group, a phenethyl group, and a naphthylmethyl group.
As said alkoxy group, a C1-C6 alkoxy group is preferable, More preferably, it is C1-C4, and a methoxy group or an ethoxy group is more preferable.
In addition, when the alkyl group is a cycloalkyl group, the cycloalkyl group may have a linear or branched alkyl group having 1 to 10 carbon atoms as a substituent, and the alkyl group is linear Or a branched alkyl group, it may have a cycloalkyl group having 3 to 12 carbon atoms as a substituent.
These substituents may be further substituted with the above substituents.

In the general formula (a1-1), when R ¹⁰¹ , R ¹⁰² and R ¹⁰³ represent an aryl group, the aryl group preferably has 6 to 12 carbon atoms, more preferably 6 to 10 carbon atoms. preferable. The aryl group may have a substituent, and preferred examples of the substituent include an alkyl group having 1 to 6 carbon atoms. Examples of the aryl group include a phenyl group, a tolyl group, a silyl group, a cumenyl group, and a 1-naphthyl group.

R ¹⁰¹ , R ¹⁰² and R ¹⁰³ can be bonded together to form a ring together with the carbon atom to which they are bonded. Examples of the ring structure when R ¹⁰¹ and R ¹⁰² , R ¹⁰¹ and R ¹⁰³ or R ¹⁰² and R ¹⁰³ are bonded include a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a tetrahydrofuranyl group, an adamantyl group, and a tetrahydropyrani group. And the like.

In the general formula (a1-1), any one of R ¹⁰¹ and R ¹⁰² is preferably a hydrogen atom or a methyl group.

（式中、Ｒ¹およびＲ²は、それぞれ、水素原子、アルキル基またはアリール基を表し、少なくともＲ¹およびＲ²のいずれか一方がアルキル基またはアリール基であり、Ｒ³は、アルキル基またはアリール基を表し、Ｒ¹またはＲ²と、Ｒ³とが連結して環状エーテルを形成してもよく、Ｒ⁴は、水素原子またはメチル基を表し、Ｘは単結合またはアリーレン基を表す。）
Ｒ¹およびＲ²がアルキル基の場合、炭素数は１〜１０のアルキル基が好ましい。Ｒ¹およびＲ²がアリール基の場合、フェニル基が好ましい。Ｒ¹およびＲ²は、それぞれ、水素原子または炭素数１〜４のアルキル基が好ましい。
Ｒ³は、アルキル基またはアリール基を表し、炭素数１〜１０のアルキル基が好ましく、１〜６のアルキル基がより好ましい。
Ｘは単結合またはアリーレン基を表し、単結合が好ましい。 A preferred embodiment of the structural unit (a1-1) having a protected carboxyl group protected by the acid-decomposable group is a structural unit represented by the formula (A2 ′).
Formula (A2 ′)

(Wherein R ¹ and R ² each represent a hydrogen atom, an alkyl group or an aryl group, at least ^one of R ¹ and R ² is an alkyl group or an aryl group, and R ³ is an alkyl group or Represents an aryl group, R ¹ or R ² and R ³ may be linked to form a cyclic ether, R ⁴ represents a hydrogen atom or a methyl group, and X represents a single bond or an arylene group; )
When R ¹ and R ² are alkyl groups, an alkyl group having 1 to 10 carbon atoms is preferable. When R ¹ and R ² are aryl groups, a phenyl group is preferred. R ¹ and R ² are each preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
R ³ represents an alkyl group or an aryl group, preferably an alkyl group having 1 to 10 carbon atoms, and more preferably an alkyl group having 1 to 6 carbon atoms.
X represents a single bond or an arylene group, and a single bond is preferred.

As the radical polymerizable monomer used for forming the structural unit having a protected carboxyl group represented by the general formula (a1-1), a commercially available one may be used, or it may be synthesized by a known method. Things can also be used.
Preferable specific examples of the structural unit (a1-1) having a protected carboxyl group protected by the acid-decomposable group include the following structural units. R represents a hydrogen atom or a methyl group.

<<< (a1-2) Structural unit having a protected phenolic hydroxyl group protected with an acid-decomposable group >>>>
The structural unit (a1-2) having a protected phenolic hydroxyl group protected with an acid-decomposable group is a protected phenolic component in which the structural unit having a phenolic hydroxyl group is protected by an acid-decomposable group described in detail below. A structural unit having a hydroxyl group.

<<<< (a1-2-1) Structural unit having phenolic hydroxyl group >>>>
Examples of the structural unit having a phenolic hydroxyl group include a structural unit in a hydroxystyrene-based structural unit and a novolac-based resin. Among these, a structural unit derived from hydroxystyrene or α-methylhydroxystyrene is, It is preferable from the viewpoint of transparency. Among the structural units having a phenolic hydroxyl group, the structural unit represented by the following general formula (a1-2) is preferable from the viewpoints of transparency and sensitivity.

（一般式（ａ１−２）中、Ｒ²²⁰は水素原子またはメチル基を表し、Ｒ²²¹は単結合または二価の連結基を表し、Ｒ²²²はハロゲン原子または炭素数１〜５の直鎖または分岐鎖状のアルキル基を表し、ａは１〜５の整数を表し、ｂは０〜４の整数を表し、ａ＋ｂは５以下である。なお、Ｒ²²²が２以上存在する場合、これらのＲ²²²は相互に異なっていてもよいし同じでもよい。） Formula (a1-2)

(In General Formula (a1-2), R ²²⁰ represents a hydrogen atom or a methyl group, R ²²¹ represents a single bond or a divalent linking group, and R ²²² represents a halogen atom or a straight chain having 1 to 5 carbon atoms or Represents a branched alkyl group, a represents an integer of 1 to 5, b represents an integer of 0 to 4, and a + b is 5 or less, and when R ²²² is 2 or more, these R ²²² may be different from each other or the same.)

In General Formula (a1-2), R ²²⁰ represents a hydrogen atom or a methyl group, and is preferably a methyl group.
R ²²¹ represents a single bond or a divalent linking group. A single bond is preferable because the sensitivity can be improved and the transparency of the cured film can be further improved. The divalent linking group of R ²²¹ may be exemplified alkylene groups, specific examples R ²²¹ is an alkylene group, a methylene group, an ethylene group, a propylene group, isopropylene group, n- butylene group, isobutylene group, tert -Butylene group, pentylene group, isopentylene group, neopentylene group, hexylene group, etc. are mentioned. Among these, it is preferable that R ²²¹ is a single bond, a methylene group, or an ethylene group. The divalent linking group may have a substituent, and examples of the substituent include a halogen atom, a hydroxyl group, and an alkoxy group. Moreover, although a represents the integer of 1-5, from the viewpoint of the effect of this invention and the point that manufacture is easy, it is preferable that a is 1 or 2, and it is more preferable that a is 1. .
Further, the bonding position of the hydroxyl group in the benzene ring is preferably bonded to the 4-position when the carbon atom bonded to R ²²¹ is defined as the reference (first position).
R ²²² is a halogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms.
Specific examples include fluorine atom, chlorine atom, bromine atom, methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, pentyl group, isopentyl group, neopentyl group and the like. It is done. Among these, a chlorine atom, a bromine atom, a methyl group, or an ethyl group is preferable from the viewpoint of easy production.
B represents 0 or an integer of 1 to 4;

<<<< acid-decomposable group that can be used for the structural unit (a1-2) >>>>
The acid-decomposable group that can be used for the structural unit (a1-2) having a protected phenolic hydroxyl group protected with the acid-decomposable group has a protected carboxyl group protected with the acid-decomposable group. Similarly to the acid-decomposable group that can be used for the unit (a1-1), a known one can be used and is not particularly limited. Among acid-decomposable groups, the structural unit having a protected phenolic hydroxyl group protected in the form of an acetal is the basic physical properties of the resist, especially the sensitivity and pattern shape, the storage stability of the photosensitive resin composition, the contact hole It is preferable from the viewpoint of formability.
Furthermore, among the acid-decomposable groups, the phenolic hydroxyl group is more preferably a protected phenolic hydroxyl group protected in the form of an acetal represented by the general formula (a1-1) from the viewpoint of sensitivity. When the phenolic hydroxyl group is a protected phenolic hydroxyl group protected in the form of the acetal represented by the general formula (a1-1), the entire protected phenolic hydroxyl group is -Ar-O-CR ¹⁰¹ R. The structure is ¹⁰² (OR ¹⁰³ ). Ar represents an arylene group.

Preferable examples of the acetal ester structure of the phenolic hydroxyl group include a combination of R ¹⁰¹ = R ¹⁰² = R ¹⁰³ = methyl group, R ¹⁰¹ = R ¹⁰² = methyl group and R ¹⁰³ = benzyl group.

Moreover, as a radically polymerizable monomer used for forming a structural unit having a protected phenolic hydroxyl group in which the phenolic hydroxyl group is protected in the form of acetal, for example, paragraph number 0042 of JP2011-215590A is disclosed. And the like.
Among these, a 1-alkoxyalkyl protector of 4-hydroxyphenyl methacrylate and a tetrahydropyranyl protector of 4-hydroxyphenyl methacrylate are preferable from the viewpoint of transparency.

  Specific examples of the acetal protecting group for the phenolic hydroxyl group include a 1-alkoxyalkyl group, such as a 1-ethoxyethyl group, a 1-methoxyethyl group, a 1-n-butoxyethyl group, and a 1-isobutoxyethyl group. 1- (2-chloroethoxy) ethyl group, 1- (2-ethylhexyloxy) ethyl group, 1-n-propoxyethyl group, 1-cyclohexyloxyethyl group, 1- (2-cyclohexylethoxy) ethyl group, 1 -A benzyloxyethyl group etc. can be mentioned, These can be used individually or in combination of 2 or more types.

  As the radical polymerizable monomer used to form the structural unit (a1-2) having a protected phenolic hydroxyl group protected with the acid-decomposable group, a commercially available one may be used, or a known method may be used. What was synthesize | combined by can also be used. For example, it can be synthesized by reacting a compound having a phenolic hydroxyl group with vinyl ether in the presence of an acid catalyst. In the above synthesis, a monomer having a phenolic hydroxyl group may be previously copolymerized with another monomer, and then reacted with vinyl ether in the presence of an acid catalyst.

  Preferable specific examples of the structural unit (a1-2) having a protected phenolic hydroxyl group protected with the acid-decomposable group include the following structural units, but the present invention is not limited thereto.

<<< Preferred Aspect of Structural Unit (a1) >>>
When the polymer containing the structural unit (a1) does not substantially contain the structural unit (a2), the structural unit (a1) is 5 to 90 in the polymer containing the structural unit (a1). Mol% is preferable and 20-80 mol% is more preferable.
When the polymer containing the structural unit (a1) contains the structural unit (a2), the single structural unit (a1) is contained in the polymer containing the structural unit (a1) and the structural unit (a2). From the viewpoint of sensitivity, 3-70 mol% is preferable, and 10-60 mol% is more preferable. In particular, when the acid-decomposable group that can be used in the structural unit (a1) is a structural unit having a protected carboxyl group in which the carboxyl group is protected in the form of an acetal, 10 to 40 mol% is more preferable.
In this invention, it is preferable to contain 3-70 mol% of structural units (a1) in all the structural units of (A) component irrespective of any aspect, and it is more preferable to contain 10-60 mol%. preferable.

  The structural unit (a1-1) having a protected carboxyl group protected with an acid-decomposable group is more developed than the structural unit (a1-2) having a protected phenolic hydroxyl group protected with the acid-decomposable group. Is characterized by being fast. Therefore, the structural unit (a1-1) having a protected carboxyl group protected with an acid-decomposable group is preferred when developing quickly. Conversely, when it is desired to delay development, it is preferable to use the structural unit (a1-2) having a protected phenolic hydroxyl group protected with an acid-decomposable group.

<< (a2) Structural Unit Having a Crosslinking Group >>
The component (A) has a structural unit (a2) having a crosslinking group. The crosslinking group is not particularly limited as long as it is a group that causes a curing reaction by heat treatment. Preferred embodiments of the structural unit having a bridging group were selected from the group consisting of an oxiranyl group, an oxetanyl group, —NH—CH ₂ —OR (where R is an alkyl group having 1 to 20 carbon atoms) and an ethylenically unsaturated group. Examples of the structural unit include at least one.
Among them, in the photosensitive resin composition of the present invention, the component (A) preferably contains a structural unit containing at least one of an oxiranyl group and an oxetanyl group, and contains a structural unit containing an oxetanyl group. Is particularly preferred. In more detail, the following are mentioned.

<<< (a2-1) Oxylanyl group and / or Oxetanyl group-containing unit >>>>
The (A) copolymer preferably contains a structural unit (structural unit (a2-1)) having an oxiranyl group and / or an oxetanyl group. The 3-membered cyclic ether group is also called an oxiranyl group, and the 4-membered cyclic ether group is also called an oxetanyl group. The structural unit (a2-1) having an oxiranyl group and / or oxetanyl group is preferably a structural unit having an alicyclic oxiranyl group and / or oxetanyl group, more preferably a structural unit having an oxetanyl group. preferable.
The structural unit (a2-1) having an oxiranyl group and / or oxetanyl group may have at least one oxiranyl group or oxetanyl group in one structural unit. It may have an oxetanyl group, two or more oxiranyl groups, or two or more oxetanyl groups, and is not particularly limited, but preferably has a total of 1 to 3 oxiranyl groups and / or oxetanyl groups. It is more preferable to have one or two oxiranyl groups and / or oxetanyl groups, and it is even more preferable to have one oxiranyl group or oxetanyl group.

Specific examples of the radical polymerizable monomer used for forming the structural unit having an oxiranyl group include, for example, glycidyl acrylate, glycidyl methacrylate, glycidyl α-ethyl acrylate, and glycidyl α-n-propyl acrylate. Glycidyl α-n-butyl acrylate, 3,4-epoxybutyl acrylate, 3,4-epoxybutyl methacrylate, 3,4-epoxycyclohexylmethyl acrylate, 3,4-epoxycyclohexyl methacrylate Methyl, α-ethylacrylic acid-3,4-epoxycyclohexylmethyl, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, described in paragraph Nos. 0031 to 0035 of Japanese Patent No. 4168443 Fat And compounds containing an expression epoxy skeleton.
Specific examples of the radical polymerizable monomer used for forming the structural unit having an oxetanyl group include (meth) having an oxetanyl group described in paragraph Nos. 0011 to 0016 of JP-A No. 2001-330953, for example. Examples thereof include acrylic acid esters.
Specific examples of the radical polymerizable monomer used for forming the structural unit (a2-1) having the oxiranyl group and / or oxetanyl group include a monomer having a methacrylate structure and an acrylate structure. It is preferable that it is a monomer to contain.

  Among these monomers, more preferred are compounds containing an alicyclic epoxy skeleton described in paragraph Nos. 0034 to 0035 of Japanese Patent No. 4168443 and paragraph numbers 0011 to 0016 of JP-A No. 2001-330953. The (meth) acrylic acid ester having an oxetanyl group described in (1), and (meth) acrylic acid ester having an oxetanyl group described in paragraph Nos. 0011 to 0016 of JP-A No. 2001-330953 is particularly preferable. Among these, preferred are glycidyl methacrylate, 3,4-epoxycyclohexylmethyl acrylate, 3,4-epoxycyclohexylmethyl methacrylate, (3-ethyloxetane-3-yl) methyl acrylate, and methacrylic acid ( 3-ethyloxetane-3-yl) methyl, most preferred are (3-ethyloxetane-3-yl) methyl acrylate and (3-ethyloxetane-3-yl) methyl methacrylate. These structural units can be used individually by 1 type or in combination of 2 or more types.

  As the structural unit (a2-1) having the oxiranyl group and / or oxetanyl group, the description of paragraph numbers 0053 to 0055 of JP2011-215590A can be referred to.

  Preferable specific examples of the structural unit (a2-1) having the oxiranyl group and / or oxetanyl group include the following structural units. R represents a hydrogen atom or a methyl group.

  In the present invention, an oxetanyl group is preferable from the viewpoint of sensitivity. From the viewpoint of transmittance (transparency), an alicyclic oxiranyl group and an oxetanyl group are preferred. From the above, in the present invention, as the oxiranyl group and / or oxetanyl group, an alicyclic oxiranyl group and an oxetanyl group are preferable, and an oxetanyl group is particularly preferable.

<<< (a2-2) Structural unit having an ethylenically unsaturated group >>>
As one of the structural unit (a2) having a crosslinking group, there may be mentioned a structural unit (a2-2) having an ethylenically unsaturated group (hereinafter also referred to as “structural unit (a2-2)”). The structural unit (a2-2) having an ethylenically unsaturated group is preferably a structural unit having an ethylenically unsaturated group in the side chain, having an ethylenically unsaturated group at the terminal, and having 3 to 16 carbon atoms. A structural unit having a side chain is more preferred, and a structural unit having a side chain represented by the following general formula (a2-2-1) is more preferred.

（一般式（ａ２−２−１）中、Ｒ³⁰¹は炭素数１〜１３の二価の連結基を表し、Ｒ³⁰²は水素原子またはメチル基を表し、＊は架橋基を有する構成単位（ａ２）の主鎖に連結する部位を表す。） General formula (a2-2-1)

(In General Formula (a2-2-1), R ³⁰¹ represents a divalent linking group having 1 to 13 carbon atoms, R ³⁰² represents a hydrogen atom or a methyl group, and * represents a structural unit having a bridging group (a2 ) Represents a site linked to the main chain of.

R ³⁰¹ is a divalent linking group having 1 to 13 carbon atoms and includes an alkenyl group, a cycloalkenyl group, an arylene group, or a combination of these, and includes an ester bond, an ether bond, an amide bond, a urethane bond, and the like. Bonds may be included. The divalent linking group may have a substituent such as a hydroxy group or a carboxyl group at an arbitrary position. Specific examples of R ³⁰¹ include the following divalent linking groups.

Among the side chains represented by the general formula (a2-2-1), an aliphatic side chain including the divalent linking group represented by R ³⁰¹ is preferable.

  Other (a2-2) Regarding the structural unit having an ethylenically unsaturated group, the description of paragraph numbers 0077 to 0090 of JP2011-215580A can be referred to.

（上記式中、Ｒ¹は水素原子またはメチル基を表し、Ｒ²は炭素数１〜２０のアルキル基を表す。）
Ｒ²は、炭素数１〜９のアルキル基が好ましく、炭素数１〜４のアルキル基がさらに好ましい。また、アルキル基は、直鎖、分岐または環状のアルキル基のいずれであってもよいが、好ましくは、直鎖または分岐のアルキル基である。
Ｒ²の具体例としては、メチル基、エチル基、ｎ−ブチル基、ｉ−ブチル基、シクロヘキシル基、およびｎ−ヘキシル基を挙げることができる。中でもｉ−ブチル基、ｎ−ブチル基、メチル基が好ましい。 <<< constituent unit having a partial structure represented by (a2-3) -NH-CH ₂ —O—R (R is an alkyl group having 1 to 20 carbon atoms) >>
The copolymer used in the present invention is also preferably a structural unit (a2-3) having a partial structure represented by —NH—CH ₂ —O—R (R is an alkyl group having 1 to 20 carbon atoms). By having the structural unit (a2-3), a curing reaction can be caused by a mild heat treatment, and a cured film having excellent characteristics can be obtained. Here, R is preferably an alkyl group having 1 to 9 carbon atoms, and more preferably an alkyl group having 1 to 4 carbon atoms. The alkyl group may be a linear, branched or cyclic alkyl group, but is preferably a linear or branched alkyl group. The structural unit (a2) is more preferably a structural unit having a group represented by the following general formula (1).
General formula (1)

(In the above formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents an alkyl group having 1 to 20 carbon atoms.)
R ² is preferably an alkyl group having 1 to 9 carbon atoms, and more preferably an alkyl group having 1 to 4 carbon atoms. The alkyl group may be a linear, branched or cyclic alkyl group, but is preferably a linear or branched alkyl group.
Specific examples of R ² include a methyl group, an ethyl group, an n-butyl group, an i-butyl group, a cyclohexyl group, and an n-hexyl group. Of these, i-butyl, n-butyl and methyl are preferred.

<<< Preferred Aspect of Structural Unit (a2) >>>
When the polymer containing the structural unit (a2) does not substantially contain the structural unit (a1), the structural unit (a1) is 5 to 90 in the polymer containing the structural unit (a1). Mol% is preferable and 20-80 mol% is more preferable.
When the polymer containing the structural unit (a2) contains the structural unit (a1), the single structural unit (a1) is contained in the polymer containing the structural unit (a1) and the structural unit (a2). From the viewpoint of sensitivity, 3-70 mol% is preferable, and 10-60 mol% is more preferable.
In this invention, it is preferable to contain 3-70 mol% of structural units (a2) in all the structural units of (A) component irrespective of any aspect, and it is more preferable to contain 10-60 mol%. preferable.
Within the above numerical range, the cured film obtained from the photosensitive resin composition has good transparency and ITO sputtering resistance.

<< (a3) Other structural units >>
In the present invention, the component (A) may have another structural unit (a3) in addition to the structural units (a1) and (a2). There is no restriction | limiting in particular as a monomer used as another structural unit (a3). For example, styrenes, (meth) acrylic acid alkyl esters, (meth) acrylic acid cyclic alkyl esters, (meth) acrylic acid aryl esters, unsaturated dicarboxylic acid diesters, bicyclounsaturated compounds, maleimide compounds, unsaturated aromatics Examples thereof include compounds, conjugated diene compounds, unsaturated monocarboxylic acids, unsaturated dicarboxylic acids, unsaturated dicarboxylic acid anhydrides, and other unsaturated compounds.
Specifically, styrene, tert-butoxystyrene, methylstyrene, hydroxystyrene, α-methylstyrene, acetoxystyrene, methoxystyrene, ethoxystyrene, chlorostyrene, methyl vinylbenzoate, ethyl vinylbenzoate, 4-hydroxybenzoic acid (3-methacryloyloxypropyl) ester, (meth) acrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, (meth) acrylic acid tert-butyl, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, acrylonitrile, ethylene glycol monoacetoacetate mono ( Mention may be made of a structural unit due to data) acrylate. In addition, compounds described in paragraph numbers 0021 to 0024 of JP-A No. 2004-264623 can be exemplified.
Among them, the structural unit (a2) or other structural unit (a3) having a group that reacts with a separately added crosslinking agent in the (final) heat treatment is preferable from the viewpoint of film strength.
Specifically, a group having an alcoholic hydroxyl group is preferable, and 2-hydroxyethyl methacrylate is particularly preferable. The proportion of the other structural unit (a3) having a group that reacts with the structural unit (a2) or the separately added crosslinking agent in the (final) heat treatment is 1 to 50 mol% with respect to all components (A). Is more preferable, 5 to 40 mol% is more preferable, and 10 to 30 mol% is particularly preferable.

Moreover, the said (A) component contains 1-50 mol% of structural units which have an unprotected carboxyl group, or a structural unit which has an unprotected phenolic hydroxyl group with respect to all the (A) components. Is preferable in terms of sensitivity, more preferably 3 to 40 mol%, and particularly preferably 5 to 20 mol%. Examples of the structural unit having an unprotected carboxyl group or phenolic hydroxyl group include monomers having a known acidic group. Among them, hydroxystyrenes and (meth) acrylic acid are preferable, and methacrylic acid is more preferable. preferable.
The monomer which becomes said other structural unit (a3) can be used individually or in combination of 2 or more types.

  Moreover, the group which has styrenes and an aliphatic cyclic skeleton as another structural unit (a3) is preferable from a viewpoint of an electrical property. Specific examples include styrene, tert-butoxystyrene, methylstyrene, hydroxystyrene, α-methylstyrene, dicyclopentanyl (meth) acrylate, cyclohexyl (meth) acrylate, and benzyl (meth) acrylate.

  Moreover, (meth) acrylic-acid alkylester is preferable as an other structural unit (a3) from an adhesive viewpoint. Specific examples include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and n-butyl (meth) acrylate.

  Regarding the component (A), in any of the above-described embodiments, the structural unit (a3) component can be included, and a plurality of types can be used in combination.

  In the present invention, it is preferable that both a structural unit having a carboxyl group or a phenolic hydroxyl group protected in the form of an acetal and a structural unit having an unprotected carboxyl group or a phenolic hydroxyl group are included.

  In the photosensitive resin composition of the present invention, the (A) polymer component preferably occupies 70% by weight or more of the component excluding the solvent, and more preferably 90% by weight or more.

<< (A) Molecular Weight of Copolymer >>
(A) The molecular weight of a copolymer is a polystyrene conversion weight average molecular weight, Preferably it is 1,000-200,000, More preferably, it is the range of 2,000-50,000. Within the above numerical range, the sensitivity and ITO suitability are good.
The ratio (dispersity) between the number average molecular weight and the weight average molecular weight is preferably 1.0 to 5.0, more preferably 1.5 to 3.5.

<< (A) Copolymer Production Method >>
Various methods for synthesizing the component (A) are known. To give an example, the component (A) is used to form at least the structural units represented by (a1) and (a2). It can be synthesized by polymerizing a radical polymerizable monomer mixture containing a radical polymerizable monomer in an organic solvent using a radical polymerization initiator. It can also be synthesized by a so-called polymer reaction.

As a specific example of the copolymer (A), as an example satisfying (1), 1-ethoxyethyl methacrylate / methacrylic acid / methacrylic acid (3-ethyloxetane-3-yl) methyl / 2-hydroxyethyl methacrylate Polymer (45/8/35/12),
1-ethoxyethyl methacrylate / methacrylic acid / glycidyl methacrylate / allyl methacrylate / dicyclopentanyl methacrylate / styrene copolymer (35/10/30/5/15/15),
1-cyclohexyloxyethyl methacrylate / methacrylic acid / glycidyl methacrylate / 2-hydroxyethyl methacrylate / styrene copolymer (40/8/35/12/5),
Tetrahydrofuran-2-yl methacrylate / methacrylic acid / methacrylic acid (3-ethyloxetane-3-yl) methyl / glycidyl methacrylate / 2-hydroxyethyl methacrylate / styrene copolymer (35/10/15/15/15 / 10),
1-ethoxyethyl methacrylate / methacrylic acid / methacrylic acid (3-ethyloxetane-3-yl) methyl / N-methoxymethylacrylamide / 2-hydroxyethyl methacrylate copolymer (40/5/40/5/10) ,
Tetrahydropyran-2-yl methacrylate / methacrylic acid / methacrylic acid (3-ethyloxetane-3-yl) methyl / 2-hydroxyethyl methacrylate / dicyclopentanyl methacrylate copolymer (42/11/25/18 / 4),
As an example that satisfies (2),
1-ethoxyethyl methacrylate / methacrylic acid / 2-hydroxyethyl methacrylate / benzyl methacrylate methacrylate (60/10/10/20) and methacrylic acid (3-ethyloxetane-3-yl) methyl / methacrylic acid / A combination of 2-hydroxyethyl methacrylate / benzyl methacrylate copolymer (60/10/10/20),
Tetrahydropyran-2-yl methacrylate / methacrylic acid / 2-hydroxyethyl methacrylate / dicyclopentanyl methacrylate copolymer (65/5/10/20) and glycidyl methacrylate / N-methoxymethylacrylamide / methacrylic acid / Dicyclopentanyl methacrylate / styrene copolymer (50/15/5/15/15).

<(B) Photoacid generator>
The photoacid generator used in the present invention is preferably a compound that reacts with actinic rays having a wavelength of 300 nm or more, preferably 300 to 450 nm, and generates an acid, but is not limited to its chemical structure. Further, a photoacid generator that is not directly sensitive to an actinic ray having a wavelength of 300 nm or more can also be used as a sensitizer if it is a compound that reacts with an actinic ray having a wavelength of 300 nm or more and generates an acid when used in combination with a sensitizer. It can be preferably used in combination. The photoacid generator used in the present invention is preferably a photoacid generator that generates an acid having a pKa of 4 or less, and more preferably a photoacid generator that generates an acid having a pKa of 3 or less.
The component (B) is preferably an onium salt compound or an oxime sulfonate compound from the viewpoint of sensitivity. Among these, oxime sulfonate is more preferable from the viewpoint of electrical characteristics.

  Examples of the photoacid generator include trichloromethyl-s-triazines, sulfonium salts and iodonium salts, quaternary ammonium salts, diazomethane compounds, imide sulfonate compounds, and oxime sulfonate compounds. Among these, it is preferable to use an oxime sulfonate compound from the viewpoint of insulation. These photoacid generators can be used singly or in combination of two or more. Specific examples of trichloromethyl-s-triazines, diaryliodonium salts, triarylsulfonium salts, quaternary ammonium salts, and diazomethane derivatives include the compounds described in paragraph numbers 0077 to 0078 of JP2011-221494A. It can be illustrated.

  Preferred examples of the oxime sulfonate compound, that is, a compound having an oxime sulfonate structure include compounds having an oxime sulfonate structure represented by the following general formula (B1).

（一般式（Ｂ１）中、Ｒ²¹は、アルキル基、アリール基、フッ化アルキル基、フッ化アルキル基を表す。波線は他の基との結合を表す。） General formula (B1)

(In the general formula (B1), R ²¹ represents an alkyl group, an aryl group, a fluorinated alkyl group, or a fluorinated alkyl group. The wavy line represents a bond with another group.)

Any group may be substituted, and the alkyl group in R ²¹ may be linear, branched or cyclic. Acceptable substituents are described below.
As the alkyl group for R ^21, a linear or branched alkyl group having 1 to 10 carbon atoms is preferable. The alkyl group represented by R ²¹ is an aryl group having 6 to 11 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or a cycloalkyl group (7,7-dimethyl-2-oxonorbornyl group or the like It may be substituted with a cyclic group, preferably a bicycloalkyl group or the like.
As the aryl group for R ^21, an aryl group having 6 to 11 carbon atoms is preferable, and a phenyl group or a naphthyl group is more preferable. The aryl group of R ²¹ may be substituted with a lower alkyl group, an alkoxy group, or a halogen atom.

  The compound containing an oxime sulfonate structure represented by the general formula (B1) is also preferably an oxime sulfonate compound represented by the following general formula (B2).

（式（Ｂ２）中、Ｒ⁴²は、アルキル基、アリール基、フッ化アルキル基、フッ化アルキル基を表し、Ｘは、アルキル基、アルコキシ基、または、ハロゲン原子を表し、ｍ４は、０〜３の整数を表し、ｍ４が２または３であるとき、複数のＸは同一でも異なっていてもよい。）

(In the formula (B2), R ⁴² represents an alkyl group, an aryl group, a fluorinated alkyl group, or a fluorinated alkyl group, X represents an alkyl group, an alkoxy group, or a halogen atom; 3 represents an integer of 3 and when m4 is 2 or 3, a plurality of X may be the same or different.)

The alkyl group as X is preferably a linear or branched alkyl group having 1 to 4 carbon atoms.
The alkoxy group as X is preferably a linear or branched alkoxy group having 1 to 4 carbon atoms.
The halogen atom as X is preferably a chlorine atom or a fluorine atom.
m4 is preferably 0 or 1.
In the above general formula (B2), m4 is 1, X is a methyl group, the substitution position of X is the ortho position, R ⁴² is a linear alkyl group having 1 to 10 carbon atoms, 7,7- A compound that is a dimethyl-2-oxonorbornylmethyl group or a p-toluyl group is particularly preferred.

  The compound containing the oxime sulfonate structure represented by the general formula (B1) is more preferably an oxime sulfonate compound represented by the following general formula (B3).

（式（Ｂ３）中、Ｒ⁴³は式（ｂ１）におけるＲ⁴²と同義であり、Ｘ¹は、ハロゲン原子、水酸基、炭素数１〜４のアルキル基、炭素数１〜４のアルコキシ基、シアノ基またはニトロ基を表し、ｎ４は０〜５の整数を表す。）

(In formula (B3), R ⁴³ has the same meaning as R ⁴² in formula (b1), and X ¹ represents a halogen atom, a hydroxyl group, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, cyano A group or a nitro group, and n4 represents an integer of 0 to 5.)

R ⁴³ in the general formula (B3) is methyl group, ethyl group, n-propyl group, n-butyl group, n-octyl group, trifluoromethyl group, pentafluoroethyl group, perfluoro-n-propyl group. Perfluoro-n-butyl group, p-tolyl group, 4-chlorophenyl group or pentafluorophenyl group is preferable, and n-octyl group is particularly preferable.
X ¹ is preferably an alkoxy group having 1 to 5 carbon atoms, and more preferably a methoxy group.
As n4, 0-2 are preferable and 0-1 are especially preferable.

  Specific examples of the compound represented by the general formula (B3) include α- (methylsulfonyloxyimino) benzyl cyanide, α- (ethylsulfonyloxyimino) benzyl cyanide, α- (n-propylsulfonyloxyimino). ) Benzyl cyanide, α- (n-butylsulfonyloxyimino) benzyl cyanide, α- (4-toluenesulfonyloxyimino) benzyl cyanide, α-[(methylsulfonyloxyimino) -4-methoxyphenyl] acetonitrile, α-[(ethylsulfonyloxyimino) -4-methoxyphenyl] acetonitrile, α-[(n-propylsulfonyloxyimino) -4-methoxyphenyl] acetonitrile, α-[(n-butylsulfonyloxyimino) -4- Methoxyphenyl] acetonitrile, α-[(4- Toluene sulfonyl) -4-methoxyphenyl] can be mentioned acetonitrile.

  Specific examples of preferred oxime sulfonate compounds include the following compounds (i) to (viii) and the like, and these can be used alone or in combination of two or more. Compounds (i) to (viii) can be obtained as commercial products. Moreover, it can also be used in combination with another kind of (B) photo-acid generator.

  The compound containing an oxime sulfonate structure represented by the general formula (B1) is also preferably a compound represented by the following general formula (OS-1).

In the general formula (OS-1), R ¹⁰¹ represents a hydrogen atom, an alkyl group, an alkenyl group, an alkoxy group, an alkoxycarbonyl group, an acyl group, a carbamoyl group, a sulfamoyl group, a sulfo group, a cyano group, an aryl group, or Represents a heteroaryl group. ^R102 represents an alkyl group or an aryl group.
X ¹⁰¹ represents —O—, —S—, —NH—, —NR ¹⁰⁵ —, —CH ₂ —, —CR ¹⁰⁶ H—, or —CR ¹⁰⁵ R ¹⁰⁷ —, wherein R ^{105 to} R ¹⁰⁷ are alkyl groups. Or an aryl group.
R ^{121 to} R ¹²⁴ each independently represents a hydrogen atom, a halogen atom, an alkyl group, an alkenyl group, an alkoxy group, an amino group, an alkoxycarbonyl group, an alkylcarbonyl group, an arylcarbonyl group, an amide group, a sulfo group, a cyano group, Or an aryl group is represented. Two of R ^{121 to} R ¹²⁴ may be bonded to each other to form a ring.
As R ^{121 to} R ¹²⁴ , a hydrogen atom, a halogen atom, and an alkyl group are preferable, and an embodiment in which at least two of R ^{121 to} R ¹²⁴ are bonded to each other to form an aryl group is also preferable. Among these, an embodiment in which R ^{121 to} R ¹²⁴ are all hydrogen atoms is preferable from the viewpoint of sensitivity.
Any of the aforementioned functional groups may further have a substituent.

  Preferable examples of the compound represented by the general formula (OS-1) include general formulas described in paragraph numbers 0194 to 0202 of JP2011-22196A and exemplary compounds thereof.

  In the present invention, the compound containing the oxime sulfonate structure represented by the general formula (B1) is represented by the following general formula (OS-3), the following general formula (OS-4), or the following general formula (OS-5). It is preferable that it is an oxime sulfonate compound represented by these.

（一般式（ＯＳ−３）〜一般式（ＯＳ−５）中、Ｒ²²、Ｒ²⁵およびＲ²⁸はそれぞれ独立にアルキル基、アリール基またはヘテロアリール基を表し、Ｒ²³、Ｒ²⁶およびＲ²⁹はそれぞれ独立に水素原子、アルキル基、アリール基またはハロゲン原子を表し、Ｒ²⁴、Ｒ²⁷およびＲ³⁰はそれぞれ独立にハロゲン原子、アルキル基、アルキルオキシ基、スルホン酸基、アミノスルホニル基またはアルコキシスルホニル基を表し、Ｘ¹〜Ｘ³はそれぞれ独立に酸素原子または硫黄原子を表し、ｎ¹〜ｎ³はそれぞれ独立に１または２を表し、ｍ¹〜ｍ³はそれぞれ独立に０〜６の整数を表す。）

(In the general formula (OS-3) to general formula (OS-5), R ²² , R ²⁵ and R ²⁸ each independently represents an alkyl group, an aryl group or a heteroaryl group, and R ²³ , R ²⁶ and R ²⁹ Each independently represents a hydrogen atom, an alkyl group, an aryl group or a halogen atom, and R ²⁴ , R ²⁷ and R ³⁰ each independently represent a halogen atom, an alkyl group, an alkyloxy group, a sulfonic acid group, an aminosulfonyl group or an alkoxysulfonyl group. X ^{1 to} X ³ each independently represents an oxygen atom or a sulfur atom, n ^{1 to} n ³ each independently represents 1 or 2, and m ^{1 to} m ³ each independently represents an integer of 0 to 6 Represents.)

In the general formulas (OS-3) to (OS-5), the alkyl group, aryl group or heteroaryl group in R ²² , R ²⁵ and R ²⁸ may have a substituent.
In the above formulas (OS-3) to (OS-5), the alkyl group in R ²² , R ²⁵ and R ²⁸ is an alkyl group having 1 to 30 carbon atoms which may have a substituent. Is preferred.

In the general formulas (OS-3) to (OS-5), as the aryl group in R ²² , R ²⁵ and R ^28, an aryl group having 6 to 30 carbon atoms which may have a substituent may be used. preferable.

Further, in the above general formula (OS-3) ~ (OS -5), as the heteroaryl group in R ^1, heteroaryl group having a total carbon number of 4-30 which may have a substituent is preferable.

In the general formulas (OS-3) to (OS-5), at least one ring of the heteroaryl group in R ²² , R ²⁵ and R ²⁸ may be a heteroaromatic ring. For example, a heteroaromatic ring and benzene The ring may be condensed.

In the general formulas (OS-3) to (OS-5), R ²³ , R ²⁶ and R ²⁹ are preferably a hydrogen atom, an alkyl group or an aryl group, and more preferably a hydrogen atom or an alkyl group. preferable.
In the general formulas (OS-3) to (OS-5), one or two of R ²³ , R ²⁶ and R ²⁹ present in the compound are an alkyl group, an aryl group or a halogen atom. It is more preferable that one is an alkyl group, an aryl group or a halogen atom, and it is particularly preferable that one is an alkyl group and the rest is a hydrogen atom.
In the general formulas (OS-3) to (OS-5), the alkyl group or aryl group in R ²³ , R ²⁶ and R ²⁹ may have a substituent. Here, the substituent that the alkyl group or aryl group in R ²³ , R ²⁶ and R ²⁹ may have may be the alkyl group or aryl group in R ²² , R ²⁵ and R ²⁸ described above. Examples thereof are the same groups as the good substituent.

The alkyl group for R ²³ , R ²⁶ and R ²⁹ is preferably an alkyl group having 1 to 12 carbon atoms which may have a substituent, and 1 to 1 carbon atoms which may have a substituent. More preferred is an alkyl group of 6.

The aryl group for R ²³ , R ²⁶ and R ²⁹ is preferably an aryl group having 6 to 30 carbon atoms which may have a substituent.

Examples of the halogen atom for R ²³ , R ²⁶ and R ²⁹ include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.
Among these, a chlorine atom and a bromine atom are preferable.

In the general formulas (OS-3) to (OS-5), X ^{1 to} X ³ each independently represents O or S, and is preferably O.
In the general formulas (OS-3) to (OS-5), the ring containing X ^{1 to} X ³ as a ring member is a 5-membered ring or a 6-membered ring.
In the general formulas (OS-3) to (OS-5), n ^{1 to} n ³ each independently represent 1 or 2, and when X ^{1 to} X ³ are O, n ^{1 to} n ³ are each independently 1 is preferable, and when X ^{1 to} X ³ are S, n ^{1 to} n ³ are preferably 2 each independently.

In the general formulas (OS-3) to (OS-5), R ²⁴ , R ²⁷ and R ³⁰ each independently represent a halogen atom, an alkyl group, an alkyloxy group, a sulfonic acid group, an aminosulfonyl group or an alkoxysulfonyl group. Represent. Among them, R ²⁴ , R ²⁷ and R ³⁰ are preferably each independently an alkyl group or an alkyloxy group.
The alkyl group, alkyloxy group, sulfonic acid group, aminosulfonyl group and alkoxysulfonyl group in R ²⁴ , R ²⁷ and R ³⁰ may have a substituent.
In the general formulas (OS-3) to (OS-5), the alkyl group in R ²⁴ , R ²⁷ and R ³⁰ is an alkyl group having 1 to 30 carbon atoms which may have a substituent. It is preferable.

In the general formulas (OS-3) to (OS-5), the alkyloxy group in R ²⁴ , R ²⁷ and R ³⁰ is an alkyloxy group having 1 to 30 carbon atoms which may have a substituent. Preferably there is.
In addition, for the preferred ranges of general formulas (OS-3) to (OS-5) and exemplary compounds, the description in paragraph numbers 0171 to 0200 of JP2011-227449A can be referred to.

  In the photosensitive resin composition of the present invention, (B) the photoacid generator is added to 100 parts by mass of all resin components (preferably solid content, more preferably (A) copolymer) in the photosensitive resin composition. On the other hand, it is preferable to use 0.1-10 mass parts, and it is more preferable to use 0.5-10 mass parts. Two or more kinds can be used in combination.

  The photosensitive resin composition of the present invention may contain a 1,2-quinonediazide compound as a photoacid generator sensitive to actinic rays. The 1,2-quinonediazide compound generates a carboxyl group by a sequential photochemical reaction, but its quantum yield is always 1 or less.

<(C) Fluorine-containing compound>
The photosensitive resin composition of the present invention contains (C) a fluorine additive. The (C) fluorine-containing compound used in the present invention is characterized by having at least one of a hydroxyphenyl group, a hydroxyalkyl group, an epoxy group and an acid anhydride group, and having a molecular weight of 100 to 1,000. By employing such a compound, the sensitivity can be improved while achieving a low dielectric constant. By adopting a compound having at least one of a hydroxyphenyl group, a hydroxyalkyl group, an epoxy group, and an acid anhydride group, the compound can be evenly dispersed in the photosensitive resin composition, and these effects are enhanced. Adhesion to the substrate can be maintained.
Here, the hydroxyphenyl group is a group having a -benzene ring -OH group. The benzene ring may have a substituent. The OH group may be substituted at any position of para, meta and ortho, but is preferably substituted at the para position.
A hydroxyalkyl group is a group in which an OH group is bonded to a hydrocarbon group. The hydrocarbon group may be linear, branched or cyclic, and is preferably linear or branched. 1-10 are preferable and, as for carbon number which comprises a hydrocarbon group, 1-4 are more preferable.
An acid anhydride group is a group represented by —RC (═O) O (═O) R—, where R is an aliphatic or aromatic hydrocarbon group. Rs may be bonded to form a ring.
The hydroxyphenyl group, hydroxyalkyl group, epoxy group and acid anhydride group are preferably a hydroxyphenyl group, a hydroxyalkyl group and an acid anhydride group, more preferably a hydroxyphenyl group and a hydroxyalkyl group, More preferably it is.

The fluorine-containing compound used in the present invention may have at least one hydroxyphenyl group, hydroxyalkyl group, epoxy group and acid anhydride group, but preferably has two or more. The upper limit is not particularly defined, but can be four or less.
When the fluorine-containing compound has two or more hydroxyphenyl groups, hydroxyalkyl groups, epoxy groups and acid anhydride groups, these groups may be the same group or different groups. , Preferably the same group.

The fluorine-containing compound used in the present invention has a molecular weight of 100 to 1000, preferably 200 to 800, and particularly preferably 200 to 600. By setting it as such a range, development can be accelerated | stimulated and it becomes possible to improve a sensitivity.
In the fluorine-containing compound used in the present invention, the number of carbon atoms substituted with fluorine atoms is preferably 2 to 6, and more preferably 2 to 4. By setting it as such a range, a dielectric constant can be reduced, without reducing a sensitivity.

The fluorine-containing compound used in the present invention preferably has a fluorine atom content (number of fluorine atoms in one molecule / total number of atoms in one molecule) of 0.05 to 0.5, preferably 0.1 to 0.00. 4 is more preferable.
In addition, the fluorine-containing compound used in the present invention has an alkyl group, a fluorinated alkyl group, a hydroxyphenyl group, a hydroxy group at both ends of a group consisting of an alkylene group, a fluorinated alkylene group, —O—, a phenylene group, and a combination thereof. A group in which any two of an alkyl group, an epoxy group and an acid anhydride group are bonded is preferable. More preferably, any two of a hydroxyphenyl group, a hydroxyalkyl group, an epoxy group, and an acid anhydride group are present at both ends of the group consisting of an alkylene group, a fluorinated alkylene group, —O—, a phenylene group, and a combination thereof. It is a bonded group.

In the photosensitive resin composition of the present invention, (C) the fluorine-containing compound is preferably used in an amount of 0.1 to 10 parts by mass with respect to 100 parts by mass of the solid content in the photosensitive resin composition. It is more preferable to use -5 mass parts, and it is most preferable to use 1.0-4.0 mass parts. Two or more kinds can be used in combination.
In general, many fluorine compounds lower the sensitivity, but the fluorine-containing compound used in the present invention can lower the dielectric constant while maintaining and improving the sensitivity.
In general, many fluorine compounds greatly deteriorate the adhesion to the substrate, but the fluorine additive (C) of the present invention does not deteriorate the adhesion during development and after curing. It is effective for adhesion to a glass substrate or a metal substrate (molybdenum, titanium, ITO, silicon nitride, etc.), which is important in an interlayer insulating film.

  Below, the preferable example of the (C) fluorine-containing compound which can be used by this invention is shown. Needless to say, the present invention is not limited to these examples.

  In the photosensitive composition of the present invention, the compounding ratio of the compound containing a fluorine atom other than the (C) fluorine-containing compound is preferably 10% by mass or less, and preferably 5% by mass or less. It is more preferable.

<(D) Solvent>
The photosensitive resin composition of the present invention contains (D) a solvent. The photosensitive resin composition of the present invention comprises the components (A) to (D) which are essential components, the components (E) to (I) described below which are preferable components, and the optional components described below as a solvent (D). It is preferable to be prepared as a solution dissolved in.
As the solvent (D) used in the photosensitive resin composition of the present invention, known solvents can be used, such as ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, ethylene glycol monoalkyl ether acetates, propylene. Glycol monoalkyl ethers, propylene glycol dialkyl ethers, propylene glycol monoalkyl ether acetates, diethylene glycol dialkyl ethers, diethylene glycol monoalkyl ether acetates, dipropylene glycol monoalkyl ethers, dipropylene glycol dialkyl ethers, dipropylene glycol Examples include monoalkyl ether acetates, esters, ketones, amides, lactones and the like.

As (D) solvent used for the photosensitive resin composition of this invention, description of the paragraph numbers 0166-0169 of Unexamined-Japanese-Patent No. 2011-215580 can be referred, for example.
These solvents can be used alone or in combination of two or more. The solvent that can be used in the present invention is a single type or a combination of two types, more preferably a combination of two types, propylene glycol monoalkyl ether acetates or dialkyl ethers, diacetates. And diethylene glycol dialkyl ethers, or esters and butylene glycol alkyl ether acetates are more preferably used in combination, and propylene glycol monomethyl ether acetate and diethylene glycol ethyl methyl ether are most preferably used in combination.

Component D is preferably a solvent having a boiling point of 130 ° C. or higher and lower than 160 ° C., a solvent having a boiling point of 160 ° C. or higher, or a mixture thereof, a solvent having a boiling point of 130 ° C. or higher and lower than 160 ° C., a boiling point of 160 ° C. or higher and 200 ° C. A solvent having a boiling point of 130 ° C. or lower or a mixture thereof is more preferable, and a solvent having a boiling point of 130 ° C. or higher and lower than 160 ° C. and a solvent having a boiling point of 160 ° C. or higher and 200 ° C. or lower is more preferable.
Solvents having a boiling point of 130 ° C. or higher and lower than 160 ° C. include propylene glycol monomethyl ether acetate (boiling point 146 ° C.), propylene glycol monoethyl ether acetate (boiling point 158 ° C.), propylene glycol methyl-n-butyl ether (boiling point 155 ° C.), propylene glycol An example is methyl-n-propyl ether (boiling point 131 ° C.).
Solvents having a boiling point of 160 ° C or higher include ethyl 3-ethoxypropionate (boiling point 170 ° C), diethylene glycol methyl ethyl ether (boiling point 176 ° C), propylene glycol monomethyl ether propionate (boiling point 160 ° C), dipropylene glycol methyl ether acetate. (Boiling point 213 ° C), 3-methoxybutyl ether acetate (boiling point 171 ° C), diethylene glycol diethyl ether (boiling point 189 ° C), diethylene glycol dimethyl ether (boiling point 162 ° C), propylene glycol diacetate (boiling point 190 ° C), diethylene glycol monoethyl ether acetate (Boiling point 220 ° C), dipropylene glycol dimethyl ether (boiling point 175 ° C), 1,3-butylene glycol diacetate (boiling point 232 ° C) It can be.

  The content of the solvent (D) in the photosensitive resin composition of the present invention is 100 parts by mass of all resin components (preferably solid content, more preferably the (A) copolymer) in the photosensitive resin composition. It is preferably 50 to 3,000 parts by mass, more preferably 100 to 2,000 parts by mass, and even more preferably 150 to 1,500 parts by mass.

<Other ingredients>
In addition to the component (A), the component (B), the component (C) and the component (D), the positive photosensitive resin composition of the present invention includes (E) a sensitizer, F) A crosslinking agent, (G) an adhesion improver, (H) a basic compound, and (I) a surfactant can be preferably added. Further, the positive photosensitive resin composition of the present invention includes a plasticizer, a thermal radical generator, an antioxidant, a thermal acid generator, an ultraviolet absorber, a thickener, a development accelerator, and an organic or inorganic precipitate. Known additives such as inhibitors can be added.

(E) Sensitizer The photosensitive resin composition of the present invention preferably contains a sensitizer in order to promote its decomposition in a combination with (B) a photoacid generator. The sensitizer absorbs actinic rays or radiation and enters an electronically excited state. The sensitizer in an electronically excited state comes into contact with the photoacid generator, and effects such as electron transfer, energy transfer, and heat generation occur. Thereby, a photo-acid generator raise | generates a chemical change and decomposes | disassembles and produces | generates an acid. Examples of preferred sensitizers include compounds belonging to the following compounds and having an absorption wavelength in any of the wavelength ranges from 350 nm to 450 nm.

Polynuclear aromatics (eg, pyrene, perylene, triphenylene, anthracene, 9,10-dibutoxyanthracene, 9,10-diethoxyanthracene, 3,7-dimethoxyanthracene, 9,10-dipropyloxyanthracene), xanthenes (Eg, fluorescein, eosin, erythrosine, rhodamine B, rose bengal), xanthones (eg, xanthone, thioxanthone, dimethylthioxanthone, diethylthioxanthone), cyanines (eg, thiacarbocyanine, oxacarbocyanine), merocyanines ( For example, merocyanine, carbomerocyanine), rhodocyanines, oxonols, thiazines (eg, thionine, methylene blue, toluidine blue), acridines (eg, acridine oleoresin) Di, chloroflavin, acriflavine), acridones (eg, acridone, 10-butyl-2-chloroacridone), anthraquinones (eg, anthraquinone), squariums (eg, squalium), styryls, base styryls ( For example, 2- [2- [4- (dimethylamino) phenyl] ethenyl] benzoxazole), coumarins (for example, 7-diethylamino 4-methylcoumarin, 7-hydroxy-4-methylcoumarin, 2,3,6,7 -Tetrahydro-9-methyl-1H, 5H, 11H [1] benzopyrano [6,7,8-ij] quinolizine-11-non).
Among these sensitizers, polynuclear aromatics, acridones, styryls, base styryls, and coumarins are preferable, and polynuclear aromatics are more preferable. Of the polynuclear aromatics, anthracene derivatives are most preferred.

The addition amount of the sensitizer in the photosensitive resin composition of the present invention is preferably 0 to 1000 parts by weight, preferably 10 to 500 parts by weight, with respect to 100 parts by weight of the photoacid generator of the photosensitive resin composition. It is more preferable that it is 50 to 200 parts by weight.
Two or more kinds can be used in combination.

(F) Crosslinking agent It is preferable that the photosensitive resin composition of this invention contains a crosslinking agent as needed. By adding a crosslinking agent, the cured film obtained by the photosensitive resin composition of the present invention can be made a stronger film.
The crosslinking agent is not limited as long as a crosslinking reaction is caused by heat. (Excluding component A). For example, a compound having two or more epoxy groups or oxetanyl groups in the molecule described below, an alkoxymethyl group-containing crosslinking agent, or a compound having at least one ethylenically unsaturated double bond can be added. .
Among these crosslinking agents, compounds having two or more epoxy groups or oxetanyl groups in the molecule are preferable, and epoxy resins are particularly preferable.

  It is preferable that the addition amount of the crosslinking agent in the photosensitive resin composition of this invention is 0.01-50 weight part with respect to 100 weight part of total solids of the photosensitive resin composition, 0.5-30 More preferably, it is more preferably 2 to 10 parts by weight. By adding in this range, a cured film having excellent mechanical strength and solvent resistance can be obtained. A plurality of crosslinking agents may be used in combination. In that case, the content is calculated by adding all the crosslinking agents.

<Compound having two or more epoxy groups or oxetanyl groups in the molecule>
Specific examples of compounds having two or more epoxy groups in the molecule include bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, aliphatic epoxy resins, and the like. Can do.

These are available as commercial products. For example, a commercially available product described in paragraph number 0189 of JP2011-221494A can be mentioned.
In addition, ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, EP-4010S, EP-4011S (above, manufactured by ADEKA Corporation), NC-2000, NC-3000, NC-7300, XD-1000, EPPN-501, EPPN-502 (above, manufactured by ADEKA Corporation), Denacol EX-611, EX-612, EX-614, EX-614B, EX-622, EX-512, EX-521, EX-411, EX-421, EX-313, EX-314, EX-321, EX-211, EX-212, EX-810, EX-811, EX-850, EX-851, EX-821, EX-830, EX- 832, EX-841, EX-911, EX-941, EX-920, EX-931, EX-212L, EX- 14L, EX-216L, EX-321L, EX-850L, DLC-201, DLC-203, DLC-204, DLC-205, DLC-206, DLC-301, DLC-402 (manufactured by Nagase Chemtech), YH -300, YH-301, YH-302, YH-315, YH-324, YH-325 (manufactured by Nippon Steel Chemical Co., Ltd.) and the like.
These can be used alone or in combination of two or more.

  Among these, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, aliphatic epoxy, and aliphatic epoxy resin are more preferable, and bisphenol A type epoxy resin is particularly preferable.

  As specific examples of the compound having two or more oxetanyl groups in the molecule, Aron oxetane OXT-121, OXT-221, OX-SQ, PNOX (manufactured by Toagosei Co., Ltd.) can be used.

  As other crosslinking agents, alkoxymethyl group-containing crosslinking agents described in paragraphs 0107 to 0108 of JP2012-8223A and compounds having at least one ethylenically unsaturated double bond are also preferably used. be able to.

(G) Adhesion improving agent The photosensitive resin composition of the present invention may contain (G) an adhesion improving agent. The adhesion improver (G) that can be used in the photosensitive resin composition of the present invention includes an inorganic substance serving as a substrate, for example, a silicon compound such as silicon, silicon oxide, and silicon nitride, a metal such as gold, copper, and aluminum. It is a compound that improves adhesion to an insulating film. Specific examples include silane coupling agents and thiol compounds. The silane coupling agent (G) used as an adhesion improver used in the present invention is for the purpose of modifying the interface, and any known silane coupling agent can be used without any particular limitation.
Preferred silane coupling agents include, for example, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-glycidoxypropyltriacoxysilane, γ-glycidoxypropylalkyldialkoxysilane, γ- Methacryloxypropyltrialkoxysilane, γ-methacryloxypropylalkyldialkoxysilane, γ-chloropropyltrialkoxysilane, γ-mercaptopropyltrialkoxysilane, β- (3,4-epoxycyclohexyl) ethyltrialkoxysilane, vinyltri An alkoxysilane is mentioned. Of these, γ-glycidoxypropyltrialkoxysilane and γ-methacryloxypropyltrialkoxysilane are more preferable, γ-glycidoxypropyltrialkoxysilane is more preferable, and 3-glycidoxypropyltrimethoxysilane is more preferable. Further preferred. These can be used alone or in combination of two or more. These are effective in improving the adhesion to the substrate and are also effective in adjusting the taper angle with the substrate.
The content of the (G) adhesion improving agent in the photosensitive resin composition of the present invention is preferably 0.1 to 30 parts by mass with respect to 100 parts by mass of the total solid content in the photosensitive resin composition. 10 mass parts is more preferable.

(H) Basic compound The photosensitive resin composition of the present invention may contain (H) a basic compound. (H) The basic compound can be arbitrarily selected from those used in chemically amplified resists. Examples include aliphatic amines, aromatic amines, heterocyclic amines, quaternary ammonium hydroxides, quaternary ammonium salts of carboxylic acids, and the like. Specific examples thereof include compounds described in paragraph numbers 0204 to 0207 of JP2011-221494A.

  The basic compounds that can be used in the present invention may be used singly or in combination of two or more. However, it is preferable to use two or more in combination, and it is more preferable to use two in combination. It is preferable to use two kinds of heterocyclic amines in combination.

  The content of the basic compound (H) in the photosensitive resin composition of the present invention is preferably 0.001 to 1 part by mass with respect to 100 parts by mass of the total solid content in the photosensitive resin composition. It is more preferable that it is 0.005-0.2 mass part.

(I) Surfactant The photosensitive resin composition of the present invention may contain (I) a surfactant. (I) As the surfactant, any of anionic, cationic, nonionic, or amphoteric surfactants can be used, but a preferred surfactant is a nonionic surfactant.
Examples of nonionic surfactants include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkyl phenyl ethers, higher fatty acid diesters of polyoxyethylene glycol, silicone-based and fluorine-based surfactants. . In addition, the following trade names are KP (manufactured by Shin-Etsu Chemical Co., Ltd.), Polyflow (manufactured by Kyoeisha Chemical Co., Ltd.), F-Top (manufactured by JEMCO), MegaFac (manufactured by DIC Corporation), Florard (Sumitomo 3M) (Manufactured by Co., Ltd.), Asahi Guard, Surflon (manufactured by Asahi Glass Co., Ltd.), PolyFox (manufactured by OMNOVA), SH-8400 (Toray Dow Corning Silicone), and the like.
Further, as the surfactant, compounds described in paragraph numbers 0185 to 0188 of JP2011-215580A can also be employed.

These surfactants can be used individually by 1 type or in mixture of 2 or more types.
The addition amount of (I) surfactant in the photosensitive resin composition of the present invention is preferably 10 parts by mass or less with respect to 100 parts by mass of the total solid content in the photosensitive resin composition, 0.001 It is more preferably 10 to 10 parts by mass, further preferably 0.01 to 10 parts by mass, still more preferably 0.01 to 3 parts by mass, and 0.01 to 1 part by mass. Is particularly preferred.

Antioxidant The photosensitive resin composition of the present invention may contain an antioxidant. As an antioxidant, a well-known antioxidant can be contained. By adding an antioxidant, there is an advantage that coloring of the cured film can be prevented, or a decrease in film thickness due to decomposition can be reduced, and heat-resistant transparency is excellent.
Examples of such antioxidants include phosphorus antioxidants, hydrazides, hindered amine antioxidants, sulfur antioxidants, phenolic antioxidants, ascorbic acids, zinc sulfate, sugars, nitrites, sulfites. Examples thereof include salts, thiosulfates, and hydroxylamine derivatives. Among these, a phenolic antioxidant is particularly preferable from the viewpoint of coloring the cured film and reducing the film thickness. These may be used alone or in combination of two or more.

Examples of commercially available phenolic antioxidants include ADK STAB AO-20, ADK STAB AO-30, ADK STAB AO-40, ADK STAB AO-50, ADK STAB AO-60, ADK STAB AO-70 and ADK STAB AO manufactured by ADEKA Corporation. -80, ADK STAB AO-330, Sumitizer Chemical Co., Ltd., Sumilizer GM, Sumilizer GS, Sumilizer MDP-S, Sumizer ZBM-S, Sumizer ZX, IRGANOX10 NO. IRGANOX 1135, IRGANOX 1330, IRGANOX 1726, IRGANOX 1425WL, IR ANOX1520L, IRGANOX245, IRGANOX259, IRGANOX3114, IRGANOX565, IRGAMOD295, Yoshinox BHT, Yoshinox BB, Yoshinox T3, Yoshinox T3, Yoshinox T3, Is mentioned.
Among them, ADK STAB AO-60, ADK STAB AO-80 (manufactured by ADEKA, Inc.), and Irganox 1098 (manufactured by Ciba Japan Co., Ltd.) are preferable.

The content of the antioxidant is preferably 0.1 to 10% by mass, more preferably 0.2 to 5% by mass, based on the total solid content of the photosensitive resin composition. It is particularly preferably 5 to 4% by mass. By setting it within this range, sufficient transparency of the formed film can be obtained, and the sensitivity at the time of pattern formation becomes good.
As additives other than antioxidants, various ultraviolet absorbers described in “New Development of Polymer Additives (Nikkan Kogyo Shimbun Co., Ltd.)”, metal deactivators, and the like are used in the present invention. You may add to a resin composition.

In the present invention, it is also preferable to use a sulfonic acid ester that does not substantially generate an acid by irradiation with exposure light and generates an acid by heat.
The fact that acid is not substantially generated by exposure light exposure can be determined by no change in the spectrum by IR spectrum or NMR spectrum measurement before and after the exposure of the compound.
The molecular weight of the sulfonic acid ester is preferably 230 to 1,000, and more preferably 230 to 800.
As the sulfonic acid ester that can be used in the present invention, a commercially available one may be used, or one synthesized by a known method may be used. The sulfonic acid ester can be synthesized, for example, by reacting a sulfonyl chloride or sulfonic acid anhydride with a corresponding polyhydric alcohol under basic conditions.
The content of the thermal acid generator in the photosensitive resin composition is preferably 0.5 to 20 parts by weight and more preferably 1 to 15 parts by weight when the total content of the component (A) is 100 parts by weight. .

等を挙げることができる。
本発明で用いることができる酸増殖剤としては、酸発生剤から発生した酸によって分解し、ジクロロ酢酸、トリクロロ酢酸、メタンスルホン酸、ベンゼンスルホン酸、トリフルオロメタンスルホン酸、フェニルホスホン酸などのｐＫａが３以下の酸を発生させる化合物を挙げることができる。
酸増殖剤の感光性樹脂組成物への含有量は、光酸発生剤１００重量部に対して、１０〜１，０００重量部とするのが、露光部と未露光部との溶解コントラストの観点から好ましく、２０〜５００重量部とするのがさらに好ましい。 [Acid multiplication agent]
In the photosensitive resin composition of the present invention, an acid proliferating agent can be used for the purpose of improving sensitivity.
The acid proliferating agent that can be used in the present invention is a compound that can further generate an acid by an acid-catalyzed reaction to increase the acid concentration in the reaction system, and is a compound that exists stably in the absence of an acid. is there. In such a compound, since one or more acids increase in one reaction, the reaction proceeds at an accelerated rate as the reaction proceeds. However, the generated acid itself induces self-decomposition, and is generated here. The acid strength is preferably 3 or less as an acid dissociation constant, pKa, and particularly preferably 2 or less.
Specific examples of the acid proliferating agent include paragraph numbers 0203 to 0223 of JP-A-10-1508, paragraphs 0016 to 0055 of JP-A-10-282642, and page 39 of JP-T 9-512498. The compounds described on the 12th line to the 47th line on the 2nd line can be mentioned.
In particular

Etc.
Examples of the acid proliferating agent that can be used in the present invention include pKa such as dichloroacetic acid, trichloroacetic acid, methanesulfonic acid, benzenesulfonic acid, trifluoromethanesulfonic acid, and phenylphosphonic acid, which are decomposed by an acid generated from the acid generator. Examples include compounds that generate 3 or less acids.
The content of the acid proliferating agent in the photosensitive resin composition is 10 to 1,000 parts by weight with respect to 100 parts by weight of the photoacid generator, from the viewpoint of dissolution contrast between the exposed and unexposed parts. To 20 to 500 parts by weight is more preferable.

[Development accelerator]
The photosensitive resin composition of the present invention can contain a development accelerator.
As the development accelerator, any compound having a development acceleration effect can be used, but it is preferably a compound having at least one structure selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, and an alkyleneoxy group. Or the compound which has a phenolic hydroxyl group is more preferable, and the compound which has a phenolic hydroxyl group is the most preferable.
The molecular weight of the (M) development accelerator is preferably 100 to 2000, more preferably 100 to 1000, and most preferably 100 to 800.

Examples of development accelerators having an alkyleneoxy group include polyethylene glycol, polyethylene glycol monomethyl ether, polyethylene glycol dimethyl ether, polyethylene glycol glyceryl ester, polypropylene glycol glyceryl ester, polypropylene glycol diglyceryl ester, polybutylene glycol, Examples thereof include polyethylene glycol-bisphenol A ether, polypropylene glycol-bisphenol A ether, polyoxyethylene alkyl ether, polyoxyethylene alkyl ester, and compounds described in JP-A-9-222724.
Examples of those having a carboxyl group include maleic acid, fumaric acid, acetylene carboxylic acid, 1,4-cyclohexanedicarboxylic acid, suberic acid, adipic acid, citric acid, malic acid and the like. In addition, compounds described in JP-A 2000-66406, JP-A 9-6001, JP-A 10-20501, JP-A 11-338150 and the like can be mentioned.
Examples of those having a phenolic hydroxyl group include JP-A No. 2005-346024, JP-A No. 10-133366, JP-A No. 9-194415, JP-A No. 9-222724, JP-A No. 11-171810, Examples thereof include compounds described in JP 2007-121766, JP-A-9-297396, JP-A 2003-43679, and the like. Among these, a phenol compound having 2 to 10 benzene rings is preferable, and a phenol compound having 2 to 5 benzene rings is more preferable. Particularly preferred is a phenolic compound disclosed as a dissolution accelerator in JP-A-10-133366.

A development accelerator may be used individually by 1 type, and can also use 2 or more types together.
The addition amount of the development accelerator in the photosensitive resin composition of the present invention is preferably 0 to 30 parts by mass when the component (A) is 100 parts by mass from the viewpoints of sensitivity and residual film ratio. 20 mass parts is more preferable, and it is most preferable that it is 0.5-10 mass parts.
In addition, as other additives, thermal radical generators and thermal acid generators described in paragraph numbers 0120 to 0121 of JP2012-8223A can also be used.

[Method for producing cured film]
Next, the manufacturing method of the cured film of this invention is demonstrated.
The method for producing a cured film of the present invention preferably includes the following steps (1) to (5).
(1) A step of applying the positive photosensitive resin composition of the present invention on a substrate;
(2) removing the solvent from the applied positive photosensitive resin composition;
(3) a step of exposing with actinic rays;
(4) developing with an aqueous developer;
(5) A post-bake process for thermosetting.
Each step will be described below in order.

In the application step (1), the positive photosensitive resin composition of the present invention is preferably applied onto a substrate to form a wet film containing a solvent.
In the solvent removing step (2), the solvent is removed from the applied film by vacuum (vacuum) and / or heating to form a dry coating film on the substrate.

  In the exposure step (3), the obtained coating film is irradiated with actinic rays having a wavelength of 300 nm or more and 450 nm or less. In this step, (B) the photoacid generator is decomposed to generate an acid. By the catalytic action of the generated acid, the acid-decomposable group contained in the copolymer (A) is hydrolyzed to produce a carboxyl group or a phenolic hydroxyl group.

  In order to accelerate the hydrolysis reaction in the region where the acid catalyst is generated, post-exposure heat treatment: Post Exposure Bake (hereinafter also referred to as “PEB”) is performed. PEB can promote the formation of a carboxyl group or a phenolic hydroxyl group from an acid-decomposable group. The temperature for performing PEB is preferably 30 ° C. or higher and 130 ° C. or lower, more preferably 40 ° C. or higher and 110 ° C. or lower, and particularly preferably 50 ° C. or higher and 100 ° C. or lower.

  The acid-decomposable group in the structural unit represented by the formula (a1-1) in the present invention has a low activation energy for acid decomposition, and is easily decomposed by an acid derived from an acid generator by exposure to a carboxyl group or phenol. A positive image can also be formed by development without necessarily carrying out PEB, since a functional hydroxyl group is produced. In the method for producing a cured film of the present invention, the photosensitive resin composition of the present invention is used. By performing the post-bake process, the obtained cured film can reduce heat flow. Therefore, when the cured film obtained by the method for producing a cured film of the present invention is used for a substrate as a resist, for example, even if the cured film of the present invention is heated together with the substrate, the resolution of the pattern hardly deteriorates. In the present specification, “heat flow” means that the cross-sectional shape of a patterned cured film formed by exposure and development steps is to heat the cured film (preferably 180 ° C. or more, more preferably 200 ° C. to 240 ° C. ) When deformed and the dimensions, taper angle, etc. deteriorate.

In the developing step (4), a copolymer having a liberated carboxyl group or phenolic hydroxyl group is developed using an alkaline developer. A positive image is formed by removing an exposed area containing a resin composition having a carboxyl group or a phenolic hydroxyl group that is easily dissolved in an alkaline developer.
In the post-baking step of (5), the obtained positive image is heated to thermally decompose the acid-decomposable group in the structural unit (a1) to generate a carboxyl group or a phenolic hydroxyl group, thereby forming the structural unit (a2). A cured film can be formed by crosslinking with a crosslinking group, a crosslinking agent, or the like. This heating is preferably performed at a high temperature of 150 ° C. or more, more preferably 180 to 250 ° C., and particularly preferably 200 to 240 ° C. The heating time can be appropriately set depending on the heating temperature or the like, but is preferably in the range of 10 to 120 minutes.
When a step of irradiating the entire surface with actinic rays, preferably ultraviolet rays, is added before the post-baking step, the crosslinking reaction can be promoted by an acid generated by actinic ray irradiation.
Furthermore, the cured film obtained from the photosensitive resin composition of the present invention can also be used as a dry etching resist.
When the cured film obtained by thermal curing in the post-baking step (5) is used as a dry etching resist, dry etching processing such as ashing, plasma etching, ozone etching, or the like can be performed as the etching processing.
Next, the formation method of the cured film using the photosensitive resin composition of this invention is demonstrated concretely.

<Method for preparing photosensitive resin composition>
The photosensitive resin composition is prepared by mixing the essential components (A) to (D) at a predetermined ratio and by any method, and stirring and dissolving. For example, it is possible to prepare a resin composition by mixing the components (A) to (C) in advance in a solution in which the components (A) to (C) are previously dissolved in the solvent (D) and mixing them at a predetermined ratio. The composition solution prepared as described above can be used after being filtered using a filter having a pore size of 0.2 μm or the like.

<Application process and solvent removal process>
A desired dry coating film can be formed by applying the photosensitive resin composition to a predetermined substrate and removing the solvent by decompression and / or heating (pre-baking). Examples of the substrate include, for example, a glass plate in which a polarizing plate, a black matrix layer and a color filter layer are provided as necessary, and a transparent conductive circuit layer is further provided in the production of a liquid crystal display element. Although there is no restriction | limiting in particular as a method of applying the photosensitive resin composition to a board | substrate, Among these, it is preferable to apply | coat a photosensitive resin composition to a board | substrate in this invention. The coating method to a board | substrate is not specifically limited, For example, methods, such as a slit coat method, a spray method, a roll coat method, a spin coat method, can be used. Among them, the slit coating method is preferable from the viewpoint of being suitable for a large substrate. Manufacturing with a large substrate is preferable because of high productivity. Here, the large substrate means a substrate having a size of 1 m or more and 5 m or less on each side.

  Further, (2) the heating conditions in the solvent removal step are such that the acid-decomposable group is decomposed in the structural unit (a1) in the component (A) in the unexposed area, and the component (A) is not soluble in the alkaline developer. Although it varies depending on the type and blending ratio of each component, it is preferably about 80 to 130 ° C. for 30 to 120 seconds.

<Exposure process and development process (pattern formation method)>
In the exposure step, the substrate provided with the coating film is irradiated with actinic rays through a mask having a predetermined pattern. After the exposure step, heat treatment (PEB) is performed as necessary, and then in the development step, the exposed area is removed using an alkaline developer to form an image pattern.
For exposure with actinic light, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a chemical lamp, an LED light source, an excimer laser generator, or the like can be used. Actinic rays having a wavelength of 300 nm to 450 nm can be preferably used. Moreover, irradiation light can also be adjusted through spectral filters, such as a long wavelength cut filter, a short wavelength cut filter, and a band pass filter, as needed.

  The developer used in the development step preferably contains a basic compound. Examples of the basic compound include alkali metal hydroxides such as lithium hydroxide, sodium hydroxide and potassium hydroxide; alkali metal carbonates such as sodium carbonate and potassium carbonate; alkalis such as sodium bicarbonate and potassium bicarbonate Metal bicarbonates; ammonium hydroxides such as tetramethylammonium hydroxide, tetraethylammonium hydroxide and choline hydroxide; aqueous solutions such as sodium silicate and sodium metasilicate can be used. An aqueous solution obtained by adding an appropriate amount of a water-soluble organic solvent such as methanol or ethanol or a surfactant to the alkaline aqueous solution can also be used as a developer.

The pH of the developer is preferably 10.0 to 14.0.
The development time is preferably 30 to 180 seconds, and the development method may be any of a liquid piling method, a dip method, and the like. After the development, washing with running water is performed for 30 to 90 seconds, and a desired pattern can be formed.
A rinsing step can also be performed after development. In the rinsing step, the developed substrate and the development residue are removed by washing the developed substrate with pure water or the like. A known method can be used as the rinsing method. For example, shower rinse and dip rinse can be mentioned.

<Post-bake process (crosslinking process)>
For a pattern corresponding to an unexposed area obtained by development, using a heating device such as a hot plate or oven, at a predetermined temperature, for example, 180 to 250 ° C., for a predetermined time, for example, 5 to 90 minutes on the hot plate, In the case of an oven, a protective film or an interlayer insulating film having excellent heat resistance, hardness, etc. can be formed by carrying out a heat treatment for 30 to 120 minutes to cause a crosslinking reaction. In addition, when heat treatment is performed, the transparency can be improved by performing the heat treatment in a nitrogen atmosphere.
Prior to post-baking, post-baking can be performed after baking at a relatively low temperature (addition of a middle baking process). When performing middle baking, it is preferable to post-bake at a high temperature of 200 ° C. or higher after heating at 90 to 150 ° C. for 1 to 60 minutes. Moreover, middle baking and post-baking can be heated in three or more stages. The taper angle of the pattern can be adjusted by devising such middle baking and post baking. These heating methods can use well-known heating methods, such as a hotplate, oven, and an infrared heater.
Prior to the heat treatment, the substrate on which the pattern is formed is re-exposed with actinic rays and then post-baked (re-exposure / post-bake) to generate an acid from the component (B) present in the unexposed portion, thereby crosslinking. It is preferable to function as a catalyst that accelerates the process.
That is, the method for forming a cured film of the present invention preferably includes a re-exposure step in which re-exposure is performed with actinic rays between the development step and the post-bake step. The exposure in the re-exposure step may be performed by the same means as in the exposure step. In the re-exposure step, the entire surface is exposed on the side of the substrate on which the film is formed by the photosensitive resin composition of the present invention. It is preferable.
A preferable exposure amount in the re-exposure step is 100 to 1,000 mJ / cm ² .

[Curing film]
The cured film of the present invention is a cured film obtained by curing the photosensitive resin composition of the present invention.
The cured film of the present invention can be suitably used as an interlayer insulating film. Moreover, it is preferable that the cured film of this invention is a cured film obtained by the formation method of the cured film of this invention.
With the photosensitive resin composition of the present invention, an interlayer insulating film having excellent insulation and high transparency even when baked at high temperatures can be obtained. Since the interlayer insulating film using the photosensitive resin composition of the present invention has high transparency and excellent cured film physical properties, it is useful for applications of organic EL display devices and liquid crystal display devices.

[Organic EL display device, Liquid crystal display device]
The organic EL display device and the liquid crystal display device of the present invention are characterized by including the cured film of the present invention.
The organic EL display device or liquid crystal display device of the present invention is not particularly limited except that it has a planarizing film or an interlayer insulating film formed using the photosensitive resin composition of the present invention, and has various structures. Various known organic EL display devices and liquid crystal display devices can be used.
Moreover, the photosensitive resin composition of this invention and the cured film of this invention are not limited to the said use, It can be used for various uses. For example, in addition to the planarization film and interlayer insulating film, a protective film for the color filter, a spacer for keeping the thickness of the liquid crystal layer in the liquid crystal display device constant, a microlens provided on the color filter in the solid-state imaging device, etc. Can be suitably used.

FIG. 1 is a conceptual diagram illustrating an example of an organic EL display device. A schematic cross-sectional view of a substrate in a bottom emission type organic EL display device is shown, and a planarizing film 4 is provided.
A bottom gate type TFT 1 is formed on a glass substrate 6, and an insulating film 3 made of Si ₃ N ₄ is formed so as to cover the TFT 1. A contact hole (not shown) is formed in the insulating film 3, and then a wiring 2 (height: 1.0 μm) connected to the TFT 1 through the contact hole is formed on the insulating film 3. The wiring 2 is for connecting the TFT 1 with an organic EL element formed between the TFTs 1 or in a later process.
Further, in order to flatten the unevenness due to the formation of the wiring 2, the flattening layer 4 is formed on the insulating film 3 in a state where the unevenness due to the wiring 2 is embedded.
On the planarizing film 4, a bottom emission type organic EL element is formed. That is, the first electrode 5 made of ITO is formed on the planarizing film 4 so as to be connected to the wiring 2 through the contact hole 7. The first electrode 5 corresponds to the anode of the organic EL element.
An insulating film 8 having a shape covering the periphery of the first electrode 5 is formed. By providing the insulating film 8, a short circuit between the first electrode 5 and the second electrode formed in the subsequent process is prevented. can do.
Further, although not shown in FIG. 1, a hole transport layer, an organic light emitting layer, and an electron transport layer are sequentially deposited through a desired pattern mask, and then a first layer made of Al is formed on the entire surface above the substrate. An active matrix organic material in which two electrodes are formed and sealed by bonding using a sealing glass plate and an ultraviolet curable epoxy resin, and each organic EL element is connected to a TFT 1 for driving it. An EL display device is obtained.

  FIG. 2 is a conceptual cross-sectional view showing an example of the active matrix type liquid crystal display device 10. The color liquid crystal display device 10 is a liquid crystal panel having a backlight unit 12 on the back surface, and the liquid crystal panel includes all pixels disposed between two glass substrates 14 and 15 having a polarizing film attached thereto. The elements of the TFT 16 corresponding to are arranged. Each element formed on the glass substrate is wired with an ITO transparent electrode 19 that forms a pixel electrode through a contact hole 18 formed in the cured film 17. On the ITO transparent electrode 19, an RGB color filter 22 in which a liquid crystal 20 layer and a black matrix are arranged is provided.

  The present invention will be described more specifically with reference to the following examples. The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. Unless otherwise specified, “part” and “%” are based on mass.

ＥＤＭ：ジエチレングリコールエチルメチルエーテル（東邦化学工業製、ハイソルブＥＤＭ） (A) Polymer component In the following synthesis examples, the following symbols represent the following compounds, respectively.
V-65: 2,2′-azobis (2,4-dimethylvaleronitrile) (manufactured by Wako Pure Chemical Industries, Ltd.)
V-601: Dimethyl-2,2′-azobis (2-methylpropionate) (manufactured by Wako Pure Chemical Industries, Ltd.)
MAEVE: 1-ethoxyethyl methacrylate MATHF: tetrahydro-2H-furan-2-yl methacrylate MATHP: tetrahydro-2H-pyran-2-yl methacrylate StOEVE: 4- (1-ethoxyethyloxy) styrene IBMA: i- Butoxymethylacrylamide (manufactured by Tokyo Chemical Industry)
GMA: Glycidyl methacrylate OXE-30: Methacrylic acid (3-ethyloxetane-3-yl) methyl (manufactured by Osaka Organic Chemical Industry Co., Ltd.)
HEMA: 2-hydroxyethyl methacrylate THFFMA: tetrahydrofurfuryl methacrylate St: styrene MMA: methyl methacrylate MAA: methacrylic acid AA: acrylic acid DCPM: dicyclopentanyl methacrylate

EDM: Diethylene glycol ethyl methyl ether (manufactured by Toho Chemical Industry, Hisolv EDM)

<Synthesis of MATHF>
Methacrylic acid (86 g, 1 mol) was cooled to 15 ° C., and camphorsulfonic acid (4.6 g, 0.02 mol) was added. To the solution, 2-dihydrofuran (71 g, 1 mol, 1.0 equivalent) was added dropwise. After stirring for 1 hour, saturated sodium bicarbonate (500 mL) was added, extracted with ethyl acetate (500 mL), dried over magnesium sulfate, insolubles were filtered and concentrated under reduced pressure at 40 ° C. or lower to give a residual yellow oily product. Distillation under reduced pressure afforded 125 g of tetrahydro-2H-furan-2-yl methacrylate (MATHF) as a colorless oily substance (yield 80%) at a boiling point (bp.) Of 54 to 56 ° C./3.5 mmHg.

<Synthesis of Polymer A-1>
Polymer A-1 which is a copolymer (A) was synthesized as follows.
After adding phenothiazine (0.5 part) to ethyl vinyl ether (144.2 parts, 2 molar equivalents) and adding dropwise methacrylic acid (86.1 parts, 1 molar equivalent) while cooling the reaction system to 10 ° C or lower. And stirred at room temperature (25 ° C.) for 4 hours. After adding pyridinium p-toluenesulfonate (5.0 parts), the mixture was stirred at room temperature for 2 hours and allowed to stand overnight at room temperature. Sodium bicarbonate (5 parts) and sodium sulfate (5 parts) were added to the reaction mixture, and the mixture was stirred at room temperature for 1 hour. The insoluble matter was filtered and concentrated under reduced pressure at 40 ° C. or lower. (Bp.) 1-ethoxyethyl methacrylate (MAEVE) (134.0 parts) of a 43-45 ° C./7 mmHg fraction was obtained as a colorless oil.

Obtained 1-ethoxyethyl methacrylate (63.28 parts (0.4 molar equivalent)), GMA (42.65 parts (0.3 molar equivalent)), MAA (8.61 parts (0.1 molar equivalent) )), HEMA (26.03 parts (0.2 molar equivalent)) and EDM (110.8 parts) were heated to 80 ° C. under a stream of nitrogen. While stirring this mixed solution, a mixed solution of radical polymerization initiator V-601 (trade name, manufactured by Wako Pure Chemical Industries, Ltd., 4 parts) and EDM (100.0 parts) was added dropwise over 2.5 hours. did. After completion of the dropwise addition, the mixture was reacted at 80 ° C. for 4 hours to obtain an EDM solution of polymer A-1 (solid content concentration: 40%).
The weight average molecular weight measured by gel permeation chromatography (GPC) of the obtained polymer A-1 was 15,000.

<Synthesis of other polymers>
Each copolymer was synthesized in the same manner as the synthesis of polymer A-1, except that each monomer used and the amount used thereof were changed to those shown in the following table.

(B) Photoacid generator B-1: Irgacure PAG-103 (trade name, structure shown below, manufactured by BASF)
B-2: PAI-101 (trade name, structure shown below, manufactured by Midori Chemical Co., Ltd.)
B-5: Structure shown below (synthesis examples will be described later)
B-6: Structure shown below (synthesis example will be described later)
B-9: N-hydroxynaphthalimide methanesulfonate B-10: TPS-1000 (trade name, structure shown below, manufactured by Midori Chemical Co., Ltd.)

<Synthesis of B-5>
1-1. Synthesis of Synthetic Intermediate B-5A 2-Aminobenzenethiol: 31.3 g (manufactured by Tokyo Chemical Industry Co., Ltd.) was dissolved in toluene: 100 mL (manufactured by Wako Pure Chemical Industries, Ltd.) at room temperature (25 ° C.). . Next, 40.6 g of phenylacetyl chloride (manufactured by Tokyo Chemical Industry Co., Ltd.) was added dropwise to the resulting solution, and the mixture was stirred at room temperature for 1 hour and then at 100 ° C. for 2 hours to cause a reaction. 500 mL of water was added to the resulting reaction solution to dissolve the precipitated salt, the toluene oil was extracted, and the extract was concentrated with a rotary evaporator to obtain a synthetic intermediate B-5A.

1-2. Synthesis of B-5 2.25 g of the synthetic intermediate B-5A obtained as described above was mixed with 10 mL of tetrahydrofuran (manufactured by Wako Pure Chemical Industries, Ltd.), and then placed in an ice bath and the reaction solution was kept at 5 ° C. Cooled to: Next, tetramethylammonium hydroxide: 4.37 g (25% by mass methanol solution, manufactured by Alfa Acer) was added dropwise to the reaction solution, and the mixture was stirred for 0.5 hour in an ice bath for reaction. Furthermore, 7.03 g of isopentyl nitrite: was dropped while maintaining the internal temperature at 20 ° C. or lower, and after completion of the dropping, the reaction solution was warmed to room temperature and stirred for 1 hour.
Subsequently, after cooling the reaction liquid to 5 ° C. or lower, p-toluenesulfonyl chloride (1.9 g) (manufactured by Tokyo Chemical Industry Co., Ltd.) was added, and stirred for 1 hour while maintaining 10 ° C. or lower. Thereafter, 80 mL of water was added and stirred at 0 ° C. for 1 hour. After filtration of the resulting precipitate, 60 mL of isopropyl alcohol (IPA) was added, heated to 50 ° C., stirred for 1 hour, filtered while hot, and dried to obtain B-5 (the aforementioned structure). 8 g was obtained.
¹ H-NMR spectrum (300 MHz, deuterated DMSO ((D ₃ C) ₂ S═O)) of the obtained B-5 is δ = 8.2 to 8.17 (m, 1H), 8.03 to It was 8.00 (m, 1H), 7.95 to 7.9 (m, 2H), 7.6 to 7.45 (m, 9H), 2.45 (s, 3H).
From the above ¹ H-NMR measurement results, it is estimated that the obtained B-5 is a single geometric isomer.

<Synthesis of B-6>
Aluminum chloride (10.6 g) and 2-chloropropionyl chloride (10.1 g) were added to a suspension of 2-naphthol (10 g) and chlorobenzene (30 mL), and the mixture was heated to 40 ° C. for 2 hours. I let you. Under ice-cooling, 4N HCl aqueous solution (60 mL) was added dropwise to the reaction solution, and ethyl acetate (50 mL) was added for liquid separation. Potassium carbonate (19.2 g) was added to the organic layer, reacted at 40 ° C. for 1 hour, 2N HCl aqueous solution (60 mL) was added and separated, and the organic layer was concentrated, and the crystals were diluted with diisopropyl ether (10 mL). The slurry was reslurried, filtered and dried to obtain a ketone compound (6.5 g).
Acetic acid (7.3 g) and a 50 mass% aqueous hydroxylamine solution (8.0 g) were added to a suspension of the obtained ketone compound (3.0 g) and methanol (30 mL), and the mixture was heated to reflux. After allowing to cool, water (50 mL) was added, and the precipitated crystals were filtered, washed with cold methanol, and dried to obtain an oxime compound (2.4 g).
The obtained oxime compound (1.8 g) was dissolved in acetone (20 mL), triethylamine (1.5 g) and p-toluenesulfonyl chloride (2.4 g) were added under ice cooling, and the temperature was raised to room temperature. Reacted for hours. Water (50 mL) was added to the reaction solution, and the precipitated crystals were filtered, then reslurried with methanol (20 mL), filtered and dried to obtain 2.3 g of B-6 (the above-mentioned structure).
In addition, the ¹ H-NMR spectrum (300 MHz, CDCl ₃ ) of B-6 is δ = 8.3 (d, 1H), 8.0 (d, 2H), 7.9 (d, 1H), 7. 8 (d, 1H), 7.6 (dd, 1H), 7.4 (dd, 1H) 7.3 (d, 2H), 7.1 (d.1H), 5.6 (q, 1H) , 2.4 (s, 3H), 1.7 (d, 3H).

Ｃ−２

Ｃ−３

Ｃ−４

Ｃ−５

Ｃ−６

Ｃ−７

Ｃ−８
Ｆ（ＣＦ₂）₈ＣＨ₂ＣＨ₂ＯＨ (C) Fluorine-containing compound C-1: the following compound, manufactured by Daikin Industries, Mw336
C-2: The following compound, manufactured by Daikin Industries, Mw410
C-3: The following compound, manufactured by Daikin Industries, Mw314
C-4: The following compound, manufactured by Daikin Industries, Mw444
C-5: The following compound, manufactured by Daikin Industries, Mw288
C-6: The following compound, manufactured by Daikin Industries, Mw278
C-7: The following compound, manufactured by Daikin Industries, Mw188
C-1

C-2

C-3

C-4

C-5

C-6

C-7

C-8
F (CF ₂ ) ₈ CH ₂ CH ₂ OH

c′-1: Perfluorooctyl sulfonate (Megafac F110, manufactured by DIC)
c'-2: Fluorine-containing acrylic resin polymer (Megafac F780F, manufactured by DIC Corporation)
c′-3: the following compound (Ftergent FT (manufactured by Neos))

(E) Component E-1: NBCA (the following structure, manufactured by Kurokin Kasei Co., Ltd.)
E-2: DBA (trade name, 9,10-dibutoxyanthracene, manufactured by Kawasaki Chemical Industries)

(F) Component F-1: JER157S65 (trade name, phenol novolac type epoxy resin, manufactured by Japan Epoxy Resins Co., Ltd.)
F-2: Nikarac MW-100LM (manufactured by Sanwa Chemical Co., Ltd.)
F-3: Trimethylolpropane triacrylate (manufactured by Toagosei)

(G) Component G-1: KBM-403 (trade name, 3-glycidoxypropyltrimethoxysilane, structure shown below, manufactured by Shin-Etsu Chemical Co., Ltd.)
G-2: KBM-5103 (trade name, 3-acryloxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd.)

(H) Component H-1: 1,5-diazabicyclo [4.3.0] -5-nonene H-2: Triphenylimidazole

(I) Component I-1: Polyoxyethylene sorbitan fatty acid ester type surfactant (Solgen 90, manufactured by Daiichi Kogyo Seiyaku)
I-2: Silicone surfactant SH-8400 (Toray Dow Corning Silicone)

Antioxidant AO-60: Hindered Phenol Adeka Stub AO-60 (manufactured by Adeka)
BC-90: NOFMER BC-90 manufactured by NOF Corporation SE-1: Suberic acid

[Example 1]
Each component was dissolved and mixed so that it might become the composition of a table | surface, and it filtered with the filter made from a polytetrafluoroethylene with a 0.2 micrometer aperture, and obtained the photosensitive resin composition of Example 1.

[Other Examples and Comparative Examples]
Except having changed each compound used in Example 1 into the compound of the following table | surface, it melt-mixed with the addition amount similar to Example 1, and prepared the photosensitive resin composition of a following Example and a comparative example. did.

<Evaluation of sensitivity>
Each photosensitive resin composition was slit-coated on a glass substrate (Corning 1737, 0.7 mm thickness (manufactured by Corning)) treated with hexamethyldisilazane vapor for 1 minute, and then heated at 85 ° C. for 150 seconds. Pre-baking was performed to volatilize the solvent, and a photosensitive resin composition layer having a film thickness of 4.0 μm was formed.
Next, the obtained photosensitive resin composition layer was exposed through a 9 μm hole pattern mask using a PLA-501F exposure machine (extra-high pressure mercury lamp) manufactured by Canon Inc. Then, the exposed photosensitive composition layer was developed with an alkali developer (0.4 mass% tetramethylammonium hydroxide aqueous solution) at 24 ° C./60 seconds, and then rinsed with ultrapure water for 20 seconds.
The optimum exposure dose (Eopt) when a 9 μm hole pattern was formed by these operations was defined as sensitivity. The evaluation criteria are as follows. A smaller value is more preferable, and 1 to 3 is a practical range.
1: 60mJ / cm ² less than ^2: 60mJ / cm 2 or more 90 mJ / cm ² less than 3: 90mJ / cm ² or more 120 mJ / cm ² less than 4: 120mJ / cm ² or more 150 mJ / cm ² less than 5: 150mJ / cm ² or more

<Evaluation of relative dielectric constant>
Bare wafer substrate (N-type low resistance) (manufactured by SUMCO) Each photosensitive resin composition is slit-coated, then pre-baked on a hot plate at 85 ° C. for 150 seconds to volatilize the solvent, and the film thickness is 0.3 μm. A resin composition layer was formed.
After being treated with an alkali developer (0.4 wt% tetramethylammonium hydroxide aqueous solution) at 24 ° C./60 seconds, it was rinsed with ultrapure water for 20 seconds.
Then, after irradiating with light of 500 mJ / cm ^{2 at} a wavelength of 365 nm using an ultra-high pressure mercury lamp, it was heated in an oven at 210 ° C. for 70 minutes to obtain a cured film.
For this cured film, the relative dielectric constant was measured at a measurement frequency of 10 KHz using CVmap92A (manufactured by Four Dimensions Inc.).
The evaluation criteria are as follows. A smaller value is more preferable, and 1 to 3 is a practical range.
1: Less than 3.3 2: 3.3 or more but less than 3.4 3: 3.4 or more but less than 3.5 4: 3.5 or more but less than 3.6 5: 3.6 or more

<Evaluation of substrate adhesion>
After each photosensitive resin composition is slit-coated on a substrate (molybdenum, titanium), it is pre-baked on a hot plate at 85 ° C. for 150 seconds to volatilize the solvent to form a photosensitive resin composition layer having a thickness of 0.3 μm. did.
After being treated with an alkali developer (0.4 wt% tetramethylammonium hydroxide aqueous solution) at 24 ° C./60 seconds, it was rinsed with ultrapure water for 20 seconds.
Then, after irradiating the light of 500 mJ / cm < ² > in wavelength 365nm using an ultrahigh pressure mercury lamp, it heated at 230 degreeC for 60 minute (s) in oven, and obtained the cured film.
The adhesiveness of this cured film was evaluated according to the cross cut test of JIS K5600.
1: Within 1 piece.
2: Peeling is 2 to 3 pieces.
3: Peeling 4-5 pieces 4: Peeling 6-7 pieces 5: Peeling 8 or more pieces

<Evaluation of pattern>
For each composition, each photosensitive resin composition was slit-coated on a silicon wafer substrate that had been surface-treated with hexamethyldisilazane vapor for 1 minute, and then pre-baked on a hot plate at 85 ° C. for 150 seconds to volatilize the solvent. Thus, a photosensitive resin composition layer having a film thickness of 4.0 μm was formed.
Next, using the NSR-2205i14E2F exposure machine (i-line stepper) manufactured by Nikon Corporation, the obtained photosensitive resin composition layer was formed into a 9 μm hole pattern shape, and the optimum exposure amount (Eopt) of each composition was set. Exposed. Then, the exposed photosensitive composition layer was developed with an alkali developer (0.4 mass% tetramethylammonium hydroxide aqueous solution) at 24 ° C./60 seconds, and then rinsed with ultrapure water for 20 seconds. After irradiating light of 500 mJ / cm ^{2 at} a wavelength of 365 nm using an ultrahigh pressure mercury lamp, heating in an oven at 140 ° C. for 20 minutes, 180 ° C. for 20 minutes, and further heating at 230 ° C. for 60 minutes to form a cured film Got. The hole pattern was observed with an electron microscope.
In all the examples, the hole pattern was clearly formed. The compound of the comparative example had a problem in pattern formability due to rattling of the hole edge portion and surface roughness of the non-exposed portion.

  As is clear from the above results, the photosensitive resin composition of the present invention was excellent in both sensitivity and relative dielectric constant. In contrast, the photosensitive resin composition of the comparative example was inferior in both sensitivity and relative dielectric constant, but either sensitivity or relative dielectric constant was significantly inferior. Further, as shown in Example 23, it was found that the photosensitive resin composition of the present invention can achieve both sensitivity and relative dielectric constant even when no crosslinking agent or other additives are added. It was.

[Example 30]
An organic EL display device using a thin film transistor (TFT) was produced by the following method (see FIG. 1).
A bottom gate type TFT 1 was formed on a glass substrate 6, and an insulating film 3 made of Si ₃ N ₄ was formed so as to cover the TFT 1. Next, a contact hole (not shown) is formed in the insulating film 3, and then a wiring 2 (height 1.0 μm) connected to the TFT 1 through the contact hole is formed on the insulating film 3. . The wiring 2 is used to connect the TFT 1 with an organic EL element formed between TFTs 1 or in a later process.

Further, in order to flatten the unevenness due to the formation of the wiring 2, the planarizing film 4 was formed on the insulating film 3 in a state where the unevenness due to the wiring 2 was embedded. The planarization film 4 is formed on the insulating film 3 by spin-coating the photosensitive resin composition of Example 16 on the substrate, pre-baking on a hot plate (90 ° C. × 2 minutes), and then applying high pressure from above the mask. After irradiating 45 mJ / cm ² (illuminance 20 mW / cm ² ) with i-line (365 nm) using a mercury lamp, a pattern was formed by developing with an alkaline aqueous solution, and heat treatment was performed at 230 ° C. for 60 minutes.
The applicability when applying the photosensitive resin composition was good, and no wrinkles or cracks were observed in the cured film obtained after exposure, development and baking. Furthermore, the average step of the wiring 2 was 500 nm, and the thickness of the prepared planarizing film 4 was 2,000 nm.

  Next, a bottom emission type organic EL element was formed on the obtained planarization film 4. First, a first electrode 5 made of ITO was formed on the planarizing film 4 so as to be connected to the wiring 2 through the contact hole 7. Thereafter, a resist was applied, prebaked, exposed through a mask having a desired pattern, and developed. Using this resist pattern as a mask, pattern processing was performed by wet etching using an ITO etchant. Thereafter, the resist pattern was stripped at 50 ° C. using a resist stripper (remover 100, manufactured by AZ Electronic Materials). The first electrode 5 thus obtained corresponds to the anode of the organic EL element.

  Next, an insulating film 8 having a shape covering the periphery of the first electrode 5 was formed. As the insulating film 8, the photosensitive resin composition of Example 18 was used, and the insulating film 8 was formed by the same method as described above. By providing this insulating film 8, it is possible to prevent a short circuit between the first electrode 5 and the second electrode formed in the subsequent process.

  Furthermore, a hole transport layer, an organic light emitting layer, and an electron transport layer were sequentially deposited through a desired pattern mask in a vacuum deposition apparatus. Next, a second electrode made of Al was formed on the entire surface above the substrate. The obtained board | substrate was taken out from the vapor deposition machine, and it sealed by bonding together using the glass plate for sealing, and an ultraviolet curable epoxy resin.

  As described above, an active matrix type organic EL display device in which each organic EL element is connected to the TFT 1 for driving the organic EL element was obtained. When a voltage was applied via the drive circuit, it was found that the organic EL display device showed good display characteristics and high reliability.

[Example 31]
In the active matrix liquid crystal display device described in FIG. 1 of Japanese Patent No. 3321003, a cured film 17 was formed as an interlayer insulating film as follows, and a liquid crystal display device of Example 31 was obtained.
That is, using the photosensitive resin composition of Example 18, the cured film 17 was formed as an interlayer insulating film by the same method as the method for forming the planarizing film 4 of the organic EL display device in the above Example.

  When a driving voltage was applied to the obtained liquid crystal display device, it was found that the liquid crystal display device showed good display characteristics and high reliability.

1: TFT (Thin Film Transistor)
2: Wiring 3: Insulating film 4: Flattened film 5: First electrode 6: Glass substrate 7: Contact hole 8: Insulating film 10: Liquid crystal display device 12: Backlight unit 14, 15: Glass substrate 16: TFT
17: Cured film 18: Contact hole 19: ITO transparent electrode 20: Liquid crystal 22: Color filter

Claims (16)

(A) a polymer component that satisfies at least one of the following (1) and (2):
(1) (a1) a structural unit having a residue in which an acid group is protected with an acid-decomposable group, and (a2) a polymer having a structural unit having a crosslinkable group,
(2) (a1) a polymer having a structural unit having a residue in which an acid group is protected with an acid-decomposable group, and (a2) a polymer having a structural unit having a crosslinkable group,
(B) a photoacid generator,
(C) a fluorine-containing compound, and
(D) a photosensitive resin composition containing a solvent,
The (C) fluorine-containing compound is a compound excluding a photoacid generator and a thermal acid generator, having at least one of a hydroxyphenyl group, a hydroxyalkyl group, an epoxy group, and an acid anhydride group, and having a molecular weight The photosensitive resin composition whose is 100-1000.   The photosensitive resin composition according to claim 1, wherein the number of carbons substituted with fluorine atoms in the (C) fluorine-containing compound is 2 to 6.   The photosensitive resin composition of Claim 1 whose carbon number substituted by the fluorine atom of the said (C) fluorine-containing compound is 2-4.   The photosensitive resin composition of any one of Claims 1-3 in which the said (C) fluorine-containing compound contains a 2 or more hydroxyphenyl group, a hydroxyalkyl group, an epoxy group, or an acid anhydride group. The (C) fluorine-containing compound is a hydroxyphenyl group, a hydroxyalkyl group, an epoxy group, and an acid anhydride group at both ends of a group consisting of an alkylene group, a fluorinated alkylene group, —O—, a phenylene group, and combinations thereof. The photosensitive resin composition of any one of Claims 1-4 which has a structure where any two of these couple | bonded. The photosensitive resin composition according to any one of claims 1 to 5 , wherein the structural unit (a1) is a structural unit having a residue in which a carboxy group is protected in the form of an acetal. The structural units (a1) is a structural unit represented by the following formula (A2 '), the photosensitive resin composition according to any one of claims 1-5.
Formula (A2 ′)

(Wherein R ¹ and R ² each represent a hydrogen atom, an alkyl group or an aryl group, at least ^one of R ¹ and R ² is an alkyl group or an aryl group, and R ³ is an alkyl group or Represents an aryl group, R ¹ or R ² and R ³ may be linked to form a cyclic ether, R ⁴ represents a hydrogen atom or a methyl group, and X represents a single bond or an arylene group; ) The crosslinkable group is an epoxy group, an oxetane group, -NH-CH ₂ -OR (R is an alkyl group having 1 to 20 carbon atoms) in any one of claim 1 to 7 at least one selected from The photosensitive resin composition as described. The photosensitive resin composition according to any one of claims 1 to 8 , wherein the photosensitive resin composition is a chemically amplified positive photosensitive resin composition. The (B) an acid generating agent, an oxime sulfonate compound or an onium salt compound, the photosensitive resin composition according to any one of claims 1-9. (1) applying a photosensitive resin composition according to the substrate in any one of claims 1-10,
(2) a step of removing the solvent from the applied photosensitive resin composition;
(3) a step of exposing with actinic radiation,
(4) a step of developing with an aqueous developer, and
(5) A method for producing a cured film, comprising a post-baking step of thermosetting. The manufacturing method of the cured film of Claim 11 including the process of exposing the whole surface after the said image development process and before a post-baking process. The manufacturing method of the cured film of Claim 11 or 12 whose said board | substrate is a metal substrate. Cured film obtained by curing the photosensitive resin composition according to any one of claims 1-10. The cured film of Claim 14 which is an interlayer insulation film. Having a cured film according to claim 14 or 15, the liquid crystal display device or an organic EL display device.

Images