JP5538906B2 - 急速熱処理チャンバ用のランプ - Google Patents
急速熱処理チャンバ用のランプ Download PDFInfo
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- JP5538906B2 JP5538906B2 JP2009549710A JP2009549710A JP5538906B2 JP 5538906 B2 JP5538906 B2 JP 5538906B2 JP 2009549710 A JP2009549710 A JP 2009549710A JP 2009549710 A JP2009549710 A JP 2009549710A JP 5538906 B2 JP5538906 B2 JP 5538906B2
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- JP
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- Prior art keywords
- lamp
- bulb
- sleeve
- lamp assembly
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- Prior art date
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- 238000012545 processing Methods 0.000 title description 19
- 239000000463 material Substances 0.000 claims description 35
- 238000004381 surface treatment Methods 0.000 claims description 26
- 230000005855 radiation Effects 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- 239000010453 quartz Substances 0.000 claims description 7
- 229910052582 BN Inorganic materials 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 238000010306 acid treatment Methods 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229910052845 zircon Inorganic materials 0.000 claims 1
- 239000002585 base Substances 0.000 description 53
- 238000004382 potting Methods 0.000 description 22
- 230000005540 biological transmission Effects 0.000 description 15
- DFRAKBCRUYUFNT-UHFFFAOYSA-N 3,8-dicyclohexyl-2,4,7,9-tetrahydro-[1,3]oxazino[5,6-h][1,3]benzoxazine Chemical compound C1CCCCC1N1CC(C=CC2=C3OCN(C2)C2CCCCC2)=C3OC1 DFRAKBCRUYUFNT-UHFFFAOYSA-N 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 12
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 8
- 239000011888 foil Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 229910052736 halogen Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000004323 axial length Effects 0.000 description 2
- 239000013536 elastomeric material Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical group [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 1
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical group O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical group [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 description 1
- 239000004137 magnesium phosphate Substances 0.000 description 1
- 229960002261 magnesium phosphate Drugs 0.000 description 1
- 229910000157 magnesium phosphate Inorganic materials 0.000 description 1
- 235000010994 magnesium phosphates Nutrition 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 229920003031 santoprene Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- -1 tungsten Chemical class 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01K—ELECTRIC INCANDESCENT LAMPS
- H01K1/00—Details
- H01K1/28—Envelopes; Vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01K—ELECTRIC INCANDESCENT LAMPS
- H01K1/00—Details
- H01K1/28—Envelopes; Vessels
- H01K1/32—Envelopes; Vessels provided with coatings on the walls; Vessels or coatings thereon characterised by the material thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01K—ELECTRIC INCANDESCENT LAMPS
- H01K1/00—Details
- H01K1/28—Envelopes; Vessels
- H01K1/32—Envelopes; Vessels provided with coatings on the walls; Vessels or coatings thereon characterised by the material thereof
- H01K1/325—Reflecting coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01K—ELECTRIC INCANDESCENT LAMPS
- H01K1/00—Details
- H01K1/42—Means forming part of the lamp for the purpose of providing electrical connection, or support for, the lamp
- H01K1/46—Means forming part of the lamp for the purpose of providing electrical connection, or support for, the lamp supported by a separate part, e.g. base, cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01K—ELECTRIC INCANDESCENT LAMPS
- H01K1/00—Details
- H01K1/58—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01K—ELECTRIC INCANDESCENT LAMPS
- H01K7/00—Lamps for purposes other than general lighting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
- H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Resistance Heating (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
Description
Claims (8)
- ランプアセンブリにおいて、
一対の電気コネクタに取り付けられた少なくとも1つの放射発生フィラメントを包囲し、内面及び外面を有している石英電球と、
上記一対の電気コネクタを含むランプベースと、
を備え、
上記ランプアセンブリは、基板熱処理チャンバ内で少なくとも約1100℃までの温度に基板を加熱するのに使用するように適応され、
上記電球の少なくとも一部分には、上記内面における拡散散乱部分を含む上記電球の下部の上記ランプベースから延び出た表面処置部が備えられ、
上記拡散散乱部分は、1つ以上の焼結粉末材料の層、又は、上記電球の内部に粗面を与えるための酸処置部を含み、
上記表面処置部は上記ランプベースに向けた放射の移動を最小にする、
ランプアセンブリ。 - 上記表面処置部は、上記電球の少なくとも下部の外部における被覆をさらに含み、
上記被覆は、アルミニウム、金、銀、窒化硼素及びその組み合わせより成るグループから選択される、請求項1に記載のランプアセンブリ。 - 上記被覆は、高温塗装部を含む、請求項2に記載のランプアセンブリ。
- 上記表面処置部は、上記電球の少なくとも下部の外部における被覆を含み、この被覆は、粉末シリカ、アルミナ、ジルコン、又はその組み合わせより成るグループから選択される、請求項1に記載のランプアセンブリ。
- 上記焼結粉末材料は、粉末石英、アルミナ又はその混合物を含み、かつ、上記焼結粉末材料は、バインダーと混合される、請求項1に記載のランプアセンブリ。
- 上記ランプベースを包囲するスリーブを更に備え、このスリーブは、その断面積が上記電球の断面積の約1.2倍未満である、請求項1に記載のランプアセンブリ。
- 上記スリーブの断面積は、上記電球の断面積の約0.95倍未満であり、上記ランプベース及び上記スリーブは、断面形状が実質的に似ている、請求項6に記載のランプアセンブリ。
- 上記スリーブの断面積は、上記電球の断面積の約0.42倍未満である、請求項6に記載のランプアセンブリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/675,150 | 2007-02-15 | ||
US11/675,150 US9536728B2 (en) | 2007-02-15 | 2007-02-15 | Lamp for rapid thermal processing chamber |
PCT/US2008/053915 WO2008101050A1 (en) | 2007-02-15 | 2008-02-14 | Lamp for rapid thermal processing chamber |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010519737A JP2010519737A (ja) | 2010-06-03 |
JP5538906B2 true JP5538906B2 (ja) | 2014-07-02 |
Family
ID=39690515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009549710A Active JP5538906B2 (ja) | 2007-02-15 | 2008-02-14 | 急速熱処理チャンバ用のランプ |
Country Status (6)
Country | Link |
---|---|
US (1) | US9536728B2 (ja) |
EP (2) | EP3361493B1 (ja) |
JP (1) | JP5538906B2 (ja) |
CN (1) | CN101617191B (ja) |
TW (1) | TWI421903B (ja) |
WO (1) | WO2008101050A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0811980D0 (en) * | 2008-07-07 | 2008-07-30 | Ceramaspeed Ltd | Radiant electric heater |
CN102062903B (zh) * | 2009-11-13 | 2013-08-28 | 鸿富锦精密工业(深圳)有限公司 | 光纤耦合连接器 |
DE102009047746A1 (de) * | 2009-12-09 | 2011-06-16 | Osram Gesellschaft mit beschränkter Haftung | Lampe |
JP6038503B2 (ja) * | 2011-07-01 | 2016-12-07 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法 |
US10405375B2 (en) * | 2013-03-11 | 2019-09-03 | Applied Materials, Inc. | Lamphead PCB with flexible standoffs |
US9613835B2 (en) * | 2013-03-15 | 2017-04-04 | Applied Materials, Inc. | Heating lamp assembly |
WO2014150071A1 (en) | 2013-03-15 | 2014-09-25 | Applied Materials, Inc. | Tubular light source having overwind |
CN104995991B (zh) * | 2013-03-15 | 2019-05-17 | 应用材料公司 | 简化的灯具设计 |
CN106133888B (zh) | 2013-12-19 | 2019-10-01 | 应用材料公司 | 用于可替换的灯的适配器 |
US10026630B2 (en) * | 2014-05-27 | 2018-07-17 | Applied Materials, Inc. | Retention and insulation features for lamp |
US11057963B2 (en) | 2017-10-06 | 2021-07-06 | Applied Materials, Inc. | Lamp infrared radiation profile control by lamp filament design and positioning |
Family Cites Families (27)
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US2179455A (en) * | 1937-10-07 | 1939-11-07 | Spacth Charles | Electric lamp |
US2859369A (en) * | 1954-06-15 | 1958-11-04 | Gen Electric | Incandescent light source |
US3093769A (en) * | 1959-05-15 | 1963-06-11 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Mixed-light electric lamp |
US3588564A (en) | 1968-04-01 | 1971-06-28 | Sylvania Electric Prod | Electric lamp with heat reflector |
DE2616893A1 (de) * | 1976-04-15 | 1977-11-03 | Patra Patent Treuhand | Bestrahlungslampe |
US4864184A (en) * | 1987-11-23 | 1989-09-05 | Gte Products Corporation | Lamp construction and method of manufacture |
JP2940047B2 (ja) | 1989-02-14 | 1999-08-25 | 株式会社日本自動車部品総合研究所 | 熱処理装置および熱処理方法 |
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US5723937A (en) * | 1993-03-22 | 1998-03-03 | General Electric Company | Light-scattering coating, its preparation and use |
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JP2002134430A (ja) | 2000-10-24 | 2002-05-10 | Tokyo Electron Ltd | 指向性を高める高反射率の膜を有するランプ及び熱処理装置 |
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-
2007
- 2007-02-15 US US11/675,150 patent/US9536728B2/en active Active
-
2008
- 2008-02-01 TW TW097104046A patent/TWI421903B/zh active
- 2008-02-14 WO PCT/US2008/053915 patent/WO2008101050A1/en active Application Filing
- 2008-02-14 CN CN2008800053514A patent/CN101617191B/zh active Active
- 2008-02-14 EP EP18156318.0A patent/EP3361493B1/en active Active
- 2008-02-14 EP EP08729823.8A patent/EP2115372B1/en active Active
- 2008-02-14 JP JP2009549710A patent/JP5538906B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN101617191A (zh) | 2009-12-30 |
EP3361493B1 (en) | 2020-05-20 |
US20080199163A1 (en) | 2008-08-21 |
EP2115372A1 (en) | 2009-11-11 |
WO2008101050A1 (en) | 2008-08-21 |
EP2115372A4 (en) | 2011-04-27 |
US9536728B2 (en) | 2017-01-03 |
JP2010519737A (ja) | 2010-06-03 |
TWI421903B (zh) | 2014-01-01 |
EP2115372B1 (en) | 2018-02-14 |
CN101617191B (zh) | 2013-02-27 |
TW200845104A (en) | 2008-11-16 |
EP3361493A1 (en) | 2018-08-15 |
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