JP5533314B2 - Method for manufacturing reflective color image display device - Google Patents

Description

  The present invention relates to a reflective color image display device that requires alignment with a color filter substrate among the reflective image display devices.

  Currently, a reflective liquid crystal display device in which liquid crystal is encapsulated, an electrophoretic display device filled with a dispersion medium solution and charged electrophoretic particles, and rotating particles having a charged surface region dispersed in the dispersion medium solution. Reflective images such as filled rotating particle display devices, electronic powder fluid type display devices that move powder fluid filled with powder fluid showing high fluidity in an aerosol state in which a solid substance is stably suspended as a dispersoid in gas Display devices are used in mobile phones, electronic book readers, electronic signboards, and the like, and their applications are expected to expand.

  In general, amorphous silicon, polycrystalline silicon, or the like has been used as a thin film transistor or thin film diode for driving these reflective image display devices. Since these amorphous silicon and polycrystalline silicon have photosensitivity in the visible light region, a light shielding film is required. Such a thin-film transistor, thin-film diode, and wiring thereof (hereinafter referred to as a pixel electrode substrate) having photosensitivity as described above will hinder visibility when placed in front of the image display body. It is installed behind the image display body as seen (see Patent Document 1).

  On the other hand, color filters are generally used for colorizing reflective display devices such as reflective liquid crystal display devices and electrophoretic display devices. This color filter needs to be disposed in front of the image display body with the image electrode substrate disposed behind it for the above reason. As described above, in order to dispose an image display body having elements such as a liquid crystal encapsulating layer and an electrophoretic particle layer between the color filter and the semiconductor circuit, the pixel electrode substrate and the color filter are sandwiched between the opaque image display bodies. Therefore, it is difficult to obtain high accuracy, which causes an increase in cost and a decrease in yield.

JP 2006-13433 A

The present invention has been made in view of the above circumstances, and its object is to provide a manufacturing how the reflection-type color image display device which can be aligned with a color filter with high precision .

The invention according to claim 1 is a manufacturing method of a reflective color image display device configured by superimposing a color filter substrate on a front side of an image display body in which a pixel electrode substrate is superimposed on a back side, On the base material provided with a plurality of pixel electrodes made of thin film transistors or thin film diode arrays for displaying an image on the image display body as an electrode substrate, for displaying an alignment mark on the image display body by energization A pixel electrode substrate in which one or a plurality of alignment mark display electrodes are provided is used, the pixel electrode substrate is superimposed on the image display body, and the alignment mark display electrode of the pixel electrode substrate is energized, With the alignment mark displayed on the image display body, the displayed alignment mark and the color filter substrate are provided in advance. While being aligned with an alignment mark, it is a manufacturing method of a reflection-type color image display apparatus of the color filter substrate and wherein the bonding superimposed on the image display body.
The invention according to a second aspect is the invention according to the first aspect, wherein the alignment mark is displayed at a position displayed outside the display area of the image by the image display body by energizing the alignment mark display electrode. A method of manufacturing a reflective color image display device, wherein the alignment mark display electrode is provided.

According to the first aspect of the present invention, the alignment mark and the color filter which are displayed in a state where the alignment mark display electrode provided on the pixel electrode substrate is energized to display the alignment mark on the image display body. By aligning the pixel electrode substrate and the color filter substrate to the image display body while aligning using the alignment mark provided in advance on the substrate, the pixel electrode substrate and the color filter substrate Can be aligned.
In addition, even if the pixel electrode substrate has a light shielding film that hides the pixel electrode having photosensitivity from view, the position of the color filter substrate relative to the pixel electrode substrate can be obtained by energizing the alignment mark display electrode of the pixel electrode substrate. An alignment mark serving as a standard for alignment is displayed on an image display body that is easily visible through the color filter substrate. For this reason, the pixel electrode substrate and the color filter substrate can be aligned with high accuracy.
According to the second aspect of the present invention, the alignment mark displayed on the image display body by energizing the alignment mark display electrode is an image display area displayed on the image display body by energizing the pixel electrode. Since it is displayed on the outside, it is possible to prevent the alignment mark of the color filter substrate from hindering the visibility of the display image by the image display body after the color filter substrate is superimposed on the image display body.

It is sectional drawing explaining the manufacturing method of the reflection type color image display apparatus in one Embodiment of this invention. It is an expanded sectional view which shows the basic composition of the reflection type color image display apparatus of FIG.

Hereinafter, embodiments of the present invention will be described. First, a schematic configuration of a reflective color image apparatus to which the manufacturing method of the present invention is applied will be described with reference to FIGS. The reflective color image display device of this embodiment is configured by disposing a pixel electrode substrate 2 behind an image display body 1 and a color filter substrate 3 in front of the image display body 1.
As shown in FIG. 2, the image display 1 is configured by forming a common electrode 12 on the back surface of a base material 11 and further disposing an image display element 13 thereon. The pixel electrode substrate 2 is configured by forming a pixel electrode 22 on the front surface of a base material 21. The present invention is applied to the pixel electrode substrate 2, and as a result, an alignment mark display electrode 23 is further formed on the front surface of the base member 21, as shown in FIG. The front side of the base material 21 of the pixel electrode substrate 2 configured in this way is attached to the back side of the base material 11 by the adhesive 14 applied on the image display element 13 of the image display body 1. As shown in FIG. 2, the color filter substrate 3 is configured by appropriately arranging a colored layer 32 on a base material 31. Further, as shown in FIG. 1, an alignment mark 33 for alignment with the image display body 1 is further formed on the base material 31 and is covered with an overcoat layer 34 together with the colored layer 32.
A known transparent substrate can be used as the substrate 31 of the color filter substrate 3 of the reflective color image display device. Transparent means that the transmittance is 70% or more within the wavelength range of 400 nm to 700 nm which is visible light. Specifically, a glass substrate, polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, cycloolefin polymer, polyimide, polyamide, polycarbonate, methacrylic resin, polymethyl methacrylate, polyvinyl chloride, triacetyl cellulose, In addition, a material obtained by processing a composite material of an inorganic material such as glass and a plastic as typified above into a film can be used. When plastic is used, it is appropriately selected and used in consideration of flexibility, weather resistance, heat resistance and solvent resistance in the production process, and the like.

  Moreover, although a well-known material can be used for the base material 21 of the pixel electrode substrate 2, it is necessary to use an insulating base material. Specifically, glass substrate, polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, cycloolefin polymer, polyimide, polyamide, polycarbonate, methacrylic resin, polymethyl methacrylate, polyvinyl chloride, triacetyl cellulose, polyphenylene sulfide, Examples thereof include a plastic material such as polyetheretherketone, and a composite material of an inorganic material such as glass and a plastic as typified above in a film shape. Quartz and silicon wafers can also be used as the insulating base material.

When using a base material 31 for the color filter substrate 3 and a base material 21 for the pixel electrode substrate 2 using a plastic or a film base material containing plastic, a gas barrier layer may be appropriately formed on each of the base materials 31 and 21. Is possible. Specifically, examples of the gas barrier layer include Al ₂ O ₃ , SiO ₂ , SiN, SiON, SiC, diamond-like carbon (DLC), and the like, but are not limited thereto. These gas barrier layers can also be used by laminating two or more layers. Moreover, a gas barrier layer may be provided only on one side of the film substrate, or may be provided on both sides. The gas barrier layer can be formed by an evaporation method, an ion plating method, a sputtering method, a laser ablation method, a plasma CVD (Chemical Vapor Deposition) method, a hot wire CVD method, a sol-gel method, or the like.

  The color filter substrate 3 can be formed by a known method. Specifically, it is appropriately selected from various printing methods such as a photolithography method, an ink jet method, letterpress printing, and intaglio printing in consideration of resolution, substrate resistance, and the like.

  The color filter substrate 3 has three types of red (R), green (G), and blue (B) as the colored layer 32, or red (R), green (G), blue (B), white (W), and cyan. (C), magenta (M), yellow (Y), or the like can be used, but is not limited to these (in FIG. 1, four types of R, G, B, and W are illustrated). Shown). The colored layer 32 is patterned in a suitable pattern such as a stripe (stripe) matrix having a predetermined width or a rectangular matrix having a predetermined size. Note that a transparent overcoat layer 34 may be provided on the colored layer 32 as shown in FIG. 1 in order to protect the colored pattern and flatten the colored layer 32 after the colored pattern is formed by the colored layer 32. .

The thin film transistor and the thin film diode used for the pixel electrode 22 of the pixel electrode substrate 2 can be formed on the base material 21 by a known method. Silicon, Au, Ag, Cu, Cr, Al, Mg, Li, and indium oxide (In ₂ O ₃ ) are used for the gate electrode, source electrode, drain electrode, auxiliary capacitor electrode, pixel electrode, scanning line electrode, and signal line electrode. Tin oxide (SnO ₂ ), zinc oxide (ZnO), cadmium oxide (CdO), indium cadmium oxide (CdIn ₂ O ₄ ), cadmium tin oxide (Cd ₂ SnO ₄ ), zinc tin oxide (Zn ₂ SnO ₄ ), An oxide material such as indium zinc oxide (IZO) is preferably used. It is also preferable to add impurities to this oxide material in order to increase conductivity. For example, indium oxide doped with tin (Sn), molybdenum (Mo), titanium (Ti), tin oxide doped with antimony (Sb) or fluorine (F), zinc oxide indium, aluminum, gallium ( For example, doped with Ga). Among them, indium tin oxide (ITO) in which indium oxide (In ₂ O ₃ ) is doped with tin (Sn) is particularly preferably used because of its low resistivity. Moreover, what laminated | stacked two or more of the said material can also be used. Further, an organic conductive material such as polyethylenedioxythiophene (PEDOT) can also be suitably used.

  As the semiconductor layer of the above-described thin film transistor or thin film diode, known inorganic and organic materials can be used. Specifically, silicon, zinc oxide, indium oxide, indium zinc oxide, tin oxide, tungsten oxide (WO), gallium indium oxide (In—Ga—Zn—O), or the like can be used as the inorganic semiconductor material. . The structure of these materials may be single crystal, polycrystal, microcrystal, crystal / amorphous mixed crystal, nanocrystal scattered amorphous, or amorphous. Organic semiconductor materials include acenes such as pentacene and tetracene, naphthalenetetracarboxylic dianhydride (NTCDA) and naphthalenetetracarboxylic acid diimide (NTCDI), or polythiophene, polyaniline, poly-p-phenylene vinylene, polyacetylene, polydiacetylene. It is possible to use a conjugated polymer such as polythienylene vinylene.

  Vapor deposition, ion plating, sputtering, pulse laser deposition, vacuum deposition, CVD, MBE (Molecular Beam Epitaxy), sol-gel, various printing methods, spin coating, dip coating, etc. It is possible to form the pixel electrode substrate 2 on the base material 21 by using.

  A known material can be used for the gate insulating film and the interlayer insulating film (not shown) of the pixel electrode substrate 2. Specifically, silicon oxide, silicon nitride, silicon oxynitride (SiNxOy), aluminum oxide, tantalum oxide, yttrium oxide, hafnium oxide, hafnium aluminate, zirconia, titanium oxide, or other inorganic materials, or PMMA (poly Examples include, but are not limited to, polyacrylates such as methyl methacrylate), PVA (polyvinyl alcohol), PS (polystyrene), transparent polyimide, polyester, epoxy, and polyvinylphenol.

  The image display element 13 of the image display 1 includes a reflective liquid crystal display device in which liquid crystal is sealed, an electrophoretic display device filled with a dispersion medium solution and charged electrophoretic particles, and a charge dispersed in the dispersion medium solution. Rotating particle display device filled with rotating particles having a surface area with a surface, electrons that move the pulverulent fluid encapsulating pulverulent fluid that exhibits high fluidity in an aerosol state in which a solid substance is stably suspended as a dispersoid in gas Examples thereof include, but are not limited to, a powder fluid type display device.

The common electrode 12 of the image display body 1 is preferably a transparent conductive film. This is because it is provided on the front side of the image display body 1, that is, on the side where the reflective color image display device is viewed. As materials, known materials can be used. Specifically, conductive materials such as ITO, IZO, indium tungsten oxide (IWO), indium oxide (ICO), ZnO, SnO ₂ , carbon nanotubes, polythiophene, and PEDOT. A functional polymer is used. And vapor deposition method, ion plating method, sputtering method, laser ablation method, plasma CVD (Chemical Vapor Deposition) method, hot wire CVD method, sol-gel method, spin coating method, dip coating method, PLD (pulse laser deposition) method It forms on the base material 11 by the method suitably selected from the above.

  Moreover, a well-known material can be used for the base material 11 of the image display body 1. Specifically, a glass substrate, polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, cycloolefin polymer, polyimide, polyamide, polycarbonate, methacrylic resin, polymethyl methacrylate, polyvinyl chloride, triacetyl cellulose, A material obtained by processing a composite material of an inorganic material such as glass and a plastic as typified above into a film can be used. When plastic is used, it is appropriately selected and used in consideration of flexibility, weather resistance, heat resistance and solvent resistance in the production process, and the like.

  As shown in FIG. 1, the alignment mark display electrode 23 provided on the pixel electrode substrate 2 is formed when the pixel electrode 22 is formed on the base material 21 or a gate electrode not shown in FIG. When any one of the source electrode, the drain electrode, the auxiliary capacitor electrode, the scanning line electrode, and the signal line electrode is formed on the substrate 21, it is preferably formed at the same time. By forming simultaneously, it can form without increasing a process, a material efficiency can be raised, and since a yield improves, it can suppress a cost rise.

  The alignment mark display electrode 23 displays an alignment mark corresponding to the electrode 23 on the outside of the image display area by the image display element 13 of the image display body 1 by energizing the alignment mark display electrode 23. Preferably, it is formed at an arbitrary position such as a diagonal of the pixel pattern according to the shape of the base material 21 or the shape of the pixel pattern by the image display element 13. The alignment mark display electrode 23 faces the alignment mark 33 of the color filter substrate 3 with the image display body 1 sandwiched between the image display body 1, the pixel electrode substrate 2 and the color filter substrate 3. Placed in position. Therefore, when the alignment mark display electrode 23 is energized, the number of the alignment mark display electrodes 23 of the image display body 1 is not particularly limited, but at least two or more alignment mark display electrodes 23 are formed for precise alignment. It is preferable.

  The shape of the alignment mark display electrode 23 is not particularly limited as long as it is a shape corresponding to the alignment mark 33 on the color filter substrate 3 side. Specifically, it can be arbitrarily set from triangles, rectangles, polygons, circles, bows, sectors, combinations thereof, and the like. The size of the alignment mark display electrode 23 is not particularly limited, but is appropriately selected and formed according to the field of view, magnification, etc. of the alignment camera used for alignment and its lens.

  In addition, an adhesive layer (adhesive 14) used for adhesion between the pixel electrode substrate 2 and the image display body 1 and an adhesive layer (not shown) used for adhesion between the image display body 1 and the color filter substrate 3 include A known pressure-sensitive adhesive or heat-sensitive adhesive can be used. The adhesive layer used for adhesion between the image display body 1 and the color filter substrate 3 is preferably transparent because it is positioned in front of the image display body 1 on the line of sight for viewing the reflective color image display device.

In addition, a known method can be used for adhesion between the pixel electrode substrate 2 and the image display body 1 and adhesion between the image display body 1 and the color filter substrate 3. Specifically, in consideration of the characteristics of the base materials 11, 21, 31 used for the selected adhesive layer material, thin film transistor, image display body 1, pixel electrode substrate 2, and color filter substrate 3, lamination, It is appropriately selected from laminating, vacuum laminating and the like.
By manufacturing the reflective color image display device by such a method, the alignment mark display electrode 23 provided on the pixel electrode substrate 2 is energized and the alignment mark is displayed on the image display body 1. The pixel electrode substrate 2 and the color filter substrate 3 are bonded to the image display body 1 while performing alignment using the displayed alignment mark and the alignment mark 33 provided in advance on the color filter substrate 3. Thus, the pixel electrode substrate 2 and the color filter substrate 3 can be aligned with high accuracy.

  Examples of the present invention are shown below, but are not limited to these methods.

  As a color filter substrate, alignment marks between a rectangular matrix pattern of R, G, B, and W and a pixel electrode substrate are formed on a PEN having a thickness of 100 μm and a size of 300 mm × 300 mm, and an overcoat is formed on these colored layers. What provided the layer was used.

  As the pixel electrode substrate, a thin film transistor array having a shape corresponding to the colored pattern of the color filter is arranged on a PEN having a thickness of 100 μm and a size of 300 mm × 300 mm, and a gate electrode, a source electrode, and a drain electrode having shapes corresponding to the thin film transistor array. In addition, an auxiliary capacitor electrode, a pixel electrode, a scanning line electrode, a signal line electrode, and an alignment mark display electrode formed on a color filter substrate were used.

  As an image display body, a substrate obtained by coating microcapsules for a microcapsule type electrophoretic display panel on a PET substrate having a thickness of 100 μm and a 300 mm × 300 mm size on which a common electrode made of ITO is formed by sputtering. Was used.

  A pressure sensitive adhesive was applied to the microcapsule surface of the image display body, and then the image display body and the pixel electrode substrate were bonded together by pressing a rubber roller.

  Next, the pixel electrode substrate was energized, and an alignment mark was displayed on the image display body.

  Thereafter, similarly, after applying a pressure-sensitive adhesive to the viewing side of the image display body (opposite surface of the microcapsule surface), this adhesive layer and the color filter are overlapped with an interval of 200 μm for alignment. After confirming the alignment mark with the camera, the reflective color image display device of the present invention was obtained by sticking the adhesive layer and the color filter by pressing the rubber roller.

DESCRIPTION OF SYMBOLS 1 ... Image display body 11 ... Base material 12 ... Common electrode 13 ... Image display element 14 ... Adhesive 2 ... Pixel electrode substrate 21 ... Base material 22 ... Pixel Electrode 23 ... Positioning mark display electrode 3 ... Color filter substrate 31 ... Base material 32 ... Colored layer 33 ... Positioning mark 34 ... Overcoat layer

Claims (2)

A method of manufacturing a reflective color image display device configured by superimposing a color filter substrate on the front side of an image display body in which a pixel electrode substrate is superimposed on the back side,
An alignment mark is displayed on the image display body by energization on a substrate provided with a plurality of pixel electrodes made of thin film transistors or thin film diode arrays for displaying an image on the image display body as the image electrode substrate . A pixel electrode substrate provided with one or a plurality of alignment mark display electrodes is provided,
The alignment mark is displayed in a state where the pixel electrode substrate is overlaid on the image display body and the alignment mark display electrode of the pixel electrode substrate is energized to display the alignment mark on the image display body. And aligning using the alignment mark provided in advance on the color filter substrate, the color filter substrate is overlapped and bonded to the image display body,
A method of manufacturing a reflective color image display device. The alignment mark display electrode is provided at a position where the alignment mark is displayed outside the display area of the image by the image display body by energizing the alignment mark display electrode. A method for manufacturing a reflective color image display device according to claim 1.

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