JP5530510B1 - Terminal block for grounding - Google Patents

Terminal block for grounding Download PDF

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JP5530510B1
JP5530510B1 JP2012281587A JP2012281587A JP5530510B1 JP 5530510 B1 JP5530510 B1 JP 5530510B1 JP 2012281587 A JP2012281587 A JP 2012281587A JP 2012281587 A JP2012281587 A JP 2012281587A JP 5530510 B1 JP5530510 B1 JP 5530510B1
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substrate
hole
connection plate
terminal block
screw hole
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JP2014127276A (en
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篤朗 杉村
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Takigen Manufacturing Co Ltd
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Takigen Manufacturing Co Ltd
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Priority to JP2012281587A priority Critical patent/JP5530510B1/en
Priority to TW102108001A priority patent/TWI481314B/en
Priority to CN201310556714.6A priority patent/CN103904439B/en
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Abstract

【課題】ロウ付けの工程を省略でき、製造コストを引き下げることができ、形状と寸法が安定し、メッキが海上輸送を必要とする海外での低コスト生産を前提としたものであっても、国内で比較的低コストで組立てでき、メッキ工程を省略できる接地用端子台を提供する。
【解決手段】接地用端子台1は、基板2と接続板3とからなる。基板2と接続板3とは、圧搾変形部31bにより互いに固着される。したがって、ロウ付けの工程を要しない。接続板3のねじ孔31a付きボス部31は、基板2の貫通孔21aに嵌合する。ボス部31の先端部に圧搾変形部31bが形成される。
【選択図】図1
[PROBLEMS] To eliminate the brazing step, reduce the manufacturing cost, stabilize the shape and dimensions, and plating is premised on low-cost production overseas that requires sea transportation. To provide a grounding terminal block that can be assembled at a relatively low cost in Japan and can eliminate the plating process.
A grounding terminal block includes a substrate and a connecting plate. The board | substrate 2 and the connection board 3 are mutually fixed by the pressing deformation part 31b. Therefore, a brazing process is not required. The boss portion 31 with the screw hole 31 a of the connection plate 3 is fitted into the through hole 21 a of the substrate 2. A squeezing deformation portion 31 b is formed at the tip of the boss portion 31.
[Selection] Figure 1

Description

本発明は、配電盤等の筐体に取り付けられ、内部に収容される電気機器や電気回路等をアースするのに使用される接地用端子台に関する。   The present invention relates to a grounding terminal block that is attached to a housing such as a switchboard and is used to ground an electrical device, an electrical circuit, or the like housed therein.

従来、接地用端子台として、例えば、非特許文献1に記載されたものが知られている。これを図7に示す。この接地用端子台51は、鋼製の基板52と銅又は銅合金製の接続板53とを銀ロウ付けにより固着してなる。基板52は、端子接続用のねじ孔52bを有する平板状の支持板部52aと、当該支持板部52aの両端縁から直角に突出する一対の脚部52cとを具備する。接続板53は、平板材で、基板52のねじ孔52bに連続するねじ孔53aを有し、支持板部52a上に電気的に導通するようにロウ付けされる。この接地用端子台51は、組み立てられた後、全面に銅メッキ54が施される。基板52の脚部52cが、電気機器を収容する筐体の内側面に溶着される。図示しない接地線の端子を固定するボルトがねじ孔53a,52bに螺合される。なお、メッキは、海外で生産された製品を海上輸送する際の腐食対策を目的として行われる。国内で生産できれば、原則としてメッキは不要である。   Conventionally, as a terminal block for grounding, for example, one described in Non-Patent Document 1 is known. This is shown in FIG. The grounding terminal block 51 is formed by fixing a steel substrate 52 and a connection plate 53 made of copper or copper alloy by silver brazing. The substrate 52 includes a flat plate-like support plate portion 52a having a screw hole 52b for connecting terminals, and a pair of leg portions 52c protruding at right angles from both end edges of the support plate portion 52a. The connection plate 53 is a flat plate material, has a screw hole 53a continuous with the screw hole 52b of the substrate 52, and is brazed so as to be electrically conductive on the support plate portion 52a. After the grounding terminal block 51 is assembled, copper plating 54 is applied to the entire surface. The leg part 52c of the board | substrate 52 is welded to the inner surface of the housing | casing which accommodates an electric equipment. A bolt for fixing a terminal of a ground wire (not shown) is screwed into the screw holes 53a and 52b. In addition, plating is performed for the purpose of anti-corrosion when products produced overseas are transported by sea. If it can be produced in Japan, plating is not necessary in principle.

TAKIGEN Catalogue No.20 2007の1212ページ(タキゲン製造株式会社、平成19年4月発行)1212 page of TAKIGEN Catalog No.20 2007 (Takigen Manufacturing Co., Ltd., issued April 2007)

上記従来の接地用端子台の製作においては、ロウ付け作業が難作業で、コストを引き上げる要因となる。ロウ付け工程では、ロウ付けの不良部が生じやすい。ロウ付け不良部には、メッキ液の液溜まりが発生しやすく、そのメッキ液は、製品の表面を酸化し、メッキの剥落を招き、製品の歩留まりを低下させる原因となる。ロウ付けの工程では、加熱処理が行われるため、完成した製品の寸法、形状にばらつきが生じやすい。
したがって、本発明は、ロウ付けの工程を省略して製造コストを引き下げることができる、形状と寸法の安定した接地用端子台を提供することを目的としている。
In the production of the conventional grounding terminal block, the brazing operation is difficult, which increases the cost. In the brazing process, a defective portion of brazing tends to occur. A plating solution pool is likely to be generated in the brazed defective portion, and the plating solution oxidizes the surface of the product, causing the plating to peel off, thereby reducing the yield of the product. In the brazing process, since heat treatment is performed, variations in the size and shape of the finished product are likely to occur.
Accordingly, an object of the present invention is to provide a grounding terminal block having a stable shape and dimensions, which can reduce the manufacturing cost by omitting the brazing step.

以下、添付図面の符号を参照して説明するが、本発明はこれに限定されるものではない。
上記課題を解決するための、本発明の接地用端子台1は、基板2と接続板3とからなり、この基板2と接続板3とが、圧搾変形部31b,32a,4aにより互いに固着される構造であり、ロウ付けの工程は省略される。
圧搾変形部32aは、基板2の貫通孔21bに嵌合する、接続板3のボス部32の先端部に形成することができる。
また、基板2の貫通孔21aに嵌合する、接続板3のねじ孔31a付きボス部31の先端部に圧搾変形部31bを形成することができる。
基板2の貫通孔21bと接続板3の貫通孔32aとに挿通されるカシメピン4の端部に圧搾変形部4aを形成することができる。
Hereinafter, the present invention will be described with reference to the accompanying drawings, but the present invention is not limited thereto.
The grounding terminal block 1 according to the present invention for solving the above-described problems includes a substrate 2 and a connection plate 3, and the substrate 2 and the connection plate 3 are fixed to each other by pressing deformation portions 31b, 32a, 4a. The brazing process is omitted.
The squeezing deformation portion 32 a can be formed at the tip end portion of the boss portion 32 of the connection plate 3 that fits into the through hole 21 b of the substrate 2.
Moreover, the compression deformation | transformation part 31b can be formed in the front-end | tip part of the boss | hub part 31 with the screw hole 31a of the connection board 3 fitted to the through-hole 21a of the board | substrate 2. FIG.
The squeezing deformation part 4 a can be formed at the end of the caulking pin 4 inserted through the through hole 21 b of the substrate 2 and the through hole 32 a of the connection plate 3.

本発明の接地用端子台は、ロウ付けの工程を省略できるので、製造コストを引き下げることができ、形状と寸法が安定する。メッキは、海上輸送を必要とする海外での低コスト生産を前提としたものであるが、国内でも比較的低コストで組立てできるので、メッキ工程を省略できる。   Since the grounding terminal block of the present invention can omit the brazing step, the manufacturing cost can be reduced, and the shape and dimensions can be stabilized. Plating is premised on low-cost production overseas that requires marine transportation, but can be assembled at a relatively low cost in Japan, so the plating process can be omitted.

本発明に係る接地用端子台を示すもので、(A)は平面図、(B)は断面図である。The grounding terminal block which concerns on this invention is shown, (A) is a top view, (B) is sectional drawing. 図1の接地用端子台の組立前の分解した断面図である。FIG. 2 is an exploded cross-sectional view of the ground terminal block of FIG. 1 before assembly. 本発明に係る他の実施形態の接地用端子台を示すもので、(A)は平面図、(B)は断面図である。The grounding terminal block of other embodiment which concerns on this invention is shown, (A) is a top view, (B) is sectional drawing. 図3の接地用端子台の組立前の分解した断面図である。FIG. 4 is an exploded sectional view of the grounding terminal block of FIG. 3 before assembly. 本発明に係るさらに他の実施形態の接地用端子台を示すもので、(A)は平面図、(B)は断面図である。The grounding terminal block of further another embodiment which concerns on this invention is shown, (A) is a top view, (B) is sectional drawing. 図5の接地用端子台の組立前の分解した断面図である。FIG. 6 is an exploded cross-sectional view of the grounding terminal block of FIG. 5 before assembly. 従来の接地用端子台を示すもので、(A)は平面図、(B)は断面図である。The conventional grounding terminal block is shown, (A) is a top view, (B) is sectional drawing.

図面を参照して本発明の実施の形態を説明する。
図1、図2において、接地用端子台1は、互いに電気的に導通するように固着される基板2と接続板3とからなり、両者間を貫通する2つのねじ孔31aを具備する。
Embodiments of the present invention will be described with reference to the drawings.
1 and 2, the grounding terminal block 1 includes a substrate 2 and a connection plate 3 that are fixed so as to be electrically connected to each other, and includes two screw holes 31a penetrating therebetween.

基板2は、鋼製で、平板状の支持板部21と、一対の脚部22とを具備する。支持板部21は、ねじ孔31aに対応する一対の貫通孔21aを有する。脚部22は、支持板部21の両端縁から直角に突出する。図2によく示すように、貫通孔21aにおける、脚部22が突出する側の端部には、ザグリ部21bが形成される。   The substrate 2 is made of steel and includes a flat support plate portion 21 and a pair of leg portions 22. The support plate portion 21 has a pair of through holes 21a corresponding to the screw holes 31a. The leg portions 22 project at right angles from both end edges of the support plate portion 21. As shown in FIG. 2, a counterbore 21b is formed at the end of the through hole 21a on the side where the leg 22 protrudes.

接続板3は、銅又は銅合金製の平板材で、ねじ孔31a付きのボス部31を有する。接続板3は、ボス部31を基板2の貫通孔21aに嵌合させて支持板部214上に重ねられ、ボス部31の先端部に形成される圧搾変形部31bをザグリ部21bに膨出させることより、基板2に固着される。   The connection plate 3 is a flat plate material made of copper or copper alloy and has a boss portion 31 with a screw hole 31a. The connecting plate 3 is overlapped on the support plate portion 214 with the boss portion 31 fitted in the through hole 21a of the substrate 2, and the squeezing deformed portion 31b formed at the tip portion of the boss portion 31 bulges to the counterbore portion 21b. As a result, the substrate 2 is fixed.

図2に示すように、組立前の接続板3は、ボス部31の中心に貫通する円孔31cを有する。このボス部31は、基板2の貫通孔31aに嵌合させたとき、先端部がわずかに基板2から突出する寸法である。この突出部を圧搾して、図1(B)に示すように、その圧搾変形部31bをザグリ部21bに膨出させ、基板2と接続板3とを結合する。その後、円孔31cにタッピングして、ねじ孔31aが形成される。   As shown in FIG. 2, the connection plate 3 before assembly has a circular hole 31 c that passes through the center of the boss portion 31. The boss portion 31 has a dimension such that the tip portion slightly protrudes from the substrate 2 when fitted into the through hole 31 a of the substrate 2. As shown in FIG. 1 (B), the projecting portion is squeezed so that the squeezed deformed portion 31b bulges to the counterbore portion 21b, and the substrate 2 and the connecting plate 3 are combined. Thereafter, the screw hole 31a is formed by tapping the circular hole 31c.

図3、図4に示す他の実施形態において、基板2は、2つの貫通孔21aの中間位置に、他の貫通孔21cを具備する。貫通孔21cは、ザグリ部21dを有する。接続板3は、基板の貫通孔21cに嵌合される他のボス部32を有する。このボス部32の先端部に圧搾変形部32aが形成される。この圧搾変形部32aにより基板2と接続板3とが互いに固着される。したがって、ボス部32は、嵌合時に基板2からわずかに突出する寸法に形成される。   In other embodiments shown in FIGS. 3 and 4, the substrate 2 includes another through hole 21c at an intermediate position between the two through holes 21a. The through hole 21c has a counterbore 21d. The connection plate 3 has another boss portion 32 fitted into the through hole 21c of the substrate. A squeezing deformation portion 32 a is formed at the tip of the boss portion 32. The substrate 2 and the connection plate 3 are fixed to each other by the squeezing deformation portion 32a. Therefore, the boss portion 32 is formed to have a dimension that slightly protrudes from the substrate 2 when fitted.

なお、この実施形態において、基板2の貫通孔21aにはザグリ部が形成されない。接続板3のボス部31は基板2から突出することのない寸法であり、中心には予めねじ孔31aが形成される。   In this embodiment, no counterbore is formed in the through hole 21a of the substrate 2. The boss portion 31 of the connection plate 3 has a dimension that does not protrude from the substrate 2, and a screw hole 31 a is formed in the center in advance.

図5,図6に示す他の実施形態において、基板2は、2つの貫通孔21aの中間位置に他の貫通孔21cを具備する。貫通孔21cは、ザグリ部21dを有する。接続板3は、基板2の貫通孔21cに対応する貫通孔33aを有する。貫通孔33aは、ザグリ部33bを有する。貫通孔21c,33aにカシメピン4が挿入され、それの圧搾変形部4aにより、基板2と接続板3とが互いに固着される。   In another embodiment shown in FIGS. 5 and 6, the substrate 2 includes another through hole 21c at an intermediate position between the two through holes 21a. The through hole 21c has a counterbore 21d. The connection plate 3 has a through hole 33 a corresponding to the through hole 21 c of the substrate 2. The through hole 33a has a counterbore portion 33b. The caulking pin 4 is inserted into the through holes 21c and 33a, and the substrate 2 and the connection plate 3 are fixed to each other by the squeezing deformation portion 4a.

なお、この実施形態において、基板2の貫通孔21aにはザグリ部が形成されない。接続板3のボス部31は基板2から突出することのない寸法であり、中心には予めねじ孔31aが形成される。   In this embodiment, no counterbore is formed in the through hole 21a of the substrate 2. The boss portion 31 of the connection plate 3 has a dimension that does not protrude from the substrate 2, and a screw hole 31 a is formed in the center in advance.

いずれの実施形態の接地用端子台1においても、ロウ付けの工程は省略される。ロウ付け工程の省略により、製造コストを引き下げることができる。ロウ付け工程における加熱が行われないので、製品の形状と寸法が安定する。メッキは、海上輸送を必要とする海外での低コスト生産を前提としたものであるが、国内でも比較的低コストで組立てできるので、メッキ工程を省略できる。   In any of the ground terminal blocks 1 of any embodiment, the brazing process is omitted. By omitting the brazing process, the manufacturing cost can be reduced. Since heating in the brazing process is not performed, the shape and dimensions of the product are stabilized. Plating is premised on low-cost production overseas that requires marine transportation, but can be assembled at a relatively low cost in Japan, so the plating process can be omitted.

1 接地用端子台
2 基板
21a 貫通孔
21b ザグリ部
21c 貫通孔
21d ザグリ部
22 脚部
3 接続板
31 ボス部
31a ねじ孔
31b 圧搾変形部
31c 円孔
32 ボス部
32a 圧搾変形部
33a 貫通孔
33b ザグリ部
4 カシメピン
4a 圧搾変形部
DESCRIPTION OF SYMBOLS 1 Grounding terminal block 2 Board | substrate 21a Through-hole 21b Counterbore part 21c Through-hole 21d Counterbore part 22 Leg part 3 Connection board 31 Boss part 31a Screw hole 31b Compression deformation part 31c Circular hole 32 Boss part 32a Compression deformation part 33a Through-hole 33b Counterbore Part 4 Caulking pin 4a Squeezed deformation part

Claims (4)

互いに電気的に導通するように固着される基板と接続板とからなり、当該基板と接続板との間に貫通するねじ孔を具備し、
前記基板は、鋼製で、前記ねじ孔が貫通する平板状の支持板部と当該支持板部の両端縁から直角に突出する一対の脚部とを具備し、
前記接続板は、銅又は銅合金製の平板材で、前記ねじ孔が貫通し、前記基板の支持板部上に固着され、
前記基板と前記接続板とは、圧搾変形部により互いに固着されることを特徴とする接地用端子台。
It consists of a substrate and a connection plate that are fixed so as to be electrically connected to each other, and includes a screw hole that passes between the substrate and the connection plate.
The substrate is made of steel, and includes a flat plate-like support plate portion through which the screw hole penetrates and a pair of legs protruding at right angles from both end edges of the support plate portion,
The connection plate is a flat plate made of copper or copper alloy, the screw hole penetrates, and is fixed on the support plate portion of the substrate,
The grounding terminal block, wherein the substrate and the connection plate are fixed to each other by a squeezing deformation portion.
前記基板は、前記ねじ孔に対応する貫通孔を有し、
前記接続板は、前記基板の貫通孔に嵌合されるねじ孔付きのボス部を有し、
前記ボス部の先端部に形成される圧搾変形部により前記基板と前記接続板とが互いに固着されることを特徴とする請求項1に記載の接地用端子台。
The substrate has a through hole corresponding to the screw hole,
The connection plate has a boss portion with a screw hole fitted into the through hole of the substrate,
2. The grounding terminal block according to claim 1, wherein the substrate and the connection plate are fixed to each other by a squeezing deformation portion formed at a tip portion of the boss portion.
前記基板は、前記ねじ孔に対応する貫通孔と、この貫通孔と異なる位置に形成される他の貫通孔とを有し、
前記接続板は、前記基板の貫通孔に嵌合されるねじ孔付きのボス部と、前記基板の他の貫通孔に嵌合される他のボス部とを有し、
前記他のボス部の先端部に形成される圧搾変形部により前記基板と前記接続板とが互いに固着されることを特徴とする請求項1に記載の接地用端子台。
The substrate has a through hole corresponding to the screw hole and another through hole formed at a position different from the through hole,
The connection plate has a boss portion with a screw hole to be fitted into the through hole of the substrate, and another boss portion to be fitted into another through hole of the substrate,
The grounding terminal block according to claim 1, wherein the substrate and the connection plate are fixed to each other by a squeezing deformation portion formed at a tip portion of the other boss portion.
前記基板は、前記ねじ孔に対応する貫通孔と、この貫通孔と異なる位置に形成される他の貫通孔とを有し、
前記接続板は、前記基板の貫通孔に嵌合されるねじ孔付きのボス部と、基板の他の貫通孔に対応する他の貫通孔を有し、
前記基板と前記接続板とが前記他の貫通孔に挿通されるカシメピンの圧搾変形部により互いに固着されることを特徴とする請求項1に記載の接地用端子台。
The substrate has a through hole corresponding to the screw hole and another through hole formed at a position different from the through hole,
The connection plate has a boss portion with a screw hole fitted into the through hole of the substrate, and another through hole corresponding to the other through hole of the substrate,
2. The grounding terminal block according to claim 1, wherein the substrate and the connection plate are fixed to each other by a squeezing deformation portion of a caulking pin inserted through the other through hole.
JP2012281587A 2012-12-25 2012-12-25 Terminal block for grounding Expired - Fee Related JP5530510B1 (en)

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JP2012281587A JP5530510B1 (en) 2012-12-25 2012-12-25 Terminal block for grounding
TW102108001A TWI481314B (en) 2012-12-25 2013-03-07 Grounding terminal block
CN201310556714.6A CN103904439B (en) 2012-12-25 2013-11-11 Earthy terminal board

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JP2014127276A JP2014127276A (en) 2014-07-07

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KR101706120B1 (en) * 2015-06-10 2017-02-15 한국태양유전(주) A Terminal block and Printed Circuit Board comprising the same
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KR200496665Y1 (en) * 2021-05-07 2023-03-29 박두성 Waterproof terminal plate for heat pipe watching system

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CN103904439A (en) 2014-07-02
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JP2014127276A (en) 2014-07-07
CN103904439B (en) 2016-04-27

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