JP5063672B2 - Wiring board and manufacturing method thereof - Google Patents

Wiring board and manufacturing method thereof Download PDF

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JP5063672B2
JP5063672B2 JP2009281901A JP2009281901A JP5063672B2 JP 5063672 B2 JP5063672 B2 JP 5063672B2 JP 2009281901 A JP2009281901 A JP 2009281901A JP 2009281901 A JP2009281901 A JP 2009281901A JP 5063672 B2 JP5063672 B2 JP 5063672B2
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conductor
wiring pattern
hole
fastening member
wiring board
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JP2011124437A (en
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利樹 腰前
宏 久留島
仁志 城所
昭弘 鈴木
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Mitsubishi Electric Corp
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Description

本発明は、基板の表面に形成された配線パターンに導体を接続する接続構造に関するものである。   The present invention relates to a connection structure for connecting a conductor to a wiring pattern formed on a surface of a substrate.

配線基板の表面に形成された配線パターンに導体を接続する接続構造に関しては、特に電流が大電流である場合、配線パターンにブスバーを接続する構造が用いられることが多い。   Regarding a connection structure for connecting a conductor to a wiring pattern formed on the surface of a wiring board, a structure in which a bus bar is connected to the wiring pattern is often used particularly when the current is large.

従来、例えば、基板上に配線パターンが形成され、この配線パターン上にブスバーが取り付けられている大電流プリント配線基板において、配線パターンの一部にスルーホールを形成して、このスルーホールにリベットにてブスバーを機械的に圧着する方法が提案されている(例えば、特許文献1参照)。   Conventionally, for example, in a high-current printed wiring board in which a wiring pattern is formed on a substrate and a bus bar is attached on the wiring pattern, a through hole is formed in a part of the wiring pattern, and the through hole is used as a rivet. A method of mechanically pressure-bonding the bus bar has been proposed (see, for example, Patent Document 1).

このようなリベットを用いた接続構造においては、配線パターンとブスバーとがリベットにより圧着されるので、確実に接続が行われるとともに、熱変動や振動に対してブスバーが脱落するおそれがなく信頼性が高い。   In such a connection structure using rivets, since the wiring pattern and the bus bar are crimped by the rivets, the connection is surely performed, and the bus bar is not likely to drop off due to thermal fluctuations and vibrations, and the reliability is improved. high.

また、他の例としては、基板とほぼ同じ厚さの導電性接続部材を基板に設けられたスルーホールに埋め込むことで基板に設けられた配線と接続させ、この導電性接続部材に雌ねじ穴を形成することにより、ブスバーや大電流用の圧着端子などを接続する接続構造が提案されている(例えば、特許文献2参照)。   As another example, a conductive connection member having substantially the same thickness as that of the substrate is embedded in a through hole provided in the substrate to be connected to a wiring provided in the substrate, and a female screw hole is provided in the conductive connection member. A connection structure for connecting a bus bar, a crimp terminal for a large current, or the like by forming the structure has been proposed (for example, see Patent Document 2).

このような基板埋め込み型の導電性接続部材は、基板とほぼ同じ厚さであるため、組立性、メンテナンス性を犠牲にすることなく基板に対する接続高さを抑えることができる(例えば、特許文献2参照)。   Since such a board-embedded conductive connecting member has substantially the same thickness as the board, the height of connection to the board can be suppressed without sacrificing assembly and maintenance (for example, Patent Document 2). reference).

さらにまた、従来、配線基板の表面に形成された配線パターンにブスバーを接続する接続構造の他の例として、ブスバーに直接ねじ穴を形成してねじ止めするというものも提案されている。   Furthermore, conventionally, another example of a connection structure for connecting a bus bar to a wiring pattern formed on the surface of a wiring board has been proposed in which a screw hole is directly formed in the bus bar and screwed.

実開平06−011371号公報Japanese Utility Model Publication No. 06-011371 特開2001−102111号公報JP 2001-102111 A

しかしながら、上記のような基板のスルーホールにリベットにてブスバーを圧着する方法に関しては、基板交換時や廃却時に導体を安易に取り外すことができず、導体とプリント基板同時に外す必要がある。このため、基板交換に時間がかかったり、廃却時の分別が困難であったりするといった問題があった。   However, regarding the method for crimping the bus bar to the through hole of the board as described above with a rivet, the conductor cannot be easily removed at the time of board replacement or disposal, and it is necessary to remove the conductor and the printed board at the same time. For this reason, there has been a problem that it takes time to replace the substrate, and it is difficult to separate at the time of disposal.

また、上記の基板埋め込み型の導電性接続部材を用いた接続構造においては、導電性接続部材を介して電流が流れるので、導電性接続部材電流容量が必要とされる。また、はんだ付け部に電流が流れることとなり、はんだ接続部にヒートサイクルが発生し、その影響によるはんだクラックの発生により信頼性が低下するといった問題があった。   Further, in the connection structure using the above-described embedded substrate type conductive connection member, since a current flows through the conductive connection member, a current capacity of the conductive connection member is required. In addition, a current flows in the soldering portion, and a heat cycle occurs in the solder connection portion, and there is a problem that reliability is lowered due to generation of a solder crack due to the influence.

さらにまた、ブスバーに直接ねじ穴を形成してねじ止めする接続構造においては、雌ねじ穴を形成するために、ブスバーを所定の厚さとする必要があり、コストが向上するといった問題があった。さらには、ブスバーを基板にねじ止めする場合、基板の裏側のボルトに手を延ばす必要があり、基板を裏返す必要があるので、作業性が悪く改善が望まれていた。   Furthermore, in the connection structure in which a screw hole is directly formed in the bus bar and screwed, in order to form the female screw hole, the bus bar needs to have a predetermined thickness, which increases the cost. Further, when the bus bar is screwed to the substrate, it is necessary to reach out to the bolt on the back side of the substrate, and it is necessary to turn the substrate over.

本発明は、上記に鑑みてなされたものであって、配線パターンに接続するブスバーなどの導体の板厚を小さくすることが可能であり(導体の板厚を自由に選定できる)、さらに、予め第2面に締結部材を固定した基板本体に対して、一方向からのねじ止め作業のみで導体を固定することができる配線基板及びその製造方法を提供することを目的とする。   The present invention has been made in view of the above, and it is possible to reduce the thickness of a conductor such as a bus bar connected to a wiring pattern (the thickness of the conductor can be freely selected). An object of the present invention is to provide a wiring board capable of fixing a conductor only by screwing work from one direction to a board body having a fastening member fixed to a second surface, and a method for manufacturing the wiring board.

上述した課題を解決し、目的を達成するために、本発明にかかる配線基板は、第1面に配線パターンを有するとともに配線パターンを含む箇所に貫通孔が形成された基板本体と、配線パターンに直接接触するとともに配線パターンとの接触面に貫通孔が形成された導体と、基板本体の第1面と反対側の第2面に固定された締結部材と、第1面側から導体の貫通孔に挿入されて基板本体の貫通孔を挿通して締結部材と螺合することにより、配線パターンと導体とを接続する固定ねじとを備えたことを特徴とする。   In order to solve the above-described problems and achieve the object, a wiring board according to the present invention includes a substrate body having a wiring pattern on a first surface and a through hole formed at a location including the wiring pattern, and a wiring pattern. A conductor that is in direct contact and has a through-hole formed on the contact surface with the wiring pattern, a fastening member that is fixed to a second surface opposite to the first surface of the substrate body, and a conductor through-hole from the first surface side And a fixing screw that connects the wiring pattern and the conductor by being inserted into the through hole of the board body and screwed into the fastening member.

また、本発明にかかる配線基板の製造方法は、基板本体の第1面の配線パターンが形成された部分に貫通孔を形成するとともに、基板本体の第1面と反対側の第2面に締結部材を固定し、貫通孔が形成された導体を配線パターンに直接接触するように配置し、固定ねじを、基板本体の第1面側から導体の貫通孔と基板本体の貫通孔とに挿通して、さらに締結部材と締結させて、配線パターンと導体とを接続することを特徴とする。   In the method for manufacturing a wiring board according to the present invention, a through hole is formed in a portion of the first surface of the board body where the wiring pattern is formed, and is fastened to the second surface opposite to the first surface of the board body. The member is fixed, the conductor in which the through hole is formed is arranged so as to be in direct contact with the wiring pattern, and the fixing screw is inserted from the first surface side of the board body into the through hole of the conductor and the through hole of the board body. Further, the wiring pattern and the conductor are connected by further fastening with a fastening member.

なお、ここで上記貫通孔とは、穴が中心軸回りに全周に渡って閉じた形状のものに限らず、例えば切り欠きなど、その内側を挿通する固定ねじを概ね囲むような形状なども含むものである。   Here, the above-mentioned through hole is not limited to a shape in which the hole is closed over the entire circumference around the central axis. For example, a shape such as a notch that substantially surrounds the fixing screw that passes through the inside of the through hole. Is included.

本発明によれば、導体にねじを形成する必要が無く、導体の板厚を小さくすることが可能であり(導体の板厚を自由に選定できる)、さらに、予め第2面に締結部材を固定した基板本体に対して、一方向からのねじ止め作業のみで導体を固定することができるので作業性がよく、さらに部品の交換や基板の分解も容易である。   According to the present invention, there is no need to form a screw on the conductor, the conductor thickness can be reduced (the conductor thickness can be freely selected), and a fastening member is previously provided on the second surface. Since the conductor can be fixed to the fixed board main body only by screwing from one direction, workability is good, and parts can be easily replaced and the board can be easily disassembled.

図1は、本発明にかかる配線基板の実施の形態1を示す図であり、導体接続構造の要部の斜視図である。FIG. 1 is a diagram showing a first embodiment of a wiring board according to the present invention, and is a perspective view of a main part of a conductor connection structure. 図2は、図1に示す配線基板の分解斜視図である。FIG. 2 is an exploded perspective view of the wiring board shown in FIG. 図3は、実施の形態1の締結部材が配線基板に取り付けられている様子を示す断面図である。FIG. 3 is a cross-sectional view showing a state in which the fastening member of the first embodiment is attached to the wiring board. 図4は、配線基板に導体を接合する様子を示す斜視図である。FIG. 4 is a perspective view showing a state in which a conductor is joined to a wiring board. 図5は、締結部材が取り付けられた配線基板を裏面側から見た斜視図である。FIG. 5 is a perspective view of the wiring board to which the fastening member is attached as viewed from the back side. 図6は、実施の形態1の締結部材である端子台の本来の使い方を説明する断面図である。FIG. 6 is a cross-sectional view for explaining the original usage of the terminal block that is the fastening member of the first embodiment. 図7は、実施の形態1の配線基板の効果の一つを説明する図であり、配線基板がカバーに近づけて配設された様子を示す斜視図である。FIG. 7 is a diagram for explaining one of the effects of the wiring board according to the first embodiment, and is a perspective view showing a state in which the wiring board is disposed close to the cover. 図8は、本発明にかかる配線基板の実施の形態2を示す図であり、締結部材が取り付けられた配線基板を裏面側から見た斜視図である。FIG. 8 is a diagram showing a second embodiment of a wiring board according to the present invention, and is a perspective view of the wiring board to which a fastening member is attached as viewed from the back side. 図9は、本発明にかかる配線基板の実施の形態3を示す図であり、締結部材が取り付けられた配線基板を裏面側から見た斜視図である。FIG. 9 is a diagram showing a third embodiment of the wiring board according to the present invention, and is a perspective view of the wiring board to which the fastening member is attached as viewed from the back side. 図10は、実施の形態1乃至3にて使用される導体の他の例を示す斜視図である。FIG. 10 is a perspective view showing another example of the conductor used in the first to third embodiments. 図11は、実施の形態1乃至3にて使用される導体のさらに他の例を示す斜視図である。FIG. 11 is a perspective view showing still another example of the conductor used in the first to third embodiments. 図12は、実施の形態1乃至3にて使用される導体のさらに他の例を示す斜視図である。FIG. 12 is a perspective view showing still another example of the conductor used in the first to third embodiments.

以下に、本発明にかかる配線基板及びその製造方法の実施の形態を図面に基づいて詳細に説明する。なお、この実施の形態によりこの発明が限定されるものではない。   Embodiments of a wiring board and a method for manufacturing the same according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

実施の形態1.
図1は、本発明にかかる配線基板の実施の形態1を示す図であり、導体接続構造の要部の斜視図である。図2は、図1に示す配線基板の分解斜視図である。図3は、本実施の形態の締結部材が配線基板に取り付けられている様子を示す断面図である。図4は、配線基板に導体を接合する様子を示す斜視図である。図5は、締結部材が取り付けられた配線基板を裏面側から見た斜視図である。なお、各図とも導体接続部分の要部を記載したものであり、実際には基板本体1は、同一平面上でさらに広範囲に広がっている。そして、ブスバー(導体)3は、電気的に接続すべき他の部品(図示せず)まで延びている。
Embodiment 1 FIG.
FIG. 1 is a diagram showing a first embodiment of a wiring board according to the present invention, and is a perspective view of a main part of a conductor connection structure. FIG. 2 is an exploded perspective view of the wiring board shown in FIG. FIG. 3 is a cross-sectional view showing a state in which the fastening member of the present embodiment is attached to the wiring board. FIG. 4 is a perspective view showing a state in which a conductor is joined to a wiring board. FIG. 5 is a perspective view of the wiring board to which the fastening member is attached as viewed from the back side. In each figure, the main part of the conductor connection portion is described, and actually, the substrate body 1 is spread over a wider range on the same plane. The bus bar (conductor) 3 extends to other parts (not shown) to be electrically connected.

本実施の形態の配線基板は、概略平板状のプリント配線基板である基板本体1と、基板本体1の配線パターン1aに接続されたブスバー(導体)3と、基板本体1の裏面に固定された締結部材5と、配線パターン1aとブスバー3とを接続する固定ねじ7とを含んで構成されている。   The wiring board of the present embodiment is fixed to the substrate body 1 which is a substantially flat printed wiring board, the bus bar (conductor) 3 connected to the wiring pattern 1 a of the board body 1, and the back surface of the substrate body 1. The fastening member 5 includes a fixing screw 7 that connects the wiring pattern 1 a and the bus bar 3.

基板本体1の少なくとも第1面(図中A側の面)に配線パターン1aが形成されている(第1面と反対側の第2面(図中B側の面)に別の配線パターンが設けられていてもよい)。この配線パターン1aに、ブスバー3が接続されている。配線パターン1aが形成されている部分の一部がブスバー3の接続位置となっており、この位置には表面を絶縁するレジストが形成されてない。そして、この接続位置の中央部に貫通孔1bが穿孔されている(図2)。   A wiring pattern 1a is formed on at least the first surface (surface on the A side in the drawing) of the substrate body 1 (another wiring pattern is formed on the second surface (surface on the B side in the drawing) opposite to the first surface). May be provided). A bus bar 3 is connected to the wiring pattern 1a. A part of the portion where the wiring pattern 1a is formed is a connection position of the bus bar 3, and a resist for insulating the surface is not formed at this position. And the through-hole 1b is drilled in the center part of this connection position (FIG. 2).

ブスバー3は、配線パターン1aと重なる接続部3aと、この接続部3aの一端から立ち上がる本体部3bとを含んで構成されている。接続部3aは、配線パターン1aに直接接続(面接触)している。図では省略しているが、上記のようにブスバー3の本体部3bは、図示しない他の部品まで延びている。そして、ブスバー3は、この他の部品と配線パターン1aとの間で大電流を流す電気的経路を構成している。そして、ブスバー3の接続部3aの中央部に貫通孔3cが穿孔されている(図2)。   The bus bar 3 includes a connection portion 3a that overlaps the wiring pattern 1a and a main body portion 3b that rises from one end of the connection portion 3a. The connecting portion 3a is directly connected (surface contact) to the wiring pattern 1a. Although not shown in the figure, the main body 3b of the bus bar 3 extends to other parts (not shown) as described above. The bus bar 3 constitutes an electrical path through which a large current flows between the other components and the wiring pattern 1a. And the through-hole 3c is drilled in the center part of the connection part 3a of the bus bar 3 (FIG. 2).

基板本体1の第1面と反対側の第2面(図中B側の面)に締結部材5が設けられている。締結部材5は、矩形平板状の締結部本体5aと基板本体1に立設され締結部本体5aの四隅をそれぞれ支持する脚部5bとから構成されている。締結部本体5aの中央部に雌ねじ穴5cが形成されている(図2)。図3に示すように、締結部材5は、締結部本体5aと対向する側の脚部5b先端を基板本体1にはんだ付けされて基板本体1に固定されている。配線パターン1aの絶縁するレジストが形成されてない部分を介してブスバー3へ電流が流れる。このため、締結部材5と配線パターン1aとは電気的に接続していなくてもよい。つまり、締結部材5と配線パターン1aとは絶縁されていてもよい。締結部材5は、電流回路に関係しないので、電気容量を持つ必要はなく、所定の機械的強度があればよい。   A fastening member 5 is provided on a second surface (surface on the B side in the drawing) opposite to the first surface of the substrate body 1. The fastening member 5 is composed of a rectangular flat plate-like fastening part body 5a and leg parts 5b that stand on the board body 1 and support the four corners of the fastening part body 5a. A female screw hole 5c is formed in the central portion of the fastening portion main body 5a (FIG. 2). As shown in FIG. 3, the fastening member 5 is fixed to the board body 1 by soldering the tip of the leg part 5 b on the side facing the fastening part body 5 a to the board body 1. A current flows to the bus bar 3 through a portion of the wiring pattern 1a where the insulating resist is not formed. For this reason, the fastening member 5 and the wiring pattern 1a do not need to be electrically connected. That is, the fastening member 5 and the wiring pattern 1a may be insulated. Since the fastening member 5 is not related to the current circuit, the fastening member 5 does not need to have an electric capacity and may have a predetermined mechanical strength.

固定ねじ7は、外周にねじが螺刻されて雄ねじとされた螺刻部7bと、螺刻部7bの一端に形成された頭部7aとからなる。固定ねじ7の螺刻部7bは、ブスバー3の貫通孔3cと基板本体1の貫通孔1bを貫通して締結部材5の雌ねじ穴5cに螺合している。貫通孔3cと貫通孔1bは、螺刻部7bに対して所定のクリアランスをもつような大きさ、つまりばか穴となっている。そして、固定ねじ7は、頭部7aと締結部材5との間にブスバー3と基板本体1とを強く挟み込んで配線パターン1aとブスバー3とを電気的に接続している。   The fixing screw 7 includes a threaded portion 7b that is screwed on the outer periphery to form a male screw, and a head 7a that is formed at one end of the threaded portion 7b. The threaded portion 7 b of the fixing screw 7 passes through the through hole 3 c of the bus bar 3 and the through hole 1 b of the substrate body 1 and is screwed into the female screw hole 5 c of the fastening member 5. The through hole 3c and the through hole 1b are sized so as to have a predetermined clearance with respect to the threaded portion 7b, that is, a fool hole. The fixing screw 7 electrically connects the wiring pattern 1a and the bus bar 3 with the bus bar 3 and the substrate body 1 being strongly sandwiched between the head 7a and the fastening member 5.

以上のように、本実施の形態の配線基板によれば、ブスバー3と配線パターン1aとが直接接続するので、両者間に信頼性よく大電流を流す構成している。また、ブスバー3に螺刻する必要がないので、ブスバー3の特に接続部3aの厚さを薄くすることも可能となる(ブスバー3の板厚を自由に選定できる)。さらに、一方向からのねじ止め作業により、配線パターン1aとブスバー3とを電気的に接続することができ、作業性がよく、さらに部品の交換や基板の分解も容易である。   As described above, according to the wiring board of the present embodiment, the bus bar 3 and the wiring pattern 1a are directly connected, so that a large current flows between them with high reliability. Further, since it is not necessary to screw into the bus bar 3, the thickness of the connection portion 3a of the bus bar 3 can be reduced (the thickness of the bus bar 3 can be freely selected). Furthermore, the wiring pattern 1a and the bus bar 3 can be electrically connected by screwing work from one direction, the workability is good, and the parts can be easily replaced and the board can be easily disassembled.

図6は、本実施の形態の締結部材5である端子台の本来の使い方を説明する断面図である。本実施の形態の締結部材5は、配線基板11上に固定して端子14の固定に用いる市販の汎用の端子台5を流量して用いている。このように市販の端子台5を流用することにより、コストダウンを図っている。端子台5は、本来図6に示すように、配線基板11上に形成された配線パターン11cと接続するようにはんだ12にて固定されて、締結部本体5aに締結された端子14と配線パターン1cとの電気的接続を実現するものである。本実施の形態の使い方においては、締結部材5は、上記のように配線パターン11cと電気的に接続するものでないので、導電性材料のみならず絶縁性材料で作製されてもよい。締結部材5を、樹脂等の絶縁性材料にて作製することにより、コストダウンを図ることができる。   FIG. 6 is a cross-sectional view for explaining the original usage of the terminal block which is the fastening member 5 of the present embodiment. The fastening member 5 of the present embodiment uses a commercially available general-purpose terminal block 5 which is fixed on the wiring board 11 and used for fixing the terminals 14 at a flow rate. Thus, cost reduction is achieved by diverting the commercially available terminal block 5. As shown in FIG. 6, the terminal block 5 is fixed with solder 12 so as to be connected to the wiring pattern 11c formed on the wiring board 11, and the terminal 14 and the wiring pattern fastened to the fastening portion main body 5a. The electrical connection with 1c is realized. In the usage of the present embodiment, since the fastening member 5 is not electrically connected to the wiring pattern 11c as described above, the fastening member 5 may be made of an insulating material as well as a conductive material. By producing the fastening member 5 with an insulating material such as resin, the cost can be reduced.

また、本実施の形態の締結部材5は、締結部本体5aと、これを基板本体1から支持する脚部5bとから構成されているので、締結部本体5aと基板本体1との間に所定の間隔が空き、これにより固定ねじ7は、長さ方向に所定の間隔だけ離れた2点にて支持されるのでより安定して固定される。   Further, since the fastening member 5 of the present embodiment is composed of the fastening portion main body 5a and the leg portions 5b that support the fastening portion main body 5a from the substrate main body 1, a predetermined amount is provided between the fastening portion main body 5a and the substrate main body 1. The fixing screw 7 is supported at two points separated by a predetermined interval in the length direction, so that the fixing screw 7 is fixed more stably.

また、本実施の形態においては、固定ねじ7は電気の導通に関与しないので、固定ねじ7もまた、導電性材料のみならず絶縁性材料で作製されたものてもよい。絶縁性材料にて作製された締結部材5と、絶縁性材料にて作製された固定ねじ7とを合わせて用いることにより、次のような効果を得ることができる。図7は、本実施の形態の配線基板の効果の一つを説明する斜視図である。図7において、基板本体1はカバー51に近づけて配設されている。例えば、カバー51が金属製である場合、電流が流れる箇所(回路)から所定距離離さなければならない(カバーに限らず、導電性の部材は、回路から所定距離離さなければならない)。締結部材5と固定ねじ7を絶縁性材料にて作製することにより、両者に電流が流れないので、カバー51(導電性の部材)に近づけて、或いは接触させて配置することができる。これにより、装置の小型化を図ることができる。   In this embodiment, since the fixing screw 7 does not participate in electrical conduction, the fixing screw 7 may also be made of an insulating material as well as a conductive material. By using together the fastening member 5 made of an insulating material and the fixing screw 7 made of an insulating material, the following effects can be obtained. FIG. 7 is a perspective view for explaining one of the effects of the wiring board of the present embodiment. In FIG. 7, the substrate body 1 is disposed close to the cover 51. For example, when the cover 51 is made of metal, it must be separated from a portion (circuit) through which current flows by a predetermined distance (not limited to the cover, the conductive member must be separated from the circuit by a predetermined distance). Since the fastening member 5 and the fixing screw 7 are made of an insulating material, no current flows through them, so that they can be placed close to or in contact with the cover 51 (conductive member). Thereby, size reduction of an apparatus can be achieved.

実施の形態2.
図8は、本発明にかかる配線基板の実施の形態2を示す図であり、締結部材が取り付けられた配線基板を裏面側から見た斜視図である。本実施の形態の締結部材15は、矩形平板状の締結部本体15aと、基板本体1に立設され締結部本体15aの1辺を支持する脚部15bとから構成されており、概略断面L字型を成している。締結部材15は、脚部15bの締結部本体15aと反対側の辺を基板本体1に接着剤にて固定されている。基板本体1の第1面(図中A側の面)の構成は、実施の形態1のものと同じである。図示しない固定ねじ7の螺刻部7bは、図示しないブスバー3の貫通孔3cと基板本体1の貫通孔1bを貫通して締結部材15の雌ねじ穴15cに螺合している。締結部材15は、板金の折り曲げ、或いは樹脂モールドなどによって作製される。その他の構成は実施の形態1と同様である。
Embodiment 2. FIG.
FIG. 8 is a diagram showing a second embodiment of a wiring board according to the present invention, and is a perspective view of the wiring board to which a fastening member is attached as viewed from the back side. The fastening member 15 according to the present embodiment is composed of a rectangular flat plate-like fastening part main body 15a and a leg part 15b that stands on the board main body 1 and supports one side of the fastening part main body 15a. It has a letter shape. The fastening member 15 is fixed to the substrate body 1 with an adhesive on the side opposite to the fastening portion body 15a of the leg portion 15b. The configuration of the first surface (the surface on the A side in the drawing) of the substrate body 1 is the same as that of the first embodiment. The threaded portion 7b of the fixing screw 7 (not shown) passes through the through hole 3c of the bus bar 3 (not shown) and the through hole 1b of the substrate body 1, and is screwed into the female screw hole 15c of the fastening member 15. The fastening member 15 is produced by bending a sheet metal or resin mold. Other configurations are the same as those of the first embodiment.

このような構成の配線基板においては、実施の形態1のものと概略同様の効果を得られるとともに、締結部材15が簡素な構造で安価に製造できるのでコストダウンを図ることができる。   In the wiring board having such a configuration, effects similar to those of the first embodiment can be obtained, and the fastening member 15 can be manufactured at a low cost with a simple structure, so that the cost can be reduced.

実施の形態3.
図9は、本発明にかかる配線基板の実施の形態3を示す図であり、締結部材が取り付けられた配線基板を裏面側から見た斜視図である。本実施の形態の締結部材17は、基板本体1に固着された一般的なナットである。基板本体1の第1面(図中A側の面)の構成は、実施の形態1のものと同じである。図示しない固定ねじ7の螺刻部7bは、図示しないブスバー3の貫通孔3cと基板本体1の貫通孔1bを貫通して締結部材17の雌ねじ穴17cに螺合している。その他の構成は実施の形態1と同様である。
Embodiment 3 FIG.
FIG. 9 is a diagram showing a third embodiment of the wiring board according to the present invention, and is a perspective view of the wiring board to which the fastening member is attached as viewed from the back side. The fastening member 17 according to the present embodiment is a general nut fixed to the board body 1. The configuration of the first surface (the surface on the A side in the drawing) of the substrate body 1 is the same as that of the first embodiment. The threaded portion 7b of the fixing screw 7 (not shown) passes through the through hole 3c of the bus bar 3 (not shown) and the through hole 1b of the substrate body 1, and is screwed into the female screw hole 17c of the fastening member 17. Other configurations are the same as those of the first embodiment.

このような構成の配線基板においては、基板本体1と締結部材17との間に所定の間隔が空かないので、固定ねじ7は、長さ方向に所定の間隔だけ離れた2点にて支持されないが、締結部材17の軸方向厚さが実施の形態1及び2の締結部本体5a,15aのものよりも大きく、これにより、固定ねじ7は安定して固定される。そして、実施の形態1,2のものと概略同様の効果を得られる他、締結部材17が一般的なナットであるのでコストダウンを図ることができる。   In the wiring board having such a configuration, there is no predetermined gap between the board body 1 and the fastening member 17, so that the fixing screw 7 is not supported at two points separated by a predetermined gap in the length direction. However, the axial direction thickness of the fastening member 17 is larger than that of the fastening part main bodies 5a and 15a of the first and second embodiments, whereby the fixing screw 7 is stably fixed. In addition to substantially the same effects as those of the first and second embodiments, the fastening member 17 is a general nut, so that the cost can be reduced.

図10は、実施の形態1乃至3にて使用される導体の他の例を示す斜視図である。図11は、実施の形態1乃至3にて使用される導体のさらに他の例を示す斜視図である。図12は、実施の形態1乃至3にて使用される導体のさらに他の例を示す斜視図である。上記実施の形態1乃至3においては、配線パターン1aに接続される導体は、ブスバー3であったが、図10に示されるような丸形圧着端子23や、図11に示されるようなY形圧着端子25などでもよい。さらには、図12に示されるような、電線の端をU字形に形成したものであってもよい。上記実施の形態1乃至3において説明したように、導体は基板本体1と固定ねじ7の頭部7aとの間に狭持される。そのため、図11のY形圧着端子25や図12のU字形電線27のように、導体に形成される穴は、全周に渡って閉じた形のものでなくともよい。同様にして、基板本体1に形成される貫通孔1cも、全周に渡って閉じた形のものでなくともよい。   FIG. 10 is a perspective view showing another example of the conductor used in the first to third embodiments. FIG. 11 is a perspective view showing still another example of the conductor used in the first to third embodiments. FIG. 12 is a perspective view showing still another example of the conductor used in the first to third embodiments. In the first to third embodiments, the conductor connected to the wiring pattern 1a is the bus bar 3, but the round crimp terminal 23 as shown in FIG. 10 or the Y shape as shown in FIG. A crimp terminal 25 or the like may be used. Furthermore, as shown in FIG. 12, the end of the electric wire may be formed in a U shape. As described in the first to third embodiments, the conductor is held between the substrate body 1 and the head 7 a of the fixing screw 7. Therefore, like the Y-shaped crimp terminal 25 in FIG. 11 and the U-shaped electric wire 27 in FIG. 12, the holes formed in the conductor do not have to be closed over the entire circumference. Similarly, the through-hole 1c formed in the substrate body 1 may not be closed over the entire circumference.

以上のように、本発明にかかる配線基板及びその製造方法は、基板の表面に形成された配線パターンに導体を接続する接続構造に関するものに有用であり、特に、大電流を流す導体を接続する接続構造に関するものに適している。   As described above, the wiring board and the manufacturing method thereof according to the present invention are useful for a connection structure that connects a conductor to a wiring pattern formed on the surface of the board, and in particular, connects a conductor through which a large current flows. Suitable for connection structures.

1 基板本体
1a,1c 配線パターン
1b 貫通孔
3 ブスバー(導体)
3a 接続部
3b 本体部
3c 貫通孔
5 締結部材(端子台)
5a 締結部本体
5b 脚部
5c 雌ねじ穴
7 固定ねじ
7a 頭部
7b 螺刻部
11 配線基板
12 はんだ
15,17 締結部材
15a 締結部本体
15b 脚部
15c,17c 雌ねじ穴
51 カバー
A 第1面
B 第2面
DESCRIPTION OF SYMBOLS 1 Substrate body 1a, 1c Wiring pattern 1b Through hole 3 Busbar (conductor)
3a connection part 3b body part 3c through-hole 5 fastening member (terminal block)
5a Fastening part main body 5b Leg part 5c Female screw hole 7 Fixing screw 7a Head part 7b Screw part 11 Wiring board 12 Solder 15, 17 Fastening member 15a Fastening part main body 15b Leg part 15c, 17c Female screw hole 51 Cover A 1st surface B 1st 2 sides

Claims (7)

第1面に配線パターンを有するとともに前記配線パターンを含む箇所に貫通孔が形成された基板本体と、
前記配線パターンに直接接触する接触面を有し、該接触面に貫通孔が形成された導体と、
前記基板本体の第1面と反対側の第2面に予め固定された締結部材と、
ねじ頭が前記第1面側に配置されるように前記第1面側から前記導体の貫通孔にねじ軸が挿入されて前記基板本体の貫通孔を挿通して前記締結部材と螺合することにより、前記ねじ頭と前記基板本体との間に前記導体を挟み込んで前記配線パターンと前記導体とを接続する固定ねじと
を備えたことを特徴とする配線基板。
A substrate body having a wiring pattern on the first surface and having a through-hole formed at a location including the wiring pattern;
It has a contact surface that contacts directly on the wiring pattern, a conductor through hole in the contact surface is formed,
A fastening member fixed in advance to a second surface opposite to the first surface of the substrate body;
A screw shaft is inserted into the through hole of the conductor from the first surface side so that the screw head is disposed on the first surface side, and is inserted into the through hole of the substrate body and screwed with the fastening member. A wiring board comprising: a fixing screw that sandwiches the conductor between the screw head and the board body and connects the wiring pattern and the conductor.
前記配線パターンの表面はレジストで覆われており、
前記導体は、前記配線パターンのレジストがない部分に配置されている
ことを特徴とする請求項1に記載の配線基板。
The surface of the wiring pattern is covered with a resist,
The wiring board according to claim 1, wherein the conductor is disposed in a portion of the wiring pattern where there is no resist.
前記締結部材は、前記固定ねじと螺合する雌ねじが形成された締結部本体と、前記締結部本体を前記基板本体から所定の高さに支持する少なくとも一つの脚部とを有する
ことを特徴とする請求項1または2に記載の配線基板。
The fastening member has a fastening portion main body formed with a female screw that is screwed with the fixing screw, and at least one leg portion that supports the fastening portion main body at a predetermined height from the substrate body. The wiring board according to claim 1 or 2.
前記締結部材が、絶縁性材料で作製されている
ことを特徴とする請求項1から3のいずれか1項に記載の配線基板。
The wiring board according to claim 1, wherein the fastening member is made of an insulating material.
前記固定ねじが、絶縁性材料で作製されている
ことを特徴とする請求項1から4のいずれか1項に記載の配線基板。
The wiring board according to any one of claims 1 to 4, wherein the fixing screw is made of an insulating material.
基板本体の第1面の配線パターンが形成された部分に貫通孔を形成するとともに、前記基板本体の第1面と反対側の第2面に締結部材を予め固定し、
貫通孔が形成された接触面を有する導体を、前記接触面が前記配線パターンに直接接触するように配置し、
固定ねじを、ねじ頭が前記第1面側に配置されるように前記基板本体の第1面側から前記導体の貫通孔と前記基板本体の貫通孔とにねじ軸を挿通して、さらに前記締結部材と締結させて、前記ねじ頭と前記基板本体との間に前記導体を挟み込むことにより前記配線パターンと前記導体とを接続することを特徴とする配線基板の製造方法。
A through hole is formed in a portion where the wiring pattern of the first surface of the substrate body is formed, and a fastening member is fixed in advance to the second surface opposite to the first surface of the substrate body,
A conductor having a through-hole is formed in contact surfaces, arranged so that the contact surface is in direct contact on the wiring pattern,
Fixing screws, by inserting a screw shaft from the first surface side of the substrate main body so the screw head is disposed on the first surface side and the through hole of the substrate main body and the through hole of the conductor, further wherein A method of manufacturing a wiring board, wherein the wiring pattern and the conductor are connected by fastening with a fastening member and sandwiching the conductor between the screw head and the board body .
前記配線パターンの表面はレジストで覆われており、
前記導体を、前記配線パターンのレジストがない部分に配置する
ことを特徴とする請求項6に記載の配線基板の製造方法。
The surface of the wiring pattern is covered with a resist,
The method of manufacturing a wiring board according to claim 6, wherein the conductor is disposed in a portion of the wiring pattern where there is no resist.
JP2009281901A 2009-12-11 2009-12-11 Wiring board and manufacturing method thereof Expired - Fee Related JP5063672B2 (en)

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