JP5525146B2 - Biochip substrate - Google Patents

Description

  The present invention relates to a biochip substrate used in an apparatus for analyzing a trace amount of a biocomponent using a liquid biological sample as a test liquid, and a microreactor for chemically synthesizing a trace amount of a biocomponent.

  Using only a trace amount of a biological sample such as blood or urine, and utilizing the specific substrate selectivity of the enzyme, the amount of enzymatic reaction that acts on the substrate in the sample and the degree of coloring by the reagent that develops the base mass with the enzyme or substrate Analyzes that quantitate with the use of an enzyme-containing membrane, convert the amount of enzyme reaction to an electrical signal with an electrode, and quantify the substrate mass, DNA extraction, PCR amplification thereof, ion concentration measurement, DNA, protein, or peptide A biochip substrate is used to carry out a microsynthesis of the above.

  A commercially available biochip substrate is formed by digging grooves for various reactions on a resin plate by laser irradiation or by etching a metal layer or silicon dioxide layer on a glass plate to form grooves. Each is covered with another plate and bonded with an adhesive.

  For example, in Patent Document 1, a silicon dioxide film on a silicon substrate is coated with a resist film, then coated with a patterned photomask, etched with hydrofluoric acid, and the biosensor accommodation region and the flow path of the liquid specimen After the lithography that forms the groove, the biosensor electrode / wiring is formed again by lithography, the biocatalyst, etc. is fixed there, covered with a glass substrate, and fixed with an epoxy adhesive. Are disclosed.

  In such a biosensor, when the liquid specimen is pressurized and flowed into the groove, the bonded substrate and the substrate cannot withstand the pressure and are peeled off and are easily damaged.

Japanese Patent Publication No. 08-20396

  The present invention has been made to solve the above-described problems, and can reliably form a fine flow path for flowing a test liquid such as a small amount of a biological sample, and pressurize the test liquid to flow at a low or high temperature. However, it is an object of the present invention to provide a simple and easy-to-manufacture small-sized biochip substrate that can be analyzed and reacted accurately and simply in a short period of time without breakage.

The biochip substrate according to claim 1, which has been made in order to achieve the above object, has an overlapping resin molded sheet, and one of the overlapping surfaces of the resin molded sheets facing each other. A non-adhesive streak from the liquid injection port to the liquid discharge port is provided in the part, and the resin molded sheets are bonded to each other on both sides along the streak of the liquid injection port. The streak is formed as a flow path for the test liquid to be injected from at least one ,
The resin molded sheet is made of silicone resin and has elasticity, and the streaks are expanded by compression from outside and / or by pressure injection of the test solution to form the flow path. ,
At least one of the superimposed surfaces of the molded resin sheet, the streaks are covered with a metal deposition film or a masking resin layer, thereby forming the non-adhesive streaks,
At least one of the surfaces of the resin-molded sheet to be bonded and, if necessary, the spacers sandwiched between them, is subjected to corona discharge treatment or plasma treatment, and the treated surfaces are overlapped. The biochip substrate to be bonded,
The resin-molded sheet to be bonded and the spacer sandwiched between the resin-molded sheet and the spacer, if necessary, contain a hydrosilyl group-containing compound and a vinyl group-containing compound, both of which are added to the vinyl group of the vinyl group-containing compound. The silicon-carbon bond formed by the addition reaction of the hydrosilyl group of the hydrosilyl group-containing compound of
Or
One of the resin-molded sheet to be bonded and the spacer sandwiched between the resin-molded sheet and the spacer, if necessary, has a hydrosilyl-containing silyl group, a vinyl-containing silyl group, an alkoxy group on the dehydrogenation group of the hydroxyl group on the surface. At least one active silyl group selected from a silyl-containing silyl group and a hydrolyzable group-containing silyl group is bonded to a silyl ether bond, and the other is hydrosilyl, vinylsilyl, hydroxysilyl that reacts with the active silyl group. A compound containing at least one reactive group selected from alkyloxysilyl, alkenyloxysilyl, acyloxysilyl, iminooxysilyl, and alkylaminosilyl, both of which are silicon-carbon formed by the above reaction. And the silicon-oxygen bond. Characterized in that it is.

The biochip substrate according to claim 2 is the biochip substrate according to claim 1, wherein the streaks are partitioned by the spacers sandwiched between the resin molded sheets that are stacked , so that the streaks are the flow paths. The resin molded sheet and the spacer are bonded to each other.

The biochip substrate according to claim 3, which has been described in any one of claims 1-2, and the resin molded sheet the to be bonded, at least one of the said spacer sandwiched Re their The surfaces to be bonded are subjected to corona discharge treatment or plasma treatment, and the treated surfaces are overlapped and bonded together.

The biochip substrate according to claim 4, claim 1 which has been described in any one of 2, and the resin molded sheet the to be bonded, and the spacer sandwiched Re its is, hydrosilyl group-containing compound And a vinyl group-containing compound, both of which are bonded via a silicon-carbon bond formed by the addition reaction of the hydrosilyl group of the hydrosilyl group-containing compound to the vinyl group of the vinyl group-containing compound. It is characterized by being bonded.

The biochip substrate according to claim 5, which has been described in any one of claims 1-2, and the resin molded sheet the to be bonded, to be bonded of the said spacer sandwiched Re their On the other hand, at least one active silyl group selected from a hydrosilyl-containing silyl group, a vinyl-containing silyl group, an alkoxysilyl-containing silyl group, and a hydrolyzable group-containing silyl group as a hydroxyl group dehydrogenation group on the surface thereof, At least one selected from hydrosilyl, vinylsilyl, hydroxysilyl, alkyloxysilyl, alkenyloxysilyl, acyloxysilyl, iminooxysilyl, and alkylaminosilyl, which are silyl ether-bonded and the other reacts with the active silyl group. Of the reactive group, both of which are formed by the reaction described above. The bonding is made through any bond of silicon-carbon and silicon-oxygen formed.

A biochip substrate according to a sixth aspect is the biochip substrate according to the first aspect, characterized in that there are a plurality of the streaks and are converged or branched in the middle.

A biochip substrate according to claim 7 is the biochip substrate according to claim 1, wherein at least any one of a detection reagent for a biocomponent of the test liquid, a reaction reagent for the biocomponent of the test liquid, and a biosensor Is placed in the middle of the streak and / or
At least one of the detection reagent, the reaction reagent, and the synthesis reagent is injected from the liquid injection port.
The biochip substrate according to claim 8 is the biochip substrate according to claim 1, wherein the silicone resin is a peroxide-crosslinked silicone rubber, an addition-type crosslinked silicone rubber, or a condensation-type crosslinked silicone rubber. To do.
The biochip substrate according to claim 9 is the biochip substrate according to claim 8, wherein the silicone resin is the peroxide-crosslinked silicone rubber to which a peroxide is added.
The biochip substrate according to claim 10 is the biochip substrate according to claim 8, wherein the silicone resin is an addition-type crosslinked silicone rubber, and includes chloroplatinic acid, platinumcarbonylcyclovinylmethylsiloxane complex, platinum divinyltetra A catalyst selected from a methyldisiloxane complex, a platinum cyclovinylmethylsiloxane complex, a platinum octanal / octanol complex, and tris (dibutyl sulfide) rhodium trichloride is added.
The biochip substrate according to claim 11 is the biochip substrate according to claim 8, wherein the silicone resin is a condensation type crosslinked silicone rubber, and is CH ₃ Si (OCOCH ₃ ) ₃ , C ₂ H ₅ OSi ( OCOCH ₃ ) ₃ , CH ₃ Si [OC (CH ₃ ) = CH ₂ ] ₃ , CH ₃ Si [ON = C (CH ₃ ) C ₂ H ₅ ]] ₃ , CH ₃ OSi [ON = C (CH ₃ ) C ₂ H ₅ ]] ₃ , and CH ₃ Si [N (CH ₃ )] ₃ condensation type cross-linking agents, and organic tins such as bis (ethylhexyl) tin, bis (neodecanate) tin, and dibutylralauryltin A catalyst selected from a compound, zinc octylate, iron octylate, titanate ester, titanium chelate compound, and amines is added.

The biochip substrate of the present invention has a complex shape in which straight lines or curves are combined with fine streaks having a width of 0.5 μm to 5 mm flowing the test solution, or is expanded or converged or branched in the middle or at the end thereof. A flow path having an arbitrary pattern such as a shape is surely formed. In addition, since the plurality of resin molded sheets forming the biochip substrate are firmly bonded like chemical covalent bonds between molecules at sites other than the streaks, the physical properties of the adhesive Bonded much stronger than glued. Therefore, even if the test liquid is flowed by applying a pressure of about normal pressure to about 5 atm in order to allow the test liquid to permeate through such a fine flow path, it is about -80 ° C., preferably 20 ° C. to 80 ° C. under ice cooling. Even if the test liquid is flowed while repeating heating and cooling in the low to high temperature range of about ℃, the biochip substrate does not break, and the biocomponents of the test liquid can be analyzed and reacted accurately and simply in a short period of time. can do.

  Since this biochip substrate has an extremely small size of about several millimeters to several tens of centimeters and a simple structure, it can be manufactured in a large amount at a low cost and with a high yield.

  When such a biochip substrate is used in a disposable manner, there is no fear of contamination due to mixing of a test fluid of another system, and a reliable result can be obtained.

  Since the biochip substrate is small and can be made multifunctional, it can be used to quickly obtain analysis results not only indoors but also outdoors using a portable analyzer without using a large analyzer. The

  The amount of analysis reagent and reaction reagent used for the biochip substrate is very small, and the amount of waste liquid is significantly smaller than the analysis and reaction in flasks and test tubes, which contributes to environmental conservation.

Preferred form for carrying out the invention

  Hereinafter, examples of preferable modes for carrying out the present invention will be described in detail, but the scope of the present invention is not limited to these modes.

As shown in FIG. 1, the biochip substrate 1 is obtained by stacking two silicone resin molded sheets 11 and 12. If necessary, the resin molded sheets 11 and 12 contain a hydrosilyl group-containing compound and a vinyl group-containing compound as vulcanizing agents, and a part of these compound molecules is exposed from the surfaces of both sheets 11 and 12. The upper surface of the lower side of the resin molded sheet 12, Sujijo 17 of the metal layer 1 8a · 18a 'corresponding to the path to flow the test liquid is attached. The upper resin molding sheet 11 is provided with liquid inlets 13a, 13b, 13c and liquid outlets 14a, 14b corresponding to the start and end of the streak 17 so as to penetrate therethrough.

  A heater 19 is provided in the vicinity of the streak 17 on the way, and an electrode 20 that is a biosensor is provided at one end.

The overlapping surface of the lower surface 15 of the upper resin molded sheet 11 and the upper surface 16 of the lower resin molded sheet 12 is the hydrosilyl group of the hydrosilyl group-containing compound molecule exposed on the surface of one surface 15 (or 16). Share of silicon-carbon formed by reaction of (SiH group) with the vinyl group (CH ₂ ═CH— group) of the vinyl group-containing compound molecule exposed on the surface of the other surface 16 (or 15) Bonded by bonding.

The streak 17 on the lower resin molded sheet 12 covers the resin molded sheet 12 so that the hydrosilyl group-containing compound molecule and the vinyl group-containing compound molecule are not exposed. It cannot be covalently bonded to these compound molecules. Accordingly, the streak 17 is not bonded to the overlapping surfaces 15 and 16 of the resin molded sheets 11 and 12. On the other hand, both sides along the streak 17 are firmly bonded by chemical bonding. If necessary, the metal layer may be removed by washing with an acid.

  When the both sides of the streak 17 are pressed in parallel to the sheet surface from the outer peripheral side of the resin sheet, when compressed from the outside from the upstream side of the test liquid, or when the test liquid is injected under pressure, the streak 17 Can be spread to form a channel as if it were a tube. In addition, a flow path with almost no gap can be realized depending on the degree of pressure from the outside or pressurized injection of the test solution, and a very small amount of test can be performed.

What is necessary is just to design the width | variety and length of a streak to the dimension made into the objective suitably according to the use. According to the biochip substrate of the present invention, it is not necessary to delete such as mechanical cutting and chemical erosion as compared with the conventional biochip substrate that forms an etching or groove engraving, and a 0.5 μm wide non-chip. Bond streaks are possible. The thickness of the biochip substrate is appropriately selected according to the use and amount of the device on which the biochip substrate is mounted and the microreactor, but is preferably 0.5 to 10 mm.

  Such a biochip substrate 1 will be described as follows with reference to FIG.

A metal film 31 is attached to one surface of a silicone resin- molded sheet 12 containing a hydrosilyl group-containing compound and a vinyl group-containing compound as shown in FIG. Further, it is coated with a photoresist solution to form an uncured resist film 32. Covering with a mask concealing other than the position corresponding to the streak 17 and irradiating the exposure line, photo-curing the resist film 32, and then washing away the portion that has not been cured because it was concealed, The cured resist layers 32a and 32a ′ are obtained as shown in FIG. Next, when the exposed portion of the metal coating 31 is etched with an acid, metal layers 18a and 18a ′ covered with the cured resist layers 32a and 32a ′ are obtained at portions corresponding to the streak 17 as shown in FIG. It is done. When the hardened resist layers 32a and 32a ′ are removed, the metal layers 18a and 18a ′ are exposed as shown in FIG. If necessary, an electrode 20 such as a heater 19 or a biosensor is attached. Liquid injection ports 13a, 13b and 13c and liquid discharge ports 14a and 14b (see FIG. 1) are opened in another silicone resin- molded sheet 11 containing a hydrosilyl group-containing compound and a vinyl group-containing compound. When the overlapping surfaces 15 and 16 of the resin molded sheets 11 and 12 are subjected to corona discharge treatment, and are overlapped and pressure-bonded under heating, the lower surface 15 of the upper resin molded sheet 11 and the lower resin molded sheet 12 of the hydrosilyl group-containing compound existing in one and the vinyl group of the vinyl group-containing compound existing in the other cause an addition-type reaction to be shared at a site other than the metal layers 18a and 18a '. Form a bond. As a result, the biochip substrate 1 is obtained as shown in FIG.

  The biochip substrate 1 will be used as follows, for example, with reference to FIGS. 1 and 2 for an example of trace synthesis. A biochip substrate is attached to a microreactor (not shown). As shown in FIG. 2 (G), the biochip substrate 1 is compressed from the side surface side to the both sides of the streak perpendicular to the streak flow direction. Then, the streak 17 is expanded to form a tubular channel. From the liquid inlets 13a and 13b, pressure is applied while injecting test liquids as separate raw materials while covering with tightly packed packing so that the pressure does not leak. Then, both test liquids flow through the streaks 17 and are mixed and heated by the heater 19 so that the raw materials react with each other. Pressure is applied while injecting a reaction terminator such as a buffer in the same manner from the liquid inlet 13c. Then, the reaction product reaches the liquid discharge port 14a, is detected by the electrode 20, and is discharged therefrom. On the other hand, by-products and waste liquid reach the liquid discharge port 14b and are discharged therefrom.

1 and 2 show examples in which the metal layers 18a and 18a 'are attached to the streaks 17 of the biochip substrate 1, the biochip substrate 1 is replaced with the metal layers as shown in FIG. Alternatively, the masking resin layers 18b and 18b ′ may be provided. The biochip substrate 1 having such a configuration is manufactured as follows. An uncured resist film is applied to one side of a silicone resin molded sheet 12 containing a hydrosilyl group-containing compound and a vinyl group-containing compound as shown in FIG. 33. Covering with a mask concealing other than the position corresponding to the streak 17 and irradiating with an exposure line, photo-curing the resist film 33, and then washing away the portion that has not been cured because it was concealed, Masking resin layers 18b and 18b ′, which are cured resist layers, are obtained as shown in FIG. A heater 19 and an electrode 20 as a biosensor are attached as necessary. Liquid injection ports 13a, 13b and 13c and liquid discharge ports 14a and 14b (see FIG. 1) are opened in another silicone resin- molded sheet 11 containing a hydrosilyl group-containing compound and a vinyl group-containing compound. As shown in FIG. 2D, when the overlapping surfaces of the resin molded sheets 11 and 12 are subjected to corona discharge treatment, overlapped, and pressure-bonded under heating, the bio-bonded by covalent bond as in FIG. The chip substrate 1 is obtained.

1-3, the metal layers 18a and 18a ′ and the masking resin layers 18b and 18b ′ have been provided on the lower silicone resin molded sheet 12, but the upper silicone resin molded sheet 11 is provided. It may be provided on both the upper and lower silicone resin molded sheets 11 and 12. If necessary, the metal layer or the resin layer may be removed by pickling or solvent cleaning.

Another embodiment of the biochip substrate 1 is shown in FIG. The biochip substrate 1 is obtained by sandwiching a silicone resin-forming spacer 21 of the same type between silicone resin- molded sheets 11 and 12 containing a hydrosilyl group-containing compound and a vinyl group-containing compound. The upper resin molded sheet 11 is provided with liquid injection ports 13a, 13b, 13c and liquid discharge ports 14a, 14b, and the resin molded spacer 21 is provided with a streak 17 serving as a flow path for the test liquid by laser cutting. It has been. The resin- molded sheets 11 and 12 and the resin-forming spacer 21 are superposed and pressure-bonded under heat to form the biochip substrate 1 bonded by covalent bonding in the same manner as in FIGS. Yes.

  1-4, the example of the biochip board | substrate 1 using the same kind of resin molding sheet | seat 11 * 12 was shown, but the different kind of resin molding sheet or the different kind of spacer pinched | interposed into the same kind of resin molding sheet was used. It may be a thing (not shown). More specifically, one of the resin molded sheets has a hydrosilyl-containing silyl group, a vinyl-containing silyl group, an alkoxysilyl-containing silyl group, and a hydrolyzable group-containing silyl group as a hydroxyl group dehydrogenation group on the surface thereof. At least one active silyl group selected from the group consisting of silyl ether bond, and the other is hydrosilyl, vinylsilyl, hydroxysilyl, alkyloxysilyl, alkenyloxysilyl, acyloxysilyl, imino which reacts with the active silyl group A compound containing at least one kind of reactive group selected from oxysilyl and alkylaminosilyl, wherein both resin-molded sheets are formed of any one of the silicon-carbon and silicon-oxygen formed by the reaction. It may be a structure bonded through a bond.

  Such a biochip substrate is manufactured as follows, for example.

  Corona discharge treatment is performed on the surface of the base material that becomes the lower resin molded sheet made of a polymer resin such as a silicone resin, to form a silicone rubber cross-linking reactive base material surface exposed and activated by hydroxyl groups.

On the other hand, a functional alkoxysilyl compound such as HSi (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ CH ₂ Si (OC ₂ H ₅ ) ₃ that reacts with the hydroxyl group to form a silyl ether and a solvent The solution is applied to the base material surface of the resin-molded sheet in which hydroxyl groups are generated, dried, and then heated. The triethoxysilyl group of this functional alkoxysilyl compound reacts with the hydroxyl group on the surface of the base material of the resin molded sheet to become the active silyl group, which forms a chemically strong silyl ether bond together with the dehydrogenated residue of the hydroxyl group. Form. By this alkoxysilyl compound, a lower resin-molded sheet coated with a monomolecular film of silyl ether in which a silyl group such as a hydrosilyl-containing silyl group is ether-bonded is obtained. Such a monomolecular film consists of molecular chains that do not exceed the basic unit of the silyl compound used first.

  After placing the streaks and, if necessary, heaters and electrodes on the resin molded sheet, a composition containing a silicone rubber component is applied or another resin molded sheet formed from the composition is brought into contact with the resin molded sheet. When cured, an upper resin molded sheet, which is silicone rubber in which silicone rubber is crosslinked and bonded to the monomolecular film of silyl ether on the resin molded sheet, is formed on the surface. The silyl ether molecule on the surface of the lower resin molding sheet and the silicone rubber of the upper resin molding sheet are chemically crosslinked by the chemical reaction between the silyl ether molecule and the silicone rubber component, or chemically crosslinked. They are attracted to each other and interact to form an electrochemical cross-link, resulting in a strong bond. Therefore, both the upper and lower resin molded sheets are bonded while having strong adhesive strength at portions other than the streak, and are difficult to peel off.

  The upper and lower resin molded sheets may be produced by reversing them. An example of a lower resin-molded sheet having a silyl ether bond with a silyl group such as a hydrosilyl-containing silyl group has been shown, but a vinyl-containing silyl group exemplified by a vinylsilyl-containing silyl group, an alkoxysilyl terminal-containing silyl group, a hydrolyzable group It may be a silyl ether bond with an active silyl group such as a contained silyl group. The liquid injection port and the liquid discharge port are formed in the resin molded sheet, and may be formed on one resin molded sheet, or may be provided at the end of the overlapping surface of the stacked resin molded sheets. Alternatively, it may be formed by puncture at the time of injection and discharge of the test liquid.

  Such active silyl groups are all formed by the reaction of the alkoxysilyl group of the functional alkoxysilyl compound with the hydroxyl group on the surface of the base material of the resin molded sheet.

The silyl ether bond formed on the substrate (Sub .: Substrate) of the resin molded sheet with such a hydrosilyl-containing silyl group has the following chemical formula [1]
Sub.-O-SiR ²⁰ ... [1]
It is represented by Hydrosilyl-containing silyl group —SiR ²⁰ has R ²⁰ having —SiH (R ¹ ) ₂ or —SiH ₂ (R ² ) (R ¹ and R ² are alkyl groups having 1 to 4 carbon atoms) at the end, Alternatively, it has a —SiH— group in the middle of its main chain and may be a polysiloxy group.

More specifically, -SiR ²⁰ is
-(C ₂ H ₅ O) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ H,
-(CH ₃ O) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ H,
-(iC ₃ H ₇ O) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) H ₂ ,
-(nC ₃ H ₇ O) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ Si (CH ₃ ) ₂ H,
-(nC ₄ H ₉ O) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
-(tC ₄ H ₉ O) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
-(C ₂ H ₅ O) CH ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
-(CH ₃ O) CH ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ Si (CH ₃ ) ₂ H,
-(CH ₃ ) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
-(C ₂ H ₅ O) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
-(nC ₃ H ₇ ) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
-(iC ₃ H ₇ O) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
-(nC ₄ H ₉ ) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
-(tC ₄ H ₉ O) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
-[(-O) (-) SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H] _k1
-[(-O) (-) SiCH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H] _k2 ,
-[(-O) (-) SiCH ₂ CH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H] _k3 ,
-[(-O) (-) SiCH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H] _k4 ,
-[(-O) (-) SiCH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H] _k5 ,
-(CH ₃ O) ₂ SiCH ₂ C ₆ H ₄ CH ₂ CH ₂ Si (CH ₃ ) ₂ C ₆ H ₄ Si (CH ₃ ) ₂ H,
-(CH ₃ O) CH ₃ SiCH ₂ C ₆ H ₄ CH ₂ CH ₂ Si (CH ₃ ) ₂ C ₆ H ₄ Si (CH ₃ ) ₂ H,
-(CH ₃ ) ₂ SiCH ₂ C ₆ H ₄ CH ₂ CH ₂ Si (CH ₃ ) ₂ C ₆ H ₄ Si (CH ₃ ) ₂ H,
-[(-O) (-) SiCH ₂ C ₆ H ₄ CH ₂ CH ₂ Si (CH ₃ ) ₂ C ₆ H ₄ Si (CH ₃ ) ₂ H] _k6 ,
-[(-O) (-) SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ C ₆ H ₄ OC ₆ H ₄ Si (CH ₃ ) ₂ H] _k7 ,
-[(-O) (-) SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ C ₂ H ₄ Si (CH ₃ ) ₂ H] _k8 ,
-(C ₂ H ₅ O) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ O [Si (CH ₃ ) ₂ O] _m1 Si (CH ₃ ) ₂ H,
-(C ₂ H ₅ ) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ O [Si (CH ₃ ) ₂ O] _m2 Si (C ₂ H ₅ ) ₂ H,
-(C ₂ H ₅ O) CH ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ O [Si (CH ₃ ) ₂ O] _m3 Si (CH ₃ ) ₂ H,
(CH ₃ ) ₃ SiO [-Si (CH ₃ )] O [SiH (CH ₃ ) O] _m4 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(-Si (CH ₃ ) CH ₂ CH ₂ CH ₂ ) (-) SiCH ₃ ] O [SiH (CH ₃ ) O] _m5 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(-Si (OCH ₃ ) CH ₂ CH ₂ CH ₂ ) (-) SiCH ₃ ] O [SiH (CH ₃ ) O] _m6 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(-Si (CH ₃ ) CH ₂ CH ₂ CH ₂ ) (-) SiCH ₃ ] O [SiH (CH ₃ ) O] _m7 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(-Si (O-) CH ₂ CH ₂ CH ₂ ) SiCH ₃ ] O [SiH (CH ₃ ) O] _m8 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(-Si (CH ₃ ) O [SiH (CH ₃ ) O] _m9 [Si (CH ₃ ) ₂ O] _n1 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(-Si (CH ₃ ) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) (-) Si (CH ₃ ) O] [SiH (CH ₃ ) O] _m10 [Si (CH ₃ ) ₂ O] _n2 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(-Si (OCH ₃ ) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) (-) Si (CH ₃ ) O] [SiH (CH ₃ ) O] _m11 [Si (CH ₃ ) ₂ O] _n3 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [( _-Si (O-) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [SiH (CH ₃ ) O] _m12 [Si (CH ₃ ) ₂ O] _n4 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(-Si (OCH ₃ ) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) (-) Si (CH ₃ ) O] [SiH (CH ₃ ) O] _m13 [Si (CH ₃ ) ₂ O] _n5 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [-Si (C ₂ H ₅ ) O] [SiH (C ₂ H ₅ ) O] _m14 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(-Si (O-) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (C ₂ H ₅ )] O [SiH (C ₂ H ₅ ) O] _m15 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(-Si (CH ₃ ) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) (-) Si (C ₂ H ₅ )] O [SiH (C ₂ H ₅ ) O] _m16 Si (CH ₃ ) ₃ ,
-Si (CH ₃ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ (CH ₃ ) ₂ SiO [HSi (CH ₃ ) ₂ OSiC ₆ H ₅ O] _m17 Si (CH ₃ ) ₂ H,
-Si (OCH ₃ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ (CH ₃ ) ₂ SiO [HSi (CH ₃ ) ₂ OSiC ₆ H ₅ O] _m18 Si (CH ₃ ) ₂ H,
-Si (O-) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ (CH ₃ ) ₂ SiO [HSi (CH ₃ ) ₂ OSiC ₆ H ₅ O] _m19 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (CH ₃ ) ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m20 Si (CH ₃ ) ₂ H,
_{H (CH 3) 2 SiO [} (- Si (CH 3) 2 CH 2 CH 2 CH 2 CH 2) Si (CH 3) O] [HSiCH 3 O] m21 Si (CH 3) 2 H,
H (CH ₃ ) ₂ SiO [(-Si (CH ₃ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m22 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (CH ₃ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m23 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (CH ₃ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m24 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (OCH ₃ ) ₂ CH ₂ CH ₂ C ₆ H ₄ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m25 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (OCH ₃ ) ₂ CH ₂ C ₆ H ₄ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m26 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (OCH ₃ ) ₂ CH ₂ C ₆ H ₄ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m27 Si (CH ₃ ) ₂ H,
_{H (CH 3) 2 SiO [} (- Si (OCH 3) 2 C 6 H 4 CH 2 CH 2) Si (CH 3) O] [HSiCH 3 O] m28 Si (CH 3) 2 H,
_{H (CH 3) 2 SiO [} (- Si (OCH 3) 2 CH 2 CH 2 CH 2) Si (CH 3) O] [HSiCH 3 O] m29 Si (CH 3) 2 H,
H (CH ₃ ) ₂ SiO [(-Si (OCH ₃ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m30 Si (CH ₃ ) ₂ H,
_{H (CH 3) 2 SiO [} (- Si (OCH 3) 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2) Si (CH 3) O] [HSiCH 3 O] m31 Si (CH 3) 2 H,
_{H (CH 3) 2 SiO [} (- Si (OCH 3) 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2) Si (CH 3) O] [HSiCH 3 O] m32 Si (CH 3 ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (OCH ₃ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m33 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (OCH ₃ ) ₂ CH ₂ CH ₂ C ₆ H ₄ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m34 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (OCH ₃ ) ₂ CH ₂ C ₆ H ₄ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m35 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (OCH ₃ ) ₂ CH ₂ C ₆ H ₄ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m36 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (OCH ₃ ) ₂ C ₆ H ₄ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m37 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (O-) CH ₂ CH ₂ C ₆ H ₄ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m38 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (O-) CH ₂ C ₆ H ₄ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m39 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (O-) CH ₂ C ₆ H ₄ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m40 Si (CH ₃ ) ₂ H,
_{H (CH 3) 2 SiO [} (- Si (O-) C 6 H 4 CH 2 CH 2) Si (CH 3) O] [HSiCH 3 O] m41 Si (CH 3) 2 H,
H (CH ₃ ) ₂ SiO [(-Si (O-) CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m42 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (O-) CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m43 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (O-) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m44 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (O-) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m45 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (O-) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m46 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-Si (O-) CH ₂ CH ₂ C ₆ H ₄ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m47 Si (CH ₃ ) ₂ H,
_{H (CH 3) 2 SiO [} (- Si (O-) CH 2 C 6 H 4 CH 2 CH 2 CH 2) Si (CH 3) O] [HSiCH 3 O] m48 Si (CH 3) 2 H,
H (CH ₃ ) ₂ SiO [(-Si (O-) CH ₂ C ₆ H ₄ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _m49 Si (CH ₃ ) ₂ H,
_{H (CH 3) 2 SiO [} (- Si (O-) C 6 H 4 CH 2 CH 2) Si (CH 3) O] [HSiCH 3 O] m50 Si (CH 3) 2 H,
H (CH ₃ ) ₂ SiO [(-) Si (CH ₃ ) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSiC ₆ H ₅ O] _m51 [HSi (CH ₃ ) ₂ OSiC ₆ H ₅ O] _n6 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-) Si (OCH ₃ ) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSiC ₆ H ₅ O] _m52 [HSi (CH ₃ ) ₂ OSiC ₆ H ₅ O] _n7 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-) Si (O-) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSiC ₆ H ₅ O] _m53 [HSi (CH ₃ ) ₂ OSiC ₆ H ₅ O] _n8 Si (CH ₃ ) ₂ H,
-(CH ₃ ) ₂ SiO [SiH (CH ₃ ) O] _m54 [SiCH ₃ (C ₆ H ₅ ) O] _n9 Si (CH ₃ ) ₂ H,
-Si (OC ₂ H ₅ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ (CH ₃ ) ₂ SiO [SiH (CH ₃ ) O] _m55 [SiCH ₃ (C ₆ H ₅ ) O] _n10 Si ( CH ₃ ) ₂ H,
-Si (O-) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ (CH ₃ ) ₂ SiO [SiH (CH ₃ ) O] _m56 [SiCH ₃ (C ₆ H ₅ ) O] _n11 Si (CH ₃ ) ₂ H,
-Si (CH ₃ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ (CH ₃ ) ₂ SiO [SiH (CH ₃ ) O] _m57 [SiCH ₃ (C ₆ H ₅ ) O] _n12 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO (-) Si (CH ₃ ) O [SiH (CH ₃ ) O] _m58 [SiCH ₃ (C ₆ H ₅ ) O] _n13 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-) Si (OC ₂ H ₅ ) ₂ CH ₂ CH ₂ CH ₂ Si (CH ₃ )] O [SiH (CH ₃ ) O] _m59 [SiCH ₃ (C ₆ H ₅ ) O] _n14 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-) Si (O-) CH ₂ CH ₂ CH ₂ Si (CH ₃ )] O [SiH (CH ₃ ) O] _m60 [SiCH ₃ (C ₆ H ₅ ) O] _n15 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(-) Si (CH ₃ ) ₂ CH ₂ CH ₂ CH ₂ Si (CH ₃ )] O [SiH (CH ₃ ) O] _m61 [SiCH ₃ (C ₆ H ₅ ) O] _n16 Si (CH ₃ ) ₂ H
Is mentioned. In these groups, k1 to k8, m1 to m61, and n1 to n16 are numbers from 1 to 100. One group preferably has 1 to 99 hydrosilyl groups (SiH groups).

The functional alkoxysilyl compound that forms such a hydrosilyl-containing silyl group includes the hydrosilyl-containing compound described above, for example,
(CH ₃ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
(CH ₃ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (OCH ₃ ) ₂ OSi (OCH ₃ ) ₃ ,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (OCH ₃ ) ₂ OSi (OCH ₃ ) ₃ ,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ H,
(CH ₃ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ H,
(iC ₃ H ₇ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) H ₂ ,
(nC ₃ H ₇ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ Si (CH ₃ ) ₂ H,
(nC ₄ H ₉ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
(tC ₄ H ₉ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
(C ₂ H ₅ O) ₂ CH ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
(CH ₃ O) ₂ CH ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ Si (CH ₃ ) ₂ H,
CH ₃ O (CH ₃ ) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
(nC ₃ H ₇ ) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
(iC ₃ H ₇ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
(nC ₄ H ₉ ) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
(tC ₄ H ₉ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
(CH ₃ O) ₃ SiCH ₂ C ₆ H ₄ CH ₂ CH ₂ Si (CH ₃ ) ₂ C ₆ H ₄ Si (CH ₃ ) ₂ H,
(CH ₃ O) ₂ CH ₃ SiCH ₂ C ₆ H ₄ CH ₂ CH ₂ Si (CH ₃ ) ₂ C ₆ H ₄ Si (CH ₃ ) ₂ H,
CH ₃ O (CH ₃ ) ₂ SiCH ₂ C ₆ H ₄ CH ₂ CH ₂ Si (CH ₃ ) ₂ C ₆ H ₄ Si (CH ₃ ) ₂ H,
(C ₂ H ₅ O) ₃ SiCH ₂ C ₆ H ₄ CH ₂ CH ₂ Si (CH ₃ ) ₂ C ₆ H ₄ Si (CH ₃ ) ₂ H,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ C ₆ H ₄ OC ₆ H ₄ Si (CH ₃ ) ₂ H,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ C ₂ H ₄ Si (CH ₃ ) ₂ H,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ O [Si (CH ₃ ) ₂ O] _p1 Si (CH ₃ ) ₂ H,
C ₂ H ₅ O (CH ₃ ) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ O [Si (CH ₃ ) ₂ O] _p2 Si (C ₂ H ₅ ) ₂ H,
(C ₂ H ₅ O) ₂ CH ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ O [Si (CH ₃ ) ₂ O] _p3 Si (CH ₃ ) ₂ H,
(CH ₃ ) ₃ SiOSiH (CH ₃ ) O [SiH (CH ₃ ) O] _p4 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(C ₂ H ₅ OSi (CH ₃ ) CH ₂ CH ₂ CH ₂ ) SiCH ₃ ] O [SiH (CH ₃ ) O] _p5 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(C ₂ H ₅ OSiOCH ₃ CH ₂ CH ₂ CH ₂ ) SiCH ₃ ] O [SiH (CH ₃ ) O] _p6 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(C ₂ H ₅ OSi (CH ₃ ) CH ₂ CH ₂ CH ₂ ) SiCH ₃ ] O [SiH (CH ₃ ) O] _p7 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(Si (OC ₂ H ₅ ) ₂ CH ₂ CH ₂ CH ₂ ) SiCH ₃ ] O [SiH (CH ₃ ) O] _p8 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiOSi (OC ₂ H ₅ ) ₂ O [SiH (CH ₃ ) O] _p9 [Si (CH ₃ ) ₂ O] _q1 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(C ₂ H ₅ Osi (CH ₃ ) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [SiH (CH ₃ ) O] _p10 [Si (CH ₃ ) ₂ O] _q2 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(Si (OCH ₃ ) ₃ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [SiH (CH ₃ ) O] _p11 [Si (CH ₃ ) ₂ O] _q3 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiOSi (OC ₂ H ₅ ) ₂ O [SiH (C ₂ H ₅ ) O] _p12 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(Si (OC ₂ H ₅ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (C ₂ H ₅ )] O [SiH (C ₂ H ₅ ) O] _p13 Si (CH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO [(C ₂ H ₅ OSi (CH ₃ ) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (C ₂ H ₅ )] O [SiH (C ₂ H ₅ ) O] _p14 Si (CH ₃ ) ₃ ,
C ₂ H ₅ OSi (CH ₃ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ (CH ₃ ) ₂ SiO [HSi (CH ₃ ) ₂ OSiC ₆ H ₅ O] _p15 Si (CH ₃ ) ₂ H,
Si (OCH ₃ ) ₃ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ (CH ₃ ) ₂ SiO [HSi (CH ₃ ) ₂ OSiC ₆ H ₅ O] _p16 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(C ₂ H ₅ OSi (CH ₃ ) ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p17 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(C ₂ H ₅ OSi (CH ₃ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p18 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(C ₂ H ₅ OSi (CH ₃ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p19 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(C ₂ H ₅ OSi (CH ₃ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p20 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(C ₂ H ₅ OSi (CH ₃ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p21 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(Si (OCH ₃ ) ₃ CH ₂ CH ₂ C ₆ H ₄ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p22 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(Si (OCH ₃ ) ₃ CH ₂ C ₆ H ₄ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p23 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(Si (OCH ₃ ) ₃ CH ₂ C ₆ H ₄ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p24 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(Si (OCH ₃ ) ₃ C ₆ H ₄ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p25 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(Si (OCH ₃ ) ₃ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p26 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(Si (OCH ₃ ) ₃ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p27 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(Si (OCH ₃ ) ₃ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p28 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(Si (OCH ₃ ) ₃ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p29 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(Si (OCH ₃ ) ₃ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p30 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(Si (OCH ₃ ) ₃ CH ₂ CH ₂ C ₆ H ₄ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p31 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(Si (OCH ₃ ) ₃ CH ₂ C ₆ H ₄ CH ₂ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p32 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(Si (OCH ₃ ) ₃ CH ₂ C ₆ H ₄ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p33 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(Si (OCH ₃ ) ₃ C ₆ H ₄ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p34 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(Si (OCH ₃ ) ₃ CH ₂ CH ₂ C ₆ H ₄ CH ₂ CH ₂ ) Si (CH ₃ ) O] [HSiCH ₃ O] _p35 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [(CH ₃ O) Si (CH ₃ ) CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSiC ₆ H ₅ O] _p36 [HSi (CH ₃ ) ₂ OSiC ₆ H ₅ O] _q4 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [Si (OCH ₃ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSiC ₆ H ₅ O] _p37 [HSi (CH ₃ ) ₂ OSiC ₆ H ₅ O] _q5 Si (CH ₃ ) ₂ H,
C ₂ H ₅ O (CH ₃ ) ₂ SiO [SiH (CH ₃ ) O] _p38 [SiCH ₃ (C ₆ H ₅ ) O] _q6 Si (CH ₃ ) ₂ H,
Si (OC ₂ H ₅ ) ₃ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ (CH ₃ ) ₂ SiO [SiH (CH ₃ ) O] _p39 [SiCH ₃ (C ₆ H ₅ ) O] _q7 Si (CH ₃ ) ₂ H,
C ₂ H ₅ OSi (CH ₃ ) ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ (CH ₃ ) ₂ SiO [SiH (CH ₃ ) O] _p40 [SiCH ₃ (C ₆ H ₅ ) O] _q8 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO (C ₂ H ₅ O) Si (CH ₃ ) O [SiH (CH ₃ ) O] _p41 [SiCH ₃ (C ₆ H ₅ ) O] _q9 Si (CH ₃ ) ₂ H,
H (CH ₃ ) ₂ SiO [Si (OC ₂ H ₅ ) ₃ CH ₂ CH ₂ CH ₂ Si (CH ₃ )] O [SiH (CH ₃ ) O] _p42 [SiCH ₃ (C ₆ H ₅ ) O] _q10 Si (CH ₃ ) ₂ H
Is mentioned. In these groups, p1 to p42 and q1 to q10 are numbers from 1 to 100. One molecule preferably has 1 to 99 hydrosilyl groups.

The silyl ether bond formed on the base (Sub.) Of the resin molded sheet with a vinylsilyl-containing silyl group is represented by the following chemical formula [2]:
Sub.-O-SiR ²¹ ... [2]
It is represented by In the vinylsilyl-containing silyl group —SiR ²¹ , R ²¹ has a —Si—R ³ group (R ³ is a vinyl-containing group), or a —Si (R ⁴ ) — group (R ⁴ ) in the middle of the main chain of the group. Has a vinyl-containing group).

-SiR ²¹ is more specifically
-(C ₂ H ₅ O) ₂ SiCH ₂ -CH = CH ₂ ,
-(C ₂ H ₅ O) ₂ SiCH ₂ CH ₂ -CH = CH ₂ ,
-(C ₂ H ₅ O) ₂ SiCH ₂ CH ₂ CH ₂ CH ₂ -CH = CH ₂ ,
-(C ₂ H ₅ O) ₂ SiCH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ -CH = CH ₂ ,
-C ₂ H ₅ OSi (CH = CH ₂ ) OSi (OC ₂ H ₅ ) -CH = CH ₂ ,
-(CH ₃ O) ₂ SiCH ₂ CH ₂ C ₆ H ₄ -CH = CH ₂ ,
-(CH ₃ O) Si (CH = CH ₂ ) O [SiOCH ₃ (CH = CH ₂ ) O] _r1 Si (OCH ₃ ) ₂ -CH = CH ₂ ,
-(C ₂ H ₅ O) Si (CH = CH ₂ ) O [SiOC ₂ H ₅ (CH = CH ₂ ) O] _r2 Si (OC ₂ H ₅ ) ₂ -CH = CH ₂ ,
-(C ₂ H ₅ O) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ [Si (CH ₃ ) ₂ O] _r3 -CH = CH ₂ ,
-(CH ₃ O) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ [Si (CH ₃ ) ₂ O] _r4 -CH = CH ₂ ,
-(CH ₃ ) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ [Si (CH ₃ ) ₂ O] _r5 -CH = CH ₂ ,
-(C ₂ H ₅ O) CH ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ [Si (CH ₃ ) ₂ O] _r6 -CH = CH ₂ ,
-(-O) SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ [Si (CH ₃ ) ₂ O] _r7 -CH = CH ₂ ,
-(C ₂ H ₅ O) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ (Si (CH ₃ ) ₃ O) Si (CH ₃ ) O [SiCH ₃ ( -) O] _s1 Si (CH ₃ ) ₃ ,
-(C ₂ H ₅ O) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ (Si (CH ₃ ) ₃ O) Si (CH ₃ ) O [SiCH ₃ ( -) O] _s2 [Si (CH ₃ ) ₂ O] _r8 Si (CH ₃ ) ₃ ,
-C ₂ H ₅ OSi (CH = CH ₂ ) O [SiCH ₃ (-) O] _s3 Si (OC ₂ H ₅ ) ₂ CH = CH ₂ ,
-C ₂ H ₅ OSi (CH = CH ₂ ) O [SiCH ₃ (-) O] _s4 Si (CH = CH ₂ ) OC ₂ H ₅ -CH = CH ₂ ,
-(-O) Si (CH = CH ₂ ) O [SiCH ₃ (-) O] _s5 Si (OC ₂ H ₅ ) ₂ CH = CH ₂ ,
-(-O) Si (CH = CH ₂ ) O [SiCH ₃ (-) O] _s6 Si (CH = CH ₂ ) (O-)-CH = CH ₂ ,
-(-O) Si (CH = CH ₂ ) O [SiCH ₃ (-) (O-)] _s7 Si (CH = CH ₂ ) (O-)-CH = CH ₂ ,
-Si (CH = CH ₂ ) O [Si (-) OC ₂ H ₅ ] _s8 [Si (O-) CH = CH ₂ ] ₂ ,
-Si (CH = CH ₂ ) O [Si (O-)] _r9 [Si (-) OC ₂ H ₅ ] _s9 [Si (OC ₂ H ₅ ) ₂ CH = CH ₂ ] ₂ ,
-Si (CH = CH ₂ ) O [Si (-) (O-)] _s10 [Si (O-) CH = CH ₂ ] ₂
Is mentioned. In these groups, r1 to r9 and s1 to s10 are numbers from 1 to 30. One group preferably has 1 to 30 vinyl groups (CH═CH ₂ groups).

The functional alkoxysilyl compound that forms a vinylsilyl-containing silyl group is the vinylsilyl-containing compound, for example,
(C ₂ H ₅ O) ₃ SiCH ₂ CH = CH ₂ ,
(CH ₃ O) ₃ SiCH ₂ CH ₂ CH = CH ₂ ,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH = CH ₂ ,
(CH ₃ O) ₃ SiCH ₂ CH ₂ CH ₂ CH ₂ CH = CH ₂ ,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH ₂ CH ₂ CH = CH ₂ ,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH = CH ₂ ,
(CH ₃ O) ₃ SiCH ₂ (CH ₂ ) ₇ CH = CH ₂ ,
(C ₂ H ₅ O) ₂ Si (CH = CH ₂ ) OSi (OC ₂ H ₅ ) CH = CH ₂ ,
(CH ₃ O) ₃ SiCH ₂ CH ₂ C ₆ H ₄ CH = CH ₂ ,
(CH ₃ O) ₂ Si (CH = CH ₂ ) O [SiOCH ₃ (CH = CH ₂ ) O] _t1 Si (OCH ₃ ) ₂ CH = CH ₂ ,
(C ₂ H ₅ O) ₂ Si (CH = CH ₂ ) O [SiOC ₂ H ₅ (CH = CH ₂ ) O] _t2 Si (OC ₂ H ₅ ) ₃ ,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ [Si (CH ₃ ) ₂ O] _t3 CH = CH ₂ ,
(CH ₃ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ [Si (CH ₃ ) ₂ O] _t4 CH = CH ₂ ,
CH ₃ O (CH ₃ ) ₂ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ [Si (CH ₃ ) ₂ O] _t5 CH = CH ₂ ,
(C ₂ H ₅ O) ₂ CH ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ [Si (CH ₃ ) ₂ O] _t6 CH = CH,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ [Si (CH ₃ ) ₂ O] _t7 CH = CH,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ (Si (CH ₃ ) ₃ O) Si (CH ₃ ) O [SiCH ₃ (- ) O] _u1 Si (CH ₃ ) ₃ CH = CH ₂ ,
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ CH ₂ Si (CH ₃ ) ₂ OSi (CH ₃ ) ₂ CH ₂ CH ₂ (Si (CH ₃ ) ₃ O) Si (CH ₃ ) O [SiCH ₃ (- ) O] _u2 [Si (CH ₃ ) ₂ O] _t8 Si (CH ₃ ) ₃ CH = CH ₂ ,
(C ₂ H ₅ O) ₂ Si (CH = CH ₂ ) O [SiCH ₃ (OC ₂ H ₅ ) O] _u3 Si (OC ₂ H ₅ ) ₂ CH = CH ₂ ,
(C ₂ H ₅ O) ₂ Si (CH = CH ₂ ) O [Si (OC ₂ H ₅ ) ₂ O] _u4 Si (OC ₂ H ₅ ) ₂ CH = CH ₂ ,
(C ₂ H ₅ O) ₂ Si (CH = CH ₂ ) O [Si (OC ₂ H ₅ ) ₂ O] _u5 Si (OC ₂ H ₅ ) ₂ CH = CH ₂
Is mentioned. In these groups, t1 to t8 and u1 to u5 are numbers from 1 to 30. One molecule preferably has 1 to 30 vinyl groups.

In addition, the silyl ether bond formed on the base (Sub.) Of the resin molded sheet with an alkoxysilyl terminal-containing silyl group is represented by the following chemical formula [3]:
Sub.-O-SiR ²² ... [3]
It is represented by In the alkoxysilyl terminal-containing silyl group —SiR ²² , R ²² is —Si (OR ⁵ ) ₂ R ⁶ group (R ⁵ and R ⁶ are alkyl groups having 1 to 4 carbon atoms), or —Si (OR ⁷ ) ₃ group. (R ⁷ is an alkyl group having 1 to 4 carbon atoms). -SiR ²² is more specifically
-(C ₂ H ₅ O) ₂ SiCH ₂ CH ₂ Si (OC ₂ H ₅ ) ₃ ,
-(C ₂ H ₅ O) CH ₃ SiCH ₂ CH ₂ Si (OC ₂ H ₅ ) ₃ ,
-(C ₂ H ₅ O) ₂ SiCH = CHSi (OC ₂ H ₅ ) _3,
-(CH ₃ O) ₂ SiCH ₂ CH ₂ Si (OCH ₃ ) _3,
-(CH ₃ O) ₂ SiCH ₂ CH ₂ C ₆ H ₄ CH ₂ CH ₂ Si (OCH ₃ ) ₃ ,
-(CH ₃ O) ₂ Si [CH ₂ CH ₂ ] ₃ Si (OCH ₃ ) ₃ ,
-(CH ₃ O) ₂ Si [CH ₂ CH ₂ ] ₄ Si (OCH ₃ ) _3,
-(CH ₃ O) CH ₃ SiCH ₂ CH ₂ Si (OCH ₃ ) ₂ CH ₃ ,
-(C ₂ H ₅ O) CH ₃ SiOSi (OC ₂ H ₅ ) ₂ CH ₃ ,
-(C ₂ H ₅ O) Si (OC ₂ H ₅ ) ₂
Is mentioned.

Examples of functional alkoxysilyl compounds that form alkoxysilyl terminal-containing silyl groups include:
(C ₂ H ₅ O) ₃ SiCH ₂ CH ₂ Si (OC ₂ H ₅ ) ₃ ,
(C ₂ H ₅ O) ₂ CH ₃ SiCH ₂ CH ₂ Si (OC ₂ H ₅ ) ₃ ,
(C ₂ H ₅ O) ₃ SiCH = CHSi (OC ₂ H ₅ ) ₃ ,
(CH ₃ O) ₃ SiCH ₂ CH ₂ Si (OCH ₃ ) ₃ (CH ₃ O) ₃ SiCH ₂ CH ₂ C ₆ H ₄ CH ₂ CH ₂ Si (OCH ₃ ) ₃ ,
(CH ₃ O) ₃ Si [CH ₂ CH ₂ ] ₃ Si (OCH ₃ ) ₃ ,
(CH ₃ O) ₂ Si [CH ₂ CH ₂ ] ₄ Si (OCH ₃ ) ₃ ,
(C ₂ H ₅ O) ₂ Si (OC ₂ H ₅ ) ₂ ,
(CH ₃ O) ₂ CH ₃ SiCH ₂ CH ₂ Si (OCH ₃ ) ₂ CH ₃ ,
(C ₂ H ₅ O) ₂ CH ₃ SiOSi (OC ₂ H ₅ ) ₂ CH ₃ ,
(CH ₃ O) ₃ SiO [Si (OCH ₃ ) ₂ O] _v1 Si (OCH ₃ ) ₃ ,
(C ₂ H ₅ O) ₃ SiO [Si (OC ₂ H ₅ ) ₂ O] _v2 Si (OC ₂ H ₅ ) ₃ ,
(C ₃ H ₇ O) ₃ SiO [Si (OC ₃ H ₇ ) ₂ O] _v3 Si (OC ₃ H ₇ ) ₃
Is mentioned. In these groups, v1 to v3 are numbers from 0 to 30.

Further, the silyl ether bond formed on the substrate (Sub.) Of the resin molded sheet with the hydrolyzable group-containing silyl group is represented by the following chemical formula [4].
Sub.-O-Si (R ⁸ ) _a (R ⁹ ) _3-a ... [4]
(R ⁸ is a hydrogen atom; a halogen atom; an alkyl group having 1 to 12 carbon atoms, an alkenyl group, an alkyloxy group, a fluorine-substituted alkyl group; an aralkyl group; an aryl group, and R ⁹ is an alkyl group having 1 to 12 carbon atoms. An acyloxy group, an alkenyloxy group, an alkaneiminooxy group, an alkyloxy group, an alkylamino group, a dialkylamino group; a nitrogen-containing heterocyclic group, and an arylamino group, where a is a number from 0 to 3. More specifically, in the hydrolyzable group-containing silyl group -Si (R ⁸ ) _a (R ⁹ ) _3-a , R ⁸ is H-, F-, CH _3- , C ₂ H _5- , CH _{2 = CH-, nC 3 H 7} -, iC 3 H 7 -, CH 2 = CHCH 2 -, C 4 H 9 -, C 6 H 13 -, C 8 H 17 -, C 6 H 5 -, CH 3 _{C 6 H 4 -, C 6} H 5 CH 2 -, CF 3 CF 2 CH 2 CH 2 -, CF 3 CF 2 CF 2 CH 2 CH 2 -, CF 3 CF 2 CF 2 CF 2 CF 2 CF 2 CF 2 CH ₂ CH _2- , CH ₃ O-, C ₂ H ₅ O-, and R ⁹ is CH ₃ COO-, CH ₂ = C (CH ₃ ) O-, C ₂ H ₅ (CH ₃ ) C = NO-, CH ₃ O-, (CH ₃ ) ₂ N-, (C ₂ H ₅ ) ₂ N-, (iC ₃ H ₇ ) ₂ N-, O (CH ₂ CH ₂ ) ₂ N-, (CH ₃ ) ₃ CNH-, C ₆ H ₁₀ NH-, C ₆ H ₅ NH-.

As an example of a functional alkoxysilyl compound that forms a hydrolyzable group-containing silyl group,
CH ₃ Si (OCOCH ₃ ) ₃ , (CH ₃ ) ₂ Si (OCOCH ₃ ) ₂ , nC ₃ H ₇ Si (OCOCH ₃ ) ₃ , CH ₂ = CHCH ₂ Si (OCOCH ₃ ) ₃ , C ₆ H ₅ Si ( OCOCH ₃ ) ₃ , CF ₃ CF ₂ CH ₂ CH ₂ Si (OCOCH ₃ ) ₃ , CH ₂ = CHCH ₂ Si (OCOCH ₃ ) ₃ , CH ₃ OSi (OCOCH ₃ ) ₃ , C ₂ H ₅ OSi (OCOCH ₃ ) ₃ , CH ₃ Si (OCOC ₃ H ₇ ) ₃ , CH ₃ Si [OC (CH ₃ ) = CH ₂ ] ₃ , (CH ₃ ) ₂ Si [OC (CH ₃ ) = CH ₂ ] ₃ , nC ₃ H ₇ Si [OC (CH ₃ ) = CH ₂ ] ₃ , CH ₂ = CHCH ₂ Si [OC (CH ₃ ) = CH ₂ ] ₃ , C ₆ H ₅ Si [OC (CH ₃ ) = CH ₂ ] ₃ , CF ₃ CF ₂ CH ₂ CH ₂ Si [OC (CH ₃ ) = CH ₂ ] ₃ , CH ₂ = CHCH ₂ Si [OC (CH ₃ ) = CH ₂ ] ₃ , CH ₃ OSi [OC (CH ₃ ) = CH ₂ ] ₃ , C ₂ H ₅ OSi [OC (CH ₃ ) = CH ₂ ] ₃ , CH ₃ Si [ON = C (CH ₃ ) C ₂ H ₅ ] ₃ , (CH ₃ ) ₂ Si [ON = C (CH ₃ ) C ₂ H ₅ ] ₂ , nC ₃ H ₇ Si [ON = C (CH ₃ ) C ₂ H ₅ ] ₃ , CH ₂ = CHCH ₂ Si [ON = C (CH ₃ ) C ₂ H ₅ ] ₃ , C ₆ H ₅ Si [ON = C (CH ₃ ) C ₂ H ₅ ] ₃ , CF ₃ CF ₂ CH ₂ CH ₂ Si [ON = C (CH ₃ ) C ₂ H ₅ ] ₃ , CH ₂ = CHCH ₂ Si [ ON = C (CH ₃ ) C ₂ H ₅ ] ₃ , CH ₃ OSi [ON = C (CH ₃ ) C ₂ H ₅ ] ₃ , C ₂ H ₅ OSi [ON = C (CH ₃ ) C ₂ H ₅ ] ] ₃ , CH ₃ Si [ON = C (CH ₃ ) C ₂ H ₅ ] ₃ , CH ₃ Si [ N (CH ₃ )] ₃ , (CH ₃ ) ₂ Si [N (CH ₃ )] ₂ , nC ₃ H ₇ Si [N (CH ₃ )] ₃ , CH ₂ = CHCH ₂ Si [N (CH ₃ )] ₃ , C ₆ H ₅ Si [N (CH ₃ )] ₃ , CF ₃ CF ₂ CH ₂ CH ₂ Si [N (CH ₃ )] ₃ , CH ₂ = CHCH ₂ Si [N (CH ₃ )] ₃ , CH ₃ OSi [N (CH ₃ )] ₃ , C ₂ H ₅ OSi [N (CH ₃ )] ₃ , and CH ₃ Si [N (CH ₃ )] ₃ are examples of hydrolyzable organosilanes.

  These functional alkoxysilyl compounds include water, methanol, ethanol, isopropanol, ethylene glycol and other alcohols; acetone, methyl ethyl ketone and other ketones; ethyl acetate and other esters; methylene chloride and other halides, butane, hexane, etc. These olefins are used by dissolving in ethers such as tetrahydrofuran and butyl ether, aromatics such as benzene and toluene, amides such as dimethylformamide and methylpyrrolidone, and mixed solvents thereof.

  The amount of the functional alkoxysilyl compound added is generally in the range of 0.001 to 5 g with respect to 100 g of the solvent. If it is 0.001 g or less, the adhesive effect is not sufficient, and if it is 5 g or more, a multilayer thin film is formed even if the conditions are controlled.

  Although the preferable example of the base material of the resin-made sheet | seat made from silicone was shown, silicone is preferably used by a silicone resin or silicone rubber. In addition, a base material made of a polymer resin may be used. These materials are preferably transparent materials, and are preferably those that do not inhibit the transmission of the fluorescence wavelength when the test solution is fluorescently emitted / stained using a biochip substrate.

  Examples of polymer resins include cellulose, hydroxyethyl cellulose, starch, cellulose derivatives such as cellulose diacetate, surface saponified vinyl acetate resin, low density polyethylene, high density polyethylene, i-polypropylene, petroleum resin, polystyrene, s-polystyrene, Chroman indene resin, terpene resin, styrene-divinylbenzene copolymer, acrylonitrile-butadiene-styrene resin (ABS resin), polyacrylate, polyacrylate, polyacrylonitrile, methyl methacrylate, ethyl methacrylate, poly Cyanoacrylate, polyvinyl acetate, polyvinyl alcohol, polyvinyl formal, polyvinyl acetal, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, vinyl chloride / ethylene copolymer, poly Vinylidene fluoride, vinylidene fluoride / ethylene copolymer, vinylidene fluoride / propylene copolymer, 1,4-transpolybutadiene, polyoxymethylene, polyethylene glycol, polypropylene glycol, phenol / formalin resin, cresol / formalin resin, Resorcin resin, melamine resin, xylene resin, toluene resin, glyphal resin, modified glyphal resin, polyethylene terephthalate, polybutene terephthalate, unsaturated polyester resin, allyl ester resin, polycarbonate, 6-nylon (Nylon is a registered trademark), 6 ' 6-nylon, 6'10-nylon, polyimide, polyamide, polybenzimidazole, polyamideimide, silicon resin, silicone rubber, silicone resin, furan resin, polyurethane resin, epoxy Resin, polyphenylene oxide, polydimethylphenylene oxide, polyxylene, polyphenylene sulfide (PPS), polysulfone (PSF), polyethersulfone (PES), polyetheretherketone (PEEK), polyimide (PPI, Kapton), liquid crystal resin , Kevlar fibers, blends of carbon fibers and these materials, polymer materials such as polytetrafluoroethylene (PTFE), or natural rubber, 1,4-cisbutadiene rubber, isoprene rubber, polychloroprene, styrene-butadiene copolymer Polymerized rubber, hydrogenated styrene / butadiene copolymer rubber, acrylonitrile / butadiene copolymer rubber, hydrogenated acrylonitrile / butadiene copolymer rubber, polybutene, polyisobutylene, ethylene / propylene rubber, ethylene / propylene / terpolymer, chlorine Polyethylene, chlorosulfonated polyethylene, alkylated chlorosulfonated polyethylene, chloroprene rubber, chlorinated acrylic rubber, brominated acrylic rubber, fluoro rubber, epichlorohydrin and its copolymer rubber, chlorinated ethylene propylene rubber, chlorinated butyl rubber, brominated butyl rubber Rubber materials such as A mixture thereof or a cross-linked product thereof may be used.

  The resin molded sheet to be superimposed can be appropriately selected from these materials, and two different types of resin molded sheets may be superimposed. Further, one of the resin molded sheets to be superposed is rubber elastic, and the other is a material having no rubber elasticity and high resinity, and these may be bonded.

  For example, when the resin molded sheet has rubber-like elasticity, the durometer A hardness is preferably in the range of 30 to 80. Moreover, you may use suitably combining the resin molding sheet | seat which has such rubber-like elasticity, and the sheet | seat shape | molded by normal resin which makes durometer D hardness 20-90.

  Although the example which gave the corona discharge to the resin molded sheet base material was shown, you may give an atmospheric pressure plasma process or ultraviolet irradiation.

  Corona discharge is performed according to the method described in “Corona Treatment”, Journal of the Adhesion Society of Japan, Vol. 36, No. 3, 126 (2000). Atmospheric pressure plasma treatment is performed using “plasma treatment”, Journal of the Adhesion Society of Japan, Vol. In accordance with 41, No. 1, 4 (2005), ultraviolet irradiation involves exposure to ultraviolet rays and treatment. By these treatments, as described in LJ Gerenser: J. Adhesion Sci. Technol. 7, 1019 (1997), a hydroxyl group, a carboxyl group, a carbonyl group, etc. are generated on the surface of the base material of the resin molded sheet. Or appear.

  The above polymer resins may or may not have hydroxyl groups from the beginning, but even if they do not have hydroxyl groups on the base material surface of the polymer resin-made resin sheet, corona discharge, atmospheric pressure plasma treatment or ultraviolet irradiation By performing the treatment, a hydroxyl group is efficiently generated there.

  These optimum processing conditions vary depending on the type and history of the material on the base material surface of the resin molded sheet, but it is important to continue the processing until a surface tension of 55 kJ / m or more is obtained on the surface. Thereby, sufficient adhesive strength is obtained.

  Specifically, the corona discharge treatment on the surface of the base material of the resin molded sheet is performed using, for example, a corona surface reformer (for example, Corona Master manufactured by Shinko Electric Measurement Co., Ltd.), for example, power supply: AC100V, output voltage: 0 -20 kV, oscillation frequency: 0 to 40 kHz, 0.1 second to 60 seconds, temperature 0 to 60 ° C.

  Moreover, the atmospheric pressure plasma treatment of the substrate surface of the resin molded sheet is performed using, for example, an atmospheric pressure plasma generator (for example, Matsushita Electric Works, Ltd .: trade name Aiplasuma), for example, a plasma treatment speed of 10 to 100 mm / s, Power source: 200 or 220V AC (30 A), compressed air: 0.5 MPa (1 NL / min), 10 kHz / 300 W to 5 GHz, power: 100 W to 400 W, irradiation time: 0.1 second to 60 seconds.

In addition, ultraviolet irradiation of the surface of the base material of the resin molded sheet is performed using an ultraviolet-light emitting diode (UV-LED) irradiation device (for example, UV-LED irradiation device manufactured by OMRON Corporation: trade name ZUV-C30H). For example, the conditions are as follows: wavelength: 200 to 400 nm, power supply: 100 V AC, light source peak illuminance: 400 to 3000 mW / cm ² , irradiation time: 1 to 60 seconds.

  After the pretreatment such as corona discharge, the substrate surface of the resin molded sheet may be brought into contact with a solution of a functional alkoxysilyl compound that is a molecular adhesive by dipping or spraying. There is no limitation on the dipping and spraying time, and it is important that the substrate surface of the resin molded sheet is uniformly moistened.

  The substrate of the resin-molded sheet with the functional alkoxysilyl compound is dried while being heated by placing it in an oven, blowing warm air with a dryer, or irradiating a high frequency. Heating and drying are performed at a temperature range of 50 ° C to 250 ° C for 1 to 60 minutes. When the temperature is 50 ° C. or lower, the reaction time between the hydroxyl group generated on the substrate surface of the resin molded sheet and the functional alkoxysilyl compound is too long, resulting in a decrease in productivity and an increase in cost. Further, at 250 ° C. or higher, the base material surface of the resin molded sheet is deformed or decomposed even if the heat drying time is short. Since heat transfer is insufficient in heat drying for 1 minute or less, the bonding between the hydroxyl group on the surface of the base material of the resin molded sheet and the functional alkoxysilyl compound becomes insufficient. Moreover, productivity will fall in 60 minutes or more.

  When the reaction between the hydroxyl group on the substrate surface of the resin-molded sheet and the functional alkoxysilyl compound is insufficient, the above immersion and drying may be repeated about 1 to 5 times. As a result, it is possible to sufficiently advance the reaction by shortening the time of dipping and drying per time and increasing the number of reactions.

  Furthermore, the silyl ether which has silicone rubber crosslinking reactivity can be formed in the base-material surface of a resin molding sheet | seat by using combining the said functional alkoxysilyl compound and a silane compound.

For example, after reacting the hydroxyl group on the substrate surface of the resin molded sheet with the above functional alkoxysilyl compound, a silane compound, for example,
HSi (CH ₃ ) ₂ C ₆ H ₄ Si (CH ₃ ) ₂ H,
HSi (CH ₃ ) ₂ C ₆ H ₄ OC ₆ H ₄ Si (CH ₃ ) ₂ H,
CH ₃ Si (H) ₂ C ₂ H ₄ Si (H) ₂ CH ₃ ,
HSi (CH ₃ ) ₂ C ₂ H ₄ Si (CH ₃ ) ₂ H,
HSi (CH ₃ ) ₂ OSi (CH ₃ ) ₂ H,
HSi (CH ₃ ) ₂ O [Si (CH ₃ ) ₂ O] _x1 Si (CH ₃ ) ₂ H (where x1 = 1 to 840),
(CH ₃ ) ₃ SiO [SiH (R ¹⁷ ) O] _x2 [Si (CH ₃ ) ₂ O] _y1 Si (CH ₃ ) ₃ (where R ¹⁷ = CH _3- , C ₂ H _5- , C ₆ H ₅ -; Y1 = 1-50; x2 = 0-50)
HSi (CH ₃ ) ₂ O [SiC ₆ H ₅ (OSi (CH ₃ ) ₂ H)] _x3 Si (CH ₃ ) ₂ H (x3 = 1-5),
HSi (CH ₃ ) ₂ O [SiCH ₃ (H) O] _x4 [SiCH ₃ (C ₆ H ₅ ) O] _y2 Si (CH ₃ ) ₂ H (x4 = 1-10, y2 = 1-10)
Is mentioned. A substrate of a resin molded sheet is obtained by immersing in a 0.01-5% alcohol solution of these silane compounds and heating to 0-200 ° C. for 1-60 minutes. If it is 0.01% or less, it takes too much reaction time, and if it is 5% or more, cleaning and recovery costs are required. The reactivity is low below 0 ° C, and the productivity is inferior above 200 ° C. The reaction is not completed in 1 minute or less, and the productivity is inferior in 60 minutes or more.

Similarly, the following unsaturated alkoxysilane compounds, such as
CH ₂ = CHCH ₂ Si (OC ₂ H ₅ ) ₃ ,
CH ₂ = CHCH ₂ CH ₂ Si (OC ₂ H ₅ ) ₃ ,
CH ₂ = CHCH ₂ CH ₂ CH ₂ CH ₂ Si (OC ₂ H ₅ ) ₃ ,
CH ₂ = CHCH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ Si (OCH ₃ ) ₃ ,
CH ₂ = CHSi (OC ₂ H ₅ ) ₂ OSi (OC ₂ H ₅ ) ₂ CH = CH ₂ ,
CH ₂ = CHC ₆ H ₄ CH ₂ CH ₂ Si (OCH ₃ ) ₃ ,
CH ₂ = CHSi (OCH ₃ ) ₂ O [SiOCH ₃ (CH = CH ₂ ) O] _x5 Si (OCH ₃ ) ₂ CH = CH ₂ (however, x5 = 1-30),
CH ₂ = CHSi (CH ₃ ) ₂ O [Si (CH ₃ ) ₂ O] _y3 [Si (R ¹⁸ ) ₂ O] _x6 Si (CH ₃ ) ₂ CH = CH ₂ (However, R ¹⁸ = CH ₃ −, C ₂ H ₅ −, C ₆ H ₅ −, or CF ₃ CH ₂ CH ₃ −, x6 = 0 to 2100, y3 = 0 to 2100),
(CH ₃ ) ₃ SiO [Si (CH ₃ ) ₂ O] _y4 [SiCH ₃ (CH = CH ₂ ) O] _x7 Si (CH ₃ ) ₃ (where x7 = 0 to 2100, y4 = 0 to 2100),
(CH ₃ ) ₃ SiO [Si (CH ₃ ) ₂ O] _y5 [SiCH ₃ (CH = CH ₂ ) O] _x8 [SiCH ₃ (R ¹⁹ ) O] _z1 Si (CH ₃ ) ₃ (R ¹⁹ = CH ₃ −, C ₂ H ₅ −, C ₆ H ₅ −, or CF ₃ CH ₂ CH ₃ −, x8 = 0 to 2100, y5 = 0 to 2100, z1 = 0 to 2100)
Is mentioned. After reacting with the hydroxyl group on the substrate surface of the resin molded sheet with these unsaturated alkoxysilane compounds, the suspension of a mixture of 0.01 to 5% of the silane compound and 10 to 1000 ppm of the platinum catalyst is 0. A resin molded sheet can be obtained even by immersing at ~ 200 ° C for 1 to 60 minutes.

  At this time, if the silane compound concentration is 0.01% or less, it takes too much reaction time, and if it is 5% or more, cleaning and recovery costs are required. If the platinum catalyst concentration is 10 ppm, the reaction rate is too slow, and if it is 1000 ppm or more, the cost becomes a problem. Below 0 ° C, the reactivity is low, so the productivity is low. Above 200 ° C, the SiH group is oxidized and the performance decreases. The reaction may not be completed in 1 minute or less, and the productivity is inferior in 60 minutes or more.

Moreover, after reacting with the hydroxyl group of the base material of the resin molded sheet with functional polyalkoxysilane, silanol such as HOSi (CH ₃ ) ₂ O [Si (CH ₃ ) ₂ O] ₂ Si (CH ₃ ) ₂ OH When immersed in a 0.01 to 5% methanol solution of terminal siloxane at 0 to 200 ° C. for 1 to 60 minutes, a resin molded sheet containing silanol groups on the surface is obtained.

  If the silanol-terminated siloxane concentration is 0.01% or less, the reaction time is too long, and if it is 5% or more, cleaning and recovery costs are required. Below 0 ° C., the reactivity is low and the productivity is inferior. Above 200 ° C., a multimolecular film may be formed, which is not preferable. The reaction may not be completed in 1 minute or less, and the productivity is inferior in 60 minutes or more.

  The lower resin molded sheet into which a crosslinking reactive group such as hydrosilyl (SiH) group, unsaturated group, and silanol (SiOH) group obtained as described above is introduced is a silicone rubber component as described below. It is brought into contact with the composition and the upper silicone resin molded sheet formed from the composition and left or heated to cause cross-linking adhesion.

The lower resin molded sheet is brought into contact with the silicone rubber component composition and the upper silicone resin molded sheet formed therefrom, and treated at 0 to 200 ° C. for 1 to 240 minutes under a pressure of 100 kg / cm ² from atmospheric pressure. Then, a biochip substrate is obtained.

At this time, the crosslinking rate is low at 0 ° C. or lower and the productivity is inferior, but at 200 ° C. or higher, the polymer resin to be used is not preferable because it has a limit of thermal stability. If it is 1 minute or less, the crosslinking reaction is not sufficient and often does not adhere, and if it is 240 minutes or more, the productivity is inferior, which is not preferable. Except for the production of foam, the adhesive strength of the biochip substrate is low at atmospheric pressure or lower, and even if it is 100 kg / cm ² or higher, there is no particular advantage, which is not preferable.

The silicone rubber component constituting the resin molded sheet has the following chemical formula [5]
H (CH ₃ ) ₂ SiO [SiH (CH ₃ ) O] _c [Si (R ¹¹ ) R ¹² O] _d Si (CH ₃ ) ₂ H ・ ・ ・ [5]
(Wherein, R ¹¹ and R ^12, more specifically _{CH 3 -, C 2 H 5} -, CH 2 CH = CH 2 -, nC 3 H 7 -, iC 3 H 7 -, nC 6 H 13 −, NC ₈ H ₁₇ −, C ₆ H ₅ −, C ₆ H ₅ CH ₂ −, C ₆ H ₅ CH ₂ CH ₂ −, C ₁₀ H ₇ −, CF ₃ CH ₂ CH ₂ −, CF ₃ CF ₂ CH ₂ CH ₂ −, CF ₃ CF ₂ CF ₂ CH ₂ CH ₂ −, CF ₃ CF ₂ CF ₂ CF ₂ CF ₂ CH ₂ CH ₂ −, CF ₃ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CH ₂ CH ₂ -, CF ₃ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CH ₂ CH _2- , CF ₃ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CH ₂ CH _2- , A group represented by HSi (CH ₃ ) ₂ O—, c is a number from 1 to 80, and d is a number from 0 to 80),
The following chemical formula [6]
CH ₂ = CH (CH ₃ ) ₂ SiO [SiCH = CH ₂ (CH ₃ ) O] _e [Si (R ¹³ ) R ¹⁴ O] _f Si (CH ₃ ) ₂ CH = CH ₂ ... [6]
(Wherein, R ¹³ and R ^14, more _{specifically, CH 3 -, C 2 H} 5 -, CH 2 = CH-, CH 2 = CHCH 2 -, nC 3 H 7 -, iC 3 H 7 −, NC ₆ H ₁₃ −, nC ₈ H ₁₇ −, C ₆ H ₅ −, CH ₂ = CHC ₆ H ₄ −, CH ₂ = CHC ₆ H ₄ CH ₂ −, C ₆ H ₅ CH ₂ CH ₂ −, C ₁₀ H ₇ −, CF ₃ CH ₂ CH ₂ −, CF ₃ CF ₂ CH ₂ CH ₂ −, CF ₃ CF ₂ CF ₂ CH ₂ CH ₂ −, CF ₃ CF ₂ CF ₂ CF ₂ CF ₂ CH ₂ CH ₂ −, CF ₃ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CH ₂ CH ₂ −, CF ₃ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CH ₂ CH ₂ −, CF ₃ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CH ₂ CH ₂ —, a group exemplified by HSi (CH ₃ ) ₂ O—, e is a number from 1 to 80, and f is a number from 0 to 80)
Vinyl silicones selected from
Or the following chemical formula [7]
A- (CH ₃ ) ₂ SiO [Si (CH ₃ ) ₂ O] _g [Si (R ¹⁵ ) R ¹⁶ O] _h Si (CH ₃ ) ₂ -A ・ ・ ・ [7]
(Wherein R ¹⁵ and R ¹⁶ are CH ₃ −, C ₂ H ₅ −, CH ₂ = CH−, CH ₂ = CHCH ₂ −, nC ₃ H ₇ −, iC ₃ H ₇ −, nC ₆ H ₁₃ − , nC ₈ H ₁₇ −, C ₆ H ₅ −, CH ₂ = CHC ₆ H ₄ −, CH ₂ = CHC ₆ H ₄ CH ₂ −, C ₆ H ₅ CH ₂ CH ₂ −, C ₁₀ H ₇ −, CF ₃ CH ₂ CH ₂ −, CF ₃ CF ₂ CH ₂ CH ₂ −, CF ₃ CF ₂ CF ₂ CH ₂ CH ₂ −, CF ₃ CF ₂ CF ₂ CF ₂ CF ₂ CH ₂ CH ₂ −, CF ₃ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CH ₂ CH _2- , CF ₃ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CH ₂ CH _2- , CF ₃ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CF ₂ CH ₂ CH _2- group, A is HO-, CH ₃ O-, C ₂ H ₅ O-, nC ₃ H ₇ O-, iC ₃ H ₇ O-, C ₆ H ₅ O−, CH ₃ COO−, CH ₂ = C (CH ₃ ) O−, C ₂ H ₅ (CH ₃ ) C = NO−, (CH ₃ ) ₂ N−, (C ₂ H ₅ ) ₂ N− And silanol silicone derivatives selected from the group exemplified by the formula: g is a number from 1 to 80, and h is a number from 0 to 80.

  The silicone rubber component composition contains at least one of these silicone rubber components. Addition type silicone rubber composition comprising a mixture of chemical formula [5] and chemical formula [6], peroxide type silicone rubber composition comprising only chemical formula [6], and chemical formula [7] or a mixture of chemical formula [5] and chemical formula [7] The condensation type silicone rubber composition which consists of may be sufficient.

  In addition to the silicone rubber component, the silicone rubber component composition may contain a filler, a crosslinking agent, and a catalyst.

  Examples of the filler include wet silica, dry silica, talc, nipsil, carbon black, and metal oxide, and are added in the range of 10 to 100 parts. If it is 10 parts or less, the reinforcing effect is not sufficient, and if it is 100 parts or more, filling becomes difficult.

  Silicone rubber is formed by a crosslinking system such as a peroxide crosslinking system, an addition crosslinking system, and a condensation crosslinking system. Thereby, a biochip substrate bonded by cross-linking is obtained.

  Peroxide type silicone rubber composition includes benzoyl peroxide, t-butyl perbenzoate, dicumyl peroxide, di-t-butyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, 2 0.5 to 5 parts of a peroxide such as 1,5-dimethyl-2,5-di (t-butylperoxy) hexyne-3, di (t-butylperoxyisopropyl) benzene is added. If it is 0.5 parts or less, crosslinking is insufficient, and if it is 5 parts or more, crosslinking may occur during molding.

  When the lower resin-molded sheet is brought into contact with the peroxide-type silicone rubber composition or the upper silicone resin-molded sheet formed with the composition and heated in a temperature range of 80 to 200 ° C. for 1 to 60 minutes, they are crosslinked. A biochip substrate is obtained. A crosslinked biochip substrate is difficult to obtain at 80 ° C. or lower, and the silicone rubber may turn yellow at 200 ° C. or higher. In less than 1 minute, crosslinking is insufficient, and in more than 60 minutes, productivity is low and cost is high.

  For addition type silicone rubber composition, chloroplatinic acid, platinum carbonylcyclovinylmethylsiloxane complex, platinum divinyltetramethyldisiloxane complex, platinum cyclovinylmethylsiloxane complex, platinum octanal / octanol complex as catalyst used for addition type crosslinking , Tris (dibutyl sulfide) rhodium trichloride and the like are added within the range of 1 to 100 ppm. If this is 1 ppm or less, crosslinking is insufficient, and if it is 100 ppm or more, the cost increases, which is not preferable.

  The above catalyst is used by adding to the silicone rubber component composition of any of the addition type silicone rubber compositions of the chemical formula [5], the silicone rubber of the chemical formula [6], and mixtures thereof.

  When the silicone rubber component composition or the upper silicone resin molded sheet and the lower silicone resin molded sheet formed with the silicone rubber component composition are heat-treated at a temperature range of 0 to 150 ° C. for a crosslinking time of 1 to 240 minutes, Thus, a biochip substrate can be obtained. Below 0 ° C., it is difficult to obtain a biochip substrate that is sufficiently cross-linked and adhered, and there is no particular problem at 150 ° C. or higher. In less than 1 minute, crosslinking is insufficient, and in more than 240 minutes, productivity is low and cost is high. When the thickness of the resin molded sheet exceeds 10 mm, the thermal conductivity is deteriorated and the internal cross-linking is slowed down, so that the mold temperature may be lowered and the cross-linking may be performed for a long time. In that case, it is also possible to change the crosslinking temperature stepwise. In the case of a relatively thin rubber resin molded sheet, it may be crosslinked at room temperature, for example, overnight. In that case, thermal expansion at the crosslinking temperature and shrinkage when used at room temperature do not occur, and it becomes possible to mold a resin molded sheet with very good dimensional accuracy.

The mixing ratio of the silicone rubber represented by the chemical formula [5] and the silicone rubber represented by the chemical formula [6] is based on a SiH group / CH = CH ₂ ratio of 1 (stoichiometry). 4.5 / 1. The hardness is lower than 1.3 / 1 or less, and the same result is often obtained at 4.5 / 1 or more. The optimum SiH group / CH = CH ₂ ratio is affected by the additives such as fillers, and is therefore selected as appropriate.

In particular, when the crosslinkable reactive group SiH group concentration on the substrate surface of the resin molded sheet is high, the adhesive strength is high even if the SiH group / CH═CH ₂ ratio is high. However, when the SiH group concentration is low, if the SiH group / CH = CH ₂ ratio is high, the adhesive strength is low. Further, when the concentration of the crosslinkable group CH═CH ₂ group on the substrate surface is high, the adhesive strength cannot be increased unless the SiH group / CH═CH ₂ ratio is increased.

In the condensation type silicone rubber composition, as a condensation type crosslinking agent, CH ₃ Si (OCOCH ₃ ) ₃ , C ₂ H ₅ OSi (OCOCH ₃ ) ₃ , CH ₃ Si [OC (CH ₃ ) = CH ₂ ] ₃ , CH ₃ Si [ON = C (CH ₃ ) C ₂ H ₅ ]] ₃ , CH ₃ OSi [ON = C (CH ₃ ) C ₂ H ₅ ]] ₃ , CH ₃ Si [N (CH ₃ )] ₃ etc. 0.5 to 10 parts, and as the catalyst, organic tin compounds such as bis (ethylhexyl) tin, bis (neodecanate) tin, dibutylralauryltin, metal salts such as zinc octylate and iron octylate, titanates, titanium 0.5-10 parts of chelate compounds, amines and the like are added.

  In the condensation type silicone rubber composition, the condensation type crosslinking agent is added to the silanol silicone rubber of the chemical formula [7], and the catalyst is either the H silicone polymer of the chemical formula [5] or the silanol silicone rubber of the chemical formula [7]. Or added to a mixture thereof.

  The biochip substrate may be in another mode as described below.

The substrate of the resin molded sheet is subjected to a surface treatment such as corona discharge treatment to generate hydroxyl groups on the substrate, and (CH ₂ = CH-) (CH ₃ O-) ₂ Si-O-[(CH ₂ = CH -) (CH ₃ O-) Si-O] _b1 -Si (-OCH ₃ ) ₂ (-CH = CH ₂ ) The contained silyl compound reacts. When it is immersed in a platinum-containing catalyst, for example, a hexane solution of a platinum complex such as a platinum-tetramethyldivinyldisiloxane complex, and dried, a resin-molded sheet having a platinum-containing catalyst on the substrate is obtained. Although the chemical structure is not necessarily clear, it is assumed that the platinum atom of the platinum complex is coordinated to a plurality of vinyl-containing silyl groups generated on the surface of the resin molded sheet.

  A hydrosilyl group-containing polysiloxane, or a vinyl group-containing polysiloxane, a composition containing a platinum-containing catalyst as necessary, and a resin molded sheet formed therefrom are brought into contact with the resin molded sheet and cured. Then, the hydrosilyl group of the hydrosilyl group-containing polysiloxane undergoes a hydrosilylation reaction to the double bond of the vinyl-containing silyl group preferentially over the cross-linking polymerization of the vinyl-containing silyl groups, thereby increasing the molecular weight, and lower resin molding A biochip substrate is obtained in which a silicone rubber upper resin molded sheet made of polysiloxane is coated and adhered on the sheet surface.

  As a platinum-containing catalyst, for example, SIP6829.2 (trade name manufactured by Gelest), which is a hexane solution of a platinum-tetramethyldivinyldisiloxane complex, a vinylmethyl cyclic siloxane solution of a platinum carbonylcyclovinylmethylsiloxane complex of 1.85 to 2.1%, SIP6830.3 (trade name, manufactured by Gelest) which is a vinyl polydimethylsiloxane solution at both ends of 3 to 3.5% platinum-divinyltetramethyldisiloxane complex, xylene of 2.1 to 2.4% platinum-divinyltetramethyldisiloxane complex SIP6831.2LC (trade name, manufactured by Gelest) which is a solution, SIP6831.2LC (trade name, manufactured by Gelest) which is a low coloring type of xylene solution of platinum-divinyltetramethyldisiloxane complex of 2.1 to 2.4%, 2 SIP6832.2 (trade name made by Gelest), which is a cyclic methylvinylsiloxane solution of ~ 2.5% platinum-cyclovinylmethylsiloxane complex, 2 ~ 2.5% platinum- Platinum complexes such as octanol solution of Kutanaru / octanol complex SIP6833.2 (Gelest Inc. of trade name) and the like. In place of the platinum-containing catalyst, a rhodium-containing catalyst such as a rhodium complex such as INRH078 (trade name manufactured by Gelest), which is a toluene solution of 3 to 3.5% tris (dibutyl sulfide) rhodium trichloride, may be used. .

  As described above, the biochip substrate of the present invention does not have a thickness as an adhesive layer in the adhesion of the resin molded sheet, and thus has a thickness obtained by superimposing two resin molded sheets. Rather, during the test, the flow path can be formed by external compression or pressurized injection of the test solution. Also, even when a spacer is sandwiched between two resin molded sheets and bonded to form a flow path, since the adhesive layer is not used because the adhesive is not used, the resin molded sheet and the spacer are overlapped. Since the thickness is only the combined thickness and the thickness of the spacer is accurately the height of the flow path, a flow path in which the cross-sectional area of the flow path and the total volume of the flow path are accurately specified can be formed.

  The resin molded sheet in the present invention is obtained by a normal molding method.

  The following is an example of a prototype biochip substrate to which the present invention is applied.

Example 1
A biochip substrate 1 shown in FIGS. 1 and 3 was prototyped. That is, 1 part by mass of the trade name “KE1935A” is mixed at a ratio of 1 part by mass of “KE1935B” (both made by Shin-Etsu Chemical Co., Ltd., trade name), 0.6 mm thick, 100 mm × 60 mm in length and width. The two resin molded sheets 11 and 12 made of silicone were prepared. The liquid injection port and the liquid discharge port were punched into the resin molded sheet 11. Polyethylene terephthalate (PET) having a thickness of 4 μm was adsorbed to the resin molded sheet 12 as masking resin layers 18b and 18b ′ by static electricity. Furthermore, a heater 19 and an electrode 20 as a biosensor were attached. Next, the overlapping surface of the resin molded sheets 11 and 12 is subjected to a corona discharge treatment at 60 Hz with a heater sandwiched between 60 Hz at a corona discharge force of 600 W / 31 cm, an air gap of 7 mm, and a speed of 50 cm / min. The resin layer was peeled off, and the surfaces were pressure-bonded at 40 ° C. with a pressure of 2 Pa to obtain a biochip substrate 1.

(Example 2)
A biochip substrate 1 shown in FIG. That is, two silicone resin molded sheets 11 and 12 of the same type as in Example 1 and spacers 21 of the same material having the same vertical and horizontal dimensions and a thickness of 0.2 mm were used. The spacer 21 was subjected to laser cutting, and the sheet was pulled out in the thickness direction to provide a streak gap having a width of 30 μm at the parallel line portion. After the surfaces to be overlapped of each sheet were subjected to corona discharge treatment in the same manner as in Example 1, the spacers 21 were sandwiched between the resin molded sheets 11 and 12 and pressure-bonded in the same manner as in Example 1. Thereby, a biochip substrate 1 having a flow path with a cross section of 30 μm × 200 μm was obtained.

  The biochip substrate of the present invention analyzes the biological components of a patient in an emergency medical setting where it is necessary to quickly know the analysis result, and extracts DNA from remains such as blood traces, body fluids, hair, and biological tissue cells in a crime scene. Extraction, PCR amplification to increase the DNA, DNA analysis to identify DNA by electrophoresis, physical properties and efficacy evaluation of various drug candidates for new drug search, diagnosis for customized medicine, peptides, DNA and functions It is used for the synthesis of low-molecular-weight small molecules.

  This biochip substrate is attached to these analyzers and microreactors to perform various analyzes in the medical field for genetic diagnosis and treatment, criminal investigations using biological samples, and underwater in remote areas such as the ocean and lakes. It can be used for microbial search using robots and various synthesis in drug development.

It is a model perspective view of the biochip board | substrate to which this invention is applied. It is a schematic cross section which shows the manufacturing process of the biochip board | substrate to which this invention is applied. It is a schematic cross section which shows the manufacturing process of another biochip board | substrate to which this invention is applied. It is a model perspective view of another biochip board | substrate to which this invention is applied.

Explanation of symbols

  1 is a biochip substrate, 11 is an upper resin molded sheet, 12 is a lower resin molded sheet, 13a to c are liquid inlets, 14a and b are liquid outlets, 15 and 16 are overlapping surfaces, and 17 is a streak , 18a and 18a ′ are metal layers, 18b and 18b ′ are masking resin layers, 19 are heaters, 20 are electrodes, 21 are spacers, 31 are metal coatings, 32 are uncured resist films, and 32a and 32a ′ are cured resist layers. 33 are uncured resist films.

Claims (11)

Non-adhesive streaks extending from the liquid inlet to the liquid outlet are provided on a part of the overlapping surfaces of the resin molded sheets facing each other, and the streaks are provided. The streaks that form the flow path of the test liquid injected from at least one of the liquid injection ports are formed by bonding the resin molded sheets to each other along the sides ,
The resin molded sheet is made of silicone resin and has elasticity, and the streaks are expanded by compression from outside and / or by pressure injection of the test solution to form the flow path. ,
At least one of the superimposed surfaces of the molded resin sheet, the streaks are covered with a metal deposition film or a masking resin layer, thereby forming the non-adhesive streaks,
At least one of the surfaces of the resin-molded sheet to be bonded and, if necessary, the spacers sandwiched between them, is subjected to corona discharge treatment or plasma treatment, and the treated surfaces are overlapped. The biochip substrate to be bonded,
The resin-molded sheet to be bonded and the spacer sandwiched between the resin-molded sheet and the spacer, if necessary, contain a hydrosilyl group-containing compound and a vinyl group-containing compound, both of which are added to the vinyl group of the vinyl group-containing compound. The silicon-carbon bond formed by the addition reaction of the hydrosilyl group of the hydrosilyl group-containing compound of
Or
One of the resin-molded sheet to be bonded and the spacer sandwiched between the resin-molded sheet and the spacer, if necessary, has a hydrosilyl-containing silyl group, a vinyl-containing silyl group, an alkoxy group on the dehydrogenation group of the hydroxyl group on the surface. At least one active silyl group selected from a silyl-containing silyl group and a hydrolyzable group-containing silyl group is bonded to a silyl ether bond, and the other is hydrosilyl, vinylsilyl, hydroxysilyl that reacts with the active silyl group. A compound containing at least one reactive group selected from alkyloxysilyl, alkenyloxysilyl, acyloxysilyl, iminooxysilyl, and alkylaminosilyl, both of which are silicon-carbon formed by the above reaction. And the silicon-oxygen bond. Biochip substrate, characterized in that it is. By being partitioned by the spacer which is sandwiched between the resin molded sheet superposed, the muscle strip has formed the flow path, the said resin molded sheet and the spacer is adhered The biochip substrate according to claim 1. And the resin molded sheet the to be bonded, at least one of the adhesive the surface to the inside of said spacer sandwiched Re their is, corona discharge treatment or plasma treatment, the process is has been faces thereof, superimposed the biochip substrate according to any one of claims 1-2, characterized in that it is the adhesive Te. And the resin molded sheet the to be bonded, and the spacer sandwiched Re their is, has contains a hydrosilyl group-containing compound and a vinyl group-containing compounds, both, to the vinyl groups of the vinyl group-containing compound 3. The biochip substrate according to claim 1, wherein the biochip substrate is bonded through a silicon-carbon bond formed by an addition reaction of a hydrosilyl group of the hydrosilyl group-containing compound. Wherein the forming the to be bonded resin sheets, one to be bonded of the said spacer sandwiched Re their is, the dehydrogenation group for a hydroxyl group having on the surface thereof, a hydrosilyl-containing silyl group, a vinyl-containing silyl group, alkoxysilyl A silyl ether-bonded at least one active silyl group selected from a containing silyl group and a hydrolyzable group-containing silyl group, the other being hydrosilyl, vinylsilyl, hydroxysilyl, which reacts with the active silyl group, A compound containing at least one reactive group selected from alkyloxysilyl, alkenyloxysilyl, acyloxysilyl, iminooxysilyl, and alkylaminosilyl, both of which include silicon-carbon formed by the above reaction and Through any bond with silicon-oxygen. The biochip substrate according to any one of claims 1-2, characterized in that.   The biochip substrate according to claim 1, wherein there are a plurality of the streaks, and they are converged or branched in the middle. At least one of a detection reagent for the biocomponent of the test liquid, a reaction reagent for the biocomponent of the test liquid, and a biosensor is disposed in the middle of the streak, and / or
The biochip substrate according to claim 1, wherein at least one of the detection reagent, the reaction reagent, and the synthesis reagent is injected from the liquid injection port. The biochip substrate according to claim 1, wherein the silicone resin is a peroxide-crosslinked silicone rubber, an addition-type crosslinked silicone rubber, or a condensation-type crosslinked silicone rubber. The biochip substrate according to claim 8, wherein the silicone resin is the peroxide-crosslinked silicone rubber to which a peroxide is added. The silicone resin is an addition-type crosslinked silicone rubber, and includes chloroplatinic acid, platinum carbonylcyclovinylmethylsiloxane complex, platinum divinyltetramethyldisiloxane complex, platinum cyclovinylmethylsiloxane complex, platinum octanal / octanol complex, and tris ( The biochip substrate according to claim 8, wherein a catalyst selected from dibutyl sulfide) rhodium trichloride is added. The silicone resin is a condensation-type crosslinked silicone rubber, and CH _Three Si (OCOCH _Three ) _Three , C ₂ H _Five OSi (OCOCH _Three ) _Three , CH _Three Si [OC (CH _Three ) = CH ₂ ] _Three , CH _Three Si [ON = C (CH _Three ) C ₂ H _Five ]] _Three , CH _Three OSi [ON = C (CH _Three ) C ₂ H _Five ]] _Three And CH _Three Si [N (CH _Three )] _Three Condensation type cross-linking agents selected from: organic tin compounds such as bis (ethylhexyl) tin, bis (neodecanate) tin, dibutylralauryltin, zinc octylate, iron octylate, titanate ester, titanium chelate compound, and amine The biochip substrate according to claim 8, further comprising a catalyst selected from the group of compounds.

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