JP5518662B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a light emitting device that converts light from a light emitting element by a wavelength conversion layer and a method for manufacturing the same.

  There is known a light-emitting device that converts part of light from a light-emitting element into light having a different wavelength by a wavelength conversion layer, and mixes and emits the light with light from the light-emitting element. For example, Patent Document 1 discloses a light emitting device in which a plurality of light emitting elements are arranged on a substrate such as ceramic or resin, and a wavelength conversion layer formed of a phosphor-containing resin is disposed immediately above the light emitting element 3. Yes. A transparent plate is mounted on the upper surface of the wavelength conversion layer. Patent Document 2 discloses a light emitting device in which a light emitting element is disposed in a cavity, and a phosphor-containing resin is filled in the cavity so as to cover a side surface and an upper surface of the light emitting element. A transparent plate is mounted on the upper surface of the phosphor-containing resin.

  Patent Document 3 discloses a light emitting device in which a plurality of light emitting elements are arranged in a casing having a cavity, and an upper opening of the cavity is covered with a transparent plate. In order to prevent light from being emitted from the end face of the transparent plate, the space around the end face of the transparent plate is filled with a light absorbing material.

Special table 2008-507850 gazette JP 2006-48934 A Special table 2009-60113 gazette

  In a light emitting device in which a plurality of light emitting elements are arranged side by side in a substrate or cavity, a plurality of light emitting elements cannot be arranged without gaps, and therefore luminance unevenness and chromaticity are caused by the gap between the light emitting elements and the portion directly above the light emitting elements. Unevenness is likely to occur. Further, even when a single light emitting element is disposed, uneven luminance and uneven chromaticity are likely to occur in the portion directly above the light emitting element and the peripheral region.

  In order to solve this luminance unevenness and chromaticity unevenness, the light emitted from the transparent plate is processed by roughening the upper surface of the wavelength conversion layer and the upper surface of the transparent plate arranged for protection on the opening of the cavity. It is possible to diffuse. However, when the upper surface of the transparent plate is processed into a rough surface, a light diffusing effect is obtained, but wettability with respect to a liquid is increased. For this reason, the structure in which the phosphor-containing resin is filled in the lower part of the transparent plate as in Patent Document 2 and the structure in which the light absorbing material is filled around the end face of the transparent plate as in Patent Document 3 are not performed in the manufacturing process. There arises a problem that the cured phosphor-containing resin and the light absorbing material crawl up from the end surface of the transparent resin to the upper surface, and the upper surface of the transparent plate is soiled. Since the upper surface of the transparent plate is a light exit surface, if it is contaminated with the resin that has been scooped up, the light extraction efficiency is reduced and luminance unevenness occurs in the light exit pattern.

  An object of the present invention is to provide a light emitting device that is small in luminance unevenness and chromaticity unevenness and excellent in light extraction efficiency.

  In order to achieve the above object, according to the first aspect of the present invention, the following light emitting device is provided. That is, a substrate, one or more light-emitting elements mounted on the substrate, a resin layer disposed on the light-emitting element, a plate-like member mounted on the resin layer, and the periphery of the resin layer and the plate-like member And a reflective resin member filled therein. A plate-shaped member is provided with the smooth edge area | region provided in the periphery of the upper surface, and the uneven | corrugated process area | region enclosed by the edge area | region. The reflective resin member covers the entire side surface of the plate-like member.

  Moreover, according to the 2nd aspect of this invention, the following light-emitting devices are provided. That is, a substrate, one or more light-emitting elements mounted on the substrate, a resin layer disposed on the light-emitting element, a plate-like member mounted on the resin layer, and the periphery of the resin layer and the plate-like member And a reflective resin member filled therein. The plate-like member includes a resin scooping prevention region and an uneven processing region surrounded by the resin scooping prevention region provided on the periphery of the upper surface. The reflective resin member covers the entire side surface of the plate-like member. A layer of material that repels uncured resin is disposed in the resin creep-up prevention region.

  On the upper surface of the plate-shaped member described above, a smooth area directly above the light emitting element may be further provided.

  Moreover, according to the 3rd aspect of this invention, the manufacturing method of a light-emitting device is provided. That is, the first step of covering the upper surface of the light emitting element mounted on the substrate with an uncured resin and placing the plate member thereon, and around the side surface of the resin and the plate member in an uncured state And a second step of covering the entire side surface of the plate-like member with the reflective resin material by filling the reflective resin material with fluidity. As the plate-like member, a member having a resin scooping prevention region provided on the periphery of the upper surface and a concavo-convex processing region surrounded by the resin scooping prevention region is used.

  According to the present invention, it is possible to reduce luminance unevenness and chromaticity unevenness due to light scattering by providing the uneven processing region on the upper surface of the plate-like member. In addition, the smooth region on the periphery of the upper surface of the plate-like member or the resin creep-up prevention region causes a phenomenon that uncured resin crawls up to the upper surface of the plate-like member when filling the resin around or below the plate-like member. prevent. Therefore, the light extraction efficiency can be improved without being contaminated by the resin in the uneven processing region on the upper surface of the plate member.

2A is a top view of the light-emitting device of Embodiment 1, and FIG. The top view of the transparent plate 1 of FIG. (A)-(d) Sectional drawing which shows the manufacturing process of the light-emitting device of Embodiment 1. FIG. FIG. 6 is a top view of a transparent plate 1 used in the light emitting device of Embodiment 2. Sectional drawing of the transparent board 1 which formed the smooth edge 1b of Embodiment 1 by the concave process 1c. Sectional drawing of the transparent plate 1 which formed the smooth edge 1b of Embodiment 2 by the concave process 1c. FIG. 6 is a top view of a transparent plate 1 used in the light emitting device of Embodiment 3. FIG. 6 is a top view of an example in which a directly above region 2 is provided on the transparent plate 1 of Embodiment 3. Sectional drawing of the light-emitting device of Embodiment 4. FIG. (A)-(d) Sectional drawing which shows the manufacturing process of the light-emitting device of Embodiment 4. FIG.

  Hereinafter, a light emitting device according to an embodiment of the present invention will be described.

(Embodiment 1)
FIGS. 1A and 1B are a top view and a cross-sectional view of the light emitting device according to the first embodiment. One or more flip-chip type light emitting elements 11 are joined and mounted by a plurality of bumps 12 on a mounting substrate 10 on which wiring is formed on the upper surface. A predetermined interval is provided between the plurality of light emitting elements 11.

  The upper surface and the side surface of the light emitting element 11 are covered with the wavelength conversion layer 24. The wavelength conversion layer 24 is formed of a material obtained by kneading and dispersing phosphor particles in a resin or an inorganic binder.

  A transparent plate 1 is mounted on the wavelength conversion layer 24 in order to protect the light emitting element 11. In the light emitting device of FIG. 1, the wavelength conversion layer 24 and the transparent plate 1 are the same in size when viewed from the top, and these side surfaces are in a coincident position.

  A ring 16 is disposed on the upper surface of the mounting substrate 10 along the outer periphery. In the space between the wavelength conversion layer 24 and the side surface of the transparent plate 1 and the ring 16, the diffuse reflection member 15 is disposed. The diffuse reflection member 15 is formed by injecting a material obtained by mixing light scattering particles into a binder of resin or inorganic material into a space between the light emitting element 11 and the frame body in an uncured state and curing the material. Yes.

  It is desirable that the diffuse reflection member 15 has a thickness that covers the entire side surfaces of the wavelength conversion layer 24 and the transparent plate 1 and does not exceed the upper surface of the transparent plate 1. This is for forming a cut-off line of a desired light distribution pattern. The thickness of the diffuse reflection member 15 can be controlled by adjusting the amount of the uncured diffuse reflection member 15 to be filled.

  As shown in FIG. 2, the upper surface (light emission surface side) of the transparent plate 1 has a large area 1a processed into a rough surface (uneven surface). This is because the light from the light emitting element 11 is diffused and emitted. The roughness Ra of the uneven surface is preferably in the range of Ra = 0.5 or more and 2.0 or less in order to obtain the light diffusion effect. The size of the transparent plate 1 is desirably larger than the entire arrayed elements 11.

  When the upper surface of the transparent plate 1 is processed into an uneven surface, the wettability of the upper surface of the transparent plate 1 with respect to the liquid is increased, and the uncured wavelength conversion layer 24 and the uncured diffuse reflection member 15 are configured in the manufacturing process. There is a possibility that a phenomenon occurs in which the resin crawls up to the upper surface of the transparent plate 1 and partially covers the upper surface of the transparent plate 1. In order to prevent this, in the present embodiment, the edge of the upper surface of the transparent plate 1 is provided with an edge 1b that is a smooth area that is not roughened, and only the central area 1a surrounded by the edge 1b is uneven. Has been processed.

  The width of the smooth edge 1b is desirably set to a width that does not allow the uncured resin to reach the uneven processing area 1a over the smooth edge 1b and does not affect the light distribution pattern. Whether the resin constituting the uncured wavelength conversion layer 24 or the uncured diffuse reflection member 15 climbs over the smooth edge 1b depends on the viscosity and material of the uncured resin and the material of the transparent plate 1 Therefore, it is desirable to set an appropriate width by conducting an experiment or the like in advance. For example, when the transparent plate 1 is made of glass and the uncured resin is a silicone resin, the width of the smooth edge 1b can be 10 μm or more and 60 μm or less. More specifically, it can be set to 10 μm.

  Further, in order to prevent the resin constituting the uncured wavelength conversion layer 24 and the uncured diffuse reflection member 15 from scooping up from the side surface to the top surface of the transparent plate 1, the upper corner of the transparent plate 1 (upper surface) It is desirable that the corner portion where the side surface and the side surface intersect) is a clear edge (with a curvature of 0.1 mm or less).

  It is desirable that the lower surface of the transparent plate 1 is in close contact with the wavelength conversion layer 24 without interposing an air layer or the like. Further, by making the refractive index of the transparent plate 1 larger than that of the wavelength conversion layer 24, it is possible to prevent the light emitted from the light emitting element 11 from being totally reflected at the interface between the transparent plate 1 and the wavelength conversion layer 24. Can do.

  As the transparent plate 1, a material that is transparent to the light emitted from the light emitting element 11 and the light converted by the wavelength conversion layer 24 is used. For example, a transparent plate 1 made of an inorganic material such as glass or a transparent resin such as a silicone resin or an epoxy resin can be used.

  As the phosphor of the wavelength conversion layer 24, a phosphor that emits fluorescence of a desired wavelength using light from the light emitting element 11 as excitation light is used. Specifically, for example, when using the light emitting element 11 that emits blue light, a phosphor that emits yellow fluorescence when excited by the blue light (for example, a YAG phosphor) is used. Accordingly, a light emitting device that emits white light in which blue light and yellow light are mixed can be provided. As the binder resin of the wavelength conversion layer 24, silicone resin, epoxy, or the like can be used.

  As the binder resin of the diffuse reflection member 15, a resin such as a silicone resin, an epoxy resin, an alkyl silicate, a metal alcoholate, or the like can be used. As the scattering material (particles), metal oxides such as titanium oxide, zinc oxide, boron nitride, and aluminum nitride can be used.

  As the mounting substrate 10, for example, an AlN ceramic substrate on which a wiring pattern such as Au is formed is used. For example, Au bumps are used as the bumps 12. As the light emitting element 11, an element that emits light having a desired wavelength is prepared. For example, one that emits blue light is used.

  For example, a ceramic ring can be used as the ring 16.

  The operation of the light emitting device of this embodiment will be described. The light emitted upward from the light emitting element 11 is incident on the wavelength conversion layer 24, part or all of which is converted into light having a predetermined wavelength, and is emitted from the upper surface of the wavelength conversion layer 24. The light emitted from the upper surface of the wavelength conversion layer 24 enters the transparent plate 1 and is scattered and emitted from the uneven processing region 1 b on the upper surface of the transparent plate 1. Thereby, chromaticity unevenness and luminance unevenness due to the spacing between the light emitting elements 11 and the like are reduced, and light of uniform chromaticity and brightness is emitted from the upper surface of the transparent plate 1 with a predetermined light distribution pattern. can do.

  The light traveling in the side surface direction in the wavelength conversion layer 24 and the transparent plate 1 is reflected by the diffuse reflection member 15 on the side surface to change the traveling direction to the upper surface direction, and is scattered and emitted from the upper surface of the transparent plate 1.

  In the present embodiment, since the distance from the side surface of the light emitting element 11 to the diffuse reflection member 15 is short, the optical path length until the light emitted from the light emitting element 11 in the lateral direction reaches the upper surface of the transparent plate 1 is short, and the wavelength The light can be emitted from the upper surface of the transparent plate 1 with high efficiency without being affected by absorption by the conversion layer 24 and the transparent plate 1.

  Moreover, since the diffuse reflection member 15 is filled in an uncured state, it can be formed close to the light emitting element 11, and a light emitting device with a small light emitting area can be provided. Moreover, since the cavity is formed by the diffuse reflection member 15 in spite of a small light emitting area, most of the light emitted from the side surface of the light emitting element 11 is not returned to the inside of the light emitting element 11 but goes to the upper surface. The take-out efficiency is improved.

  Next, a method for manufacturing the light emitting device of this embodiment will be described with reference to FIGS.

  The edge 1b is left on the upper surface of the transparent plate 1 and the region 1a is processed to have a predetermined roughness Ra. As the unevenness processing method, it is possible to use a method in which ceramic particles such as sandblast are collided with the surface of the transparent plate to physically make the surface uneven, or a method in which the surface is chemically uneven with hydrofluoric acid or the like. .

  First, as shown in FIG. 3A, the element electrode of the flip chip type light emitting element 11 is bonded to the wiring pattern on the upper surface of the mounting substrate 10 using the bumps 12 and mounted. The ring 16 is fixed on the mounting substrate 10. Next, a phosphor particle kneaded with a binder is prepared, and the upper and side surfaces of the light emitting element 11 are coated with a predetermined thickness by a printing method or a potting method as shown in FIG. The wavelength conversion layer 24 is formed.

  As shown in FIG. 3C, the transparent plate 1 is mounted in a state where the wavelength conversion layer 24 is uncured, and then the wavelength conversion layer 24 is cured under predetermined conditions, whereby the wavelength conversion layer 24 is used as an adhesive layer. The transparent plate 1 is used. At this time, although the wavelength conversion layer 24 is uncured, since the smooth edge 1b is provided on the upper surface of the transparent plate 1 and the edge of the upper corner of the transparent plate 1 is clear, it is transparent. The uncured wavelength conversion layer 24 does not crawl on the upper surface of the plate 1.

  Next, an uncured diffuse reflection member 15 in which scattering particles are kneaded with a binder is prepared, and the space between the transparent plate 1 and the ring 16 is filled as shown in FIG. At this time, the filling amount is controlled so that the upper surface of the transparent plate 1 and the liquid surface of the uncured diffuse reflection member 15 have the same height. The upper surface of the transparent plate 1 has an uneven region 1a. However, since the smooth edge 1b is provided and the edge of the upper corner of the transparent plate 1 is clear, uncured diffuse reflection. The member does not crawl up to the upper surface of the transparent plate 1 and does not cover the upper surface of the transparent plate 1. After filling with the uncured diffuse reflection member 15, it is cured under predetermined conditions.

  As described above, the light-emitting device shown in FIG. 1 of Embodiment 1 can be manufactured.

  In the manufacturing method described above, the diffuse reflection member 15 is filled after the wavelength conversion layer 24 is cured, but by adjusting the viscosity so that the shape of the uncured wavelength conversion layer 24 does not change, It is also possible to proceed to the next step while the wavelength conversion layer 24 is in an uncured state, fill the diffuse reflection member 15, and simultaneously cure the wavelength conversion layer 24 and the diffuse reflection member 15.

  It is also possible to arrange a transparent member layer between the wavelength conversion layer 24 and the transparent plate 1 and fix the transparent plate 1 using the transparent member layer as an adhesive layer.

  In the first embodiment, the manufacturing process for filling the diffuse reflection member 15 after mounting the transparent plate 1 has been described. However, the diffuse reflection member 15 formed in advance may be mounted on the substrate 10. In this case, the light emitting element 11 is mounted in the opening of the diffuse reflection member 15, the uncured wavelength conversion layer 24 is filled, the transparent plate 1 is mounted, and then the uncured wavelength conversion layer 24 is cured. At this time, by using the transparent plate 1 of the present embodiment, it is possible to prevent the uncured wavelength conversion layer 24 from climbing up to the upper surface of the transparent plate 1.

(Embodiment 2)
In the second embodiment, as shown in FIG. 4, on the upper surface of the transparent plate 1, the region 2 immediately above the light emitting element 11 is a smooth surface of the light emitting element 11 and is not subjected to uneven processing. Other configurations are the same as those in the first embodiment, and thus the description thereof is omitted.

  Thus, by making the region 2 directly above the light emitting element 11 a smooth surface, the light that has reached the region 2 immediately above the element out of the light emitted from the light emitting element 11 is emitted without being scattered. The brightness of the emitted light in the region 2 can be improved.

  Further, since light is scattered by the uneven region 1a in the gap between the light emitting element 11 and the light emitting element 11 where the chromaticity unevenness and the brightness unevenness easily occur, and the periphery of the element, the chromaticity unevenness and the brightness unevenness are reduced. Can do.

  Note that the shape of the smooth region 2 immediately above the element may be the same shape as the upper surface of the light emitting element 11, or may be a circle different from the upper surface shape of the light emitting element 11. The size of the region 2 immediately above the smooth element is desirably smaller than the upper surface of the element.

  In the first and second embodiments described above, the smooth edge 1b is formed by not subjecting the region of the edge 1b of the transparent plate 1 to the uneven processing, but the method of forming the smooth edge 1b is not limited to this method. Absent. For example, after the concavo-convex process is performed on the entire surface of the transparent plate 1, the surface area of the edge 1b is removed by applying a concave process (spotting process) 1c as shown in FIGS. 5 and 6, thereby forming a smooth surface on the edge 1b. It is also possible to do. 5 is a cross-sectional view of the transparent plate 1 of FIG. 2 according to the first embodiment, and FIG. 6 is a cross-sectional view of the transparent plate 1 of FIG. Even when the edge 1b is smoothed by the concave processing 1c as shown in FIGS. 5 and 6, the effect of preventing the resin from creeping up to the upper surface of the transparent plate 1 is the same as in the first and second embodiments. Arise.

  A plurality of transparent plates 1 can be easily manufactured from a large plate by forming the smooth edge 1b by performing the concave processing 1c as shown in FIGS. Specifically, a process of performing unevenness processing on the entire surface of a large plate, then performing concave processing 1c on a region that becomes the edge 1b of each transparent plate 1 to form a smooth surface, and then cutting to the size of each transparent plate 1 A plurality of transparent plates 1 can be manufactured. This eliminates the need for previously covering the area of the edge 1b with a mask during the uneven processing of the surface of the transparent plate 1, and it is only necessary to perform the uneven processing on the entire transparent plate 1 of a large plate, thereby facilitating the uneven processing. Moreover, since the process of the concave process 1c and a cutting process can be performed continuously, manufacturing efficiency can be improved.

  It is also possible to form the region 2 immediately above the smooth element of FIG. 6 by the concave processing 1c.

(Embodiment 3)
In Embodiment 3, as shown in FIG. 7, a region 3 in which a resin scooping-up preventing agent layer is formed is formed on the edge of the upper surface of the transparent plate 1. The scooping-up preventing agent layer forming region 3 is more preferably a smooth region, but may be subjected to uneven processing.

  The width of the creeping preventing agent layer forming region 3 is determined in consideration of the material of the creeping preventing agent, the resin material of the wavelength conversion layer 24 and the diffuse reflection member 15, and the surface state of the transparent plate 1. Specifically, it is desirable to set the width so that the uncured resin does not reach the concavo-convex processing region 1a over this region and does not affect the light distribution pattern. It is desirable to set an appropriate width by conducting an experiment or the like in advance.

  As the scooping-up preventing agent, one that repels the uncured wavelength conversion layer 24 and / or the uncured diffuse reflection member 15, for example, one having a contact angle of pure water of 90 ° or more is used. Specifically, use a fluoropolymer such as polytetrafluoroethylene (PTFE), tetrafluoroethylene / hexafluoropropylene copolymer (FEP), tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer (PFA), etc. Can do.

  As a method of forming the scooping-up preventing agent layer, a method such as application by brush coating or the like, a scooping-up preventing agent is applied to another member such as a rubber plate, and this member is pressed against the transparent plate 1 to transfer, or a dispenser or the like It is possible to use a method of coating while injecting using a liquid.

  In addition, the transparent plate 1 can be provided with a smooth region 2 immediately above the light emitting element as shown in FIG.

(Embodiment 4)
In the fourth embodiment, as shown in a cross-sectional view in FIG. 9, the diffuse reflection member 15 having the reflective surface 130 inclined at a position close to the side surface of the light emitting element 11 is formed.

  The light emitting element 11 is mounted on the mounting substrate 10 by bumps 12, and a ring 16 is disposed around the light emitting element 11. This structure is the same as that of the first embodiment.

  A wavelength conversion layer 24 having inclined side surfaces is mounted on the upper surface of the light emitting element 11, and the transparent plate 1 is mounted thereon. As in the first embodiment, the transparent plate 1 has a region 1a that is processed to be uneven on the upper surface and a smooth edge 1b. The size of the transparent plate 1 in the main plane direction is slightly larger than the entire light emitting elements 11 arranged.

  In the example of FIG. 9, the side surface of the wavelength conversion layer 24 is a curved surface that is convex toward the light emitting element 11 side.

  A space between the light emitting element 11 and the ring 16 is filled with a diffuse reflection member 15. The inclined surface 130 formed at the boundary between the diffuse reflection member 15 and the wavelength conversion layer 24 becomes a reflection surface that reflects the emitted light in the side surface direction of the light emitting element 11 and the transparent plate 1.

  In the second embodiment, the diffuse reflection member 15 also fills the space between the bottom surface of the light emitting element 11 and the top surface of the substrate 10 so as to fill the space between the bumps 12.

  In FIG. 9, the inclined surface 130 at the boundary between the diffuse reflection member 15 and the wavelength conversion layer 24 is a curved surface that is convex toward the light emitting element 11 side (inner side), but is not limited thereto. An inclined surface that linearly connects the bottom surface of the transparent plate 1 and the lower surface of the transparent plate 1 or a curved surface that protrudes outward (ring 16 side) may be used.

  Further, one end of the inclined surface 130 on the light emitting element 11 side is not necessarily at the same height as the bottom surface of the light emitting element 11 as shown in FIG. The light emitting element 11 is preferably flip-chip mounted on the substrate 10. This is because in the case of flip chip mounting, since the light emitting surface is located near the bottom surface of the light emitting element, the reflection by the inclined surface 130 can be most utilized.

  The operation of each part of the light emitting device of Embodiment 2 will be described. Light emitted from the light emitting element 11 is incident on the wavelength conversion layer 24, part or all of which is converted into light having a predetermined wavelength, and is emitted from the upper surface of the wavelength conversion layer 24. The light emitted from the upper surface of the wavelength conversion layer 24 enters the transparent plate 1 and is scattered and emitted in the uneven processing region 1 a on the upper surface of the transparent plate 1. As a result, chromaticity unevenness and luminance unevenness due to a gap between the light emitting element 11 and the light emitting element 11 are reduced, and light with uniform chromaticity and brightness is transmitted with a predetermined light distribution pattern. The light can be emitted from the upper surface of 1.

  The light emitted from the side surface of the light emitting element 11 enters the wavelength conversion layer 24 from the side surface and is reflected upward by the inclined surface 130 at the boundary between the diffuse reflection member 15 and the wavelength conversion layer 24. Thereby, most of the light emitted from the side surface of the light emitting element 11 is not returned to the inside of the light emitting element 11 and is not absorbed by the light emitting element 11. Further, since the distance between the side surface of the light emitting element 11 and the diffuse reflection member 15 is short, it is hardly affected by absorption by the wavelength conversion layer 24. Therefore, the light extraction efficiency is improved.

  Next, a method for manufacturing the light emitting device according to the fourth embodiment will be described with reference to FIGS. First, as shown in FIG. 10A, the light emitting element 11 is mounted on the mounting substrate 10 using the bumps 12. As shown in FIG. 10B, an uncured wavelength converting material 24 ′ is applied (dropped) on the upper surface of the light emitting element 11, and the transparent plate 1 is mounted as shown in FIG. As a result, the uncured wavelength conversion material 24 ′ maintains the surface tension while covering at least a part of the side surface of the light emitting element, thereby forming the inclined surface 130 that connects the side surface of the light emitting element 11 and the lower surface of the transparent plate 1. The At this time, if the amount of the wavelength converting material 24 ′ is small, a convex curved inclined surface 130 is formed on the light emitting element 11 side, and if the amount of the wavelength converting material 24 ′ is increased, a linear inclined surface 130 is formed. Further, when the amount of the wavelength conversion material 24 ′ is increased, an outwardly convex curved inclined surface 130 is formed.

  The wavelength conversion material 24 ′ is cured by a predetermined curing process to form the wavelength conversion layer 24. In addition, as long as the shape of the wavelength conversion layer 24 does not change in the subsequent steps, the wavelength conversion layer 24 may not be completely cured, but may be cured under a semi-cured condition.

  Next, an uncured diffuse reflection member 15 is prepared and filled in the space between the transparent plate 1 and the ring 16 as shown in FIG. Thereafter, the diffuse reflection member 15 is cured under predetermined conditions.

  In the manufacturing method described above, in the step of FIG. 10B, the uncured wavelength conversion material 24 ′ is applied to the upper surface of the light emitting element 11, but the manufacturing method of the present embodiment is not limited to this. . For example, the wavelength conversion material 24 ′ can be applied to the lower surface of the transparent plate 1, or the wavelength conversion material 24 ′ can be applied to both the upper surface of the light emitting element 11 and the lower surface of the transparent plate 1. With the light emitting element 11 mounted on the submount 10 facing downward, the wavelength conversion material 24 ′ is placed on the lower surface of the light emitting element 11, the upper surface of the transparent plate 1, or both the lower surface of the light emitting element 11 and the upper surface of the transparent plate 1. It is also possible to adopt a manufacturing method in which each is applied.

  In the light emitting device of Embodiment 4, the transparent plate 1 of Embodiment 2 or Embodiment 3 can be used as the transparent plate 1.

  In Embodiments 1 to 4 described above, a plate-like member having a wavelength conversion function such as phosphor ceramic or phosphor glass can be used instead of the transparent plate 1. Also in this case, the unevenness of chromaticity and the unevenness of luminance can be prevented by providing the surface 1a of the unevenness processing on the surface as in the first to fourth embodiments. By providing the edge 1b and the scooping-up agent application region 3, it is possible to prevent the uncured wavelength conversion resin or the uncured diffusion preventing member from scooping up on the upper surface of the plate-like member having the wavelength conversion function. In addition, when using the plate-shaped member provided with the wavelength conversion function, it is also possible to use a transparent material layer instead of the wavelength conversion layer.

  In the above-described first to fourth embodiments, the region 1 a where the unevenness is formed is provided only on the upper surface of the transparent plate 1, but it can also be provided on the lower surface of the transparent plate 1.

  In the first to fourth embodiments, the uneven shape of the region 1a of the transparent plate 1 may be a random rough surface or a shape in which specific unevenness such as a diffraction grating is repeated.

  The light-emitting device of the present invention can be used as a general light-emitting device having a wavelength conversion layer, such as general lighting or an automotive lamp.

DESCRIPTION OF SYMBOLS 1 ... Transparent board, 1a ... Concave processing area | region, 1b ... Smooth edge, 2 ... Area | region immediately above the element which has not performed uneven | corrugated processing, 3 ... Scooping agent application area | region, 10 ... Mounting board, 11 ... Light emitting element, 12 ... Bump, 15 ... Diffuse reflection member, 16 ... Ring, 24 ... Wavelength conversion layer, 130 ... Inclined surface

Claims (4)

A substrate, one or more light-emitting elements mounted on the substrate, a resin layer disposed on the light-emitting element, a plate-like member mounted on the resin layer, and the resin layer and the plate-like member And a reflective resin member filled around
The plate-like member includes a smooth edge region provided on the periphery of the upper surface, and an uneven processing region surrounded by the edge region,
The light-emitting device, wherein the reflective resin member covers the entire side surface of the plate-like member. A substrate, one or more light-emitting elements mounted on the substrate, a resin layer disposed on the light-emitting element, a plate-like member mounted on the resin layer, and the resin layer and the plate-like member And a reflective resin member filled around
The plate-like member includes a resin scooping prevention region provided on the periphery of the upper surface, and an uneven processing region surrounded by the resin scooping prevention region,
The reflective resin member covers the entire side surface of the plate member,
A light emitting device, wherein a layer of a material that repels an uncured resin is disposed in the resin creeping prevention region.   3. The light emitting device according to claim 1, wherein a smooth upper region is further provided on the upper surface of the plate-like member at a portion immediately above the light emitting element. A first step of covering the upper surface of the light emitting element mounted on the substrate with an uncured resin and disposing a plate member thereon;
A second step of covering the entire side surface of the plate-shaped member with the reflective resin material by filling the resin and the side surface of the plate-shaped member with a fluid reflective resin material in an uncured state; Have
A method of manufacturing a light-emitting device, wherein the plate-like member includes a resin scooping prevention region provided on a peripheral edge of an upper surface and a concavo-convex processing region surrounded by the resin scooping prevention region.

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