JP5514375B1 - Coil component and method for manufacturing coil component - Google Patents

Abstract

  The coil component of the present invention has a front surface and a back surface, a first coil element formed on the front surface, a second coil element formed on the back surface, and ends of the first coil element and the second coil element. A resin substrate having a connection hole for connecting the first and second coil elements and a magnetic material insertion hole that is formed in the center portion and the peripheral portion of the first coil element and the second coil element and penetrates from the front surface to the back surface. The pattern stamped on the front surface is filled with a conductor layer, the second coil element is filled with a pattern stamped on the back surface with a conductor layer, and the connection hole is near one end of the first coil element and the second coil element. It penetrates from the front surface to the back surface and is filled with a conductor layer. The resin substrate is surrounded by a magnetic material and molded, and the magnetic material is inserted into the magnetic material insertion hole to form a molded material.

Description

The present invention relates to a coil component and a manufacturing method thereof is produced in a resin base inner plate.

With the recent increase in functionality of mobile devices such as smartphones and tablet terminals, there is an increasing need for small coil components (power inductors) that can handle high rated currents.
As such a coil component, one produced using a transfer metal mold is known, and a metal mold having a reverse coil element pattern engraved on the surface is used, and this metal mold is obtained by electroplating. After the coil element is formed therein, the coil element is peeled off from the metal mold and transferred to a component substrate to obtain a coil component.

As a method that does not use a metal mold, after forming a plating resist pattern on a substrate, a coil element pattern is formed by electroplating, and after removing the plating resist pattern, it is transferred onto a sheet-like magnetic layer and coiled. What is made into parts is known.
Since all of the above methods form coil parts by transfer, there is a problem in that the conductor pattern is likely to fall down or drop off due to peeling / transfer of the coil elements.

On the other hand, Patent Document 1 also describes a method using a resin mold without using a metal mold. In this method, the coil element formed in the resin mold is used as it is without being transferred.
In Patent Document 2, a coil conductor composed of a conductor main portion and a conductor shade portion embedded in a photosensitive insulating resin portion is formed on a metal substrate, and then the metal plate is peeled off to form a coil conductor. Is described.

JP 2005-191408 A JP 2006-332147 A

The coil components described in Patent Documents 1 and 2 described above have a problem that since the thickness of one layer of the coil is large, when the laminated coil component is manufactured, the thickness is further increased. Further, the coil components described in Patent Documents 1 and 2 have a problem that since the magnetic body surrounding the coil element is not arranged, the inductance is low and the coil cannot function as a power inductor.
The present invention has been made to solve the above-described problems, and provides a coil component that uses a resin mold, can produce a coil element without peeling / transferring, and is thin and has high inductance. For the purpose.

  The said subject can be achieved by the following this invention.

  The coil component of the present invention has a front surface and a back surface, the first coil element formed by being wound on the surface from one end to the other end, and the other end from one end at a position corresponding to the first coil element on the back surface. A second coil element wound around the end, a connection hole for connecting one ends of the first coil element and the second coil element, and a central portion and a peripheral portion of the first coil element and the second coil element; The first coil element is patterned and engraved at a predetermined depth on the surface, and the pattern imprinted by electroplating is a conductor. The second coil element is filled with a layer, and is patterned and engraved at a predetermined depth on the back surface, and a pattern imprinted by electroplating is filled with a conductor layer, and the connection hole includes the first coil element and the second coil element. One end of coil element It penetrates from the front surface to the back surface in the vicinity, and is filled with a conductor layer by electroplating. The resin substrate is surrounded by a magnetic material and molded, and the magnetic material is inserted into the magnetic material insertion hole to form a molded material. The molded body is partially cut to expose the other ends of the first coil element and the second coil element, and is provided with an electrode lead portion.

  The coil component of the present invention has a first surface and a first back surface, and is formed on the first surface, patterned and stamped at a predetermined depth, and a pattern stamped by electroplating is a conductor layer. Embedded in the first coil element wound from one end to the other end, penetrating from the first surface to the first back surface in the vicinity of one end of the first coil element, filled with a conductor layer by electroplating, A first resin substrate having a first connection hole connected to one end of the first coil element, and a first magnetic body insertion hole penetrating from the first surface to the first back surface at the center and the periphery of the first coil element And a pattern having a second surface and a second back surface, formed at a position corresponding to the first coil element on the second surface, patterned and stamped at a predetermined depth, and patterned by electroplating. Wrapped from one end to the other, filled with a conductive layer A second connection hole penetrating from the second surface to the second back surface in the vicinity of one end of the second coil element, filled with a conductor layer by electroplating, and connected to one end of the second coil element; A second resin substrate having a second magnetic body insertion hole penetrating from the second surface to the second back surface at the center portion and the peripheral portion of the second coil element, and the first back surface and the second of the first resin substrate. The second back surfaces of the resin substrates are bonded together so that the first connection holes and the second connection holes coincide with each other, and the first resin substrate and the second resin substrate are surrounded and molded with a magnetic material. The insertion hole and the second magnetic body insertion hole are formed by inserting a magnetic body, and a part of the molded body is cut to expose the other ends of the first coil element and the second coil element. In addition, an electrode lead portion is provided.

  Furthermore, the coil component of the present invention is characterized in that the resin substrate is made of a thermosetting resin.

  Furthermore, the coil component of the present invention is characterized in that the first resin substrate and the second resin substrate are made of a thermosetting resin.

The method for manufacturing a coil component of the present invention includes a first surface having a first surface, a first back surface, a first depth formed by being engraved on the first surface and wound from one end to the other end. A first connection hole pattern having a second depth deeper than the first depth connected to one end of the first coil pattern, and a first connection hole pattern formed on the first surface, A first resin mold having a first magnetic body insertion hole pattern having a second depth formed by being stamped at the center and the periphery of one coil pattern, and having a second surface and a second back surface. A second coil pattern having a first depth formed by being stamped on the second surface and wound from one end to the other end, and a second coil pattern formed by being stamped on the second surface. A second connection hole pattern having a second depth connected to one end of the second connection hole; A first step of preparing a second resin mold having a second magnetic body insertion hole pattern formed on the center and the periphery of the second coil pattern on the surface and having a second depth; The first coil pattern and the first connection hole pattern formed in the first resin mold by electroplating, and the second coil pattern and the second connection hole pattern formed in the second resin mold are respectively conductive layers. A second step of fabricating a first resin substrate and a second resin substrate on which the first coil element and the second coil element are formed, and the first resin substrate and the second resin substrate are connected to the first back surface and the first resin substrate. 2 The third step of polishing from the back surface to expose the conductive layer of the first connection hole and the second connection hole, and the first step of the first resin substrate so that the exposed first connection hole and the second connection hole coincide with each other. 1. Adhere the back surface and the second back surface of the second resin substrate together 4 and steps, first forming a molded body filling the first resin substrate and the second resin substrate and the first magnetic body insertion hole surrounded by a magnetic second magnetic body insertion hole which is adhered a magnetic material and step 5, by cutting a portion of the molded body, and characterized in that the other end of the first coil element and the second coil element is exposed respectively, and a sixth step of providing an electrode lead portion To do.

In addition, the manufacture of the coil component according to the present invention has an inversion coil pattern having a first height engraved on the surface and wound from one end to the other end, and engraved on the surface and connected to one end of the inversion coil pattern. A reversal connection hole pattern having a second height higher than the first height, and a reversal magnetic material insertion hole pattern having a second height formed by being stamped at the center and the periphery of the reversal coil pattern on the surface A first step of preparing a first mold having: a second step of preparing a second mold comprising a mold defining a side wall and a mold defining a bottom surface; 1 mold is placed so that the reverse connection hole pattern is in close contact with the bottom surface of the second mold, a resin is injected into the second mold, filled in the first mold, and cured. A third step, a mold defining a sidewall of the first mold and the second mold, and A fourth step, a fifth step of forming a coil element and the connecting member to fill the connection hole pattern and the coil pattern with a conductive layer by electric plating, and stripping the mold defining the bottom of the resin to remove A first resin substrate on which a first coil element, a first connection body, and a first magnetic body insertion hole are formed by a first step to a sixth step, and a second coil element, A second resin substrate on which a second connection body and a second magnetic body insertion hole are formed is manufactured, and the back surface of the first resin substrate and the second resin substrate are arranged so that the first connection hole and the second connection hole coincide with each other. The back surfaces of the first and second resin substrates are bonded to each other, and the molded first resin substrate and the second resin substrate are surrounded by a magnetic material to form a molded body that fills the first magnetic material insertion hole and the second magnetic material insertion hole with the magnetic material. And cutting the part of the molded body to obtain the first coil element and The other end of the second coil element is exposed respectively, and providing a electrode lead portion.

  Furthermore, the manufacture of the coil component of the present invention is characterized in that the resin substrate is made of a thermosetting resin.

  Furthermore, the manufacture of the coil component of the present invention is characterized in that the first resin substrate and the second resin substrate are made of a thermosetting resin.

  According to the present invention, even if a resin mold used for manufacturing a coil element is left as it is as a resin substrate after the coil element is formed, the thickness of the coil component to be manufactured is sufficiently thin, and a high-inductance coil is inexpensive. Parts can be obtained.

The figure which shows the structure of the coil component 100 which concerns on one Example of this invention. The figure which shows the shape of the surface part of the resin substrate used for this invention. Process drawing which shows the process for obtaining the resin metal mold | die used by this invention. The figure which shows the process flow until a resin substrate is produced from the resin metal mold | die. The figure which made two resin substrates oppose on the back surfaces. Explanatory drawing of the back surface grinding | polishing of the resin substrate. The figure which bonded together the two resin substrates after back surface grinding | polishing. The figure which shows the cross-sectional shape of the molded object after a shaping | molding process. The process flow figure which shows the preparation procedure of the 1st metal mold | die used for 2nd Example. The figure which shows the structure of the 2nd metal mold | die used for 2nd Example. The manufacturing process flowchart of the resin substrate by 2nd Example. The figure which shows an example of the resin metal mold | die used for this invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
First, the structure of the coil component according to the present invention will be described.
The coil component according to the present invention has a structure in which a resin substrate on which a coil element is formed is surrounded by a magnetic material to form a molded body. A part of the molded body is cut to expose the electrode of the coil element formed on the resin substrate, and an electrode lead portion is provided. FIG. 1 is a diagram showing the structure of a coil component 100 according to an embodiment of the present invention. FIG. 1a is a perspective view showing a part of a molded part of a coil component after dicing, and FIG. 1b is a perspective view showing part of the molded part after cutting. FIG. 1c shows a coil element formed. It is a partially-cut perspective view which shows the structure of the resin substrate which is.

  In the present embodiment, the first resin substrate 20a having the first coil element 30a formed on the front surface and the second resin substrate 20b having the second coil element 30b formed on the front surface are adhered to each other on the back surface. The element 30a and the second coil element 30b are connected to each other at one end, but the first coil element 30a and the second coil element 30b are formed on the front and back surfaces of a single resin substrate 20a, respectively. Alternatively, the ends may be connected to each other.

FIG. 2 is a view showing the shape of the surface portion of the resin substrate 20 (20a, 20b), FIG. 2a is a top view of the first resin substrate 20a, and FIG. 2b is a top view of the second resin substrate 20b.
FIG. 1a shows a coil component 100 produced by cutting along broken lines X1-X1 ′, X2-X2 ′, Y1-Y1 ′, Y2-Y2 ′ shown in FIG.
As shown in FIGS. 1c and 2a, the first coil element 30a is formed in a spiral shape on the surface of the first resin substrate 20a from one end 33a to the other end 35a. The first coil element 30a has a structure in which a surface is patterned and stamped at a predetermined depth, and a pattern stamped by electroplating is filled with a conductor layer.
As shown in FIGS. 1c and 2b, the second coil element 30b is formed by being spirally wound from one end 33b to the other end 35b at a position corresponding to the first coil element 30a on the surface of the second resin substrate 20b. ing. Note winding direction of the winding direction and the second coil element 30b of the first coil element 30a is kept as the other also becomes the watch around if the same direction, i.e., one is clockwise each other. This is because when the first resin substrate 20a and the second resin substrate 20b are connected to each other in the later step, the winding direction of the current is the same direction.
In the vicinity of one end 33a and 33b of the first coil element 30a and the second coil element 30b, the surface penetrates from the front surface to the back surface, and is filled with a conductor layer by electroplating. The one end 33a of the first coil element 30a and the second coil element A first connection hole 40a and a second connection hole 40b are formed to be connected to one end 33b of 30b via a conductor layer.
Magnetic body insertion holes 50-1a, 50-2a,..., 50-8a and 50-1b, 50 penetrating from the front surface to the back surface in the central portion and the peripheral portion of the first coil element 30a and the second coil element 30b. -2b, ..., 50-8b. A magnetic material is inserted into the magnetic material insertion hole during molding.
The first resin substrate 20a and the second resin substrate 20b are surrounded by the magnetic body 10 in a state where the back surfaces thereof are bonded so that the first connection holes 40a and the second connection holes 40b coincide with each other, as shown in FIG. 1b. To be molded. Since a plurality of coil parts are arranged in a matrix at the time of molding, it is necessary to separate them into single coil parts. Therefore, dicing is performed by cutting along the broken lines X1-X1 ′, X2-X2 ′, Y1-Y1 ′, Y2-Y2 ′ shown in FIG.
As a result, the other ends 35a and 35b of the first coil element 30a and the second coil element 30b are exposed to the side walls of the magnetic body 10 as shown in FIG. 1a, thereby forming electrode lead portions. Next, an external electrode is attached to the electrode lead-out portion by a method such as solder dipping to form the coil component 100. The other end 35b is exposed on the side wall opposite to the other end 35a.

  In the coil component according to the present invention, the resin substrate 20 (20a, 20b) is used as it is even after the coil element 30 (30a, 30b) is formed. As the resin material, a thermosetting resin such as epoxy, phenol, polyimide, or polyurethane can be used. The electroplating for forming the conductive layer is preferably copper plating.

Next, the manufacturing method (1st Example) of the coil components of this invention is demonstrated.
In the present invention, actually, a plurality of coil parts are continuously produced in a matrix arrangement, and are separated by dicing after molding to form a single coil part. It is assumed that only the coil component is manufactured.

In the present invention, the coil element is formed using a resin mold made of a thermosetting material.
FIG. 3 is a diagram showing a process for obtaining a first resin mold 3a and a second resin mold 3b used for producing the first resin substrate 20a and the second resin substrate 20b used in the present invention. It is.
First, Si master molds 1a and 1b are manufactured using a material such as Si. A surface of the Si master mold 1a is stamped and formed, and is stamped and formed with a first coil pattern 300a having a first depth (d1) wound spirally from one end to the other end. The first connection hole pattern 400a having a second depth (d2) deeper than the first depth connected to one end of the first coil pattern 300a, and the center portion and the peripheral portion of the first coil pattern 300a are stamped. The first magnetic body insertion hole patterns 500-1a, 500-2a,..., 500-8a having the second depth (d2) are formed.
Similarly, the second coil pattern 300b, the second connection hole pattern 400b, and the second magnetic body insertion hole patterns 500-1b, 500-2b,..., 500-8b are also formed on the surface of the Si master mold 1b. Is formed.
Next, a mold release layer (release layer) (not shown) is formed on the pattern surfaces of the master molds 1a and 1b, and then the pattern is filled with Ni plating, and the Ni mother mold 2a composed of an inverted pattern is formed by a well-known transfer method. , 2b. Next, a thermosetting resin is poured into the reversal pattern of the Ni mother molds 2a and 2b, cured, and then peeled off from the Ni mother molds 2a and 2b to produce resin molds 3a and 3b as sun molds. To do. The resin molds 3a and 3b thus manufactured are imprinted with the same pattern as the pattern imprinted on the Si master molds 1a and 1b.

Next, a method for producing the resin substrate 20 (20a, 20b) using the resin molds 3a, 3b will be described.
FIG. 4 is a diagram showing a process flow from the resin mold 3a to the production of the first resin substrate 20a.
As shown in FIG. 4a, a coil pattern 300, a connection hole pattern 400, and a magnetic material insertion hole pattern 500 are engraved on the resin mold 3a.
The depth of the marking on the coil pattern 300 is d1, and the depths of the connection hole pattern 400 and the magnetic material insertion hole pattern 500 are d2, which is deeper than d1.
As a material of the resin mold 3a, a thermosetting resin such as epoxy, phenol, polyimide, and polyurethane is preferable.
In addition, as described above, the engraving of various patterns on the resin mold 3a is produced by transfer from the master mold, but can also be produced by imprinting or hot pressing on the resin surface.

Next, as shown in FIG. 4b, a metal seed film 601 is formed so as to cover the surface of the resin mold 3a in preparation for an electroforming (electroplating) process in a subsequent process. Cu, Sn, Ni, Ag, Al, or the like is used as the metal used for the metal seed film 601.
The metal seed film 601 can be formed by electroless plating of copper (Cu), nickel (Ni), or the like, or may be formed by vapor deposition, sputtering, or CVD.
Next, as shown in FIG. 4c, the metal seed film 601 in the region where the pattern is not formed and the region of the magnetic material insertion hole pattern 500 is removed. This is to prevent electrodeposition in these areas by subsequent solder plating.
Next, with the remaining metal seed film 601 as a base, as shown in FIG. 4d, the region where the coil pattern 300 is imprinted and the region where the connection hole pattern 400 is imprinted are filled by electroforming (electroplating). Copper (Cu) is electrodeposited to form the conductive film 602, and the coil element 30a and the connection body 40a are formed.
The electrodeposition of copper is performed until the region where the coil pattern 300 is imprinted is filled, and the surface thereof coincides with the surface of the resin mold 3a and becomes flat.
In the region where the connection hole pattern 400 is engraved, the electrodeposition ends at a position slightly lower than the surface of the resin mold 3a.
Thereby, the first resin substrate 20a in which the coil element 30a and the connection body 40a are formed on the resin mold 3a is completed. Note that one end of the coil element 30a and the connection body 40a are connected by a conductive layer formed by plating.

  The second resin substrate 20b to be bonded between the first resin substrate 20a and the back surface in a later step is also produced by the same method. FIG. 5 is a diagram in which the first resin substrate 20a and the second resin substrate 20b are opposed to each other on the back surfaces.

Next, a process of bonding the first resin substrate 20a and the second resin substrate 20b to each other on the back surfaces will be described. The first resin substrate 20a and the second resin substrate 20b are respectively polished from the back surface to remove the resin in the portions 22a and 22b indicated by the broken lines in FIG. 6, and the first connection body (conductive) in the first connection hole pattern 400a is removed. Layer) 40a and second connection body (conductive layer) 40b in second connection hole pattern 400b are exposed to the outside.
Accordingly, the first magnetic body insertion hole 500a and the second magnetic body insertion hole 500b become through holes that penetrate from the front surface to the back surface of the resin substrate.
Next, as shown in FIG. 7, the first resin substrate 20 a and the second resin substrate are bonded so that the first connection body 40 a in the first connection hole and the second connection body 40 b in the second connection hole coincide with each other. Adhere 20b.
As a result, the first coil element 30a and the second coil element 30b are electrically connected to each other through the connection bodies 40a and 40b.
Further, the first magnetic body insertion hole 500a and the second magnetic body insertion hole 500b are also through-holes that penetrate through the bonded resin substrate.
In addition, in order to make electrical connection with the 1st connection body 40a and the 2nd connection body 40b more reliable, after forming a solder bump in each exposed part, you may make it weld.

FIG. 1c shows a state where the two resin substrates are bonded to each other in this way.
Thereafter, the first resin substrate 20a and the second resin substrate 20b that are bonded together are surrounded by the magnetic body 10, and a molding process is performed in which the first magnetic body insertion hole 500a and the second magnetic body insertion hole 500b are filled with the magnetic body. . FIG. 8 is a diagram showing a cross-sectional shape of the molded body after the molding process.
Thereafter, a part of the molded body is cut along the broken line ZZ ′ shown in FIG. 8 to expose the other ends of the first coil element 30a and the second coil element 30b to form an electrode lead portion. .
The size of a single coil component manufactured according to the present invention is 2.5 mm (width) × 2.0 mm (depth) × 0.8 mm (thickness), the coil element has a line width of 40 μm, and a line interval. Was 50 μm.

Next, a manufacturing method (second embodiment) of a coil component according to another embodiment of the present invention will be described. The point that two resin substrates are used in the second embodiment and the process after the two resin substrates are bonded together are the same as those in the first embodiment described above. Will be described.
In the case of the first embodiment, it was necessary to polish the back surface after the resin substrate was produced. However, in the case of the second embodiment, it is not necessary to polish the back surface.

  In the second embodiment, the reverse coil pattern 350, the reverse connection hole pattern 450, and the reverse magnetic body insertion hole pattern 550 that are formed by reversing the coil pattern 300, the connection hole pattern 400, and the magnetic body insertion hole pattern 500 are the surfaces. A desired resin mold and resin can be obtained by using a combination of a first mold engraved on the second mold composed of a mold defining a side wall and a mold defining a bottom surface. A substrate is produced.

FIG. 9 is a process flow diagram showing a procedure for producing the first mold.
First, as shown in FIG. 9a, a coil pattern 300 having a depth d1, a connection hole pattern 400 having a depth d2, and a magnetic material insertion hole pattern 500 having a depth d2 are made of Ni, SUS, Ni alloy or the like imprinted on the surface. A metal mold 1 is prepared.
Next, as shown in FIG. 9 b, a release layer such as NiO is formed on the surface of the mold 1, and then Ni is laminated and transferred by electroplating to produce the Ni mold 2. Thereafter, the Ni mold 2 is peeled from the metal mold 1 to form a first mold 2 as shown in FIG. 9c.
As a result, a reverse coil pattern 350 having a height d1, a reverse connection hole pattern 450 having a height d2, and a reverse magnetic material insertion hole pattern 550 having a height d2 are formed on the surface of the first mold 2.

  FIG. 10 is a diagram showing the configuration of the second mold. The second mold is called a casting mold, and is formed by bonding a mold 4 that defines a side wall portion and a mold 3 that defines a bottom surface portion. The material of the casting mold 4 is not particularly limited, and may be a resin or a metal. The material of the casting mold 3 needs to have requirements such as low cost, that a seed layer for subsequent plating treatment can be formed on the surface thereof, and that it is thin in order to peel or dissolve. For this reason, it is preferable to use a resin such as acrylic.

FIG. 11 is a diagram showing a process flow for producing the resin substrate 5 using the first mold 2 shown in FIG. 9 and the second mold shown in FIG.
First, as shown in FIG. 11a, the first mold 2 is inserted into the second mold into which the casting resin film is poured, and the reverse connection hole pattern 450 and the reverse magnetic body insertion hole pattern are formed into the casting mold 3. It is placed so as to be in close contact with the bottom surface of and then pressed.
At that time, the reverse connection hole pattern 450 and the reverse magnetic material insertion hole pattern 550 need to be sufficiently adhered to the bottom surface portion of the casting mold 3 so that the resin F does not enter the adhesion portion. The resin F is uniformly filled in the recesses of the first mold 2 and then cured.
Thereafter, when the first mold 2 is removed, the resin mold 5 having the coil pattern 300, the connection hole pattern 400, and the magnetic material insertion hole pattern 500 is formed on the casting mold 3 as shown in FIG. Is done.
Thereafter, as shown in FIG. 11c, the casting mold 4 defining the side wall portion of the second mold is removed.

Next, as in the first embodiment, when a seed layer is formed in the region of the coil pattern 300 and the region of the connection hole pattern 400 and the pattern portion is filled with a conductive layer by electroplating, as shown in FIG. 30 and the connection body 40 are formed in the resin mold 5.
Finally, when the casting mold 3 is peeled from the resin mold 5, a resin substrate is completed as shown in FIG. 11e.

The subsequent steps are the same as those in the first embodiment shown in FIGS.
There are the following three methods for peeling the casting mold 3 from the resin mold 5.
(1) Peel off with physical force.
(2) A resin that is soluble in an organic solvent is used as the casting mold 3 and is dissolved in the solvent after the plating process is completed.
(3) The casting mold 3 has a two-layer structure of a metal plate and a thin resin sheet (or resin film) formed on the surface thereof, and after the metal plate is first peeled off, the resin film is peeled off or dissolved. To do.

  In both of the first and second embodiments described above, two resin substrates are bonded to each other on the back side, but it is also possible to carry out using a single resin substrate. At that time, the first coil pattern 300a, the first connection hole pattern 400a, the first magnetic material insertion hole pattern 500a, and the second coil pattern 300b are imprinted or hot pressed on the front and back surfaces as shown in FIG. A single resin mold 1000 engraved with the second connection hole pattern 400b and the second magnetic material insertion hole pattern 500b may be used.

100: Coil parts 10: Magnetic body 20: Resin substrate 30: Coil element 33a: Part of the first coil element 33b: Part of the second coil element 35a: The other end of the first coil element 35b: The second coil element The other end 40a: first connection hole 40b: second connection hole 50a: first magnetic body insertion hole 50b: second magnetic body insertion hole

Claims (8)

Having a front surface and a back surface;
A first coil element formed on the surface by being wound from one end to the other;
A second coil element formed by being wound from one end to the other end at a position corresponding to the first coil element on the back surface;
A connection hole for connecting the one ends of the first coil element and the second coil element;
A magnetic substrate insertion hole formed in a central part and a peripheral part of the first coil element and the second coil element and penetrating from the front surface to the back surface;
The first coil element is patterned and stamped at a predetermined depth on the surface, and the stamped pattern is filled with a conductor layer by electroplating,
The second coil element is patterned and engraved at a predetermined depth on the back surface, and the engraved pattern is filled with a conductor layer by electroplating,
The connection hole penetrates from the front surface to the back surface in the vicinity of the one end of the first coil element and the second coil element, and is filled with a conductor layer by electroplating,
The resin substrate is molded by being surrounded by a magnetic body, and the molded body is configured by inserting the magnetic body into the magnetic body insertion hole,
A coil component, wherein the molded body is partially cut to expose the other ends of the first coil element and the second coil element, respectively, and is provided with an electrode lead portion. Having a first surface and a first back surface;
A first coil element formed on the first surface, patterned and engraved at a predetermined depth, and wound from one end to the other end, wherein the engraved pattern is filled with a conductor layer by electroplating When;
A first connection hole penetrating from the first surface to the first back surface in the vicinity of the one end of the first coil element, filled with a conductor layer by electroplating, and connected to the one end of the first coil element; ;
A first resin substrate having a first magnetic body insertion hole penetrating from the first surface to the first back surface at a central portion and a peripheral portion of the first coil element;
Having a second surface and a second back surface;
Formed at a position corresponding to the first coil element on the second surface, patterned and engraved at a predetermined depth, and filled with a conductive layer by electroplating, from one end to the other end A wound second coil element;
A second connection hole penetrating from the second surface to the second back surface in the vicinity of the one end of the second coil element, filled with a conductor layer by electroplating, and connected to the one end of the second coil element; ;
A second magnetic substrate having a second magnetic body insertion hole penetrating from the second surface to the second back surface at a central portion and a peripheral portion of the second coil element;
The first back surface of the first resin substrate and the second back surface of the second resin substrate are bonded so that the first connection hole and the second connection hole coincide with each other, The second resin substrate is surrounded and molded with a magnetic body, and the first magnetic body insertion hole and the second magnetic body insertion hole are formed by inserting a magnetic body, and the molded body is partially The coil component is characterized in that the other end of each of the first coil element and the second coil element is exposed by being cut and an electrode lead-out portion is provided.   The coil component according to claim 1, wherein the resin substrate is made of a thermosetting resin.   The coil component according to claim 2, wherein the first resin substrate and the second resin substrate are made of a thermosetting resin. Having a first surface and a first back surface;
A first coil pattern formed on the first surface by being stamped and having a first depth wound from one end to the other;
A first connection hole pattern formed on the first surface by being stamped and having a second depth deeper than the first depth connected to the one end of the first coil pattern;
A first resin mold having a first magnetic body insertion hole pattern formed on the first surface of the first coil pattern by being engraved at a center portion and a peripheral portion of the first surface and having the second depth;
Having a second surface and a second back surface;
A second coil pattern having the first depth formed by being stamped on the second surface and wound from one end to the other;
A second connection hole pattern formed by being stamped on the second surface and having the second depth connected to the one end of the second coil pattern;
A second resin mold having a second magnetic body insertion hole pattern formed on the second surface and engraved at a center portion and a peripheral portion of the second coil pattern and having the second depth. A first step to prepare,
The first coil pattern and the first connection hole pattern formed in the first resin mold and the second coil pattern and the second connection hole formed in the second resin mold by electroplating. A second step of producing a first resin substrate and a second resin substrate on which the first coil element and the second coil element are formed by filling the pattern with a conductive layer,
A third step of polishing the first resin substrate and the second resin substrate from the first back surface and the second back surface, respectively, to expose the conductive layer of the first connection hole and the second connection hole;
A fourth step of bonding the first back surface of the first resin substrate and the second back surface of the second resin substrate so that the exposed first connection hole and the second connection hole coincide with each other;
A fifth molded body is formed in which the bonded first resin substrate and the second resin substrate are surrounded by a magnetic material, and the first magnetic material insertion hole and the second magnetic material insertion hole are filled with the magnetic material. And the steps
And a sixth step of exposing the other ends of the first coil element and the second coil element by cutting a part of the molded body and providing an electrode lead portion. Manufacturing method of coil parts. An inverted coil pattern having a first height imprinted on the surface and wound from one end to the other;
An inversion connection hole pattern having a second height higher than the first height stamped on the surface and connected to the one end of the inversion coil pattern;
A first step of preparing a first mold having: a reversed magnetic material insertion hole pattern formed by being stamped at a central portion and a peripheral portion of the reverse coil pattern on the surface and having the second height; ,
A second step of preparing a second mold comprising a mold that defines a side wall and a mold that defines a bottom surface;
The first mold is placed so that the reverse connection hole pattern is in close contact with the bottom surface portion of the second mold, a resin is injected into the second mold, and the first mold A third step of filling and curing inside,
A fourth step of removing the first mold and the mold defining the side wall portion of the second mold;
A fifth step of forming a coil element and the connecting member by electric plating to fill the said connecting hole pattern and the coil pattern with a conductive layer,
A sixth step of peeling a mold defining the bottom portion to form a resin substrate,
Through the first step to the sixth step,
A first resin substrate on which a first coil element, a first connection body and a first magnetic body insertion hole are formed, and a second resin substrate on which a second coil element, a second connection body and a second magnetic body insertion hole are formed; Make
Adhering the back surface of the first resin substrate and the back surfaces of the second resin substrate so that the first connection hole and the second connection hole coincide,
Forming a molded body that surrounds the bonded first resin substrate and the second resin substrate with a magnetic material and fills the first magnetic material insertion hole and the second magnetic material insertion hole with the magnetic material;
A method of manufacturing a coil component, comprising: cutting a part of the molded body to expose the other ends of the first coil element and the second coil element, and providing an electrode lead portion.   The method according to claim 5, wherein the resin substrate is made of a thermosetting resin.   The method according to claim 6, wherein the first resin substrate and the second resin substrate are made of a thermosetting resin.

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