JP5514044B2 - Method for producing antiglare film and method for producing mold for production of antiglare film - Google Patents

Description

  The present invention relates to a method for producing an antiglare film having low anti-glare properties while having low haze, and a method for producing a metal mold for obtaining such an antiglare film.

  In an image display device such as a liquid crystal display, a plasma display panel, a cathode ray tube (CRT) display, an organic electroluminescence (EL) display, and the like, when external light is reflected on the display surface, visibility is significantly impaired. In order to prevent such reflection of external light, TVs and personal computers that emphasize image quality, video cameras and digital cameras used outdoors with strong external light, mobile phones that display using reflected light, etc. In the conventional art, a film layer for preventing external light from being reflected is provided on the surface of the image display device. This film layer consists of a film that has been subjected to anti-reflection treatment using interference by the optical multilayer film, and anti-glare treatment that scatters incident light by blurring the incident light by forming fine irregularities on the surface. It is divided roughly into the thing which consists of the film which was given. Among these, the former non-reflective film needs to form a multilayer film having a uniform optical film thickness, and thus increases the cost. On the other hand, since the latter anti-glare film can be produced at a relatively low cost, it is widely used in applications such as large personal computers and monitors.

  Conventionally, such an antiglare film has a random unevenness on the sheet by, for example, applying a resin solution in which fine particles are dispersed on a base sheet, adjusting the coating thickness, and exposing the fine particles to the coating film surface. It is manufactured by the method to form in. However, the antiglare film produced by dispersing such fine particles has irregularities as intended because the arrangement and shape of the irregularities depend on the dispersion state and application state of the fine particles in the resin solution. There is a problem that it is difficult to obtain and a sufficient anti-glare effect cannot be obtained if the haze is low. Furthermore, when such a conventional anti-glare film is disposed on the surface of the image display device, the entire display surface becomes whitish due to scattered light, and the display becomes cloudy, so-called “whiteness” is likely to occur. There was a problem. Also, with the recent high definition of image display devices, the pixels of the image display device interfere with the surface uneven shape of the anti-glare film, resulting in a so-called “glare” phenomenon in which a luminance distribution is generated and becomes difficult to see. There was also a problem that was likely to occur. In order to eliminate glare, there is an attempt to scatter light by providing a refractive index difference between the binder resin and the dispersed fine particles, but when such an antiglare film is disposed on the surface of the image display device, There is also a problem that the contrast tends to decrease due to light scattering at the interface between the fine particles and the binder resin.

  On the other hand, there is also an attempt to develop anti-glare properties only by fine irregularities formed on the surface of the transparent resin layer without containing fine particles. For example, in Japanese Patent Application Laid-Open No. 2007-237541 (Patent Document 1), the surface of a metal substrate is subjected to copper plating or nickel plating, the plated surface is polished, and fine particles are applied to the polished surface to form irregularities, After performing the process of dulling the uneven shape, the surface having a fine unevenness is produced by applying chrome plating to the uneven surface, and the uneven shape of the roll is transferred to the transparent resin film on the surface. It describes that an antiglare film having a fine uneven shape is produced. The method of forming random unevenness on the sheet by transferring the uneven shape of the roll increases the contrast because it does not contain fine particles, and also forms random unevenness on the sheet with good reproducibility. There is an advantage that you can.

JP 2007-237541 A JP 2010-76385 A

  In the method for producing an antiglare film by transferring the uneven shape of the roll, the uneven shape of the roll determines the characteristics of the antiglare film, and therefore it is necessary to accurately produce the desired uneven shape on the roll. However, since the method described in Patent Document 1 forms a concavo-convex shape by sand blasting, the distribution of the concavo-convex diameter resulting from the particle size distribution of the blast particles is generated, and the depth of the dent obtained by blasting is controlled. It was difficult to obtain the shape of the unevenness excellent in the antiglare function with good reproducibility. That is, it has been difficult to achieve a sufficient antiglare effect, whitening suppression, high contrast, and glare suppression. In particular, a relatively large uneven shape having a period of 50 μm or more is produced on the surface uneven shape, and as a result, the large uneven shape and pixels of the image display device interfere with each other, resulting in a luminance distribution that is difficult to see. There was a problem that so-called glare was likely to occur.

  In JP 2010-76385 A (Patent Document 2), the surface of a mold substrate is subjected to copper plating or nickel plating, the plated surface is polished, and a photosensitive resin film is applied to the polished surface. After that, the pattern is exposed on the photosensitive resin film, the exposed photosensitive resin film is developed, and etching is performed using the developed photosensitive resin film as a mask so that unevenness is formed on the polished plated surface. After the formation, the photosensitive resin film is completely removed, and further etching treatment is performed to dull the previously formed uneven surface, and the dull uneven surface is subjected to chromium plating so that fine unevenness is formed on the surface. A method for producing a roll having a roll is described. According to this method, it is possible to accurately control the period of the surface uneven shape, but since the relationship between the steps is not specifically described, the uneven shape required for the antiglare film is not described. It was difficult to obtain the height difference and the inclination angle.

  Therefore, the object of the present invention is to prevent a decrease in visibility due to whitish while exhibiting a high anti-glare effect, and does not cause glare when placed on the surface of a high-definition image display device, and has a contrast. Provided is a method capable of accurately producing a mold having fine irregularities on the surface, which is useful for the production of an anti-glare film that does not deteriorate, and further produces an excellent anti-glare film using the mold. Is to provide a method.

  The mold manufacturing method of the present invention includes a polishing step for polishing the surface of a mold base, a first uneven surface forming step for forming a first uneven surface including a flat portion and a recess on the polished surface, Including a second uneven surface forming step for forming the second uneven surface by dulling the first uneven surface by an etching process, and a plating step for performing chrome plating on the formed second uneven surface, The area occupied by the portion is A (%), the average depth of the recess is B (μm), the average value of the linear distance between the centers of the recesses is C (μm), and the etching depth in the second uneven surface forming step is When D (μm), the following condition is satisfied.

  In the mold manufacturing method of the present invention, it is preferable that the chromium plating layer formed by the second plating step has a thickness of 1 to 10 μm.

  In the first uneven surface forming step in the mold manufacturing method of the present invention, it is preferable to form the first uneven surface by any one of the following methods (1) to (3).

  (1) A photosensitive resin film coating process for coating and forming a photosensitive resin film on the polished surface, an exposure process for exposing a pattern on the photosensitive resin film, and developing the photosensitive resin film on which the pattern is exposed A developing step, an etching step of performing an etching process using the developed photosensitive resin film as a mask and forming irregularities on the polished plated surface, and a photosensitive resin film peeling step of peeling the photosensitive resin film after the etching process (1st preferable 1st uneven surface formation process).

  (2) It comprises a cutting step in which a recess is formed on the polished surface by cutting, and the cutting moves relatively linearly in a direction parallel to the surface of the mold base, and simultaneously with the linear movement, the mold A method (second preferable first uneven surface forming step) performed by a cutting tool that reciprocally moves in a direction perpendicular to the surface of the substrate for use.

  (3) A colored paint application process for applying a colored paint on the polished surface to form a colored paint film, a laser irradiation process for drawing a pattern on the colored paint film by a laser, and a colored paint film on which the pattern is drawn A method including an etching process for forming irregularities on the polished plated surface and a colored coating film peeling process for stripping the colored coating film after the etching process (third preferred first irregular surface formation) Process).

  The present invention also provides a method for producing an antiglare film, comprising producing the above-described mold, transferring the uneven surface of the mold onto a transparent substrate, and then peeling the transparent substrate having the transferred uneven surface from the mold. Also provide about.

  According to the mold manufacturing method of the present invention, since a fine uneven shape is accurately formed on the surface, a mold that is useful for manufacturing an antiglare film exhibiting a high antiglare function can be reproduced. Well, it can be manufactured with almost no defects. Furthermore, according to the method for producing an antiglare film of the present invention, the haze is low, while maintaining the brightness of the display image, preventing reflection and reflection, suppressing whitening, preventing glare generation, preventing contrast reduction, etc. An antiglare film excellent in antiglare performance can be produced industrially advantageously.

It is a figure which shows typically a preferable example of the manufacturing method of the metal mold | die of this invention. It is a figure which shows typically the state which observed the 1st uneven surface from upper direction. It is a figure which shows typically the cross section of a 1st uneven surface. It is a figure which shows the result of having observed the 1st uneven surface with the microscope from upper direction. It is a figure which shows the cross section in y = 0 of the autocorrelation function R (x, y) calculated from the microscope image of the 1st uneven surface of FIG. It is a figure which shows typically a preferable example of a 1st uneven surface formation process. It is a figure which shows typically the pattern exposed on the photosensitive resin film. It is a figure which shows typically a preferable example of a 1st uneven surface formation process. The figure which shows typically the mode of the cutting tool which carries out a linear reciprocation to the direction perpendicular | vertical to the surface of the mold base material simultaneously with a linear movement relatively to the direction parallel to the surface of the mold base material. It is. It is a figure which shows typically the apparatus for cutting a fine recessed part in the flat base material for metal mold | dies. It is a figure which shows typically the apparatus for cutting a micro recessed part in a cylindrical base material for metal mold | die. It is a figure which shows typically a preferable example of a 1st uneven surface formation process. It is a figure which shows typically a mode that a 1st uneven surface becomes dull by an etching process, and becomes a 2nd uneven surface. It is a figure which shows the pattern used in the case of metal mold | die preparation of Example 1. FIG.

<Manufacturing method of mold>
FIG. 1 is a diagram schematically showing a preferred example of the mold manufacturing method of the present invention. FIG. 1 schematically shows a cross section of a mold in each step. The mold manufacturing method of the present invention basically includes [1] polishing step, [2] first uneven surface forming step, [3] second uneven surface forming step, and [4] plating step. . Hereafter, each process of the manufacturing method of the metal mold | die of this invention is demonstrated in detail, referring FIG.

[1] Polishing Step In the mold manufacturing method of the present invention, first, the surface of the base material used for the mold is polished. It is preferable that the base material surface is grind | polished in the state close | similar to a mirror surface through the said process. This is because the metal plate or metal roll serving as a base material is often subjected to machining such as cutting or grinding in order to obtain a desired accuracy, and as a result, the processing surface remains on the base material surface. Because. Further, as described later, even if the base material used for the mold is in a state where copper plating or nickel plating is applied to the surface, the above-mentioned processed eyes may remain, and in the plated state, the surface may be This is because it is not always smooth. That is, even if a process described later is performed on the surface where such deep processed marks remain, unevenness such as processed marks may be deeper than the unevenness formed after each process is performed. Such effects may remain, and when an antiglare film is produced using such a mold, the optical characteristics may be unexpectedly affected. FIG. 1A schematically shows a state in which a flat mold base 1 has a mirror-polished surface 2 by a polishing process.

  The method for polishing the surface of the substrate used in the mold is not particularly limited, and any of mechanical polishing, electrolytic polishing, and chemical polishing can be used. Examples of the mechanical polishing method include super finishing, lapping, fluid polishing, and buff polishing. Moreover, it is good also considering the surface 2 of the base material 1 for metal mold | die as a mirror surface by carrying out mirror surface cutting using a cutting tool in a grinding | polishing process. The material and shape of the cutting tool at that time are not particularly limited, and carbide tools, CBN tools, ceramic tools, diamond tools, etc. can be used, but diamond tools should be used from the viewpoint of processing accuracy. Is preferred. The surface roughness after the polishing step is preferably such that the center line average roughness Ra conforming to the provisions of JIS B 0601 is 0.1 μm or less, and more preferably 0.05 μm or less. If the center line average roughness Ra after polishing is greater than 0.1 μm, the final unevenness of the mold surface may be affected by the surface roughness after polishing, which is not preferable. In addition, the lower limit of the center line average roughness Ra is not particularly limited, and there is no limit in particular because there is a natural limit from the viewpoint of processing time and processing cost.

  In the metal mold manufacturing method of the present invention, examples of the metal material suitably used for forming the base material include aluminum and iron from the viewpoint of cost. Furthermore, lightweight aluminum is more preferable from the convenience of handling. The aluminum and iron here may be pure metals, respectively, or may be an alloy mainly composed of aluminum or iron.

  The shape of the substrate is not particularly limited as long as it is an appropriate shape that has been conventionally employed in this field, and may be a flat plate shape, or a columnar or cylindrical roll. If a mold is produced using a roll-shaped substrate, there is an advantage that the antiglare film can be produced in a continuous roll shape.

  Furthermore, in the manufacturing method of the metal mold | die of this invention, it is also preferable to plate on the surface of the base material used for a metal mold | die before a grinding | polishing process. The type of plating applied to the surface of the base material used for the mold is not particularly limited as long as it has good workability in the first uneven surface forming step, and examples thereof include copper plating, nickel plating, and zinc plating. It is done. Among these, copper plating or nickel plating is preferable from the viewpoints of workability, coverage, and smoothing action. This is because copper plating or nickel plating has a high covering property and a strong smoothing action, so that a flat and glossy surface is formed by filling minute irregularities and voids of the mold base.

  As used herein, copper or nickel may be a pure metal, or may be an alloy mainly composed of copper, or an alloy mainly composed of nickel. Therefore, “copper” referred to in the present specification. Is meant to include copper and copper alloys, and “nickel” is meant to include nickel and nickel alloys. Copper plating and nickel plating may be performed by electrolytic plating or electroless plating, respectively, but if copper plating is used, electrolytic plating is usually adopted, and if nickel plating, usually electroless plating is adopted. .

  When plating is performed on the surface of the mold base material, if the plating layer is too thin, the influence of the base surface cannot be completely eliminated. Therefore, the thickness is preferably 50 μm or more. Although the upper limit of the plating layer thickness is not critical, generally about 500 μm is sufficient from the viewpoint of cost and the like.

  Hereinafter, both the case where the surface of the substrate used for the mold is not plated and the case where the surface of the substrate used for the mold is plated are referred to as a mold substrate or a substrate.

[2] First Irregular Surface Formation Step In the subsequent first uneven surface formation step, a first uneven surface comprising a flat portion and a concave portion is formed on the surface 2 of the substrate 1 that has been mirror-polished by the above-described polishing step. FIG. 1B schematically shows a state in which the concave portion 3 is formed on the surface 2 of the substrate 1 and the first concave and convex surface 4 including the flat portion 5 and the concave portion 3 is formed.

  In the mold manufacturing method of the present invention, the ratio of the area occupied by the flat portion of the first concavo-convex surface is A (%), the depth of the recess is B (μm), and the average value of the linear distance between the centers of the recesses Is C (μm), it is preferable to satisfy the conditions of the above-mentioned formulas (1) to (3).

  Here, the area ratio A occupied by the flat portion 5 refers to the ratio of the area of the flat portion to the mold base projection surface when the first uneven surface is observed from above. FIG. 2 is a schematic diagram illustrating a state in which the first uneven surface is observed from above. In FIG. 2, the concave portion 3 is shown in gray, and the flat portion 5 is shown in white. In the case shown in FIG. 2, the area ratio A occupied by the flat portion 5 can be expressed by the following equation.

(Ratio A of area occupied by flat portion) = (area of white region) / [(area of white region) + (area of gray region)] × 100 Formula (5)
In the mold manufacturing method of the present invention, it is preferable that the ratio A of the area occupied by the flat portion 5 formed on the first uneven surface satisfies the formula (1). FIG. 3 is a diagram schematically showing a cross section of the first uneven surface. As shown in FIG. 3, when the linear distance of one flat portion 5 and the linear distance of one concave portion 3 formed on the first uneven surface are X and Y, respectively, the first uneven surface is formed with high accuracy. Therefore, it is preferable that the average value X _AVE of X and the average value Y _AVE of Y are both 10 μm or more. When each average value X _AVE or Y _AVE is less than 10 μm, the influence of slight fluctuations in the linear distance X or Y increases, resulting in unexpected unevenness in the resulting surface shape. It is. Here, the average value X _AVE of the straight line distance X of one flat part and the average value Y _AVE of the straight line distance Y of a certain concave part are the ratio A of the area occupied by the flat part and the linear distance between the centers between the concave parts described later. The average value C can be used to express as follows.

Since the average values X _AVE and Y _{AVE of} these linear distances are both 10 μm or more, the condition of formula (1) is obtained.

  The depth B of the recess means a difference in height between the flat portion and the deepest portion of the recess as shown in FIG. In the manufacturing method of the metal mold | die of this invention, it is preferable that the depth B of a recessed part satisfy | fills Formula (2). When the depth B of the recess is less than 2 μm, the first uneven surface is in a substantially flat state, and the surface uneven shape is sufficiently formed when the surface shape is blunted in the second uneven surface forming step. Will not be. The antiglare film produced from such a mold also has an insufficient antiglare effect due to insufficient surface irregularity. On the other hand, when the depth B of the recess exceeds 10 μm, the etching rate of the recess and the flat portion is different in the subsequent second uneven surface forming step, making it difficult to form an appropriate second uneven surface. Therefore, it is not preferable. That is, the deepest concave portion is not sufficiently etched, and the first surface uneven shape is not effectively blunted, and a portion having a steep inclination angle remains in the second surface uneven shape. The antiglare film produced from such a mold also has a portion having a steep inclination angle in the surface irregularity shape, resulting in whitening.

In addition, the average value C of the center-to-center linear distances of the recesses means the average value of the linear distances (intervals) between the center points on the bottom surface of the nearest recess, and a microscope image obtained by observing the first uneven surface from above or It can be obtained by image analysis of a pattern to be described later. That is, first, the microscopic image or pattern is converted into binary image data of two gradations so that the concave portion and the flat portion can be distinguished. The resulting image gradation two-dimensional function h (x, y) of the data expressed in the resulting two-dimensional function h (x, y) to Fourier transform the two-dimensional function H (f _x, f _y) a calculate. Then, two-dimensional function H (f _x, f _y) obtained by inverse Fourier transform of the power spectrum obtained by squaring the calculating the autocorrelation function R (x, y). In this autocorrelation function R (x, y), the maximum value closest to the origin is the average value of the linear distance between the centers of the recesses. Here, since the first uneven surface formed in the mold manufacturing method of the present invention has concave portions formed randomly as described later, the autocorrelation function R (x, y) is symmetrical about the origin. Become. Therefore, the maximum value closest to the origin can be obtained from the cross section passing through the origin in the autocorrelation function R (x, y). Here, x and y are (a horizontal direction, the vertical y-direction image data in the example x-direction image data) orthogonal coordinates represents the image data plane, f _x and f _y are frequency in the x direction and It represents the frequency in the y direction.

Actually, the two-dimensional function h (x, y) indicating the gradation of the image data is a discrete function because the gradation for each pixel is obtained as a set of discrete data points. Therefore, to calculate the discrete function H (f _x, f _y) by a discrete Fourier transform defined by equation (8), discrete function H (f _x, f _y) power spectrum by squaring the H ² (f _x , F _y ). The power spectrum ^{_{H 2 (f x, f y}} ) and the autocorrelation function, R (x, y) by the inverse discrete Fourier transform defined by equation (9) is obtained. Here, π in the formulas (8) and (9) is a pi, and i is an imaginary unit. M is the number of pixels in the x direction, N is the number of pixels in the y direction, j is an integer from 0 to M−1, k is an integer from 0 to N−1, and l is It is an integer from 0 to M-1, and m is an integer from 0 to N-1. Furthermore, Delta] f _x and Delta] f _y are frequency intervals of the x and y directions, it is defined by equation (10) and (11). Here, Δx and Δy in the equations (10) and (11) are the pixel intervals in the x and y directions, respectively.

  FIG. 4 shows an example of a microscope image obtained by observing the first uneven surface from above. FIG. 5 shows a cross section of y = 0 in the autocorrelation function R (x, y) calculated from the microscope image of FIG. FIG. 5 shows that the average value C of the average distance between the centers of the recesses is 31 μm.

  Here, it is preferable that the fine uneven surface of the antiglare film does not contain a long-period component of 50 μm or more from the viewpoint of suppressing glare generated by the fine uneven surface of the antiglare film. However, an excellent antiglare performance is not exhibited on a fine uneven surface containing only a short period component of 10 μm or less. Therefore, the fine uneven surface of the antiglare film preferably includes a surface shape having a period of 10 to 50 μm as a main component in order to sufficiently prevent glare while exhibiting a sufficient antiglare effect. Therefore, it is preferable that the metal mold | die for manufacturing the glare-proof film which fully prevents glare while expressing sufficient anti-glare effect contains the surface shape with a period of 10-50 micrometers as a main component. When the average value C of the center-to-center linear distance between the recesses exceeds 35 μm, a fine uneven surface shape having a period of 50 μm or more is likely to be formed on the resulting mold, and as a result, the resulting antiglare film is highly enhanced. Glare will occur when placed on the surface of a fine image display device. Moreover, when the average value C of the center-to-center linear distance between the recesses is less than 15 μm, the resulting mold contains a lot of short-period components with a period of 10 μm or less, and the resulting antiglare film is excellent. Anti-glare performance does not appear. Therefore, it is preferable that the average value C of the center-to-center linear distance between the recesses satisfies the condition of the expression (3).

  The first concavo-convex surface forming step is not particularly limited as long as the flat portion and the concave portion are formed with high accuracy, but in order to manufacture the flat portion and the concave portion with high accuracy and reproducibility, any of the following methods Is preferably used.

[2-1] First Preferred First Irregular Surface Forming Step The first preferred first irregular surface forming step includes [2-1-1] photosensitive resin film coating step and [2-1-2] exposure. The process basically includes a [2-1-3] development process, a [2-1-4] etching process, and a [2-1-5] photosensitive resin film peeling process. FIG. 6 is a diagram schematically showing a first preferable first uneven surface forming step in the method for manufacturing a mold of the present invention. FIG. 6 schematically shows a cross section of the mold in each step.

[2-1-1] Photosensitive resin film coating step In the photosensitive resin film coating step, the photosensitive resin is applied as a solution in which the photosensitive resin is dissolved in a solvent to the surface 2 of the substrate 1 that has been mirror-polished by the polishing step described above. Then, a photosensitive resin film is formed by heating and drying. FIG. 6A schematically shows a state where the photosensitive resin film 6 is formed on the surface 2 of the substrate 1.

  A conventionally known photosensitive resin can be used as the photosensitive resin. For example, a negative photosensitive resin having a property of curing the photosensitive part includes an acrylic ester monomer or prepolymer having an acrylic group or a methacrylic group in the molecule, a mixture of bisazide and diene rubber, polyvinyl thinner. Mart compounds and the like can be used. In addition, as a positive photosensitive resin having a property that a photosensitive portion is eluted by development and only an unexposed portion remains, a phenol resin type or a novolac resin type can be used. Moreover, you may mix | blend various additives, such as a sensitizer, a development accelerator, an adhesiveness modifier, and a coating property improving agent, with a photosensitive resin as needed.

  When these photosensitive resins are applied to the surface 2 of the substrate 1, in order to form a good coating film, it is preferable to dilute and apply in an appropriate solvent. Cellosolve solvents, propylene glycol solvents An ester solvent, an alcohol solvent, a ketone solvent, a highly polar solvent, or the like can be used.

  As a method for applying the photosensitive resin solution, known methods such as meniscus coating, fountain coating, dip coating, spin coating, roll coating, wire bar coating, air knife coating, blade coating, curtain coating, ring coating, etc. are used. Among these methods, methods such as spin coating, roll coating, wire bar coating, and ring coating that can easily adjust coating conditions are preferably used.

  The thickness of the photosensitive resin film formed in the photosensitive resin film coating step is preferably in the range of 1 to 6 μm after drying. The coefficient of variation of the thickness of the photosensitive resin film is preferably less than 10%. Here, the coefficient of variation in the thickness of the photosensitive resin film is defined as the standard deviation of the thickness of the photosensitive resin film divided by the average thickness of the photosensitive resin film. The variation coefficient of the thickness of the photosensitive resin film being 10% or more indicates that the variation of the thickness of the photosensitive resin film is large. When the thickness of the photosensitive resin film is different, the sensitivity in the exposure process changes, and the development time in the development process also changes. Therefore, when the variation in the thickness of the photosensitive resin film is large, unevenness depending on the variation in the thickness of the photosensitive resin film occurs in the photosensitive resin film remaining on the surface of the mold base after the development process. This unevenness also causes unevenness in the final mold. The coefficient of variation in the thickness of the photosensitive resin film is obtained by measuring three or more thicknesses of the photosensitive resin film 6 formed on the surface 2 of the mold substrate 1 and calculating the average value and standard deviation. Can be sought. Here, in order to obtain the coefficient of variation with high accuracy, the thickness of the photosensitive resin film 6 is preferably measured at 10 or more locations.

  In order to make the variation coefficient of the thickness of the photosensitive resin film less than 10%, the leveling property of the solution in which the photosensitive resin is dissolved in the solvent is adjusted with a leveling agent, the dilution rate with the solvent is adjusted, This can be achieved by adjusting the coating method and the coating conditions in doing so.

  Leveling agents that are added to a solution in which a photosensitive resin is dissolved in a solvent include alkyl-modified silicone oil, polyether-modified silicone oil, epoxy-modified silicone oil, amino-modified silicone oil, carboxy-modified silicone oil, carbinol-modified silicone oil, alkoxy Organically modified silicone oils such as modified silicone oils, double-end modified silicone oils, polyester modified silicone oils, aralkyl modified silicone oils and acrylic silicone oils can be preferably used. Examples of such organically modified silicone oil include, for example, alkyl-modified silicone oils “SH203”, “SH230”, “SF8416”, “BY16-846”, “FZ-49” manufactured by Toray Dow Corning, polyether modified silicone Oils “FZ-77”, “FZ-2105”, “SH 3746”, “FZ-2118”, “FZ-7604”, “FZ-2161”, “SH 3771”, “FZ-2162”, “FZ-” 2203 "," FZ-2207 "," FZ-2208 ", epoxy-modified silicone oils" FZ-3720 "," BY 16-839 "," SF 8411 "," SF 8413 "," SF 8421 "," BY 16 " -876 "," FZ-3736 "," BY 16-855D ", amino-modified silicone oil" “FZ-3707”, “FZ-3504”, “BY 16-205”, “FZ-3760”, “FZ-3705”, “BY 16-209”, “FZ-3710”, “SF 8417”, “BY” 16-849 "," BY 16-850 "," BY 16-879 B "," BY 16-892 "," FZ-3501 "," FZ-3785 "," BY 16-872 "," BY 16- 213 "," BY 16-203 "," BY 16-898 "," BY 16-890 "," BY 16-878 "," BY 16-891 "," BY 16-893 "," FZ-3789 " Carboxy modified silicone “BY 16-880”, carbinol modified silicone oil “SF 8428”, alkoxy modified silicone oil “FZ-3704”, “BY 1” -606 ", both-end modified silicone oils" BY 16-871 "," BY 16-853 "," BY 16-201 "," BY 16-004 "," SF-8427 "," BY 16-799 ", “BY 16-752”, polyether modified silicone oils “BYK-300 / 302”, “BYK-306”, “BYK-307”, “BYK-320”, “BYK-325” manufactured by BYK Japan , “BYK-330”, “BYK-331”, “BYK-333”, “BYK-337”, “BYK-341”, “BYK-344”, “BYK-345 / 346”, “BYK-347”, “BYK-348”, “BYK-375”, “BYK-377”, “BYK-378”, “BYK-UV3500”, “BYK-UV3510” ”, Polyester-modified silicone oils“ BYK-310 ”,“ BYK-315 ”,“ BYK-370 ”,“ BYK-UV3570 ”, aralkyl-modified silicone oils“ BYK-322 ”,“ BYK-323 ”, acrylic silicone oil “BYK-350”, “BYK-352”, “BYK-354”, “BYK-355”, “BYK-358N / 361N”, “BYK-380N”, “BYK-381”, “BYK-392”, etc. Is mentioned. These surface conditioners may be used alone or in combination of two or more. Moreover, it is preferable that the addition amount of the leveling agent added to the solution which melt | dissolved photosensitive resin in the solvent is 0.1-5 weight part with respect to 100 weight part of photosensitive resin.

  The weight fraction of the photosensitive resin in a solution obtained by dissolving the photosensitive resin in a solvent is preferably 5 to 50% by weight, and more preferably 10 to 30% by weight. When the weight fraction exceeds 50% by weight, the leveling property when the photosensitive resin solution is applied and dried is insufficient, and the variation coefficient of the thickness of the photosensitive resin film may be increased. On the other hand, when the weight fraction is less than 5% by weight, dripping or the like may occur when the photosensitive resin solution is applied and dried, and the variation coefficient of the thickness of the photosensitive resin film may increase. . As the solvent for dissolving the photosensitive resin, those described above are preferably used.

  The coating method and coating conditions of the photosensitive resin solution for setting the coefficient of variation of the thickness of the photosensitive resin film to less than 10% vary depending on the physical properties of the photosensitive resin solution. As a method, methods such as spin coating, roll coating, wire bar coating, and ring coating, which can easily adjust coating conditions, are preferably used. In this case, the relative movement speed of the coating head is preferably 0.5 to 300 mm / sec. Moreover, it is preferable that the heating or drying temperature after apply | coating the photosensitive resin solution is 20-80 degreeC, More preferably, it is 25-40 degreeC. When the heating or drying temperature is lower than 20 ° C., the drying time becomes long, and there is a high possibility that dripping occurs during drying. On the other hand, when the heating or drying temperature exceeds 80 ° C., the drying time is shortened, the leveling effect during drying is not exhibited, and the coefficient of variation in the thickness of the photosensitive resin film may increase.

[2-1-2] Exposure Step In the subsequent exposure step, a predetermined pattern is exposed on the photosensitive resin film 6 formed in the above-described photosensitive resin film forming step. The light source used in the exposure process may be appropriately selected according to the photosensitive wavelength, sensitivity, etc. of the coated photosensitive resin. For example, g line (wavelength: 436 nm) of a high pressure mercury lamp, h line (wavelength: 405 nm) of a high pressure mercury lamp. , I line (wavelength: 365 nm) of high pressure mercury lamp, semiconductor laser (wavelength: 830 nm, 532 nm, 488 nm, 405 nm, etc.), YAG laser (wavelength: 1064 nm), KrF excimer laser (wavelength: 248 nm), ArF excimer laser (wavelength: 193 nm), F2 excimer laser (wavelength: 157 nm), or the like.

  In order to form the surface unevenness shape with high accuracy in the mold manufacturing method of the present invention, it is preferable to expose a predetermined pattern on the photosensitive resin film in a precisely controlled manner in the exposure step. In the mold manufacturing method of the present invention, in order to accurately expose the above-described pattern on the photosensitive resin film, the pattern is created as image data on the computer, and the pattern based on the image data is controlled by the computer. It is preferable to draw with a laser beam emitted from the laser head. When performing laser drawing, a laser drawing apparatus for making a printing plate such as Laser Stream FX (manufactured by Sink Laboratory Co., Ltd.) can be preferably used.

  FIG. 6B schematically shows a state where the pattern is exposed to the photosensitive resin film 6. When the photosensitive resin film is formed of a negative photosensitive resin, the exposed region 7 undergoes a crosslinking reaction of the resin by exposure, and the solubility in a developing solution described later decreases. Therefore, the unexposed area 8 in the developing process is dissolved by the developer, and only the exposed area 7 remains on the substrate surface as a mask. On the other hand, in the case where the photosensitive resin film is formed of a positive photosensitive resin, the exposed region 7 is broken by the resin bond due to the exposure, and the solubility in the developer described later increases. Therefore, the region 7 exposed in the developing process is dissolved by the developer, and only the unexposed region 8 remains on the substrate surface as a mask.

Here, in the region where the mask is present on the substrate surface, the etching process basically does not proceed by the etching process described later. Therefore, the region where the mask exists becomes the flat portion of the first uneven surface. Thus, in order to form the first uneven surface so that the ratio A of the area occupied by the flat portion satisfies the formula (1), the ratio of the area A _M to the surface of the substrate in the region where the mask exists is expressed by the formula A pattern may be created so as to satisfy (1). That is, in the case where the photosensitive resin film is formed of a negative photosensitive resin, the area ratio A _MN occupying the surface of the substrate in the exposed region is expressed by the formula (1) of the area ratio A occupying the flat portion. Create a pattern to meet. In the case of forming a photosensitive resin film with a positive type photosensitive resin, the proportion A _MP of the area occupied by the substrate surface of the unexposed region satisfies the formula (1) in the proportion A of the area occupied by the flat portion Create a pattern as follows.

Moreover, since the area | region where a mask does not exist becomes a recessed part of a 1st uneven surface, in order to form a 1st uneven surface so that the average value C of the linear distance between the centers of a recessed part may satisfy | fill Formula (3), a mask is used. mean value C _M between the centers linear distance between the nonexistent areas of it is sufficient to create a pattern so as to satisfy the equation (3). That is, when the photosensitive resin film is formed of a negative photosensitive resin, the average value _CMN of the center-to-center linear distance of the unexposed region is expressed by the equation (3) of the average value C of the center-to-center linear distance of the recess. When a pattern is formed so as to satisfy the condition, and the photosensitive resin film is formed of a positive photosensitive resin, the average value _CMP of the center-to-center linear distance of the exposed region is the average value of the center-to-center linear distance of the recess. A pattern is created so as to satisfy the expression (3) of C.

  The pattern exposed on the photosensitive resin film in the exposure step is preferably a random pattern. When a regular pattern is exposed, the final fine uneven surface of the resulting mold becomes regular, and the fine uneven surface of the antiglare film produced using such a mold is also regular. It will be something. An antiglare film having a regular fine uneven surface may generate interference colors due to its regularity. Therefore, the pattern exposed in the exposure step is more preferably random.

The pattern exposed on the photosensitive resin film in the exposure process is random, and the average ratio C of the area ratio A _{M of the} area where the mask exists to the substrate surface and the center-to-center linear distance of the area where the mask does not exist There is no particular limitation as long as _M satisfies the above-mentioned conditions, for example, a specific space from a pattern in which dots having a dot diameter of 10 μm or more and less than 20 μm are randomly and uniformly arranged, or a pattern created by randomly arranging dots. Bandpass filter that removes components below a specific spatial frequency and components above a specific spatial frequency from a pattern created by passing a high-pass filter that removes components below the frequency, and a pattern created by randomly arranging dots. The shade is determined by the pattern, random number obtained by passing through or a pseudo random number generated by a computer. A pattern obtained by passing a high-pass filter that removes components below a specific spatial frequency from a pattern having a random brightness distribution, a pattern having a random brightness distribution whose density is determined by a random number or a pseudo-random number generated by a computer A pattern obtained by passing a bandpass filter that removes a component below a specific spatial frequency and a component above a specific spatial frequency can be used. FIG. 7 schematically shows a random pattern. FIG. 7A shows a pattern in which dots having a dot diameter of 16 μm are randomly arranged, and FIG. 7B shows a band in which only a specific spatial frequency range is extracted from a pattern created by randomly arranging dots. It is a pattern obtained by passing through a pass filter.

[2-1-3] Development Step In the subsequent development step, when a negative photosensitive resin was used for the photosensitive resin film 6, the unexposed region 8 was dissolved by the developer and exposed. Only the region 7 remains on the mold base and acts as a mask in the subsequent first etching step. On the other hand, when a positive photosensitive resin is used for the photosensitive resin film 6, only the exposed region 7 is dissolved by the developer, and the unexposed region 8 remains on the mold base. It acts as a mask in the subsequent first etching step.

  A conventionally well-known thing can be used about the developing solution used for a image development process. For example, inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia, primary amines such as ethylamine and n-propylamine, diethylamine, di-n-butylamine, etc. Secondary amines, tertiary amines such as triethylamine and methyldiethylamine, alcohol amines such as dimethylethanolamine and triethanolamine, secondary amines such as tetramethylammonium hydroxide, tetraethylammonium hydroxide and trimethylhydroxyethylammonium hydroxide Examples include alkaline aqueous solutions such as quaternary ammonium salts, cyclic amines such as pyrrole and pihelidine, and organic solvents such as xylene and toluene.

  The development method in the development step is not particularly limited, and methods such as immersion development, spray development, brush development, and ultrasonic development can be used.

  FIG. 6C schematically shows a state in which a development process is performed using a positive photosensitive resin for the photosensitive resin film 6. In FIG. 6B, the exposed region 7 is dissolved by the developer, and only the unexposed region 8 becomes the remaining mask 9 on the substrate surface.

[2-1-4] Etching Step In the subsequent etching step, the mold base is mainly used in a portion where there is no mask, using the photosensitive resin film remaining on the surface of the mold base after the development step as a mask. Etch the material. FIG. 6E schematically shows a state in which the mold base 1 in the portion 10 where no mask is mainly etched by the etching process.

Etching treatment in the etching process is usually performed by using a ferric chloride (FeCl ₃ ) solution, a cupric chloride (CuCl ₂ ) solution, an alkali etching solution (Cu (NH ₃ ) ₄ Cl ₂ ), etc. Although it is performed by corroding, a strong acid such as hydrochloric acid or sulfuric acid can be used, or reverse electrolytic etching by applying a potential opposite to that during electrolytic plating can also be used. Since the etching amount by this etching process becomes the recess depth B of the first uneven surface, the etching amount _BE is set so as to satisfy the equation (2) of the recess depth B of the first uneven surface. The etching amount here is the thickness of the base material to be cut by etching.

The etching process in the etching process may be performed by one etching process, or the etching process may be performed in two or more times. Here, when the etching process is performed twice or more, it is preferable that the sum of the etching amounts _BE in the two or more etching processes satisfies the formula (2) of the recess depth B of the first uneven surface.

[2-1-5] Photosensitive resin film peeling step In the subsequent photosensitive resin film peeling step, the remaining photosensitive resin film used as a mask in the etching step is completely dissolved and removed. In the photosensitive resin film peeling step, the photosensitive resin film is dissolved using a peeling solution. As the stripper, the same developer as that described above can be used, and by changing the pH, temperature, concentration, immersion time, etc., when using a negative photosensitive resin film, When a positive photosensitive resin film is used, the photosensitive resin film in the non-exposed area is completely dissolved and removed. The peeling method in the photosensitive resin film peeling step is not particularly limited, and methods such as immersion peeling, spray peeling, brush peeling, and ultrasonic peeling can be used.

  FIG. 6E schematically shows a state where the photosensitive resin film used as a mask in the etching process is completely dissolved and removed by the photosensitive resin film peeling process. The first concavo-convex surface 4 is formed on the surface of the mold substrate by the mask 9 and etching using the photosensitive resin film.

[2-2] Second Preferred First Irregular Surface Formation Step The second preferred first uneven surface formation step basically includes a cutting step of forming a concave portion on the polished surface by cutting. FIG. 8 schematically shows a state in which a recess is formed on the surface of the mold base.

  In the cutting process, the concave portion is moved relatively linearly in a direction parallel to the surface of the polished mold base material, and at the same time as the linear movement, the micro-reciprocation is performed in a direction perpendicular to the surface of the mold base material. It is preferably done by a moving cutting tool. FIG. 9 shows a cutting that moves relatively linearly in a direction 12 parallel to the surface of the polished mold base 1 and reciprocally moves in a direction 13 perpendicular to the surface of the mold base simultaneously with the linear movement. A state of the tool 14 is schematically shown. In FIG. 9, since the mold base 1 is shown fixed, only the cutting tool 14 performs a linear movement and a minute reciprocation in the vertical direction. By performing such a cutting process, the recesses 3 can be formed on the mold base 1 with a desired pitch and depth with high accuracy.

  An apparatus for performing such a cutting process is schematically shown in FIGS. FIG. 10 shows an apparatus in the case where the mold base 1 has a flat plate shape. The mold base 1 is installed in a first direction parallel to the surface of the mold base 1 (hereinafter referred to as “X”). A working table 15 movable in a second direction (hereinafter referred to as “Y direction”) parallel to the surface of the mold base 1 and perpendicular to the X direction, and a mold base A Z-axis drive unit 16 movable in a direction perpendicular to the surface of the material 1 (hereinafter referred to as “Z direction”), a micro-reciprocating drive mechanism unit 17 attached to the Z-axis drive unit 16, and a micro-reciprocation It has the cutting tool 14 attached to the drive mechanism part for a movement. The mold base 1 is placed on the machining table 15, and the micro reciprocating drive mechanism 17 is moved in the Z-axis direction by using the Z-axis drive unit 16 of the machining apparatus. The base material 1 is brought close to a predetermined amount that can be processed. Next, the mold base 1 is moved at a constant speed by driving the processing table 15 in the X direction. At that time, the cutting tool 14 is reciprocated by a predetermined minute amount in the Z direction by using the minute reciprocating drive mechanism 17. As a result, the distal end portion 14a of the cutting tool 14 moves so as to draw the tool movement trajectories 18a and 18b shown in FIG. 9 with respect to the mold base 1, and the concave portion 3 can be formed with high accuracy.

  FIG. 11 schematically shows an apparatus when the mold base 1 is cylindrical. The apparatus of FIG. 11 rotates the roll which is the cylindrical mold base material 1 centering on the longitudinal axis about the support mechanism 19 which supports the both ends of the roll which is the cylindrical mold base material 1. The motor 20 (hereinafter referred to as “X direction”), a Y-axis drive unit 21 movable in the longitudinal direction (hereinafter referred to as “Y-direction”), and the Y-axis drive unit 21 are attached. A Z axis drive unit 16 movable in a direction perpendicular to the surface of the mold base 1 (hereinafter referred to as “Z direction”), and a micro reciprocating drive mechanism unit 17 attached to the Z axis drive unit; The cutting tool 14 is attached to the micro reciprocating drive mechanism 17. The cylindrical mold base 1 is installed on the support mechanism 19, and the micro reciprocating drive mechanism 17 is moved in the Z-axis direction using the Z-axis drive unit 16 of the processing apparatus. The mold base 1 is brought close to a predetermined amount that can be processed. Next, the mold base 1 is rotated in the X direction at a constant speed by driving the motor 20. At that time, the cutting tool 14 is reciprocated by a predetermined minute amount in the Z direction by using the minute reciprocating drive mechanism 17. Thereby, the front-end | tip part 14a of the cutting tool 14 moves so that the tool movement traces 18a and 18b shown in FIG. 9 may be drawn with respect to the base material 1 for metal mold | dies, and the recessed part 3 can be formed with high precision.

  The drive source of the micro reciprocating drive mechanism is not particularly limited as long as it can drive the cutting tool microscopically, and a piezoelectric element, a magnetostrictive element, an ultrasonic oscillator, etc. can be used. It is preferable to use a piezoelectric element from the viewpoint of speed. The material of the cutting tool to be attached to the micro reciprocating drive mechanism is not particularly limited, and carbide tools, CBN tools, ceramic tools, diamond tools, etc. can be used. Is preferably used.

  Even when the first uneven surface is formed by cutting, the formed recesses are preferably arranged at random, the ratio A of the area occupied by the flat portion of the first uneven surface, the depth B of the recesses, and the recesses It is preferable that the average value C of the center-to-center linear distance satisfies the above-described formulas (1) to (3). Therefore, when the first uneven surface is formed by cutting, the depth of the recess formed by the cutting is set so as to satisfy the formula (2), and then in the [2-1-2] exposure step. It is preferable to cut the recess based on the described pattern. That is, it is preferable to cut a region that is not exposed in a pattern when using a negative photosensitive resin film to form a concave portion, and a region that is exposed in a pattern when using a positive photosensitive resin film. It is preferable to form a recess.

[2-3] Third Preferred First Irregular Surface Forming Step The third preferred first irregular surface forming step includes: [2-3-1] Colored paint application step; [2-3-2] Laser irradiation step And [2-3-3] etching step and [2-3-4] colored coating film peeling step. FIG. 12 is a diagram schematically showing a third preferable first uneven surface forming step in the mold manufacturing method of the present invention. FIG. 12 schematically shows a cross section of the mold in each step.

[2-3-1] Colored paint application process In the colored paint application process, a colored paint is applied to the surface 2 of the base material 1 that has been mirror-polished by the above-described polishing process, and heated and dried. A film 22 is formed. FIG. 12A schematically shows a state in which the colored coating film 22 is formed on the surface 2 of the substrate 1.

  The colored paint used in the colored paint coating process is not particularly limited as long as it can be laser ablated in the subsequent laser irradiation process and has etching resistance in the subsequent etching process. For example, nitrocellulose, ethylene vinyl acetate strong Polymer, unsaturated polyester resin, epoxy resin, allyl resin, polyurethane resin, polyethylene, polypropylene, polystyrene, polyacetal, natural rubber and any one or more flammable substances, and oxidizing agents such as ammonium nitrate and chloric acid compounds In addition, a light absorber such as carbon black diluted with an appropriate solvent such as a cellosolve solvent, a propylene glycol solvent, an ester solvent, an alcohol solvent, a ketone solvent, or a highly polar solvent can be used. Moreover, you may mix | blend various additives, such as an adhesiveness modifier and a coating property improving agent, with a coloring paint as needed.

  As a method for applying the colored paint, known methods such as meniscus coating, fountain coating, dip coating, spin coating, roll coating, wire bar coating, air knife coating, blade coating, curtain coating, and ring coating may be used. However, among these methods, methods such as spin coating, roll coating, wire bar coating, and ring coating that can easily adjust coating conditions are preferably used. Moreover, it is preferable that the thickness of the colored coating film formed in the colored paint coating step is in the range of 1 to 6 μm after drying.

  As the leveling agent to be added to the colored paint, the same leveling agent as that added to the solution in which the photosensitive resin is dissolved in the solvent can be used. Alkyl-modified silicone oil, polyether-modified silicone oil, epoxy-modified silicone Organically modified silicone such as oil, amino-modified silicone oil, carboxy-modified silicone oil, carbinol-modified silicone oil, alkoxy-modified silicone oil, both-end-modified silicone oil, polyester-modified silicone oil, aralkyl-modified silicone oil, acrylic silicone oil Oil can be preferably used. Examples of such organically modified silicone oil include alkyl-modified silicone oils “SH203”, “SH230”, “SF8416”, “BY16-846”, “FZ-49” manufactured by Toray Dow Corning Co., Ltd., polyether-modified silicones Oils “FZ-77”, “FZ-2105”, “SH 3746”, “FZ-2118”, “FZ-7604”, “FZ-2161”, “SH 3771”, “FZ-2162”, “FZ-” 2203 "," FZ-2207 "," FZ-2208 ", epoxy-modified silicone oils" FZ-3720 "," BY 16-839 "," SF 8411 "," SF 8413 "," SF 8421 "," BY 16 " -876 "," FZ-3736 "," BY 16-855D ", amino-modified silicone oil" F "Z-3707", "FZ-3504", "BY 16-205", "FZ-3760", "FZ-3705", "BY 16-209", "FZ-3710", "SF 8417", "BY 16-849 "," BY 16-850 "," BY 16-879 B "," BY 16-892 "," FZ-3501 "," FZ-3785 "," BY 16-872 "," BY 16- 213 "," BY 16-203 "," BY 16-898 "," BY 16-890 "," BY 16-878 "," BY 16-891 "," BY 16-893 "," FZ-3789 " Carboxy modified silicone “BY 16-880”, carbinol modified silicone oil “SF 8428”, alkoxy modified silicone oil “FZ-3704”, “BY 16” 606 ", both-end modified silicone oils" BY 16-871 "," BY 16-853 "," BY 16-201 "," BY 16-004 "," SF-8427 "," BY 16-799 "," BY 16-752 ", a polyether modified silicone oil" BYK-300 / 302 "," BYK-306 "," BYK-307 "," BYK-320 "," BYK-325 "manufactured by BYK Japan “BYK-330”, “BYK-331”, “BYK-333”, “BYK-337”, “BYK-341”, “BYK-344”, “BYK-345 / 346”, “BYK-347”, “ BYK-348 "," BYK-375 "," BYK-377 "," BYK-378 "," BYK-UV3500 "," BYK-UV3510 " Polyester modified silicone oils “BYK-310”, “BYK-315”, “BYK-370”, “BYK-UV3570”, aralkyl-modified silicone oils “BYK-322”, “BYK-323”, acrylic silicone oil “ “BYK-350”, “BYK-352”, “BYK-354”, “BYK-355”, “BYK-358N / 361N”, “BYK-380N”, “BYK-381”, “BYK-392”, etc. Can be mentioned. These surface conditioners may be used alone or in combination of two or more. Moreover, it is preferable that the addition amount of the leveling agent added to a colored paint is 0.1-5 weight part with respect to 100 weight part of solid content of a colored paint.

  The solid content of the colored paint in the colored paint is preferably 5 to 50% by weight, more preferably 10 to 30% by weight. When the weight fraction exceeds 50% by weight, the leveling property at the time of applying and drying the colored paint becomes insufficient, and the thickness of the colored coating film after drying may become uneven. On the other hand, when the weight fraction is less than 5% by weight, dripping or the like may occur when the colored paint is applied and dried, and the thickness of the colored coating film may become uneven. As the solvent for dissolving the colored paint, those described above are preferably used.

[2-3-2] Laser irradiation step In the subsequent laser irradiation step, a predetermined pattern is drawn by laser ablation on the colored coating film 22 formed in the above-described colored paint application step. That is, a laser beam is irradiated onto the colored coating film 22, the laser beam is absorbed by the light absorber in the colored coating film 22 and converted into heat, and the combustible substance is instantaneously heated and evaporated under an oxidant. In the etching step, the surface of the mold base in the region where the etching process is performed is exposed. At this time, the region not irradiated with the laser beam acts as a mask in a later etching process. The light source used in the laser irradiation process may be appropriately selected from those capable of laser ablating the colored coating film 22. For example, a YAG laser (wavelength: 1064 nm) or a semiconductor laser having a wavelength of about 800 nm can be used.

  In order to form the surface uneven shape with high accuracy in the method for producing a mold of the present invention, it is preferable to draw the above-described pattern on the colored coating film in a precisely controlled state in the laser irradiation step. In the mold manufacturing method of the present invention, in order to accurately draw the above-described pattern on the colored coating film, the pattern is created as image data on a computer, and the pattern based on the image data is computer-controlled. It is preferable to draw with a laser beam emitted from a laser head. When performing laser drawing, a laser drawing apparatus for making a printing plate can be used. Examples of such a laser drawing apparatus include Laser Stream FX (manufactured by Sink Laboratories) and DIGILAS (manufactured by Shepherds Ohio).

Since the pattern drawn on the colored coating film in the laser irradiation step corresponds to the flat part and the concave part of the first uneven surface, the concave part of the drawn pattern is preferably arranged at random, and laser ablation is not performed. area average value C _L between the centers linear distance ratio a _L and the laser ablated regions of the area occupied by the (corresponding to the flat portion of the first concave-convex surface) (corresponding to the concave portion of the first concave-convex surface) described above It is preferable to satisfy | fill Formula (1) and Formula (3). Therefore, the pattern drawn in the laser irradiation process is preferably the same as the pattern described in [2-1-2] exposure process. That is, it is preferable to expose a region that is not exposed in the pattern in the case of using the negative type photosensitive resin film by laser ablation, and in the pattern in the case of using the positive type photosensitive resin film, the region to be exposed is laser ablated. It is preferable to expose by.

  FIG. 12B schematically shows a state in which the colored coating film 22 is irradiated with laser light, a part of the colored coating film 22 is heated and evaporated, and the surface 2 of the mold base 1 is exposed. ing. In FIG. 12B, the colored coating film 22 remaining on the surface 2 of the substrate 1 becomes a mask in the subsequent etching process.

[2-3-3] Etching process In the subsequent etching process, the colored coating film remaining on the surface of the mold substrate after the laser irradiation process described above is used as a mask. Etch the material. FIG. 12C schematically shows a state in which the mold base 1 in a portion mainly without a mask is etched by the etching process.

Etching treatment in the etching process is usually performed by using a ferric chloride (FeCl ₃ ) solution, a cupric chloride (CuCl ₂ ) solution, an alkali etching solution (Cu (NH ₃ ) ₄ Cl ₂ ), etc. Although it is performed by corroding, a strong acid such as hydrochloric acid or sulfuric acid can be used, or reverse electrolytic etching by applying a potential opposite to that during electrolytic plating can also be used. Since the etching amount by this etching process becomes the recess depth B of the first uneven surface, the etching amount _BE is set so as to satisfy the equation (2) of the recess depth B of the first uneven surface. The etching amount here is the thickness of the base material to be cut by etching.

The etching process in the etching process may be performed by one etching process, or the etching process may be performed in two or more times. Here, when the etching process is performed twice or more, it is preferable that the sum of the etching amounts _BE in the two or more etching processes satisfies the formula (2) of the recess depth B of the first uneven surface.

[2-3-4] Colored coating film peeling step In the subsequent colored coating film peeling step, the remaining colored coating film 22 used as a mask in the etching step is completely dissolved and removed. In the colored coating film peeling step, the colored coating film 22 is dissolved using a stripping solution. Examples of the stripping solution include inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, and aqueous ammonia, primary amines such as ethylamine and n-propylamine, diethylamine, and diamine. Secondary amines such as n-butylamine, tertiary amines such as triethylamine and methyldiethylamine, alcohol amines such as dimethylethanolamine and triethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, trimethylhydroxyethylammonium Quaternary ammonium salts such as hydroxide, alkaline aqueous solutions such as cyclic amines such as pyrrole and pihelidine, and organic solvents such as xylene and toluene can be used. The peeling method in the colored coating film peeling step is not particularly limited, and methods such as immersion peeling, spray peeling, brush peeling, and ultrasonic peeling can be used.

  FIG. 12D schematically shows a state in which the colored coating film 22 used as a mask in the etching process is completely dissolved and removed by the colored coating film peeling process. The first concavo-convex surface 4 is formed on the surface of the mold substrate by masking and etching with the colored coating film 22.

[3] Second uneven surface forming step In the second uneven surface forming step, the surface shape of the first uneven surface 4 formed in the first uneven surface forming step is blunted by etching. By this etching treatment, a portion having a steep surface inclination in the surface shape of the first uneven surface 4 is eliminated, and the optical characteristics of the antiglare film manufactured using the obtained mold are changed in a preferable direction. In FIG. 1C, the surface shape of the first concavo-convex surface 4 of the substrate 1 is blunted by the etching process, the portion having a steep surface inclination is blunted, and the second concavo-convex surface 11 having a gradual surface inclination is formed. The formed state is shown.

  In the mold manufacturing method of the present invention, the etching amount D of the etching process in the second uneven surface forming step is determined according to the surface shape of the first uneven surface 4 formed in the first uneven surface forming step. Is preferred. That is, the etching amount D preferably satisfies the above-described formula (4). The shape of the second concavo-convex surface 11 formed by the etching amount D satisfying the above-described formula (4) is suitable for manufacturing an antiglare film as will be described later. The etching amount here is also the thickness of the base material scraped by etching.

Below, the preferable range of the etching amount D determined according to the surface shape of the 1st uneven surface 4 is demonstrated. FIG. 13 schematically shows a state in which the first uneven surface 4 is etched, the surface uneven shape is blunted, and the second uneven surface 11 is formed. FIG. 13A schematically shows a case where the etching amount D in the second uneven surface forming step is less than half of the linear distance X of the flat portion. When the etching amount D is less than half of the linear distance X of the flat portion, a flat region remains on the second uneven surface 11, and the inclination angle of the inclined surface extending from the flat portion to the concave portion is approximately 90 °. It becomes. An anti-glare film produced from a mold having such a surface uneven shape also has a flat region and a slope having an inclination angle of approximately 90 °. As a result, the obtained antiglare film is whitish and has an insufficient antiglare effect. Therefore, it is preferable that the etching amount D in the second uneven surface forming step is at least half of the average value X _AVE of the linear distance X of the flat portion. Here, the average value X _AVE of the straight line distance X of the flat portion can be expressed by the above-described equation (6). Therefore, it is preferable that the etching amount D in the second uneven surface forming step satisfies the following expression (12).

On the other hand, when the etching amount D in the second uneven surface forming step exceeds the linear distance X of the flat portion, the inclination angle of the second uneven surface 11 obtained as shown in FIG. 13C may be too small. There is. Thus, the anti-glare film produced from the mold having the surface irregularity shape with a small inclination angle may also have an excessively small inclination angle. As a result, the obtained antiglare film has an insufficient antiglare effect. Therefore, the etching amount D in the second uneven surface forming step is preferably equal to or less than the average value X _AVE of the linear distance X of the flat portion. Therefore, it is preferable that the etching amount D in the second uneven surface forming step satisfies the following expression (13).

  Equation (4) is obtained as a preferable condition for the etching amount D from Equation (12) and Equation (13) described above. By performing the etching process with the etching amount D satisfying Expression (4), the inclination angle of the second uneven surface 11 is suitably controlled. As a result, the resulting antiglare film does not generate whiteness and has excellent antiglare properties.

Here, the etching process in the second uneven surface forming step is usually performed by using a ferric chloride (FeCl ₃ ) solution, a cupric chloride (CuCl ₂ ) solution, an alkali etching solution (Cu (NH ₃ ) ₄ Cl ₂ ), or the like. Although it is performed by corroding the surface, strong acid such as hydrochloric acid or sulfuric acid can be used, or reverse electrolytic etching by applying a potential opposite to that at the time of electrolytic plating can also be used. Moreover, the etching process in a 2nd uneven | corrugated surface formation process may be performed by one etching process, and an etching process may be performed in 2 steps or more. When the etching process is performed twice or more, it is preferable that the sum of the etching amounts D in the two or more etching processes satisfies the formula (4).

[4] Plating step In the subsequent plating step, the outermost surface of the mold is protected by forming a chromium plating layer having a high hardness and a small friction coefficient on the outermost surface of the mold. FIG. 1D shows a state in which the chromium plating layer 23 is formed on the second uneven surface 11 formed by the etching process in the second uneven surface forming step as described above.

In the present invention, chrome plating is employed which has a glossy surface, a high hardness, a low coefficient of friction, and good release properties on the surface of a flat plate or a roll. The type of chrome plating is not particularly limited, but it is preferable to use a chrome plating that expresses a good gloss, so-called gloss chrome plating or decorative chrome plating. Chromium plating is usually performed by electrolysis, and an aqueous solution containing chromic anhydride (CrO ₃ ) and a small amount of sulfuric acid is used as the plating bath. By adjusting the current density and electrolysis time, the thickness of the chromium plating can be controlled.

  In addition, it is not preferable to perform plating other than chromium plating in the plating step. This is because plating other than chromium has low hardness and wear resistance, so that the durability as a mold is lowered, and unevenness is worn away during use or the mold is damaged. In an antiglare film obtained from such a mold, there is a high possibility that a sufficient antiglare function cannot be obtained, and there is a high possibility that defects will occur on the film.

  Further, polishing the surface after plating is also not preferable in the present invention. By polishing, a flat part is generated on the outermost surface, which may lead to deterioration of optical characteristics, and since shape control factors increase, shape control with good reproducibility becomes difficult. Depending on the reason.

  Thus, in the present invention, it is preferable to use the chrome plated surface as the uneven surface of the mold without polishing the surface after chrome plating. As for the thickness of the chromium plating layer to be formed, the thickness of the chromium plating is preferably in the range of 1 to 10 μm, and more preferably in the range of 3 to 6 μm. If the thickness of the chromium plating is thin, the effect of protecting the outermost surface by the chromium plating layer cannot be obtained sufficiently, which is not preferable. On the other hand, when the plating thickness is too thick, productivity is deteriorated and a projection-like plating defect called a nodule is generated, which is not preferable.

  The chromium plating layer formed in the plating step is preferably formed to have a Vickers hardness of 800 or more, and more preferably 1000 or more. When the Vickers hardness of the chrome plating layer is less than 800, the durability when using the mold is reduced, and the decrease in hardness due to chrome plating is due to abnormalities in the plating bath composition, electrolysis conditions, etc. during the plating process. This is because the possibility of occurrence is high, and the possibility of undesirably affecting the occurrence of defects is also high.

<Method for producing antiglare film>
The present invention also provides a method for producing an antiglare film using the mold obtained by the above-described mold production method of the present invention. That is, the manufacturing method of the antiglare film of the present invention includes a step of transferring the uneven surface of the mold manufactured by the manufacturing method of the mold of the present invention to a transparent resin film, and a transparent surface on which the uneven surface of the mold is transferred. And a step of peeling the resin film from the mold. By such a method for producing an antiglare film of the present invention, an antiglare film exhibiting preferable optical properties is suitably produced.

  The transfer to the mold-shaped film is preferably performed by embossing. Examples of the embossing include a UV embossing method using a photocurable resin and a hot embossing method using a thermoplastic resin. Among these, the UV embossing method is preferable from the viewpoint of productivity.

  The UV embossing method forms a photocurable resin layer on the surface of a transparent resin film, and cures the photocurable resin layer while pressing the photocurable resin layer against the uneven surface of the mold. It is a method of transferring to a layer. Specifically, an ultraviolet curable resin is applied onto the transparent resin film, and the ultraviolet curable resin is irradiated with ultraviolet rays from the transparent resin film side in a state where the applied ultraviolet curable resin is in close contact with the uneven surface of the mold. The mold resin is cured, and then the transparent resin film on which the cured ultraviolet curable resin layer is formed is peeled from the mold, thereby transferring the shape of the mold to the ultraviolet curable resin.

  When the UV embossing method is used, the transparent resin film may be a substantially optically transparent film. For example, a triacetyl cellulose film, a polyethylene terephthalate film, a polymethyl methacrylate film, a polycarbonate film, or a norbornene compound is used as a monomer. And a resin film such as a solvent cast film of thermoplastic resin such as amorphous cyclic polyolefin and an extruded film.

  Further, the type of the ultraviolet curable resin in the case of using the UV embossing method is not particularly limited, but a commercially available appropriate one can be used. It is also possible to use a resin that can be cured by visible light having a wavelength longer than that of ultraviolet rays by combining an ultraviolet curable resin with an appropriately selected photoinitiator. Specifically, polyfunctional acrylates such as trimethylolpropane triacrylate and pentaerythritol tetraacrylate are used alone or in admixture of two or more thereof, and Irgacure 907 (manufactured by Ciba Specialty Chemicals) ), Irgacure 184 (manufactured by Ciba Specialty Chemicals), and a photopolymerization initiator such as Lucillin TPO (manufactured by BASF) can be suitably used.

  On the other hand, the hot embossing method is a method in which a transparent resin film formed of a thermoplastic resin is pressed against a mold in a heated state, and the surface shape of the mold is transferred to the transparent resin film. The transparent resin film used in the hot embossing method may be any material as long as it is substantially transparent. For example, polymethyl methacrylate, polycarbonate, polyethylene terephthalate, triacetyl cellulose, norbornene compounds are used as monomers. A solvent cast film or an extruded film of a thermoplastic resin such as amorphous cyclic polyolefin can be used. These transparent resin films can also be suitably used as a base film for applying the ultraviolet curable resin in the UV embossing method described above.

  The anti-glare film produced using the mold obtained by the production method of the present invention is formed by controlling the fine concavo-convex surface with high precision, so that it exhibits sufficient anti-glare properties and is also whiteish. It does not occur, and no glare occurs even when it is arranged on the surface of the image display device, so that high contrast is exhibited.

  EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples. In the examples, “%” and “part” representing the content or amount used are based on weight unless otherwise specified.

[1] Evaluation of surface shape of first uneven surface (Ratio A of area occupied by flat portion)
The first uneven surface was observed from above using a microscope Eclipse 80i (manufactured by Nikon Corporation). During the measurement, the objective lens was measured at a magnification of 10 times. The horizontal resolutions Δx and Δy were both 1.93 μm and the measurement area was 1236 μm × 927 μm. 256 × 256 data (494 μm × 494 μm in measurement area) are sampled from the center of the obtained microscopic observation image, and the flat portion is displayed in white using image processing software ImageJ (manufactured by National Institutes of Health, USA). Thus, the image was converted into a binary image having two gradations in which the concave portion was displayed in black. From this binarized image, the number of white pixels and the number of black pixels were determined, and the area ratio A occupied by the flat portion was determined by the following equation.

(Ratio A of the area occupied by the flat portion) = [(number of white pixels) / (number of pixels of the entire image)] × 100 Expression (12)
(Depth of recess B)
Using a three-dimensional microscope PLμ2300 (manufactured by Sensofar), the surface shape of the antiglare film was measured to determine the depth of the recess. During the measurement, the objective lens was measured at a magnification of 50 times.

(Average value C of linear distance between centers of recesses)
The gradation of the binarized image obtained when determining the area ratio A occupied by the flat portion was determined as a two-dimensional function h (x, y). The resulting two-dimensional function h (x, y) of the discrete Fourier transform to two-dimensional function H (f _x, f _y) was determined. Two-dimensional function H (f _x, f _y) a two-dimensional function of the power spectrum by squaring the ^{_{H 2 (f x, f y}} ) to calculate the two-dimensional function ^{_{H 2 (f x, f y}} ) inverse Fourier transform of From this, an autocorrelation function R (x, y) was calculated. The average value C of the center-to-center linear distances of the recesses was determined by determining the maximum value closest to the origin from the cross section of the obtained autocorrelation function R (x, y) at y = 0.

[2] Measurement of optical properties of antiglare film (haze)
The haze of the antiglare film was measured by the method defined in JIS K 7136. Specifically, haze was measured using a haze meter HM-150 type (manufactured by Murakami Color Research Laboratory) compliant with this standard. In order to prevent the anti-glare film from warping, it was subjected to measurement after being bonded to a glass substrate using an optically transparent pressure-sensitive adhesive so that the uneven surface becomes the surface. In general, when haze increases, an image becomes dark when applied to an image display device, and as a result, front contrast tends to decrease. Therefore, a lower haze is preferable.

(Transparency definition)
The transmission clarity of the antiglare film was measured using an image clarity measuring device “ICM-1DP” manufactured by Suga Test Instruments Co., Ltd. based on JIS K 7105. Also in this case, in order to prevent the sample from warping, it was subjected to measurement after being bonded to a glass substrate using an optically transparent adhesive so that the fine uneven surface of the antiglare layer was the surface. . In this state, light was incident from the glass side and measurement was performed. The measured value here is a total value of values measured using four types of optical combs in which the widths of the dark part and the bright part are 0.125 mm, 0.5 mm, 1.0 mm, and 2.0 mm, respectively. . In this case, the maximum value of the transmission clarity is 400%. In general, when the transmission definition is low, the definition of the image is lowered when applied to an image display device. Therefore, it is preferable that the transmission clarity is high.

(Reflection sharpness)
The reflection sharpness of the antiglare film was measured using an image measuring device “ICM-1DP” manufactured by Suga Test Instruments Co., Ltd. based on JIS K 7105. Also in this case, in order to prevent the sample from warping, it is used for measurement after being bonded to a black acrylic substrate using an optically transparent adhesive so that the fine uneven surface of the antiglare layer becomes the surface. did. In this state, light was incident at 45 ° from the concavo-convex surface side, and measurement was performed. The measured value here is a total value of values measured using four types of optical combs in which the widths of the dark part and the bright part are 0.5 mm, 1.0 mm, and 2.0 mm, respectively. In this case, the maximum value of the reflection definition is 300%. In general, when the reflection definition becomes high, the antiglare property is lowered and reflection tends to occur. Therefore, it is preferable that the reflection definition is low.

[3] Evaluation of anti-glare performance of anti-glare film (Visual evaluation of reflections and whitishness)
In order to prevent reflection from the back surface of the antiglare film, the antiglare film is bonded to the black acrylic resin plate so that the uneven surface becomes the surface, and visually observed from the uneven surface side in a bright room with a fluorescent lamp. Then, the presence or absence of reflection of a fluorescent lamp and the degree of whitening were visually evaluated. Reflection and whitishness were evaluated according to the following criteria in three stages of 1 to 3, respectively.

Reflection 1: Reflection is not observed.
2: Reflection is slightly observed.

3: Reflection is clearly observed.
Whiteness 1: No whiteness is observed.

2: A little whitish is observed.
3: The whitish is clearly observed.

(Evaluation of glare)
The glare was evaluated by the following method. That is, the polarizing plates on both sides were peeled from a commercially available liquid crystal television (LC-32GH3, manufactured by Sharp Corporation). Instead of these original polarizing plates, both the back side and the display side are polarizing plates (Sumikaran SRDB31E, manufactured by Sumitomo Chemical Co., Ltd.). Adhesive so that each absorption axis coincides with the absorption axis of the original polarizing plate. Further, the antiglare film shown in each of the following examples was laminated on the display surface side polarizing plate via an adhesive such that the concavo-convex surface was the surface. In this state, by visually observing from a position about 30 cm away from the sample, the degree of glare was sensory evaluated in seven stages. Level 1 corresponds to a state where no glare is recognized, level 7 corresponds to a state where severe glare is observed, and level 3 refers to a state where only slight glare is observed.

<Example 1>
An aluminum roll having a diameter of 200 mm (A5056 according to JIS) was prepared by applying copper ballad plating to the surface. Copper ballad plating consists of a copper plating layer / thin silver plating layer / surface copper plating layer, and the thickness of the entire plating layer was set to be about 200 μm. The copper plating surface was mirror-polished, and a photosensitive resin was applied to the polished copper plating surface and dried to form a photosensitive resin film. Then, the pattern having a pattern (random brightness distribution shown in FIG. 14, is passed through a bandpass filter for removing 0.039Myuemu ^-1 or lower spatial frequency components and 0.146Myuemu ^-1 or more high spatial frequency components The prepared pattern was repeatedly exposed and developed on the photosensitive resin film with a laser beam. Laser beam exposure and development were performed using Laser Stream FX (manufactured by Sink Laboratories). A positive photosensitive resin was used for the photosensitive resin film.

  Then, the etching process was performed with cupric chloride solution. The etching amount at that time was set to 3 μm. Thereafter, the photosensitive resin film was completely removed from the roll to form a first uneven surface. The proportion of the area occupied by the flat portion of the first uneven surface was 48%, the depth of the concave portion was 2.8 μm, and the average value of the linear distance between the centers of the concave portions was 16 μm.

  Next, the first uneven surface was etched with a cupric chloride solution. The etching amount at that time was set to be 6 μm. Then, the chromium plating process was performed and the metal mold | die A was produced. At this time, the chromium plating thickness was set to 4 μm.

A photocurable resin composition GRANDIC 806T (manufactured by Dainippon Ink & Chemicals, Inc.) is dissolved in ethyl acetate to obtain a 50% strength by weight solution. Further, a photopolymerization initiator, Lucillin TPO (manufactured by BASF). Chemical name: 2,4,6-trimethylbenzoyldiphenylphosphine oxide) was added in an amount of 5 parts by weight per 100 parts by weight of the curable resin component to prepare a coating solution. This coating solution was applied onto a triacetyl cellulose (TAC) film having a thickness of 80 μm so that the coating thickness after drying was 6 μm, and dried for 3 minutes in a dryer set at 60 ° C. The film after drying was brought into close contact with the concavo-convex surface of the mold A obtained previously with a rubber roll so that the photocurable resin composition layer was on the mold side. In this state, light from a high-pressure mercury lamp with an intensity of 20 mW / cm ² was irradiated from the TAC film side so that the amount of light in terms of h-line was 200 mJ / cm ² to cure the photocurable resin composition layer. Thereafter, the TAC film was peeled from the mold together with the cured resin, and a transparent anti-glare film A composed of a laminate of the cured resin having irregularities on the surface and the TAC film was produced.

<Examples 2 to 5>
A pattern having characteristics as shown in Table 1 (the ratio AMP of the area of the unexposed area to the substrate surface _AMP and the average value C _{MP of the} linear distance between the centers of the exposed areas) is exposed on the photosensitive resin film. Then, molds B to E were manufactured under the manufacturing conditions shown in Table 1. Antiglare films B to E were produced in the same manner as in Example 1 except that the obtained molds B to E were used.

<Comparative Examples 1-5>
A pattern having characteristics as shown in Table 2 (area ratio AMP of the area of the unexposed area on the substrate surface _AMP and average value C _MP of the center-to-center linear distance of the illuminated area) is exposed on the photosensitive resin film. Then, molds F to J were manufactured under the manufacturing conditions shown in Table 2. Antiglare films F to J were produced in the same manner as in Example 1 except that the obtained molds F to J were used.

<Comparative Example 6>
The surface of a 200 mm diameter iron roll (STKM13A by JIS) was prepared by applying copper ballad plating. Copper ballad plating consists of a copper plating layer / thin silver plating layer / surface copper plating layer, and the thickness of the entire plating layer was about 200 μm. The copper-plated surface is mirror-polished, and blasting equipment (manufactured by Fuji Seisakusho Co., Ltd.) is used on the polished surface, and zirconia beads “TZ-B125” (trade name, average particle diameter) manufactured by Tosoh Corporation : 125 μm) was blasted at a blast pressure of 0.05 MPa (gauge pressure, the same applies hereinafter) and a bead usage of 8 g / cm ² (a used amount per 1 cm ² of surface area of the roll, the same applies hereinafter) to give irregularities to the surface. The resulting copper-plated iron roll with unevenness was etched with a cupric chloride solution. The etching amount at that time was set to 10 μm. Then, the chromium plating process was performed and the metal mold | die K was produced. At this time, the chromium plating thickness was set to 6 μm. An antiglare film K was produced in the same manner as in Example 1 except that the obtained mold K was used.

  The results are shown in Table 3. The antiglare films A to E obtained from the molds produced by the production method satisfying all the requirements of the present invention did not cause glare, showed sufficient antiglare properties, and did not generate whiteness. In addition, since the haze is low, the contrast does not decrease even when it is arranged in an image display device. On the other hand, the antiglare films F to K obtained from a mold produced by a production method that does not satisfy the requirements of the present invention may cause glare, have insufficient antiglare properties, or cause whitening. As a result.

  DESCRIPTION OF SYMBOLS 1 Base material for molds, 2 Surface of base material, 3 Concave surface, 1st uneven surface, 6 Photosensitive resin film, 7 Exposed area | region, 8 Unexposed area | region, 9 Mask, 10 Unmasked area, 11 1st 2 uneven surface, 12 direction parallel to the surface of the mold base, 13 direction perpendicular to the surface of the mold base, 14 cutting tool, 14a cutting edge of the cutting tool, 15 processing table, 16 Z-axis drive unit, 17 Drive mechanism for reciprocating minute movement, 18a Trajectory of the tip of the cutting tool, 18b Trajectory of the cutting tool, 19 Cylindrical mold support mechanism, 20 Motor for rotating the cylindrical mold, 21 Y axis Drive unit, 22 colored coating film, 23 chrome plating layer.

Claims (6)

A polishing step for polishing the surface of the mold substrate;
A first concavo-convex surface forming step of forming a first concavo-convex surface comprising a flat portion and a concave portion on the polished surface;
A second uneven surface forming step of forming the second uneven surface by dulling the first uneven surface by an etching process;
A plating step of performing chromium plating on the formed second uneven surface,
The area occupied by the flat portion on the first uneven surface is A (%), the average depth of the recesses is B (μm), and the average value of the linear distance between the centers of the recesses is C (μm). The manufacturing method of the metal mold | die for glare-proof film manufacture characterized by satisfy | filling the following conditions when the etching depth in a process is set to D (micrometer).
  The manufacturing method of the metal mold | die for anti-glare film manufacture of Claim 1 which performs chromium plating so that the thickness of a chromium plating layer may be 1-10 micrometers in the said plating process. The first uneven surface forming step includes
A photosensitive resin film coating step of coating and forming a photosensitive resin film on the polished surface;
An exposure step of exposing a pattern on the photosensitive resin film;
A development step of developing the photosensitive resin film on which the pattern is exposed;
Etching process using the developed photosensitive resin film as a mask to form irregularities on the polished plated surface;
The method for producing a mold for producing an antiglare film according to claim 1, further comprising a photosensitive resin film peeling step of peeling the photosensitive resin film after the etching treatment.   Cutting in which the first concavo-convex surface forming step moves relatively linearly in a direction parallel to the surface of the mold base and moves reciprocally in a direction perpendicular to the surface of the mold base simultaneously with the linear movement. It is performed by cutting with a tool, The manufacturing method of the metal mold | die for anti-glare film manufacture of Claim 1 or 2 characterized by the above-mentioned. The first uneven surface forming step includes
A colored paint application process for applying a colored paint to the polished surface to form a colored coating film,
A laser irradiation process for drawing a pattern on the colored coating film with a laser;
Etching process using the colored coating film on which the pattern is drawn as a mask, and forming irregularities on the polished plating surface,
The manufacturing method of the metal mold | die for anti-glare film manufacture of Claim 1 or 2 including the colored coating film peeling process of peeling a colored coating film after an etching process. After transferring the uneven surface of the mold manufactured by the method according to any one of claims 1 to 5 to a transparent resin film, the transparent resin film having the transferred uneven surface of the mold is peeled off from the mold. A method for producing an antiglare film.