JP2014117854A - Method for manufacturing mold for producing antiglare film and method for producing antiglare film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a mold for producing an antiglare film, the mold having a fine rugged pattern on a surface thereof with high accuracy, for obtaining an antiglare film having good antiglare property, developing a good contrast, and suppressing generation of white blur or glare as well as generation of unevenness.SOLUTION: A method for manufacturing a mold for producing an antiglare film includes: a polishing step of polishing a surface of a mold base material; a first rugged surface forming step of forming a first rugged surface comprising flat portions and recessed portions on the polished surface; and a plating step of subjecting the first rugged surface to chromium or nickel plating to form a second rugged surface. An area percentage A (%) of the flat portions occupying the first rugged surface, an average depth B (μm) of the recessed portions, an average linear distance C (μm) between centers of the recessed portions, and a plating thickness D (μm) in the plating step satisfy specified conditions.

Description

  The present invention relates to a mold manufacturing method and an antiglare film manufacturing method for manufacturing an antiglare (antiglare) film having low anti-glare properties while having low haze.

  In an image display device such as a liquid crystal display, a plasma display panel, a cathode ray tube (CRT) display, an organic electroluminescence (EL) display, and the like, when external light is reflected on the display surface, visibility is significantly impaired. In order to prevent such reflection of external light, TVs and personal computers that emphasize image quality, video cameras and digital cameras used outdoors with strong external light, mobile phones that display using reflected light, etc. In the conventional art, a film layer for preventing external light from being reflected is provided on the surface of the image display device. This film layer consists of a film that has been subjected to anti-reflection treatment using interference by the optical multilayer film, and anti-glare treatment that scatters incident light by blurring the incident light by forming fine irregularities on the surface. It is divided roughly into the thing which consists of the film which was given. Among these, the former non-reflective film needs to form a multilayer film having a uniform optical film thickness, and thus increases the cost. On the other hand, since the latter anti-glare film can be produced at a relatively low cost, it is widely used in applications such as large personal computers and monitors.

  Conventionally, such an antiglare film has a random unevenness on the sheet by, for example, applying a resin solution in which fine particles are dispersed on a base sheet, adjusting the coating thickness, and exposing the fine particles to the coating film surface. It is manufactured by the method to form in. However, the antiglare film produced by dispersing such fine particles has irregularities as intended because the arrangement and shape of the irregularities depend on the dispersion state and application state of the fine particles in the resin solution. There is a problem that it is difficult to obtain and a sufficient anti-glare effect cannot be obtained if the haze is low. Furthermore, when such a conventional anti-glare film is disposed on the surface of the image display device, the entire display surface becomes whitish due to scattered light, and the display becomes cloudy, so-called “whiteness” is likely to occur. There was a problem. Also, with the recent high definition of image display devices, the pixels of the image display device interfere with the surface uneven shape of the anti-glare film, resulting in a so-called “glare” phenomenon in which a luminance distribution is generated and becomes difficult to see. There was also a problem that was likely to occur. In order to eliminate glare, there is an attempt to scatter light by providing a refractive index difference between the binder resin and the dispersed fine particles, but when such an antiglare film is disposed on the surface of the image display device, There is also a problem that the contrast tends to decrease due to light scattering at the interface between the fine particles and the binder resin.

  On the other hand, there is also an attempt to develop anti-glare properties only by fine irregularities formed on the surface of the transparent resin layer without containing fine particles. As such an antiglare film, for example, in Patent Document 1 (Japanese Patent Application Laid-Open No. 2006-53371), a substrate is polished, sandblasted, and then subjected to electroless nickel plating so that the surface is fine. An anti-glare film produced by producing a roll having unevenness and curing it while pressing the uneven surface of the roll against a photocurable resin layer formed on a TAC film is described. That is, a method for producing an antiglare film is disclosed that includes transferring the shape of the uneven surface of a mold to a transparent resin film, and then peeling the transparent resin film having the transferred shape of the uneven surface of the mold from the mold. Yes.

  However, the antiglare film disclosed in Patent Document 1 is not sufficient in terms of the accuracy of the concavo-convex shape because it is produced using a mold in which the concavo-convex shape is formed by sandblasting, and in particular, has a period of 50 μm or more. Since it sometimes has a relatively large uneven shape, “glare” was likely to occur.

  Patent Document 2 (Japanese Patent Laid-Open No. 2012-511175) discloses a polishing process for polishing the surface of a mold base, and a first uneven surface including a flat portion and a concave portion on the polished surface. A first uneven surface forming step, a second uneven surface forming step of forming the second uneven surface by dulling the first uneven surface by an etching process, and a plating step of performing chromium plating on the formed second uneven surface. In addition, the area occupied by the flat portion on the first concavo-convex surface is A (%), the average depth of the recesses is B (μm), the average linear distance between the centers of the recesses is C (μm), and the second It describes a method for producing a mold for producing an antiglare film, wherein a specific condition is satisfied when the etching depth in the uneven surface forming step is D (μm).

  That is, Patent Document 2 discloses that a surface irregularity shape is formed on a mold substrate by pattern exposure, thereby achieving low haze, sufficient anti-glare properties, good contrast, suppression of occurrence of whitening, and generation of glare. It is disclosed that a mold for producing an antiglare film capable of suppressing the above can be obtained.

  However, in the method described in Patent Document 2, the second uneven surface is formed by etching the first uneven surface. Thus, when the 2nd uneven surface was formed by etching, there was a problem that a defect was easy to occur in the surface uneven shape pattern of the mold. Specifically, for example, when foreign matter adheres or rust exists on the first uneven surface before the second uneven surface is formed by etching, the etching is inhibited, and the second uneven surface has a convex shape. Defects were likely to occur.

  Anti-glare film has anti-glare properties, exhibits good contrast when placed on the surface of an image display device, and the entire display surface becomes whitish due to scattered light when placed on the surface of the image display device. Suppresses the occurrence of so-called “whitening” that becomes a cloudy color, and when arranged on the surface of the image display device, the pixel of the image display device and the surface uneven shape of the antiglare film interfere with each other. As described above, it is desired to suppress the occurrence of so-called “glare” that is difficult to see due to the occurrence of a luminance distribution. Furthermore, it is necessary that there are no defects in quality such as defects.

  In the case of producing a mold for producing an antiglare film using the method described in Patent Document 2, the above-mentioned defects are eliminated, and the characteristics required for such an antiglare film (antiglare property, good contrast expression) As a means for satisfying the suppression of the occurrence of whitish and the occurrence of glare), the first uneven surface is sufficiently washed before the etching process for forming the second uneven surface, and the adhered foreign matter and rust It is conceivable to remove this. However, even if thorough cleaning before the etching process is performed, it is difficult to completely remove foreign matter. Also, since cleaning is usually performed using a processing solution, surface rust occurs immediately after cleaning. There was a possibility.

JP 2006-53371 A JP 2012-511175 A

  In order to obtain an anti-glare film having good anti-glare properties, expressing good contrast, suppressing the occurrence of whitish and glare, and suppressing the occurrence of defects, It is an object of the present invention to provide a method capable of accurately producing a mold for producing an antiglare film having a fine uneven shape.

The present invention comprises a polishing step for polishing the surface of a mold substrate;
A first concavo-convex surface forming step of forming a first concavo-convex surface comprising a flat portion and a concave portion on the polished surface;
A plating step of performing chromium plating or nickel plating on the first uneven surface and forming a second uneven surface,
In the plating step, the area occupied by the flat portion on the first concavo-convex surface is A (%), the average depth of the recesses is B (μm), and the average linear distance between the centers of the recesses is C (μm). It is the manufacturing method of the metal mold | die for anti-glare film manufacture characterized by satisfy | filling the following conditions, when plating thickness is set to D (micrometer).

  In the first uneven surface forming step in the mold manufacturing method of the present invention, it is preferable to form the first uneven surface by any one of the following methods (1) to (3).

  (1) A photosensitive resin film coating process for coating and forming a photosensitive resin film on the polished surface, an exposure process for exposing a pattern on the photosensitive resin film, and developing the photosensitive resin film on which the pattern is exposed A developing step, an etching step of performing an etching process using the developed photosensitive resin film as a mask and forming irregularities on the polished plated surface, and a photosensitive resin film peeling step of peeling the photosensitive resin film after the etching process (1st preferable 1st uneven surface formation process).

  (2) It comprises a cutting step in which a recess is formed on the polished surface by cutting, and the cutting moves relatively linearly in a direction parallel to the surface of the mold base, and simultaneously with the linear movement, the mold (Second preferred first uneven surface forming step) performed by a cutting tool that reciprocally moves in a direction perpendicular to the surface of the substrate for use.

  (3) A colored paint application process for applying a colored paint on the polished surface to form a colored paint film, a laser irradiation process for drawing a pattern on the colored paint film by a laser, and a colored paint film on which the pattern is drawn A method including an etching process for forming irregularities on the polished plated surface and a colored coating film peeling process for stripping the colored coating film after the etching process (third preferred first irregular surface formation) Process).

  Further, in the present invention, after the uneven surface of the antiglare film manufacturing mold manufactured by the above method for manufacturing the antiglare film manufacturing mold is transferred to the transparent resin film, the uneven surface of the mold is transferred. The present invention also relates to a method for producing an antiglare film, comprising peeling off the transparent resin film from the mold for producing the antiglare film.

  In the method for producing a mold for producing an antiglare film according to the present invention, the second uneven surface is formed by plating, so that etching defects due to adhering foreign matter and rust on the surface of the mold and the occurrence of point defects in the uneven pattern are caused. It can be suppressed. That is, when the second uneven surface is formed only by etching, if the etching is hindered by adhering foreign matter or rust, a convex defect equivalent to the etching depth when forming the second uneven surface may occur. become. On the other hand, in the case where the second uneven surface is formed by plating, even if there are adhered foreign matters or rust, the plating is formed in a direction to cover those defects, so that it does not become a detrimental defect.

  Therefore, according to the manufacturing method of the metal mold | die for anti-glare film manufacture of this invention, the metal mold | die with which the fine uneven | corrugated shape was formed in the surface with high precision can be manufactured. Furthermore, according to the method for producing an antiglare film of the present invention using this mold, it has a good antiglare property, expresses a good contrast, suppresses the occurrence of whitish and glare, and It becomes possible to produce an antiglare film in which the occurrence of defects is suppressed.

It is a figure which shows typically a preferable example of the manufacturing method of the metal mold | die of this invention. It is a figure which shows typically the state which observed the 1st uneven surface from upper direction. It is a figure which shows typically the cross section of a 1st uneven surface. It is a figure which shows the result of having observed the 1st uneven surface with the microscope from upper direction. It is a figure which shows the cross section in y = 0 of the autocorrelation function R (x, y) calculated from the microscope image of the 1st uneven surface of FIG. It is a figure which shows typically a preferable example of a 1st uneven surface formation process. It is a figure which shows typically the pattern exposed on the photosensitive resin film. It is a figure which shows typically a preferable example of a 1st uneven surface formation process. The figure which shows typically the mode of the cutting tool which carries out a linear reciprocation to the direction perpendicular | vertical to the surface of the mold base material simultaneously with a linear movement relatively to the direction parallel to the surface of the mold base material. It is. It is a figure which shows typically the apparatus for cutting a fine recessed part in the flat base material for metal mold | dies. It is a figure which shows typically the apparatus for cutting a micro recessed part in a cylindrical base material for metal mold | die. It is a figure which shows typically a preferable example of a 1st uneven surface formation process. It is a figure which shows typically a mode that a 1st uneven surface becomes dull by a plating process and becomes a 2nd uneven surface. It is a figure which shows a part of pattern used in the case of metal mold | die preparation of Example 1. FIG.

<Manufacturing method of mold>
FIG. 1 is a diagram schematically showing a preferred example of the mold manufacturing method of the present invention. FIG. 1 schematically shows a cross section of a mold in each step. The mold manufacturing method of the present invention basically includes [1] polishing step, [2] first uneven surface forming step, and [3] plating step. Hereafter, each process of the manufacturing method of the metal mold | die of this invention is demonstrated in detail, referring FIG.

[1] Polishing Step In the mold manufacturing method of the present invention, first, the surface of the base material used for the mold is polished. It is preferable that the base material surface is grind | polished in the state close | similar to a mirror surface through the said process. This is because the metal plate or metal roll serving as a base material is often subjected to machining such as cutting or grinding in order to obtain a desired accuracy, and as a result, the processing surface remains on the base material surface. Because. Further, as described later, even if the base material used for the mold is in a state where copper plating or nickel plating is applied to the surface, the above-mentioned processed eyes may remain, and in the plated state, the surface may be This is because it is not always smooth. That is, even if a process described later is performed on the surface where such deep processed marks remain, unevenness such as processed marks may be deeper than the unevenness formed after each process is performed. Such effects may remain, and when an antiglare film is produced using such a mold, the optical characteristics may be unexpectedly affected. FIG. 1A schematically shows a state in which a flat mold base 1 has a mirror-polished surface 2 by a polishing process.

  The method for polishing the surface of the substrate used in the mold is not particularly limited, and any of mechanical polishing, electrolytic polishing, and chemical polishing can be used. Examples of the mechanical polishing method include super finishing, lapping, fluid polishing, and buff polishing. Moreover, it is good also considering the surface 2 of the base material 1 for metal mold | die as a mirror surface by carrying out mirror surface cutting using a cutting tool in a grinding | polishing process. The material and shape of the cutting tool at that time are not particularly limited, and carbide tools, CBN tools, ceramic tools, diamond tools, etc. can be used, but diamond tools should be used from the viewpoint of processing accuracy. Is preferred. The surface roughness after the polishing step is preferably such that the center line average roughness Ra conforming to the provisions of JIS B 0601 is 0.1 μm or less, and more preferably 0.05 μm or less. If the center line average roughness Ra after polishing is greater than 0.1 μm, the final unevenness of the mold surface may be affected by the surface roughness after polishing, which is not preferable. In addition, the lower limit of the center line average roughness Ra is not particularly limited, and there is no limit in particular because there is a natural limit from the viewpoint of processing time and processing cost.

  In the metal mold manufacturing method of the present invention, examples of the metal material suitably used for forming the base material include aluminum and iron from the viewpoint of cost. Furthermore, lightweight aluminum is more preferable from the convenience of handling. The aluminum and iron here may be pure metals, respectively, or may be an alloy mainly composed of aluminum or iron.

  The shape of the substrate is not particularly limited as long as it is an appropriate shape that has been conventionally employed in this field, and may be a flat plate shape, or a columnar or cylindrical roll. If a mold is produced using a roll-shaped substrate, there is an advantage that the antiglare film can be produced in a continuous roll shape.

  Furthermore, in the manufacturing method of the metal mold | die of this invention, it is also preferable to plate on the surface of the base material used for a metal mold | die before a grinding | polishing process. The type of plating applied to the surface of the base material used for the mold is not particularly limited as long as it has good workability in the first uneven surface forming step, and examples thereof include copper plating, nickel plating, and zinc plating. It is done. Among these, copper plating or nickel plating is preferable from the viewpoints of workability, coverage, and smoothing action. This is because copper plating or nickel plating has a high covering property and a strong smoothing action, so that a flat and glossy surface is formed by filling minute irregularities and voids of the mold base.

  As used herein, copper or nickel may be a pure metal, or may be an alloy mainly composed of copper, or an alloy mainly composed of nickel. Therefore, “copper” referred to in the present specification. Is meant to include copper and copper alloys, and “nickel” is meant to include nickel and nickel alloys. Copper plating and nickel plating may be performed by electrolytic plating or electroless plating, respectively, but if copper plating is used, electrolytic plating is usually adopted, and if nickel plating, usually electroless plating is adopted. .

  When plating is performed on the surface of the mold base material, if the plating layer is too thin, the influence of the base surface cannot be completely eliminated. Therefore, the thickness is preferably 50 μm or more. Although the upper limit of the plating layer thickness is not critical, generally about 500 μm is sufficient from the viewpoint of cost and the like.

  Hereinafter, both the case where the surface of the substrate used for the mold is not plated and the case where the surface of the substrate used for the mold is plated are referred to as a mold substrate or a substrate.

[2] First Irregular Surface Formation Step In the subsequent first uneven surface formation step, a first uneven surface comprising a flat portion and a concave portion is formed on the surface 2 of the substrate 1 that has been mirror-polished by the above-described polishing step. FIG. 1B schematically shows a state in which the concave portion 3 is formed on the surface 2 of the substrate 1 and the first concave and convex surface 4 including the flat portion 5 and the concave portion 3 is formed.

  In the mold manufacturing method of the present invention, the ratio of the area occupied by the flat portion of the first concavo-convex surface is A (%), the depth of the recess is B (μm), and the average value of the linear distance between the centers of the recesses Is C (μm), it is preferable to satisfy the conditions of the above-mentioned formulas (1) to (3).

Here, the area ratio A occupied by the flat portion 5 refers to the ratio of the area of the flat portion to the mold base projection surface when the first uneven surface is observed from above. FIG. 2 is a schematic diagram illustrating a state in which the first uneven surface is observed from above. In FIG. 2, the concave portion 3 is shown in gray, and the flat portion 5 is shown in white. In the case shown in FIG. 2, the ratio A of the area occupied by the flat portion 5 is expressed by the following formula:

(Ratio A of area occupied by flat portion) = (area of white region) / [(area of white region) + (area of gray region)] × 100 Formula (5)

Can be expressed as

In the mold manufacturing method of the present invention, it is preferable that the ratio A of the area occupied by the flat portion 5 formed on the first uneven surface satisfies the formula (1). FIG. 3 is a diagram schematically showing a cross section of the first uneven surface. As shown in FIG. 3, when the linear distance of one flat portion 5 and the linear distance of one concave portion 3 formed on the first uneven surface are X and Y, respectively, the first uneven surface is formed with high accuracy. Therefore, it is preferable that the average value X _AVE of X and the average value Y _AVE of Y are both 10 μm or more. When each average value X _AVE or Y _AVE is less than 10 μm, the influence of slight fluctuations in the linear distance X or Y increases, resulting in unexpected unevenness in the resulting surface shape. It is. Here, the average value X _AVE of the straight line distance X of one flat part and the average value Y _AVE of the straight line distance Y of a certain concave part are the ratio A of the area occupied by the flat part and the linear distance between the centers between the concave parts described later. The average value C can be used to express as follows.

Since the average values X _AVE and Y _{AVE of} these linear distances are both 10 μm or more, the condition of formula (1) is obtained.

  The depth B of the recess means a difference in height between the flat portion and the deepest portion of the recess as shown in FIG. In the manufacturing method of the metal mold | die of this invention, it is preferable that the depth B of a recessed part satisfy | fills Formula (2). When the depth B of the recess is less than 2 μm, the first uneven surface is in a substantially flat state, and the surface uneven shape is not sufficiently formed when the surface shape is dulled in the plating process. . The antiglare film produced from such a mold also has an insufficient antiglare effect due to insufficient surface irregularity. On the other hand, when the depth B of the recess exceeds 10 μm, it is difficult to dull the surface shape in the subsequent plating step and it is difficult to form an appropriate second uneven surface, which is not preferable. That is, the first surface uneven shape is not effectively blunted, and a portion having a steep inclination angle remains in the second surface uneven shape. The antiglare film produced from such a mold also has a portion having a steep inclination angle in the surface irregularity shape, resulting in whitening.

In addition, the average value C of the center-to-center linear distances of the recesses means the average value of the linear distances (intervals) between the center points on the bottom surface of the nearest recess, and a microscope image obtained by observing the first uneven surface from above or It can be obtained by image analysis of a pattern to be described later. That is, first, the microscopic image or pattern is converted into binary image data of two gradations so that the concave portion and the flat portion can be distinguished. The resulting image gradation two-dimensional function h (x, y) of the data expressed in the resulting two-dimensional function h (x, y) to Fourier transform the two-dimensional function H _{(f x,} f _y) a calculate. Next, an autocorrelation function R (x, y) is calculated by performing inverse Fourier transform on the power spectrum obtained by squaring the obtained two-dimensional function H (f _x , f _y ). In this autocorrelation function R (x, y), the maximum value closest to the origin is the average value of the linear distance between the centers of the recesses. Here, since the first uneven surface formed in the mold manufacturing method of the present invention has concave portions formed randomly as described later, the autocorrelation function R (x, y) is symmetrical about the origin. Become. Therefore, the maximum value closest to the origin can be obtained from the cross section passing through the origin in the autocorrelation function R (x, y). Here, x and y are (a horizontal direction, the vertical y-direction image data in the example x-direction image data) orthogonal coordinates represents the image data plane, f _x and f _y are frequency in the x direction and It represents the frequency in the y direction.

Actually, the two-dimensional function h (x, y) indicating the gradation of the image data is a discrete function because the gradation for each pixel is obtained as a set of discrete data points. Therefore, to calculate the discrete function _{H (f} x, _{f y)} by a discrete Fourier transform defined by equation (8), discrete function _{H (f} x, _{f y)} power spectrum by squaring the ^H 2 _{(f x} , F _y ). The autocorrelation function R (x, y) is obtained by the inverse discrete Fourier transform defined by the power spectrum H ² (f _x , f _y ) and the equation (9). Here, π in the formulas (8) and (9) is a pi, and i is an imaginary unit. M is the number of pixels in the x direction, N is the number of pixels in the y direction, j is an integer from 0 to M−1, k is an integer from 0 to N−1, and l is It is an integer from 0 to M-1, and m is an integer from 0 to N-1. Further, Δf _x and Δf _y are frequency intervals in the x direction and the y direction, respectively, and are defined by Expression (10) and Expression (11). Here, Δx and Δy in the equations (10) and (11) are the pixel intervals in the x and y directions, respectively.

  FIG. 4 shows an example of a microscope image obtained by observing the first uneven surface from above. FIG. 5 shows a cross section of y = 0 in the autocorrelation function R (x, y) calculated from the microscope image of FIG. FIG. 5 shows that the average value C of the average distance between the centers of the recesses is 31 μm.

  Here, it is preferable that the fine uneven surface of the antiglare film does not contain a long-period component of 50 μm or more from the viewpoint of suppressing glare generated by the fine uneven surface of the antiglare film. However, an excellent antiglare performance is not exhibited on a fine uneven surface containing only a short period component of 10 μm or less. Therefore, the fine uneven surface of the antiglare film preferably includes a surface shape having a period of 10 to 50 μm as a main component in order to sufficiently prevent glare while exhibiting a sufficient antiglare effect. Therefore, it is preferable that the metal mold | die for manufacturing the glare-proof film which fully prevents glare while expressing sufficient anti-glare effect contains the surface shape with a period of 10-50 micrometers as a main component. When the average value C of the center-to-center linear distance between the recesses exceeds 35 μm, a fine uneven surface shape having a period of 50 μm or more is likely to be formed on the resulting mold, and as a result, the resulting antiglare film is highly enhanced. Glare will occur when placed on the surface of a fine image display device. Moreover, when the average value C of the center-to-center linear distance between the recesses is less than 15 μm, the resulting mold contains a lot of short-period components with a period of 10 μm or less, and the resulting antiglare film is excellent. Anti-glare performance does not appear. Therefore, it is preferable that the average value C of the center-to-center linear distance between the recesses satisfies the condition of the expression (3).

  The first concavo-convex surface forming step is not particularly limited as long as the flat portion and the concave portion are formed with high accuracy, but in order to manufacture the flat portion and the concave portion with high accuracy and reproducibility, any of the following methods Is preferably used.

[2-1] First Preferred First Irregular Surface Forming Step The first preferred first irregular surface forming step includes [2-1-1] photosensitive resin film coating step and [2-1-2] exposure. The process basically includes a [2-1-3] development process, a [2-1-4] etching process, and a [2-1-5] photosensitive resin film peeling process. FIG. 6 is a diagram schematically showing a first preferable first uneven surface forming step in the method for manufacturing a mold of the present invention. FIG. 6 schematically shows a cross section of the mold in each step.

[2-1-1] Photosensitive resin film coating step In the photosensitive resin film coating step, the photosensitive resin is applied as a solution in which the photosensitive resin is dissolved in a solvent to the surface 2 of the substrate 1 that has been mirror-polished by the polishing step described above. Then, a photosensitive resin film is formed by heating and drying. FIG. 6A schematically shows a state where the photosensitive resin film 6 is formed on the surface 2 of the substrate 1.

  A conventionally known photosensitive resin can be used as the photosensitive resin. For example, a negative photosensitive resin having a property of curing the photosensitive part includes an acrylic ester monomer or prepolymer having an acrylic group or a methacrylic group in the molecule, a mixture of bisazide and diene rubber, polyvinyl thinner. Mart compounds and the like can be used. In addition, as a positive photosensitive resin having a property that a photosensitive portion is eluted by development and only an unexposed portion remains, a phenol resin type or a novolac resin type can be used. Moreover, you may mix | blend various additives, such as a sensitizer, a development accelerator, an adhesiveness modifier, and a coating property improving agent, with a photosensitive resin as needed.

  When these photosensitive resins are applied to the surface 2 of the substrate 1, in order to form a good coating film, it is preferable to dilute and apply in an appropriate solvent. Cellosolve solvents, propylene glycol solvents An ester solvent, an alcohol solvent, a ketone solvent, a highly polar solvent, or the like can be used.

  As a method for applying the photosensitive resin solution, known methods such as meniscus coating, fountain coating, dip coating, spin coating, roll coating, wire bar coating, air knife coating, blade coating, curtain coating, ring coating, etc. are used. Among these methods, methods such as spin coating, roll coating, wire bar coating, and ring coating that can easily adjust coating conditions are preferably used.

  The thickness of the photosensitive resin film formed in the photosensitive resin film coating step is preferably in the range of 1 to 6 μm after drying. The coefficient of variation of the thickness of the photosensitive resin film is preferably less than 10%. Here, the coefficient of variation in the thickness of the photosensitive resin film is defined as the standard deviation of the thickness of the photosensitive resin film divided by the average thickness of the photosensitive resin film. The variation coefficient of the thickness of the photosensitive resin film being 10% or more indicates that the variation of the thickness of the photosensitive resin film is large. When the thickness of the photosensitive resin film is different, the sensitivity in the exposure process changes, and the development time in the development process also changes. Therefore, when the variation in the thickness of the photosensitive resin film is large, unevenness depending on the variation in the thickness of the photosensitive resin film occurs in the photosensitive resin film remaining on the surface of the mold base after the development process. This unevenness also causes unevenness in the final mold. The coefficient of variation in the thickness of the photosensitive resin film is obtained by measuring three or more thicknesses of the photosensitive resin film 6 formed on the surface 2 of the mold substrate 1 and calculating the average value and standard deviation. Can be sought. Here, in order to obtain the coefficient of variation with high accuracy, the thickness of the photosensitive resin film 6 is preferably measured at 10 or more locations.

  In order to make the variation coefficient of the thickness of the photosensitive resin film less than 10%, the leveling property of the solution in which the photosensitive resin is dissolved in the solvent is adjusted with a leveling agent, the dilution rate with the solvent is adjusted, This can be achieved by adjusting the coating method and the coating conditions in doing so.

  Leveling agents that are added to a solution in which a photosensitive resin is dissolved in a solvent include alkyl-modified silicone oil, polyether-modified silicone oil, epoxy-modified silicone oil, amino-modified silicone oil, carboxy-modified silicone oil, carbinol-modified silicone oil, alkoxy Organically modified silicone oils such as modified silicone oils, double-end modified silicone oils, polyester modified silicone oils, aralkyl modified silicone oils and acrylic silicone oils can be preferably used. Examples of such organically modified silicone oil include, for example, alkyl-modified silicone oils “SH203”, “SH230”, “SF8416”, “BY16-846”, “FZ-49” manufactured by Toray Dow Corning, polyether modified silicone Oils “FZ-77”, “FZ-2105”, “SH3746”, “FZ-2118”, “FZ-7604”, “FZ-2161”, “SH3771”, “FZ-2162”, “FZ-2203” , "FZ-2207", "FZ-2208", epoxy-modified silicone oils "FZ-3720", "BY16-839", "SF8411", "SF8413", "SF8421", "BY16-876", "FZ- 3736 "," BY16-855D ", amino-modified silicone oil" FZ-37 " 7 "," FZ-3504 "," BY16-205 "," FZ-3760 "," FZ-3705 "," BY16-209 "," FZ-3710 "," SF8417 "," BY16-849 "," BY16-850 "," BY16-879B "," BY16-892 "," FZ-3501 "," FZ-3785 "," BY16-872 "," BY16-213 "," BY16-203 "," BY16- 898 "," BY16-890 "," BY16-878 "," BY16-891 "," BY16-893 "," FZ-3789 ", carboxy-modified silicone" BY16-880 ", carbinol-modified silicone oil" SF8428 " , Alkoxy-modified silicone oil “FZ-3704”, “BY16-606”, both-end-modified silicone oil "BY16-871", "BY16-853", "BY16-201", "BY16-004", "SF-8427", "BY16-799", "BY16-752", manufactured by BYK Japan Polyether-modified silicone oils “BYK-300 / 302”, “BYK-306”, “BYK-307”, “BYK-320”, “BYK-325”, “BYK-330”, “BYK-331”, “ "BYK-333", "BYK-337", "BYK-341", "BYK-344", "BYK-345 / 346", "BYK-347", "BYK-348", "BYK-375", "BYK-" -377 "," BYK-378 "," BYK-UV3500 "," BYK-UV3510 ", polyester-modified silicone oil" BYK " -310 "," BYK-315 "," BYK-370 "," BYK-UV3570 ", aralkyl-modified silicone oils" BYK-322 "," BYK-323 ", acrylic silicone oils" BYK-350 "," BYK " -352 "," BYK-354 "," BYK-355 "," BYK-358N / 361N "," BYK-380N "," BYK-381 "," BYK-392 ", and the like. These surface conditioners may be used alone or in combination of two or more. Moreover, it is preferable that the addition amount of the leveling agent added to the solution which melt | dissolved photosensitive resin in the solvent is 0.1-5 weight part with respect to 100 weight part of photosensitive resin.

  The weight fraction of the photosensitive resin in a solution obtained by dissolving the photosensitive resin in a solvent is preferably 5 to 50% by weight, and more preferably 10 to 30% by weight. When the weight fraction exceeds 50% by weight, the leveling property when the photosensitive resin solution is applied and dried is insufficient, and the variation coefficient of the thickness of the photosensitive resin film may be increased. On the other hand, when the weight fraction is less than 5% by weight, dripping or the like may occur when the photosensitive resin solution is applied and dried, and the variation coefficient of the thickness of the photosensitive resin film may increase. . As the solvent for dissolving the photosensitive resin, those described above are preferably used.

  The coating method and coating conditions of the photosensitive resin solution for setting the coefficient of variation of the thickness of the photosensitive resin film to less than 10% vary depending on the physical properties of the photosensitive resin solution. As a method, methods such as spin coating, roll coating, wire bar coating, and ring coating, which can easily adjust coating conditions, are preferably used. In this case, the relative movement speed of the coating head is preferably 0.5 to 300 mm / sec. Moreover, it is preferable that the heating or drying temperature after apply | coating the photosensitive resin solution is 20-80 degreeC, More preferably, it is 25-40 degreeC. When the heating or drying temperature is lower than 20 ° C., the drying time becomes long, and there is a high possibility that dripping occurs during drying. On the other hand, when the heating or drying temperature exceeds 80 ° C., the drying time is shortened, the leveling effect during drying is not exhibited, and the coefficient of variation in the thickness of the photosensitive resin film may increase.

[2-1-2] Exposure Step In the subsequent exposure step, a predetermined pattern is exposed on the photosensitive resin film 6 formed in the above-described photosensitive resin film forming step. The light source used in the exposure process may be appropriately selected according to the photosensitive wavelength, sensitivity, etc. of the coated photosensitive resin. For example, g line (wavelength: 436 nm) of a high pressure mercury lamp, h line (wavelength: 405 nm) of a high pressure mercury lamp. , I line (wavelength: 365 nm) of high pressure mercury lamp, semiconductor laser (wavelength: 830 nm, 532 nm, 488 nm, 405 nm, etc.), YAG laser (wavelength: 1064 nm), KrF excimer laser (wavelength: 248 nm), ArF excimer laser (wavelength: 193 nm), F2 excimer laser (wavelength: 157 nm), or the like.

  In order to form the surface unevenness shape with high accuracy in the mold manufacturing method of the present invention, it is preferable to expose a predetermined pattern on the photosensitive resin film in a precisely controlled manner in the exposure step. In the mold manufacturing method of the present invention, in order to accurately expose the above-described pattern on the photosensitive resin film, the pattern is created as image data on the computer, and the pattern based on the image data is controlled by the computer. It is preferable to draw with a laser beam emitted from the laser head. When performing laser drawing, a laser drawing apparatus for making a printing plate such as Laser Stream FX (manufactured by Sink Laboratory Co., Ltd.) can be preferably used.

  FIG. 6B schematically shows a state where the pattern is exposed to the photosensitive resin film 6. When the photosensitive resin film is formed of a negative photosensitive resin, the exposed region 7 undergoes a crosslinking reaction of the resin by exposure, and the solubility in a developing solution described later decreases. Therefore, the unexposed area 8 in the developing process is dissolved by the developer, and only the exposed area 7 remains on the substrate surface as a mask. On the other hand, in the case where the photosensitive resin film is formed of a positive photosensitive resin, the exposed region 7 is broken by the resin bond due to the exposure, and the solubility in the developer described later increases. Therefore, the region 7 exposed in the developing process is dissolved by the developer, and only the unexposed region 8 remains on the substrate surface as a mask.

Here, in the region where the mask is present on the substrate surface, the etching process basically does not proceed by the etching process described later. Therefore, the region where the mask exists becomes the flat portion of the first uneven surface. Thus, in order to form the first uneven surface so that the ratio A of the area occupied by the flat portion satisfies the formula (1), the ratio of the area A _M to the surface of the substrate in the region where the mask exists is expressed by the formula A pattern may be created so as to satisfy (1). That is, in the case where the photosensitive resin film is formed of a negative photosensitive resin, the area ratio A _MN occupying the surface of the substrate in the exposed region is expressed by the formula (1) of the area ratio A occupying the flat portion. Create a pattern to meet. In the case of forming a photosensitive resin film with a positive type photosensitive resin, the proportion A _MP of the area occupied by the substrate surface of the unexposed region satisfies the formula (1) in the proportion A of the area occupied by the flat portion Create a pattern as follows.

Moreover, since the area | region where a mask does not exist becomes a recessed part of a 1st uneven surface, in order to form a 1st uneven surface so that the average value C of the linear distance between the centers of a recessed part may satisfy | fill Formula (3), a mask is used. mean value C _M between the centers linear distance between the nonexistent areas of it is sufficient to create a pattern so as to satisfy the equation (3). That is, when the photosensitive resin film is formed of a negative photosensitive resin, the average value _CMN of the center-to-center linear distance of the unexposed region is expressed by the equation (3) of the average value C of the center-to-center linear distance of the recess. When a pattern is formed so as to satisfy the condition, and the photosensitive resin film is formed of a positive photosensitive resin, the average value _CMP of the center-to-center linear distance of the exposed region is the average value of the center-to-center linear distance of the recess. A pattern is created so as to satisfy the expression (3) of C.

  The pattern exposed on the photosensitive resin film in the exposure step is preferably a random pattern. When a regular pattern is exposed, the final fine uneven surface of the resulting mold becomes regular, and the fine uneven surface of the antiglare film produced using such a mold is also regular. It will be something. An antiglare film having a regular fine uneven surface may generate interference colors due to its regularity. Therefore, the pattern exposed in the exposure step is more preferably random.

The pattern exposed on the photosensitive resin film in the exposure process is random, and the average ratio C of the area ratio A _{M of the} area where the mask exists to the substrate surface and the center-to-center linear distance of the area where the mask does not exist There is no particular limitation as long as _M satisfies the above-mentioned conditions, for example, a specific space from a pattern in which dots having a dot diameter of 10 μm or more and less than 20 μm are randomly and uniformly arranged, or a pattern created by randomly arranging dots. Bandpass filter that removes components below a specific spatial frequency and components above a specific spatial frequency from a pattern created by passing a high-pass filter that removes components below the frequency, and a pattern created by randomly arranging dots. The shade is determined by the pattern, random number obtained by passing through or a pseudo random number generated by a computer. A pattern obtained by passing a high-pass filter that removes components below a specific spatial frequency from a pattern having a random brightness distribution, a pattern having a random brightness distribution whose density is determined by a random number or a pseudo-random number generated by a computer A pattern obtained by passing a bandpass filter that removes a component below a specific spatial frequency and a component above a specific spatial frequency can be used. FIG. 7 schematically shows a random pattern. FIG. 7A shows a pattern in which dots having a dot diameter of 16 μm are randomly arranged, and FIG. 7B shows a band in which only a specific spatial frequency range is extracted from a pattern created by randomly arranging dots. It is a pattern obtained by passing through a pass filter.

[2-1-3] Development Step In the subsequent development step, when a negative photosensitive resin was used for the photosensitive resin film 6, the unexposed region 8 was dissolved by the developer and exposed. Only the region 7 remains on the mold base and acts as a mask in the subsequent etching process. On the other hand, when a positive photosensitive resin is used for the photosensitive resin film 6, only the exposed region 7 is dissolved by the developer, and the unexposed region 8 remains on the mold base. It acts as a mask in the subsequent etching process.

  A conventionally well-known thing can be used about the developing solution used for a image development process. For example, inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia, primary amines such as ethylamine and n-propylamine, diethylamine, di-n-butylamine, etc. Secondary amines, tertiary amines such as triethylamine and methyldiethylamine, alcohol amines such as dimethylethanolamine and triethanolamine, secondary amines such as tetramethylammonium hydroxide, tetraethylammonium hydroxide and trimethylhydroxyethylammonium hydroxide Examples include alkaline aqueous solutions such as quaternary ammonium salts, cyclic amines such as pyrrole and pihelidine, and organic solvents such as xylene and toluene.

  The development method in the development step is not particularly limited, and methods such as immersion development, spray development, brush development, and ultrasonic development can be used.

  FIG. 6C schematically shows a state in which a development process is performed using a positive photosensitive resin for the photosensitive resin film 6. In FIG. 6B, the exposed region 7 is dissolved by the developer, and only the unexposed region 8 becomes the remaining mask 9 on the substrate surface.

[2-1-4] Etching Step In the subsequent etching step, the mold base is mainly used in a portion where there is no mask, using the photosensitive resin film remaining on the surface of the mold base after the development step as a mask. Etch the material. FIG. 6E schematically shows a state in which the mold base 1 in the portion 10 where no mask is mainly etched by the etching process.

Etching treatment in the etching process is usually performed by using a ferric chloride (FeCl ₃ ) solution, a cupric chloride (CuCl ₂ ) solution, an alkali etching solution (Cu (NH ₃ ) ₄ Cl ₂ ), etc. Although it is performed by corroding, a strong acid such as hydrochloric acid or sulfuric acid can be used, or reverse electrolytic etching by applying a potential opposite to that during electrolytic plating can also be used. Since the etching amount by this etching process becomes the recess depth B of the first uneven surface, the etching amount _BE is set so as to satisfy the equation (2) of the recess depth B of the first uneven surface. The etching amount here is the thickness of the base material to be cut by etching.

The etching process in the etching process may be performed by one etching process, or the etching process may be performed in two or more times. Here, when the etching process is performed twice or more, it is preferable that the sum of the etching amounts _BE in the two or more etching processes satisfies the formula (2) of the recess depth B of the first uneven surface.

[2-1-5] Photosensitive resin film peeling step In the subsequent photosensitive resin film peeling step, the remaining photosensitive resin film used as a mask in the etching step is completely dissolved and removed. In the photosensitive resin film peeling step, the photosensitive resin film is dissolved using a peeling solution. As the stripper, the same developer as that described above can be used, and by changing the pH, temperature, concentration, immersion time, etc., when using a negative photosensitive resin film, When a positive photosensitive resin film is used, the photosensitive resin film in the non-exposed area is completely dissolved and removed. The peeling method in the photosensitive resin film peeling step is not particularly limited, and methods such as immersion peeling, spray peeling, brush peeling, and ultrasonic peeling can be used.

  FIG. 6E schematically shows a state where the photosensitive resin film used as a mask in the etching process is completely dissolved and removed by the photosensitive resin film peeling process. The first concavo-convex surface 4 is formed on the surface of the mold substrate by the mask 9 and etching using the photosensitive resin film.

[2-2] Second Preferred First Irregular Surface Formation Step The second preferred first uneven surface formation step basically includes a cutting step of forming a concave portion on the polished surface by cutting. FIG. 8 schematically shows a state in which a recess is formed on the surface of the mold base.

  In the cutting process, the concave portion is moved relatively linearly in a direction parallel to the surface of the polished mold base material, and at the same time as the linear movement, the micro-reciprocation is performed in a direction perpendicular to the surface of the mold base material. It is preferably done by a moving cutting tool. FIG. 9 shows a cutting that moves relatively linearly in a direction 12 parallel to the surface of the polished mold base 1 and reciprocally moves in a direction 13 perpendicular to the surface of the mold base simultaneously with the linear movement. A state of the tool 14 is schematically shown. In FIG. 9, since the mold base 1 is shown fixed, only the cutting tool 14 performs a linear movement and a minute reciprocation in the vertical direction. By performing such a cutting process, the recesses 3 can be formed on the mold base 1 with a desired pitch and depth with high accuracy.

  An apparatus for performing such a cutting process is schematically shown in FIGS. FIG. 10 shows an apparatus in the case where the mold base 1 has a flat plate shape. The mold base 1 is installed in a first direction parallel to the surface of the mold base 1 (hereinafter referred to as “X”). A working table 15 movable in a second direction (hereinafter referred to as “Y direction”) parallel to the surface of the mold base 1 and perpendicular to the X direction, and a mold base A Z-axis drive unit 16 movable in a direction perpendicular to the surface of the material 1 (hereinafter referred to as “Z direction”), a micro-reciprocating drive mechanism unit 17 attached to the Z-axis drive unit 16, and a micro-reciprocation It has the cutting tool 14 attached to the drive mechanism part for a movement. The mold base 1 is placed on the machining table 15, and the micro reciprocating drive mechanism 17 is moved in the Z-axis direction by using the Z-axis drive unit 16 of the machining apparatus. The base material 1 is brought close to a predetermined amount that can be processed. Next, the mold base 1 is moved at a constant speed by driving the processing table 15 in the X direction. At that time, the cutting tool 14 is reciprocated by a predetermined minute amount in the Z direction by using the minute reciprocating drive mechanism 17. As a result, the distal end portion 14a of the cutting tool 14 moves so as to draw the tool movement trajectories 18a and 18b shown in FIG. 9 with respect to the mold base 1, and the concave portion 3 can be formed with high accuracy.

  FIG. 11 schematically shows an apparatus when the mold base 1 is cylindrical. The apparatus of FIG. 11 rotates the roll which is the cylindrical mold base material 1 centering on the longitudinal axis about the support mechanism 19 which supports the both ends of the roll which is the cylindrical mold base material 1. The motor 20 (hereinafter referred to as “X direction”), a Y-axis drive unit 21 movable in the longitudinal direction (hereinafter referred to as “Y-direction”), and the Y-axis drive unit 21 are attached. A Z axis drive unit 16 movable in a direction perpendicular to the surface of the mold base 1 (hereinafter referred to as “Z direction”), and a micro reciprocating drive mechanism unit 17 attached to the Z axis drive unit; The cutting tool 14 is attached to the micro reciprocating drive mechanism 17. The cylindrical mold base 1 is installed on the support mechanism 19, and the micro reciprocating drive mechanism 17 is moved in the Z-axis direction using the Z-axis drive unit 16 of the processing apparatus. The mold base 1 is brought close to a predetermined amount that can be processed. Next, the mold base 1 is rotated in the X direction at a constant speed by driving the motor 20. At that time, the cutting tool 14 is reciprocated by a predetermined minute amount in the Z direction by using the minute reciprocating drive mechanism 17. Thereby, the front-end | tip part 14a of the cutting tool 14 moves so that the tool movement traces 18a and 18b shown in FIG. 9 may be drawn with respect to the base material 1 for metal mold | dies, and the recessed part 3 can be formed with high precision.

  The drive source of the micro reciprocating drive mechanism is not particularly limited as long as it can drive the cutting tool microscopically, and a piezoelectric element, a magnetostrictive element, an ultrasonic oscillator, etc. can be used. It is preferable to use a piezoelectric element from the viewpoint of speed. The material of the cutting tool to be attached to the micro reciprocating drive mechanism is not particularly limited, and carbide tools, CBN tools, ceramic tools, diamond tools, etc. can be used. Is preferably used.

  Even when the first uneven surface is formed by cutting, the formed recesses are preferably arranged at random, the ratio A of the area occupied by the flat portion of the first uneven surface, the depth B of the recesses, and the recesses It is preferable that the average value C of the center-to-center linear distance satisfies the above-described formulas (1) to (3). Therefore, when the first uneven surface is formed by cutting, the depth of the recess formed by the cutting is set so as to satisfy the formula (2), and then in the [2-1-2] exposure step. It is preferable to cut the recess based on the described pattern. That is, it is preferable to cut a region that is not exposed in a pattern when using a negative photosensitive resin film to form a concave portion, and a region that is exposed in a pattern when using a positive photosensitive resin film. It is preferable to form a recess.

[2-3] Third Preferred First Irregular Surface Forming Step The third preferred first irregular surface forming step includes: [2-3-1] Colored paint application step; [2-3-2] Laser irradiation step And [2-3-3] etching step and [2-3-4] colored coating film peeling step. FIG. 12 is a diagram schematically showing a third preferable first uneven surface forming step in the mold manufacturing method of the present invention. FIG. 12 schematically shows a cross section of the mold in each step.

[2-3-1] Colored paint application process In the colored paint application process, a colored paint is applied to the surface 2 of the base material 1 that has been mirror-polished by the above-described polishing process, and heated and dried. A film 22 is formed. FIG. 12A schematically shows a state in which the colored coating film 22 is formed on the surface 2 of the substrate 1.

  The colored paint used in the colored paint coating process is not particularly limited as long as it can be laser ablated in the subsequent laser irradiation process and has etching resistance in the subsequent etching process. For example, nitrocellulose, ethylene vinyl acetate strong Polymer, unsaturated polyester resin, epoxy resin, allyl resin, polyurethane resin, polyethylene, polypropylene, polystyrene, polyacetal, natural rubber and any one or more flammable substances, and oxidizing agents such as ammonium nitrate and chloric acid compounds In addition, a light absorber such as carbon black diluted with an appropriate solvent such as a cellosolve solvent, a propylene glycol solvent, an ester solvent, an alcohol solvent, a ketone solvent, or a highly polar solvent can be used. Moreover, you may mix | blend various additives, such as an adhesiveness modifier and a coating property improving agent, with a coloring paint as needed.

  As a method for applying the colored paint, known methods such as meniscus coating, fountain coating, dip coating, spin coating, roll coating, wire bar coating, air knife coating, blade coating, curtain coating, and ring coating may be used. However, among these methods, methods such as spin coating, roll coating, wire bar coating, and ring coating that can easily adjust coating conditions are preferably used. Moreover, it is preferable that the thickness of the colored coating film formed in the colored paint coating step is in the range of 1 to 6 μm after drying.

  As the leveling agent to be added to the colored paint, the same leveling agent as that added to the solution in which the photosensitive resin is dissolved in the solvent can be used. Alkyl-modified silicone oil, polyether-modified silicone oil, epoxy-modified silicone Organically modified silicone such as oil, amino-modified silicone oil, carboxy-modified silicone oil, carbinol-modified silicone oil, alkoxy-modified silicone oil, both-end-modified silicone oil, polyester-modified silicone oil, aralkyl-modified silicone oil, acrylic silicone oil Oil can be preferably used. Examples of such organically modified silicone oil include alkyl-modified silicone oils “SH203”, “SH230”, “SF8416”, “BY16-846”, “FZ-49” manufactured by Toray Dow Corning Co., Ltd., polyether-modified silicones Oils “FZ-77”, “FZ-2105”, “SH3746”, “FZ-2118”, “FZ-7604”, “FZ-2161”, “SH3771”, “FZ-2162”, “FZ-2203” , "FZ-2207", "FZ-2208", epoxy-modified silicone oils "FZ-3720", "BY16-839", "SF8411", "SF8413", "SF8421", "BY16-876", "FZ- 3736 "," BY16-855D ", amino-modified silicone oil" FZ-370 " ”,“ FZ-3504 ”,“ BY16-205 ”,“ FZ-3760 ”,“ FZ-3705 ”,“ BY16-209 ”,“ FZ-3710 ”,“ SF8417 ”,“ BY16-849 ”,“ BY16 ” -850 "," BY16-879B "," BY16-892 "," FZ-3501 "," FZ-3785 "," BY16-872 "," BY16-213 "," BY16-203 "," BY16-898 " ”,“ BY16-890 ”,“ BY16-878 ”,“ BY16-891 ”,“ BY16-893 ”,“ FZ-3789 ”, carboxy-modified silicone“ BY16-880 ”, carbinol-modified silicone oil“ SF8428 ”, Alkoxy-modified silicone oil “FZ-3704”, “BY16-606”, both-end modified silicone oil “BY16-871”, “BY16-853”, “BY16-201”, “BY16-004”, “SF-8427”, “BY16-799”, “BY16-752”, poly manufactured by BYK Japan Ether-modified silicone oils “BYK-300 / 302”, “BYK-306”, “BYK-307”, “BYK-320”, “BYK-325”, “BYK-330”, “BYK-331”, “BYK” -333 "," BYK-337 "," BYK-341 "," BYK-344 "," BYK-345 / 346 "," BYK-347 "," BYK-348 "," BYK-375 "," BYK- " 377 "," BYK-378 "," BYK-UV3500 "," BYK-UV3510 ", polyester-modified silicone oil" BYK- 310 ”,“ BYK-315 ”,“ BYK-370 ”,“ BYK-UV3570 ”, aralkyl-modified silicone oils“ BYK-322 ”,“ BYK-323 ”, acrylic silicone oils“ BYK-350 ”,“ BYK- ” 352 "," BYK-354 "," BYK-355 "," BYK-358N / 361N "," BYK-380N "," BYK-381 "," BYK-392 ", and the like. These surface conditioners may be used alone or in combination of two or more. Moreover, it is preferable that the addition amount of the leveling agent added to a colored paint is 0.1-5 weight part with respect to 100 weight part of solid content of a colored paint.

  The solid content of the colored paint in the colored paint is preferably 5 to 50% by weight, more preferably 10 to 30% by weight. When the weight fraction exceeds 50% by weight, the leveling property when the colored paint is applied and dried is insufficient, and the thickness of the colored coating film after drying may be uneven. On the other hand, when the weight fraction is less than 5% by weight, dripping or the like may occur when the colored paint is applied and dried, and the thickness of the colored coating film may become uneven. As the solvent for dissolving the colored paint, those described above are preferably used.

[2-3-2] Laser irradiation step In the subsequent laser irradiation step, a predetermined pattern is drawn by laser ablation on the colored coating film 22 formed in the above-described colored paint application step. That is, a laser beam is irradiated onto the colored coating film 22, the laser beam is absorbed by the light absorber in the colored coating film 22 and converted into heat, and the combustible substance is instantaneously heated and evaporated under an oxidant. In the etching step, the surface of the mold base in the region where the etching process is performed is exposed. At this time, the region not irradiated with the laser beam acts as a mask in a later etching process. The light source used in the laser irradiation process may be appropriately selected from those capable of laser ablating the colored coating film 22. For example, a YAG laser (wavelength: 1064 nm) or a semiconductor laser having a wavelength of about 800 nm can be used.

  In order to form the surface uneven shape with high accuracy in the method for producing a mold of the present invention, it is preferable to draw the above-described pattern on the colored coating film in a precisely controlled state in the laser irradiation step. In the mold manufacturing method of the present invention, in order to accurately draw the above-described pattern on the colored coating film, the pattern is created as image data on a computer, and the pattern based on the image data is computer-controlled. It is preferable to draw with a laser beam emitted from a laser head. When performing laser drawing, a laser drawing apparatus for making a printing plate can be used. Examples of such a laser drawing apparatus include Laser Stream FX (manufactured by Sink Laboratories) and DIGILAS (manufactured by Shepherds Ohio).

Since the pattern drawn on the colored coating film in the laser irradiation step corresponds to the flat part and the concave part of the first uneven surface, the concave part of the drawn pattern is preferably arranged at random, and laser ablation is not performed. area average value C _L between the centers linear distance ratio a _L and the laser ablated regions of the area occupied by the (corresponding to the flat portion of the first concave-convex surface) (corresponding to the concave portion of the first concave-convex surface) described above It is preferable to satisfy | fill Formula (1) and Formula (3). Therefore, the pattern drawn in the laser irradiation process is preferably the same as the pattern described in [2-1-2] exposure process. That is, it is preferable to expose a region that is not exposed in the pattern in the case of using the negative type photosensitive resin film by laser ablation, and in the pattern in the case of using the positive type photosensitive resin film, the region to be exposed is laser ablated. It is preferable to expose by.

  FIG. 12B schematically shows a state in which the colored coating film 22 is irradiated with laser light, a part of the colored coating film 22 is heated and evaporated, and the surface 2 of the mold base 1 is exposed. ing. In FIG. 12B, the colored coating film 22 remaining on the surface 2 of the substrate 1 becomes a mask in the subsequent etching process.

[2-3-3] Etching process In the subsequent etching process, the colored coating film remaining on the surface of the mold substrate after the laser irradiation process described above is used as a mask. Etch the material. FIG. 12C schematically shows a state in which the mold base 1 in a portion mainly without a mask is etched by the etching process.

The etching process in the etching process is usually performed by using a ferric chloride (FeCl ₃ ) solution, a cupric chloride (CuCl ₂ ) solution, an alkaline etching solution (Cu (NH ₃ ) ₄ Cl ₂ ), etc. Although it is performed by corroding, a strong acid such as hydrochloric acid or sulfuric acid can be used, or reverse electrolytic etching by applying a potential opposite to that during electrolytic plating can also be used. Since the etching amount by this etching process becomes the recess depth B of the first uneven surface, the etching amount _BE is set so as to satisfy the equation (2) of the recess depth B of the first uneven surface. The etching amount here is the thickness of the base material to be cut by etching.

The etching process in the etching process may be performed by one etching process, or the etching process may be performed in two or more times. Here, when the etching process is performed twice or more, it is preferable that the sum of the etching amounts _BE in the two or more etching processes satisfies the formula (2) of the recess depth B of the first uneven surface.

[2-3-4] Colored coating film peeling step In the subsequent colored coating film peeling step, the remaining colored coating film 22 used as a mask in the etching step is completely dissolved and removed. In the colored coating film peeling step, the colored coating film 22 is dissolved using a stripping solution. Examples of the stripping solution include inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, and aqueous ammonia, primary amines such as ethylamine and n-propylamine, diethylamine, and diamine. Secondary amines such as n-butylamine, tertiary amines such as triethylamine and methyldiethylamine, alcohol amines such as dimethylethanolamine and triethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, trimethylhydroxyethylammonium Quaternary ammonium salts such as hydroxide, alkaline aqueous solutions such as cyclic amines such as pyrrole and pihelidine, and organic solvents such as xylene and toluene can be used. The peeling method in the colored coating film peeling step is not particularly limited, and methods such as immersion peeling, spray peeling, brush peeling, and ultrasonic peeling can be used.

  FIG. 12D schematically shows a state in which the colored coating film 22 used as a mask in the etching process is completely dissolved and removed by the colored coating film peeling process. The first concavo-convex surface 4 is formed on the surface of the mold substrate by masking and etching with the colored coating film 22.

[3] Plating step In the subsequent plating step, the outermost surface of the mold is protected by forming a chromium plating layer or a nickel plating layer having a high hardness and a small friction coefficient on the outermost surface of the mold. The surface shape of the first uneven surface 4 formed by the uneven surface forming step is blunted by plating. FIG. 1C shows a state in which the chromium plating layer (or nickel plating layer) 23 formed by the plating process is formed and the second uneven surface 11 is formed.

  By this plating step, a portion having a steep surface inclination in the surface shape of the first uneven surface 4 is eliminated, and the optical characteristics of the antiglare film manufactured using the obtained mold are changed in a preferable direction. In FIG. 1C, the surface of the first concavo-convex surface 4 of the substrate 1 is blunted by the plating process, the portion having a steep surface inclination is blunted, and the second concavo-convex surface 11 having a gradual surface inclination is formed. The formed state is shown.

  In the mold manufacturing method of the present invention, it is preferable that the plating thickness D in the plating step is determined according to the surface shape of the first uneven surface 4 formed in the first uneven surface forming step. That is, the plating thickness D preferably satisfies the above-described formula (4). The shape of the second uneven surface 11 formed by the plating thickness D satisfying the above-described formula (4) is suitable for manufacturing an antiglare film as will be described later. Here, the plating thickness is measured by measuring the level difference between the area where plating is not formed and the area where plating is not formed by applying a masking tape to a part of the mold base. It can be obtained by doing. Moreover, after forming metal plating on a small metal piece and a small roll on the same conditions as the time of forming the metal mold | die for anti-glare film manufacture, it can obtain | require by observing those cross sections.

  Below, the preferable range of the plating thickness D determined according to the surface shape of the 1st uneven surface 4 is demonstrated. FIG. 13 schematically shows a state in which the first uneven surface 4 is plated and the surface uneven shape is blunted to form the second uneven surface 11.

FIG. 13A schematically shows a case where the plating thickness D in the plating process is less than half of the linear distance Y of the recesses. When the plating thickness D is less than half of the linear distance Y of the recess, a flat region remains on the second uneven surface 11, and the inclination angle of the slope leading from the flat portion to the recess is approximately 90 °. Become. An anti-glare film produced from a mold having such a surface uneven shape also has a flat region and a slope having an inclination angle of approximately 90 °. As a result, the obtained antiglare film is whitish and has an insufficient antiglare effect. Therefore, the plating thickness D in the plating step is preferably half or more of the average value Y _AVE of the linear distance Y of the recesses.

Here, the average value Y _AVE of the linear distance Y of the recesses can be expressed by the above-described equation (7). Therefore, the plating thickness D in the plating process preferably satisfies the following formula (12).

On the other hand, when the plating thickness D in the plating process exceeds the linear distance Y of the recess, the inclination angle of the second uneven surface 11 obtained as shown in FIG. 13C may be too small. Thus, the anti-glare film produced from the mold having the surface irregularity shape with a small inclination angle may also have an excessively small inclination angle. As a result, the obtained antiglare film has an insufficient antiglare effect. Therefore, the plating thickness D in the plating process is preferably equal to or less than the average value Y _AVE of the linear distance Y of the recesses. Therefore, it is preferable that the plating thickness D in the plating process satisfies the following formula (13).

  As a preferable condition of the plating thickness D, the formula (4) is obtained from the above-described formula (12) and the formula (13). By performing the plating process with the plating thickness D satisfying the formula (4), the inclination angle of the second uneven surface 11 is suitably controlled. As a result, the resulting antiglare film does not generate whiteness and has excellent antiglare properties.

  In the present invention, chrome plating or nickel plating that has a glossy surface, a high hardness, a low friction coefficient, and good releasability is employed on the surface of a flat plate or a roll. As used herein, chromium or nickel may be a pure metal, or may be an alloy mainly composed of chromium or an alloy mainly composed of nickel. Is meant to include chromium and chromium alloys, and “nickel” is meant to include nickel and nickel alloys.

The type of chromium plating or nickel plating is not particularly limited, but it is preferable to use chromium plating or nickel plating that expresses good gloss, which is called so-called bright plating or decorative plating. Chromium plating is usually performed by electrolysis, and an aqueous solution containing chromic anhydride (CrO ₃ ) and a small amount of sulfuric acid is used as the plating bath. For nickel plating, electrolytic plating or electroless plating is employed. When nickel plating is performed by electroplating, an aqueous solution containing nickel sulfate, nickel chloride, boric acid or the like is used as the plating bath. When nickel plating is performed by electroless plating, the plating bath includes an aqueous solution containing nickel sulfate, nickel chloride, a reducing agent (sodium hypophosphite, hypophosphorous acid, borohydride, hydrazine, etc.), etc. Is used. In the case of electroplating, the thickness of chromium plating or nickel plating can be controlled by adjusting the current density and electrolysis time. In the case of electroless plating, the thickness of nickel plating can be controlled by adjusting pH, temperature, and treatment time.

  In the plating step, it is not preferable to perform plating other than chromium plating or nickel plating. This is because plating other than chrome plating or nickel plating has insufficient glossiness and low hardness and wear resistance, so that the durability as a mold is reduced and the unevenness is polished down during use. Or the mold may be damaged. In an antiglare film obtained from such a mold, there is a high possibility that a sufficient antiglare function cannot be obtained, and there is a high possibility that defects will occur on the film.

  Further, polishing the surface after plating is also not preferable in the present invention. By polishing, a flat part is generated on the outermost surface, which may lead to deterioration of optical characteristics, and since shape control factors increase, shape control with good reproducibility becomes difficult. Depending on the reason. As described above, in the present invention, it is preferable to use the chrome plating or nickel plating surface as the uneven surface of the mold as it is without polishing the surface after chrome plating or nickel plating.

<Method for producing antiglare film>
In the method for producing an antiglare film of the present invention, a mold obtained by the above-described mold production method of the present invention is used. That is, the manufacturing method of the antiglare film of the present invention includes a step of transferring the uneven surface of the mold manufactured by the manufacturing method of the mold of the present invention to a transparent resin film, and a transparent surface on which the uneven surface of the mold is transferred. And a step of peeling the resin film from the mold. By such a method for producing an antiglare film of the present invention, an antiglare film exhibiting preferable optical properties is suitably produced.

  The transfer to the mold-shaped film is preferably performed by embossing. Examples of the embossing include a UV embossing method using a photocurable resin and a hot embossing method using a thermoplastic resin. Among these, the UV embossing method is preferable from the viewpoint of productivity.

  The UV embossing method forms a photocurable resin layer on the surface of a transparent resin film, and cures the photocurable resin layer while pressing the photocurable resin layer against the uneven surface of the mold. It is a method of transferring to a layer. Specifically, an ultraviolet curable resin is applied onto the transparent resin film, and the ultraviolet curable resin is irradiated with ultraviolet rays from the transparent resin film side in a state where the applied ultraviolet curable resin is in close contact with the uneven surface of the mold. The mold resin is cured, and then the transparent resin film on which the cured ultraviolet curable resin layer is formed is peeled from the mold, thereby transferring the shape of the mold to the ultraviolet curable resin.

  When the UV embossing method is used, the transparent resin film may be a substantially optically transparent film. For example, a triacetyl cellulose film, a polyethylene terephthalate film, a polymethyl methacrylate film, a polycarbonate film, or a norbornene compound is used as a monomer. And a resin film such as a solvent cast film of thermoplastic resin such as amorphous cyclic polyolefin and an extruded film.

  Further, the type of the ultraviolet curable resin in the case of using the UV embossing method is not particularly limited, but a commercially available appropriate one can be used. It is also possible to use a resin that can be cured by visible light having a wavelength longer than that of ultraviolet rays by combining an ultraviolet curable resin with an appropriately selected photoinitiator. Specifically, polyfunctional acrylates such as trimethylolpropane triacrylate and pentaerythritol tetraacrylate are used alone or in admixture of two or more thereof, and Irgacure 907 (manufactured by Ciba Specialty Chemicals) ), Irgacure 184 (manufactured by Ciba Specialty Chemicals), and a photopolymerization initiator such as Lucillin TPO (manufactured by BASF) can be suitably used.

  On the other hand, the hot embossing method is a method in which a transparent resin film formed of a thermoplastic resin is pressed against a mold in a heated state, and the surface shape of the mold is transferred to the transparent resin film. The transparent resin film used in the hot embossing method may be any material as long as it is substantially transparent. For example, polymethyl methacrylate, polycarbonate, polyethylene terephthalate, triacetyl cellulose, norbornene compounds are used as monomers. A solvent cast film or an extruded film of a thermoplastic resin such as amorphous cyclic polyolefin can be used. These transparent resin films can also be suitably used as a base film for applying the ultraviolet curable resin in the UV embossing method described above.

  The anti-glare film produced using the mold obtained by the production method of the present invention is formed by controlling the fine concavo-convex surface with high precision, so that it exhibits sufficient anti-glare properties and is also whiteish. It does not occur, and no glare occurs even when it is arranged on the surface of the image display device, so that high contrast is exhibited.

  EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.

[1] Evaluation of surface shape of first uneven surface (Ratio A of area occupied by flat portion)
The first uneven surface is observed from above using a microscope Eclipse 80i (manufactured by Nikon Corporation). At the time of measurement, measurement is performed with the magnification of the objective lens being 10 times. The horizontal resolutions Δx and Δy are both 1.93 μm and the measurement area is 1236 μm × 927 μm. 256 × 256 data (494 μm × 494 μm in measurement area) are sampled from the center of the obtained microscopic observation image, and the flat portion is displayed in white using image processing software ImageJ (manufactured by National Institutes of Health, USA). Then, the image is converted into a binary image having two gradations in which the concave portion is black. The number of white pixels and the number of black pixels are obtained from this binarized image, and the area ratio A occupied by the flat portion is obtained by the following equation.

(Ratio A of area occupied by flat portion) = [(number of white pixels) / (number of pixels of entire image)] × 100 Expression (12)
(Depth of recess B)
Using a three-dimensional microscope PLμ2300 (manufactured by Sensofar), the surface shape of the antiglare film is measured to determine the depth of the recess. At the time of measurement, the measurement is performed with the magnification of the objective lens being 50 times.

(Average value C of linear distance between centers of recesses)
The gradation of the binarized image obtained when obtaining the area ratio A occupied by the flat portion is obtained as a two-dimensional function h (x, y). The obtained two-dimensional function h (x, y) is subjected to discrete Fourier transform to obtain a two-dimensional function H (fx, fy). Two-dimensional function H (fx, fy) two-dimensional function ^H 2 (fx, fy) of the power spectrum calculated by squaring the two-dimensional function ^H 2 (fx, fy) autocorrelation function from the inverse Fourier transform of R ( x, y) is calculated. The average value C of the center-to-center linear distances of the recesses is obtained by obtaining the maximum value closest to the origin from the y = 0 section of the obtained autocorrelation function R (x, y).

[2] Measurement of optical properties of antiglare film (haze)
The haze of the antiglare film is measured by a method defined in JIS K 7136. Specifically, haze is measured using a haze meter HM-150 type (manufactured by Murakami Color Research Laboratory) that complies with this standard. In order to prevent warping of the antiglare film, it is used for measurement after being bonded to a glass substrate using an optically transparent adhesive so that the uneven surface becomes the surface. In general, when haze increases, an image becomes dark when applied to an image display device, and as a result, front contrast tends to decrease. Therefore, a lower haze is preferable.

(Transparency definition)
The transmission clarity of the antiglare film is measured using an image clarity measuring device “ICM-1DP” manufactured by Suga Test Instruments Co., Ltd. based on JIS K 7105. Also in this case, in order to prevent the sample from warping, it is used for measurement after being bonded to a glass substrate using an optically transparent adhesive so that the fine uneven surface of the antiglare layer becomes the surface. In this state, light is incident from the glass side and measurement is performed. The measured value here is a total value of values measured using four types of optical combs in which the widths of the dark part and the bright part are 0.125 mm, 0.5 mm, 1.0 mm, and 2.0 mm, respectively. . In this case, the maximum value of the transmission clarity is 400%. In general, when the transmission definition is low, the definition of the image is lowered when applied to an image display device. Therefore, it is preferable that the transmission clarity is high.

(Reflection sharpness)
The reflection sharpness of the antiglare film is measured using an image clarity measuring device “ICM-1DP” manufactured by Suga Test Instruments Co., Ltd. based on JIS K 7105. Also in this case, in order to prevent the sample from warping, it is used for measurement after being bonded to a black acrylic substrate using an optically transparent adhesive so that the fine uneven surface of the antiglare layer becomes the surface. . In this state, light is incident at 45 ° from the concave and convex surface side, and measurement is performed. The measured value here is a total value of values measured using four types of optical combs in which the widths of the dark part and the bright part are 0.5 mm, 1.0 mm, and 2.0 mm, respectively. In this case, the maximum value of the reflection definition is 300%. In general, when the reflection definition becomes high, the antiglare property is lowered and reflection tends to occur. Therefore, it is preferable that the reflection definition is low.

[3] Evaluation of anti-glare performance of anti-glare film (Visual evaluation of reflections and whitishness)
In order to prevent reflection from the back surface of the antiglare film, the antiglare film is bonded to the black acrylic resin plate so that the uneven surface becomes the surface, and visually observed from the uneven surface side in a bright room with a fluorescent lamp. Then, visually evaluate the presence or absence of reflection of the fluorescent lamp and the degree of whitishness.

(Evaluation of glare)
Glare is evaluated by the following method. First, the polarizing plates on both the front and back sides are peeled off from a commercially available liquid crystal television (LC-32GH3, manufactured by Sharp Corporation). Instead of these original polarizing plates, both the back side and the display side are polarizing plates (Sumikaran SRDB31E, manufactured by Sumitomo Chemical Co., Ltd.). Adhesive so that each absorption axis coincides with the absorption axis of the original polarizing plate. Further, the antiglare film shown in the following examples is laminated on the display surface side polarizing plate via an adhesive such that the uneven surface is the surface. In this state, the degree of glare is sensory evaluated by visual observation from a position about 30 cm away from the sample.

<Example 1>
A surface of a 200 mm diameter aluminum roll (JIS A5056) with copper ballad plating is prepared. Copper ballad plating consists of a copper plating layer / thin silver plating layer / surface copper plating layer, and the thickness of the entire plating layer is set to be about 200 μm. The copper plating surface is mirror-polished, and a photosensitive resin is applied to the polished copper plating surface and dried to form a photosensitive resin film. Then, the pattern having a pattern (random brightness distribution shown in FIG. 14, is passed through a bandpass filter for removing 0.039Myuemu ^-1 or lower spatial frequency components and 0.146Myuemu ^-1 or more high spatial frequency components A pattern in which a size of 33 mm × 33 mm and a resolution of 12800 dpi) is repeatedly arranged is exposed on a photosensitive resin film with a laser beam and developed. The laser beam exposure and development are performed using Laser Stream FX (manufactured by Sink Laboratories). A positive photosensitive resin is used for the photosensitive resin film.

  Thereafter, an etching process is performed with cupric chloride solution. In this case, the etching amount is set to 3 μm. Thereafter, the photosensitive resin film is completely removed from the roll to form the first uneven surface. At this time, the ratio (A) of the flat portion of the first uneven surface is 48%, the average depth (B) of the recesses is 2.8 μm, and the average value (C) of the center-to-center linear distance of the recesses is 16 μm. To do.

  Next, chromium plating is performed on the first uneven surface to produce a mold. In this case, the chromium plating thickness is set to 8 μm.

A photocurable resin composition GRANDIC 806T (manufactured by Dainippon Ink & Chemicals, Inc.) is dissolved in ethyl acetate to obtain a 50% strength by weight solution. Further, a photopolymerization initiator, Lucillin TPO (manufactured by BASF). Chemical name: 2,4,6-trimethylbenzoyldiphenylphosphine oxide) is added at 5 parts by weight per 100 parts by weight of the curable resin component to prepare a coating solution. This coating solution is applied onto a triacetylcellulose (TAC) film having a thickness of 80 μm so that the coating thickness after drying is 6 μm, and is dried for 3 minutes in a dryer set at 60 ° C. The dried film is brought into close contact with the uneven surface of the previously obtained mold by pressing with a rubber roll so that the photocurable resin composition layer is on the mold side. In this state, light from a high-pressure mercury lamp having an intensity of 20 mW / cm ² is irradiated from the TAC film side so that the amount of light in terms of h-line is 200 mJ / cm ² to cure the photocurable resin composition layer. Thereafter, the TAC film is peeled from the mold together with the cured resin, and a transparent antiglare film made of a laminate of the cured resin having irregularities on the surface and the TAC film is produced.

  An antiglare film obtained from a mold produced by a production method that satisfies all the requirements of the present invention does not cause glare, exhibits sufficient antiglare properties, and does not cause whiteness. In addition, since the haze is low, the contrast does not decrease even when it is arranged in an image display device. Furthermore, there are few defects.

  DESCRIPTION OF SYMBOLS 1 Mold base material, 2 Surface, 3 Concave, 4 1st uneven surface, 6 Photosensitive resin film, 7 Exposed area | region, 8 Unexposed area | region, 9 Mask, 10 Unmasked area, 11 2nd uneven surface , 12 Direction parallel to the surface of the mold base material, 13 Direction perpendicular to the surface of the mold base material, 14 Cutting tool, 14a Cutting edge of the cutting tool, 15 Processing table, 16 Z-axis drive unit, 17 Minute reciprocation Movement mechanism for movement, 18a Movement locus of tip of cutting tool, 18b Movement locus of cutting tool, 19 Cylindrical mold support mechanism, 20 Motor for rotating cylindrical mold, 21 Y-axis driving section, 22 Colored coating film, 23 Chromium plating layer.

Claims (5)

A polishing step for polishing the surface of the mold substrate;
A first concavo-convex surface forming step of forming a first concavo-convex surface comprising a flat portion and a concave portion on the polished surface;
A plating step of performing chromium plating or nickel plating on the first uneven surface and forming a second uneven surface,
In the plating step, the area occupied by the flat portion on the first concavo-convex surface is A (%), the average depth of the recesses is B (μm), and the average linear distance between the centers of the recesses is C (μm). The manufacturing method of the metal mold | die for glare-proof film manufacture characterized by satisfy | filling the following conditions, when plating thickness is set to D (micrometer).
The first uneven surface forming step includes
A photosensitive resin film coating step of coating and forming a photosensitive resin film on the polished surface;
An exposure step of exposing a pattern on the photosensitive resin film;
A development step of developing the photosensitive resin film on which the pattern is exposed;
Etching process using the developed photosensitive resin film as a mask to form irregularities on the polished plated surface;
The manufacturing method of the metal mold | die for glare-proof film manufacture of Claim 1 including the photosensitive resin film peeling process of peeling the photosensitive resin film after an etching process.   Cutting in which the first concavo-convex surface forming step moves relatively linearly in a direction parallel to the surface of the mold base and moves reciprocally in a direction perpendicular to the surface of the mold base simultaneously with the linear movement. The manufacturing method of the metal mold | die for glare-proof film manufacture of Claim 1 performed by the cutting process by a tool. The first uneven surface forming step includes
A colored paint application process for applying a colored paint to the polished surface to form a colored coating film,
A laser irradiation process for drawing a pattern on the colored coating film with a laser;
Etching process using the colored coating film on which the pattern is drawn as a mask, and forming irregularities on the polished plating surface,
The manufacturing method of the metal mold | die for anti-glare film manufacture of Claim 1 including the colored coating-film peeling process of peeling a colored coating film after an etching process.   The uneven surface of the mold is transferred to the transparent resin film after transferring the uneven surface of the anti-glare film manufacturing mold manufactured by the method for manufacturing the anti-glare film manufacturing mold according to claim 1. A method for producing an antiglare film, comprising: peeling the transferred transparent resin film from the mold for producing the antiglare film.