JP5513582B2 - Radiation detector - Google Patents

Description

  The present invention relates to a dual energy type radiation detector.

  A dual energy type radiation detector is a device that detects radiation in a low energy range and radiation in a high energy range that has passed through an object to be inspected (see, for example, Patent Document 1). According to such a radiation detector, a radiation image in a low energy range and a radiation image in a high energy range are simultaneously acquired, and predetermined processing (for example, weighted subtraction or superposition) is performed based on the radiation images. By creating the processed image, detection of foreign matter, measurement of component distribution, measurement of weight, etc. in non-destructive inspection (that is, in-line non-destructive inspection) of inspection objects conveyed by a belt conveyor, etc. Can be realized with high accuracy.

Japanese Patent Publication No. 5-68674

  By the way, for dual energy type radiation detectors, further improvement in reliability is expected, such as preventing the radiation images in the low energy range and the radiation images in the high energy range that were acquired at the same time from shifting. Yes.

  Therefore, the present invention has been made in view of such circumstances, and an object thereof is to provide a highly reliable radiation detector.

In order to achieve the above object, a radiation detector according to the present invention is a radiation detector that detects radiation incident from one side, and extends along a predetermined direction to convert the radiation into light. A first scintillator layer, a first photodetector fixed to the first scintillator layer, which converts light converted by the first scintillator layer into an electrical signal, and one side of the first photodetector; A slit structure that is disposed and allows radiation to pass through, a second scintillator layer that extends along a predetermined direction and converts radiation into light, and is fixed to the second scintillator layer, and the second scintillator layer is A second photodetector that converts the converted light into an electrical signal, and the slit structure includes a first plate-like member in which a slit extending in a predetermined direction is formed, and a first plate-like member A second plate-like member that supports the member from the other side; And, the second plate-like member, the wall portion which is erected toward the other side is characterized in that it is formed along the edge of the slit.

  The radiation detector includes a slit structure that is disposed on one side of the first photodetector and allows radiation to pass therethrough. The slit structure includes a first slit formed with a slit extending in a predetermined direction. A plate-shaped member and a second plate-shaped member that supports the first plate-shaped member from the other side are provided, and the second plate-shaped member has a wall portion erected toward the other side. It is formed along the edge of the slit. Thereby, even if a relatively soft material such as lead is used for the first plate member in order to shield radiation reliably, the deformation of the slit formed in the first plate member is the second plate shape. Since it is prevented by the member, radiation can be reliably incident on a line along a predetermined direction. As described above, according to this radiation detector, reliability can be improved.

  In the radiation detector according to the present invention, the thickness of the first scintillator layer may be smaller than the thickness of the second scintillator layer.

  A radiation detector according to the present invention includes a mechanism body to which a first scintillator layer and a first photodetector are attached, and has an opening for allowing radiation to enter the first scintillator layer. May be attached to one side of the mechanism body in a state of being disposed in the opening.

  According to the present invention, the reliability of the radiation detector can be improved.

It is a block diagram of the nondestructive inspection system to which the X-ray line sensor which is one Embodiment of the radiation detector which concerns on this invention was applied. It is sectional drawing of the X-ray line sensor of FIG. It is a principal part enlarged view of the X-ray line sensor of FIG. It is sectional drawing along the IV-IV line of the X-ray line sensor of FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected to the same or an equivalent part, and the overlapping description is abbreviate | omitted.

  FIG. 1 is a configuration diagram of a nondestructive inspection system to which an X-ray line sensor which is an embodiment of a radiation detector according to the present invention is applied. As shown in FIG. 1, the nondestructive inspection system 50 includes a belt conveyor 51 that conveys the inspection object S, and an X-ray source 52 that emits X-rays toward the inspection object S conveyed by the belt conveyor 51. And a dual energy type X-ray line that detects X-rays in the low energy range (radiation in the first energy range) and X-rays in the high energy range (radiation in the second energy range) transmitted through the inspection object S A sensor (one-dimensional sensor) 1, an X-ray shielding box 53 that covers the inspection object S, the X-ray source 52, and the X-ray line sensor 1, and a computer 54 that is electrically connected to the X-ray line sensor 1. I have. Based on the X-ray transmission image in the low energy range and the X-ray transmission image in the high energy range acquired at the same time, the computer 54 creates a processed image that has been subjected to predetermined processing (for example, weighted subtraction or superposition). To do.

  Hereinafter, although a line sensor is illustrated as a one-dimensional sensor, it is not limited to this, As another one-dimensional sensor applicable to the radiation detector which concerns on this invention, a TDI sensor etc. are mentioned, for example.

  According to the nondestructive inspection system 50 configured as described above, the measurement of the component distribution, the measurement of the weight, and the like can be realized with high accuracy for the inspection object S such as food and electronic parts, starting with the detection of foreign matter. be able to.

  2 is a cross-sectional view of the X-ray line sensor of FIG. 1, FIG. 3 is an enlarged view of the main part of the X-ray line sensor of FIG. 2, and FIG. It is sectional drawing along an IV line. As shown in FIGS. 2 to 4, the X-ray line sensor 1 includes a rectangular parallelepiped mechanism body 2 made of aluminum. The mechanism body 2 has a front stage portion 3 constituting the front side (X-ray source 52 side) and a rear stage portion 4 constituting the rear side, and the front stage portion 3 is provided with an opening 5.

  A slit structure 6 that allows X-rays emitted from the X-ray source 52 to pass through is attached to the front side of the mechanism body 2. The slit structure 6 includes a first plate-like member 7 formed with slits 7a extending in a predetermined direction (a direction perpendicular to the conveyance direction of the inspection object S when viewed from the front side), and a first plate member 7 It has the 2nd plate-shaped member 8 which supports this plate-shaped member 7 from the back side. The first plate-like member 7 is made of a metal (for example, lead) that shields X-rays, and the second plate-like member 8 is a metal having higher hardness than the metal used for the first plate-like member 7 ( For example, it is made of stainless steel.

  The second plate-like member 8 is formed with a wall portion 8a erected toward the rear side along one edge portion and the other edge portion extending in the longitudinal direction of the slit 7a. . The wall 8 a is disposed in the opening 5 provided in the front stage 3 of the mechanism body 2.

  A first photodetector 11 is attached to the inner surface of the front stage portion 3 of the mechanism body 2. The first photodetector 11 has a rectangular plate-like first substrate 12 fixed to the front part 3 of the mechanism body 2 and a first dimension in a predetermined direction while taking a slight first gap 13. A plurality of (e.g., 8 to 14) first light detection devices 14 disposed on one substrate 12, and each light detection device 14 disposed on the first substrate 12 and electrically connected thereto by wire bonding It has a connected amplifier circuit 15 and the like. The first light detection device 14 includes a first light that is a photoelectric conversion element so as to face the slit 7a in the X-ray incident direction (the direction in which the inspection object S is conveyed and the direction orthogonal to the predetermined direction). A plurality of (for example, 128) detectors 16 are formed in one dimension along a predetermined direction.

  A second photodetector 17 is attached to the inner surface of the rear stage portion 4 of the mechanism body 2. The second photodetector 17 includes a rectangular plate-like second substrate 18 fixed to the rear stage portion 4 of the mechanism body 2 and a first dimension one-dimensionally along a predetermined direction while taking a slight second gap 19. A plurality of (for example, 8 to 14) second light detection devices 21 disposed on the second substrate 18, and each light detection device 21 disposed on the second substrate 18 and electrically connected by wire bonding A connected amplifier circuit 22 and the like are included. The second photodetection device 21 includes a second photodetection unit 23 that is a photoelectric conversion element along a predetermined direction so as to face each of the first photodetection units 16 in the X-ray incident direction. A plurality (for example, 128) are formed in one dimension.

  Note that the configuration of the first photodetector 11 and the configuration of the second photodetector 17 are substantially the same, and as the photodetecting devices 14 and 21, for example, a line sensor such as a CCD or a CMOS is used. When viewed from the front side, one edge 12a of the first substrate 12 is located outside the one edge 18a of the second substrate 18 in a direction orthogonal to the predetermined direction. The other edge 18 b of the second substrate 18 is located outside the other edge 12 b of the first substrate 12.

  A first scintillator layer 24 that extends along a predetermined direction and absorbs X-rays in a low energy range and emits light is disposed behind the first light detection device 14 and the first gap 13. Has been. The first light detection unit 16 of the first light detection device 14 is fixed to the front side of the first scintillator layer 24 by the first adhesive 25, and the light emitted from the first scintillator layer 24 is converted into an electrical signal. Convert. The first adhesive 25 may be filled not only between the first scintillator layer 24 and the first light detection device 14 but also in the first gap 13 or may not be filled. Good.

  The first scintillator layer 24 is integrally formed in a tape shape with a thickness of about 0.1 mm in the longitudinal direction of the slit 7a, for example, with gadolinium. The width of the first scintillator layer 24 is wider than the width of the slit 7a in a direction orthogonal to the predetermined direction when viewed from the front side.

  A second scintillator layer 26 that extends along a predetermined direction and absorbs X-rays in a high energy range and emits light is disposed in front of the second light detection device 21 and the second gap 19. ing. The second light detection unit 23 of the second light detection device 21 is fixed to the rear side of the second scintillator layer 26 by the second adhesive 27, and the light emitted from the second scintillator layer 26 is an electric signal. Convert to The second adhesive 27 may be filled not only between the second scintillator layer 26 and the second light detection device 21 but also in the second gap 19 or may not be filled. Good.

  The second scintillator layer 26 includes a plurality of scintillator units 28 arranged in a one-dimensional manner along a predetermined direction so as to face each of the second light detection units 23 in the X-ray incident direction, and the X-rays The reflective layer 29 which covers the scintillator part 28 except the surface where the 2nd photon detection part 23 which opposes in the incident direction is fixed. The scintillator unit 28 absorbs X-rays in the high energy range and emits light. However, in order to reliably absorb X-rays in the high energy range while maintaining high resolution, for example, cadmium tungstate has a bottom surface of 0. It is formed in a quadrangular prism shape with a height of about 4 mm × 0.4 mm and a height of about 2 mm. The reflection layer 29 is formed, for example, by adhering a light-shielding plate on which a metal such as aluminum is vapor-deposited to the scintillator portion 28, and allows the X-rays to pass through and the light emitted from the first scintillator layer 24 and the scintillator portion. The light emitted by 28 is reflected. In this case, it is preferable that the other surface of the scintillator unit 28 except the surface on which the scintillator unit 28 and the second light detection unit 23 are fixed is covered with a reflection plate to form the reflection layer 29. In the reflective layer 29, when viewed from the front side, the thickness of the portion 29a facing in the direction orthogonal to the predetermined direction is greater than the thickness of the other portions. The reflective layer 29 may be a reflective film formed by evaporating aluminum on the scintillator portion 28.

  It should be noted that the hardness of the first adhesive 25 used for fixing the first scintillator layer 24 and the first photodetector 11 and the fixing of the second scintillator layer 26 and the second photodetector 17 are used. With respect to the hardness of the second adhesive 27 used, the difference in the first temperature deformation amount between the first scintillator layer 24 and the first photodetector 11, and the second scintillator layer 26 and the second scintillator layer 26. Of the second difference in temperature deformation amount with respect to the photodetector 17, the hardness of the adhesive used for the one with the larger difference in temperature deformation amount is that of the adhesive used for the one with the smaller difference in temperature deformation amount. It is lower than the hardness. In this embodiment, since the first scintillator material and the second scintillator material are different, the amount of temperature deformation is different. Here, as the hardness of the adhesive, for example, Shore hardness (JIS Z2246) can be applied. Further, the first scintillator layer 24 and the second scintillator layer 26 (provided with the reflective layer 29) are brought into contact so as to slide. Both surfaces of the interface between the first scintillator layer 24 and the reflective layer 29 and the interface between the second scintillator layer 26 and the reflective layer 29 may be fixed with an adhesive, or only one of the interfaces. May be adhered and fixed. In the former case, similarly to the above, the difference in the first temperature deformation amount between the first scintillator layer 24 and the first photodetector 11, and the second scintillator layer 26 and the second photodetector. 17 of the second difference in temperature deformation amount with respect to 17, the hardness of the adhesive used for the larger difference in temperature deformation amount is lower than the hardness of the adhesive used in the smaller difference in temperature deformation amount It has become. By using adhesives having different hardness according to the difference in the amount of temperature deformation, peeling at the interface between the reflective layer 29 and the scintillator and peeling at the interface between the detector and the scintillator can be prevented. In the latter case, the first scintillator layer 24 and the second scintillator layer 26 are in contact with each other so as to slide through the reflective layer 29, so that peeling at each interface due to the difference in the amount of temperature deformation occurs. Can be prevented. The configuration of the first scintillator layer 24 and the configuration of the second scintillator layer 26 are different, such that the thickness of the first scintillator layer 24 is extremely thinner than the thickness of the second scintillator layer 26. Yes.

  An electrical signal output connector 31 is connected to the first substrate 12 of the first photodetector 11. The electrical signal output from the first photodetector 11 is transmitted to the computer 54 via the connector 31, the A / D conversion / scanning conversion circuit board 33, and the like. Similarly, an electrical signal output connector 32 is connected to the second substrate 18 of the second photodetector 17. The electrical signal output from the second photodetector 17 is transmitted to the computer 54 via the connector 32, the A / D conversion / scanning conversion circuit board 34, and the like.

  An operation of the nondestructive inspection system 50 to which the X-ray line sensor 1 configured as described above is applied will be described.

  The X-rays emitted from the X-ray source 52 and transmitted through the inspection object S pass through the slit 7a and the walls 8a and 8a, pass through the first photodetector 11, and enter the first scintillator layer 24. Incident. Of the X-rays incident on the first scintillator layer 24, the X-rays in the low energy range are absorbed by the first scintillator layer 24. At this time, the light emitted from the first scintillator layer 24 is the first light. It is converted into an electric signal by the first light detection unit 16 of the detector 11. This electric signal is transmitted to the computer 54 via the amplifier circuit 15 of the first photodetector 11, the connector 31, the A / D conversion / scanning conversion circuit board 33, etc., and the computer 54 transmits X-rays in a low energy range. An image is acquired.

  Among the X-rays incident on the first scintillator layer 24, the X-rays in the high energy range are transmitted through the first scintillator layer 24 and the reflective layer 29 and absorbed by the scintillator portion 28 of the second scintillator layer 26. At this time, the light emitted from the scintillator unit 28 is converted into an electric signal by the second light detection unit 23 of the second photodetector 17. This electric signal is transmitted to the computer 54 via the amplifier circuit 22 of the second photodetector 17, the connector 32, the A / D conversion / scanning conversion circuit board 34, and the like, and the computer 54 transmits X-rays in a high energy range. An image is acquired.

  The X-ray transmission image in the low energy range and the X-ray transmission image in the high energy range acquired at the same time are subjected to predetermined processing (for example, weighted subtraction or superposition) by the computer 54, and the inspection object S The processed image is created. As a result, foreign object detection, component distribution measurement, weight measurement, and the like can be realized with high accuracy on the inspection object S conveyed by the belt conveyor 51.

  As described above, the X-ray line sensor 1 absorbs the first scintillator layer 24 that emits light by absorbing X-rays in the low energy range and the X-rays in the high energy range, as shown in FIG. The second scintillator layer 26 that emits light is brought into contact with the first scintillator layer 24 disposed on the front side of the second scintillator layer 26 disposed on the rear side. The thickness is thin (it is smaller than the distance between the centers of the adjacent first photodetecting portions 16). Accordingly, the deviation between the light emission position P1 in the first scintillator layer 24 and the light emission position P2 in the second scintillator layer 26 with respect to X-rays in the low energy range and X-rays in the high energy range incident from the front side at the same angle. Since the amount is small, at this time, the light emitted from the first scintillator layer 24 and the light emitted from the second scintillator layer 26 are opposite to each other in the X-ray incident direction. Are detected by the light detection unit 23. Therefore, it is possible to prevent the X-ray transmission image in the low energy range and the X-ray transmission image in the high energy range that are simultaneously acquired from shifting.

  Moreover, in the X-ray line sensor 1, as FIG. 2 shows, the 1st light detection part 16 is more than the one edge part 18a of the 2nd board | substrate 18 with which the 2nd light detection part 23 was provided. One edge 12a of the provided first substrate 12 is located outside, and conversely, the other edge 18b of the second substrate 18 is more than the other edge 12b of the first substrate 12. Is located on the outside. Therefore, even if the first substrate 12 and the second substrate 18 come close to each other by reducing the thickness of the first scintillator layer 24, the portion of the first substrate 12 that does not overlap the second substrate 18 The amplifier circuit 15 and the connector 31 are disposed on the second substrate 18, and the amplifier circuit 22 and the connector 32 are disposed on a portion of the second substrate 18 that does not overlap with the first substrate 12. It is possible to avoid irradiating 32 etc. with X-rays.

  In the X-ray line sensor 1, the slit structure 6 that allows X-rays to pass through includes the first plate-like member 7 formed with slits 7 a extending in a predetermined direction, and the first plate-like member 7. It has the 2nd plate-shaped member 8 supported from the back side, and the wall part 8a standingly arranged toward the back side is provided in the 2nd plate-shaped member 8 at one edge part and the other of the slit 7a. It is formed along the edge part. Thus, even if a relatively soft material such as lead is used for the first plate member 7 in order to reliably shield X-rays, the deformation of the slit 7a formed in the first plate member 7 is reduced. Since it is prevented by the two plate-like members 8, X-rays can be reliably incident on a line along a predetermined direction. The wall portion 8a not only functions as a slit for X-rays, but also functions as a rib that improves the bending strength of the second plate-like member 8.

  In the X-ray line sensor 1, when viewed from the front side, the width of the first scintillator layer 24 is wider than the width of the slit 7a in the direction orthogonal to the predetermined direction. As a result, even if the thickness of the first scintillator layer 24 is reduced, the strength of the first scintillator layer 24 can be suppressed from decreasing, and X-rays in the low energy range can be transmitted to the first scintillator layer 24. 24 can be reliably absorbed.

  Further, in the X-ray line sensor 1, as shown in FIG. 4, the first light detection unit 16 has a plurality of first elements arranged one-dimensionally along a predetermined direction while taking the first gap 13. By forming at least two in each of the light detection devices 14, the first scintillator layer 24 is arranged in one dimension along a predetermined direction, and the first scintillator layer 24 includes the first light detection device 14 and the first gap 13. It is arranged on the back side. Accordingly, it is possible to avoid the adjacent optical detection devices 14 and 14 from coming into contact with each other and damaging them, and the gap 13 between the adjacent optical detection devices 14 and 14 as well as on the optical detection device 14. Since the scintillator layer 24 is also disposed on the top, it is possible to prevent the dead zone from being generated on the line along the predetermined direction in the first photodetector 11.

  Similarly, at least two second light detection units 23 are formed in each of the plurality of second light detection devices 21 arranged one-dimensionally along a predetermined direction while taking the second gap 19. Thus, the second scintillator layer 26 is disposed in front of the second light detection device 21 in a one-dimensional manner along a predetermined direction. Thereby, it can avoid that the adjacent optical detection devices 21 and 21 contact and they are damaged.

  In the X-ray line sensor 1, the second scintillator layer 26 includes a plurality of scintillator units 28 arranged one-dimensionally along a predetermined direction, and a second light detection unit that faces in the X-ray incident direction. A reflective layer 29 is provided to cover the scintillator portion 28 except for the surface on which the 23 is fixed. The scintillator unit 28 absorbs X-rays in the high energy range and emits light. The reflective layer 29 transmits X-rays, and the light generated by the first scintillator layer 24 and the scintillator unit 28 emits light. 3 and 4, as seen from the front side, the thickness of the portion 29a facing in the direction orthogonal to the predetermined direction is made thicker than the thickness of the other portions. Has been. Accordingly, it is possible to prevent the occurrence of crosstalk between the adjacent second light detection units 23 and 23. Furthermore, even if the scintillator portion 28 of the second scintillator layer 26 is columnar in order to absorb X-rays in a high energy range while maintaining high resolution, the thickness 29a of the portion facing in a direction orthogonal to a predetermined direction Since the reflective layer 29 is formed so as to be thicker than other portions, the scintillator portion 28 can be reliably supported. Since the thickness of the first scintillator layer 24 is thinner than the thickness of the second scintillator layer 26, it is not necessary to provide the first scintillator layer 24 with a shielding layer that separates each first light detection unit 16. There is almost no influence of crosstalk between the adjacent first light detection units 16 and 16.

  The present invention is not limited to the embodiment described above. For example, in the above embodiment, the configuration of the first photodetector 11 and the configuration of the second photodetector 17 are substantially the same from the viewpoint of reducing the manufacturing cost, but the first photodetector The configuration of 11 and the configuration of the second photodetector 17 may be different.

  DESCRIPTION OF SYMBOLS 1 ... X-ray line sensor, 6 ... Slit structure, 7 ... 1st plate-shaped member, 7a ... Slit, 8 ... 2nd plate-shaped member, 8a ... Wall part, 11 ... 1st photodetector, 12 ... 1st board | substrate, 12a ... One edge part of 1st board | substrate, 12b ... The other edge part of 1st board | substrate, 13 ... 1st clearance gap, 14 ... 1st photon detection device, 16 ... 1st Photo detector 17, second photo detector 18, second substrate 18 a, one edge of the second substrate 18 b, the other edge of the second substrate, 19, second Gap, 21 ... second photodetection device, 23 ... second photodetection unit, 24 ... first scintillator layer, 26 ... second scintillator layer, 28 ... scintillator unit, 29 ... reflection layer.

Claims (3)

A radiation detector for detecting radiation incident from one side,
A first scintillator layer extending along a predetermined direction and converting the radiation into light;
A first photodetector that is fixed to the first scintillator layer and converts light converted by the first scintillator layer into an electrical signal;
A slit structure disposed on one side of the first photodetector and allowing the radiation to pass through;
A second scintillator layer extending along the predetermined direction and converting the radiation into light;
A second photodetector that is fixed to the second scintillator layer and converts the light converted by the second scintillator layer into an electrical signal ;
The slit structure has a first plate-like member in which a slit extending in the predetermined direction is formed, and a second plate-like member that supports the first plate-like member from the other side. ,
The radiation detector, wherein the second plate-like member has a wall portion erected toward the other side along the edge of the slit. The thickness of the first scintillator layer is a radiation detector according to claim 1, wherein a thinner than the thickness of the second scintillator layer. The first scintillator layer and the first photodetector are attached, and a mechanism having an opening for allowing the radiation to enter the first scintillator layer,
The slit structure is in a state in which the wall portion is disposed in said opening, the radiation detector according to claim 1 or 2 Symbol mounting, characterized in that mounted on one side of the mechanism.

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