JP5507438B2 - Liquid processing apparatus and liquid processing method - Google Patents

Description

  The present invention relates to a liquid processing apparatus and a liquid processing apparatus for performing liquid processing such as cleaning processing, etching processing, plating processing, and development processing of a substrate by supplying a processing liquid to the substrate while rotating the substrate while being held in a horizontal state. It relates to the processing method.

  Conventionally, a substrate cleaning process, an etching process, or a plating process is performed by supplying a processing liquid to the front and back surfaces of the substrate while rotating the substrate such as a semiconductor wafer (hereinafter also referred to as a wafer) in a horizontal state while rotating the substrate. Various types of liquid processing apparatuses that perform liquid processing such as development processing are known (see, for example, Patent Document 1). Patent Document 1 discloses a single-wafer type that processes substrates one by one such that a substrate is horizontally held by a spin chuck and rotated, and a processing liquid is supplied to the surface of the substrate held and rotated by the spin chuck. A liquid processing apparatus is disclosed. Further, in such a single wafer type liquid processing apparatus, an FFU (fan filter unit) is provided above the processing chamber, and a gas such as N2 gas (nitrogen gas) or clean air is flowed down from the FFU into the processing chamber. Sending technology is known.

  A configuration of a liquid processing apparatus in which an FFU is provided above the processing chamber will be described with reference to FIGS. FIG. 10 is a side view showing a schematic configuration of a conventional liquid processing apparatus, and FIG. 11 is a top view of the conventional liquid processing apparatus shown in FIG. As shown in FIGS. 10 and 11, the conventional liquid processing apparatus 200 includes a processing chamber (chamber) 210 in which a wafer W is accommodated and liquid processing of the accommodated wafer W is performed. As shown in FIGS. 10 and 11, a holding unit 220 for holding and rotating the wafer W is provided in the processing chamber 210, and a cup 230 is disposed around the holding unit 220. ing. In the conventional liquid processing apparatus 200, the nozzle 240 for supplying the processing liquid to the wafer W held by the holding unit 220 from above the cup 230 and the arm 241 that supports the nozzle 240 are provided in the processing chamber 210. Is provided. Further, the arm 241 is provided with an arm support portion 242 extending in a substantially vertical direction, and the arm 241 is supported by the arm support portion 242. The arm support portion 242 can be driven to rotate in both forward and reverse directions by a drive mechanism (not shown). As a result, the arm 241 can rotate in both forward and reverse directions around the arm support portion 242, and the arm 241 is an advanced position for supplying the processing liquid to the wafer W held by the holding portion 220 (see the solid line in FIG. 11). ) And the retracted position retracted from the cup 230 (see the two-dot chain line in FIG. 11), the arm support portion 242 is rotated (see the arrow in FIG. 11).

  Further, as shown in FIG. 10, an FFU (fan filter unit) 250 is provided above the processing chamber 210, and N2 gas (nitrogen gas), clean air, and other gases are always processed by the downflow from the FFU 250. It is sent into the chamber 210. An exhaust unit 260 is provided at the bottom of the processing chamber 210, and the exhaust of the atmosphere in the processing chamber 210 is performed by the exhaust unit 260. As described above, a gas such as clean air is sent from the FFU 250 into the processing chamber 210 in a down flow, and the gas in the processing chamber 210 is replaced by exhausting the gas by the exhaust unit 260. ing.

JP 2009-94525 A

  However, in the conventional liquid processing apparatus 200 as shown in FIGS. 10 and 11, the arm 241 that supports the nozzle 240 and the arm support portion 242 that supports the arm 241 are provided in the processing chamber 210. The space in the region outside 230 becomes large, and it becomes difficult for the atmosphere in the processing chamber 210 to be replaced in the region outside the cup 230. Specifically, the region indicated by the reference symbol X in FIGS. 10 and 11 is located outside the cup 230, so that the gas sent from the FFU 250 into the processing chamber 210 in the down flow is retained. In such a region, atmosphere replacement may not be performed properly. For this reason, in the conventional liquid processing apparatus 200, when a chemical solution or the like is scattered in an area indicated by reference numeral X when the wafer W is processed in the processing chamber 210, the atmosphere of the chemical liquid remains in the area. In the subsequent processing of the wafer W, the atmosphere of the remaining chemical solution may cause an adverse effect such as contamination of the wafer W. Specifically, there is a problem that particles may be caused when a chemical solution or the like is reattached to various dried products including the processed wafer W. In addition, there is a problem in that a crystalline substance is generated by causing a chemical reaction in an alkaline or acidic atmosphere in the remaining chemical solution, thereby causing particles.

  The present invention has been made in consideration of such points, and can improve the substitutability of the atmosphere in the processing chamber, and the atmosphere of chemicals and the like scattered during the liquid processing of the substrate is in the processing chamber. It is an object of the present invention to provide a liquid processing apparatus and a liquid processing method that can be prevented from remaining. In addition to the above-described object, the present invention allows the cleaning liquid stored in the storage portion of the cleaning unit to evaporate and the atmosphere of the cleaning liquid enter the processing chamber when the cup outer cylinder is in the lower position. It is an object of the present invention to provide a liquid processing apparatus and a liquid processing method capable of preventing the above-described problems.

  The liquid processing apparatus of the present invention includes a substrate holding unit for holding and rotating a substrate in a horizontal state, a processing chamber in which a cup disposed around the substrate holding unit is provided, and the substrate holding unit A nozzle for supplying a processing liquid to a substrate held on the substrate, and supports the nozzle, and is movable in a horizontal direction between an advanced position that has advanced into the processing chamber and a retracted position that has retracted from the processing chamber. And an arm standby portion provided adjacent to the processing chamber for waiting for the arm retracted from the processing chamber, and disposed around the cup in the processing chamber, A cup outer cylinder that can be moved up and down between and a lower position, and a cleaning part for cleaning the cup outer cylinder, and having a storage part for storing cleaning liquid, the cup outer cylinder In the down position And a cleaning part that is immersed in the cleaning liquid stored in the storage portion, and the upper part of the cup outer peripheral cylinder has the cleaning when the cup outer peripheral cylinder is in a lower position. The lid | cover for covering the washing | cleaning liquid stored by the said storage part of a part is provided.

  The liquid processing method of the present invention includes a step of holding a substrate in a horizontal state by a substrate holding portion provided inside the processing chamber, and a cup outer cylinder disposed around the cup in the processing chamber from a lower position. Moving to an upper position, isolating the region in the cup outer cylinder from the outside, and advancing the arm supporting the nozzle into the processing chamber from an arm standby portion provided adjacent to the processing chamber; The step of rotating the substrate by the substrate holding unit, supplying the processing liquid to the rotating substrate held by the substrate holding unit by the nozzle of the arm that has advanced into the processing chamber, and cleaning the cup outer peripheral cylinder by the cleaning unit And when the cup outer cylinder is in the lower position, the cup outer cylinder is immersed in the cleaning liquid stored in the storage portion of the cleaning unit. A step of cleaning the tube, and a step of covering the cleaning liquid stored in the storage portion of the cleaning unit with a lid provided on the upper portion of the cup outer peripheral tube when the cup outer peripheral tube is in the lower position. It is characterized by that.

  According to such a liquid processing apparatus and a liquid processing method, in the cleaning unit, when the cup outer peripheral cylinder is in the lower position, the cup outer peripheral cylinder is immersed in the cleaning liquid stored in the storage portion, A lid that covers the cleaning liquid stored in the storage portion when the cup outer peripheral cylinder is in the lower position is provided on the upper part of the cup outer peripheral cylinder. Here, in the cleaning unit, when the temperature of the cleaning liquid stored in the storage part is high (specifically, for example, 60 ° C. or more), the cleaning liquid stored in the storage part is likely to evaporate. For example, if the vapor of the liquid adheres to the substrate or the like during the drying process of the substrate in the processing chamber, there is a problem that it causes particles. In this case, there is also a problem that the drying efficiency of the substrate is deteriorated. On the other hand, according to the liquid processing apparatus and the liquid processing method as described above, the lid is provided on the upper portion of the cup outer peripheral tube, so that when the cup outer peripheral tube is in the lower position, This prevents the cleaning liquid from evaporating and the cleaning liquid atmosphere from entering the processing chamber.

  In the liquid processing apparatus of the present invention, a lid for covering the cleaning liquid stored in the storage portion of the cleaning unit when the cup outer peripheral cylinder is in the upper position is provided at the lower part of the cup outer peripheral cylinder. May be.

  In the liquid processing apparatus of the present invention, a wall extending in the vertical direction is provided between the processing chamber and the arm standby portion, and the wall is provided with an opening through which the arm can pass. Also good.

  In the liquid processing apparatus of the present invention, an exhaust part for exhausting the atmosphere in the processing chamber may be provided inside the cup outer peripheral tube.

  In the liquid processing apparatus of this invention, you may further provide the heating apparatus which heats the cleaning liquid sent to the said storage part of the said washing | cleaning part.

  According to the liquid processing apparatus and the liquid processing method of the present invention, when a substrate is carried into or out of a processing chamber, when the cup outer cylinder is at a lower position, It is possible to prevent the stored cleaning liquid from evaporating and the cleaning liquid atmosphere from entering the processing chamber.

It is the top view which looked at the liquid processing system containing the liquid processing apparatus by embodiment of this invention from upper direction. It is a top view which shows schematic structure of the liquid processing apparatus by embodiment of this invention. It is a side view of the liquid processing apparatus shown in FIG. It is a longitudinal cross-sectional view which shows the detail of a structure of the liquid processing apparatus shown in FIG. 2, Comprising: It is a figure which shows a state when a cup outer periphery cylinder exists in a downward position. It is a longitudinal cross-sectional view which shows the detail of a structure of the liquid processing apparatus shown in FIG. 2, Comprising: It is a figure which shows a state when a cup outer periphery cylinder exists in an upper position. (A) is an expanded longitudinal cross-sectional view which shows the structure of the holding member provided in the holding plate in the liquid processing apparatus shown in FIG. 4 etc., (b) is a lift pin plate below from the state shown in (a). It is an expanded longitudinal cross-sectional view which shows the state when it moves, (c) is an enlarged longitudinal cross-sectional view which shows a state when a lift pin plate moves further below from the state shown in (b). It is a perspective view which shows the structure of the cup outer periphery cylinder in the liquid processing apparatus shown in FIG. FIG. 4 is a side cross-sectional view illustrating a configuration of a cleaning unit of a cup outer peripheral cylinder of the liquid processing apparatus illustrated in FIG. The state when a cup outer periphery cylinder exists in a downward position is shown. It is a figure which shows the flow of the gas in a process chamber when a cup outer periphery cylinder exists in a downward position. It is a figure which shows the flow of the gas in a process chamber when a cup outer peripheral cylinder exists in an upper position. It is a side view which shows the schematic structure of the conventional liquid processing apparatus. It is a top view of the conventional liquid processing apparatus shown in FIG.

  Embodiments of the present invention will be described below with reference to the drawings. 1 to 9 are diagrams showing a liquid processing apparatus according to the present embodiment. More specifically, FIG. 1 is a top view of a liquid processing system including a liquid processing apparatus according to an embodiment of the present invention as viewed from above. FIG. 2 is a top view showing a schematic configuration of the liquid processing apparatus according to the embodiment of the present invention, and FIG. 3 is a side view showing the schematic configuration of the liquid processing apparatus shown in FIG. . 4 and 5 are longitudinal sectional views showing details of the configuration of the liquid processing apparatus shown in FIG. 6A is an enlarged longitudinal sectional view showing a configuration of a holding member provided on a holding plate in the liquid processing apparatus shown in FIG. 4 and the like, and FIG. 6B is a cup outer peripheral cylinder in the liquid processing apparatus shown in FIG. 4 and the like. It is a perspective view which shows the structure. FIG. 7 is a side sectional view showing the configuration of the cleaning portion of the cup outer cylinder of the liquid processing apparatus shown in FIG. 8 and 9 are diagrams showing the gas flow in the processing chamber when the cup outer cylinder is in the lower position and the upper position, respectively.

  First, a liquid processing system including a liquid processing apparatus according to the present embodiment will be described with reference to FIG. As shown in FIG. 1, a liquid processing system includes a mounting table 101 for mounting a carrier containing a substrate W (hereinafter also referred to as a wafer W) such as a semiconductor wafer as a substrate to be processed, and a carrier. A transfer arm 102 for taking out the accommodated wafer W, a shelf unit 103 for placing the wafer W taken out by the transfer arm 102, a wafer W placed on the shelf unit 103 are received, and the wafer W And a transport arm 104 for transporting the liquid into the liquid processing apparatus 10. As shown in FIG. 1, the liquid processing system is provided with a plurality (four in the embodiment shown in FIG. 1) of liquid processing apparatuses 10.

  Next, a schematic configuration of the liquid processing apparatus 10 according to the present embodiment will be described with reference to FIGS. 2 and 3.

  As shown in FIGS. 2 and 3, the liquid processing apparatus 10 according to the present embodiment includes a processing chamber (chamber) 20 in which a wafer W is accommodated and liquid processing of the accommodated wafer W is performed. As shown in FIG. 3, a holding unit 21 for holding and rotating the wafer W in a horizontal state is provided in the processing chamber 20, and a ring-shaped rotary cup 40 is provided around the holding unit 21. Is arranged. As shown in FIGS. 2 and 3, a cylindrical cup outer cylinder 50 is disposed around the rotary cup 40 in the processing chamber 20. As will be described later, the cup outer peripheral cylinder 50 can be raised and lowered according to the processing state of the wafer W. Details of the configurations of the holding portion 21, the rotating cup 40, and the cup outer peripheral cylinder 50 will be described later.

  Further, the liquid processing apparatus 10 is provided with a nozzle 82a for supplying a processing liquid from above the wafer W to the wafer W held by the holding unit 21, and a nozzle arm 82 for supporting the nozzle 82a. . As shown in FIG. 2, a single liquid processing apparatus 10 is provided with a plurality of (specifically, for example, six) nozzle arms 82, and a nozzle 82 a is provided at the tip of each nozzle arm 82. Further, as shown in FIG. 3, each nozzle arm 82 is provided with an arm support portion 84, and each arm support portion 84 is driven in the left-right direction in FIG. 3 by a drive mechanism (not shown). . As a result, each nozzle arm 82 linearly moves in the horizontal direction between the advanced position that has advanced into the processing chamber 20 and the retracted position that has retracted from the processing chamber 20 (FIGS. 2 and 2). 3 (see the arrows provided on each nozzle arm 82). As shown in FIG. 3, each nozzle arm 82 is provided with a surface treatment liquid supply pipe 82 m, and each surface treatment liquid supply pipe 82 m is connected to a surface treatment liquid supply part 89. Then, the processing liquid is supplied from the surface processing liquid supply unit 89 to the nozzles 82a of the nozzle arms 82 via the surface processing liquid supply pipes 82m.

  As shown in FIGS. 2 and 3, in the liquid processing apparatus 10, an arm standby unit 80 is provided adjacent to the processing chamber 20. In the arm standby section 80, the nozzle arm 82 retracted from the processing chamber 20 is configured to wait. A wall 90 extending in the vertical direction is provided between the arm standby unit 80 and the processing chamber 20. The wall 90 has an arm cleaning portion 88 provided with an opening 88a through which each nozzle arm 82 can pass. The arm cleaning unit 88 cleans each nozzle arm 82.

  Further, as shown in FIG. 3, an FFU (fan filter unit) 70 is provided above the processing chamber 20, and a gas such as N 2 gas (nitrogen gas) or clean air is flowed down from the FFU 70 in the processing chamber. 20 to be sent. As shown in FIGS. 2 and 3, an exhaust portion 54 is provided inside the cup outer peripheral cylinder 50 at the bottom of the processing chamber 20, and the exhaust portion 54 exhausts the atmosphere in the processing chamber 20. It has come to be. As described above, a gas such as clean air is sent from the FFU 70 into the processing chamber 20 in a down flow, and the gas in the processing chamber 20 is replaced by exhausting the gas by the exhaust unit 54. ing.

  As shown in FIGS. 2 and 3, an exhaust portion 56 is provided outside the cup outer peripheral cylinder 50 at the bottom of the processing chamber 20, and the exhaust portion 56 exhausts the atmosphere in the processing chamber 20. It has come to be. The exhaust part 56 can exhaust the atmosphere outside the cup outer peripheral cylinder 50 in the processing chamber 20. Specifically, the exhaust unit 56 prevents the atmosphere in the arm standby unit 80 from entering the cup outer peripheral cylinder 50. Further, the exhaust part 56 prevents the atmosphere in the cup outer cylinder 50 from coming out to the arm standby part 80.

  As shown in FIGS. 2 and 3, an exhaust unit 58 is provided at the bottom of the arm standby unit 80, and the atmosphere in the arm standby unit 80 is exhausted by the exhaust unit 58. Yes. Specifically, particles generated from a drive mechanism (not shown) for driving each nozzle arm 82 can be drawn by the exhaust unit 58.

  As shown in FIG. 2, shutters 60 and 62 for maintenance are provided at the processing chamber 20 of the liquid processing apparatus 10 and the entrance / exit of the arm standby unit 80, respectively. Since the processing chamber 20 and the arm standby unit 80 are provided with maintenance shutters 60 and 62, respectively, the devices in the process chamber 20 and the arm standby unit 80 can be individually maintained. In addition, while the wafer W is being processed in the processing chamber 20, it is possible to maintain the equipment in the arm standby unit 80 by opening the shutter 62.

  In addition, as shown in FIG. 2, an opening 94 a is provided on the side wall of the liquid processing apparatus 10 for carrying the wafer W into the processing chamber 20 by the transfer arm 104 and carrying the wafer W out of the processing chamber 20. The opening 94a is provided with a shutter 94 for opening and closing the opening 94a.

  In the liquid processing apparatus 10 shown in FIG. 2, the region inside the cup outer cylinder 50 in the processing chamber 20 is slightly positive with respect to the clean room, while the cup outer cylinder 50 in the processing chamber 20 is The outer area has a slight negative pressure against the clean room. For this reason, in the processing chamber 20, the air pressure in the region inside the cup outer peripheral tube 50 is larger than the air pressure in the region outside the cup outer peripheral tube 50.

  Next, details of the configuration of the liquid processing apparatus 10 as shown in FIGS. 2 and 3 will be described with reference to FIGS. 4 and 5.

  As shown in FIGS. 4 and 5, the holding unit 21 includes a disk-shaped holding plate 26 for holding the wafer W, and a disk-shaped lift pin plate 22 provided above the holding plate 26. ing. Three lift pins 23 for supporting the wafer W from below are provided on the upper surface of the lift pin plate 22 at equal intervals in the circumferential direction. In FIGS. 4 and 5, only two lift pins 23 are shown. The lift pin plate 22 is provided with a piston mechanism 24, and the lift pin plate 22 is moved up and down by the piston mechanism 24. More specifically, when the wafer W is placed on the lift pins 23 or taken out from the lift pins 23 by the transfer arm 104 (see FIG. 1), the lift pin plate 22 is moved to the position shown in FIG. The lift pin plate 22 is moved upward from a position as shown, and the lift pin plate 22 is positioned above the rotary cup 40. On the other hand, when liquid processing of the wafer W is performed in the processing chamber 20, the lift pin plate 22 is moved to a lower position as shown in FIG. 4 etc. by the piston mechanism 24, and the rotary cup 40 is positioned around the wafer W. To come.

  The holding plate 26 is provided with three holding members 25 for supporting the wafer W from the side at equal intervals in the circumferential direction. In FIGS. 4 and 5, only two holding members 25 are shown. Each holding member 25 supports the wafer W on the lift pins 23 when the lift pin plate 22 is moved from the upper position to the lower position as shown in FIGS. 4 and 5, and the wafer W is slightly separated from the lift pins 23. It is supposed to let you.

  The configuration of the lift pin plate 22 and the holding plate 26 will be described in more detail with reference to FIG. 6A. In FIG. 6A, (a) is a figure which shows the state in the middle of the lift pin plate 22 moving to the downward position as shown in FIG. 4 etc. from an upper position, (b) is from the state shown to (a). It is a figure which shows a state when the lift pin plate 22 moves below, (c) is a state where the lift pin plate 22 moves further downward from the state shown in (b), and the lift pin plate 22 is as shown in FIG. It is a figure which shows a state when reaching a downward position.

  As shown in FIG. 6, the holding member 25 is pivotally supported by the holding plate 26 via a shaft 25a. More specifically, as shown in FIG. 6, a bearing portion 26a is attached to the holding plate 26, and the shaft 25a is received in a bearing hole 26b provided in the bearing portion 26a. The bearing hole 26b is an elongated hole extending in the horizontal direction, and the shaft 25a of the holding member 25 can move in the horizontal direction along the bearing hole 26b. In this way, the holding member 25 can swing around the shaft 25a received in the bearing hole 26b of the bearing portion 26a.

  A spring member 25 d such as a torsion spring is wound around the shaft 25 a of the holding member 25. The spring member 25d biases the holding member 25 with a force that rotates the holding member 25 in the clockwise direction in FIG. 6 about the shaft 25a. Accordingly, when no force is applied to the holding member 25, the holding member 25 is inclined with respect to the holding plate 26, and the support portion 25b for supporting the wafer W on the holding member 25 from the side. (Described later) is in a state of being away from the center of the holding plate 26.

  A linear portion extends from the spring member 25d wound around the shaft 25a. The linear portion is locked to the inner wall surface 26c of the bearing portion 26a, and the shaft 25a is centered on the holding plate 26. Push it back. Thus, the shaft 25a is always pressed toward the center of the holding plate 26 (that is, toward the left in FIG. 6) by the linear portion of the spring member 25d. Therefore, when the wafer W having a relatively small diameter is held by the holding member 25, the shaft 25a is positioned near the center of the holding plate 26 in the bearing hole 26b as shown in FIG. 6 (that is, FIG. 6). Position on the left side). On the other hand, when the wafer W having a relatively large diameter is supported by the holding member 25, the shaft 25a moves from the position shown in FIG. 6 along the bearing hole 26b against the force of the linear portion of the spring member 25d. Move to the right. Here, the size of the diameter of the wafer W means the size of the diameter of the wafer W within an allowable dimensional error.

  The holding member 25 includes a support portion 25b that supports the wafer W from the side, and a pressed member 25c provided on the opposite side of the support portion 25b with respect to the shaft 25a. The pressed member 25c is provided between the lift pin plate 22 and the holding plate 26. The pressed member 25c is provided when the lift pin plate 22 is at the lower position or a position near it as shown in FIG. It is pressed downward by the lower surface of the lift pin plate 22.

  As shown in FIG. 6, when the lift pin plate 22 moves from the upper position to the lower position, the holding member 25 is centered on the shaft 25a by the pressed member 25c being pressed downward by the lower surface of the lift pin plate 22. As shown in FIG. 6 in the counterclockwise direction (arrow direction in FIG. 6). Then, the holding member 25 rotates about the shaft 25a, so that the support portion 25b moves toward the wafer W from the side of the wafer W. Thus, when the lift pin plate 22 reaches the lower position, the wafer W is supported from the side by the holding member 25 as shown in FIG. Here, as shown in FIG. 6C, when the wafer W is supported from the side by the holding member 25, the wafer W is separated upward from the tip of the lift pin 23 and floats upward from the lift pin 23. It becomes a state. Further, as described above, depending on the size of the wafer W, the shaft 25a may move rightward from the position shown in FIG. 6 along the bearing hole 26b against the force of the linear portion of the spring member 25d. is there. For this reason, even when a relatively large wafer W is supported by the holding member 25, the holding member 25 can move in the horizontal direction, so that the wafer W is not deformed or damaged. W can be supported from the side.

  Further, through holes are formed in the center portions of the lift pin plate 22 and the holding plate 26, respectively, and a processing liquid supply pipe 28 is provided so as to pass through these through holes. The processing liquid supply pipe 28 supplies a processing liquid such as a chemical liquid or pure water to the back surface of the wafer W held by each holding member 25 of the holding plate 26. Further, the processing liquid supply pipe 28 moves up and down in conjunction with the lift pin plate 22. A head portion 28 a is provided at the upper end of the processing liquid supply pipe 28 so as to close the through hole of the lift pin plate 22. Further, as shown in FIG. 4 and the like, a processing liquid supply unit 29 is connected to the processing liquid supply pipe 28, and the processing liquid is supplied to the processing liquid supply pipe 28 by the processing liquid supply unit 29. ing.

  As shown in FIGS. 4 and 5, a ring-shaped rotating cup 40 is disposed around the holding portion 21. The rotating cup 40 is attached to the holding plate 26 and rotates integrally with the holding plate 26. More specifically, the rotary cup 40 is provided so as to surround the wafer W supported by the holding members 25 of the holding plate 26 from the side. It is designed to receive the processing liquid that is scattered.

  In addition, a drain cup 42, a first guide cup 43, a second guide cup 44, and a third guide cup 45 are provided around the rotary cup 40 from the top. The drain cup 42 and the guide cups 43, 44, 45 are each formed in a ring shape. Here, the drain cup 42 is fixed in the processing chamber 20. On the other hand, a lift cylinder (not shown) is connected to each guide cup 43, 44, 45, and these guide cups 43, 44, 45 can be raised and lowered independently of each other by the corresponding lift cylinder. Yes.

  As shown in FIGS. 4 and 5, below the drain cup 42 and the guide cups 43, 44, 45, there are a first processing liquid recovery tank 46a, a second processing liquid recovery tank 46b, and a third processing liquid recovery. Tank 46c and a fourth processing liquid recovery tank 46d are provided. Depending on the position of each guide cup 43, 44, 45 in the vertical direction, when the wafer W is subjected to the liquid processing, the processing liquid scattered laterally from the wafer W is divided into four types based on the type of the processing liquid. The liquid is selectively sent to any one of the processing liquid recovery tanks 46a, 46b, 46c, and 46d. Specifically, when all the guide cups 43, 44, and 45 are all in the upper position (as shown in FIGS. 4 and 5), the processing liquid splashed laterally from the wafer W is recovered as the fourth processing liquid. It is sent to the tank 46d. On the other hand, when only the third guide cup 45 is in the lower position, the processing liquid scattered laterally from the wafer W is sent to the third processing liquid recovery tank 46c. Further, when the second guide cup 44 and the third guide cup 45 are in the lower position, the processing liquid splashed laterally from the wafer W is sent to the second processing liquid recovery tank 46b. Further, when all the guide cups 43, 44, 45 are in the lower position, the processing liquid splashed laterally from the wafer W is sent to the first processing liquid recovery tank 46a.

  As shown in FIGS. 4 and 5, an exhaust part 48 is provided inside the fourth processing liquid recovery tank 46d. The atmosphere around the wafer W is exhausted by the exhaust unit 48 by setting the position of each guide cup 43, 44, 45 in the vertical direction to a predetermined position.

  Further, in the liquid processing apparatus 10 of the present embodiment, the cup outer peripheral cylinder 50 is provided around the drain cup 42 and the guide cups 43, 44, 45 in the processing chamber 20. The cup outer cylinder 50 can be moved up and down between a lower position as shown in FIG. 4 and an upper position as shown in FIG. Further, as shown in FIGS. 2 and 3, the cup outer peripheral cylinder 50 is provided with an opening 50 m through which the nozzle arm 82 can pass. When the cup outer cylinder 50 is in the upper position as shown in FIG. 5, the region in the cup outer cylinder 50 is isolated from the outside.

  Details of the configuration of the cup outer cylinder 50 will be described with reference to FIG. 6B. FIG. 6B is a perspective view showing the configuration of the cup outer cylinder 50. As shown in FIG. 6B, the side surface of the cup outer peripheral cylinder 50 is provided with openings 50m through which the nozzle arms 82 can pass according to the number of the nozzle arms 82 (for example, when there are six nozzle arms 82, Six openings 50m are provided). Further, a support member 50a for supporting the cup outer peripheral cylinder 50 is connected to the upper part of the cup outer peripheral cylinder 50, and a driving mechanism 50b for moving the support member 50a up and down is provided on the support member 50a. . And by raising / lowering the supporting member 50a by the drive mechanism 50b, the cup outer periphery cylinder 50 supported by this supporting member 50a is also raised / lowered.

  As shown in FIGS. 4 and 5, a guide member 51 is attached to the FFU 70. As shown in FIG. 5, the guide member 51 is disposed so as to be slightly spaced inward from the cup outer peripheral tube 50 when the cup outer peripheral tube 50 is in the upper position. Further, in the liquid processing apparatus 10 of the present embodiment, when the cup outer peripheral tube 50 is in the upper position as shown in FIG. 5, the air pressure in the cup outer peripheral tube 50 is larger than the air pressure outside the cup outer peripheral tube 50. It is supposed to be. For this reason, when the cup outer peripheral cylinder 50 is in the upper position, as shown in FIG. 9, the downflow gas in the processing chamber 20 generated by the FFU 70 is caused by the guide member 51 in the vicinity of the upper end of the cup outer peripheral cylinder 50. The tube 50 is guided from the inside to the outside.

  As shown in FIGS. 4 and 5, a cleaning unit 52 for cleaning the cup outer cylinder 50 is provided in the processing chamber 20. The cleaning portion 52 has a storage portion 52a for storing a cleaning liquid such as pure water. When the cup outer peripheral tube 50 is in the lower position as shown in FIG. It is immersed in the cleaning liquid stored in 52a. The cleaning unit 52 is configured to clean the cup outer cylinder 50 by immersing the cup outer cylinder 50 in the cleaning liquid stored in the storage portion 52a. As the cleaning liquid stored in the storage part 52a, for example, pure water at room temperature or higher, preferably 40 ° C. or higher, more preferably 60 ° C. or higher is used. When the temperature of the cleaning liquid stored in the storage portion 52a is high, the cleaning effect on the cup outer peripheral cylinder 50 is further increased.

  Details of the configuration of the cleaning unit 52 will be described with reference to FIG. FIG. 7 is a side sectional view showing the configuration of the cleaning unit 52. Specifically, FIG. 7A shows a state when the cup outer cylinder 50 is in the upper position, and FIG. 7B shows a state when the cup outer cylinder 50 is in the lower position. ing.

  As shown in FIG. 7, a cleaning liquid supply pipe 52b is connected to the storage part 52a for storing the cleaning liquid, and the cleaning liquid is continuously sent to the storage part 52a by the cleaning liquid supply pipe 52b. . A cleaning liquid supply section 53 is connected to the cleaning liquid supply pipe 52b, and the cleaning liquid is supplied from the cleaning liquid supply section 53 to the cleaning liquid supply pipe 52b. Further, as shown in FIG. 7, a heating device 53a is provided in the cleaning liquid supply pipe 52b, and the cleaning liquid in the cleaning liquid supply pipe 52b is heated by the heating apparatus 53a. Further, a drain pipe 52c is provided at a side portion of the storage part 52a, and the cleaning liquid in the storage part 52a is discharged by the drain pipe 52c. That is, the cleaning liquid is continuously sent to the storage part 52a by the cleaning liquid supply pipe 52b, and the cleaning liquid stored in the storage part 52a is always clean by discharging the cleaning liquid in the storage part 52a by the drain pipe 52c. To be maintained. In addition, an upper opening 52d through which the cup outer peripheral tube 50 can pass is provided on the upper portion of the storage portion 52a.

  As shown in FIG. 7B, when the cup outer cylinder 50 is in the lower position, most of the cup outer cylinder 50 is immersed in the cleaning liquid stored in the storage portion 52a. Further, as shown in FIG. 7A, even when the cup outer peripheral cylinder 50 is in the upper position, the lower part of the cup outer peripheral cylinder 50 is immersed in the cleaning liquid stored in the storage portion 52a. For this reason, when the cup outer cylinder 50 is in the upper position, a water seal is provided between the cleaning liquid stored in the storage portion 52a and the lower part of the cup outer cylinder 50, and the upper part of the cup outer cylinder 50 and the guide member 51 Since the gap is narrowed, the region in the cup outer cylinder 50 can be isolated from the outside.

  Further, as shown in FIG. 7, a lid that covers the cleaning liquid stored in the storage portion 52a when the cup outer peripheral tube 50 is in the lower position as shown in FIG. A portion 50c is provided. Specifically, the lid portion 50c closes the upper opening 52d of the storage portion 52a when the cup outer peripheral cylinder 50 is in the lower position as shown in FIG. 7B. In the cleaning unit 52, when the temperature of the cleaning liquid stored in the storage part 52a is high (specifically, for example, 60 ° C. or more), the cleaning liquid stored in the storage part 52a is likely to evaporate. If, for example, the vapor of water adheres to the wafer W or the like during the drying process of the wafer W in the processing chamber 20, there is a problem that the drying efficiency is deteriorated. Even if the temperature of the cleaning liquid stored in the storage portion 52a is about 40 ° C., the cleaning liquid evaporates, and the vapor of the cleaning liquid adheres to the wafer W or the like when the wafer W is dried in the processing chamber 20, for example. There is a risk of it. On the other hand, according to the liquid processing apparatus 10 of the present embodiment, the cup outer peripheral cylinder 50 is as shown in FIG. 7B because the lid portion 50c is provided at the upper end of the cup outer peripheral cylinder 50. When in the lower position, it is possible to prevent the cleaning liquid stored in the storage portion 52 a from evaporating and the cleaning liquid atmosphere from entering the processing chamber 20 or the arm standby unit 80. In this case, even when the cleaning liquid stored in the storage portion 52 a evaporates and the atmosphere of the cleaning liquid enters the processing chamber 20 or the arm standby unit 80, the outer side of the cup outer cylinder 50 at the bottom of the processing chamber 20. Since the exhaust part 56 is provided in the above, the atmosphere of such a cleaning liquid is exhausted by the exhaust part 56.

  Further, a lid portion 50d that covers the cleaning liquid stored in the storage portion 52a when the cup outer peripheral tube 50 is in the upper position as shown in FIG. 7A is provided at the lower end of the cup outer peripheral tube 50. . Since the lid portion 50d is provided at the lower end of the cup outer cylinder 50, the cup outer cylinder 50 is stored in the storage portion 52a even when the cup outer cylinder 50 is in the upper position as shown in FIG. It is possible to prevent the cleaning liquid from evaporating and the cleaning liquid atmosphere from entering the processing chamber 20 or the arm standby unit 80. When the cup outer cylinder 50 is in the upper position as shown in FIG. 7A, a water seal is performed between the cleaning liquid stored in the storage portion 52 a and the lower part of the cup outer cylinder 50. It is possible to suppress the inside atmosphere from coming out of the cup outer cylinder 50. Even when water sealing is not performed, it is possible to suppress the atmosphere in the cup outer peripheral cylinder 50 from coming out of the processing chamber 20 by providing the exhaust part 56.

  Further, when the cup outer cylinder 50 is in the upper position as shown in FIG. 7A, the guide member 51 attached to the FFU 70 is positioned with a slight gap inward from the upper end of the cup outer cylinder 50. become. Further, as described above, when the cup outer cylinder 50 is in the upper position as shown in FIG. 7A, the air pressure inside the cup outer cylinder 50 becomes larger than the air pressure outside the cup outer cylinder 50. Therefore, as shown in FIG. 7A, the downflow gas in the processing chamber 20 generated by the FFU 70 is guided from the inside of the cup outer peripheral cylinder 50 to the outer side by the guide member 51 in the vicinity of the upper end of the cup outer peripheral cylinder 50. Is done.

  As shown in FIGS. 4 and 5, in the processing chamber 20, an exhaust portion 54 for exhausting the atmosphere in the processing chamber 20 is provided inside the cleaning portion 52, and the cleaning portion An exhaust unit 56 for exhausting the atmosphere in the processing chamber 20 is provided outside the chamber 52. By providing the exhaust part 54 and the exhaust part 56 as described above, when the cup outer peripheral cylinder 50 is at the lower position as shown in FIG. 4, the exhaust part 54 and the exhaust part 56 allow the entire inside of the processing chamber 20. The atmosphere can be exhausted (see FIG. 8). On the other hand, when the cup outer cylinder 50 is in the upper position as shown in FIG. 5, since the region in the cup outer cylinder 50 is isolated from the outside, the exhaust portion 54 exhausts the atmosphere inside the cup outer cylinder 50. Moreover, the exhaust part 56 can exhaust the atmosphere outside the cup outer peripheral cylinder 50 (see FIG. 9).

  As described above, in this embodiment, a plurality of (specifically, for example, six) nozzle arms 82 are provided in one liquid processing apparatus 10, and a nozzle 82 a is provided at the tip of each nozzle arm 82. It has been. Specifically, each nozzle 82a includes a first chemical liquid (specifically, for example, an acidic chemical liquid), a second chemical liquid (specifically, for example, an alkaline chemical liquid), pure water, N 2 gas, A mist of IPA (isopropyl alcohol) and pure water is supplied to the upper surface of the wafer W.

  Next, the operation of the liquid processing apparatus 10 having such a configuration will be described.

  First, the lift pin plate 22 and the processing liquid supply pipe 28 in the holding unit 21 are moved upward from the position shown in FIG. 4, and the shutter 94 provided in the opening 94a of the processing chamber 20 is retracted from the opening 94a. Opening 94a is performed. Then, the wafer W is transferred from the outside of the liquid processing apparatus 10 to the processing chamber 20 by the transfer arm 104 through the opening 94 a, and the wafer W is placed on the lift pins 23 of the lift pin plate 22. Is withdrawn from the processing chamber 20. At this time, the cup outer peripheral cylinder 50 is located at a lower position as shown in FIG. In addition, each nozzle arm 82 is located at a retracted position retracted from the processing chamber 20. That is, each nozzle arm 82 stands by in the arm standby unit 80. Further, a gas such as clean air is always sent in a down flow from the FFU 70 into the processing chamber 20, and this gas is exhausted by the exhaust unit 54, whereby the atmosphere in the processing chamber 20 is replaced. Yes.

  Next, the lift pin plate 22 and the processing liquid supply pipe 28 are moved downward, and the lift pin plate 22 and the processing liquid supply pipe 28 are positioned at a lower position as shown in FIG. At this time, each holding member 25 provided on the holding plate 26 supports the wafer W on the lift pins 23 and slightly separates the wafer W from the lift pins 23.

  Thereafter, or while the lift pin plate 22 is being lowered, the cup outer peripheral cylinder 50 is moved upward by the drive mechanism 50b provided in the cup outer peripheral cylinder 50, and the cup outer peripheral cylinder 50 is moved to the upper position as shown in FIG. Position. After the cup outer cylinder 50 is moved to the upper position, one or a plurality of nozzle arms 82 among the six nozzle arms 82 waiting in the arm standby portion 80 are the openings 88a of the arm cleaning portion 88 in the wall 90 and the cup. It advances into the processing chamber 20 through the opening 50m of the outer cylinder 50. At this time, the nozzle arm 82 performs a linear motion.

  Next, the holding plate 26 and the lift pin plate 22 in the holding unit 21 are rotated. As a result, the wafer W supported by each holding member 25 of the holding plate 26 also rotates. Then, the processing liquid is supplied to the upper surface of the wafer W from the nozzle 82 a of the nozzle arm 82 that has advanced into the processing chamber 20 while the wafer W is rotated. At this time, a processing solution such as a chemical solution or pure water is supplied from the processing solution supply pipe 28 toward the lower surface (back surface) of the wafer W. In this way, the processing liquid is supplied to both the upper surface and the lower surface of the wafer W, and the liquid processing of the wafer W is performed. The processing liquid supplied to the wafer W is divided into four processing liquid recovery tanks 46a and 46b by positioning the guide cups 43, 44 and 45 in the upper position or the lower position based on the type of the processing liquid. , 46c, 46d are selectively sent to one of the processing liquid recovery tanks for recovery.

  Thereafter, when the liquid processing of the wafer W is completed, the nozzle arm 82 that has advanced into the processing chamber 20 is retracted from the processing chamber 20 and waits at the arm standby unit 80. And this cup outer periphery cylinder 50 is moved below by the drive mechanism 50b provided in the cup outer periphery cylinder 50, and the cup outer periphery cylinder 50 is located in a downward position as shown in FIG.

  Thereafter, the lift pin plate 22 and the processing liquid supply pipe 28 in the holding unit 21 are moved upward from the positions shown in FIG. At this time, the wafer W supported by the holding member 25 of the holding plate 26 is transferred onto the lift pins 23 of the lift pin plate 22. Next, the opening 94a is opened by retracting the shutter 94 provided in the opening 94a of the processing chamber 20 from the opening 94a, and the transfer arm 104 is moved into the processing chamber 20 from the outside of the liquid processing apparatus 10 through the opening 94a. The wafer W on the lift pins 23 of the lift pin plate 22 is taken out by the transfer arm 104. The wafer W taken out by the transfer arm 104 is transferred to the outside of the liquid processing apparatus 10. In this way, a series of liquid processing of the wafer W is completed.

  As described above, according to the liquid processing apparatus 10 of the present embodiment, when the cup outer peripheral cylinder 50 is in the lower position, the cup outer peripheral cylinder 50 is immersed in the cleaning liquid stored in the storage portion 52a. A lid portion 50c that covers the cleaning liquid stored in the storage portion 52a when the cup outer peripheral tube 50 is in the lower position is provided at the upper end of the cup outer peripheral tube 50. As described above, in the cleaning unit 52, when the temperature of the cleaning liquid stored in the storage part 52a is high (specifically, for example, 60 ° C. or more), the cleaning liquid stored in the storage part 52a evaporates. For example, if the vapor of the cleaning liquid adheres to the wafer W or the like during the drying process of the wafer W in the processing chamber 20, for example, there is a problem of causing particles. In this case, there is also a problem that the drying efficiency of the wafer W is deteriorated. On the other hand, according to the liquid processing apparatus 10 of the present embodiment, since the lid portion 50c is provided at the upper end of the cup outer peripheral tube 50, when the cup outer peripheral tube 50 is in the lower position, the storage portion It is possible to prevent the cleaning liquid stored in 52a from evaporating and the atmosphere of the cleaning liquid from entering the processing chamber 20 or the arm standby unit 80.

  Further, in the liquid processing apparatus 10 of the present embodiment, the lower end of the cup outer peripheral cylinder 50 covers the cleaning liquid stored in the storage portion 52a of the cleaning section 52 when the cup outer peripheral cylinder 50 is in the upper position. The lid portion 50d is provided. Since the lid portion 50d is provided at the lower end of the cup outer peripheral tube 50, the cleaning liquid stored in the storage portion 52a can be obtained not only when the cup outer peripheral tube 50 is at the lower position but also at the upper position. It is possible to prevent the atmosphere of the cleaning liquid from entering the processing chamber 20 and the arm standby unit 80 by evaporating.

  Further, in the liquid processing apparatus 10 of the present embodiment, as shown in FIGS. 2 and 3, a wall 90 extending in the vertical direction is provided between the processing chamber 20 and the arm standby unit 80, and the wall The wall portion 92 of the 90 has an opening 92a through which the arm 82 can pass.

  Further, in the liquid processing apparatus 10 of the present embodiment, the exhaust part 54 for exhausting the atmosphere in the processing chamber 20 is provided inside the cup outer peripheral cylinder 50 as described above. For this reason, when the cup outer peripheral cylinder 50 is in the lower position as shown in FIG. 4, the atmosphere inside the processing chamber 20 can be exhausted (see FIG. 8). On the other hand, when the cup outer peripheral cylinder 50 is in the upper position as shown in FIG. 5, the region in the cup outer peripheral cylinder 50 is isolated from the outside, so that the atmosphere in the cup outer peripheral cylinder 50 can be exhausted (see FIG. 5). 9).

  Moreover, in the liquid processing apparatus 10 of this Embodiment, the heating apparatus 53a which heats the washing | cleaning liquid sent to the storage part 52a of the washing | cleaning part 52 is provided. By providing such a heating device 53a, the temperature of the cleaning liquid stored in the storage portion 52a of the cleaning unit 52 can be increased, and the cleaning effect on the cup outer cylinder 50 can be further increased. .

  In addition, the liquid processing apparatus according to the present embodiment is not limited to the above aspect, and various changes can be made. For example, it is not necessary to supply the processing liquid to both the upper surface and the lower surface of the wafer W by the nozzle 82 a of the nozzle arm 82 that has advanced into the processing chamber 20 and the processing liquid supply pipe 28. The processing liquid may be supplied only to the upper surface. Further, the liquid processing apparatus according to the present embodiment can be used for processing such as etching processing, plating processing, development processing and the like in addition to the substrate cleaning processing.

DESCRIPTION OF SYMBOLS 10 Liquid processing apparatus 20 Processing chamber 21 Holding part 22 Lift pin plate 23 Lift pin 24 Piston mechanism 25 Holding member 25a Shaft 25b Support part 25c Pressed member 25d Spring member 26 Holding plate 26a Bearing part 26b Bearing hole 26c Inner surface wall 28 Processing liquid supply pipe 28a Head portion 29 Treatment liquid supply unit 40 Rotating cup 42 Drain cup 43 First guide cup 44 Second guide cup 45 Third guide cup 46a First treatment liquid collection tank 46b Second treatment liquid collection tank 46c Third treatment liquid Recovery tank 46d Fourth treatment liquid recovery tank 48 Exhaust part 50 Cup outer peripheral cylinder 50a Support member 50b Drive mechanism 50c Cover part 50d Cover part 50m Opening 51 Guide member 52 Cleaning part 52a Storage part 52b Cleaning liquid supply pipe 52c Drain pipe 52d Upper part Opening 53 Supply of cleaning liquid 53a warming apparatus 54 exhaust unit 56 exhaust unit 58 exhaust unit 60 shutter 62 the shutter 70 FFU
80 Arm standby section 82 Nozzle arm 82a Nozzle 82m Surface treatment liquid supply pipe 84 Arm support section 88 Arm cleaning section 88a Opening 89 Surface treatment liquid supply section 90 Wall 94 Shutter 94a Opening 101 Mounting table 102 Transfer arm 103 Shelf unit 104 Transfer arm 200 Liquid processing apparatus 210 Processing chamber 220 Holding unit 230 Cup 240 Nozzle 241 Arm 242 Arm support unit 250 FFU
260 Exhaust section

Claims (5)

A substrate holding portion for holding and rotating the substrate in a horizontal state, and a processing chamber in which a cup disposed around the substrate holding portion is provided, and
A nozzle for supplying a processing liquid to the substrate held by the substrate holding unit;
An arm that supports the nozzle and is movable in a horizontal direction between an advanced position advanced into the processing chamber and a retracted position retracted from the processing chamber;
An arm standby unit provided adjacent to the processing chamber for waiting for the arm retracted from the processing chamber;
A cup outer cylinder disposed around the cup in the processing chamber and capable of moving up and down between an upper position and a lower position;
A cleaning part for cleaning the cup outer cylinder, having a storage part for storing cleaning liquid, and when the cup outer cylinder is in a lower position, the cup outer cylinder is stored in the storage part A cleaning section immersed in a cleaning solution;
With
At the top of the cup outer cylinder, a lid is provided for covering the cleaning liquid stored in the storage part of the cleaning unit when the cup outer cylinder is in the lower position ,
A liquid processing apparatus, characterized in that a lid for covering the cleaning liquid stored in the storage portion of the cleaning unit when the cup outer peripheral cylinder is in the upper position is provided at a lower portion of the cup outer peripheral cylinder. . A wall extending in the vertical direction is provided between the processing chamber and the arm standby unit,
The liquid processing apparatus according to claim 1 , wherein the wall is provided with an opening through which the arm can pass. The liquid processing apparatus according to claim 1, wherein an exhaust portion for exhausting the atmosphere in the processing chamber is provided inside the cup outer peripheral tube. The liquid processing apparatus according to any one of claims 1 to 3, further comprising a heating device for heating the washing liquid to be sent to the storage portion of the cleaning part. A step of holding the substrate in a horizontal state by a substrate holder provided inside the processing chamber;
A step of moving a cup outer peripheral cylinder disposed around the cup in the processing chamber from a lower position to an upper position, and isolating a region in the cup outer peripheral cylinder from the outside;
A step of covering the cleaning liquid stored in the storage portion of the cleaning unit with a lid provided at a lower portion of the cup outer peripheral cylinder when the cup outer peripheral cylinder is in an upper position;
A step of causing the arm supporting the nozzle to advance into the processing chamber from an arm standby unit provided adjacent to the processing chamber;
A step of rotating the substrate by the substrate holding unit and supplying a processing liquid to the rotating substrate held by the substrate holding unit by a nozzle of an arm that has advanced into the processing chamber;
The step of cleaning the cup outer cylinder with a cleaning unit, wherein the cup outer cylinder is immersed in a cleaning liquid stored in a storage portion of the cleaning unit when the cup outer cylinder is in a lower position. Cleaning the outer cylinder;
A step of covering the cleaning liquid stored in the storage portion of the cleaning section with a lid provided on the upper portion of the cup outer peripheral cylinder when the cup outer peripheral cylinder is in a lower position;
A liquid treatment method comprising:

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