JP5494345B2 - Organic EL display device - Google Patents

Description

  The present invention relates to an organic EL (electroluminescence) display device having display pixels on one surface of a substrate.

  Conventionally, as an organic EL display device, for example, the following is known. That is, a plurality of first electrodes are extended in a predetermined direction on one surface of a substrate made of glass or the like so as to form a stripe shape. An insulating film is formed between the stripe patterns of the first electrodes, and adjacent first electrodes are insulated from each other by the insulating film. In addition, an organic layer is formed on the first electrode, and a plurality of second electrodes are extended on the organic layer and the insulating film in a direction perpendicular to the extending direction of the first electrode so as to form a stripe shape. ing. Thereby, on the substrate, a display pixel having the first electrode, the organic layer, and the second electrode is formed at the intersection of the first electrode and the second electrode.

  And the sealing member which coat | covers a display pixel is adhere | attached on the one surface of the board | substrate through the adhesive agent, and it prevents the display pixel from being exposed to external air. Moreover, the 1st electrode penetrates the adhesive agent and is pulled out to the outside of the sealing member, and constitutes an external connection terminal at a portion outside the sealing member. And the front-end | tip part of the external connection terminal comprised by the 1st electrode pulled out to the outer side of the sealing member in the outer side of the sealing member among the one surfaces of a board | substrate is a flexible printed circuit board (FPC) or a tape carrier package ( And a wiring member made of TCP) or the like via an anisotropic conductive adhesive (ACF).

  In such a display device, the external connection terminals are connected via an anisotropic conductive adhesive, but the portion of the external connection terminals located between the seal member and the anisotropic conductive adhesive is exposed to the outside air. Will be. For this reason, when the first electrode is an anode made of, for example, an indium-tin oxide (ITO), the exposed portion is decomposed or corroded by moisture in the outside air. There is.

  In order to solve this problem, for example, Patent Document 1 discloses an organic EL display device in which an insulating film is disposed in a portion of an external connection terminal located between a sealing member and an anisotropic conductive adhesive. Yes. In such an organic EL display device, the portion of the external connection terminal located between the seal member and the anisotropic conductive adhesive is covered with an insulating film, so that the first electrode is exposed to the outside air. Can be suppressed.

  Such an organic EL display device is manufactured as follows, for example. That is, the first electrode is formed on the substrate, and the insulating film is formed on the portion constituting the external connection terminal. Specifically, the insulating film is formed so that the tip of the external connection terminal connected to the wiring member is exposed. Thereafter, sputtering, photolithography, vacuum deposition, or the like is performed to form the organic layer and the second electrode, and the sealing member is bonded to the substrate via the sealing member. Next, a wiring member is thermocompression-bonded to the exposed part among the external connection terminals arrange | positioned on the outer side of a sealing member via an anisotropic conductive adhesive. At this time, the anisotropic conductive adhesive protrudes from the arranged portion to the periphery, and the external connection terminal is covered with the insulating film and the anisotropic conductive adhesive, and the insulating film is anisotropic. A part of the conductive adhesive is placed.

JP 2001-21567 A

  However, in such an organic EL display device, if the insulating film covering the external connection terminal is too thick, the conductive particles contained in the anisotropic conductive adhesive can get over the end of the insulating film on the wiring member side. In other words, the agglomeration may occur at the end of the insulating film without causing a short circuit between adjacent external connection terminals. On the other hand, when the insulating film is thinned, the conductive particles can get over the end of the insulating film and the aggregation of the conductive particles at the end of the insulating film can be suppressed. As a result, the pinhole is likely to be formed. And when a pinhole is formed in the insulating film arrange | positioned on a 1st electrode, there exists a problem that a 1st electrode will be exposed to external air.

  In view of the above points, the present invention provides an organic EL display device capable of suppressing a short circuit between adjacent external connection terminals and suppressing the external connection terminals from being exposed to the outside air. For the purpose.

In order to achieve the above object, in the invention described in claim 1, the insulating film (100) is an end portion of a portion located on the anisotropic conductive adhesive (80) side, and is adjacent to an external connection terminal ( 20a), a recess (102a) that is recessed in a direction parallel to the extending direction of the external connection terminal (20a) is formed in a portion located on the portion between 20a), and anisotropic conductive adhesion is formed in the recess (102a). And an anisotropic conductive adhesive on the end of the insulating film (100) disposed on the external connection terminal (20a) on the side of the anisotropic conductive adhesive (80). (80), the adhesive (80b) is disposed, and the insulating film (100) is disposed between the sealing member (70) and the anisotropic conductive adhesive (80) in the external connection terminal (20a). A first insulating film (101) covering a portion located, and a first insulating film (101) A concave portion (102a) is formed in an end portion of the portion that covers the surface and is located on the anisotropic conductive adhesive (80) side and that is located on the portion between the adjacent first electrodes (20). A second insulating film (102), and an anisotropic conductive adhesive on the end of the second insulating film (102) on the anisotropic conductive adhesive (80) side. (80) is characterized in that an adhesive (80b) is disposed .

  In such an organic EL display device, the insulating film (100) is an end portion of a portion located on the anisotropic conductive adhesive (80) side, and is a portion between adjacent first electrodes (20). A concave portion (102a) is formed in the upper portion, and the anisotropic conductive adhesive (80) is disposed in the concave portion (102a). Specifically, the conductive particles (80a) and the adhesive (80b) are disposed in the recess (102a). For this reason, it can suppress that electroconductive particle (80a) aggregates in the edge part by the side of an anisotropic conductive adhesive (80) among insulating films (100), and between adjacent 1st electrodes (20). Can be prevented from short-circuiting.

  Further, the adhesive (80b) of the anisotropic conductive adhesive (80) is formed on the end of the insulating film (100) disposed on the external connection terminal (20a) on the anisotropic conductive adhesive (80) side. ) Is arranged. In other words, the insulating film (100) disposed on the external connection terminal (20a) is sufficiently thick, and the conductive particles (80a) are not disposed. For this reason, it can suppress that a pinhole is formed in the insulating film (100) arrange | positioned on an external connection terminal (20a), and suppresses an external connection terminal (20a) being exposed to external air. be able to.

  That is, in such an organic EL display device, since the concave portion (102a) is formed in the insulating film (100), the aggregation of the conductive particles (80a) at the end of the insulating film (100) is suppressed. However, it is possible to prevent the external connection terminal (20a) from being exposed to the outside air by forming a pinhole in the insulating film (100) disposed on the external connection terminal (20a).

Further, as in the invention described in claim 2 , in the invention described in claim 1 , the first insulating film (101) has a thickness equal to or smaller than the average particle diameter of the conductive particles (80a), and the second insulating film ( 102) can be set to a thickness such that the sum of the thickness with the first insulating film (101) is larger than the average particle diameter of the conductive particles (80a).

And like invention of Claim 3 , in the invention of Claim 1 or 2 , an anisotropic conductive adhesive (80) is arrange | positioned to the middle part of a recessed part (102a), and a recessed part (102a) A gap can be formed between the bottom (102c) and the anisotropic conductive adhesive (80).

Further, as in the invention according to claim 4 , in the invention according to any one of claims 1 to 3 , the portion of the insulating film (100) located on the anisotropic conductive adhesive (80) side The convex portion (102b) formed by forming the concave portion (102a) at the end of the external connection terminal is in a direction perpendicular to the extending direction toward the extending direction of the external connection terminal (20a), and the substrate ( The taper shape in which the length in the direction parallel to the planar direction of 10) is shortened can be obtained.

  In such an organic EL display device, the anisotropic conductive adhesive (80) can be easily poured into the concave portion (102a) as compared with the case where the convex portion (102b) is not tapered.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

(A) is a schematic plan view of the organic electroluminescence display device in 1st Embodiment of this invention, (b) is a figure which shows the cross-sectional structure of A area | region shown in FIG. It is a B arrow line view in FIG.1 (b). (A) is CC sectional drawing in FIG. 2, (b) is DD sectional drawing in FIG.

(First embodiment)
A first embodiment of the present invention will be described. FIG. 1A is a schematic plan view of an organic EL display device according to this embodiment, and FIG. 1B is a diagram showing a cross-sectional configuration of a region A shown in FIG.

  As shown in FIG. 1 and FIG. 2, the display device of this embodiment includes a substrate 10 made of a material transparent to visible light such as glass or resin. A display pixel is formed by sequentially laminating the anode 20 corresponding to the first electrode of the invention, the organic layer 30, and the cathode 40 corresponding to the second electrode of the present invention.

  Specifically, a plurality of anodes 20 are formed on one surface of the substrate 10 so as to have a stripe shape extending in a predetermined direction. An inter-anodic insulating film (not shown) made of polyimide resin or the like is formed between adjacent anodes 20, and each anode 20 is insulated by the inter-anodic insulating film. The inter-anode insulating film is formed so as to cover an end portion of the anode 20 extending in the extending direction. In addition, a plurality of partition walls 50 are provided on one surface of the substrate 10 in a stripe shape in a direction perpendicular to the extending direction of the anode 20.

  An organic layer 30 is formed in a portion of the anode 20 where the partition wall 50 and the inter-anode insulating film are not formed. Furthermore, a plurality of cathodes 40 are formed in stripes on the organic layer 30 and the inter-anode insulating film in a direction perpendicular to the extending direction of the anode 20, that is, in a direction parallel to the extending direction of the partition walls 50. That is, in the present embodiment, the anode 20 and the cathode 40 are patterned in a stripe shape orthogonal to each other. At the intersection of the anode 20 and the cathode 40, the anode 20, the cathode 40, and the organic layer 30 are laminated to form a display pixel.

  The anode 20 is configured by using a transparent conductive film such as indium-tin oxide (ITO) or indium-zinc oxide, for example. The organic layer 30 can employ the configuration of the organic layer 30 in a normal organic EL element. For example, the organic layer 30 is formed by sequentially stacking a positive hole transport layer, a light emitting layer, an electron transport layer, and the like from the anode 20. The cathode 40 is configured using a metal such as AL.

  Moreover, since the partition 50 isolate | separates between the adjacent cathodes 40 and suppresses mutually short-circuiting, it is preferable that it is made the shape which isolates between the adjacent cathodes 40 as much as possible. Therefore, in the present embodiment, the partition wall 50 has a cross section perpendicular to the extending direction, which is perpendicular to the extending direction from the substrate 10 toward the opposite side of the substrate 10, and is a plane of the substrate 10. The shape is an inverted taper shape in which the length in the direction parallel to the direction is increased. In the present embodiment, the shape is an inverted trapezoidal shape. In addition, the partition 50 is comprised using the resist etc., for example.

  And the sealing member 60 is adhere | attached on the one surface of the board | substrate 10 via the electrically insulating adhesive agent 70 corresponded to the sealing member of this invention. Specifically, the sealing member 60 is disposed so as to face one surface of the substrate 10, and is bonded to one surface of the substrate 10 via the electrically insulating adhesive 70 at the outer edge portion. Then, a space is formed between the substrate 10 and the display pixels formed on one surface of the substrate 10 are accommodated in the space to be protected from the outside air.

  As such a sealing member 60, a member capable of blocking outside air is used, and for example, stainless steel, glass or the like is used. Moreover, what consists of an epoxy resin etc. which exhibit adhesive performance by apply | coating and hardening is used for the electrically insulating adhesive 70, for example.

  The anode 20 is extended to the outside of the region surrounded by the electrically insulating adhesive 70. In other words, the anode 20 is formed by penetrating through the electrically insulating adhesive 70 to the outside of the space formed between the sealing member 60 and the substrate 10. And the external connection terminal 20a is comprised in the part arrange | positioned on the outer side of the electrically insulating adhesive agent 70 among the anodes 20, An anisotropic conductive adhesion is carried out at the front-end | tip part of the extending direction among the external connection terminals 20a. A wiring member 90 is connected via the agent 80.

  For example, a flexible printed circuit board (FPC), a tape carrier package (TCP), or the like is used as the wiring member 90. In the present embodiment, an FPC in which a copper wire 90b is provided on a resin base material 90a is used. As the anisotropic conductive adhesive 80, a general adhesive in which a plurality of conductive particles 80a are contained in the adhesive 80b is used. For example, as the conductive particles 80a, Ni plated with gold or resin particles plated with nickel gold are used, and the average particle size is about 2 to 5 μm. For example, an epoxy resin or the like is used as the adhesive 80b.

  Also, an insulating film 100 is formed on one surface of the substrate 10 to cover a portion of the external connection terminal 20a located between the electrically insulating adhesive 70 and the anisotropic conductive adhesive 80. A part of the anisotropic conductive adhesive 80 is disposed on the insulating film 100. In other words, a part of the anisotropic conductive adhesive 80 is overlapped on the insulating film 100. That is, the external connection terminal 20a is covered with the insulating film 100 and the anisotropic conductive adhesive 80, and is not exposed to the outside air. In FIG. 1A, the anisotropic conductive adhesive 80 and the insulating film 100 are omitted for easy understanding.

  FIG. 2 is a schematic view of the portion of the substrate 10 located between the sealing member 60 and the wiring member 90 as viewed from above, as viewed from the direction indicated by the arrow B in FIG. In FIG. 2, the external connection terminals 20 a are indicated by dotted lines, and the anisotropic conductive adhesive 80 is hatched for easy understanding although it is not a sectional view. Also. 3A is a cross-sectional view taken along the line CC in FIG. 2, and FIG. 3B is a cross-sectional view taken along the line DD in FIG.

  As shown in FIGS. 2 and 3, in this embodiment, the insulating film 100 is configured by laminating a first insulating film 101 and a second insulating film 102. Specifically, the first insulating film 101 is disposed so as to cover a portion of the external connection terminal 20 a located between the electrically insulating adhesive 70 and the anisotropic conductive adhesive 80. The first insulating film 101 has a thickness (thinness) that allows the conductive particles 80a to get over the end when the anisotropic conductive adhesive 80 spreads. The thickness is less than the average particle size. Although not particularly limited, in the present embodiment, the thickness of the first insulating film 101 is 0.7 to 1.0 μm. The first insulating film 101 is made of, for example, a polyimide resin and is formed at the same time as the inter-anode insulating film.

  The second insulating film 102 is disposed so as to cover the surface of the first insulating film 101, and is an end portion located on the anisotropic conductive adhesive 80 side and a portion between the adjacent external connection terminals 20a. A concave portion 102a that is recessed in a direction parallel to the extending direction of the external connection terminal 20a is formed in an upper portion. In other words, the second insulating film 102 has a convex portion 102b formed of the concave portion 102a at the end portion located on the anisotropic conductive adhesive 80 side. And the said edge part is made into uneven | corrugated shape.

  Further, the convex portion 102b is directed in the extending direction of the external connection terminal 20a, that is, in the direction perpendicular to the extending direction toward the distal end portion of the external connection terminal 20a and in the plane direction of the substrate 10. The taper shape is such that the length in the parallel direction is shortened. In this embodiment, the tip of the convex portion 102b has an arc shape.

  Further, the second insulating film 102 has a thickness such that the sum of the thickness with the first insulating film 101 is larger than the average particle diameter of the conductive particles 80a, for example, 2 to 5 μm. The second insulating film 102 is made of, for example, a resist and is formed at the same time as the partition wall 50. And like the said partition 50, it is set as the reverse taper shape from which the length of a planar direction becomes long toward the opposite side to the board | substrate 10 from the board | substrate 10. FIG.

  As described above, a part of the anisotropic conductive adhesive 80 is disposed on the insulating film 100. Specifically, the anisotropic conductive adhesive 80 is provided in the recess 102a. The adhesive 80 b of the anisotropic conductive adhesive 80 is disposed on the second insulating film 102. In other words, the conductive particles 80 a and the adhesive 80 b are disposed in the recess 102 a, and the conductive particles 80 a are not disposed on the second insulating film 102. That is, the portions where the first and second insulating films 101 and 102 are disposed are sufficiently thick so that the conductive particles 80a cannot get over the end portions.

  Moreover, in this embodiment, the anisotropic conductive adhesive 80 is arrange | positioned to the middle part in the recessed part 102a. That is, the anisotropic conductive adhesive 80 is not disposed in the recess 102a until it reaches the bottom 102c. A gap is formed between the bottom 102c of the recess 102a and the anisotropic conductive adhesive 80. That is, in the present embodiment, the length from the bottom 102c of the recess 102a to the tip of the projection 102b is such that the anisotropic conductive adhesive 80 does not reach the bottom 102c.

  For example, when the anisotropic conductive adhesive 80 having a thickness of 18 μm is disposed and the wiring member 90 is thermocompression bonded, the anisotropic conductive adhesive 80 extends from the disposed portion to the external connection terminal 20a. About 0.1 to 0.2 mm protrudes in the installation direction. For this reason, in the present embodiment, the position depends on the length between the portion where the anisotropic conductive adhesive 80 is disposed and the end of the insulating film 100 on the anisotropic conductive adhesive 80 side. Taking into account deviations and dimensional tolerances, the length from the bottom 102c of the recess 102a to the tip of the projection 102b is set to 0.3 mm.

  Next, a method for manufacturing the organic EL display device in the present embodiment will be briefly described.

  First, the anode 20 made of ITO or the like and the external connection terminal 20a are formed on one surface of the substrate 10 by sputtering, photolithography, or the like. Thereafter, for example, a polyimide resin is disposed on the entire surface of the substrate 10, and exposure, development, and the like are performed, and the inter-anodic insulating film and the first insulating film 101 are simultaneously formed. As described above, the first insulating film 101 is formed so that the distal end portion in the extending direction of the external connection terminal 20a is exposed. Next, for example, a resist is disposed over the entire area of one surface of the substrate 10, and exposure, development, and the like are performed to simultaneously form the partition wall 50 and the second insulating film 102 having the above-described configuration.

  Subsequently, the organic layer 30 and the cathode 40 are sequentially formed on one surface of the substrate 10 using a vacuum deposition method or the like. Next, the sealing member 60 is bonded to one surface of the substrate 10 via the electrically insulating adhesive 70. After that, the anisotropic conductive adhesive 80 is disposed at the tip of the external connection terminal 20a, in other words, the portion of the external connection terminal 20a where the insulating film 100 is not disposed, and wiring is performed via the anisotropic conductive adhesive 80. The member 90 is connected to the external connection terminal 20a by thermocompression bonding.

  At this time, since the anisotropic conductive adhesive 80 protrudes from between the substrate 10 and the wiring member 90, a part of the anisotropic conductive adhesive 80 is disposed on the insulating film 100. Specifically, in this embodiment, the insulating film 100 is configured by laminating first and second insulating films 101 and 102. The first insulating film 101 has a thickness equal to or smaller than the average particle diameter of the conductive particles 80a, and the second insulating film 102 has a sum of the thickness of the first insulating film 101 and the average particle diameter of the conductive particles 80a. The thickness is larger than the diameter. Further, the second insulating film 102 is an end portion of the portion located on the anisotropic conductive adhesive 80 side, and the external connection terminal 20a extends to a portion located on a portion between the adjacent external connection terminals 20a. A recess 102a is formed which is recessed in a direction parallel to the installation direction. For this reason, the conductive particles 80a get over the end portion of the insulating film 100 where the second insulating film 102 is not disposed, that is, the end portion of the portion where the concave portion 102a is formed, and the concave portion 102a becomes anisotropic. The conductive adhesive 80 is poured and arranged. That is, the conductive particles 80a can be prevented from aggregating at the end portion of the insulating film 100 on the anisotropic conductive adhesive 80 side.

  As described above, in the organic EL display device of the present embodiment, the insulating film 100 is configured by stacking the first and second insulating films 101 and 102. The thickness of the first insulating film 101 is equal to or smaller than the average particle diameter of the conductive particles 80a, and the sum of the thickness of the second insulating film 102 and the first insulating film 101 is larger than the average particle diameter of the conductive particles 80a. Thickness. For this reason, when the wiring member 90 is connected to the external connection terminal 20a, the anisotropic conductive adhesive 80 is disposed in the recess 102a. For this reason, it can suppress that the electroconductive particle 80a aggregates in the edge part side of the anisotropic conductive adhesive 80 among the insulating films 100, and can suppress that the adjacent external connection terminal 20a short-circuits. Can do.

  Further, since the recess 102a is formed in a portion between the adjacent external connection terminals 20a, the first insulating film 101 and the second insulating film 102 are disposed on the external connection terminal 20a. Therefore, the insulating film disposed on the external connection terminal 20a is compared with the case where only the insulating film having a thickness that allows the conductive particles 80a to get over the end portion is disposed on the external connection terminal 20a. 100 can be prevented from forming a pinhole, and the external connection terminal 20a can be prevented from being exposed to the outside air.

  That is, in the organic EL display device according to the present embodiment, the conductive particles 80a can be prevented from aggregating at the end of the insulating film 100, and a pinhole is formed in the insulating film 100 disposed on the external connection terminal 20a. It is possible to suppress the external connection terminal 20a from being exposed.

  In the present embodiment, the length of the convex portion 102b is short in the direction perpendicular to the extending direction and parallel to the planar direction of the substrate 10 in the extending direction of the external connection terminal 20a. It becomes the taper shape which becomes. For this reason, the length of the convex portion 102b in the direction perpendicular to the extending direction and parallel to the planar direction of the substrate 10 is constant toward the extending direction of the external connection terminal 20a. Compared to the case, the anisotropic conductive adhesive 80 can easily flow into the recess 102a.

  Further, in the present embodiment, the anisotropic conductive adhesive 80 is disposed up to the middle of the recess 102 a, and a gap is formed between the bottom 102 c of the recess 102 a and the anisotropic conductive adhesive 80. ing. For this reason, it can suppress that the electroconductive particle 80a aggregates in the recessed part 102a. That is, when the anisotropic conductive adhesive 80 is disposed up to the bottom 102c of the recess 102a, the flow of the anisotropic conductive adhesive 80 is stopped at the bottom 102c of the recess 102a. The bottom 102c of the recess 102a may agglomerate. However, by forming a gap between the bottom 102c of the recess 102a and the anisotropic conductive adhesive 80 as in the present embodiment, aggregation of the conductive particles 80a in the recess 102a can be suppressed. .

  For this reason, even if a pinhole is formed in a portion of the first insulating film 101 corresponding to the bottom 102c of the recess 102a, the adjacent external connection terminal 20a is short-circuited through the pinhole and the conductive particles 80a. Can be suppressed. Of course, even if a pinhole is formed in a portion of the first insulating film 101 other than the portion corresponding to the bottom portion 102c of the recess 102a, the conductive particles 80a do not aggregate in the recess 102a. It is possible to prevent the adjacent external connection terminals 20a from being short-circuited through the conductive particles 80a.

(Other embodiments)
In the first embodiment, an example in which the anode 20 is configured using a transparent conductive film such as an indium-tin oxide (ITO) or an indium-zinc oxide has been described. The anode 20 can be configured by laminating metal electrodes such as Cr and Al. In the anode 20, the wiring resistance can be lowered as compared with the case where the anode 20 is composed only of ITO.

  In the first embodiment, the example in which the second insulating film 102 has a reverse taper shape has been described, but it is needless to say that the second insulating film 102 does not have to have a reverse taper shape. For example, the end portion of the second insulating film 102 may have a shape having a wall surface perpendicular to the substrate 10.

  In the first embodiment, the example in which the anisotropic conductive adhesive 80 is disposed up to the middle of the recess 102a has been described. For example, the anisotropic conductive adhesive 80 extends to the bottom 102c of the recess 102a. It may be arranged.

  Furthermore, although the convex part 102b demonstrated the example by which the front-end | tip was made into circular arc shape in the said 1st Embodiment type | system | group, for example, the convex part 102b may be made into the shape where a front-end | tip has an apex angle. Further, the convex portion 102b has a constant length in a direction perpendicular to the extending direction and parallel to the planar direction of the substrate 10 in the extending direction of the external connection terminal 20a. It may be.

  In the first embodiment, the example in which the insulating film 100 is configured by laminating the first and second insulating films 101 and 102 has been described. However, for example, the following may be employed. That is, the insulating film 100 is composed only of the second insulating film 102 and has a thickness larger than the average particle diameter of the conductive particles 80 a so that the external connection terminals 20 a are covered with the insulating film 100 and the anisotropic conductive adhesive 80. You can do it. Also in such an organic EL display device, the end of the insulating film 100 on the side of the anisotropic conductive adhesive 80 has an uneven shape, and the anisotropic conductive adhesive 80 flows into the recess 102a and is disposed. Therefore, the same effect as the first embodiment can be obtained.

DESCRIPTION OF SYMBOLS 10 Board | substrate 20 Anode 20a External connection terminal 30 Organic layer 40 Cathode 50 Partition 60 Sealing member 70 Electrical insulating adhesive 80 Anisotropic conductive adhesive 90 Wiring member 100 Insulating film 100a Concave part 100b Convex part 101 1st insulating film 102 1st 2 Insulating film

Claims (4)

A substrate (10) having one side;
A sealing member (60) that is bonded to the one surface of the substrate (10) via a sealing member (70) and forms a space between the substrate (10);
Of the one surface of the substrate (10), a stripe is formed in a region surrounded by the seal member (70) and extends to the outside of a region surrounded by the seal member (70). 70) a plurality of first electrodes (20) constituting an external connection terminal (20a) at a portion disposed outside
An organic layer (30) formed on a portion of the first electrode (20) surrounded by the seal member (70);
A second electrode (40) formed in a region including on the organic layer (30);
A plurality of conductive particles (80a) at a distal end portion in the extending direction of the external connection terminal (20a) in a portion outside the region surrounded by the seal member (70) on one surface of the substrate (10). A wiring member (90) connected via an anisotropic conductive adhesive (80) configured to be contained in the adhesive (80b);
One of the surfaces of the substrate (10) is disposed outside the region surrounded by the seal member (70), and the seal member (70) of the external connection terminal (20a) and the anisotropic conductive adhesive. (80), and an insulating film (100) covering a portion located between
The external connection terminal (20a) is covered with the insulating film (100) and the anisotropic conductive adhesive (80), and a part of the anisotropic conductive adhesive (80) is on the insulating film (100). In the display device arranged in
The insulating film (100) is an end of a portion located on the anisotropic conductive adhesive (80) side, and a portion located on a portion between the adjacent external connection terminals (20a), A recess (102a) is formed that is recessed in a direction parallel to the extending direction of the external connection terminal (20a).
The anisotropic conductive adhesive (80) is disposed in the recess (102a), and the anisotropic conductive adhesive in the insulating film (100) disposed on the external connection terminal (20a). Of the anisotropic conductive adhesive (80), the adhesive (80b) is disposed on the end on the (80) side ,
The insulating film (100) is a first insulating film (101) covering a portion of the external connection terminal (20a) located between the seal member (70) and the anisotropic conductive adhesive (80). ) And the end of the portion that covers the surface of the first insulating film (101) and is located on the anisotropic conductive adhesive (80) side, between the adjacent first electrodes (20) A second insulating film (102) in which the recess (102a) is formed in a portion located on the portion, and
The adhesive (80b) of the anisotropic conductive adhesive (80) is disposed on the end of the second insulating film (102) on the anisotropic conductive adhesive (80) side . An organic EL display device characterized by that. The first insulating film (101) has a thickness equal to or smaller than the average particle diameter of the conductive particles (80a), and the second insulating film (102) has a thickness with respect to the first insulating film (101). The organic EL display device according to claim 1 , wherein the sum of the thicknesses is larger than the average particle diameter of the conductive particles (80 a). In the recess (102a), the anisotropic conductive adhesive (80) is disposed up to a middle portion, and between the bottom (102c) of the recess (102a) and the anisotropic conductive adhesive (80). 3. The organic EL display device according to claim 1, wherein a gap is formed in the organic EL display device. A convex portion (102b) formed by forming the concave portion (102a) at an end portion of the insulating film (100) located on the anisotropic conductive adhesive (80) side is formed by the external connection. In the extending direction of the terminal (20a), the length is in a direction perpendicular to the extending direction and parallel to the plane direction of the substrate (10), and is tapered. the organic EL display device according to any one of claims 1 to 3, wherein.

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