JP5493454B2 - Electronic component supply device and electronic component mounting device - Google Patents

Description

  The present invention relates to an electronic component supply device that supplies a taped electronic component, and an electronic component mounting apparatus that mounts the electronic component supply device.

Chip-type electronic components such as chip capacitors and chip resistors are supplied to an electronic component mounting machine by an electronic component carrier.
Here, the electronic component carrier means that a top cover tape is attached to the upper surface of a carrier tape in which a plurality of storage portions (pockets) are formed at intervals in the longitudinal direction, and the electronic components are stored in each storage portion. Say something.

  In addition, a storage part may be a recessed part (for example, refer patent document 1), and the through-hole was opened in the carrier tape, and the bottom tape may be affixed on the back surface of the carrier tape. (For example, refer to Patent Document 2).

  The supply of chip-type electronic components to the electronic component mounting machine by the electronic component carrier is performed by first setting the electronic component carrier wound on the reel on the electronic component feeder, and then mounting the electronic component feeder on the electronic component Set in the device. The electronic component supply device intermittently feeds the carrier tape and peels off the top cover tape by supplying power (air, electricity, etc.) from the electronic component mounting device (for example, Patent Document 3, (See Patent Document 4).

  That is, when the top cover tape is intermittently peeled off from the carrier tape and the top cover tape is removed from the upper surface, the chip-type electronic component stored in the carrier tape storage part remains stored in the carrier tape storage part. The carrier tape is intermittently sent to the electronic component take-out section of the electronic component mounting apparatus, and is sucked and held by the suction head of the electronic component mounting apparatus.

Japanese Utility Model Publication No. 06-018365 Japanese Patent Laid-Open No. 06-092388 JP 05-021987 Japanese Patent Laid-Open No. 11-046089

  However, when the suction head picks up the chip-type electronic component, if the position of the chip-type electronic component is shifted with respect to the suction head, there is a problem that mistakes in the suction of the chip-type electronic component occur frequently.

  This is because the non-conductive reel around which the electronic component carrier is wound has a surface of -3000 V to -3000 V due to friction during conveyance to the production site, rotation of the reel after being set in the electronic component supply device, and the like. One of the causes is charged to 500V. That is, when the surface of the reel is charged to −3000V to −500V, the electronic component carrier wound around the reel is also charged to the same potential or the opposite potential by induction from the reel and friction with the reel. Then, since the carrier tape, the top cover tape, and the like of the electronic component transport body are also charged, the electronic component sticks to the wall of the storage portion of the carrier tape due to static electricity.

  The present invention has been made to solve the above-described problem, and by lowering the reel surface potential, the charge amount of the electronic component transport body is lowered, and the adsorption rate of the electronic component of the electronic component mounting apparatus is improved. The purpose is to let you.

(First invention)
According to a first aspect of the present invention, an electronic component carrier is housed in a carrier tape housing portion, a surface of the carrier tape is covered with a top cover tape, and the electronic component carrier is pulled out from a non-conductive reel attached to the main body, and the carrier The top cover tape is peeled from the tape, and the carrier tape of the electronic component carrier from which the top cover tape has been peeled is covered with the means for transporting to the electronic component take-out part, and the whole non-conductive reel is covered, The present invention relates to an electronic component supply device including a conductive cover that is grounded to lower the potential of the reel surface. Here, the grounding means that the ground is connected to the ground by a conducting wire, and the potential is equalized with the ground.

  With this configuration, since the potential of −3000 V to −500 V on the reel surface can be lowered to about −300 V, it is possible to provide an electronic component supply device that reduces the adhesion of the electronic component to a carrier tape or the like due to static electricity. For this reason, the success rate of electronic component adsorption by the adsorption head of the electronic component mounting apparatus can be improved.

  As described above, when a non-conductive reel is covered with a conductive cover and this conductive cover is grounded, a capacitor component is formed between the non-conductive reel and the cover. Then, the electrostatic capacity due to the capacitor component and the electrostatic capacity of the reel are combined to obtain a larger combined electrostatic capacity (C).

  On the other hand, since the non-conductive reel has a constant friction during production operation, the charge (Q) of the reel is constant. For this reason, from the formula of Q (charge) = C (capacitance) × V (voltage), since Q (charge) is constant and C (capacitance) increases, V (voltage) is up to −300V. It becomes smaller.

(Second invention)
According to a second aspect of the present invention , an electronic component carrier is housed in a carrier tape housing portion, the surface of the carrier tape is covered with a top cover tape, a non-conductive reel is pulled out, and the top cover is removed from the carrier tape. By peeling the tape, the carrier tape of the electronic component carrier from which the top cover tape has been peeled, means for conveying the carrier tape to the electronic component take-out part, and the non-conductive reel is covered and grounded, Electronic component supply apparatus including a conductive cover for lowering the surface potential of a reel, and an electronic component mounting apparatus including a head for taking out the electronic component from the electronic component supply apparatus and mounting the electronic component on a printed wiring board It is about.
With this configuration, it is possible to provide an electronic component mounting apparatus that exhibits the same effects as those of the first invention.

  The present invention can provide an electronic component supply device and an electronic component mounting device that can improve the suction rate of electronic components by the suction head.

(Example 1) which is a perspective view of an electronic component conveyance body. It is a top view of the carrier tape from which the top cover tape was peeled off. Example 1 (Example 1) which is a side view of a carrier tape. It is a side view of an electronic component supply device (Example 1) (Example 1) which is the side of the electronic component supply apparatus which attached the cover. (Example 1) which is a perspective view of a cover. 1 is a perspective view of an electronic component mounting apparatus (Example 1). It is a perspective view of an electronic component supply apparatus (Example 1). (Example 2) which is a side view of an electronic component supply apparatus. It is the figure which showed the method of measuring the voltage of a reel. It is a side view of an electronic component supply device

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Outline of electronic parts carrier)
As shown in FIGS. 1 to 3, the electronic component transport body 1 includes a carrier tape 2, a top cover tape 3, and a bottom tape 4. More specifically, the electronic component carrier 1 has an acetate bottom tape 4 attached to the lower surface of a paper carrier tape 2 in which a plurality of through holes 5 are formed at intervals in the longitudinal direction. It is attached. For this reason, the carrier tape 2 is formed with a storage portion by the through hole 5 and the bottom tape 4. A chip-type electronic component 6 is stored in each of the storage portions.

  A top cover tape 3 made of resin (for example, a two-layer structure of PET and PE) is attached to the upper surface of the carrier tape 2 with an adhesive or the like, and the chip-type electronic component 6 falls from the electronic component carrier 1. It is supposed not to. The electronic component transport body 1 is wound around a reel 8, and a feed hole 7 for transporting the electronic component transport body 1 by an electronic component supply device described later is provided at an end portion of the carrier tape in the short direction. At equal intervals in the longitudinal direction.

(Outline of electronic component supply equipment)
As the electronic component supply apparatus, in addition to those described in Japanese Patent Application Laid-Open Nos. 05-21987, 9-186487, 11-46089, etc., those supplied from electronic component mounting machine manufacturers are used. be able to. One example will be described below.

  FIG. 4 is a view showing a state in which the reel 8 around which the electronic component carrier 1 is wound is set in the electronic component supply device 9. A shaft 10 is fixed to a rear end portion of the main body 16 of the electronic component supply device 9. The reel 8 can be set (attached) to the electronic component supply device 9 by inserting the hole 11 formed in the substantially central portion of the reel 8 into the shaft 10.

  The electronic component carrier 1 pulled out from the reel 8 is attached to a sprocket (not shown) that is attached to the tip portion 26 of the main body 16 and feeds the electronic component carrier 1 by a predetermined pitch. Specifically, a plurality of engagement blades provided on the peripheral surface of the sprocket are inserted into the feed holes 7 of the electronic component carrier 1. Then, the electronic component carrier 1 is pulled out from the reel 8 and moved to the tip end portion 26 by the operation of the sprocket that rotates intermittently by a drive mechanism that operates by power such as air and electricity supplied from an electronic component mounting apparatus (not shown). It is conveyed toward.

  A plate 12 as a tape peeling unit is attached to the distal end portion 26 of the main body 16 of the electronic component supply device 9, and is attached to the upper surface of the electronic component carrier 1 drawn out from the reel 8 by the plate 12. The top cover tape 3 is peeled off from the upper surface of the carrier tape 2. Then, the top cover tape 3 peeled off from the upper surface of the carrier tape 2 is taken up by a take-up reel 13 attached to a substantially central portion of the main body 16.

  On the other hand, the carrier tape 2 from which the top cover tape 3 has been peeled off by the plate 12 is bent in an arc shape along the shape of the sprocket attached to the distal end portion 26 of the main body 16 of the electronic component supply device 9, and the electronic component supply device 9 is discharged from the substantially central lower portion of the main body 16.

  The electronic component carrier 1 is conveyed (sprocket intermittent drive) and the peeled top cover tape 3 is taken up by the take-up reel 13 using a driving mechanism such as an air cylinder (not shown) attached to the main body 16. Do.

  Further, two positioning pins 15 are attached to the lower surface of the electronic component supply device 9, and by inserting these two positioning pins 15 into the positioning holes 21 of the electronic component mounting device, as shown in FIG. The electronic component supply device 9 can be set in the electronic component mounting device.

  The suction head as the head of the electronic component mounting apparatus (not shown) is stored in the storage portion of the carrier tape 2 in the gripping portion 14 as the electronic component takeout portion immediately after the top cover tape 3 is peeled off by the plate 12. The chip-type electronic component 6 is adsorbed.

(Electronic component supply apparatus according to the present invention)
As shown in FIG. 5, the electronic component supply device 61 according to the present invention grounds the cover 23 covering the entire non-conductive reel 8 and the cover 23 to the general electronic component supply device 9 described above. A cable 25 is provided.

As shown in FIG. 6, the cover 23 has a bag shape with an opening 28 and may have a conductive surface resistance value of 10 ⁷ Ω or less. The surface resistance value is measured by placing a measurement sample (cover) on a base B having a surface resistance of 10 ¹⁴ or more, placing two probes on the measurement sample, and measuring the resistance value between the two points. . As the measuring instrument, for example, a surface resistance meter MODEL152 manufactured by Trek Japan Co., Ltd. can be used.

  In Example 1, a conductive sheet made of Achilles (product name: carbon mesh) in which a coating material containing carbon in the form of a mesh is applied to the inside of a transparent soft vinyl chloride bag as the cover 23 (product name: Seiden F) was used. As the reel 8, a non-conductive (insulating) reel made of polyethylene resin was used.

(Electronic component mounting apparatus according to the present invention)
FIG. 7 is a perspective view of the electronic component mounting apparatus 50 according to the present invention, and shows a state where three electronic component supply apparatuses 61 according to the present invention are attached to the base 52 of the electronic component mounting apparatus 50. The electronic component mounting apparatus 50 vacuum grips the chip-type electronic component 6 supplied from the electronic component supply apparatus 61 according to the present invention with a suction head (not shown) in the gripping part 14 and conveys it by a conveyor 51 (not shown). It is to be mounted on a wiring board.

  The electronic component mounting apparatus 50 according to the present invention may be an electronic component mounting apparatus for mounting a general chip-type electronic component except that the electronic component supply apparatus 61 is used. A general chip-type electronic component mounting apparatus is commercially available, and there are many documents such as Japanese Patent Application Laid-Open Nos. 11-46089 and 08-2421994. To do.

Another embodiment of the present invention will be described in detail with reference to FIG.
FIG. 9 is a side view of the electronic component supply apparatus according to the present invention. In order to make the explanation easy to understand, the same parts as those of the electronic component supply apparatus according to the first embodiment are denoted by the same reference numerals and detailed description thereof is omitted.

  The electronic component supply apparatus 62 according to the second embodiment is different from the first embodiment only in that the conductive cover 27 is made of a sheet (aluminum foil) containing aluminum as a main component.

(Results of chip-type electronic component adsorption test)
The electronic component supply device 61 according to the first embodiment shown in FIG. 5 is attached to the base of an electronic component mounting device (I-CUBE2 manufactured by Yamaha Motor Co., Ltd.) as shown in FIG. An adsorption test of RK73B1ETTP made by company was conducted.

  Further, the electronic component supply device 62 according to the second embodiment shown in FIG. 9 is attached to the base of an electronic component mounting device (Yamaha Motor Co., Ltd. I-CUBE2) as shown in FIG. An adsorption test of RK73B1ETTP manufactured by KOA Corporation was performed.

  Furthermore, the adsorption test results of the following three comparative examples were also carried out. The results of a total of five adsorption tests are shown in Table 1.

[Comparative Example 1]
The electronic component mounting apparatus 9 shown in FIG. 4 was attached to the base of the electronic component mounting apparatus (I-CUBE2 manufactured by Yamaha Motor Co., Ltd.), and an adsorption test of the chip-type electronic component (RK73B1ETTP manufactured by KOA Corporation) was performed. As the reel, the same non-conductive (insulating) reel made of polyethylene resin as in Example 1 was used.

[Comparative Example 2]
The electronic component mounting apparatus 9 shown in FIG. 4 was attached to the base of the electronic component mounting apparatus (I-CUBE2 manufactured by Yamaha Motor Co., Ltd.), and an adsorption test of the chip-type electronic component (RK73B1ETTP manufactured by KOA Corporation) was performed. As the reel, a black conductive reel containing carbon in polyethylene resin was used.

[Comparative Example 3]
The electronic component mounting apparatus 62 shown in FIG. 9 was attached to the base of an electronic component mounting apparatus (I-CUBE2 manufactured by Yamaha Motor Co., Ltd.), and an adsorption test of a chip-type electronic component (RK73B1ETTP manufactured by KOA Corporation) was performed. The reel was not a non-conductive (insulating) reel made of polyethylene resin, but a black conductive reel containing carbon in the same polyethylene resin as in Comparative Example 2.

  From Table 1, it can be seen that the non-conductive reel is covered with a grounded conductive cover, so that the adsorption success rate becomes 99.9% or more.

(Reel voltage measurement result)
Table 2 shows the results of measuring the voltages of the non-conductive reels shown in Example 1, Example 2, and Comparative Example 1 when collecting the data in Table 1 described above.
The reel voltage (potential) was measured using a digital low potential measuring device KSD-0303 manufactured by Kasuga Electric. As shown in FIG. 10, the probe 56 connected to the measuring instrument 55 by the cable 57 was measured with a distance of about 10 mm from the reel 8.

  From Table 2, it can be seen that the non-conductive reel is covered with a grounded conductive cover, so that the voltage (potential) of the reel is reduced to about −300V.

  The above-described embodiments are illustrated for explanation, and the present invention is not limited thereto, and those skilled in the art will recognize from the claims, the detailed description of the invention, and the description of the drawings. Modifications and additions are possible without departing from the technical idea of the present invention.

  In the above embodiment, as shown in FIGS. 1 to 3, the electronic component carrier 1 is composed of the carrier tape 2, the top cover tape 3, and the bottom tape 4, that is, the carrier tape is stored. Although the portion formed by the side surface of the through hole formed in the carrier tape and the bottom tape is shown, it is not limited to this. For example, the electronic component transport body 1 may be composed of a carrier tape 2 having a recess and a top cover tape 3 and having no bottom tape.

  In the above-described embodiment, a bag-like cover is shown. However, as shown in FIG. 11, the entire non-conductive reel 8 is formed by a box-like case 34 made of a metal plate such as aluminum or iron. The case 34 may be covered and grounded by the cable 25. In FIG. 11, if the case 34 is fixed to the main body 16 of the electronic component supply device with screws or the like and the lid 36 made of a metal plate is attached using a metal hinge 35, the electronic component can be easily replaced with the reel 8. It can be a feeding device.

  The present invention can be used for an electronic component supply apparatus and an electronic component mounting apparatus that are used for mounting an electronic component on a printed wiring board.

DESCRIPTION OF SYMBOLS 1 Electronic component conveyance body 2 Carrier tape 3 Top cover tape 5 Through-hole 6 Chip-type electronic component 8 Reel 9 Electronic component supply apparatus 23 Cover 27 Cover

Claims (2)

An electronic component is stored in a carrier tape storage section, and an electronic component transport body whose surface is covered with a top cover tape is pulled out from a non-conductive reel attached to the main body, and the top cover is extracted from the carrier tape. Means for peeling the tape, and transporting the carrier tape of the electronic component carrier from which the top cover tape has been peeled, to the electronic component take-out unit;
A conductive cover that covers the entirety of the non-conductive reel and is grounded to lower the potential of the reel surface;
An electronic component supply device comprising: An electronic component is stored in a storage portion of a carrier tape, and an electronic component transport body in which the surface of the carrier tape is covered with a top cover tape is pulled out from a non-conductive reel, and the top cover tape is peeled off from the carrier tape, Means for transporting the carrier tape of the electronic component transporter from which the top cover tape has been peeled off to the electronic component take-out portion, and the non-conductive reel are covered and grounded, whereby the potential of the reel surface is reduced. An electronic component supply device comprising a conductive cover for lowering ;
A head for taking out the electronic component from the electronic component supply device and mounting the electronic component on a printed wiring board;
An electronic component mounting apparatus comprising:

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