JP5489849B2 - 位置計測装置及び方法、露光装置並びにデバイス製造方法 - Google Patents

位置計測装置及び方法、露光装置並びにデバイス製造方法 Download PDF

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JP5489849B2
JP5489849B2 JP2010109263A JP2010109263A JP5489849B2 JP 5489849 B2 JP5489849 B2 JP 5489849B2 JP 2010109263 A JP2010109263 A JP 2010109263A JP 2010109263 A JP2010109263 A JP 2010109263A JP 5489849 B2 JP5489849 B2 JP 5489849B2
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alignment mark
substrate
plane
alignment
imaging system
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JP2011238788A (ja
JP2011238788A5 (enExample
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憲稔 坂本
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Canon Inc
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Canon Inc
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2010109263A 2010-05-11 2010-05-11 位置計測装置及び方法、露光装置並びにデバイス製造方法 Expired - Fee Related JP5489849B2 (ja)

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JP2010109263A JP5489849B2 (ja) 2010-05-11 2010-05-11 位置計測装置及び方法、露光装置並びにデバイス製造方法

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JP2011238788A JP2011238788A (ja) 2011-11-24
JP2011238788A5 JP2011238788A5 (enExample) 2013-06-27
JP5489849B2 true JP5489849B2 (ja) 2014-05-14

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Families Citing this family (7)

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Publication number Priority date Publication date Assignee Title
JP5984459B2 (ja) * 2012-03-30 2016-09-06 キヤノン株式会社 露光装置、露光装置の制御方法及びデバイス製造方法
JP6226525B2 (ja) * 2013-01-15 2017-11-08 キヤノン株式会社 露光装置、露光方法、それらを用いたデバイスの製造方法
CN105527795B (zh) * 2014-09-28 2018-09-18 上海微电子装备（集团）股份有限公司 曝光装置及离焦倾斜误差补偿方法
JP7241548B2 (ja) 2018-02-19 2023-03-17 キヤノン株式会社 インプリント装置、平坦化層形成装置、形成装置、制御方法、および、物品製造方法
KR102851748B1 (ko) * 2018-08-28 2025-08-27 케이엘에이 코포레이션 2-회절된 차수들의 이미징을 사용한 축외 조명 오버레이 측정
CN114937619B (zh) * 2022-04-26 2024-08-20 沛顿科技（深圳）有限公司 一种倒装芯片固晶位置的检测方法
CN119376191A (zh) * 2024-11-26 2025-01-28 新毅东(北京)科技有限公司 基于物方远心镜头的标记定位方法及系统

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