JP5479344B2 - 電子素子、その作製方法およびその使用方法 - Google Patents
電子素子、その作製方法およびその使用方法 Download PDFInfo
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- JP5479344B2 JP5479344B2 JP2010524371A JP2010524371A JP5479344B2 JP 5479344 B2 JP5479344 B2 JP 5479344B2 JP 2010524371 A JP2010524371 A JP 2010524371A JP 2010524371 A JP2010524371 A JP 2010524371A JP 5479344 B2 JP5479344 B2 JP 5479344B2
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- 238000000034 method Methods 0.000 title claims description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000002105 nanoparticle Substances 0.000 claims description 44
- 239000003792 electrolyte Substances 0.000 claims description 23
- 239000011244 liquid electrolyte Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 239000007784 solid electrolyte Substances 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 4
- 238000004528 spin coating Methods 0.000 claims description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 52
- 239000004065 semiconductor Substances 0.000 description 10
- 239000012071 phase Substances 0.000 description 7
- 230000002441 reversible effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 239000002159 nanocrystal Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 238000007641 inkjet printing Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002086 nanomaterial Substances 0.000 description 3
- 150000003346 selenoethers Chemical class 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 229910017390 Au—Fe Inorganic materials 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000002707 nanocrystalline material Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 150000004763 sulfides Chemical class 0.000 description 2
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011370 conductive nanoparticle Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052976 metal sulfide Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- -1 preferably oxides Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- SYRHIZPPCHMRIT-UHFFFAOYSA-N tin(4+) Chemical compound [Sn+4] SYRHIZPPCHMRIT-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/22—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIBVI compounds
- H01L29/2203—Cd X compounds being one element of the 6th group of the Periodic Table
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/22—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIBVI compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78681—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising AIIIBV or AIIBVI or AIVBVI semiconductor materials, or Se or Te
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Materials Engineering (AREA)
- Thin Film Transistor (AREA)
Description
(1) スパッタリングまたは真空蒸着法;
(2) 無機のナノ粒子をディスパージョンするスピンコーティングまたは印刷法、有利にはスクリーン印刷法またはインクジェット印刷およびこれに続く焼結ステップ;
(3) 無機のナノ粒子と電解質をディスパージョンするスピンコーティングまたは印刷法、有利にはスクリーン印刷法またはインクジェット印刷およびこれに続く熱処理ステップ。
Claims (11)
- 2つの電極(1,2)と、誘電体とを含む電子素子において、
前記の電極の間にナノ粒子からなる層(10)が設けられており、
当該のナノ粒子は、金属と、周期表の第6主族の元素との導電性の化合物から構成され、インジウム−スズ酸化物、フッ素またはアンチモンドープスズ(IV)酸化物またはアルミニウムドープ亜鉛酸化物からなり、
前記のナノ粒子の大多数のサイズは、前記の導電性の化合物の遮蔽距離の0.1倍〜10倍であり、
前記の誘電体は、固体または液体の電解質(30)の形態であり、前記の層(10)の前記ナノ粒子の少なくとも一部分と少なくとも1つの共通の境界面を形成し、当該電解質(30)は制御電極(31)と接触接続していることを特徴とする
電子素子。 - 前記のナノ粒子からなる層(10)は、平坦な誘電体層(3)の形態の誘電体に平坦な構造体の形態で被着されており、
前記の誘電体層(3)それ自体は、平坦な導電性層(4)に被着されている、
請求項1に記載の電子素子。 - 前記のナノ粒子からなる層(10)は、電気絶縁性の基板(5)に被着されており、
前記の誘電体は、ナノ粒子からなる層(10)の表面に設けられており、かつ制御電極(31)と接触接続している、
請求項1に記載の電子素子。 - 前記電解質は、前記の層(10)のナノ粒子と相互浸入網目を形成している、
請求項1に記載の電子素子。 - ナノ粒子からなる層(10)を有しており、
当該ナノ粒子は、5nm〜500nmの粒径を有しており、
前記の層(10)のナノ粒子間に、5nm〜500nmの孔径分布を有する孔が設けられている、
請求項1から4までのいずれか1項に記載の電子素子。 - 本発明による電子素子の構造を層作製法によって作製することを特徴とする、
請求項1から5までのいずれか1項に記載の電子素子を作製する方法。 - 後続の焼結ステップを有する、
請求項6に記載の方法。 - 電子素子の構造を層作製法によって作製し、引き続いて電解質によってコーティングする、
請求項4から5までのいずれか1項に記載の電子素子を作製する方法。 - 前記のナノ粒子を液体の電解質に直接ディスパージョンさせ、引き続いてスピンコーティングによってまたは印刷法によって基板に被着する
請求項8に記載の方法。 - 熱処理ステップを有する
請求項8または9に記載の方法。 - 前記の基板に被着した後、固体になる液体の電解質を使用する、
請求項8から10までのいずれか1項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007043360.5 | 2007-09-12 | ||
DE102007043360A DE102007043360A1 (de) | 2007-09-12 | 2007-09-12 | Elektronisches Bauelement, Verfahren zu seiner Herstellung und seine Verwendung |
PCT/EP2008/006818 WO2009036856A1 (de) | 2007-09-12 | 2008-08-20 | Elektronisches bauelement, verfahren zu seiner herstellung und seine verwendung |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010539688A JP2010539688A (ja) | 2010-12-16 |
JP2010539688A5 JP2010539688A5 (ja) | 2013-09-12 |
JP5479344B2 true JP5479344B2 (ja) | 2014-04-23 |
Family
ID=39865672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010524371A Active JP5479344B2 (ja) | 2007-09-12 | 2008-08-20 | 電子素子、その作製方法およびその使用方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8558214B2 (ja) |
EP (1) | EP2188841B1 (ja) |
JP (1) | JP5479344B2 (ja) |
DE (1) | DE102007043360A1 (ja) |
WO (1) | WO2009036856A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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EP2654075B1 (de) | 2010-03-31 | 2016-09-28 | EV Group E. Thallner GmbH | Verfahren zum permanenten Verbinden zweier Metalloberflächen |
EP2423965A1 (en) | 2010-08-27 | 2012-02-29 | Karlsruher Institut für Technologie | Electrochemically-gated transistor and a method for its manufacture |
EP2629356B1 (en) | 2012-02-17 | 2016-02-17 | Karlsruher Institut für Technologie | Printed electronics available through depositing a layer of a composite solid polymer electrolyte and use of a composite solid polymer electrolyte for printing electronics |
US8927967B2 (en) * | 2013-04-24 | 2015-01-06 | Karlsruhe Institute Of Technology | Electrochemically-gated field-effect transistor, methods for its manufacture and use thereof |
US10167193B2 (en) | 2014-09-23 | 2019-01-01 | Vanderbilt University | Ferroelectric agglomerates and methods and uses related thereto |
US9903016B2 (en) * | 2014-10-23 | 2018-02-27 | E/G Electro-Graph, Inc. | Device having preformed triple junctions to maintain electrode conductivity and a method for making and using the device |
EP3261128A1 (en) * | 2016-06-23 | 2017-12-27 | Karlsruher Institut für Technologie | Vertical field-effect transistor, a method for its manufacture, its use, and electronics comprising said field-effect transistor |
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US6294401B1 (en) * | 1998-08-19 | 2001-09-25 | Massachusetts Institute Of Technology | Nanoparticle-based electrical, chemical, and mechanical structures and methods of making same |
DE19952447C1 (de) | 1999-10-30 | 2001-01-18 | Karlsruhe Forschzent | Vorrichtung mit einer Elektrode, einer schwammartigen perkolierenden Schicht, einem Elektrolyten und einem Mittel zum Anlegen einer Spannung |
DE10059498A1 (de) * | 2000-11-30 | 2002-06-13 | Infineon Technologies Ag | Substrat mit einer halbleitenden Schicht, elektronisches Bauelement mit diesem Substrat, elektronische Schaltung mit mindestens einem solchen elektronischen Bauelement, druckbare Zusammensetzung sowie Verfahren zur Herstellung eines Substrats |
WO2004032193A2 (en) * | 2002-09-30 | 2004-04-15 | Nanosys, Inc. | Large-area nanoenabled macroelectronic substrates and uses therefor |
KR20060072097A (ko) * | 2002-12-09 | 2006-06-27 | 픽셀리전트 테크놀로지스 엘엘씨 | 프로그램가능 리소그래피 마스크 및 나노 사이즈 반도체입자를 기반으로 한 가역성 광탈색재와 그 응용 |
US20110294296A1 (en) * | 2003-05-21 | 2011-12-01 | Lucent Technologies Inc. | Using edges of self-assembled monolayers to form narrow features |
JP5419326B2 (ja) * | 2003-10-06 | 2014-02-19 | マサチューセッツ インスティテュート オブ テクノロジー | 不揮発性メモリデバイス |
WO2005089165A2 (en) * | 2004-03-10 | 2005-09-29 | Nanosys, Inc. | Nano-enabled memory devices and anisotropic charge carrying arrays |
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JP2006227254A (ja) * | 2005-02-17 | 2006-08-31 | Konica Minolta Holdings Inc | 電気化学トランジスタ、及びこれを用いた表示素子 |
JP2006227488A (ja) * | 2005-02-21 | 2006-08-31 | Konica Minolta Holdings Inc | 表示素子 |
US7691666B2 (en) * | 2005-06-16 | 2010-04-06 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
US7507618B2 (en) * | 2005-06-27 | 2009-03-24 | 3M Innovative Properties Company | Method for making electronic devices using metal oxide nanoparticles |
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2007
- 2007-09-12 DE DE102007043360A patent/DE102007043360A1/de not_active Withdrawn
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2008
- 2008-08-20 WO PCT/EP2008/006818 patent/WO2009036856A1/de active Application Filing
- 2008-08-20 JP JP2010524371A patent/JP5479344B2/ja active Active
- 2008-08-20 US US12/677,848 patent/US8558214B2/en active Active
- 2008-08-20 EP EP08785631.6A patent/EP2188841B1/de not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
US20100308299A1 (en) | 2010-12-09 |
EP2188841B1 (de) | 2018-10-10 |
WO2009036856A1 (de) | 2009-03-26 |
US8558214B2 (en) | 2013-10-15 |
JP2010539688A (ja) | 2010-12-16 |
EP2188841A1 (de) | 2010-05-26 |
DE102007043360A1 (de) | 2009-03-19 |
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