JP5472211B2 - Magnetic detector - Google Patents

Description

  The present invention relates to a magnetic detection device using a magnetoelectric conversion element such as a Hall element.

  Conventionally, a magnetic detection device using a magnetoelectric conversion element such as a Hall element has been used to detect a rotation angle and a linear displacement amount. This magnetic detection device, for example, molds an IC containing a processing circuit such as a magnetoelectric conversion element or an amplification amplifier by resin injection molding, thereby positioning the magnetoelectric conversion element and stabilizing the position of the magnetoelectric conversion element. (For example, refer to Patent Document 1). However, when the IC is molded, the resin injection pressure acts on the IC package (the part of the IC in which the magnetoelectric conversion element or the like is incorporated), so that the output voltage characteristics of the IC may fluctuate.

JP 2004-004114 A

  The present invention has been made in order to solve the above-described problems. The purpose of the present invention is to form a resin mold portion by injection molding and position a magnetoelectric conversion element in a magnetic detection device. This is to reduce the possibility that the output voltage characteristic fluctuates.

According to the first aspect of the present invention, the magnetic detection device includes an IC package containing the magnetoelectric conversion element, an IC having a plurality of lead wires extending from the IC package, and an accommodating space for accommodating the IC, and is injection molded. And a storage container in which a resin mold part is formed on the outer surface. Further, a contact area where a part of the surface of the IC package abuts exists on the inner wall surface constituting the accommodation space, and the resin mold portion is formed only on the outer surface of the inner wall surface other than the contact area. The magnetoelectric conversion element is positioned by contact with the contact region of the IC package and by forming a resin mold portion on the outer surface of the storage container .

Accordingly, the resin mold portion can be formed by injection molding so that the injection pressure of the resin does not act on the IC package, and the magnetoelectric conversion element can be positioned. For this reason, when forming a resin mold part by injection molding and positioning a magnetoelectric conversion element, a possibility that the output voltage characteristic of IC may fluctuate can be reduced .

Each of the plurality of lead wires is electrically connected to the terminal in the accommodating space, and the accommodating container has an opening for accommodating the IC in the accommodating space, and the opening penetrates the terminal individually. It is closed by a lid with a hole. Further, the terminal has a lid stopper that engages with the lid while passing through the through hole, and the lid is integrated with the storage container by heat caulking while being engaged with the terminal by the lid stopper. Close.
Thereby, the terminal can be positioned.

According to the means of the second aspect , the storage container has a flange-like protrusion that surrounds the storage space in an annular shape and extends outward from the outer surface, and the protrusion is fused to the resin mold portion.
If an interface is formed between the outer surface of the storage container and the resin mold portion, fluid may enter the storage space through the interface. Therefore, a flange-like protrusion is provided on the outer surface of the storage container so as to surround the storage space in an annular shape, and the protrusion and the resin mold part are fused. Accordingly, the fluid intrusion path that reaches the accommodation space via the interface is blocked at the fusion portion between the protrusion and the resin mold portion, so that the risk of fluid entering the accommodation space through the interface can be reduced. .

According to the third aspect of the present invention, the IC package is held between the contact areas.
Thereby, the position of the magnetoelectric conversion element can be further stabilized. Further, for example, the shape of the IC package and the range of the contact area can be set so that the IC package can be sandwiched in a direction that does not easily affect the output voltage characteristics of the IC.
As described above, the position of the magnetoelectric conversion element can be further stabilized without affecting the output voltage characteristics of the IC.
According to the means of claim 4, a potting material is injected into the accommodating space. According to the means of claim 5, a capacitor is attached between the terminals, and the capacitor is sealed with the potting material.
Thereby, a terminal and a capacitor can be positioned.

(A) is a top view of a magnetic detection apparatus, (b) is a side view of a magnetic detection apparatus ( reference example 1 ). (A) is a plane sectional view showing a magnetic detection device except a resin mold part, and (b) is a side sectional view showing a magnetic detection device except a resin mold part ( reference example 1 ). (A) is a top sectional view showing the principal part of a magnetic detection device, (b) is an AA sectional view of (a), and (c) is a BB sectional view of (b). ( Reference Example 1 ). (A) is a top sectional view showing the principal part of a magnetic detection device, (b) is a CC sectional view of (a), (c) is a rear view of the magnetic detection device, (d) is explanatory drawing which shows engagement with a lid | cover and a terminal ( Example) . (A) is a side view of a sub-assembly, (b) is a side sectional view showing a magnetic detection device excluding a resin mold part (Reference Example 2 ). It is sectional drawing of a magnetic detection apparatus ( reference example 3 ). It is sectional drawing of a magnetic detection apparatus ( reference example 4 ).

  The magnetic detection device of Embodiment 1 has an IC package containing a magnetoelectric conversion element, an IC having a plurality of lead wires extending from the IC package, and a housing space for housing the IC, and is formed on the outer surface by injection molding. And a storage container in which a resin mold part is formed. In addition, a contact area where a part of the surface of the IC package abuts exists on the inner wall surface constituting the accommodation space, and the resin mold portion is formed on the outer surface of the inner wall surface other than the contact area. The magnetoelectric conversion element is positioned by contact with the contact region of the IC package and by forming a resin mold portion on the outer surface of the storage container.

In addition, the storage container has a flange-like protrusion that surrounds the storage space in an annular shape and extends outward from the outer surface, and the protrusion is fused to the resin mold portion.
The IC package is held between the contact areas .

Further, the storage container has an opening for storing the IC in the storage space, and the opening is closed by a lid having a through hole through which the terminal is individually passed. Further, the terminal has a lid stopper that engages with the lid while passing through the through hole, and the lid is integrated with the storage container by heat caulking while being engaged with the terminal by the lid stopper. Close.

[Configuration of Reference Example 1 ]
A magnetic detection device (hereinafter referred to as a detection device) 1 of Reference Example 1 will be described with reference to FIGS.
The detection device 1 includes a magnetoelectric conversion element (not shown) such as a Hall element. For example, a permanent magnet that changes a magnetic field while rotating or linearly moving relative to the magnetoelectric conversion element. In combination with a magnetic flux generating means (not shown) such as a rotational angle and a linear displacement amount. That is, the detecting device 1 detects a magnetic flux corresponding to the rotation angle of the magnetic flux generating means and the linear displacement amount and generates a voltage corresponding to the detected magnetic flux amount by the function of the magnetoelectric conversion element.

  The detection device 1 includes an IC 2 having a magnetoelectric conversion element, a storage container 3 that stores the IC 2, and a resin mold portion 4 that is formed outside the storage container 3 by resin injection molding. Is positioned by forming the resin mold portion 4 outside the storage container 3.

  The IC 2 has an IC package 5 containing a magnetoelectric conversion element and a plurality of lead wires 6 extending from the IC package 5. The IC package 5 is an epoxy resin which is mounted on a semiconductor substrate 7 on which various elements such as a magnetoelectric conversion element are mounted. The lead wire 6 is provided by being molded with a resin material such as resin, and is used for conducting various elements on the semiconductor substrate 7 and the outside.

  Here, the IC package 5 is provided in a substantially square plate shape whose surface direction is substantially the same as that of the semiconductor substrate 7. Moreover, all the lead wires 6 protrude perpendicularly only from the surface forming one side out of the four sides of the square. Note that there are three lead wires 6 protruding from the IC package 5, and the three lead wires 6 are a lead wire 6A for outputting a voltage generated in the magnetoelectric transducer, and a power source (not shown). And lead wire 6B for conducting the magnetic field and the magnetoelectric conversion element, and lead wire 6C for conducting the ground and the magnetoelectric conversion element.

  The storage container 3 is a resin molded product having a storage space 9 for storing the IC 2. The accommodation space 9 is mainly composed of a space area 9a on the front end side that accommodates the IC package 5, and a space area 9b that continuously extends to the rear end side of the space area 9a. The front end of the space area 9a is closed, and the rear end of the space area 9b forms an opening 10 for accommodating the IC 2 in the accommodation space 9.

  Here, a rectangular coordinate system using X, Y, and Z coordinate axes is defined in a state where the IC package 5 is accommodated in the space region 9a and the magnetoelectric transducer is positioned. First, the X axis is an axis indicating a direction defined by the front end and the rear end of the storage container 3, and the Y axis is an axis indicating a direction perpendicular to the X axis in the surface direction of the IC package 5. The Z-axis is an axis perpendicular to the X-axis and the Y-axis and indicating the thickness direction of the IC package 5. Furthermore, with respect to the X axis to the Z axis, one side and the other side are defined as shown in FIGS.

  The shape of the IC package 5 will be specifically described using this rectangular coordinate system. The IC package 5 is substantially square when viewed in the Z-axis direction (see FIG. 3A) and viewed in the X-axis direction. The shape is a hexagonal prism that is a hexagonal shape that is long in the Y-axis direction, and is mirrored on one side and the other side in the Y-axis direction (see FIG. 3C).

That is, the one surface Xa and the other surface Xb in the X-axis direction of the IC package 5 are hexagons that are long in the Y-axis direction, and are mirrored on one side and the other side in the Y-axis direction (hereinafter referred to as IC package). 5 are referred to as a front end surface Xa and a rear end surface Xb, respectively.
The one surface Za in the Z-axis direction of the IC package 5 is a square perpendicular to the Z-axis, and the other surface Zb in the Z-axis direction of the IC package 5 is a rectangle perpendicular to the Z-axis. The other surface Zb has a length in the X-axis direction equal to the one surface Za, and a length in the Y-axis direction is shorter than the one surface Za.

  Further, one side of the IC package 5 in the Y-axis direction is defined by one side surface Yal that is long in the X-axis direction and perpendicular to the one surface Za, and one inclined surface Ya2 that connects the one side surface Ya1 and the other surface Zb. Similarly, the other side of the IC package 5 in the Y-axis direction is defined by the other side surface Ybl and the other inclined surface Yb2.

In order to hold and position the IC package 5 having such a shape, the space region 9a of the storage container 3 is provided in the following shape.
First, the space region 9a is defined on one side in the X-axis direction by an inner wall surface x with which the tip surface Xa of the IC package 5 abuts, and the inner wall surface x closes the space region 9a on one side in the X-axis direction. The inner wall surface x is substantially in contact with the front end surface Xa. That is, most of the inner wall surface x forms an abutting region L0 where the tip surface Xa of the IC package 5 abuts.

  The space region 9a is provided so that the length in the Y-axis direction is slightly larger than that of the IC package 5. The inner wall surface ya defining the space region 9a on one side in the Y-axis direction is An inner wall surface yb that forms a gap 11ya between the one side surface Yal and the one inclined surface Ya2 and similarly defines the space region 9a on the other side in the Y-axis direction is the other side surface Ybl of the IC package 5 and the other inclined surface. A gap 11yb is formed between Yb2.

  Further, a shallow groove 12a that is wide in the Y-axis direction is provided on the inner wall surface za that defines the space region 9a on one side in the Z-axis direction. The one surface Za of the IC package 5 is in contact with the inner wall surface za only in the vicinity of one edge and the other edge in the Y-axis direction, and the bottom surface of the groove 12a in a wide range between the vicinity of the one edge and the vicinity of the other edge. A gap 11za is formed between them. That is, on the inner wall surface za, a contact area L1 where the vicinity of one edge of the one surface Za of the IC package 5 abuts and a contact area L2 where the vicinity of the other edge abuts are individually formed.

  Further, the inner wall surface zb that defines the space region 9a on the other side in the Z-axis direction is also provided with a shallow groove 12b that is wide in the Y-axis direction. The other surface Zb of the IC package 5 is in contact with the inner wall surface zb only in the vicinity of the one edge and in the vicinity of the other edge in the Y-axis direction, and the bottom surface of the groove 12b in a wide range between the vicinity of the one edge and the vicinity of the other edge. A gap 11zb is formed between them. That is, the inner wall surface zb is individually formed with a contact region L3 where the vicinity of one edge of the other surface Zb of the IC package 5 contacts and a contact region L4 where the vicinity of the other edge contacts.

  Here, since the groove 12a is wider in the Y-axis direction than the groove 12b, the contact areas L3 and L4 exist between the contact areas L1 and L2 in the Y-axis direction. Further, the contact areas L1 and L3 are separated with a gap 11ya interposed therebetween, and a portion on one side in the Y-axis direction of the IC package 5 is sandwiched and held in the Z-axis direction. Similarly, the contact areas L2 and L4 are separated with a gap 11yb interposed therebetween, and a portion on the other side of the IC package 5 in the Y-axis direction is sandwiched and held in the Z-axis direction.

  In the IC package 5, the semiconductor substrate 7 exists between the contact areas L3 and L4 in the Y-axis direction, and is sandwiched between the contact areas L1 and L3 and the contact areas L2 and L4. It does not exist in the part.

  The lead wires 6A to 6C protrude from the rear end surface Xb to the space region 9a, and further protrude through the space region 9a to the other side in the X-axis direction to the space region 9b. The lead wires 6A to 6C are welded to one ends of the terminals 13A, 13B, and 13C, respectively, in the space region 9b. Further, a noise removing capacitor 14 is connected between the terminals 13A and 13C and between the terminals 13B and 13C by solder, and the capacitor 14 is accommodated in the space region 9b. Then, for example, a potting material such as epoxy is injected into the accommodation space 9, and the capacitor 14 is sealed with the potting material.

Further, the outer surface of the portion of the storage container 3 that is the other end in the X-axis direction and that forms the opening 10 of the space region 9b has a collar shape that surrounds the storage space 9 and extends outward from the outer surface. The protrusion 16 is fused to the resin mold portion 4 (hereinafter, the outer surface of the storage container 3 is referred to as the outer surface 17).
Note that the other ends of the terminals 13A to 13C protrude from the space region 9b to the other side in the X-axis direction, and are welded to one ends of the terminals 19A, 19B, and 19C constituting the connector 18 together with the resin mold portion 4, respectively. Yes.

  The resin mold part 4 is provided by injection-molding a thermoplastic resin such as polyolefin, polyamide or polyester on the outside of the storage container 3. Here, in the outer surface 17, the interface region 20 that forms an interface with the resin mold portion 4 is the outer surface 17 closer to the other in the X-axis direction. More specifically, one edge of the interface region 20 exists between the welding region of the lead wires 6A to 6C and the terminals 13A to 13C and the soldering region of the capacitor 14 in the X-axis direction, and the interface region 20 The other edge is a protrusion 16.

For this reason, the resin mold part 4 is formed in the outer surface 17 of the inner wall surface other than the contact areas L0 to L4.
The magnetoelectric conversion element is positioned by contact with the contact regions L0 to L4 of the IC package 5 and formation of the resin mold portion 4 on the outer surface 17 of the storage container 3.

[Effect of Reference Example 1 ]
The detection device 1 of Reference Example 1 includes an IC package 5 containing a magnetoelectric conversion element, an IC 2 having lead wires 6A to 6C extending from the IC package 5, and a housing space 9 for housing the IC 2, and is externally formed by injection molding. The storage container 3 in which the resin mold part 4 is formed in the surface 17 is provided. Further, the inner wall surface constituting the accommodation space 9 has contact regions L0 to L4 where a part of the surface of the IC package 5 contacts, and the resin mold portion 4 is formed on the inner wall surface other than the contact regions L0 to L4. Formed on the outer surface 17. The magnetoelectric conversion element is positioned by contact with the contact regions L0 to L4 of the IC package 5 and formation of the resin mold portion 4 on the outer surface 17 of the storage container 3.

  Thereby, the resin mold part 4 can be formed by injection molding so that the injection pressure of the resin does not act on the IC package 5 of the IC 2, and the magnetoelectric conversion element can be positioned. For this reason, when forming the resin mold part 4 by injection molding and positioning a magnetoelectric conversion element, the possibility that the output voltage characteristic of IC2 may fluctuate can be reduced.

The storage container 3 has a flange-like protrusion 16 that surrounds the storage space 9 in an annular shape and extends outward from the outer surface 17, and the protrusion 16 is fused to the resin mold portion 4.
If an interface is formed between the outer surface 17 of the storage container 3 and the resin mold portion 4, there is a risk that fluid may enter the storage space 9 through the interface. Therefore, a flange-like protrusion 16 is provided on the outer surface 17 of the storage container 3 so as to surround the storage space 9 in an annular shape, and the protrusion 16 and the resin mold portion 4 are fused. As a result, the fluid intrusion path that reaches the accommodation space 9 via the interface is blocked at the fusion portion between the protrusion 16 and the resin mold portion 4, thereby reducing the possibility of fluid entering the accommodation space 9 through the interface. can do.

  Further, the IC package 5 is sandwiched and held by the contact regions L1 and L3 that are separated from each other on one side in the Y-axis direction, and is held by the contact regions L2 and L4 that are separated from each other. Has been. Further, in the IC package 5, the semiconductor substrate 7 exists between the contact areas L3 and L4 in the Y-axis direction, and is sandwiched between the contact areas L1 and L3 and the contact areas L2 and L4. It does not exist in the part.

  As a result, the output voltage characteristics of the IC 2 are not affected by the IC package 5 sandwiched between the contact areas L1 and L3 and the IC package 5 sandwiched between the contact areas L2 and L4. For this reason, the position of the magnetoelectric conversion element can be further stabilized without affecting the output voltage characteristics of the IC 2.

The lead wires 6A to 6C are electrically connected to the terminals 13A to 13C in the space region 9b of the accommodation space 9, respectively, and a potting material is injected into the accommodation space 9.
Thereby, terminal 13A-13C can be positioned.

Further, a capacitor 14 is attached between the terminals 13A and 13C and between the terminals 13B and 13C, and the capacitor 14 is sealed with a potting material.
Thereby, the capacitor | condenser 14 can be positioned.

( Example)
According to the detection device 1 of the embodiment, the opening 10 of the storage container 3 is closed by the lid 22 as shown in FIG. The lid | cover 22 is provided with the resin material same as the storage container 3, for example, and has the three through-holes 23 which let each of terminal 13A-13C each pass separately. Further, the terminal 13 </ b> C has a lid stopper 24 that engages with the lid 22 while passing through the through hole 23.

The lid 22 is integrated with the storage container 3 by heat caulking in a state where the lid 22 is engaged with the terminal 13 </ b> C by the lid stopper 24 and closes the opening 10. Here, the storage container 3 has a heat caulking portion 25 extending to the other side in the X-axis direction from the protrusion 16, and the lid 22 and the storage container 3 are integrated by heat caulking the heat caulking portion 25. ing.
Accordingly, the terminals 13A to 13C can be positioned without injecting a potting material into the accommodation space 9.

[Reference Example 2 ]
According to the detection apparatus 1 of the reference example 2 , as shown in FIG. 5, the IC 2, the terminals 13 </ b> A to 13 </ b> C, and the capacitor 14 are injection-molded as insert parts to form one sub-assembly 27. In the injection molding that constitutes the assembly 27, the lead wires 6A to 6C are insert parts, and the IC package 5 is not an insert part and is not injection molded. Then, after the sub assembly 27 is accommodated in the accommodating space 9, the resin mold portion 4 is formed by injection molding using the storage container 3 accommodating the sub assembly 27 as an insert part.

  As a result, after the positions of the terminals 13A to 13C and the capacitor 14 are stabilized in advance in the sub assembly 27, the sub assembly 27 is accommodated in the storage container 3, and the IC package 5 is brought into contact with the contact areas L0 to L4. The resin mold portion 4 can be formed on the outer surface 17 of the storage container 3. For this reason, the possibility that the output voltage characteristics of the IC 2 fluctuate can be reduced, and the terminals 13A to 13C and the capacitor 14 can be positioned to stabilize the positions of the terminals 13A to 13C and the capacitor 14.

[ Reference Example 3 ]
According to the detection device 1 of the reference example 3 , as shown in FIG. 6, the one side surface Yal of the IC package 5 is in contact with the inner wall surface ya, and the contact region L1 is a portion existing on the inner wall surface za and the inner wall surface za. It expands to the part existing in ya. Similarly, the other side surface Yb1 of the IC package 5 is in contact with the inner wall surface yb, and the contact region L2 is expanded into a portion existing on the inner wall surface za and a portion existing on the inner wall surface yb.

[ Reference Example 4 ]
According to the detection apparatus 1 of the reference example 4 , as shown in FIG. 7, the IC package 5 is not provided with one inclined surface Ya2, and the one side surface Ya1 is enlarged to the other side in the Z-axis direction, and the inner wall surface ya is formed. The entirety is a contact area L5. That is, unlike the contact areas L1 and L3 in Reference Examples 1 and 3, etc., Reference Example 4 is a continuous contact area L5 without being separated. Similarly, the other inclined surface Yb2 is not provided in the IC package 5, the other side surface Yb1 is enlarged to the other side in the Z-axis direction, and the entire inner wall surface yb is a contact region L6. That is, unlike the contact areas L2 and L4 in Reference Examples 1 and 3, etc., Reference Example 4 is a continuous contact area L6 without being separated.

  When the contact regions L1 and L3 are a continuous contact region L5 and the contact regions L2 and L4 are a continuous contact region L6, one side of the IC package 5 in the Y-axis direction by the contact region L5 itself. The side portion can be held in the Z-axis direction, and similarly, the contact region L6 itself can hold the other side portion of the IC package 5 in the Z-axis direction.

[Modification]
The aspect of the detection apparatus 1 is not limited to an Example, Various modifications can be considered.
For example, according to the detection device 1 of the embodiment, the magnetoelectric conversion element is brought into contact with the contact regions L0 to L4 of the IC package 5 and the formation of the resin mold portion 4 on the outer surface 17 of the storage container 3. Although positioned, the manner of contact between the IC package 5 and the storage container 3 is not limited to this. For example, the contact between the IC package 5 and the storage container 3 is limited only to the contact between the tip surface Xa and the contact region L0, the contact of the IC package 5 with the contact region L0, and the resin mold portion 4 The magnetoelectric conversion element may be positioned by forming.

  Further, according to the IC 2 of the detection device 1 of the embodiment, the IC package 5 has a square plate shape, and the lead wire 6 protrudes vertically only from the rear end face Xb that forms one of the four sides of the square. However, the shape of the IC package 5 may be provided in a columnar shape, or the lead wire 6 may be protruded from a plurality of surfaces in different directions.

  Further, according to the detection device 1 of the embodiment, the other surface Zb of the IC package 5 is set to have a length in the Y-axis direction shorter than the one surface Za, but with respect to the length in the Y-axis direction, the other surface Zb. May be set to be longer than the one surface Za.

  Further, according to the detection device 1 of the embodiment, regarding the connection patterns of the lead wires 6A to 6C, the lead wire 6A is for outputting a voltage generated in the magnetoelectric conversion element, and the lead wire 6B is a power source, a magnetoelectric conversion element, and the like. The lead wire 6C is for conduction between the ground and the magnetoelectric transducer, but the connection pattern of the lead wires 6A to 6C is not limited to such a mode.

1 Detection device (magnetic detection device)
2 IC
DESCRIPTION OF SYMBOLS 3 Storage container 4 Resin mold part 5 IC package 6, 6A-6C Lead wire 9 Storage space 10 Opening 13A-13C Terminal 14 Capacitor 16 Protrusion 17 Outer surface (outer surface)
22 Lid 23 Through hole 24 Lid stopper 27 Sub-assembly Xa Tip surface (IC package surface)
Xb Rear end face (IC package surface)
Za one side (surface of IC package)
Zb The other side (IC package surface)
Ya1 One side (surface of IC package)
Ya2 One inclined surface (IC package surface)
Yb1 other side (surface of IC package)
Yb2 other inclined surface (surface of IC package)
x, ya, yb, za, zb inner wall surface L0-L6 contact area

Claims (5)

An IC package containing a magnetoelectric conversion element, and an IC having a plurality of lead wires extending from the IC package;
It has a storage space for storing this IC, and a storage container in which a resin mold part is formed on the outer surface by injection molding,
The inner wall surface constituting the housing space has a contact area where a part of the surface of the IC package contacts,
The resin mold portion is formed only on the outer surface of the inner wall surface other than the contact area,
The magnetoelectric conversion element is positioned by contact with the contact region of the IC package and formation of the resin mold portion on the outer surface of the storage container,
Each of the plurality of lead wires is electrically connected to a terminal in the accommodation space ,
Before SL container has an opening for accommodating the IC in the housing space,
This opening is closed by a lid having a through hole through which the terminal is individually passed,
The terminal has a lid stopper that engages with the lid while passing through the through hole,
The magnetic detection device according to claim 1, wherein the lid is integrated with the storage container by heat caulking in a state where the lid is engaged with the terminal by the lid stopper, and the opening is closed. The magnetic detection device according to claim 1,
The storage container has a brim-like protrusion that surrounds the storage space in an annular shape and extends outward from an outer surface;
The protrusion is fused with the resin mold part. The magnetic detection device according to claim 1 or 2,
The magnetic detection device , wherein the IC package is held between the contact areas . The magnetic detection device according to any one of claims 1 to 3,
A magnetic detection device , wherein a potting material is injected into the accommodation space . In the magnetic detection device according to any one of claims 1 to 4,
A capacitor is attached between the terminals,
This capacitor is sealed with a potting material, and is a magnetic detection device .

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