JP5471699B2 - Adhesion evaluation apparatus and adhesion evaluation method - Google Patents

Description

  The present invention relates to an adhesion evaluation apparatus and an adhesion evaluation method suitable for evaluating the adhesion of a film formed on a semiconductor substrate.

  In recent years, attempts have been made to apply new materials and manufacturing processes to semiconductor devices in order to meet the demands for miniaturization and higher performance of semiconductor devices. However, if the adhesion of a film formed by such a new material or manufacturing process is not sufficient, the film may be peeled off by stress applied in the manufacturing process, which greatly affects the reliability of the semiconductor device. Therefore, it is important to evaluate the adhesion of the film before a new material or manufacturing process is actually applied to a semiconductor device.

  Various methods such as a tape test method, a stud pull method, a mELT (modified Edge Liftoff Test) method, and a four-point bending test method are known as film adhesion evaluation methods. In particular, the four-point bending test method is attracting attention as a method for evaluating the adhesion of a film formed on a semiconductor substrate because the method of applying a load is similar to the method of applying a load during an actual semiconductor device manufacturing process. .

JP 2004-95865 A JP 2001-59803 A JP 2007-103546 A

  As described above, the four-point bending test method is attracting attention as a method for evaluating the adhesion of a film formed on a semiconductor substrate. However, by simply applying the conventional four-point bending test method as it is, the adhesion of the film can be accurately measured. It may not be possible to evaluate.

  In view of the above, an object is to provide an adhesion evaluation apparatus and an adhesion evaluation method suitable for evaluating the adhesion of a film on a semiconductor substrate.

According to one aspect, a sample support jig that supports the sample by a pair of support portions that are disposed below the sample and are spaced apart from each other, and a pair of pressing portions that are disposed above the sample and are spaced from each other. A pressing jig capable of pressing the sample, a driving mechanism for moving at least one of the sample supporting jig and the pressing jig and pressing the sample by the pressing unit, and a displacement amount of the pressing jig relative to the sample supporting jig. A displacement detection unit to detect, a load detection unit to detect a load applied to the sample, a displacement detection value and a load detection value are input from the displacement detection unit and the load detection unit, and the drive mechanism is controlled. and a control device, said control device, after detecting the rapid decrease of the load applied to the sample by a detection value of the load detecting unit, so that load applied to the sample is within a predetermined range Adhesion evaluation device for controlling the serial drive mechanism is provided.

  In the adhesion evaluation apparatus, when the control device detects a sudden decrease in the load applied to the sample, the driving mechanism is controlled so that the load applied to the sample is within a certain range, and the speed of approaching the sample support jig of the pressing jig is adjusted. . As a result, the speed at which the film peels within the sample can follow the speed at which the pressing jig approaches the sample support jig, and the plateau region is clearly defined in the load-displacement characteristics even when the adhesion strength of the film is high. Appears. As a result, the adhesion of the film can be evaluated with good accuracy.

Fig.1 (a)-(c) is a schematic diagram which shows the example of the adhesive evaluation method. 2A and 2B are diagrams showing displacement-load characteristics obtained by the adhesion evaluation method shown in FIG. FIG. 3 is a schematic diagram illustrating the adhesion evaluation apparatus according to the embodiment. FIG. 4 is a flowchart illustrating the operation of the adhesion evaluation apparatus according to the embodiment. Fig.5 (a) is a schematic diagram which shows the pressing jig of the adhesiveness evaluation apparatus which concerns on embodiment, FIG.5 (b) is a schematic diagram which shows the pressing jig which concerns on the modification of embodiment. 6 is a perspective view and a partially enlarged view showing a sample of Example 1. FIG. FIG. 7 is a diagram showing the results of the adhesion evaluation test of Example 1. FIG. 8 is a diagram showing the results of the adhesion evaluation test of Comparative Example 1. FIG. 9 is a perspective view showing a sample of Example 2. FIG. FIG. 10 is a diagram showing the results of the adhesion evaluation test of Example 2. FIG. 11 is a diagram showing the results of the adhesion evaluation test of Comparative Example 2.

  Before describing the embodiment, preliminary items for facilitating understanding of the embodiment will be described below.

  1A to 1C are schematic views showing an example of a film adhesion evaluation method using a four-point bending test apparatus. FIGS. 2A and 2B are diagrams showing displacement-load characteristics obtained by the adhesion evaluation method.

  Here, as shown in FIG. 1A, the sample 80 has a structure in which a film 82, an adhesive layer 83, and a dummy substrate 84 are laminated on a substrate 81, and the adhesion between the substrate 81 and the film 82 is improved. Shall be evaluated. In addition, a notch (groove) 81n is formed in the sample 80 on the substrate 81 side, and the surface on which the notch 81n is formed is set on the lower side and set in a four-point bending test apparatus.

  The four-point bending test apparatus presses the sample 80 in contact with a sample support jig having a pair of support portions 85 a and 85 b that support the vicinity of both ends of the lower surface of the sample 80 and the upper surface of the sample 80. And a pressing jig having a pair of pressing portions 86a and 86b. The pressing portions 86a and 86b are disposed at positions spaced from each other across the center of the sample 80, and the interval between the pressing portions 86a and 86b is set smaller than the interval between the support portions 85a and 85b.

  When evaluating adhesion using such a four-point bending test apparatus, the load applied to the sample 80 is measured by the load cell while moving (displace) the pressing jig (pressing portions 86a and 86b) downward at a constant speed. To do. Then, the relationship between the displacement (movement amount) of the pressing jig and the load applied to the sample 80 is examined.

  While the displacement amount of the pressing jig is small, the entire sample 80 is elastically deformed. In this case, the load applied to the sample 80 increases linearly as the displacement amount of the pressing jig increases (range indicated by I in FIG. 2A).

  When the displacement amount of the pressing jig reaches a certain value, as shown in FIG. 1B, a crack 81a is generated in the substrate 81 starting from the notch 81n. The crack 81a reaches the film 82 in a short time. At this time, as indicated by P in FIG. 2A, the load applied to the sample 80 is rapidly reduced.

  When the pressing jig moves further downward, the film 82 is peeled off from the substrate 81 as shown in FIG. At this time, even if the displacement amount of the pressing jig is increased, the load applied to the sample 80 becomes a substantially constant value (range indicated by II in FIG. 2A). A region where the load applied to the sample 80 is substantially constant even when the displacement amount of the pressing jig is changed is called a plateau region.

  In the plateau region, it can be said that the moving speed of the pressing jig and the speed at which the film 82 is peeled off are balanced. The load in the plateau region reflects the adhesion of the film 82 to the semiconductor substrate 81. It can be said that the adhesion of the film 82 to the semiconductor substrate 81 is higher as the load in the plateau region is higher.

By the way, when an attempt is made to evaluate the adhesion of a film used in a recent semiconductor device by a four-point bending test method, the relationship between the amount of displacement of the pressing jig and the load applied to the sample is as shown in FIG. The plateau area may not appear. The inventors of the present application have conducted various experiments to clarify the reason. As a result, it was found that when the adhesion of the film is high (for example, 5 N / mm ² or more), the plateau characteristic does not appear only by applying the conventional 4-point bending test method as it is.

  In the conventional four-point bending test method, since the moving speed of the pressing jig is constant, it is considered that if the adhesion of the film is high, the speed at which the film peels off cannot follow the moving speed of the pressing jig and the plateau region does not appear. .

  Hereinafter, embodiments will be described with reference to the accompanying drawings.

  FIG. 3 is a schematic diagram illustrating the adhesion evaluation apparatus according to the embodiment.

  As shown in FIG. 3, in the adhesion evaluation apparatus 10 according to the present embodiment, a load cell 18 and a sample support jig 13 are disposed on a pedestal 12. The sample support jig 13 is provided with convex support portions 13 a and 13 b that are in contact with the vicinity of both ends of the lower side of the sample 90 and support the sample 90. The tips of the support portions 13a and 13b are curved surfaces having a curvature radius of about 1 mm. Moreover, the space | interval between support part 13a, 13b is set to 60 mm.

  The load applied to the sample 90 is measured by the load cell 18, and the measured value is sent to the control device (computer) 19.

  Above the pedestal 12, a motor 14, a lead screw 14b, a head member 14c, and a pressing jig 15 are arranged. The motor 14 is fixed to the frame 11 and is driven and controlled by the control device 19.

  The lead screw 14 b is connected to the rotating shaft of the motor 14. The head member 14c moves up and down along the lead screw 14b by the rotation of the lead screw 14b. The pressing jig 15 is supported by a lower portion of the head member 14b and moves in the vertical direction together with the head member 14b.

  The pressing jig 15 has a pair of convex pressing portions 15 a and 15 b that are in contact with the upper surface of the sample 90. The tips of the pressing portions 15a and 15b are curved surfaces having a curvature radius of 1 mm, for example. Moreover, the space | interval between the press parts 15a and 15b is set to 40 mm.

  Furthermore, the adhesion evaluation apparatus 10 of the present embodiment includes an optical displacement meter 17 fixed to the pedestal 12 and a mirror 16 connected to the head member 14c. The optical displacement meter 17 irradiates the mirror 16 with laser light, and detects the amount of displacement of the head member 14 (pressing jig 15) by the laser light reflected by the mirror 16. The detection result is also input to the control device 19.

  Hereinafter, an adhesion evaluation method using the above-described adhesion evaluation apparatus 10 will be described with reference to a flowchart shown in FIG.

  First, in step S11, a sample 90 having a notch 90n formed at the center is prepared, and the sample 90 is set on the sample support jig 13 with the notch 90n on the lower side. In this case, the notch 90 n is positioned at the center between the support portions 13 a and 13 b of the sample support jig 13 and the center between the press portions 15 a and 15 b of the press jig 15. Thereafter, in response to an instruction from the operator, the control device 19 starts an adhesion evaluation test (four-point bending test), drives the motor 14 and moves the pressing jig 15 downward at a constant speed (for example, 0.1 μm / second). Let

  It should be noted that during the period from the start of the process in step S11 to the end of the process in step S18, the control device 19 provides the measured value of the load applied to the sample 90 from the load cell 18 and the optical displacement meter 17 and the displacement of the pressing jig 13. Information is input from time to time. The control device 19 records such information in a memory (not shown) in time series.

  Next, in step S <b> 12, the control device 19 monitors the load applied to the sample 90 based on the output of the load cell 18 and waits until the load rapidly decreases. And when it determines with the load added to the sample 90 having decreased rapidly (when it is YES), it transfers to step S13. A sudden decrease in load indicates that a crack occurred in the sample 90.

In step S13, the control device 19, the load (maximum load) immediately before the load is rapidly reduced to the N _1, a load immediately after decreasing the N _2. Thereafter, the process proceeds to step S14, and it is determined whether or not the load N applied to the sample 90 satisfies the following expression (1).

N ₂ −R (N ₁ −N ₂ ) ≦ N (1)
Here, R is a constant set empirically in the range of 0 <R <1. The value of R determines the width of load variation in the plateau region. From the viewpoint of reducing the variation in load, it is preferable to reduce the value of R. However, since the load N ₂ immediately after the occurrence of the crack is not always equal to the load in the plateau region, if R is too small, the adhesion cannot be evaluated correctly. In the present embodiment, the value of R is 0.1.

  When it is determined NO (NO) in step S14, the process proceeds to step S15, and the control device 19 increases the rotation speed of the motor 14. That is, the lowering speed of the pressing jig 15 is increased. Thereafter, the process proceeds to step S18. On the other hand, when it is determined in step S14 that the expression (1) is satisfied (YES), the process proceeds to step S16. Then, it is determined whether or not the load N applied to the sample 90 satisfies the following expression (2).

N ≦ N ₂ + R (N ₁ −N ₂ ) (2)
When it is determined NO (NO) in step S16, the process proceeds to step S17. Then, the control device 19 decreases the rotational speed of the motor 14. That is, the descending speed of the pressing jig 15 is decreased. Thereafter, the process proceeds to step S18.

  On the other hand, when it is determined in step S16 that the above expression (2) is satisfied (YES), the control device 19 directly proceeds to step S18 without changing the rotational speed of the motor 14.

  In step S18, it is determined whether or not to end the measurement. Here, the position at which the load is suddenly reduced is used as a reference, and the measurement is terminated when the amount of displacement from the reference exceeds 100 μm. If the measurement end condition is not satisfied (in the case of NO), the process returns to step S14 and the process is continued.

  On the other hand, when it is determined in step S18 that the measurement end condition is satisfied (in the case of YES), the adhesion of the film of the sample 90 is evaluated by the load of the plateau region.

As described above, when the adhesion evaluation apparatus 10 of the present embodiment detects a rapid decrease in the load applied to the sample 90, the load N applied to the sample 90 is within a certain range (N ₂ -R (N ₁ -N ₂ ) ≦ N ≦ N ₂ + R (N ₁ + N ₂ )), the descent speed of the pressing jig 15 is controlled.

  For this reason, even if the adhesion strength of the film to be evaluated is high and the film is peeled off slowly, a plateau region can appear in the displacement-load characteristic, and the adhesion strength of the film is accurately evaluated. be able to.

(Modification)
In the above-described embodiment, when the center position of the pressing jig 15 is shifted from the center position of the sample support jig 13 or the center position of the sample 90, the force applied to the sample 90 is biased as shown in FIG. This makes it impossible to accurately evaluate the adhesion.

  Therefore, in the modification, as shown in FIG. 5B, the pressing jig 15 is attached to the head member 14 so as to be rotatable about the shaft 14d.

  In the pressing jig 15 of this modification, even if the center of the pressing jig 15 is slightly shifted from the center of the sample support jig 13 or the center of the sample 90 as shown in FIG. 5B, the pressing jig 15 rotates. Thus, the pressing portions 15a and 15b can be pressed against the sample 90 evenly. Thereby, the adhesiveness of the film can be accurately evaluated.

Example 1
FIG. 6 is a perspective view showing a sample used in the adhesion evaluation method according to Example 1 of the present embodiment.

  In recent semiconductor devices such as LSI, copper (Cu) wiring formed by a damascene method has been widely used with miniaturization and high performance. Since various stresses are applied to the copper wiring in the manufacturing process, peeling may occur between the copper wiring and the upper and lower layers. Therefore, it is important to evaluate the adhesion between the copper wiring and the upper and lower layers.

  As shown in FIG. 6, a silicon (Si) substrate 21 having a thickness of 725 μm was prepared, and a thermal oxide film (silicon oxide film 22) having a thickness of 100 nm was formed on the surface of the silicon substrate 21. Then, a 20-nm-thick tantalum (Ta) film 23 and a 20-nm-thick copper (Cu) seed film were sequentially formed on the silicon oxide film 22 by sputtering. Thereafter, a copper plating film having a thickness of about 1 μm was formed on the copper seed film by electrolytic plating to form a copper film 24 composed of the copper seed film and the copper plating film.

  Next, the copper film 24 was polished by a chemical mechanical polishing (CMP) method to a thickness of about 300 nm. Then, after reducing the surface of the copper film 24, a silicon carbide (SiC) film 25 having a thickness of 70 nm was formed on the copper film 24 by a CVD method.

  Next, the silicon substrate 21 was cut into a square shape (W1 = L1 = 70 mm) having a side of 7 cm. In addition, a silicon substrate having a thickness of 725 μm was prepared, and the substrate was cut into the same shape as the silicon substrate 21 to form a dummy substrate 27. The dummy substrate 27 was bonded onto the silicon substrate 21 (silicon carbide film 25) using an epoxy resin 26.

  Thereafter, a notch 27n was formed in the center of the dummy substrate 27 by a dicing saw. The notch 27n extends in the W1 direction and has a width of 20 μm and a depth of 720 μm.

  The sample 20 of Example 1 formed in this way was placed on the sample support jig 13 of the adhesion evaluation apparatus 10 shown in FIG. 3 with the dummy substrate 27 side down. The distance D1 (see FIG. 6) between the support portions 13a and 13b of the sample support jig 13 was 60 mm, and the distance D2 between the press portions 15a and 15b of the press jig 15 was 40 mm. Moreover, in Example 1, the pressing jig 15 shown in FIG.5 (b) was used.

  Then, the adhesive evaluation test was implemented in the procedure shown in the flowchart of FIG. 4, and the adhesiveness of the copper film 24 was evaluated. The descending speed of the pressing jig 15 until the load suddenly decreased was 0.1 μm / second.

  FIG. 7 is a diagram showing the results of the adhesion evaluation test of Example 1. FIG. As shown in FIG. 7, after the load increased in proportion to the displacement of the pressing jig 15, the load suddenly decreased with the occurrence of a crack, and then a plateau region appeared. The load in the plateau region was about 6N.

  As a result of observing the sample 20 after the adhesion evaluation test, the interface between the tantalum film 23 and the silicon oxide film 22 is peeled off, and the adhesion between the copper film 24, the tantalum film 23, and the silicon carbide film 25 is extremely good. It was confirmed that.

(Comparative Example 1)
In Comparative Example 1, an adhesion evaluation test was performed in the same manner as in Example 1 except that the descending speed of the pressing jig 15 before and after the occurrence of the crack was constant.

  FIG. 8 is a diagram showing the results of the adhesion evaluation test of Comparative Example 1. As shown in FIG. 8, in Comparative Example 1, the plateau region does not appear after the occurrence of a crack, and the load continues to increase as the displacement amount of the pressing jig 15 increases. As described above, when the lowering speed of the pressing jig 15 is constant, the plateau region does not appear because the peeling speed between the tantalum film 23 and the silicon oxide film 22 of the sample 20 is lower than the lowering speed of the pressing jig 15. This is considered to be because it cannot follow.

  Further, it can be seen from FIG. 8 that the load N2 immediately after the occurrence of the crack in Comparative Example 1 is higher than the load in the plateau region of Example 1.

(Example 2)
FIG. 9 is a perspective view showing a sample used for adhesion evaluation in Example 2 of the present embodiment.

  In Example 2, the adhesion between the bonding agent and the semiconductor chip was evaluated. Such adhesion evaluation is useful, for example, for reliability evaluation of a chip stacking type semiconductor device in which a plurality of semiconductor chips are stacked using a bonding agent.

  As shown in FIG. 9, in Example 2, a silicon substrate having a thickness of 725 μm is prepared, and the silicon substrate is cut into a square shape (W2 = L2 = 70 mm) with a side of 7 cm, and the substrate 31 and the substrate 33 are formed. Formed. Then, a BCB (benzocyclobutene) resin 32 having a thickness of 2 μm was applied to one surface of the substrate 31, and the substrate 31 and the substrate 33 were joined by the BCB resin 32.

Then, the notch 33n was formed in the center of the board | substrate 33 with the dicing saw. Notch 33n extends in the W 2 directions, a width of 20 [mu] m, depth 720 .mu.m.

  The sample 30 of Example 2 formed in this way was placed on the sample support jig 13 of the adhesion strength test apparatus 10 shown in FIG. In Example 2, the distance D1 between the support portions 13a and 13b of the sample support jig 13 was 60 mm, and the distance D2 between the press portions 15a and 15b of the press jig 15 was 40 mm.

  Then, the adhesive evaluation test was implemented in the procedure shown in the flowchart of FIG. 4, and the adhesiveness between the bonding agent and the semiconductor chip was evaluated. The conditions for the adhesion evaluation test are the same as in Example 1.

  FIG. 10 is a diagram showing the results of the adhesion evaluation test of Example 2. FIG. As shown in FIG. 10, even in Example 2, it was confirmed that a plateau region appeared after the occurrence of a crack. In Example 2, the load in the plateau region was about 9N.

(Comparative Example 2)
FIG. 11 is a diagram showing the results of adhesion evaluation of Comparative Example 2.

  In Comparative Example 2, an adhesion evaluation test was performed in the same manner as in Example 2 except that the descending speed of the pressing jig 15 before and after the occurrence of the crack was constant.

  FIG. 11 is a diagram showing the results of the adhesion evaluation test of Comparative Example 2. As shown in FIG. 11, in Comparative Example 2, the plateau region did not appear after the occurrence of the crack, and the load continued to increase with the increase of the displacement amount of the pressing jig 15, so that the adhesion evaluation could not be performed. .

  The following additional notes are disclosed with respect to the above embodiments.

(Supplementary Note 1) A sample support jig that is arranged below the sample and supports the sample by a pair of support parts spaced apart from each other;
A pressing jig arranged on the upper side of the sample and capable of pressing the sample by a pair of pressing parts spaced apart from each other;
A driving mechanism for moving at least one of the sample support jig and the pressing jig and pressing the sample by the pressing unit;
A displacement detector for detecting a displacement amount of the pressing jig relative to the sample support jig;
A load detector for detecting a load applied to the sample;
A control device that controls the drive mechanism by receiving a displacement detection value and a load detection value from the displacement detection unit and the load detection unit;
The control device controls the drive mechanism so that the load applied to the sample falls within a certain range after detecting a sudden decrease in the load applied to the sample based on a detection value of the load detection unit. Sex evaluation device.

  (Supplementary note 2) When the control device has N1 as the load immediately before the load applied to the sample suddenly decreases, N2 as the load immediately after the load applied to the sample decreases, and R is a constant satisfying 0 <R <1 In addition, after detecting a sudden decrease in the load applied to the sample, the drive mechanism is controlled so that the load N applied to the sample satisfies N2−R (N1−N2) ≦ N ≦ N2 + R (N1−N2). The adhesion evaluation apparatus according to appendix 1, characterized by:

  (Supplementary note 3) The supplementary note 1 or 2, wherein the pressing jig is rotatable about an axis perpendicular to a line segment connecting the pair of pressing parts and a displacement direction of the pressing jig. Adhesion evaluation apparatus as described in 2.

  (Additional remark 4) The said coefficient R is set to 0.1 or less, The adhesive evaluation apparatus of Additional remark 2 characterized by the above-mentioned.

  (Additional remark 5) The said control apparatus controls the said drive mechanism so that the said press jig may approach the said sample support jig at a fixed speed until the load added to the said sample sharply decreases to Additional remark 1 characterized by the above-mentioned. The adhesion evaluation apparatus described.

  (Additional remark 6) The said control apparatus complete | finishes a measurement, when the displacement amount of the said pressing jig after the load added to the said sample reduces rapidly reaches | attains a fixed value, Adhesiveness evaluation of Additional remark 1 characterized by the above-mentioned. apparatus.

(Supplementary Note 7) A step of supporting a sample support jig having a pair of support parts spaced apart from each other on the lower side of the sample and disposing the pressure jig having a pair of press parts spaced apart from each other on the upper side of the sample;
Bringing the pressing jig closer to the sample support jig at a constant speed and applying a load to the sample by the pressing unit;
Monitoring the load applied to the sample, and changing the moving speed of the pressing jig relative to the sample support jig so that the load applied to the sample falls within a certain range when a sudden decrease in the load applied to the sample is detected. Adhesion evaluation method characterized by this.

  (Supplementary Note 8) N1 is a load immediately before the load applied to the sample suddenly decreases, N2 is a load immediately after the load applied to the sample is sharply reduced, and R is a constant satisfying 0 <R <1. After detecting a sudden decrease in applied load, the moving speed of the pressing jig relative to the sample support jig is such that the load N applied to the sample satisfies N2-R (N1-N2) ≦ N ≦ N2 + R (N1-N2). The adhesiveness evaluation method according to appendix 7, wherein the adhesiveness is changed.

DESCRIPTION OF SYMBOLS 1a, 1b ... Crack, 1n, 27n, 33n, 90n ... Notch, 20, 30, 90 ... Sample, 10 ... Adhesion evaluation apparatus, 11 ... Frame, 11a ... Rail, 12 ... Support stand, 13 ... Lower jig, 13a, 13b ... fulcrum, 14 ... actuator (drive mechanism), 14a ... motor, 14b ... screw rod, 14c ... head member, 14d ... shaft, 15 ... upper jig, 15a, 15b ... indenter, 16 ... mirror, 17 ... optical Displacement meter, 18 ... load cell, 19 ... control device, 21 ... silicon substrate, 22 ... silicon oxide film (thermal oxide film), 23 ... barrier metal film, 24 ... copper film, 25 ... silicon carbide film, 26 ... epoxy resin Layer 27: Dummy substrate 31, 33 ... Substrate, 32 ... BCB resin.

Claims (5)

A sample support jig disposed on the lower side of the sample and supporting the sample by a pair of support parts spaced apart from each other;
A pressing jig arranged on the upper side of the sample and capable of pressing the sample by a pair of pressing parts spaced apart from each other;
A driving mechanism for moving at least one of the sample support jig and the pressing jig and pressing the sample by the pressing unit;
A displacement detector for detecting a displacement amount of the pressing jig relative to the sample support jig;
A load detector for detecting a load applied to the sample;
A control device that controls the drive mechanism by receiving a displacement detection value and a load detection value from the displacement detection unit and the load detection unit;
The control device controls the drive mechanism so that the load applied to the sample falls within a certain range after detecting a sudden decrease in the load applied to the sample based on a detection value of the load detection unit. Sex evaluation device.   The control device is configured such that the load immediately before the load applied to the sample suddenly decreases is N1, the load immediately after the load applied to the sample is rapidly decreased is N2, and R is a constant satisfying 0 <R <1. After detecting a sudden decrease in the load applied to the sample, the drive mechanism is controlled so that the load N applied to the sample satisfies N2−R (N1−N2) ≦ N ≦ N2 + R (N1−N2). The adhesion evaluation apparatus according to claim 1.   3. The press jig according to claim 1, wherein the press jig is rotatable about an axis perpendicular to a line segment connecting the pair of press portions and a displacement direction of the press jig. 4. Adhesion evaluation device. A step of supporting a sample support jig having a pair of support portions spaced apart from each other on the lower side of the sample, and disposing a press jig having a pair of press portions spaced apart from each other on the upper side of the sample;
Bringing the pressing jig closer to the sample support jig at a constant speed and applying a load to the sample by the pressing unit;
Monitoring a load applied to the sample, and detecting a sudden decrease in the load applied to the sample, and changing a moving speed of the pressing jig relative to the sample support jig so that the load applied to the sample is within a certain range. Adhesion evaluation method characterized by this. When the load immediately before the load applied to the sample suddenly decreases is N1, the load immediately after the load applied to the sample is immediately decreased is N2, and R is a constant satisfying 0 <R <1, the sudden decrease in the load applied to the sample Is detected, the moving speed of the pressing jig relative to the sample support jig is changed so that the load N applied to the sample satisfies N2-R (N1-N2) ≦ N ≦ N2 + R (N1-N2). The adhesion evaluation method according to claim 4 , wherein:

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