JP5461089B2 - Copper foil composite - Google Patents
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- JP5461089B2 JP5461089B2 JP2009164337A JP2009164337A JP5461089B2 JP 5461089 B2 JP5461089 B2 JP 5461089B2 JP 2009164337 A JP2009164337 A JP 2009164337A JP 2009164337 A JP2009164337 A JP 2009164337A JP 5461089 B2 JP5461089 B2 JP 5461089B2
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Description
本発明は、銅箔又は銅合金箔の片面に樹脂層を設けた銅箔複合体に関し、例えば物品の表面に貼付して抗菌性を付与できる銅箔複合体に関する。 The present invention relates to a copper foil composite in which a resin layer is provided on one side of a copper foil or a copper alloy foil, for example, a copper foil composite that can be applied to the surface of an article to impart antibacterial properties.
銅または銅合金中の銅イオンが抗菌作用を有することはよく知られている。2008年3月には米国環境保護庁(EPA)が銅及び銅合金がメチシリン耐性黄色ブドウ球菌(MRSA)等の病原体を殺菌することを証明し、「殺菌力のある銅および銅合金の表面は、実験対象となった病原体の99.9%以上を2時間以内に殺菌する。さらに同じ表面を、繰り返しこの病原体で汚染し続けても、その99%を殺菌し続ける」、「銅及び銅合金の表面は、通常の感染コントロールに必要な措置、たとえば環境表面の清掃や消毒をしなくて済むというものではないが、その措置を補完するものとして考えられる。銅及び銅合金の表面は、それだけで相互汚染を完全に防ぎきるものではないが、病原体汚染のリスクを低くすることが証明された」と報告している。 It is well known that copper ions in copper or copper alloys have an antibacterial action. In March 2008, the US Environmental Protection Agency (EPA) proved that copper and copper alloys could sterilize pathogens such as methicillin-resistant Staphylococcus aureus (MRSA). Sterilize more than 99.9% of the pathogens tested within 2 hours, and even if the same surface is repeatedly contaminated with this pathogen, it will continue to sterilize 99% "," copper and copper alloys This surface is not meant to eliminate the need for routine infection control measures such as cleaning and disinfection of environmental surfaces, but is considered to complement that measure. Although it has not completely prevented cross-contamination, it has been proven to reduce the risk of pathogen contamination. "
このことから、ドアノブ、手すりや壁等の不特定多数の人が触れる部分を銅または銅合金で形成することが抗菌性の観点から望ましいことが明らかである。しかしながら、現実には、銅製のドアノブ等は広く普及していない。これは、銅および銅合金は、ドアノブ、手すり、壁等に通常用いられているステンレスや壁紙といった材料に比較して高価であることや、銅が変色したり、耐久性が低いことが原因と考えられる。
そこで、薄い銅箔、又は銅箔を樹脂や紙等と張り合わせた複合材料を、ドアノブ、手すり、壁等に貼り付ける方法が考えられている。さらに、銅箔をシワ加工して、意匠性と加工性を向上する試みがなされている。(特許文献1参照)
From this, it is apparent that it is desirable from the viewpoint of antibacterial properties to form a portion touched by an unspecified number of people such as a door knob, a handrail or a wall from copper or a copper alloy. However, in reality, copper door knobs are not widely used. This is because copper and copper alloys are expensive compared to materials such as stainless steel and wallpaper that are usually used for door knobs, handrails, walls, etc., copper is discolored, and durability is low. Conceivable.
In view of this, a method has been considered in which a thin copper foil or a composite material obtained by bonding a copper foil to resin, paper, or the like is attached to a door knob, a handrail, a wall, or the like. Furthermore, an attempt has been made to improve design and workability by wrinkling a copper foil. (See Patent Document 1)
しかしながら、上記した銅箔を貼り付ける方法の場合、銅箔が薄い金属であるため切断面が露出し、肌を切るおそれがある。そのため、切断面を折り曲げたり、切断面を樹脂等の別の素材でカバーしたりする必要があった。
また、上記した特許文献1記載の技術の場合、加工性や意匠性を向上させるために、銅箔をシワ加工や皮シボ加工しているが、シワを維持するためには、銅箔を厚くして強度を確保する必要がある。そのため、この技術の場合、銅箔の厚さを10μm以上20μm以下としているが、切断面の切傷性が高くなるので、切断面を露出したままの使用には不適である。
However, in the case of the above-described method of attaching the copper foil, the cut surface is exposed because the copper foil is a thin metal, and the skin may be cut. Therefore, it is necessary to bend the cut surface or cover the cut surface with another material such as a resin.
Further, in the case of the technique described in Patent Document 1, the copper foil is wrinkled or wrinkled in order to improve workability and designability, but in order to maintain wrinkles, the copper foil is thickened. Therefore, it is necessary to ensure strength. Therefore, in the case of this technique, the thickness of the copper foil is set to 10 μm or more and 20 μm or less. However, since the cut property of the cut surface becomes high, it is unsuitable for use with the cut surface exposed.
さらに、シワ加工や皮シボ加工をするためには圧延加工等が必要となり、コスト高を招く。また、シワ加工や皮シボ加工を行うと、ある程度の柔軟性は得られるものの、強度や伸びはもとの銅箔のままであり、銅箔を薄くすればするほど切れやすいという欠点を有している。このため、銅箔の裏面に補強材としてポリエチレンフィルムや紙を貼付するが、強度を補完することは容易であるものの、銅箔とフィルム等との複合体の伸びを高めることは困難である。
ここで、銅箔の伸びを向上させるには焼鈍することが一般的である。しかし、箔の場合、厚さの効果に起因して板材に比較して伸びが低くなる。例えば、通常の圧延銅箔の場合、厚みが10μm未満になると伸びが10%を超えることは少なく、伸びは5%前後の値となるが、5%程度の伸びでは加工時の応力で容易に破断してしまい、実用的とは言えなかった。
Furthermore, in order to perform wrinkle processing and skin wrinkle processing, a rolling process or the like is required, resulting in an increase in cost. In addition, when wrinkle processing and skin wrinkle processing are performed, although a certain degree of flexibility is obtained, the strength and elongation remain the same as the original copper foil, and there is a disadvantage that the thinner the copper foil, the easier it is to cut ing. For this reason, a polyethylene film or paper is attached to the back surface of the copper foil as a reinforcing material. However, although it is easy to supplement the strength, it is difficult to increase the elongation of the composite of the copper foil and the film.
Here, annealing is generally performed in order to improve the elongation of the copper foil. However, in the case of foil, the elongation is lower than that of the plate material due to the effect of the thickness. For example, in the case of a normal rolled copper foil, the elongation is less than 10% when the thickness is less than 10 μm, and the elongation is a value of around 5%. It broke and was not practical.
従って、本発明の目的は、切断面の切傷性を低下させるとともに加工性を向上させた銅箔複合体を提供することにある。 Accordingly, an object of the present invention is to provide a copper foil composite that has improved cutability while reducing the cutability of the cut surface.
本発明者らは、銅箔又は銅合金箔と樹脂層との複合体を構成することで、銅箔又は銅合金箔の厚みを薄くすることができ、さらに銅箔又は銅合金箔の剛性を低下することで切断面の切傷性を低下させることを見出した。さらに、銅箔又は銅合金箔の厚みと強度、及び樹脂の強度とのバランスをとることで、銅箔複合体としての加工性、特に伸びを高くすることに成功した。
すなわち、本発明の銅箔複合体は、銅箔又は銅合金箔と、該銅箔又は銅合金箔の片面に設けられた樹脂層とを有し、前記銅箔又は銅合金箔の厚さが2μm以上10μm未満で、かつ引張強度が250MPa以下であり、前記樹脂層がポリエチレンテレフタレートからなるか、又はポリエチレンテレフタレートフィルムと、該フィルムと前記銅箔又は銅合金箔とを接着する接着性樹脂層とからなり、前記樹脂層の厚さが10μm以上で、かつ引張強度が200MPa以上である。
The present inventors can reduce the thickness of the copper foil or copper alloy foil by configuring a composite of the copper foil or copper alloy foil and the resin layer, and further reduce the rigidity of the copper foil or copper alloy foil. It has been found that the cutting ability of the cut surface is lowered by lowering. Furthermore, by balancing the thickness and strength of the copper foil or copper alloy foil and the strength of the resin, the present invention succeeded in increasing the workability, particularly the elongation, as a copper foil composite.
That is, the copper foil composite of the present invention has a copper foil or copper alloy foil and a resin layer provided on one side of the copper foil or copper alloy foil, and the thickness of the copper foil or copper alloy foil is 2 μm or more and less than 10 μm and a tensile strength of 250 MPa or less, and the resin layer is made of polyethylene terephthalate, or a polyethylene terephthalate film, and an adhesive resin layer for bonding the film and the copper foil or copper alloy foil The resin layer has a thickness of 10 μm or more and a tensile strength of 200 MPa or more.
前記銅箔複合体の引張強度が200MPa以下で、かつ破断歪が20%以上であることが好ましい。
本発明の銅箔複合体は抗菌用途に使用されることが好ましい。
The copper foil composite preferably has a tensile strength of 200 MPa or less and a breaking strain of 20% or more .
The copper foil composite of the present invention is preferably used for antibacterial applications.
本発明によれば、切断面の切傷性を低下させるとともに加工性を向上させた銅箔複合体を得ることができる。 ADVANTAGE OF THE INVENTION According to this invention, the copper foil composite which improved the workability while reducing the cut property of a cut surface can be obtained.
本発明の銅箔複合体は、銅箔又は銅合金箔の片面に樹脂層を設けてなる。銅箔又は銅合金箔の他の面を露出させると、銅イオンの作用により抗菌作用を付与することができるが、抗菌用途に用いない場合は銅箔又は銅合金箔の他の面を被覆してもよい。 The copper foil composite of the present invention is formed by providing a resin layer on one side of a copper foil or a copper alloy foil. When the other surface of the copper foil or copper alloy foil is exposed, an antibacterial effect can be imparted by the action of copper ions, but when not used for antibacterial applications, the other surface of the copper foil or copper alloy foil is coated. May be.
<銅箔又は銅合金箔>
銅箔又は銅合金箔の厚さが2μm以上10μm未満で、かつ引張強度が250MPa以下である。
銅箔又は銅合金箔の厚さが10μmを超えると、銅箔又は銅合金箔の断面の強度が高くなり過ぎ、切断面の切傷性が高くなる。
一方、銅箔又は銅合金箔の厚さを2μm未満とすることは製造上困難であると共に、銅箔又は銅合金箔の強度が低下して複合材を作成する等の途中の工程で破断しやすくなる。
又、銅箔又は銅合金箔の引張強度が250MPaを超えると、銅箔又は銅合金箔を薄くしたとしても銅箔複合体の引張強度が高くなり、銅箔複合体の加工性が低下する。望ましくは、銅箔又は銅合金箔の引張強度を200MPa以下とする。銅箔又は銅合金箔の引張強度の下限は特に制限されないが、通常は140MPa程度となる。
<Copper foil or copper alloy foil>
The thickness of the copper foil or copper alloy foil is 2 μm or more and less than 10 μm, and the tensile strength is 250 MPa or less.
If the thickness of the copper foil or copper alloy foil exceeds 10 μm, the strength of the cross section of the copper foil or copper alloy foil becomes too high, and the cut property of the cut surface becomes high.
On the other hand, it is difficult to make the thickness of the copper foil or copper alloy foil less than 2 μm, and it breaks in the middle of the process such as making the composite material by reducing the strength of the copper foil or copper alloy foil. It becomes easy.
Moreover, when the tensile strength of copper foil or copper alloy foil exceeds 250 MPa, even if the copper foil or copper alloy foil is thinned, the tensile strength of the copper foil composite increases and the workability of the copper foil composite decreases. Desirably, the tensile strength of copper foil or copper alloy foil shall be 200 Mpa or less. The lower limit of the tensile strength of the copper foil or copper alloy foil is not particularly limited, but is usually about 140 MPa.
銅箔の組成としては、純度99.9%以上のタフピッチ銅、無酸素銅が挙げられる。又、銅合金箔の組成としては、要求される強度や導電性に応じて公知の銅合金を用いることができる。公知の銅合金としては、例えば、0.01〜0.3%の錫入り銅合金や0.01〜0.05%の銀入り銅合金が挙げられ、特に導電性に優れたものとしてCu-0.12%Sn、Cu-0.02%Agがよく用いられる。
銅箔又は銅合金箔としては、圧延箔や電解箔を用いることができる。ただし、引張強度を250MPa以下とするため、圧延箔の場合は焼鈍を施した箔であることが望ましい。また、電解箔は引張強度が高く、圧延箔に比べると本発明に用いるには適さないが、引張強度が250MPa以下であれば電解箔であっても問題なく使用できる。ただし、電解箔の場合、引張強度が高くても銅箔自体の伸びが20%を超える場合があり、その場合は銅箔複合体の加工性を向上させるので好ましい。一方、銅箔の切断面の切傷性に関しては、引張強度の低い銅箔に比較して電解箔の方が劣る傾向にある。
Examples of the composition of the copper foil include tough pitch copper and oxygen-free copper having a purity of 99.9% or more. Moreover, as a composition of copper alloy foil, a well-known copper alloy can be used according to the intensity | strength and electroconductivity requested | required. Known copper alloys include, for example, 0.01-0.3% tin-containing copper alloys and 0.01-0.05% silver-containing copper alloys. Cu- 0.12% Sn and Cu-0.02% Ag are often used.
As the copper foil or copper alloy foil, rolled foil or electrolytic foil can be used. However, in order to set the tensile strength to 250 MPa or less, it is desirable that the rolled foil is an annealed foil. Further, the electrolytic foil has a high tensile strength and is not suitable for use in the present invention as compared with the rolled foil, but if the tensile strength is 250 MPa or less, the electrolytic foil can be used without any problem. However, in the case of an electrolytic foil, even if the tensile strength is high, the elongation of the copper foil itself may exceed 20%, which is preferable because the workability of the copper foil composite is improved. On the other hand, regarding the cut property of the cut surface of the copper foil, the electrolytic foil tends to be inferior to the copper foil having a low tensile strength.
銅箔又は銅合金箔と複合される樹脂層の厚さが10μm以上で、かつ引張強度が200MPa以上である。
樹脂層の厚さが10μm未満であると、銅箔複合体の強度及び伸びが銅箔又は銅合金箔の強度及び伸びに依存するようになり、銅箔複合体としての伸びが低下する。樹脂層の厚みの上限は特に制限されないが、例えば市販の樹脂フィルムを用いる場合、樹脂層の厚みの上限を50μm程度とすることができる。
また、樹脂層の引張強度が200MPa未満であると、やはり銅箔複合体の強度及び伸びが銅箔又は銅合金箔の強度及び伸びに依存するようになり、銅箔複合体としての伸びが低下する。
The resin layer combined with the copper foil or the copper alloy foil has a thickness of 10 μm or more and a tensile strength of 200 MPa or more.
If the thickness of the resin layer is less than 10 μm, the strength and elongation of the copper foil composite will depend on the strength and elongation of the copper foil or copper alloy foil, and the elongation of the copper foil composite will be reduced. Although the upper limit of the thickness of a resin layer is not specifically limited, For example, when using a commercially available resin film, the upper limit of the thickness of a resin layer can be about 50 micrometers.
Moreover, if the tensile strength of the resin layer is less than 200 MPa, the strength and elongation of the copper foil composite also depend on the strength and elongation of the copper foil or copper alloy foil, and the elongation as the copper foil composite is reduced. To do.
樹脂層は、樹脂フィルム等の単一組成から成っていてもよい。又、樹脂フィルムを接着剤を介して銅箔又は銅合金箔に積層した場合、樹脂フィルムと、接着剤を構成する接着性樹脂層とを、本発明の「樹脂層」とする。
樹脂層としては、ポリエチレンテレフタレート(PET)、ポリエチレンナフタレート(PEN)、ポリイミド(PI)、ナイロン(登録商標)、ポリビニルアルコール等を用いることができるが、厚さ、強度、価格の観点からPETが最も適している。
接着性樹脂層としては、ポリウレタン樹脂、エポキシ樹脂とエラストマーの組み合わせ、又はアクリル樹脂等を用いることができる。接着性樹脂層の厚みは例えば10μm以下程度とすることができる。従って、厚み10〜50μm程度市販の樹脂フィルムを接着性樹脂層で銅箔又は銅合金箔に積層した場合、本発明の「樹脂層」としての厚みは、樹脂フィルムの厚みと接着性樹脂層の厚みの合計となる。接着性樹脂層は、一般的にPET、PEN等と比較すると機械的強度が低い。このため、接着性樹脂層を含む樹脂層の強度は、PET、PEN等(例えば樹脂フィルム)の強度を、樹脂フィルムの厚みと接着性樹脂層の厚みの合計で除した値にほぼ等しい
The resin layer may consist of a single composition such as a resin film. Moreover, when laminating | stacking a resin film on copper foil or copper alloy foil through an adhesive agent, let the resin film and the adhesive resin layer which comprises an adhesive agent be the "resin layer" of this invention.
As the resin layer, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), nylon (registered trademark), polyvinyl alcohol, etc. can be used, but PET is used from the viewpoint of thickness, strength, and price. Most suitable.
As the adhesive resin layer, a polyurethane resin, a combination of an epoxy resin and an elastomer, an acrylic resin, or the like can be used. The thickness of the adhesive resin layer can be, for example, about 10 μm or less. Therefore, when a commercially available resin film having a thickness of about 10 to 50 μm is laminated on a copper foil or a copper alloy foil with an adhesive resin layer, the thickness as the “resin layer” of the present invention is the thickness of the resin film and the adhesive resin layer. Total thickness. The adhesive resin layer generally has a lower mechanical strength than PET, PEN and the like. For this reason, the strength of the resin layer including the adhesive resin layer is approximately equal to the value obtained by dividing the strength of PET, PEN or the like (for example, a resin film) by the sum of the thickness of the resin film and the thickness of the adhesive resin layer.
なお、本発明の銅箔複合体を対象物品に貼付し易いよう、樹脂層の裏面(樹脂層のうち銅箔側と反対の面)に裏面接着層を設けることが可能である。ただし、その場合、樹脂層の厚さ、引張強度は裏面接着層を除いた樹脂層の値で定義し、銅箔複合体の引張強度及び破断歪は裏面接着層を除いた状態で定義する。 In addition, it is possible to provide a back surface adhesive layer on the back surface of the resin layer (the surface opposite to the copper foil side of the resin layer) so that the copper foil composite of the present invention can be easily attached to the target article. However, in that case, the thickness and tensile strength of the resin layer are defined by values of the resin layer excluding the back surface adhesive layer, and the tensile strength and breaking strain of the copper foil composite are defined in a state excluding the back surface adhesive layer.
なお、一般的なPETフィルムは、250MPa以上の引張強度と、100%以上の伸びを持つ。又、PETフィルムに高延伸加工を施して引張強度を280MPa以上にする場合もあるが、その場合には伸びが70%程度まで低下することが多い。
ただし、銅箔又は銅合金箔とPETフィルムとを複合して銅箔複合体を得た場合には、銅箔複合体の伸びは100%を大きく下回り、20〜40%となる。このため、PETフィルムの最大の引張強度は発揮できず、銅箔複合体の引張強度もPETフィルムの引張強度より低くなり、加工性が向上する。
A general PET film has a tensile strength of 250 MPa or more and an elongation of 100% or more. Further, there are cases where the PET film is subjected to a high stretching process to increase the tensile strength to 280 MPa or more, but in that case, the elongation often decreases to about 70%.
However, when a copper foil or copper alloy foil and a PET film are combined to obtain a copper foil composite, the elongation of the copper foil composite is significantly less than 100% and is 20 to 40%. For this reason, the maximum tensile strength of the PET film cannot be exhibited, the tensile strength of the copper foil composite is also lower than the tensile strength of the PET film, and the workability is improved.
なお、銅箔複合体を製造する前の銅箔と樹脂層の引張強度等の値が既知の場合であって、銅箔複合体を製造する際に銅箔及び樹脂層の特性が大きく変化するような熱処理を行わない場合は、銅箔複合体を製造する前の上記既知の値を採用してもよい。
又、銅箔複合体から樹脂層を溶剤等で除去して残った銅箔の引張強度を測定してもよい。同様に、銅箔複合体から銅箔を酸等で除去して残った樹脂層の引張強度を測定してもよい。銅箔と樹脂層とが接着剤を介して積層されている場合は、接着剤層を溶剤等で除去すると、銅箔と樹脂層とが剥離し、銅箔と樹脂層との引張強度を別個に測定することができる。
In addition, it is a case where the values such as the tensile strength of the copper foil and the resin layer before manufacturing the copper foil composite are known, and the characteristics of the copper foil and the resin layer change greatly when the copper foil composite is manufactured. When not performing such heat processing, you may employ | adopt the said known value before manufacturing a copper foil composite_body | complex.
Alternatively, the tensile strength of the remaining copper foil may be measured by removing the resin layer from the copper foil composite with a solvent or the like. Similarly, the tensile strength of the resin layer remaining after removing the copper foil from the copper foil composite with an acid or the like may be measured. When the copper foil and the resin layer are laminated via an adhesive, the copper foil and the resin layer are peeled off when the adhesive layer is removed with a solvent, etc., and the tensile strength between the copper foil and the resin layer is separated. Can be measured.
銅箔複合体の引張強度が200MPa以下で、かつ破断歪が20%以上であることが好ましい。破断歪が20%以上であると、銅箔複合体が伸びやすく、加工性が更に向上する。 The copper foil composite preferably has a tensile strength of 200 MPa or less and a breaking strain of 20% or more. When the breaking strain is 20% or more, the copper foil composite is easily stretched, and the workability is further improved.
本発明の銅箔複合体を、樹脂層側を対象物品に貼付し、銅箔又は銅合金箔の露出面を表側にすることで、露出した銅箔又は銅合金箔から銅イオンが流出して抗菌作用が得られる。 The copper foil composite of the present invention is bonded to the target article on the resin layer side, and the exposed surface of the copper foil or copper alloy foil is the front side, so that copper ions flow out from the exposed copper foil or copper alloy foil. Antibacterial action is obtained.
本発明は上記実施形態に限定されず、本発明の思想と範囲に含まれる様々な変形及び均等物に及ぶことはいうまでもない。 It goes without saying that the present invention is not limited to the above-described embodiment, but extends to various modifications and equivalents included in the spirit and scope of the present invention.
<銅箔複合体の製造>
表1に示す組成の銅インゴットを熱間圧延し、表面切削で酸化物を取り除いた後、冷間圧延、焼鈍と酸洗を繰り返して所定厚みまで薄くし、最後に焼鈍を行って加工性を確保した銅箔を得た。銅箔が幅方向で均一な組織となるよう、冷間圧延時のテンション及び圧延材の幅方向の圧下条件を均一にした。次の焼鈍では幅方向で均一な温度分布となるよう複数のヒータを使用して温度管理を行い、銅の温度を測定して制御した。一部の試料については、銅合金インゴットを用い、銅合金箔を得た。銅箔及び合金箔の引張強度、伸び、及び厚みを表1に示す。
次に、表1に示す引張強度、伸び、及び厚みの市販の2軸延伸PETフィルムを、ポリウレタン系接着剤(接着後厚み2μm)で上記銅箔に貼付し、銅箔複合体を製造した。
<Manufacture of copper foil composite>
After hot-rolling a copper ingot having the composition shown in Table 1 and removing the oxide by surface cutting, cold rolling, annealing and pickling are repeated to reduce the thickness to a predetermined thickness, and finally annealing is performed to improve workability. Obtained copper foil was obtained. The tension during cold rolling and the rolling conditions in the width direction of the rolled material were made uniform so that the copper foil had a uniform structure in the width direction. In the next annealing, temperature control was performed using a plurality of heaters so as to obtain a uniform temperature distribution in the width direction, and the copper temperature was measured and controlled. For some samples, a copper alloy foil was obtained using a copper alloy ingot. Table 1 shows the tensile strength, elongation, and thickness of the copper foil and alloy foil.
Next, a commercially available biaxially stretched PET film having the tensile strength, elongation and thickness shown in Table 1 was attached to the copper foil with a polyurethane adhesive (2 μm thickness after adhesion) to produce a copper foil composite.
<引張試験>
予め、銅箔複合体を製造する前の銅箔(合金箔)、及びPETフィルムから、幅12.7mmの短冊状の引張試験片を作製し、引張強度、伸びを測定した。
同様に、得られた銅箔複合体から幅12.7mmの短冊状の引張試験片を作製した。
引張試験は、ゲージ長さ100mm、引張速度10mm/minの条件で行い、N10の平均値を引張強度及び伸びの値として採用した。なお、銅箔複合体の引張試験は、銅箔が破断した時点で停止し、そのときの引張強度と伸びを銅箔複合体の値として測定した。ここで、銅箔複合体の引張試験は、ポリウレタン層(接着性樹脂層)を含めた状態で行った。
<Tensile test>
A strip-shaped tensile test piece having a width of 12.7 mm was prepared in advance from a copper foil (alloy foil) before producing a copper foil composite and a PET film, and tensile strength and elongation were measured.
Similarly, a strip-shaped tensile test piece having a width of 12.7 mm was produced from the obtained copper foil composite.
The tensile test was performed under the conditions of a gauge length of 100 mm and a tensile speed of 10 mm / min, and the average value of N10 was adopted as the tensile strength and elongation values. The tensile test of the copper foil composite was stopped when the copper foil was broken, and the tensile strength and elongation at that time were measured as the value of the copper foil composite. Here, the tensile test of the copper foil composite was performed in a state including the polyurethane layer (adhesive resin layer).
<銅箔複合体の加工性>
銅箔複合体の伸びに応じて、以下の基準で評価した。
◎:銅箔複合体の伸びが20%以上
○:銅箔複合体の伸びが20%未満で10%以上
×:銅箔複合体の伸びが10%未満
<銅箔複合体の切傷性>
銅箔複合体をはさみで切断し、その切断面を指で触り、その部分の皮膚の状態を観察し、傷の有無を目視で判断した。以下の基準で評価した。
○:皮膚に傷が見られない
△:皮膚に微細な傷が認められる
×:皮膚が切傷する
得られた結果を表1に示す。
<Processability of copper foil composite>
The following criteria were evaluated according to the elongation of the copper foil composite.
A: Elongation of copper foil composite is 20% or more B: Elongation of copper foil composite is less than 20% and 10% or more X: Elongation of copper foil composite is less than 10% <Cutting property of copper foil composite>
The copper foil composite was cut with scissors, the cut surface was touched with a finger, the state of the skin at that portion was observed, and the presence or absence of a flaw was visually determined. Evaluation was made according to the following criteria.
○: No scars are seen on the skin Δ: Fine scars are found on the skin ×: The skin is cut The results obtained are shown in Table 1.
表1から明らかなように、各実施例の場合、銅箔複合体の加工性と切傷性が共に良好であった。但し、銅箔の引張強度が200MPaを超えた実施例4の場合、他の実施例に比べて切傷性が少し劣化したが、実用上は問題ない。 As is clear from Table 1, in each example, both the workability and the cutability of the copper foil composite were good. However, in the case of Example 4 in which the tensile strength of the copper foil exceeded 200 MPa, the cut property was slightly degraded as compared with the other examples, but there is no practical problem.
一方、銅箔の厚みが10μmを超えた比較例1、2の場合、銅箔の断面の強度が高く、切傷性が劣化した。
又、樹脂層の厚みが10μm未満である比較例3の場合、銅箔複合体の特性(伸び)が銅箔の伸びに依存するようになり、銅箔複合体の伸びが低下して加工性が劣化した。
銅が引張強度が250MPaを超えた比較例4の場合、銅箔複合体の引張強度も高くなり、銅箔複合体の伸びが低下して加工性が劣化した。又、銅箔の断面の強度が高く、切傷性も劣化した。
樹脂層が引張強度が200MPa未満である比較例5の場合、銅箔複合体の特性(伸び)が銅箔の伸びに依存するようになり、銅箔複合体の伸びが低下して加工性が劣化した。
On the other hand, in the case of Comparative Examples 1 and 2 in which the thickness of the copper foil exceeded 10 μm, the strength of the cross section of the copper foil was high and the cut property was deteriorated.
Further, in the case of Comparative Example 3 in which the thickness of the resin layer is less than 10 μm, the properties (elongation) of the copper foil composite become dependent on the elongation of the copper foil, and the elongation of the copper foil composite is lowered and the workability is increased. Deteriorated.
In the case of Comparative Example 4 where the tensile strength of copper exceeded 250 MPa, the tensile strength of the copper foil composite also increased, the elongation of the copper foil composite decreased, and the workability deteriorated. Moreover, the strength of the cross section of the copper foil was high, and the cut property was also deteriorated.
In the case of Comparative Example 5 in which the resin layer has a tensile strength of less than 200 MPa, the properties (elongation) of the copper foil composite become dependent on the elongation of the copper foil, the elongation of the copper foil composite is reduced, and the workability is reduced. Deteriorated.
Claims (3)
前記銅箔又は銅合金箔の厚さが2μm以上10μm未満で、かつ引張強度が250MPa以下であり、
前記樹脂層がポリエチレンテレフタレートからなるか、又はポリエチレンテレフタレートフィルムと、該フィルムと前記銅箔又は銅合金箔とを接着する接着性樹脂層とからなり、
前記樹脂層の厚さが10μm以上で、かつ引張強度が200MPa以上である銅箔複合体。 A copper foil composite having a copper foil or copper alloy foil and a resin layer provided on one side of the copper foil or copper alloy foil,
The thickness of the copper foil or copper alloy foil is 2 μm or more and less than 10 μm, and the tensile strength is 250 MPa or less,
The resin layer is made of polyethylene terephthalate, or a polyethylene terephthalate film, and an adhesive resin layer that bonds the film and the copper foil or copper alloy foil.
A copper foil composite in which the resin layer has a thickness of 10 μm or more and a tensile strength of 200 MPa or more.
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