JP5459594B2 - Energy conversion mechanism, boiling cooler and electronic equipment - Google Patents

Description

  The present invention relates to an energy conversion mechanism that converts thermal energy into kinetic energy, a boiling cooler, and an electronic device using the same.

  With the spread of computer networks in recent years, so-called ubiquitous computing and cloud computing that provide information and services from remote locations via servers and terminals connected to networks such as the Internet, and receive information and services. Has been expanded. Along with this, further spread of electronic devices such as servers and terminals is predicted, and the problem of increased energy consumption by these electronic devices has become apparent worldwide.

  In addition, a so-called sensor network in which a large number of electronic devices cooperate to independently establish wireless communication is known. In the sensor network, in order to immediately enable wireless communication when electronic devices enter the mutual communicable range, it is necessary to perform information processing according to the communication status such as constantly monitoring the presence of a communication partner. Along with this, there is a problem that the amount of heat generated by LSIs and electronic devices increases due to high performance and high density of large scale integrated circuits (LSIs) mounted on electronic devices.

  Conventionally, heat generated from an LSI or the like is generated by a forced air cooling method using a fan for forced exhaust (for example, see Patent Documents 1 and 2), or a water cooling method using a gas-liquid phase change by a refrigerant (for example, Patent Document 3, 4)) is radiated to the outside by a cooler. For example, in the air cooling system, electric current is generated by rotating a fan using electric power. Further, for example, in the water cooling system, a pump that circulates refrigerant is driven using electric power.

JP 2007-165664 A JP 2007-335624 A JP 2004-193438 A JP 2009-123231 A

By the way, in recent electronic devices equipped with LSIs that have increased in calorific value due to high performance, large fans and motors have been used to cool LSIs and electronic devices, and fans and motors have been used. Therefore, there is a problem that the power for driving the fan and the motor increases.
In this way, when considering both the cooling of equipment and the reduction of power consumption, it not only improves cooling efficiency, but also recovers the energy consumed for cooling and reuses it as a drive source for components mounted on equipment. It is important to reduce the energy consumption of the entire device.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to reduce power required to dissipate heat generated from LSIs and electronic devices and to cool LSIs and electronic devices appropriately. It is to provide an energy conversion mechanism, a boiling cooler, and an electronic device that can be used.

Energy conversion mechanism of the present invention includes a case where the boiling liquid is Ru housed inside by being heated, is bonded to the contact can be the case with the liquid, and the heat transfer member having thermal conductivity, and the liquid A vibrating body that is joined to the case so as to come into contact and is arranged to be able to collide with bubbles generated by boiling of the liquid by heat transferred from the heat transfer member, and the vibrating body includes the bubbles There characterized that you vibration by collision.
Moreover, the boiling cooler of this invention is equipped with the energy conversion mechanism of this invention, It is characterized by the above-mentioned.
In addition, an electronic device according to the present invention includes the energy conversion mechanism according to the present invention.

  According to the energy conversion mechanism, the boiling cooler, and the electronic device of the present invention, it is possible to vibrate the vibrating body when the bubbles collide with the vibrating body, and heat energy is converted into kinetic energy with high efficiency. The heat transmitted to the conductive member can be dissipated. For this reason, for example, no power is required to dissipate heat generated from the LSI or the electronic device, and the power can be reduced and the LSI or the electronic device can be suitably cooled.

It is a disassembled perspective view which shows the energy conversion mechanism of the 1st Embodiment of this invention. (A) is a top view of the energy conversion mechanism, and (B) is a cross-sectional view taken along line AA of (A). It is sectional drawing which shows the operation | movement at the time of use of the energy conversion mechanism. It is a schematic diagram for demonstrating the vibration aspect of the vibrating body in the energy conversion mechanism. It is a schematic diagram for demonstrating the operating principle of the vibrating body in the energy conversion mechanism. It is a longitudinal cross-sectional view which shows the energy conversion mechanism of the 2nd Embodiment of this invention. It is a longitudinal cross-sectional view which shows the mechanism of the 3rd Embodiment of this invention. It is a longitudinal cross-sectional view which shows the mechanism of the 4th Embodiment of this invention. (A) is a top view which shows the energy conversion mechanism of the 5th Embodiment of this invention, (B) is a longitudinal cross-sectional view in the BB line of (A). (A) is a top view which shows the energy conversion mechanism of the 6th Embodiment of this invention, (B) is a longitudinal cross-sectional view in CC line of (A). It is a longitudinal cross-sectional view which shows the energy conversion mechanism of the 7th Embodiment of this invention. It is sectional drawing which shows the vibrating body in the energy conversion mechanism of Example 8 of this invention. It is sectional drawing which shows the energy conversion mechanism of Example 10 of this invention. (A) is sectional drawing which shows the energy conversion mechanism of Example 14 of this invention, (B) is a top view which shows the heat transfer member in the energy conversion mechanism of the Example. (A) is sectional drawing which shows the energy conversion mechanism of Example 15 of this invention, (B) is a top view which shows the heat transfer member in the energy conversion mechanism of the Example. (A) is a top view which shows the energy conversion mechanism of Example 16 of this invention, (B) is sectional drawing in the EE line | wire of (A). (A) is a top view which shows the energy conversion mechanism of Example 17 of this invention, (B) is sectional drawing in the FF line | wire of (A). It is sectional drawing which shows the energy conversion mechanism of Example 20 of this invention. It is a top view which shows the heat transfer member in the energy conversion mechanism. It is a top view which shows the heat transfer member in the energy conversion mechanism of Example 21 of this invention. It is a top view which shows the heat transfer member in the energy conversion mechanism of Example 22 of this invention. It is a top view which shows the heat transfer member in the energy conversion mechanism of Example 23 of this invention. It is a top view which shows the heat transfer member in the energy conversion mechanism of Example 24 of this invention. It is sectional drawing which shows the energy conversion mechanism of Example 29 of this invention. It is sectional drawing which shows the energy conversion mechanism of Example 32 of this invention. It is sectional drawing which shows the energy conversion mechanism of Example 34 of this invention. It is a table | surface which shows the result of Example 1 thru | or Example 36 of this invention, and the comparative example 1 thru | or the comparative example 3 collectively.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in the structure of each embodiment demonstrated below, about the same structure part, the same code | symbol is attached | subjected and shown, and the overlapping description is abbreviate | omitted.

(First embodiment)
The energy conversion mechanism according to the first embodiment of the present invention will be described below. FIG. 1 is an exploded perspective view showing the configuration of the energy conversion mechanism of the present embodiment. 2A and 2B are diagrams showing the energy conversion mechanism of the present embodiment, in which FIG. 2A is a plan view and FIG. 2B is a cross-sectional view taken along line AA in FIG.
As shown in FIGS. 1 and 2, the energy conversion mechanism 1-1 is in contact with a case 51-1 in which a liquid 41-1 that is a liquid that is boiled by heating is stored, and the liquid 41-1. The heat transfer member 31-1 is bonded to the case 51-1 and has thermal conductivity, and the vibrating body 61-1 is bonded to the case 51-1 so as to come into contact with the liquid 41-1. ing.

The case 51-1 is formed with a cavity inside, and has a configuration capable of storing the liquid 41-1 therein. Examples of the material of the case 51-1 include a resin material such as polyethylene, polypropylene, or an acrylic resin, a metal material such as aluminum, or a ceramic material. Note that the material of the case 51-1 is not particularly limited as long as the material is chemically resistant to the solvent.
In addition, a heat exchanger 71-1 having a flow path communicating with the inside of the case 51-1 is attached to the case 51-1.

  The heat exchanger 71-1 has heat exchange fins 71-1a for increasing the contact area with the outside air. A gas obtained by vaporizing the liquid 41-1 flows through the heat exchanger 71-1, and heat is diffused to the air outside the heat exchanger 71-1. Thereby, the gas which the liquid 41-1 vaporized condenses inside the heat exchanger 71-1, liquefies, and recirculate | refluxs to the case 51-1.

The heat transfer member 31-1 has a function of transferring heat generated from the heating element 21-1 outside the energy conversion mechanism 1-1 to the liquid 41-1, and boiling the liquid 41-1. The material of the heat transfer member 31-1 is preferably a material having a high thermal conductivity (for example, a thermal conductivity of 10 W / mK or more), and examples thereof include metal materials such as aluminum and copper. The material of the heat transfer member 31-1 may be other than a metal material as long as it has a thermal conductivity, and is not particularly limited.
Moreover, it is preferable that the heat transfer member 31-1 is subjected to surface processing such as a groove or a slit on the surface on the side in contact with the liquid 41-1.

  The heating element 21-1 is, for example, an electronic component such as an LSI, and can be attached in close contact with the heat transfer member 31-1 with a silicon compound having high thermal conductivity. The heat generator 21-1 may be a heat transport member that transports heat generated in a heat generating component disposed outside the energy conversion mechanism 1-1, and any member that needs to be cooled can be used. It may be anything.

The vibrating body 61-1 is set to be lower in rigidity than the case 51-1. Examples of the material of the vibrating body 61-1 include resin materials such as polyethylene, urethane, and polyethylene terephthalate. Further, the vibrating body 61-1 is in contact with the liquid 41-1 on one surface. For this reason, it is preferable that the vibrating body 61-1 is a material having resistance to corrosion and dissolution at least on the surface in contact with the liquid 41-1.
In the present embodiment, the vibrating body 61-1 is disposed opposite to the heat transfer member 31-1 with the liquid 41-1.

  The liquid 41-1 is a heat medium used for transferring heat from a place having a high temperature to a place having a low temperature. Furthermore, in this embodiment, in addition to the liquid 41-1 being a heat medium, the liquid 41-1 has a function of generating a boiling bubble 41-1b that vibrates the vibrating body 61-1. As the liquid 41-1, a refrigerant can be preferably used. Specifically, non-fluorocarbon solvents containing hydrofluoroether, polyoxyalkylene glycol (ether-based lubricating oil), ester-based lubricant, and the like can be employed. When a refrigerant is used as the liquid 41-1, it is preferable to employ a refrigerant having a low global warming potential or ozone depletion potential, but heat transmitted from the heating element 21-1 via the heat transfer member 31-1. If it is a liquid material which boils by, it will not specifically limit.

In the present embodiment, the heating element 21-1 and the heat transfer member 31-1 are bonded using a silicon compound having thermal conductivity. Moreover, for example, an epoxy-based adhesive can be used for joining the heat transfer member 31-1 and the case 51-1 and joining the vibrating body 61-1 and the case 51-1. The thickness of the adhesive layer by the epoxy adhesive is not particularly limited, but if the adhesive layer is too thin, the liquid 41-1 may leak to the outside of the energy conversion mechanism 1-1, while the adhesive is If the layer is too thick, vibration energy is absorbed by the adhesive layer at the portion of the vibrating body 61-1, and it may be difficult to obtain sufficient vibration displacement. For this reason, it is preferable that the thickness of an adhesive bond layer is 5 micrometers or more and 500 micrometers or less, for example. Furthermore, from the viewpoint of adhesive strength, the thickness of the adhesive layer is more preferably 10 μm or more and 100 μm or less.

The operation of the energy conversion mechanism of the present embodiment having the above-described configuration will be described.
When the heating element 21-1 generates heat, the heat of the heating element 21-1 diffuses to the heat transfer member 31-1. The heat transferred to the heat transfer member 31-1 is transferred to the liquid 41-1. Then, the liquid 41-1 is heated. When the liquid 41-1 is boiled by being heated, a boiling bubble 41-1b in which the liquid 41-1 is vaporized is generated.

The boiling bubble 41-1b moves upward in the liquid 41-1, and collides with the vibrating body 61-1 in contact with the liquid 41-1. Then, the vibrating body 61-1 is deformed by the kinetic energy with which the boiling bubble 41-1b collides.
More specifically, as shown in FIG. 3, the vibrating body 61-1 is first deformed in the upper surface direction in response to the collision of the boiling bubble 41-1b, and is in a curved state that is convex upward. Subsequently, as illustrated in FIG. 4, the vibrating body 61-1 that is convex upward returns to the original flat plate shape by the restoring force due to the elasticity of the vibrating body 61-1. Furthermore, the vibrating body 61-1 has a curved shape that protrudes downward due to the inertia of the vibrating body 61-1.

Since the boiling bubble 41-1b collides with the vibrating body 61-1 that is convex downward, the vibrating body 61-1 is deformed so as to be convex upward again.
In this manner, the vibrating body 61-1 vibrates with a constant amplitude by alternately repeating a state of convexing upward and a state of convexing downward in the direction in which the boiling bubbles 41-1b collide.

  For example, as shown in FIG. 5, an upward force is intermittently applied to the weight 100 in the spring 200 having one end fixed to the fixed wall 300 and the weight 100 fixed to the other end of the spring 200. This is based on the same principle that the spring 200 expands and contracts and the weight 100 vibrates up and down.

  The boiling bubble 41-1b after colliding with the vibrating body 61-1 reaches the liquid level of the liquid 41-1, and the gas in the boiling bubble 41-1b is transferred from the inside of the case 51-1 to the heat exchanger 71-1. It is liquefied by moving and condensing and returns to the liquid 41-1. The liquid 41-1 liquefied in the heat exchanger 71-1 is returned to the case 51-1, and is integrated with the liquid 41-1 inside the case 51-1. In this manner, the liquid 41-1 circulates inside the energy conversion mechanism 1-1 by repeating vaporization and condensation.

Below, in the energy conversion mechanism of this embodiment, the efficiency which converts the thermal energy transmitted from the heat generating body 21-1 into the kinetic energy of the vibrating body 61-1, the relationship between the frequency at which the vibrating body 61-1 vibrates and the vibration displacement. Will be described.
Mechanical energy depends on the product of acceleration and weight. Moreover, the conversion efficiency η of heat energy to kinetic energy is proportional to the cube of the frequency and the square of the displacement. For this reason, in the energy conversion mechanism 1-1 of the present embodiment, the frequency at which the vibrating body 61-1 vibrates is set to a high frequency band, and the vibration displacement amount of the vibrating body 61-1 is increased, thereby increasing the heat. The conversion efficiency of energy to kinetic energy can be increased. Further, since the above-described conversion efficiency η is proportional to the cube of the frequency and the square of the displacement, the frequency of the vibrating body 61-1 is higher than the amount of vibration displacement of the vibrating body 61-1. It is considered to be a dominant factor with respect to η. Specific values of the frequency at which the vibrating body 61-1 vibrates and the vibration displacement amount of the vibrating body 61-1 will be described later.

In the energy conversion mechanism 1-1 of the present embodiment, the weight and rigidity of the vibrating body 61-1 are dominant as factors that determine the frequency at which the vibrating body 61-1 vibrates.
In the energy conversion mechanism 1-1, the vibration body 61-1 is set by optimizing and setting the weight load on the vibration body 61-1 and the density and rigidity of the material for constituting the vibration body 61-1. The energy conversion mechanism can be configured by optimizing the frequency characteristics without changing the outer shape. Moreover, the vibration displacement amount of the vibrating body 61-1 can be increased by using materials having different rigidity as the vibrating body 61-1.

  As described above, according to the energy conversion mechanism of the present embodiment, the boiling bubble 41-1b of the liquid 41-1 generated by the heat transfer from the heat transfer member 31-1 collides with the vibrating body 61-1. Since the vibrating body 61-1 is vibrated, heat energy can be converted into kinetic energy.

  Further, the conversion efficiency for converting the heat energy generated in the heating element 21-1 into the kinetic energy of the vibrating body 61-1 is to set the weight, rigidity and density of the vibrating body 61-1, and to change the vibration displacement amount and frequency. It can be easily adjusted by changing. For this reason, it is not necessary to change the entire structure of the energy conversion mechanism 1-1 such as the configuration of the case 51-1 and the heat transfer member 31-1, and the manufacturing stability when manufacturing the energy conversion mechanism is high. Furthermore, parts for manufacturing energy conversion mechanisms having different characteristics can be shared, and manufacturing costs can be kept low.

  Moreover, since the gas which boiled inside the case 51-1 and the liquid 41-1 vaporized moves to the heat exchanger 71-1, and is condensed, the heat transmitted to the liquid 41-1 is efficiently used in the case 51. -1 can be transported outside and diffused to the outside via the heat exchanger 71-1. For this reason, converting heat energy into kinetic energy and transporting heat to the outside can be used in combination, and the heating element 21-1 can be effectively cooled.

  Moreover, since the vibrating body 61-1 has elasticity and is a material whose rigidity is lower than that of the case 51-1, an electronic device or the like including the energy conversion mechanism 1-1 is dropped to the energy conversion mechanism 1-1. On the other hand, when an impact is applied, the vibrating body 61-1 absorbs the impact, and the leakage of the liquid 41-1 and the damage of the case 51-1 can be suppressed. Therefore, the energy conversion mechanism 1-1 according to the present embodiment is preferably used by being incorporated in a portable electronic device (for example, a mobile phone, a notebook personal computer, a small game device, etc.) carried and used by the user. Can do.

  In addition, since the vibrating body 61-1 is disposed opposite to the heat transfer member 31-1 with the liquid 41-1, the boiling bubble 41-1b generated on the surface of the heat transfer member 31-1 is removed from the vibrating body 61. -1 can be efficiently collided. For this reason, energy can be efficiently converted from thermal energy to kinetic energy.

(Second Embodiment)
Below, the energy conversion mechanism of the 2nd Embodiment of this invention is demonstrated. FIG. 6 is a sectional view showing an energy conversion mechanism according to the second embodiment of the present invention.
As shown in FIG. 6, the energy conversion mechanism 2-1 of the present embodiment is different from the energy conversion mechanism 1-1 of the first embodiment in that a vibration body 62-1 is provided instead of the vibration body 61-1. The configuration is different.

  The vibrating body 62-1 is made of a material having piezoelectric characteristics, such as lead zirconate titanate. That is, the vibrator 62-1 is deformed so as to be convex upward or downward by the boiling bubble 41-1b, thereby generating a potential difference. A specific configuration of the vibrating body 62-1 is shown in an embodiment described later and FIG. 12, but for example, as shown in FIG. 12, a plate-like piezoelectric body 62-1a and the thickness direction of the piezoelectric body 62-1a are shown. And a pair of electrode plates 62-1b disposed on both sides. A wiring (not shown) can be connected to the electrode plate 62-1b, and a voltage generated by the deformation of the piezoelectric body 62-1a can be taken out.

Even if it is such a structure, there can exist an effect similar to the energy conversion mechanism 1-1 of 1st Embodiment.
Further, according to the energy conversion mechanism 2-1 of the present embodiment, since the piezoelectric material has a function as a mechanical electric transducer, the vibration body 62-1 vibrates to extract electric energy as well as kinetic energy. It is possible. The electrical energy taken out from the vibrating body 62-1 can be used as electric power for driving a component arranged in, for example, an electronic device outside the energy conversion mechanism 2-1. For this reason, the range which can apply the energy converted by the energy conversion mechanism 2-1 is wider than the energy conversion mechanism 1-1 demonstrated in 1st Embodiment.

(Third embodiment)
Below, the energy conversion mechanism of the 3rd Embodiment of this invention is demonstrated.
FIG. 7 is a cross-sectional view showing the energy conversion mechanism 3-1 of the present embodiment.
As shown in FIG. 7, the energy conversion mechanism 3-1 includes a vibrating body unit 63-1 provided instead of the vibrating body 61-1, and a case 53-1 provided instead of the case 51-1. The configuration is different from the energy conversion mechanism 1-1 described in the first embodiment in that it is provided.

  The vibrating body unit 63-1 includes a vibrating body 63-1a formed in a thin film shape, and a vibration enlarging mechanism 63-1b provided to be joined to the vibrating body 63-1a along the outline of the vibrating body 63-1a. have.

  The vibration enlarging mechanism 63-1b has one end joined to the vibrating body 63-1a as described above and the other end joined to the case 53-1. The vibration magnifying mechanism 63-1b and the vibrating body 63-1a and the vibration magnifying mechanism 63-1b and the case 53-1 are fixed by adhesion using an epoxy adhesive. The shape of the vibration magnifying mechanism 63-1b is an accordion shape extending in the thickness direction of the vibrating body 63-1a. The material of the vibration magnifying mechanism 63-1b is, for example, urethane resin, PET, natural rubber, or synthetic rubber. Resin material such as has elasticity.

The operation of the energy conversion mechanism 3-1 of this embodiment will be described.
Also in this embodiment, like the energy conversion mechanism 1-1 described in the first embodiment, the liquid 41-1 is boiled by the heat transferred from the heating element 21-1 to the heat transfer member 31-1.

  The boiling bubble 41-1b collides with the vibrating body 63-1a of the vibrating body unit 63-1, and vibrates so as to protrude upward and downward by the same action as the vibrating body 61-1 of the first embodiment. The body 63-1a vibrates.

  Then, the vibration of the vibrating body 63-1a is also transmitted to the vibration magnifying mechanism 63-1b, and expands and contracts by the elasticity of the vibration magnifying mechanism 63-1b. Since the other end of the vibration magnifying mechanism 63-1b is fixed to the case 53-1, the vibrating body 63-1a and the case 53-1 move relative to each other along the direction of expansion and contraction of the vibration magnifying mechanism 63-1b.

  According to the energy conversion mechanism 3-1 of the present embodiment, the vibrating body 63-1 vibrates so as to be convex upward and convex downward in the case 53-1, and the vibrating body is vibrated by the vibration enlarging mechanism 63-1b. Since the 63-1a and the case 53-1 move relative to each other, the vibration displacement amount of the vibration body 63-1a is larger than the vibration displacement amount of the vibration body 61-1 described in the first embodiment. Therefore, energy can be converted from heat energy to kinetic energy with high efficiency.

(Fourth embodiment)
Below, the energy conversion mechanism of the 4th Embodiment of this invention is demonstrated.
FIG. 8 is a cross-sectional view showing the energy conversion mechanism 4-1 of the present embodiment.
As shown in FIG. 8, the energy conversion mechanism 4-1 includes a vibrating body 64-1 provided instead of the vibrating body 61-1, and a displacer 84-having one end fixed to the center of the vibrating body 64-1. 1 is different in configuration from the energy conversion mechanism 1-1 described in the first embodiment.

  The displacer 84-1 is formed in a columnar shape extending in the thickness direction of the vibrating body 64-1, and is formed in, for example, a columnar shape with a constant cross-sectional area perpendicular to the generatrix or a prismatic shape.

  Even if it is such a structure, there can exist an effect similar to the energy conversion mechanism 1-1 demonstrated in 1st Embodiment. Furthermore, according to the energy conversion mechanism 4-1 of the present embodiment, the displacer 84-1 extracts the kinetic energy generated by the vibration of the vibrating body 64-1 as a reciprocating motion at a position separated from the vibrating body 64-1. Can do.

(Fifth embodiment)
Below, the energy conversion mechanism of the 5th Embodiment of this invention is demonstrated.
FIG. 9A is a plan view showing the energy conversion mechanism 5-1 of the present embodiment. FIG. 9B is a cross-sectional view taken along line BB in FIG.
As shown in FIGS. 9A and 9B, the energy conversion mechanism 5-1 includes heat transfer members 35-1a and 35-1b provided in place of the heat transfer member 31-1. In this respect, the configuration is different from that of the energy conversion mechanism 1-1 described in the first embodiment. Moreover, in this embodiment, it has the displacer 84-1, similarly to the above-mentioned 4th Embodiment.

  The heat transfer members 35-1a and 35-1b are divided into two portions by a heat insulating member 35-2 having heat insulating properties. Different heating elements 25-1a and 25-1b can be attached to the heat transfer members 35-1a and 35-1b, respectively.

  In the energy conversion mechanism 5-1 of the present embodiment, the heat generated from the heating element 25-1a is diffused in the heat transfer member 35-1a to which the heating element 25-1a is attached. On the other hand, the heat generated from the heating element 25-1b diffuses to the heat transfer member 35-1b to which the heating element 25-1b is attached.

  The heat diffused to the heat transfer members 35-1a and 35-1b is both transmitted to the liquid 41-1, and the liquid 41-1 boils to produce a boiling bubble 41-1b. Then, similarly to the energy conversion mechanism 1-1 of the first embodiment, the vibration body 61-1 vibrates to convert thermal energy into kinetic energy.

  Even if it is such a structure, there can exist an effect similar to the energy conversion mechanism 1-1 demonstrated in 1st Embodiment. Further, since the heat transfer members 35-1a and 35-1b are arranged in a state of being separated from each other with the heat insulating material 35-2 interposed therebetween, the heat transfer member 35-1a and the heat transfer member 35-1b The heat transfer between them is suppressed. For this reason, it can suppress that a mutual heat-generation state mutually influences between the heat generating body 25-1a and the heat generating body 25-1b attached to the heat transfer members 35-1a and 35-1b.

In addition, since it is not necessary to provide a corresponding number of energy conversion mechanisms for a plurality of heating elements, for example, it is easy to manufacture an electronic device when the energy conversion mechanism is mounted on an electronic device, and the number of parts is reduced. By being able to do so, the reliability of the electronic device can be increased, and the electronic device can be configured to save space.
In addition, the energy conversion mechanism 5-1 of this embodiment is not limited to two sets of a heat generating body and a heat transfer member, It is set as the structure which has two or more sets of a heat generating body and a heat transfer member. be able to.

(Sixth embodiment)
The energy conversion mechanism according to the sixth embodiment of the present invention will be described below.
FIG. 10A is a plan view showing the energy conversion mechanism 6-1 of the present embodiment. FIG. 10B is a cross-sectional view taken along line CC in FIG.
As shown in FIGS. 10A and 10B, the energy conversion mechanism 6-1 is provided instead of the case 56-1 provided instead of the case 51-1, and the vibrating body 61-1. The configuration is different from the energy conversion mechanism 1-1 described in the first embodiment in that the vibrators 66-1a and 66-1b are provided.

The case 56-1 has two concave portions 56-1a and 56-1b so as to support the vibrating body 66-1a and the vibrating body 66-1b so as to be separated from each other in the liquid 41-1. . Openings are formed at the bottoms of the recesses 56-1a and 56-1b, respectively, and these openings are sealed by vibrating bodies 66-1a and 66-1b.
The vibrating body 66-1a and the vibrating body 66-1b are formed of materials having different densities, for example.

  In the energy conversion mechanism 6-1 of the present embodiment, heat is transmitted from the heating element 21-1 to the heat transfer member 31-1 in the same manner as the energy conversion mechanism 1-1 described in the first embodiment, and the heat transfer member 31. The liquid 41-1 is heated by -1. When the boiling bubble 41-1b generated by boiling the liquid 41-1 collides with the vibrating body 66-1a and the vibrating body 66-1b under the same condition, the vibrating body 66-1a and the vibrating body 66-1b Vibrates with different vibration displacements.

Even if it is such a structure, there can exist an effect similar to the energy conversion mechanism 1-1 demonstrated in 1st Embodiment. Furthermore, according to the energy conversion mechanism 6-1 of the present embodiment, the vibrating body 66-1a and the vibrating body 66-1b vibrate with different vibration displacement amounts, and thus the vibrating body 66-1a and the vibrating body 66-1b The reciprocating motions having different amplitudes can be extracted from
Moreover, when the energy conversion mechanism 5-1 of this embodiment is mounted in an electronic device, a plurality of components can be driven by a plurality of movements extracted from one energy conversion mechanism 5-1. For this reason, manufacture of an electronic device becomes easy and the reliability of an electronic device can be improved by being able to reduce the number of parts, and an electronic device can be comprised in a space-saving.

  In addition, by using the displacer 84-1 and the other links described in the fourth embodiment, one energy is provided for each of a plurality of components arranged apart from the energy conversion mechanism 5-1. Different motions can be transmitted by the conversion mechanism 5-1.

  In the present embodiment, the example in which the vibration displacement amounts of the vibrating body 66-1a and the vibrating body 66-1b are different from each other has been described. However, the present invention is not limited thereto, and each of the vibrating body 66-1a and the vibrating body 66-1b is used. It is also possible to individually extract kinetic energy that vibrates at different vibration frequencies.

  In addition, the outer shape of the vibrating body 66-1a and the vibrating body 66-1b may be the same shape and the same size, and the diameter and thickness are different between the vibrating body 66-1a and the vibrating body 66-1b. It may be. Further, the vibrating body 66-1a and the vibrating body 66-1b may be the same.

(Seventh embodiment)
The energy conversion mechanism according to the seventh embodiment of the present invention will be described below.
FIG. 11 is a cross-sectional view showing the energy conversion mechanism 7-1 of the present embodiment.
As shown in FIG. 11, the energy conversion mechanism 7-1 includes a vibrating body 67-1 provided instead of the vibrating body 61-1, and one end 87-1a fixed to the center of the vibrating body 67-1. A displacer 87-1, a crank 97-1 to which the other end 87-1b of the displacer 87-1 is rotatably connected, and a rotating body 97-2 fixed to a rotating shaft 97-1a of the crank 97-1. The configuration differs from the energy conversion mechanism 1-1 described in the first embodiment in that it is provided.

The displacer 87-1 has the same shape as the displacer 84-1 described in the fourth embodiment, and is bonded to the vibrating body 67-1 with an epoxy adhesive.
In the crank 97-1, a crank shaft 97-1a is rotatably supported by a support portion (not shown).
The rotator 97-2 is a fan or the like for releasing heat accumulated in the energy conversion mechanism 7-1 to the outside.

The operation of the energy conversion mechanism 7-1 of the present embodiment will be described.
Also in the energy conversion mechanism 7-1, the liquid 41-1 boils by the heat transferred from the heating element 21-1 to the heat transfer member 31-1 as in the energy conversion mechanism 1-1 described in the first embodiment. . Then, the boiling bubble 41-1b collides with the vibrating body 67-1. Accordingly, the vibrating body 67-1 vibrates so as to be convex upward and downward, and the displacer 87-1 moves forward and backward by the vibration of the vibrating body 67-1. Since the other end 87-1b of the displacer 87-1 is connected to the crank 97-1, the advance / retreat operation of the displacer 87-1 is converted into a rotation operation around the rotation shaft 97-1a, and the crank 97-1 rotates. To do. At this time, the rotating body 97-2 connected to the crank 97-1 also rotates integrally with the crank 97-1.

  The heat generated by the heating element 21-1 and transmitted to the energy conversion mechanism 7-1 is converted into the rotational motion of the rotating body 97-2 as described above, but a part of the heat is accumulated in the liquid 41-1. The gas obtained by vaporizing the liquid 41-1 is filled in the case 57-1. As the rotating body 97-2 rotates, an air flow is generated around the energy conversion mechanism 7-1, and the gas filled in the case 57-1 in the energy conversion mechanism 7-1 is condensed to form a liquid 41-. Return to 1.

  Thus, since the liquid 41-1 repeats vaporization and condensation, the heating element 21-1 can be continuously cooled by circulating the liquid 41-1.

  According to the energy conversion mechanism 7-1 of the present embodiment, the heating element 21-1 can be cooled, and the gas vaporized from the liquid 41-1 can be forcibly cooled by the rotating body (fan) 97-2. As a result, it is not necessary to prepare additional power for rotating the fan.

  Moreover, according to the electronic device provided with the energy conversion mechanism 7-1 of the present embodiment, the other electronic components mounted on the electronic device can be cooled by the rotating body (fan), so the electronic components are cooled. Therefore, it is possible to reduce the electric power required for this.

  Further, since the electronic device can be cooled by operating the rotating body 97-2 by the heat generated by the heating element 21-1, waste heat in the electronic device can be suitably used for cooling the electronic device, The total amount of energy for driving the electronic device can be reduced.

  About the characteristic of the energy conversion mechanism and electronic device of this invention, the several energy conversion mechanism and electronic device which have a different structure were compared, and the following evaluation item 1 thru | or evaluation item 5 were evaluated.

(Evaluation item 1)
As an evaluation item 1, the fundamental resonance frequency of the vibrating body was measured. The fundamental resonance frequency of the vibrating body was measured by measuring the frequency and amplitude characteristics of the vibrating body using a laser displacement meter.

(Evaluation item 2)
As evaluation item 2, the amount of vibration displacement of the vibrating body was measured. The vibration displacement amount of the vibrating body was measured by measuring the amplitude of the central portion of the vibrating body using a laser displacement meter.

(Evaluation item 3)
As an evaluation item 3, energy conversion efficiency for converting thermal energy into kinetic energy by an energy conversion mechanism was measured. The energy conversion efficiency is calculated based on each of the basic resonance frequency and the vibration displacement amount obtained from the evaluation items 1 and 2, and the weight of the displacer attached to the vibrating body. When the energy conversion efficiency was less than 0.1%, the energy conversion efficiency was evaluated as a two-step evaluation.

(Evaluation item 4)
As evaluation item 4, the cooling performance for cooling the heating element by the energy conversion mechanism was measured. The cooling performance is measured by measuring the temperature T2 when the surface temperature of the heating element is in an equilibrium state after the energy conversion mechanism is attached to the heating element that generates heat at a constant temperature T1. When the temperature difference ΔT obtained by subtracting T2 from T1 is 50 ° C. or more, the evaluation was made in two stages with respect to the cooling performance as ○ (good), and when the temperature difference ΔT was less than 50 ° C., x (defect).

(Evaluation item 5)
As evaluation item 5, the reliability of the energy conversion mechanism was measured. The reliability of the energy conversion mechanism is such that the heat generation state of the heating element is continued for 100 hours with the energy conversion mechanism attached to the heating element, and the vibration displacement amount of the vibration body immediately after the energy conversion mechanism is attached to the heating element is 100 The vibration displacement amount of the vibrating body after the lapse of time was measured, and the change in the vibration displacement amount in 100 hours was measured. Reliability is evaluated as ○ (good) if the difference between the vibration displacement before the test and the vibration displacement after the test is within ± 10%, and the vibration displacement before the test and the vibration displacement after the test. Those with a difference of more than ± 10% were evaluated as a two-step evaluation as x (defect).
Hereinafter, Examples 1 to 36 and Comparative Examples 1 to 3 of the energy conversion mechanism and the electronic device implemented based on the evaluation items will be described in detail with reference to FIG. FIG. 27 is a table summarizing the results in Examples 1 to 36 and Comparative Examples 1 to 3. In FIG. 27, the portion described as “NT” indicates that the evaluation is not performed.

Example 1
As Example 1, the energy conversion mechanism 1-1 of the first embodiment was configured in the following shape (see FIGS. 1 and 2).
As the heating element 21-1, an LSI having a length of 40 mm, a width of 40 mm, a thickness of 2 mm and a heating value of 40 W was mounted on a substrate.
As the heat transfer member 31-1, an aluminum plate having a diameter of 80 mm and a thickness of 2 mm was used.
As the liquid 41-1, a commercially available hydrofluoroether refrigerant having a boiling point set to 50 ° C. was used.
As the case 51-1, the outer diameter of the opening on the side where the heat transfer member 31-1 is attached is 80 mm, the outer diameter of the opening on the side where the vibrating body 61-1 is attached is 30 mm, and a substantially cylindrical shape with a height of 50 mm. A case made of acrylic having a thickness of 2 mm was used.
As the vibrating body 61-1, a urethane film having a diameter of 30 mm and a thickness of 0.1 mm was used.
A commercially available air-cooled radiator was used as the heat exchanger 71-1, and the heat exchanger 71-1 and the case 51-1 were connected by a silicon tube.

Further, in order to extract kinetic energy from the vibrator 61-1, a displacer 84-1 was attached to the center of the vibrator 61-1. In this embodiment, the weight of the displacer 84-1 is 5 g, and the shape of the displacer is a cylindrical shape having a diameter of 10 mm and a height of 10 mm.
The heating element 21-1 and the heat transfer member 31-1 were adhered to each other using silicon grease. Further, the case 51-1, the heat transfer member 31-1, the vibrating body 61-1, and the displacer 84-1 were joined using an epoxy adhesive.

  In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 23 Hz, and the maximum value of the vibration displacement amount (hereinafter referred to as “maximum displacement amount”) was 2.0 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.

(Example 2)
As Example 2, an energy conversion mechanism 1-1 in which the thickness of the vibrating body 61-1 was set different from that of the vibrating body of Example 1 was produced. In this embodiment, the thickness of the vibrating body 61-1 is 0.5 mm.
The rest of the configuration of the energy conversion mechanism 1-1 of the present embodiment is the same as that of the first embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 35 Hz, and the maximum displacement amount was 1.7 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

(Example 3)
As Example 3, an energy conversion mechanism 1-1 in which the thickness of the vibrating body 61-1 was set different from that of the vibrating body of Example 1 and Example 2 was manufactured. In the present embodiment, the vibrating body 61-1 has a thickness of 0.05 mm.
In the energy conversion mechanism 1-1 of the present embodiment, the configuration other than the vibrating body 61-1 is the same as that of the first embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 19 Hz, and the maximum displacement amount was 3.2 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

From the results of Examples 1 to 3, it becomes clear that the thermal energy can be converted into kinetic energy when the thickness of the vibrating body is 0.05 mm, 0.1 mm, and 0.5 mm. It was found that it was preferable to have a thickness of 0.5 mm or less.
It was also found that the thinner the vibrating body, the lower the basic resonance frequency of the vibrating body and the larger the amount of vibration displacement, and the thicker the vibrating body, the higher the basic resonance frequency of the vibrating body and the smaller the amount of vibration displacement.

Example 4
As Example 4, an energy conversion mechanism configured by making the material constituting the vibrating body 61-1 different from the energy conversion mechanism 1-1 of Example 1 was manufactured. In the present embodiment, the material of the vibrating body 61-1 is polyethylene terephthalate (PET). The shape of the vibrating body 61-1 was a disk-shaped thin film having a diameter of 30 mm and a thickness of 0.1 mm, as in Example 1 described above.
In the energy conversion mechanism 1-1 of the present embodiment, the configuration other than the vibrating body 61-1 is the same as that of the first embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 27 Hz, and the maximum displacement amount was 2.3 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

(Example 5)
As Example 5, an energy conversion mechanism configured by making the material constituting the vibrating body 61-1 different from the energy conversion mechanism 1-1 of Example 1 and Example 4 was manufactured. In the present embodiment, the material of the vibrating body 61-1 is natural rubber. The shape of the vibrating body 61-1 was a disc-shaped thin film having a diameter of 30 mm and a thickness of 0.1 mm, as in the first embodiment.
In the energy conversion mechanism 1-1 of the present embodiment, the configuration other than the vibrating body 61-1 is the same as that of the first embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 24 Hz, and the maximum displacement amount was 2.9 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

(Example 6)
As Example 6, an energy conversion mechanism configured by changing the material constituting the vibrating body 61-1 from the energy conversion mechanism 1-1 of Example 1, Example 4, and Example 5 was manufactured. In the present embodiment, the material of the vibrating body 61-1 is polyethylene. The shape of the vibrating body 61-1 was a disk-shaped thin film having a diameter of 30 mm and a thickness of 0.1 mm, as in Example 1 described above.
In the energy conversion mechanism 1-1 of the present embodiment, the configuration other than the vibrating body 61-1 is the same as that of the first embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 21 Hz, and the maximum displacement amount was 3.1 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

(Example 7)
As Example 7, an energy conversion mechanism configured by making the material constituting the vibrating body 61-1 different from the energy conversion mechanism 1-1 of Example 1, Example 4 to Example 6 was manufactured. In the present embodiment, the material of the vibrating body 61-1 is silicone rubber. The shape of the vibrating body 61-1 was a disc-shaped thin film having a diameter of 30 mm and a thickness of 0.1 mm, as in the first embodiment.
In the energy conversion mechanism 1-1 of the present embodiment, the configuration other than the vibrating body 61-1 is the same as that of the first embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 18 Hz, and the maximum displacement amount was 3.2 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

  From the results of Example 1 and Examples 4 to 7, it is preferable to use thermal energy as kinetic energy regardless of whether urethane, PET, polyethylene, natural rubber, or silicone rubber is used as the material of the vibrator 61-1. It turns out that it can be converted. That is, the vibrating body 61-1 is preferably a resin member. The material of the vibrating body 61-1 is not particularly limited as long as it is an elastic member having elasticity.

(Example 8)
As Example 8, the energy conversion mechanism 2-1 of the second embodiment was configured in the following shape (see FIGS. 6 and 12).
As the heating element 21-1, the same LSI as in Example 1 was mounted on a substrate and used.
The same aluminum plate as in Example 1 was used as the heat transfer member 31-1.
As the liquid 41-1, the same hydrofluoroether refrigerant as in Example 1 was used.
As the case 51-1, a case having the same shape as that of Example 1 was used.
The vibrating body 62-1 was formed with a diameter of 30 mm and a thickness of about 0.1 mm. More specifically, as shown in FIG. 12, 0.1 mm-thick polyvinylene fluoride (PVDF) is used as the piezoelectric body 62-1a, and electrode plates 62-1b are formed on the upper and lower surfaces of the piezoelectric body 62-1a. A silver electrode having a thickness of 5 μm was formed. In addition, an electrical terminal was connected to the electrode plate 62-1b to extract electrical energy.

  Further, a displacer 84-1 was attached to the center of the piezoelectric body 62-1a in order to extract kinetic energy from the vibrating body 62-1. In the present example, as the displacer 84-1, a cylindrical displacer having the same weight as that of the first example and having a weight of 5 g, a diameter of 10 mm, and a height of 10 mm was used.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 22 Hz, and the maximum displacement amount was 2.7 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
Furthermore, the voltage of the electric energy extracted from the vibrating body 62-1 was 2 mV.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.
Furthermore, it was found that the energy conversion mechanism 2-1 of this embodiment can convert heat energy into electric energy and take out the electric energy to the outside.

Example 9
As Example 9, the energy conversion mechanism 3-1 of the third embodiment was configured in the following shape (see FIG. 7).
As the heating element 21-1, the same LSI as in Example 1 was mounted on a substrate and used.
The same aluminum plate as in Example 1 was used as the heat transfer member 31-1.
As the liquid 41-1, the same hydrofluoroether refrigerant as in Example 1 was used.
As the case 53-1, a case made of the same material as that of the first embodiment and having a shape in which a part of the wall portion is cut from the case of the first embodiment in order to attach the vibration magnifying mechanism 63-1b was used. .
As the vibrating body unit 63-1, the vibrating body 63-1a uses a urethane film having a diameter of 30 mm and a thickness of 0.1 mm, as in the vibrating body 61-1 of the first embodiment, and the vibration expanding mechanism 63-1b is external. Three urethane rings having a diameter of 30 mm, an inner diameter of 29 mm, and a height of 5 mm were stacked in the height direction.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 20 Hz, and the maximum displacement amount was 3.9 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

  In addition, the vibration magnifying mechanism 63-1b is provided, so that the vibration displacement amount (3.9 mm) in the present embodiment is larger than the vibration displacement amount (2.0 mm) in the first embodiment. Thus, it was found that the energy conversion efficiency from thermal energy to kinetic energy can be increased by interposing the vibration enlarging mechanism between the vibrating body and the case.

(Example 10)
As Example 10, an energy conversion mechanism 3-1 in which the shape of the vibration expansion mechanism was set different from that of the vibration expansion mechanism of Example 9 was produced. In the present embodiment, as shown in FIG. 13, a vibration expansion mechanism 63-2b is provided instead of the vibration expansion mechanism 63-1b. The vibration magnifying mechanism 63-2b was configured by overlapping two urethane rings formed in an outer diameter of 30 mm, an inner diameter of 29 mm, and a height of 5 mm in the height direction.
The rest of the configuration of the energy conversion mechanism 3-1 of the present embodiment is the same as that of the ninth embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 21 Hz, and the maximum displacement amount was 3.6 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the ninth embodiment. It has been found that the amount can be increased.

(Example 11)
As Example 11, an energy conversion mechanism 3-1 in which the material of the vibration expansion mechanism 63-1b was set different from that of the vibration expansion mechanism of Example 9 was produced. In the present embodiment, the material of the vibration magnifying mechanism 63-1b is silicone rubber. The shape of the vibration magnifying mechanism 63-1b is the same as that of the ninth embodiment.
The rest of the configuration of the energy conversion mechanism 3-1 of the present embodiment is the same as that of the ninth embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 19 Hz, and the maximum displacement amount was 3.4 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the ninth embodiment. It has been found that the amount can be increased.

(Example 12)
As Example 12, the energy conversion mechanism 4-1 of the fourth embodiment was configured in the following shape (see FIG. 8).
As the heating element 21-1, the same LSI as in Example 1 was mounted on a substrate and used.
The same aluminum plate as in Example 1 was used as the heat transfer member 31-1.
As the liquid 41-1, the same hydrofluoroether refrigerant as in Example 1 was used.
As the case 51-1, a case having the same shape as that of Example 1 was used.
As the vibrating body 64-1, a urethane film formed with a diameter of 30 mm and a thickness of 0.1 mm is used as in the first embodiment, and a portion to which the displacer 84-1 is bonded is changed to a liquid 41-1. It was set at the center on the surface opposite to the contact side.
As the displacer 84-1, a cylindrical member made of SUS304 having a diameter of 3 mm and a height of 5 cm was used, and one end thereof was bonded to the vibrating body 64-1 using an epoxy adhesive.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 24 Hz, and the maximum displacement amount was 2.4 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

(Example 13)
As Example 13, an energy conversion mechanism configured by changing the shape of the displacer 84-1 from the energy conversion mechanism 4-1 of Example 12 was manufactured. In the present embodiment, the shape of the displacer 84-1 is 5 mm in diameter and 5 cm in height. The material of the displacer 84-1 is the same stainless steel (SUS304) as in the twelfth embodiment.
In the energy conversion mechanism 4-1 of the present embodiment, the configuration other than the displacer 84-1 is the same as that of the twelfth embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 24 Hz, and the maximum displacement amount was 2.4 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

  Further, although the displacer 84-1 has a diameter (5 mm) larger than the displacer diameter (3 mm) in the twelfth embodiment and the weight of the displacer is heavy, the maximum displacement amount of the vibrator in the present embodiment and The fundamental resonance frequency of the vibrating body was the same as in Example 12.

(Example 14)
As Example 14, the energy conversion mechanism 5-1 of the fifth embodiment was configured in the following shape. FIG. 14 is a diagram showing the configuration of the energy conversion mechanism of the present embodiment. FIG. 14A is a sectional view of the energy conversion mechanism 5-1 of the present embodiment, and FIG. 14B is the energy conversion mechanism 5-1 of the present embodiment. It is a top view which shows the heat transfer member 31-1 in.
As the heating elements 25-1a and 25-1b, LSIs having a length of 20 mm, a width of 20 mm, a thickness of 2 mm, and a pressure heat amount of 20 W were used.
As the heat transfer members 35-1a and 35-1b, two aluminum plates having a diameter of 40 mm and a thickness of 2 mm were used. These heat transfer members 35-1a and 35-1b were used by being embedded in an acrylic plate (heat insulating member 35-2) having a diameter of 80 mm and a thickness of 2 mm (see FIG. 14B).
In the energy conversion mechanism 5-1 of the present embodiment, the configuration other than the heating element and the heat transfer member is the same as that of the first embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 20 Hz, and the maximum displacement amount was 2.6 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment. It has also been found that a plurality of different heating elements can be suitably cooled.

(Example 15)
As Example 15, an energy conversion mechanism configured by changing the configuration of the heating element and the heat transfer member from that of the energy conversion mechanism 5-1 of Example 14 was produced. FIG. 15 is a diagram illustrating the energy conversion mechanism 5-1 of the present embodiment, where (A) is a cross-sectional view of the energy conversion mechanism of the present embodiment, and (B) is a heat transfer member of the energy conversion mechanism of the present embodiment. It is a top view.
In this embodiment, three sets of heating elements and heat transfer members are provided. Specifically, the heating element 25-1c is provided in addition to the heating element 25-1a and the heating element 25-1b. As the heating elements 25-1a, 25-1b, and 25-1c, three LSIs having a length of 15 mm, a width of 15 mm, a thickness of 2 mm, and a heat generation amount of 13 W were used. In addition, as the heat transfer members 35-1a, 35-1b, and 35-1c, three aluminum plates having a diameter of 20 mm and a thickness of 2 mm were used. These heat transfer members 35-1a to 35-1c were used by being embedded in an acrylic plate (heat insulating member 35-2) having a diameter of 80 mm and a thickness of 2 mm.
In the energy conversion mechanism 5-1 of the present embodiment, the configuration other than the heating element and the heat transfer member is the same as that of the first embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 20 Hz, and the maximum displacement amount was 2.5 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment. It has also been found that a plurality of different heating elements can be suitably cooled.

(Example 16)
As Example 16, the energy conversion mechanism 6-1 of the sixth embodiment was configured in the following shape. 16A and 16B are diagrams showing the energy conversion mechanism of the present embodiment. FIG. 16A is a plan view showing the energy conversion mechanism of the present embodiment, and FIG. 16B is a cross-sectional view taken along line EE in FIG.
The same LSI as in Example 1 was used as the heating element 21-1.
As the heat transfer member 31-1, an aluminum plate having the same shape as in Example 1 was used.
As the case 56-1, a substantially cylindrical case made of acrylic having a thickness of 2 mm was used as in the case of Example 1. Further, the case 56-1 has two recesses that support the vibrating body 66-1a and the vibrating body 66-1b at positions separated from each other in the liquid 41-1, and the bottom of each of the recesses has an outer diameter. An opening having an inner diameter of 30 mm and an inner diameter of 26 mm is formed (see FIG. 16).
As the vibrating bodies 66-1a and 66-1b, two urethane films having a diameter of 30 mm and a thickness of 0.1 mm, which are configured in the same manner as in Example 1, are used, and an epoxy adhesive is used for each of the openings. Fixed.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the fundamental resonance frequency of each of the vibrating bodies 66-1a and 66-1b is 20 Hz, and the vibrating bodies 66-1a and 66-1b The maximum displacement amount of each was 1.9 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

(Example 17)
As Example 17, an energy conversion mechanism configured by changing the number of vibrators from the energy conversion mechanism 6-1 of Example 16 was manufactured. FIGS. 17A and 17B are diagrams showing the energy conversion mechanism of the present embodiment, in which FIG. 17A is a plan view and FIG. 17B is a cross-sectional view taken along line FF in FIG.
As shown in FIG. 16A, in this embodiment, there are three vibrating bodies as the vibrating bodies 66-1a, 66-1b, 66-1c. Each of the vibrating bodies 66-1a, 66-1b, and 66-1c is a urethane film having the same shape as the vibrating body 61-1 of the first embodiment.
Further, instead of the case 56-1, a case 517-1 having three concave portions for supporting the vibrating bodies 66-1a, 66-1b, 66-1c is provided.
In the energy conversion mechanism 6-1 of the present embodiment, the number of vibrating bodies and the configuration of the outer diameter shape of the case 517-1 are the same as those of the first embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency of each of the vibrating body 66-1a, the vibrating body 66-1b, and the vibrating body 66-1c is 22 Hz. The maximum displacement amount of each of the body 66-1b and the vibrating body 66-1c was 1.7 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

(Example 18)
As Example 18, an energy conversion mechanism constituted by attaching a heating element different from Example 1 to the energy conversion mechanism 1-1 of Example 1 was produced.
As the heating element 21-1, an LSI having a length of 20 mm, a width of 20 mm, a thickness of 2 mm and a heating value of 40 W was used.
The configuration other than the heating element 21-1 is the same as the configuration of the first embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 21 Hz, and the maximum displacement amount was 2.0 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

(Example 19)
As Example 19, an energy conversion mechanism constituted by attaching a heating element different from Example 1 to the energy conversion mechanism 1-1 of Example 1 was produced.
As the heating element 21-1, an LSI having a height of 30 mm, a width of 30 mm, a thickness of 2 mm, and a heating value of 40 W was used.
The configuration other than the heating element 21-1 is the same as the configuration of the first embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 19 Hz, and the maximum displacement amount was 3.2 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

  From the results of Examples 1, 18 and 19, it was found that even if the heating elements have the same heat generation amount, there are differences in the basic resonance frequency and the vibration displacement amount due to the difference in outer diameter shape. This is considered to be due to the difference in the area where the heat transfer member 31-1 and the heating element contact. Moreover, it is thought that generation | occurrence | production of the boiling bubble 41-1b is activated, so that the outer diameter shape (vertical dimension and horizontal dimension) of a heat generating body is large.

(Example 20)
As Example 20, an energy conversion mechanism configured by changing the shape of the heat transfer member 31-1 of the energy conversion mechanism 1-1 of Example 1 was manufactured. 18A and 18B are diagrams showing the energy conversion mechanism of the present embodiment, in which FIG. 18A is a cross-sectional view showing the energy conversion mechanism of the present embodiment, and FIG. 18B is a plan view showing a heat transfer member in the energy conversion mechanism of the present embodiment. FIG.
As the heat transfer member 31-1, grooves 320-1 extending in parallel with each other were formed at intervals of 0.5 mm on the surface on the side in contact with the liquid 41-1. The size of the region in which the groove 320-1 is formed is a size that overlaps the heating element 21-1 in the thickness direction of the heat transfer member 31-1, and the groove 320-1 is formed in this embodiment. The size of the region is a square shape with a length of 40 mm and a width of 40 mm.
The configuration other than the shape of the heat transfer member 31-1 is the same as the configuration of the first embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 24 Hz, and the maximum displacement amount was 2.8 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.
Furthermore, by forming the grooves 320-1 at intervals of 0.5 mm as described above with respect to the heat transfer member 31-1, the maximum displacement amount in the present embodiment is greater than the maximum displacement amount (2.0mm) in the first embodiment. Increased. This is considered to be because the nucleate boiling of the liquid 41-1 was promoted by processing the surface shape of the heat transfer member.

(Example 21)
As Example 21, an energy conversion mechanism configured by changing the shape of the heat transfer member 31-1 of the energy conversion mechanism 1-1 of Example 1 was manufactured. FIG. 20 is a plan view showing the heat transfer member 31-1 in the energy conversion mechanism of this embodiment. In this example, grooves 321-1 having a different pattern from the grooves 320-1 formed in the heat transfer member 31-1 in Example 20 were formed. Specifically, the grooves 321-1 are formed on the surface of the heat transfer member 31-1 on the side in contact with the liquid 41-1 so as to extend in parallel with each other every 0.2 mm. The size of the region in which the groove 321-1 is formed is a rectangular shape having a length of 40 mm and a width of 40 mm, as in the case of Example 20.
The configuration other than the shape of the heat transfer member 31-1 is the same as the configurations of the first and twenty-first embodiments.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 24 Hz, and the maximum displacement amount was 2.8 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.
Moreover, the result that each of the fundamental resonance frequency and the maximum displacement was the same as that of Example 20 was obtained.

(Example 22)
As Example 22, an energy conversion mechanism configured by changing the shape of the heat transfer member 31-1 of the energy conversion mechanism 1-1 of Example 1 was manufactured. FIG. 21 is a plan view showing the heat transfer member 31-1 in the energy conversion mechanism of the present embodiment. In this example, grooves 322-1 having a different pattern from the grooves 320-1 and 321-1 formed in the heat transfer member 31-1 in the examples 20 and 21 were formed. Specifically, the grooves 322-1 are formed on the surface of the heat transfer member 31-1 on the side in contact with the liquid 41-1 so as to extend in parallel with each other at intervals of 1.0 mm. The size of the region in which the groove 322-1 is formed is a rectangular shape having a length of 40 mm and a width of 40 mm, as in Examples 20 and 21.
The configuration other than the shape of the heat transfer member 31-1 is the same as the configurations of the first and twenty-first embodiments.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 23 Hz, and the maximum displacement amount was 2.6 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.
.

(Example 23)
As Example 23, an energy conversion mechanism configured by changing the shape of the heat transfer member 31-1 of the energy conversion mechanism 1-1 of Example 1 was manufactured. FIG. 22 is a plan view showing the heat transfer member 31-1 in the energy conversion mechanism of this embodiment. In this example, a pattern different from the groove formed in the heat transfer member 31-1 in Example 20 was formed. Specifically, as the heat transfer member 31-1, a concavo-convex shape 323-1 having an interval of 0.1 mm was formed on the surface in contact with the liquid 41-1. The size of the region where the uneven shape 323-1 is formed is a rectangular shape having a length of 40 mm and a width of 40 mm, as in the case of Example 20.
The configuration other than the shape of the heat transfer member 31-1 is the same as the configurations of the first and twenty-first embodiments.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 23 Hz, and the maximum displacement amount was 3.4 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.
.
In addition, the maximum displacement amount in this example increased from the maximum displacement amounts in Examples 21 and 22 in which grooves extending in parallel with each other were formed. This is because the surface area that can be in contact with the liquid is increased compared to the case where the groove is formed by forming the concave / convex shape 323-1 on the surface of the heat transfer member 31-1 that contacts the liquid 41-1. This is considered to be because the efficiency of transferring heat to the liquid 41-1 was improved.

(Example 24)
As Example 24, an energy conversion mechanism configured by changing the shape of the heat transfer member 31-1 of the energy conversion mechanism 1-1 of Example 1 was manufactured. FIG. 23 is a plan view showing the heat transfer member 31-1 in the energy conversion mechanism of the present embodiment. In this example, the uneven shape 324-1 having a different pattern from the uneven shape 323-1 formed on the heat transfer member 31-1 in Example 23 was formed. Specifically, as the heat transfer member 31-1, an uneven shape with an interval of 0.01 mm was formed on the surface in contact with the liquid 41-1. The size of the region in which the uneven shape 324-1 is formed is a rectangular shape having a length of 40 mm and a width of 40 mm, as in the case of Example 20.
The configuration other than the shape of the heat transfer member 31-1 is the same as the configurations of the first and twenty-first embodiments.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 22 Hz, and the maximum displacement amount was 3.2 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.
.

  From the results of Examples 20 to 24, the maximum displacement amount of the vibrating body 61-1 is increased by forming a groove or an uneven shape on the surface of the heat transfer member 31-1 that contacts the liquid 41-1. I understood it. Further, according to the results of Examples 20 to 22, in terms of obtaining larger kinetic energy, the groove interval is preferably 1 mm or less, more preferably 0.5 mm or less, It is further preferable that the distance of is 0.1 mm. Further, according to the results of Example 23 and Example 24, the interval between the concavo-convex shapes is preferably 0.01 mm or more and 0.1 mm or less.

(Example 25)
As Example 25, an energy conversion mechanism configured by changing the material of the heat transfer member 31-1 of the energy conversion mechanism 1-1 of Example 1 was manufactured. In the present embodiment, the material of the heat transfer member 31-1 is copper. The shape of the heat transfer member 31-1 is the same as that of the first embodiment.
The configuration other than the material of the heat transfer member 31-1 is the same as the configuration of the first embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 24 Hz, and the maximum displacement amount was 3.2 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

(Example 26)
As Example 26, an energy conversion mechanism configured by changing the material of the heat transfer member 31-1 of the energy conversion mechanism 1-1 of Example 1 was manufactured. In the present embodiment, the material of the heat transfer member 31-1 is SUS304 stainless steel. The shape of the heat transfer member 31-1 is the same as that of the first embodiment.
The configuration other than the material of the heat transfer member 31-1 is the same as the configuration of the first embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 21 Hz, and the maximum displacement amount was 2.2 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

  From the results of Examples 1, 25, and 26, in the energy conversion mechanism, the heat transfer member 31-1 is preferably made of a metal material, and more preferably made of copper.

(Example 27)
As Example 27, an energy conversion mechanism configured by changing the type of the liquid 41-1 of the energy conversion mechanism 1-1 of Example 1 was manufactured. In this example, a hydrofluoroether refrigerant having a boiling point of 60 ° C. was used as the liquid 41-1.
The configuration other than the type of the liquid 41-1 is the same as that of the first embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 27 Hz, and the maximum displacement amount was 2.3 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

(Example 28)
As Example 28, an energy conversion mechanism configured by changing the type of the liquid 41-1 of the energy conversion mechanism 1-1 of Example 1 was manufactured. In this example, as the liquid 41-1, a hydrofluoroether refrigerant containing an ester lubricant as a lubricant and having a boiling point of 70 ° C was used.
The configuration other than the type of the liquid 41-1 is the same as that of the first embodiment.

In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 24 Hz, and the maximum displacement amount was 2.0 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

(Example 29)
As Example 29, an energy conversion mechanism configured by changing the shape of the vibrating body and the case with respect to the energy conversion mechanism 1-1 of Example 1 was manufactured. FIG. 24 is a cross-sectional view showing the energy conversion mechanism 1-1 of the present embodiment. In the present embodiment, the case 51-1 has one recess for supporting the vibrating body 61-1, and the outer diameter φ1 of the bottom of the recess is 60 mm as shown in FIG. doing.
As the vibrating body 61-1, a urethane film having a diameter of 60 mm and a thickness of 0.1 mm was used.
In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 19 Hz, and the maximum displacement amount was 4.1 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

(Example 30)
As Example 30, an energy conversion mechanism constituted by changing the shape of the vibrating body and the case with respect to the energy conversion mechanism 1-1 of Example 1 and Example 29 was produced. In the present embodiment, the case 51-1 has one recess as in the first and second embodiments, but the outer diameter of the bottom of the recess is 50 mm and the opening has an inner diameter of 46 mm.
As the vibrating body 61-1, a urethane film having a diameter of 50 mm and a thickness of 0.1 mm was used.
In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 20 Hz, and the maximum displacement amount was 4.0 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

(Example 31)
As Example 31, an energy conversion mechanism configured by changing the shape of the vibrating body and the case with respect to the energy conversion mechanism 1-1 of Example 1, Example 29, and Example 30 was manufactured. In the present embodiment, the case 51-1 has one concave portion as in the first, second, and thirtieth embodiments, but the outer diameter of the bottom of the concave portion is 40 mm and the opening has an inner diameter of 36 mm.
As the vibrating body 61-1, a urethane film having a diameter of 40 mm and a thickness of 0.1 mm was used.
In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 22 Hz, and the maximum displacement amount was 3.7 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

(Example 32)
As Example 32, an energy conversion mechanism configured by changing the shape of the vibrating body and the case with respect to the energy conversion mechanism 1-1 of Example 1, Example 29 to Example 31 was manufactured. FIG. 25 is a cross-sectional view showing the energy conversion mechanism 1-1 of the present embodiment. In this embodiment, the case 51-1 has one recess as in the first embodiment and the embodiments 29 to 31, but as shown in FIG. 25, the outer diameter φ2 of the bottom of the recess is 15 mm and the inner diameter is 11 mm. Has an opening.
As the vibrating body 61-1, a urethane film having a diameter of 15 mm and a thickness of 0.1 mm was used.
In the energy conversion mechanism having the above configuration, as shown in FIG. 27, the basic resonance frequency was 22 Hz, and the maximum displacement amount was 3.1 mm. Furthermore, the results of good energy conversion efficiency, cooling performance and reliability were obtained.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

(Example 33)
As Example 33, the energy conversion mechanism 7-1 of the seventh embodiment was configured in the following shape (see FIG. 11).
The same LSI as in Example 1 was used as the heating element 21-1.
As the heat transfer member 31-1, an aluminum plate having the same shape and size as in Example 1 was used.
As the liquid 41-1, the same hydrofluoroether refrigerant as in Example 1 was used.
As the case 51-1, an acrylic case having the same shape and size as in Example 1 was used.
As the vibrating body 67-1, the same vibrating body as the vibrating body 64-1 of Example 12 was used.
The same displacer as the displacer 84-1 of Example 12 was used as the displacer 87-1.
As crank 97-1, what formed the crank shape by bending a bar was used.
As the rotating body 97-2, a fan having a resin propeller structure was used by being bonded and fixed to the rotating shaft 97-1a of the crank 97-1.

In the energy conversion mechanism having the above configuration, the displacer 87-1 is driven forward and backward after the heating element 21-1 starts to generate heat, the crank 97-1 rotates, and the rotating body 97-2 rotates.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.

(Example 34)
As Example 34, an energy conversion mechanism in which the energy conversion mechanism of Example 33 was further provided with a heat exchanger 71-1 was configured. FIG. 26 is a partial cross-sectional view showing the energy conversion mechanism of this embodiment. In the present example, the heat exchanger 71-1 has a flow path that communicates with the inside of the case 51-1, as described in the first embodiment.
Further, as the rotating body 97-2, a blower fan capable of blowing air toward the heat exchange fins 71-1a of the heat exchanger 71-1 was used.
Except for the provision of the heat exchanger 71-1 and the configuration of the rotating body 97-2, the configuration is the same as the configuration of the energy conversion mechanism of Example 33.

In the energy conversion mechanism having the above-described configuration, the displacer 87-1 is driven forward and backward after the heating element 21-1 starts to generate heat, the crank 97-1 rotates, the rotating body 97-2 rotates, and the heat exchanger 71-. Air was blown onto one heat exchange fin.
As described above, it was found that the energy conversion mechanism of the present embodiment can also convert energy from thermal energy to kinetic energy in the same manner as the energy conversion mechanism shown in the first embodiment.
Furthermore, the liquid 41-1 repeated vaporization and condensation, and the continuous cooling effect to a heat-emitting component was recognized. Moreover, in the energy conversion mechanism of the present embodiment, the energy consumption can be reduced by 2 W compared to the conventional case where the rotating body 97-2 is rotated by another power such as a motor. That is, it was found that when the energy conversion mechanism of this example is mounted on, for example, an electronic device, the total energy consumed by the electronic device can be reduced.

(Example 35)
As Example 35, a laptop personal computer (not shown), which is an electronic device equipped with the energy conversion mechanism 1-1 of Example 1, was produced.
As shown in FIG. 27, the electronic device having the above-described configuration has a result that the energy conversion efficiency, the cooling performance, and the reliability are all good.
Thus, it was found that by providing the laptop personal computer with the energy conversion mechanism of Example 1, heat can be suitably radiated even in a laptop personal computer with a low degree of freedom in the heat dissipation path.

(Example 36)
As Example 36, a server (not shown), which is an electronic device equipped with the mechanism of Example 1, was produced.
As shown in FIG. 27, the electronic device having the above-described configuration has a result that the energy conversion efficiency, the cooling performance, and the reliability are all good.
As described above, it was found that by providing the server with the energy conversion mechanism of Example 1, it is possible to suitably radiate heat even in a server that generates a large amount of heat. Further, it is considered that heat can be suitably radiated also in, for example, a rack mount type blade server configured with high density.

  Below, the case where the energy conversion mechanism of this invention is not used is demonstrated as the comparative example 1 thru | or the comparative example 3. FIG.

(Comparative Example 1)
As Comparative Example 1, a forced air cooling mechanism was created. In this comparative example, a blower fan that blows outside air (50 ° C.) to the heating element 21-1 was used, and the flow rate of outside air was 1 m / S.
In this comparative example, the cooling of the heating element 21-1 was insufficient, which adversely affected the operation of the LSI that is the heating element.

(Comparative Example 2)
As Comparative Example 2, a mechanism shown by a water cooling method was created. In this comparative example, as a water cooling method, a known water cooling device including a water cooling head for cooling a semiconductor device or the like was adopted, and the water cooling head was attached to the heating element 21-1.
In this comparative example, the cooling of the heating element 21-1 was insufficient, which adversely affected the operation of the LSI that is the heating element.

(Comparative Example 3)
As Comparative Example 3, the laptop computer which is the electronic device of Example 35 was driven by the natural air cooling method of Comparative Example 1.
In this comparative example, the laptop computer malfunctioned shortly after the laptop computer was started.

The embodiment of the present invention has been described in detail with reference to the drawings and examples. However, the specific configuration is not limited to this embodiment, and the design can be changed without departing from the gist of the present invention. Is also included.
For example, any of the energy conversion mechanisms described in the first to seventh embodiments and Examples 1 to 36 described above can be used as a boiling cooler for cooling a heating element.
In addition, the constituent elements shown in the above-described embodiment and examples can be combined as appropriate.

1-1, 2-1, 3-1, 4-1, 5-1, 6-1, 7-1 Energy conversion mechanism 21-1, 25-1a, 25-1b Heating element 31-1, 35-1a , 35-1b heat transfer member 41-1 liquid 51-1, 53-1, 54-1, 57-1 case 61-1, 62-1, 64-1, 66-1 a vibrator 71-1 heat exchanger 84-1, 87-1 Displacer 97-2 Rotating body

Claims (14)

A case the boiling liquid is Ru housed inside by being heated,
A heat transfer member joined to the case so as to be in contact with the liquid and having thermal conductivity;
A vibrating body that is joined to the case so as to come into contact with the liquid, and is arranged to be able to collide with bubbles generated by boiling the liquid due to heat transferred from the heat transfer member;
Equipped with a,
The vibrating member, the energy conversion mechanism characterized that you vibration by the bubbles collide.   The energy conversion mechanism according to claim 1, wherein the vibration body is set to have a lower rigidity than the case.   3. The energy conversion mechanism according to claim 1, wherein the vibrating body is one of urethane, polyethylene terephthalate, polyethylene film, and natural rubber.   4. The energy conversion mechanism according to claim 1, wherein the vibrating body has a piezoelectric characteristic. 5.   5. The energy conversion mechanism according to claim 1, wherein the vibrating body is disposed to face the heat transfer member with the liquid interposed therebetween.   The vibration enlarging mechanism that is elastically deformable along the direction in which the vibrating body vibrates is interposed between the case and the vibrating body. The energy conversion mechanism described.   The energy conversion mechanism according to claim 6, wherein the vibration enlarging mechanism is formed in a bellows shape.   The energy conversion mechanism according to any one of claims 1 to 7, wherein the vibrating body includes a displacer having one end joined to the vibrating body and capable of moving back and forth in a vibration direction of the vibrating body. .   9. The energy conversion mechanism according to claim 8, further comprising a crank mechanism that is connected to the displacer and changes a forward / backward movement of the displacer to a rotation operation.   The energy conversion mechanism according to claim 1, comprising a plurality of the heat transfer members.   The energy conversion mechanism according to claim 1, wherein the energy conversion mechanism includes a plurality of the vibrating bodies.   The case has a recess in which the vibrating body is accommodated,
  The vibrating body has a lower surface in contact with the liquid and an upper surface located on the opposite side of the one surface, and in the recess, a curved state that is convex in the upper surface direction and a convex in the lower surface direction. The energy conversion mechanism according to any one of claims 1 to 11, wherein the energy conversion mechanism can vibrate by alternately repeating the curved state. Boiling cooler, characterized in that it comprises an energy conversion mechanism as claimed in any one of claims 1 to 1 2. Characterized in that it comprises an energy conversion mechanism as claimed in any one of claims 1 to 1 2, the electronic device.

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