JP2021063645A - Liquid agitation structure, ebullition cooling device, and electronic apparatus - Google Patents

Abstract

To provide a liquid agitation structure that can efficiently agitate liquid.SOLUTION: An ebullition cooling device 10 has a container 14 that stores a coolant 12, and a diaphragm 20. The diaphragm 20 is provided in the container 14. The coolant 12 is heated to generate bubbles B, which impinge on the diaphragm 20, so that the diaphragm 20 vibrates in the coolant 12 to agitate the coolant 12.SELECTED DRAWING: Figure 1

Description

The present invention relates to a liquid stirring structure, a boiling cooling device, and an electronic device.

There is a boiling cooling device that cools the object to be cooled using a liquid (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2008-147482

A cooling device using the boiling phenomenon of a liquid can improve the stirring efficiency of the liquid to some extent by boiling the liquid to generate bubbles, as compared with the case where no bubbles are generated, but the stirring efficiency is further improved. It is hoped that it will be improved.

In consideration of the above facts, an object of the present invention is to provide a liquid stirring structure capable of efficiently stirring a liquid, a boiling cooling device, and an electronic device.

The liquid agitation structure according to claim 1 is provided in a container for storing a liquid and the container, and when the liquid is heated and hits with bubbles generated, it vibrates in the liquid to agitate the liquid. It has a vibrating body.

In the liquid stirring structure according to claim 1, when the liquid is heated and the generated bubbles hit the vibrating body, the vibrating body vibrates and the liquid is agitated. Therefore, the stirring efficiency is improved as compared with the case where the liquid is stirred only with bubbles.

According to the second aspect of the present invention, in the liquid stirring structure according to the first aspect, the vibrating body is formed of an elastically deformable plate material and is supported by a support portion provided in the container.

In the liquid stirring structure according to claim 2, the plate material is supported at a fixed position by the support portion. The plate material is elastically deformed and vibrates, and the liquid is agitated.

In the invention according to claim 3, in the liquid stirring structure according to claim 2, one end of the plate material is supported by the support portion.

In the liquid agitator according to claim 3, since the plate material elastically deforms and vibrates while being cantilevered by the support portion, a large amplitude can be obtained.

The invention according to claim 4 is provided with an adjusting mechanism for adjusting the length of the plate material protruding from the support portion in the liquid stirring structure according to claim 3.

In the liquid agitator according to claim 4, the natural frequency of the vibrating body can be adjusted so that the plate material resonates according to the interval (cycle) at which the air bubbles hit and separate from the plate material. As a result, the plate material vibrates greatly and the amplitude becomes large, and the stirring efficiency is improved.

According to the fifth aspect of the present invention, in the liquid stirring structure according to the first aspect, the vibrating body is supported by a support portion provided in the container via an elastic body.

In the liquid agitator according to claim 5, the diaphragm is supported by an elastic body, and the liquid is agitated by vibrating the diaphragm supported by the elastic body. When the diaphragm itself is difficult to be elastically deformed, it is effective to support it with an elastic body.

According to the sixth aspect of the present invention, in the liquid stirring structure according to any one of claims 1 to 5, a gap through which the liquid enters is provided between the vibrating body and the container. ing.

In the liquid agitator according to claim 6, by providing a gap between the vibrating body and the container and allowing the liquid to enter, the liquid in the gap is easily boiled to generate bubbles.

The boiling cooling device according to claim 7 heats the refrigerant with a container for storing the refrigerant and a cooled body which is provided in the container and is a cooling target in contact with the container to generate bubbles. It has a vibrating body that vibrates in the refrigerant when hit by air bubbles and agitates the refrigerant.

In the boiling cooling device according to claim 7, when the refrigerant is heated and the generated bubbles hit the vibrating body, the vibrating body vibrates and the refrigerant is agitated. Therefore, the stirring efficiency is improved as compared with the case where the refrigerant is agitated only with bubbles. Further, by stirring the refrigerant, the temperature bias of the refrigerant can be suppressed in the container, and the cooling efficiency can be improved.

The invention according to claim 8 is the boiling cooling device according to claim 7, wherein the container stores the refrigerant in a closed state.

In the boiling cooling device according to claim 8, since the container for storing the refrigerant is sealed, evaporation of the refrigerant can be suppressed.

According to the invention of claim 9, in the boiling cooling device according to claim 8, the container is provided with a pressure fluctuation absorbing device that absorbs fluctuations in the internal pressure of the container.

In the boiling cooling device according to claim 9, when the container is not elastically deformed, the pressure fluctuation absorbing device absorbs the pressure increased due to the generation of bubbles.

The invention according to claim 10 is the boiling cooling device according to claim 9, wherein the pressure fluctuation absorbing device is a bellows.

In the boiling cooling device according to claim 10, the bellows expands and contracts to absorb the pressure fluctuation in the container.

The invention according to claim 11 is the boiling cooling device according to any one of claims 7 to 10, wherein the container has heat that enables heat exchange between the refrigerant and the outside of the container. An exchange part is provided.

In the boiling cooling device according to claim 11, the heat of the refrigerant heated by the object to be cooled can be dissipated to the outside of the container via the heat exchange section, and the temperature rise of the refrigerant can be suppressed.

According to a twelfth aspect of the present invention, in the boiling cooling device according to any one of claims 7 to 11, the boiling point of the refrigerant is lower than the preset upper limit temperature of heat generation of the object to be cooled. It is set.

In the boiling cooling device according to claim 10, by setting the boiling point of the refrigerant to be lower than the preset upper limit temperature of heat generation of the body to be cooled, it is possible to prevent the body to be cooled from becoming higher than the upper limit temperature of heat generation.

The invention according to claim 13 is the boiling cooling device according to any one of claims 7 to 12, wherein the cooled body is a nuclear reactor.

The boiling cooling device according to claim 13 can be used to cool a nuclear reactor without using energy.

The electronic device according to claim 14 includes the boiling cooling device according to any one of claims 7 to 12, and an electronic component as a body to be cooled.

The electronic device according to claim 14 can efficiently cool the electronic components of the electronic device without using electric power.

The invention according to claim 15 is the liquid stirring structure according to any one of claims 1 to 6, wherein the vibrating body is a power generation member that generates electricity by vibration.

In the liquid stirring structure according to claim 15, since the vibrating body is a power generation member that generates electric power by vibration, electric power can be obtained from the power generation member by vibrating the vibrating body. The obtained electric power can be used in an electric power-using device or stored in a storage battery for use.

The invention according to claim 16 is the boiling cooling device according to any one of claims 7 to 13, wherein the vibrating body is a power generation member that generates electricity by vibration.

In the boiling cooling device according to claim 16, since the vibrating body is a power generation member that generates electric power by vibration, electric power can be obtained from the power generation member by vibrating the vibrating body. The obtained electric power can be used in an electric power-using device or stored in a storage battery for use.

The invention according to claim 17 is the electronic device according to claim 14, wherein the vibrating body is a power generation member that generates electricity by vibration.

In the electronic device according to claim 17, since the vibrating body is a power generation member that generates electric power by vibration, electric power can be obtained from the power generation member by vibrating the vibrating body. The obtained electric power can be used in an electronic device, used in a power-using device other than the electronic device, or stored in a storage battery for use.

The invention according to claim 18 includes a power generation member that generates electricity by vibrating the vibrating body in the liquid stirring structure according to any one of claims 1 to 6.

In the liquid stirring structure according to claim 18, electric power can be obtained from the power generation member by vibrating the vibrating body. The obtained electric power can be used in an electric power-using device or stored in a storage battery for use.

The invention according to claim 19 includes a power generation member that generates electricity by vibrating the vibrating body in the boiling cooling device according to any one of claims 7 to 13.

In the boiling cooling device according to claim 19, electric power can be obtained from a power generation member by vibrating the vibrating body. The obtained electric power can be used in an electric power-using device or stored in a storage battery for use.

The invention according to claim 20 includes a power generation member that generates electricity by vibrating the vibrating body in the electronic device according to claim 14.

In the electronic device according to claim 20, electric power can be obtained from a power generation member by vibrating the vibrating body. The obtained electric power can be used in an electronic device, used in a power-using device other than the electronic device, or stored in a storage battery for use.

As described above, the liquid stirring structure of the present invention can efficiently stir the liquid.
The boiling cooling device of the present invention can efficiently cool the object to be cooled.
In addition, the electronic device of the present invention can efficiently cool electronic components.

It is sectional drawing which shows the main part of the electronic device provided with the boiling cooling device which concerns on 1st Embodiment. It is a top view which shows the bottom part of the boiling cooling apparatus which concerns on 1st Embodiment. It is sectional drawing which shows the main part of the electronic device provided with the boiling cooling device which concerns on 2nd Embodiment. It is sectional drawing which shows the main part of the electronic device provided with the boiling cooling device which concerns on 3rd Embodiment. It is sectional drawing which shows the main part of the electronic device provided with the boiling cooling device which concerns on 4th Embodiment. It is sectional drawing which shows the main part of the electronic device provided with the boiling cooling device which concerns on 5th Embodiment. It is sectional drawing which shows the main part of the electronic device provided with the boiling cooling device which concerns on 6th Embodiment. It is sectional drawing which shows the main part of the electronic device provided with the boiling cooling device which concerns on 7th Embodiment. It is sectional drawing which shows the main part of the electronic device provided with the boiling cooling device which concerns on 8th Embodiment. (A) is a cross-sectional view showing a main part of an electronic device provided with a boiling cooling device according to a ninth embodiment, and (B) is a plan view showing a diaphragm. (A) is a cross-sectional view showing a main part of an electronic device provided with a boiling cooling device according to a tenth embodiment, and (B) is a perspective view showing a guide cylinder. It is sectional drawing which shows the main part of the boiling cooling apparatus which concerns on eleventh embodiment. It is sectional drawing which shows the main part of the electronic device provided with the boiling cooling device which concerns on another embodiment. It is sectional drawing which shows the main part of the electronic device provided with the boiling cooling device which concerns on 12th Embodiment. It is sectional drawing which shows the main part of the electronic device provided with the boiling cooling device which concerns on 13th Embodiment. It is sectional drawing which shows the main part of the electronic device provided with the boiling cooling device which concerns on 14th Embodiment. FIG. 5 is a cross-sectional view showing a main part of an electronic device provided with a boiling cooling device according to a fifteenth embodiment. It is sectional drawing which shows the main part of the electronic device provided with the boiling cooling device which concerns on 16th Embodiment. It is sectional drawing which shows the main part of the electronic device provided with the boiling cooling device which concerns on 17th Embodiment.

[First Embodiment]
The boiling cooling device 10 according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2.

As shown in FIG. 1, the boiling cooling device 10 includes a container 14 in which a liquid refrigerant 12 is stored. The inside of the container 14 is hermetically sealed. The container 14 is preferably formed of a metal material having excellent thermal conductivity, and examples of the metal material include aluminum, copper, stainless steel, and the like, but other metal materials. It may be a ceramic material other than a metal material, for example.

The container 14 of the present embodiment has a rectangular box shape as an example, but the shape, size, capacity, etc. of the container 14 are not particularly limited, and the size and heat generation of the electronic component 16 as a cooled body to be described later are not particularly limited. It is set appropriately according to the amount and the like.

Although water is used as the refrigerant 12 stored in the container 14 in this embodiment, other liquids such as methanol, acetone, and fluorocarbon can be used in addition to water.

An electronic component 16 as a body to be cooled is attached to the outer surface of the bottom portion 14A of the container 14. As an example, the electronic component 16 generates heat such as an LSI, an IC, a CPU, an MPU, a transistor, a diode, a resistor, a capacitor, and a coil, but the electronic component 16 is not limited to these and may be another electronic component. In order to improve the thermal conductivity between the bottom 14A of the container 14 and the electronic component 16, a highly thermally conductive paste or adhesive is interposed between the bottom 14A of the container 14 and the electronic component 16. It is preferable to keep it.

In the present embodiment, as an example, as shown in FIG. 2, an electronic component 16 having a rectangular (square) shape in a plan view is attached to the bottom portion 14A. The plan view shape of the electronic component 16 is not limited to a rectangle, and may be another shape such as a circle, and the plan view shape is not particularly limited.

As shown in FIG. 1, the electronic component 16 of the present embodiment is mounted on the substrate 18, but the electronic component 16 may not be mounted on the substrate 18. The electronic component 16 and the substrate 18 of the present embodiment correspond to the electronic device of the present invention.

A diaphragm 20 for stirring the refrigerant 12 is provided inside the container 14.
A rectangular pedestal 22 is attached to the bottom 14A of the container 14, and one end of the diaphragm 20 is fixed to the pedestal 22. In other words, the diaphragm 20 is cantilevered with respect to the pedestal 22.

Fixing of the pedestal 22 and the bottom 14A and fixing of the pedestal 22 and the diaphragm 20 may be selected according to the material such as screwing, adhesive, brazing, soldering, welding, caulking, etc., and the fixing method Is not particularly limited.

The pedestal 22 of the present embodiment has a rectangular shape in a plan view, but the shape of the pedestal 22 is not particularly limited. The pedestal 22 may support the diaphragm 20. The pedestal 22 can be formed of a metal material, a synthetic resin material, ceramics, or the like as an example, but it may be formed of another material, and it is preferable that the pedestal 22 does not deteriorate due to reaction with a refrigerant or corrosion.

The diaphragm 20 of the present embodiment is a flat plate, and as an example, the shape in a plan view is rectangular, but other shapes may be used. The diaphragm 20 of the present embodiment is formed of a thin metal plate or the like so as to be easily bent and deformed, but may be formed of a material other than a metal plate such as a synthetic resin plate, and may react with a refrigerant or corrode. It is preferable that it does not deteriorate due to equalization.

One end of the diaphragm 20 is fixed to the pedestal 22, and the remaining portion not fixed to the pedestal 22 is arranged above the electronic component 16.

The diaphragm 20 is arranged parallel to the pedestal 22 with respect to the bottom portion 14A with a slight gap S.

The heat radiation fins 24 are integrally formed on the ceiling portion 14B of the container 14. The heat radiation fin 24 may be formed on the side wall portion 14C of the container 14.

A through hole 26 is formed in the side wall portion 14C of the container 14, and a metal bellows 28 is attached to the side wall portion 14C on the outside of the through hole 26. The bellows 28 absorbs pressure fluctuations in the container by expanding and contracting.

(Action, effect)
Next, the operation and effect of the boiling cooling device 10 will be described.
The heat generated by the electronic component 16 is transferred to the refrigerant 12 via the bottom 14A. Due to the heat transferred from the electronic component 16, the portion of the bottom 14A in contact with the electronic component 16, that is, the heat generating surface 30, becomes hot, and when the refrigerant 12 near the heat generating surface 30 reaches the boiling point, the refrigerant 12 near the heat generating surface 30 Boils and innumerable bubbles B are generated.

The boiling includes saturated boiling (the liquid temperature has reached the saturation temperature) and subcool boiling (the liquid temperature is lower than the saturation temperature), and any boiling form may be used. However, in general, subcool boiling is more difficult for coalesced bubbles to grow and has higher cooling performance.

Innumerable bubbles B are continuously generated between the heat generating surface 30 and the diaphragm 20, innumerable bubbles B hit the diaphragm 20 one after another, and then rise in the container, and innumerable bubbles B rise. As a result, convection is generated in the refrigerant 12 in the container, and the refrigerant 12 is agitated to some extent by this convection.

Further, in the boiling cooling device 10 of the present embodiment, for example, as shown by the two-point chain line in FIG. 1, the diaphragm 20 vibrates (here, the primary vibration that bends and deforms with the pedestal 22 as a fulcrum is shown). Since the refrigerant 12 is agitated, the agitation efficiency of the refrigerant 12 can be improved and the cooling efficiency can be improved as compared with the case where only the agitation accompanying the rise of the bubbles B is performed.

When the diaphragm 20 vibrates, the refrigerant 12 flows from the tip of the diaphragm 20 in the direction opposite to the pedestal 22 (discharge of liquid) and the side of the diaphragm 20, for example, as shown by the arrow A in FIG. A flow (supply of liquid) is generated from the direction toward the diaphragm 20. Further, due to the vibration of the diaphragm 20 and the flow of the refrigerant 12, the bubbles B generated in the gap S between the heat generating surface 30 and the diaphragm 20 are efficiently removed from the gap S. As a result, the contact between the heat generating surface 30 and the refrigerant 12 becomes good, the heat transfer from the heat generating surface 30 to the refrigerant 12 is improved, the cooling efficiency is improved, and so-called burnout is suppressed.

When the temperature of the refrigerant 12 rises, the volume of the refrigerant 12 increases. However, in the boiling cooling device 10 of the present embodiment, the volume fluctuation of the refrigerant 12 can be absorbed by the deformation of the bellows 28, and the container 14 Fluctuations in the internal pressure of the

Further, in the boiling cooling device 10 of the present embodiment, since the refrigerant 12 is contained in the closed container 14, the evaporation of the refrigerant 12 is suppressed.

In the boiling cooling device 10 of the present embodiment, the diaphragm 20 is vibrated by the generated bubbles B to agitate the refrigerant 12 without using an electric pump, a stirrer, or the like, so that the structure can be extremely simplified. Further, since it is not necessary to use energy such as electric power when stirring the refrigerant 12, energy saving is achieved.

In the present embodiment, it has been described that the diaphragm 20 vibrates by hitting the continuously generated bubbles B against the diaphragm 20, but the situation of the bubble B generation (for example, the generation, disappearance, or separation of the bubble B) By adjusting the mass, spring constant, size, etc. of the diaphragm 20 at the same time, the diaphragm 20 can be made to resonate when the bubble B is generated.

By resonating the diaphragm 20, the amplitude of the vibrating diaphragm 20 can be increased as compared with the case where the diaphragm 20 does not resonate, whereby the stirring efficiency of the refrigerant 12 can be improved.
There are a plurality of modes of resonance such as primary, secondary, and tertiary, but first-order resonance that can take a large amplitude is preferable.

When the diaphragm 20 is resonated, it is preferably formed of a material whose spring multiplier is unlikely to change due to a temperature change of the refrigerant 12, for example, a metal material.

The heat of the refrigerant 12 can be discharged to the outside of the container through the container 14 and the heat radiation fins 24.

The pedestal 22 may be formed of an elastic body such as rubber to facilitate the movement of the diaphragm 20.

The diaphragm 20 of the present embodiment has a flat flat plate shape, but the diaphragm 20 may be curved or three-dimensionally formed as long as it can vibrate and agitate the refrigerant 12. Good.

Further, although the diaphragm 20 is provided parallel to the heat generating surface 30, the diaphragm 20 may not be provided parallel to the heat generating surface 30 as long as it can vibrate and agitate the refrigerant 12. ..

Further, by setting the boiling point of the refrigerant 12 to be lower than the preset upper limit temperature of heat generation of the electronic component 16, it is possible to prevent the electronic component 16 from becoming higher than the upper limit temperature of heat generation.

[Second Embodiment]
The boiling cooling device 10 according to the second embodiment of the present invention will be described with reference to FIG. The same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
As shown in FIG. 3, in the boiling cooling device 10 of the present embodiment, the electronic component 16 is attached to the bottom portion 14A inside the container.

(Action, effect)
In the present embodiment, since the heat of the electronic component 16 is directly transferred to the refrigerant 12, the cooling efficiency can be improved as compared with the case where the heat is indirectly transferred via the bottom 14A.
The other actions and effects are the same as those in the first embodiment.

[Third Embodiment]
The boiling cooling device 10 according to the third embodiment of the present invention will be described with reference to FIG. The same components as those in the above-described embodiment are designated by the same reference numerals, and the description thereof will be omitted.
As shown in FIG. 4, in the boiling cooling device 10 of the present embodiment, both end portions of the diaphragm 20 are supported by the pedestal 22.

(Action, effect)
As shown by the alternate long and short dash line, the diaphragm 20 of the present embodiment has a vibration form in which the central portion of the diaphragm 20 is alternately convex upward and downward.
Even in the diaphragm 20 in which both sides are supported as in the present embodiment, the diaphragm 20 can be vibrated by the bubbles B.
The other actions and effects are the same as those in the first embodiment.

[Fourth Embodiment]
The boiling cooling device 10 according to the fourth embodiment of the present invention will be described with reference to FIG. The same components as those in the above-described embodiment are designated by the same reference numerals, and the description thereof will be omitted.
As shown in FIG. 5, in the boiling cooling device 10 of the present embodiment, the corrugated spring portion 20A is formed in the inner portion of the diaphragm 20 than the joint portion between the diaphragm 20 and the pedestal 22. ..
By forming a part of the diaphragm 20 in a corrugated shape, the spring multiplier can be reduced, and the diaphragm 20 between the spring portion 20A and the spring portion 20A can be easily vibrated up and down.
The other actions and effects are the same as those in the third embodiment.

[Fifth Embodiment]
The boiling cooling device 10 according to the fifth embodiment of the present invention will be described with reference to FIG. The same components as those in the above-described embodiment are designated by the same reference numerals, and the description thereof will be omitted.
As shown in FIG. 6, in the boiling cooling device 10 of the present embodiment, the central portion of the diaphragm 20 is supported by the pedestal 22.

(Action, effect)
In the boiling cooling device 10 of the present embodiment, since both sides of the diaphragm 20 are bent and deformed to vibrate with the pedestal 22 as a fulcrum, convection (arrow A) can be generated on both sides of the diaphragm 20.
The other actions and effects are the same as those in the first embodiment.

[Sixth Embodiment]
The boiling cooling device 10 according to the sixth embodiment of the present invention will be described with reference to FIG. 7. The same components as those in the above-described embodiment are designated by the same reference numerals, and the description thereof will be omitted.
As shown in FIG. 7, in the boiling cooling device 10 of the present embodiment, a support arm 34 extending in the lateral direction is attached to the upper surface of the pedestal 22, and the support arm 34 vibrates via a coil spring 36. The plate 38 is suspended.

The diaphragm 38 is arranged parallel to the heat generating surface 30, and a gap S is formed between the diaphragm 38 and the heat generating surface 30.

(Action, effect)
In the present embodiment, when the bubble B hits the diaphragm 38, the diaphragm 38 suspended by the coil spring 36 vibrates up and down to agitate the refrigerant 12.

In the present embodiment, by adjusting the mass and size of the diaphragm 38, the spring constant of the coil spring 36, and the like, the diaphragm 38 can be made to resonate when the bubble B is generated.

Further, since the diaphragm 38 of the present embodiment is supported by the coil spring 36 and vibrates, it does not have to be bent and deformed like the diaphragm 20 of the first embodiment. Therefore, the diaphragm 38 of the present embodiment does not have to be formed as thin as the diaphragm 20 of the first embodiment.
The other actions and effects are the same as those in the first embodiment.

[7th Embodiment]
The boiling cooling device 10 according to the seventh embodiment of the present invention will be described with reference to FIG. The same components as those in the above-described embodiment are designated by the same reference numerals, and the description thereof will be omitted.
As shown in FIG. 8, in the boiling cooling device 10 of the present embodiment, the electronic component 16 is attached to the bottom portion 14A of the container 14.
The diaphragm 38 is supported by the upper end of the coil spring 40 attached to the bottom 14A of the container 14, and is arranged on the upper side of the electronic component 16 via the gap S.

(Action, effect)
In the present embodiment, when the bubble B hits the diaphragm 38, the diaphragm 38 supported from below by the coil spring 40 vibrates up and down to agitate the refrigerant 12.
In the present embodiment, by adjusting the mass and size of the diaphragm 38, the spring multiplier of the coil spring 40, and the like, the diaphragm 38 can be made to resonate when the bubble B is generated.
The other actions and effects are the same as those in the first embodiment.

[8th Embodiment]
The boiling cooling device 10 according to the eighth embodiment of the present invention will be described with reference to FIG. The same components as those in the above-described embodiment are designated by the same reference numerals, and the description thereof will be omitted.
The boiling cooling device 10 of the present embodiment is a modification of the first embodiment, in which the diaphragm 20 and the pedestal 22 described in the first embodiment are integrally formed, for example, the thickness. It can be formed by cutting a metal plate of meat.
The other actions and effects are the same as those in the first embodiment.

[9th Embodiment]
The boiling cooling device 10 according to the ninth embodiment of the present invention will be described with reference to FIG. The same components as those in the above-described embodiment are designated by the same reference numerals, and the description thereof will be omitted.
As shown in FIG. 10, the boiling cooling device 10 of the present embodiment is a modification of the third embodiment, and the diaphragm 20 is attached to the pedestal 22 by using a screw 42.
The diaphragm 20 is formed with a pair of elongated holes 44 through which the screws 42 are inserted, and by loosening the screws 42, the length L of the diaphragm 20 protruding from the pedestal 22 is adjusted (in the direction of arrow B). Can be done.

(Action, effect)
In the present embodiment, by adjusting the length L of the diaphragm 20 protruding from the pedestal 22, the spring multiplier and the mass of the vibrating portion of the diaphragm 20 can be adjusted, whereby the uniqueness of the diaphragm 20 can be adjusted. The frequency can be adjusted.

Therefore, in the boiling cooling device 10 of the present embodiment, the natural frequency of the diaphragm 20 can be adjusted according to the generated bubbles B so that the diaphragm 20 vibrates greatly, and the stirring efficiency can be improved. it can.
The other actions and effects are the same as those in the first embodiment.

[10th Embodiment]
The boiling cooling device 10 according to the tenth embodiment of the present invention will be described with reference to FIGS. 11A and 11B. The same components as those in the above-described embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 11A, in the boiling cooling device 10 of the present embodiment, the vibrating body 46 is placed on the heat generating surface 30 of the bottom 14A of the container 14.

Further, a protrusion 48 is formed on the lower surface of the vibrating body 46, and the protrusion 48 forms a gap S between the lower surface of the vibrating body 46 and the heat generating surface 30.

As shown in FIGS. 11A and 11B, the vibrating body 46 of the present embodiment has a thick disk shape, and a guide cylinder 50 is provided on the outside of the vibrating body 46 so as to surround the vibrating body 46. Is provided on the bottom 14A.

The guide cylinder 50 includes a cylinder main body 52 having a plurality of openings 52A formed therein, and a ring-shaped stopper 54 projecting inward in the radial direction is provided at the upper end of the tubular main body 52.

A gap S2 is provided between the tubular portion main body 52 and the vibrating body 46, and the vibrating body 46 is movable in the vertical direction inside the tubular portion main body 52.

Further, the inner diameter of the stopper 54 is smaller than the outer diameter of the vibrating body 46, and a coil spring 55 for urging the vibrating body 46 downward is arranged between the stopper 54 and the vibrating body 46.

Here, when the lower surface of the vibrating body 46 and the heat generating surface 30 are in close contact with each other, the refrigerant 12 does not enter between the vibrating body 46 and the heat generating surface 30, and air bubbles are generated between the vibrating body 46 and the heat generating surface 30. May not be able to be generated. Therefore, it is preferable to provide the protrusion 48 that separates the vibrating body 46 and the heat generating surface 30.

(Action, effect)
In the boiling cooling device 10 of the present embodiment, innumerable bubbles (not shown) are continuously generated between the heat generating surface 30 and the vibrating body 46 and hit the vibrating body 46 one after another, so that the vibrating body 46 moves up and down. The refrigerant 12 is agitated by vibrating (repeating upward movement by being pressed by air bubbles and downward movement by the coil spring 55). In the present embodiment, the vibrating body 46 can be resonated by adjusting the mass of the vibrating body 46 and the spring constant of the coil spring 55.
The other actions and effects are the same as those in the first embodiment.

[11th Embodiment]
The boiling cooling device 10 according to the eleventh embodiment of the present invention will be described with reference to FIG. The same components as those in the above-described embodiment are designated by the same reference numerals, and the description thereof will be omitted.
In the boiling cooling device 10 of the present embodiment, a dome-shaped film body 56 is provided above the heat generating surface 30 of the container 14. The periphery of the film body 56 is fixed to the bottom 14A of the container 14.

The film body 56 is made of a synthetic resin film or the like, and a plurality of through holes 58 penetrating the inside and outside are formed. The film body 56 maintains a dome shape in a free state.

(Action, effect)
In the boiling cooling device 10 of the present embodiment, the bubbles B continuously generated on the heat generating surface 30 hit the film body 56 one after another, so that the film body 56 can be vibrated and the refrigerant 12 can be agitated. The bubbles B and the refrigerant 12 can move between the inside and the outside of the film body 56 through the through holes 58.

[Other Embodiments]
Although the embodiment of the liquid stirring structure of the present invention has been described above, the present invention is not limited to the above, and other than the above, various modifications can be made within a range not deviating from the gist thereof. Of course.

In the above embodiment, as an example, in the first embodiment (the same applies to other embodiments), a configuration in which one electronic component 16 is cooled by one boiling cooling device 10 has been described. For example, as shown in FIG. In addition, one boiling cooling device 10 may cool a plurality of electronic components 16.

In the above embodiment, the bellows 28 is connected to the container 14 in order to absorb the pressure fluctuation of the container 14, but the pressure fluctuation absorbing device for absorbing the pressure fluctuation is not limited to the bellows 28 and absorbs the pressure. It may be an accumulator.

In the above embodiment, the bellows 28 is connected to the container 14 in order to absorb the pressure fluctuation of the container 14, but the bellows 28 may be provided as needed, and the bellows 28 may not be provided. For example, the container 14 may be formed of a thin metal plate or the like, and the wall of the container 14 may be deformed to absorb internal pressure fluctuations.

In the above embodiment, the electronic component 16 is attached to the bottom 14A of the container 14, but if the diaphragm 20 can vibrate, the electronic component 16 may be attached to the side wall of the container 14 to correspond to the electronic component 16. The diaphragm 20 may be arranged on the side wall.

In the above embodiment, an example in which the electronic component 16 is cooled by using the boiling cooling device 10 has been described, but the object to be cooled that is the target for cooling the boiling cooling device 10 is not limited to the electronic component 16, and the object to be cooled is not limited to the electronic component 16. The configuration is not particularly limited.

In the above embodiment, an example in which the refrigerant 12 is agitated to cool the electronic component 16 has been described, but the purpose of use of the liquid agitated in the liquid agitation structure is not particularly limited.

The body to be cooled may be anything as long as it generates heat. As an example, although not shown, it may be an engine (internal combustion engine) or a nuclear reactor.

The liquid as the refrigerant is not limited to water, and may be a liquid metal. Examples of the liquid metal include metallic sodium, sodium-potassium alloy, mercury and the like.

[Modified example of liquid stirring structure]
In the above embodiment, the diaphragm 20, the diaphragm 38, the vibrating body 46, etc. are vibrated in order to stir the liquid, but the vibration of the diaphragm 20, the vibrating plate 38, the vibrating body 46, etc. is used for power generation. can do.
Hereinafter, an embodiment in which power is generated by utilizing the vibration of the diaphragm 20, the diaphragm 38, the vibrating body 46, and the like will be described. The same components as those in the above embodiment are designated by the same reference numerals, and the description thereof will be omitted.

[Twelfth Embodiment]
As shown in FIGS. 14A and 14B, in the boiling cooling device 10 of the present embodiment, a piezoelectric film 60 that generates electricity by deformation is attached to the upper surface of the diaphragm 20 by using an adhesive or the like. There is.

In the boiling cooling device 10 of the present embodiment, when the diaphragm 20 vibrates, the diaphragm 20 is bent and deformed, so that the piezoelectric film 60 attached to the diaphragm 20 is bent and deformed to generate electricity. The obtained electric power can be used for various purposes such as being used in an electronic device using the electronic component 16, being used in a power-using device other than the electronic device, and being stored in a storage battery. Examples of power-using devices include LEDs and communication devices. Further, the piezoelectric film 60 is not limited to power generation applications, and can also be used as a vibration detection sensor for detecting whether or not the diaphragm 20 is vibrating. As the piezoelectric film 60, for example, "PIEZO FILM SENSOR" manufactured by Elmec Electronics Co., Ltd. can be used.

Since the amount of power generated by the piezoelectric film 60 may decrease when the temperature becomes high, the piezoelectric film 60 and the entire diaphragm 20 may be covered with a thin heat insulating material 62 as shown in FIG. 14C. .. As the heat insulating material 62, a material having a thermal conductivity lower than that of the diaphragm 20 and the piezoelectric film 60, for example, a synthetic resin containing innumerable bubbles can be used.

The piezoelectric film 60 is preferably provided at a portion where the deformation is large. Although not shown, the piezoelectric film 60 may be attached to both sides of the diaphragm 20. Further, although not shown, the diaphragm 20 may be replaced with the piezoelectric film 60 (in other words, the diaphragm 20 itself is used as a power generation member).

[13th Embodiment]
As shown in FIG. 15, in the boiling cooling device 10 of the present embodiment, the piezoelectric films 60 cantilevered and supported by the rectangular pedestal 64 are arranged in parallel on the upper side of the diaphragm 20 at intervals.
The tip end side of the diaphragm 20 (opposite side to the pedestal 22) and the tip end side of the piezoelectric film 60 are connected to each other by a rod-shaped connecting member 66 as an example. The connecting member 66 is made of a material having a lower thermal conductivity than the diaphragm 20, for example, a synthetic resin, and the heat of the diaphragm 20 is difficult to transfer to the piezoelectric film 60.

In the boiling cooling device 10 of the present embodiment, when the diaphragm 20 vibrates, the vibration of the diaphragm 20 is transmitted to the piezoelectric film 60 via the connecting member 66 to generate electricity.

In the boiling cooling device 10 of the present embodiment, since the piezoelectric film 60 is provided at a position away from the heat generating surface 30, the piezoelectric film 60 is unlikely to reach a high temperature, and a decrease in power generation efficiency can be suppressed.

[14th Embodiment]
As shown in FIGS. 16A and 16B, in the boiling cooling device 10 of the present embodiment, a rod-shaped magnet 70 is vertically attached to the upper portion of the diaphragm 20 on the tip end side via a heat insulating member 68. There is. The heat insulating member 68 is made of a material having a lower heat transfer coefficient than the diaphragm 20, for example, a synthetic resin. As the heat insulating member 68, a synthetic resin-based adhesive can be used.

As shown in FIG. 16A, a coil 72 is extrapolated on the outer peripheral side of the magnet 70 with a gap.

In the boiling cooling device 10 of the present embodiment, when the diaphragm 20 vibrates, the magnet 70 vibrates in the axial direction inside the coil 72 to generate electricity.

Since the magnet 70 has a property that the magnetic force weakens as the temperature rises, it is preferable that a heat insulating member 68 is interposed between the magnet 70 and the diaphragm 20 which becomes hot to suppress the temperature rise of the magnet 70. As a result, it is possible to suppress a decrease in power generation efficiency.

In the present embodiment, the magnet 70 is attached to the diaphragm 20 and the coil 72 is arranged on the outer peripheral side of the magnet 70. However, although not shown, the coil 72 is attached to the diaphragm 20 to form the coil 72 and the magnet 70. The positions may be swapped.

[Fifteenth Embodiment]
As shown in FIG. 17, in the boiling cooling device 10 of the present embodiment, the piezoelectric film 60 formed in a circle is formed in the opening portion on the upper end side of the cylinder portion main body 52 of the guide cylinder 50 accommodating the vibrating body 46. It is attached. A partition wall 74 is provided slightly below the upper end of the tubular body 52.

A coil spring 55 that urges the vibrating body 46 downward is arranged between the partition wall 74 and the vibrating body 46.

The central portion of the vibrating body 46 and the central portion of the piezoelectric film 60 are connected by a rod-shaped connecting member 76. The connecting member 76 penetrates the small hole 78 formed in the center of the partition wall 74.

(Action, effect)
In the boiling cooling device 10 of the present embodiment, when the vibrating body 46 vibrates up and down, the vibration of the vibrating body 46 is transmitted to the piezoelectric film 60 via the connecting member 76, and the piezoelectric film 60 is deformed to generate electricity.

Further, in the boiling cooling device 10 of the present embodiment, the piezoelectric film 60 is provided at a position away from the heat generating surface 30, and the internal space S3 of the tubular portion main body 52 in which the vibrating body 46 is housed is defined as. Since they are separated from each other via the partition wall 74, the piezoelectric film 60 is unlikely to reach a high temperature, and a decrease in power generation efficiency can be suppressed.

[16th Embodiment]
As shown in FIG. 18, in the boiling cooling device 10 of the present embodiment, the magnet 82 is laminated on the vibrating body 46 housed inside the guide cylinder 50 via the heat insulating member 80. The heat insulating member 80 is made of a material having a lower heat transfer coefficient than the vibrating body 46, for example, a synthetic resin or the like. As the heat insulating member 80, a synthetic resin-based adhesive can be used.

In the present embodiment, a coil 84 is formed on the outer peripheral surface of the guide cylinder 50 on the outer side in the radial direction of the magnet 82. The guide cylinder 50 of this embodiment is made of a non-metal material such as synthetic resin.
The coil 84 may be formed on the inner peripheral surface of the guide cylinder 50.

(Action, effect)
In the boiling cooling device 10 of the present embodiment, when the vibrating body 46 vibrates up and down, the magnet 82 vibrates in the axial direction inside the coil 84 to generate electricity.

Since the magnet 82 has a property that the magnetic force weakens as the temperature rises, it is preferable that the heat insulating member 80 is interposed between the magnet 82 and the vibrating body 46, which becomes hot, to suppress the temperature rise of the magnet 82. As a result, it is possible to suppress a decrease in power generation efficiency.

[17th Embodiment]
As shown in FIG. 19, in the boiling cooling device 10 of the present embodiment, the link 86, the crank 88, the pin 90, and the pin 92 are used on the vibrating body 46 housed inside the guide cylinder 50 to form the generator 94. The rotating shaft 96 is connected. The generator 94 is attached to the guide cylinder 50 or the container 14 via an attachment member (not shown).

Further, in the present embodiment, the vibrating body 46 is arranged above the fifth embodiment in order to increase the vertical displacement of the vibrating body 46.

(Action, effect)
In the boiling cooling device 10 of the present embodiment, when the vibrating body 46 vibrates up and down, the vertical movement (linear motion) of the vibrating body 46 is converted into rotary motion by the link 86, the crank 88, the pin 90, and the pin 92 to generate a power generator. The rotating shaft 96 of the machine 94 rotates, and the generator 94 generates power.

In the above embodiment, power generation is performed using a piezoelectric film 60, magnets 70, 82, coils 72, 84, etc., which are a type of piezoelectric element, but if power can be generated by vibration, power generation members other than these are used. May generate electricity.

10 Boiling cooling device (liquid stirring structure)
12 Liquid 14 Container 16 Electronic components (electronic equipment)
18 Substrate (electronic equipment)
20 Diaphragm 22 Pedestal (support)
24 Heat dissipation fins 28 Bellows (pressure fluctuation absorber)
34 Support arm (support part)
36 Coil spring 38 Diaphragm 42 Screw 44 Long hole 46 Vibrator 56 Membrane (vibrator)
S Gap 60 Piezoelectric film (power generation member)
70 Magnet (Power Generation Member)
72 coil (power generation member)
82 Magnet (Power generation member)
84 coil (power generation member)
94 Generator (power generation member)

Claims (20)

A container that stores liquid and
A vibrating body provided in the container, which vibrates in the liquid by being hit by bubbles generated by heating the liquid, and agitates the liquid.
Liquid stirring structure with. The vibrating body is formed of an elastically deformable plate material and is supported by a support portion provided in the container.
The liquid stirring structure according to claim 1. The liquid stirring structure according to claim 2, wherein one end of the plate material is supported by the support portion. The liquid stirring structure according to claim 3, further comprising an adjusting mechanism for adjusting the length of the plate material protruding from the support portion. The vibrating body is supported by a support portion provided on the container via an elastic body.
The liquid stirring structure according to claim 1. The liquid stirring structure according to any one of claims 1 to 5, wherein a gap through which the liquid enters is provided between the vibrating body and the container. A container that stores the refrigerant and
A vibrating body provided in the container and in contact with the container to be cooled to heat the refrigerant to generate air bubbles, and when the air bubbles hit the container, it vibrates in the refrigerant to agitate the refrigerant. When,
Boiling cooling device with. The boiling cooling device according to claim 7, wherein the container stores the refrigerant in a closed state. The boiling cooling device according to claim 8, wherein the container is provided with a pressure fluctuation absorbing device that absorbs fluctuations in the internal pressure of the container. The boiling cooling device according to claim 9, wherein the pressure fluctuation absorbing device is a bellows. The boiling cooling device according to any one of claims 7 to 10, wherein the container is provided with a heat exchange unit that enables heat exchange between the refrigerant and the outside of the container. The boiling cooling device according to any one of claims 7 to 11, wherein the boiling point of the refrigerant is set lower than the preset upper limit temperature of heat generation of the body to be cooled. The body to be cooled is a nuclear reactor.
The boiling cooling device according to any one of claims 7 to 12. The boiling cooling device according to any one of claims 7 to 12.
Electronic components as a body to be cooled,
Electronic equipment equipped with. The vibrating body is a power generation member that generates electricity by vibration.
The liquid stirring structure according to any one of claims 1 to 6. The vibrating body is a power generation member that generates electricity by vibration.
The boiling cooling device according to any one of claims 7 to 13. The vibrating body is a power generation member that generates electricity by vibration.
The electronic device according to claim 14. A power generation member that generates power by the vibration of the vibrating body is provided.
The liquid stirring structure according to any one of claims 1 to 6. A power generation member that generates power by the vibration of the vibrating body is provided.
The boiling cooling device according to any one of claims 7 to 13. The electronic device according to claim 14, further comprising a power generation member that generates power by vibrating the vibrating body.

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