JP5449045B2 - Heater unit with shaft and heater unit manufacturing method with shaft - Google Patents

Description

  The present invention relates to a heater unit with a shaft for heating while supporting a semiconductor substrate, and a method for manufacturing a heater unit with a shaft.

  In a semiconductor substrate manufacturing process, such as annealing, the semiconductor substrate is heat-treated in a vacuum chamber. Evenly heating the semiconductor substrate and reducing the temperature distribution has a large effect on the yield. In recent years, more precise temperature control has been desired.

  In this heat treatment of a semiconductor substrate, a heater with a shaft that heats while supporting the semiconductor substrate is known (for example, see Patent Document 1). The heater with a shaft is composed of a heater plate on which a semiconductor substrate as an object to be heated is placed, a sheath heater embedded therein, and a shaft that supports the heater plate. The material of the heater plate of the heater with a shaft is: The temperature is selected in consideration of the operating temperature range of the heater, that is, the heating temperature of the semiconductor substrate that is the object to be heated.

JP 2009-176469 A

  By the way, as a material for the heater plate, aluminum or aluminum alloy having a high thermal conductivity is generally preferably used. However, when the heater is continuously used at a high temperature, a heater with a shaft that supports the central portion of the heater plate with a shaft. Then, there is a possibility that the deflection of the outer peripheral portion of the heater plate that is not supported by the shaft occurs, and the temperature control of the object to be heated cannot be performed accurately.

  The present invention has been made in view of the above, and an object of the present invention is to provide a heater unit with a shaft and a heater unit manufacturing method with a shaft that can improve the heater strength and thereby improve the heater temperature distribution. To do.

  In order to solve the above-described problems and achieve the object, a heater unit with a shaft according to the present invention includes a heater plate that places and heats an object to be heated, and a heater with a shaft that has a shaft that supports the heater plate. The heater plate is a solid state selected from a flat base portion joined to the shaft and a material whose strength in the operating temperature range of the heater plate is higher than the material constituting the base portion And a plate part laminated by spraying the material powder on the base part at a temperature lower than the melting point of the material powder by a heated compressed gas.

  In the heater unit with a shaft according to the present invention, in the above invention, the heater plate is made of a solid-state material powder made of the same material as the base portion, and is lower than the melting point of the material powder by a heated compressed gas. It is laminated | stacked by spraying on the said plate part with temperature, The mounting part which mounts a to-be-heated material is provided.

  Moreover, the heater unit with a shaft according to the present invention is the above-described invention, wherein the heater plate includes a coating layer covering an outer peripheral portion of the heater plate, and the coating layer is in a solid phase made of the same material as the base portion. The material powder is laminated by spraying the outer peripheral portion of the heater plate with a heated compressed gas at a temperature lower than the melting point of the material powder.

  Moreover, the heater unit with a shaft according to the present invention is characterized in that, in the above invention, the heater plate has a sheath heater disposed in the plate portion.

  In the heater unit with a shaft according to the present invention as set forth in the invention described above, the base portion is made of aluminum or an aluminum alloy, and the plate portion is made of copper or a copper alloy.

  A heater unit manufacturing method with a shaft according to the present invention is a heater unit manufacturing method with a shaft having a heater plate for placing and heating an object to be heated, and a shaft for supporting the heater plate, An arrangement step of arranging a sheath heater on a flat base portion to be joined, and a solid-state material powder selected from materials whose strength in the operating temperature range of the heater plate is higher than the material constituting the base portion, And a plate portion stacking step of forming a plate portion by spraying the base portion with a heated compressed gas at a temperature lower than the melting point of the material powder.

  Further, in the above method for manufacturing a heater unit with a shaft according to the present invention, the solid-state material powder made of the same material as that constituting the base portion is set to a temperature lower than the melting point of the material powder. By spraying on the plate part with the heated compressed gas, it is characterized by including the mounting part lamination | stacking process which laminates | stacks on the said plate part and forms the mounting part which mounts the said to-be-heated material.

  Further, in the above method for manufacturing a heater unit with a shaft according to the present invention, the solid-state material powder made of the same material as that constituting the base portion is set to a temperature lower than the melting point of the material powder. It is characterized by including a coating layer laminating step of forming a coating layer covering the outer peripheral portion of the heater plate by spraying the outer peripheral portion of the heater plate together with the heated compressed gas.

  In the heater unit with a shaft according to the present invention, a heater plate on which an object to be heated is placed in a base portion made of a first material in consideration of a use temperature range of the heater plate, and a use temperature range of the heater plate. A so-called cold spray comprising a plate portion made of a second material whose strength is higher than that of the material constituting the base portion, and laminating the plate portion by spraying a solid powder material with a compressed gas having a melting point or lower. By forming the plate heater, even when the plate heater is used in a high temperature range, the deflection of the outer periphery of the plate heater is prevented, the heater temperature distribution is improved, and peeling at the dissimilar material interface of the heater plate due to thermal fatigue, There is an effect that cracks and the like can be effectively prevented.

FIG. 1 is a cross-sectional view showing a configuration of a heater unit with a shaft according to an embodiment of the present invention. FIG. 2 is a flowchart for explaining a manufacturing process of the heater unit with a shaft according to the embodiment of the present invention. FIG. 3 is an explanatory view showing an outline of an example of a thermal spraying apparatus used for manufacturing the heater unit with a shaft according to the embodiment of the present invention. FIG. 4 is a cross-sectional view illustrating a manufacturing process of the heater unit with a shaft according to the embodiment of the present invention. FIG. 5 is a cross-sectional view showing a manufacturing process of the heater unit with a shaft according to the embodiment of the present invention. FIG. 6 is a cross-sectional view showing a manufacturing process of the heater unit with a shaft according to the embodiment of the present invention. FIG. 7 is a cross-sectional view showing a configuration of a heater unit with a shaft according to the first modification of the embodiment of the present invention. FIG. 8 is a cross-sectional view showing a configuration of a heater unit with a shaft according to the second modification of the embodiment of the present invention. FIG. 9 is a cross-sectional view showing a configuration of a heater unit with a shaft according to the third modification of the embodiment of the present invention. 10 is a cross-sectional view of the heater unit with shaft shown in FIG. 9 taken along the line XX.

  Embodiments of a heater unit with a shaft and a method for manufacturing a heater unit with a shaft according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited to these embodiment, A various change is possible in the range which does not deviate from the summary of this invention.

  FIG. 1 is a cross-sectional view showing a configuration of a heater unit 100 with a shaft according to an embodiment of the present invention. The shaft-equipped heater unit 100 includes a substantially disc-shaped heater plate 1 and a shaft portion 2 that supports the heater plate 1. The shaft-equipped heater unit 100 is usually installed in a box-shaped housing in a process chamber that is a reaction chamber of a semiconductor manufacturing apparatus, and the inside of the housing is airtight so as to be in a vacuum state. In the present embodiment, a disk-shaped heater plate is used, but the present invention is not limited to this, and a rectangular shape may be used in consideration of the shape of an object to be heated.

  The heater plate 1 includes a base portion 3 joined to the shaft portion 2, a plate portion 4 stacked on the base portion 3, and a placement portion 5 on which a semiconductor substrate that is an object to be heated is placed.

  The base portion 3 has a circular opening 10 at the center, and the sheath heater 6 is disposed on the base portion 3 on substantially one surface. A power supply line 7 that supplies power to the sheath heater 6 is connected to an external power source through the opening 10. The base part 3 and the mounting part 5 to be described later are made of the same material, and the material is appropriately selected based on the operating temperature range as the heater plate 1. As a preferable material for the heater plate 1, a metal having high thermal conductivity, such as aluminum or an aluminum alloy (thermal conductivity: 100 to 240 W / m · K, at room temperature) is preferably used, but is not limited thereto. Depending on the operating temperature range of the heater plate 1, iron or iron alloy (thermal conductivity: 10 to 80 W / m · K, at normal temperature), copper or copper alloy (thermal conductivity: 100 to 400 W / m · K, normal temperature) ), Nickel or nickel alloy (thermal conductivity: 5 to 100 W / m · K, at room temperature), titanium or titanium alloy (thermal conductivity: 5 to 30 W / m · K, at room temperature), indium (thermal conductivity) : 82 W / m · K, normal temperature, lead (thermal conductivity: 35 W / m · K, normal temperature), magnesium (thermal conductivity: 156 W / m · K, normal temperature), tin (thermal conductivity: 67 W) / M · K at room temperature) Silver (thermal conductivity: 420W / m · K, at normal temperature), zinc (thermal conductivity: 116W / m · K, normal temperature) may be selected from such.

  The plate part 4 is uniformly laminated on the base part 3. The plate portion 4 is selected from materials whose strength in the operating temperature range of the heater plate 1 is higher than the material constituting the base portion 3. Here, the strength means the mechanical strength in the use temperature range of the material, and the material may be selected in consideration of the Young's modulus in the use temperature range, the tensile strength, and the like. Table 1 shows Young's modulus at room temperature of usable metal materials (pure metals or alloys thereof).

  When aluminum or aluminum alloy is selected as the base part 3, the material of the plate part 4 is a material having higher mechanical strength, for example, copper or copper alloy. When the plate portion 4 is made of a material having a higher mechanical strength in the operating temperature range of the heater plate 1 than the base portion 3, even when continuously used in the upper limit region of the operating temperature range, the heater not supported by the shaft portion 2 described later Deflection of the outer periphery of the plate 1 can be prevented. In addition, the thickness of the base part 3 and the plate part 4 considers the thermal conductivity and mechanical strength of each material selected as the base part 3 and the plate part 4 in addition to the size and thickness of the heater plate 1. Then, it adjusts suitably so that the temperature distribution of the heater plate 1 may become uniform in a use temperature range.

  The mounting unit 5 is stacked on the plate unit 4 and mounts a semiconductor substrate that is an object to be heated. A spacer that reduces contact between the semiconductor substrate and the surface of the heater plate 1 (mounting unit 5) may be installed in the mounting unit 5. Although the heater plate 100 with a shaft according to the present embodiment includes the placement portion 5, the placement portion 5 is not necessarily provided, and an object to be heated may be placed on the plate portion 4.

  The shaft portion 2 includes a shaft main body portion 8 that supports the heater plate 1 and a flange portion 9 for joining to the heater plate 1. The shaft body 8 has a hollow cylindrical shape, and the power supply line 7 is disposed inside. The flange portion 9 is joined to the base portion 3 disposed on the shaft side of the heater plate portion by welding or brazing. Although the shaft-equipped heater 100 according to the present embodiment connects the shaft portion 2 and the heater plate 1 via the flange portion 9, the end portion of the shaft portion 2 and the heater plate are not provided with the flange portion 9. 1 may be joined by welding or brazing. Note that the shaft portion 2 and the base portion 3 can also be laminated by a cold spray method described later.

  Next, with reference to FIGS. 2-6, the manufacturing process of the heater unit 100 with a shaft which concerns on embodiment of this invention is demonstrated. FIG. 2 is a flowchart for explaining the manufacturing process of the heater unit with shaft 100 according to the embodiment of the present invention. FIG. 3 is an explanatory view showing an outline of an example of a thermal spraying apparatus used for manufacturing the heater unit with a shaft according to the embodiment of the present invention. 4-6 is sectional drawing explaining the manufacturing process of the heater unit 100 with a shaft.

  As shown in the flowchart of FIG. 2, first, the opening 10 of the base 3 is masked with the masking member 11 (step S101). The base part 3 may be formed by machining or casting. Thereafter, as shown in FIG. 4, the sheath heater 6 is disposed on substantially one surface of the base portion 3 (step S102).

  Then, the plate part 4 is formed on the base part 3 by cold spraying the powder material of the plate part 4 using the thermal spraying apparatus 50 as shown in FIG. 3 (refer step S103, FIG. 5). The thermal spraying device 50 contains a gas heater 40 that heats the compressed gas below the melting point, a powder material that sprays the sprayed material, and a powder supply device 41 that supplies the powder material to the spray gun 44. A gas nozzle 45 for injecting the material powder mixed with the compressed gas onto the substrate.

  As the compressed gas, helium, nitrogen, air or the like is used. The supplied compressed gas is supplied to the gas heater 40 and the powder supply device 41 by valves 42 and 43, respectively. The compressed gas supplied to the gas heater 40 is heated to a temperature lower than the melting point of the thermal spray material, for example, 50 to 700 ° C., and then supplied to the spray gun 44. More preferably, the upper limit temperature of the thermal spray material powder heated by the compressed gas is kept below the melting point of the material. This is because the oxidation of the material can be suppressed by keeping the powder heating temperature below the melting point of the material. The compressed gas supplied to the powder supply device 41 supplies, for example, material powder having a particle size of about 10 to 100 μm in the powder supply device 41 to the spray gun 44 so as to have a predetermined discharge amount. The heated compressed gas is converted into a supersonic flow (about 340 m / s or more) by a gas nozzle 45 having a tapered tapered shape. The powder material supplied to the spray gun 44 is accelerated by the injection of the compressed gas into the supersonic flow, and collides with the substrate at a high speed in the solid state to form a film. Any apparatus capable of forming a film by colliding material powder with a base material in a solid phase can be used for manufacturing the heater unit with shaft 100 according to the present embodiment, and is limited to the thermal spraying apparatus 50 of FIG. It is not something.

  After step S103, as shown in FIG. 6, the powder material of the mounting part 5 is laminated on the plate part 4 by cold spray to form the mounting part 5 having a desired thickness (step S104). .

  After all materials are laminated, the masking member 11 is removed (step S105), and the flange portion 9 of the shaft portion 2 and the base portion 3 of the heater plate 1 are joined by welding or brazing (step S106). Subsequently, the power supply line 7 and the sheath heater 6 are connected through the opening 2 of the shaft portion 2 and the base portion 3 (step S107). When the sheath heater 6 is long enough to protrude from the shaft portion 2, the connection of the power supply line 7 may be unnecessary.

  In the manufacturing process described above, the heater unit 100 with a shaft is manufactured using the base portion 3 that has been previously formed into a predetermined shape by cutting or casting, but the base portion 3 and the shaft portion 2 are also formed of the plate portion 4 and Similarly to the mounting portion 5, each may be formed by a cold spray method.

  As described above, when the heater plate 1 is manufactured by the cold spray method using different materials, since the compressed gas temperature is low, there is almost no oxidation or thermal alteration of the material used, and a dense and highly adhesive film is formed. I can do it. Further, according to the cold spray method, since a necessary material can be laminated at an arbitrary location, the heater plate 1 is improved by combining a material having a high strength in the operating temperature range of the heater plate 1 to increase the heater strength. Can effectively improve the temperature distribution. Furthermore, since the temperature at the time of joining can be lowered, there is no accumulation of strain due to a difference in thermal expansion between materials, and there is an excellent effect that peeling and cracking at the material interface can be prevented.

  In addition, as a modified example 1 of the heater unit with shaft 100 according to the embodiment, a heater unit with shaft 100A illustrated in FIG. 7 is illustrated. The heater unit with shaft 100A does not have an opening at the center of the base portion 3A. Therefore, when the plate portion 4 is laminated by the cold spray method, it is not necessary to mask, and the manufacturing process can be shortened.

  Further, as a modification example 2 of the heater unit with shaft 100 according to the embodiment, a heater unit with shaft 100B illustrated in FIG. 8 is illustrated. The shaft-equipped heater unit 100B includes a coating layer 12 that covers the outer periphery of the heater plate 1B. For example, when the base part 3 and the mounting part 5 are made of aluminum or an aluminum alloy, and copper or a copper alloy having a higher strength than aluminum or an aluminum alloy is selected as the material of the plate part 4, the copper of the plate part 4 In order to prevent copper contamination of the semiconductor substrate, which is an object to be heated, due to diffusion, it is preferable to include the coating layer 12. The coating layer 12 is preferably made of aluminum or an aluminum alloy like the base portion 3 and the placement portion 5. The coating layer 12 is formed by laminating the material powder in the solid state by spraying the outer periphery of the heater plate 1B together with the compressed gas heated to a temperature lower than the melting point of the material powder.

  Furthermore, as a modified example 3 of the heater unit 100 with a shaft according to the embodiment, a heater unit 100C with a shaft shown in FIGS. 9 and 10 is exemplified. The heater plate 1C of the heater unit with shaft 100C includes a base part 3 joined to the shaft part 2, a first plate part 4A and a second plate part 4B stacked on the base part 3, and a semiconductor to be heated. And a placement unit 5 on which a substrate is placed. As shown in FIG. 10, the first plate portion 4A is laminated on the base portion 3 in a radial shape from the center. The first plate portion 4 </ b> A is selected from materials whose strength in the operating temperature range of the heater plate 1 is higher than the material constituting the base portion 3. The second plate portion 4B is stacked on the base portion 3 so as to fill the space between the first plate portions 4A. The second plate portion 4B is selected from the same material as that constituting the base portion 3. In the heater unit 100C with a shaft according to the modified example 3, the first plate portion 4A is formed radially on the base portion 3, so that the shaft can be used even when the heater plate 1C is continuously used in the upper limit of the operating temperature range. Deflection of the outer peripheral portion of the heater plate 1 that is not supported by the portion 2 can be prevented.

  INDUSTRIAL APPLICABILITY The present invention can be used for a heater unit with a shaft formed by joining different materials and a heater unit manufacturing method with a shaft, and is particularly useful for a heater with a shaft used in a semiconductor manufacturing apparatus.

DESCRIPTION OF SYMBOLS 1, 1A, 1B, 1C Heater plate 2 Shaft part 3, 3A Base part 4 Plate part 4A 1st plate part 4B 2nd plate part 5 Mounting part 6 Sheath heater 7 Electric power supply line 8 Shaft body part 9 Flange part 10 Opening part DESCRIPTION OF SYMBOLS 11 Masking member 40 Gas heater 41 Powder supply apparatus 42, 43 Valve 44 Spray gun 45 Gas nozzle 50 Thermal spray apparatus 100, 100A, 100B, 100C Heater unit with a shaft

Claims (8)

A heater plate with a shaft having a heater plate for placing and heating an object to be heated, and a shaft for supporting the heater plate,
The heater plate is
A flat base portion joined to the shaft;
A solid-state material powder selected from materials whose strength in the operating temperature range of the heater plate is higher than the material constituting the base portion is heated on the base portion at a temperature lower than the melting point of the material powder by a heated compressed gas. Plate parts stacked by spraying;
A heater unit with a shaft, comprising: The heater plate is
The material powder in the solid phase made of the same material as the base part is laminated by spraying on the plate part with a heated compressed gas at a temperature lower than the melting point of the material powder, and the object to be heated is placed thereon. The heater unit with a shaft according to claim 1, further comprising a mounting portion.   The heater plate includes a coating layer covering an outer peripheral portion of the heater plate, and the coating layer is made of a solid-state material powder made of the same material as the base portion by a heated compressed gas from a melting point of the material powder. The heater unit with a shaft according to claim 2, wherein the heater unit is laminated by spraying the outer peripheral portion of the heater plate at a low temperature.   The said heater plate arrange | positions a sheath heater in the said plate part, The heater unit with a shaft as described in any one of Claims 1-3 characterized by the above-mentioned.   The heater unit with a shaft according to any one of claims 1 to 4, wherein the base portion is made of aluminum or an aluminum alloy, and the plate portion is made of copper or a copper alloy. A heater unit manufacturing method with a shaft having a heater plate for placing and heating an object to be heated, and a shaft for supporting the heater plate,
An arrangement step of arranging a sheath heater on a flat base portion joined to the shaft;
A solid-state material powder selected from materials whose strength in the operating temperature range of the heater plate is higher than the material constituting the base portion is heated on the base portion at a temperature lower than the melting point of the material powder by heated compressed gas. A plate part stacking step for forming the plate part by spraying on
A method for manufacturing a heater unit with a shaft, comprising:   By spraying a solid-state material powder composed of the same material as the material constituting the base portion onto the plate portion together with a compressed gas heated to a temperature lower than the melting point of the material powder, The method of manufacturing a heater unit with a shaft according to claim 6, further comprising a placement portion laminating step of forming a placement portion on which the object to be heated is placed.   The heater plate is sprayed onto the outer periphery of the heater plate with a solid-state material powder composed of the same material as that constituting the base portion at a temperature lower than the melting point of the material powder by a heated compressed gas. The method for manufacturing a heater unit with a shaft according to claim 7, further comprising a coating layer laminating step of forming a coating layer covering the outer peripheral portion.

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