JP5446308B2 - Copper material for plating and method for producing copper plating material - Google Patents

Description

  The present invention relates to a copper material for plating used as a copper ion supply source in electrolytic plating of copper, and a method for producing a copper plating material using the copper material for plating.

Conventionally, as a method of copper plating on a printed wiring board such as a mobile phone or a computer, while immersing copper as a soluble anode in a plating tank in which a plating solution such as a dilute sulfuric acid solution containing copper ions is stored, Electroplating in which a printed wiring board is immersed as a cathode and the anode and the cathode are energized is widely used. Thus, in the electroplating using the soluble anode, the copper used as the anode is dissolved in the dilute sulfuric acid solution to become copper ions, and copper is electrodeposited on the surface of the printed wiring board used as the cathode. Become.
Moreover, instead of the soluble anode, electrolytic plating in which an insoluble anode such as iridium oxide is immersed in a plating tank is also widely used. In this case, it is necessary to supply copper ions to the plating solution in the plating tank by dissolving copper in a sulfuric acid solution or the like.

As a copper ion supply source for performing such electrolytic plating, for example, as disclosed in Patent Documents 1 and 2, a copper material (copper ball for plating) formed in a ball shape or a circle obtained by cutting a copper wire Columnar copper is widely used.
For example, when this plating copper ball is used as a soluble anode, a basket made of a corrosion-resistant material such as Ti is placed in the plating tank, and the plating copper ball is inserted into the basket. It is said that. The copper balls for plating are gradually consumed as they dissolve in the plating solution. However, by continuously rolling the copper balls for plating into the Ti basket according to the amount consumed, electrolytic plating can be performed continuously. Is something that can be done.
On the other hand, when an insoluble anode is used, the copper balls for plating are dissolved in a sulfuric acid solution or the like outside the plating tank and are sequentially supplied into the plating tank.

  Here, the above-mentioned copper balls for plating are made of low oxygen copper, oxygen-free copper, phosphorous deoxidized copper or the like having an oxygen content of 20 ppm or less, and have a diameter of about 10 mm to 60 mm. For example, as shown in Patent Documents 3 and 4, such a copper ball for plating is obtained by cutting a long copper rod material to obtain a substantially cylindrical copper rod material, and rolling the copper rod material or It is formed by forging.

JP 2000-054199 A JP 2003-328198 A JP 2006-297479 A JP 2006-225746 A

By the way, when the copper balls for plating described in Patent Documents 1-4 are dissolved with a sulfuric acid solution or the like, the one having a larger area in contact with the sulfuric acid solution or the like is efficiently dissolved. That is, as the ratio S / V between the surface area S and the volume V increases, it becomes possible to efficiently supply copper ions into the plating solution.
However, the above-described copper balls for plating have a problem that the ratio S / V between the surface area S and the volume V becomes relatively small, and copper ions cannot be supplied efficiently. In addition, when using a cylindrical copper material, etc., if a plurality of plating copper materials are inserted into a Ti basket, etc., the copper ions for plating do not come into contact with the sulfuric acid solution, etc. The supply efficiency will be reduced.

  The present invention has been made in view of the above-described circumstances, and the ratio S / V between the surface area S and the volume V is relatively large, and the contact area with the sulfuric acid solution or the like can be increased even if they are arranged to be stacked. An object of the present invention is to provide a copper material for plating that can be secured and capable of efficiently supplying copper ions into the plating solution, and a method for producing a copper plating material using the copper material for plating.

In order to solve the above problems, for plating copper material according to the present invention is a plated copper material used in supplying copper ions to the plating solution, and extend along the axis, wherein A cylindrical wall portion having a circular cross section perpendicular to the axis , and end wall portions respectively positioned at both ends of the cylindrical wall portion, wherein the axial center portion of the cylindrical wall portion is the axial end. The ratio L / R of the axial length L and the maximum length R in the direction orthogonal to the axial line is set to L / R> 1. It is characterized by being.

  In the copper material for plating of this configuration, it includes a cylindrical wall portion extending along the axis, and end wall portions positioned at both ends of the cylindrical wall portion, and the cylindrical wall portion is Since the central part in the axial direction protrudes away from the axial line rather than the end part in the axial direction, the cylindrical wall parts are in close contact with each other even when a plurality of plating copper materials are charged in a Ti basket or the like. As a result, they are not stacked and an area in contact with the sulfuric acid solution can be secured. Further, since the ratio L / R between the axial length L and the maximum length R in the direction orthogonal to the axial line is set to L / R> 1, the surface area S compared to the spherical ball material. The ratio S / V of the volume V increases. Therefore, copper is easily dissolved in a plating solution such as a sulfuric acid solution, and copper ions can be efficiently supplied into the plating solution.

Here, the ratio L / R between the axial length L and the maximum length R in the direction orthogonal to the axial line is set within a range of 1.05 ≦ L / R ≦ 1.35. preferable.
In the copper material for plating of this configuration, since the ratio L / R between the axial length L and the maximum length R in the direction orthogonal to the axial line is 1.05 or more, the surface area S and volume The ratio S / V with V can be increased. On the other hand, since the L / R is 1.35 or less, the handleability of the plating copper material is ensured, and for example, a plurality of copper plating materials can be charged in a basket or the like.

Moreover, it is preferable that the said end wall part protrudes toward the said axial direction outer side in the said axis line vicinity.
In the plating copper material of this configuration, the vicinity of the axial line of the end wall portion protrudes outward in the axial direction, and therefore, when a plurality of plating copper materials are charged into a Ti basket or the like. In addition, the end wall portions are not in close contact with each other and are not stacked, and an area in contact with the sulfuric acid solution or the like can be secured. Therefore, copper is easily dissolved in a plating solution such as a sulfuric acid solution, and copper ions can be supplied more efficiently into the plating solution.

The method for producing a copper plating material according to the present invention includes immersing a material to be plated as a cathode in a plating tank in which a plating solution is stored, immersing a soluble anode in the plating tank, and energizing the anode and the cathode. A method for producing a copper plating material in which copper is electrodeposited on the surface of the material to be plated, wherein the plating copper material is immersed in the plating tank as the soluble anode.
According to the method for producing a copper plating material having this configuration, by using the above-described copper material for plating as a soluble anode, it becomes possible to efficiently supply copper ions into the plating solution, thereby efficiently performing the copper plating. Can be performed.

In addition, the method for producing a copper plating material according to the present invention includes immersing a material to be plated as a cathode in a plating tank in which a plating solution is stored, and immersing an insoluble anode in the plating tank. A method for producing a copper plating material for energizing and depositing copper on the surface of the material to be plated, wherein a plating solution supplied with copper ions is produced by dissolving the above-described plating copper material, and this plating solution Is supplied to the plating tank.
According to the method for producing a copper plating material of this configuration, the above-described plating copper material is dissolved to produce a plating solution supplied with copper ions, and this plating solution is supplied to the plating tank. Even if it is a case where it uses, it becomes possible to perform copper plating efficiently.

  According to the present invention, the ratio S / V between the surface area S and the volume V is relatively large, and even when arranged so as to be stacked, a contact area with a sulfuric acid solution or the like can be secured, and copper ions are efficiently contained in the plating solution. It is possible to provide a copper material for plating that can be supplied in an economical manner and a method for producing a copper-plated material using this copper material for plating.

It is a perspective view of the copper material for plating which is embodiment of this invention. It is sectional drawing along the axis line of the copper material for plating which is embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the copper material for plating which is embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the copper plating material using the copper material for plating which is embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the other copper plating material using the copper material for plating which is embodiment of this invention.

  Below, the copper plating material which concerns on embodiment of this invention, and the manufacturing method of the copper plating material using the copper material for plating of this invention are demonstrated in detail with reference to attached drawing.

The outline of the copper material 10 for plating which is this embodiment is shown in FIG.1 and FIG.2. The copper material 10 for plating which is this embodiment is composed of low oxygen copper or oxygen-free copper having a copper purity of 99.96% or more and an oxygen content of 20 ppm or less, as shown in FIGS. 1 and 2. And a cylindrical wall portion 11 extending along the axis N, and a pair of end wall portions 15 and 15 respectively positioned at both ends of the cylindrical wall portion 11.
In addition, as shown in FIG. 2, in the cross section along the axis N, when the cylindrical wall part 11 and the end wall part 15 are connected by a smooth curve, the straight line orthogonal to the tangent line S of this curve. The point at which the crossing angle α between the axis N and the axis N is 45 ° is defined as the boundary between the cylindrical wall portion 11 and the end wall portion 15.

  Here, the ratio L / R between the length L in the direction of the axis N and the maximum length R in the direction perpendicular to the axis N satisfies L / R> 1, preferably 1.05 ≦ L / R ≦ 1.35. It is set within the range. In the present embodiment, 10 mm ≦ L ≦ 100 mm, 7.4 mm ≦ R ≦ 95.2 mm, and 1.05 ≦ L / R ≦ 1.35.

  The cylindrical wall portion 11 has a circular cross section perpendicular to the axis N, and the diameter of the circle formed by the cross section at the center in the axis N direction is set longer than the diameter of the circle formed by the cross section at the end in the axis N direction. ing. That is, the cylindrical wall portion 11 protrudes so that the central portion in the axis N direction is farther from the axis N than the end in the axis N direction.

  Here, as shown in FIG. 2, in the cylindrical wall portion 11, the distance from the axis N (maximum distance from the axis N) H <b> 1 at the center in the axis N direction and the distance from the axis N at the end in the axis N direction ( The difference H1−H2 from the minimum distance H2 from the axis N is set within a range of 0.01 × L ≦ H1−H2 ≦ 0.15 × L with respect to the total length L of the copper material 10 for plating. ing. In the present embodiment, 0.1 mm ≦ H1−H2 ≦ 15 mm.

  As shown in FIG. 2, the ridgeline formed by the cylindrical wall portion 11 in the cross section along the axis N has a convex curve shape that is convex outward in the radial direction. The radius of curvature r1 of the convex curve is set within a range of 0.525 × L ≦ r1 ≦ 2.0 × L with respect to the total length L of the plating copper material 10, and in this embodiment, 5 .25 mm ≦ r1 ≦ 200 mm. Note that the ridgeline formed by the cylindrical wall portion 11 in the cross section along the axis N does not need to be configured by a convex curve having a single radius of curvature, and may be configured by a plurality of convex curves having the aforementioned radius of curvature. Good.

As shown in FIGS. 1 and 2, the end wall portion 15 protrudes outward in the direction of the axis N in the vicinity of the axis N and extends in a direction perpendicular to the axis N, A convex curved portion 17 that connects the outer periphery of the plate portion 16 and the end portion in the axis N direction of the cylindrical wall portion 11 is provided.
Here, as shown in FIG. 2, the protruding length M of the disk portion 16 protruding outward in the direction of the axis N in the vicinity of the axis N is 0.05 with respect to the total length L of the copper material 10 for plating. It is set within the range of × L ≦ M ≦ 0.45 × L. In the present embodiment, 0.5 mm ≦ M ≦ 45 mm.

Further, as shown in FIG. 2, the ratio D1 / D2 between the diameter D1 of the disc portion 16 and the maximum diameter D2 of the end wall portion 15 is set within a range of 0 ≦ D1 / D2 ≦ 0.7. Yes.
Further, the radius of curvature r2 of the convex curve formed by the convex curved portion 17 in the cross section along the axis N is in a range of 0.1 × L ≦ r2 ≦ 1.0 × L with respect to the total length L of the plating copper material 10. In this embodiment, 1 mm ≦ r2 ≦ 100 mm. Note that the convex curve formed by the convex curve portion 17 in the cross section along the axis N does not have to be composed of a convex curve having a single radius of curvature, and is composed of a plurality of convex curves having the aforementioned radius of curvature. Also good.

Below, the manufacturing method of the copper material 10 for plating which is this embodiment is demonstrated using FIG.
First, as shown in FIG. 3 (a), a copper bar 50 having a cylindrical outer shape is produced. The copper bar 50 is made of, for example, low-oxygen copper or oxygen-free copper having a copper purity of 99.96% or more and an oxygen content of 20 ppm or less. The copper bar 50 continuously produces a long bar-shaped ingot using, for example, a belt wheel type continuous casting machine, and continuously rolls the bar-shaped ingot to have a predetermined outer diameter (in this embodiment, 7 to 80 mm) is produced in a coil shape, and this wire material is produced by shear cutting with a predetermined length (9 to 180 mm in this embodiment).

  Next, in the forging process shown in FIG. 3, the copper rod 50 is placed on the end face of the die 60 having a die 61 having a deep cylindrical cavity and a punch 62 having a shallow round dish-like cavity. 51 and 51 are inserted so as to face the die 61 and the punch 62, respectively, and forged in the direction of the axis N of the copper bar 11.

Here, at least the outer peripheral portion of the bottom surface 61A of the die 61 is formed with a concave curved portion 64a that curves so as to gradually increase in diameter toward the opening of the die 61, and is formed on the inner peripheral surface 61B of the die 61. It is connected.
Further, the punch 62 is formed with a concave curved portion 64b having the same shape as the concave curved portion 64a provided on the bottom portion 61A of the die 61 so as to face the bottom portion 61A of the die 61.

In this forging process, the copper bar 50 is forged by bringing the die 61 and the punch 62 close to each other in the direction of the axis N. During the forging, the side wall 52 of the deformed copper bar 50 is the inner periphery of the die 61. The distance in the direction of the axis N between the die 61 and the punch 62 at the time of forging is set so as not to make strong contact with the surface 61B.
By this forging process, the portion in contact with the concave curved portions 64a and 64b is formed as the convex curved portion 17, and the above-described end wall portion 15 is formed. At this time, depending on the distance in the direction of the axis N between the die 61 and the punch 62, there is a portion that does not contact the die 61 or the punch 62 in the vicinity of the axis N of the end surface 51 of the copper bar 50. Becomes the disk portion 16. Further, by forging in the direction of the axis N, the cylindrical copper bar 50 is bulged and deformed so that the central part in the direction of the axis N swells. Here, the amount of deformation of the bulging is controlled by adjusting the distance in the axis N direction between the die 61 and the punch 62, and the center part of the axis N direction protrudes so as to be farther from the axis N than the end in the axis N direction. The wall 11 is formed.
Thus, the copper material 10 for plating which is this embodiment whose external shape makes a substantially barrel shape is manufactured.

Below, the manufacturing method of the copper plating material using the copper material 10 for plating which is this embodiment is demonstrated.
In FIG. 4, the example which used the copper material 10 for plating which is this embodiment as a soluble anode is shown.
This plating apparatus 20 accommodates a plating tank 21 in which a plating solution 2 made of a sulfuric acid solution or the like is stored, a material 6 to be plated on which a copper plating film 7 is formed, and a copper material 10 for plating according to this embodiment. And a basket 23. The basket 23 is made of a corrosion resistant material such as Ti.

Here, the material 6 to be plated is a cathode, and the copper material 10 for plating accommodated in the basket 23 is a soluble anode, and the cathode and the anode are energized.
Then, the copper material 10 for plating accommodated in the basket 23 is dissolved in the plating solution 2, so that copper ions are supplied into the plating solution 2, and this copper ion is applied to the surface of the cathode (material to be plated 6). Electrodeposition is performed, and a copper plating film 7 is formed on the surface of the material 6 to be plated.
In this case, as the formation of the copper plating film 7 proceeds, the plating copper material 10 gradually dissolves and decreases. Therefore, it is preferable to provide a means for supplying the plating copper material 10 into the basket 23 as appropriate. .

Next, FIG. 5 shows an example in which copper ions are supplied using the plating copper material 10 according to the present embodiment and copper plating is performed using an insoluble anode.
The plating apparatus 30 includes a plating tank 31 in which a plating solution 2 made of a sulfuric acid solution or the like is stored, a material to be plated 6 on which a copper plating film 7 is formed, an insoluble anode 33 made of iridium oxide, and the like. A copper ion supply device 40 that supplies copper ions therein and a communication path 37 that connects the copper ion supply device 40 and the plating tank 31 are provided.

The copper ion supply device 40 is provided in an ion generation tank 41 in which the plating solution 2 is stored, a hydrogen ion exchange membrane 45 that partitions the ion generation tank 41 into a cathode chamber 41A and an anode chamber 41B, and the cathode chamber 41A. And a basket 43 that is disposed in the anode chamber 41B and accommodates the copper material for plating 10 according to the present embodiment.
Here, the communication path 37 that connects the copper ion supply device 40 and the plating tank 31 is connected to the anode chamber 41 </ b> B of the ion generation tank 41.

  In the copper ion supply device 40, electricity is supplied between the basket 43 and the plating copper material 10 accommodated in the basket 43 as the anode and the cathode portion 44 of the cathode chamber 41 </ b> A. Then, the copper material 10 for plating dissolves in the plating solution 2 and copper ions are supplied into the plating solution 2. Here, the hydrogen ions existing in the anode chamber 41B pass through the hydrogen ion exchange membrane 45 and enter the cathode chamber 41A, and are released to the outside as hydrogen gas from the surface of the cathode portion 44.

  The plating solution 2 supplied with copper ions in the anode chamber 41 </ b> B is supplied into the plating tank 31 through the communication path 37. In this plating tank 31, by applying current to the insoluble anode 33 and the material 6 to be plated, the copper ions in the plating solution 2 are electrodeposited on the surface of the cathode (material 6) to be plated. A copper plating film 7 is formed on the surface of the material 6.

  According to the copper material 10 for plating which is this embodiment made into such a structure, the cylinder wall part 11 extended so that the axis line N may be followed, and a pair of end each located in the both ends of this cylinder wall part 11 And the ratio L / R of the length L in the direction of the axis N and the maximum length R in the direction orthogonal to the axis N satisfies L / R> 1, preferably 1. 05 ≦ L / R ≦ 1.35, more specifically, 10 mm ≦ L ≦ 100 mm, 7.4 mm ≦ R ≦ 95.2 mm, 1.05 ≦ L / R ≦ 1.35 As a result, the ratio S / V of the surface area S to the volume V is increased compared to a ball material having a spherical shape, a contact area with a plating solution such as a sulfuric acid solution is ensured, and copper dissolves in the plating solution. Therefore, copper ions can be efficiently supplied into the plating solution. Moreover, the handleability of the copper material 10 for plating is ensured, and as shown in FIG.4 and FIG.5, the several copper material 10 for plating can be inserted into the baskets 23 and 43 grade | etc.,.

  In addition, since the cylindrical wall portion 11 protrudes so that the central portion in the axial line N direction is farther from the axial line N than the end portion in the axial line N direction, a plurality of copper materials 10 for plating are loaded into the baskets 23, 43, etc. Even in this case, the cylinder wall portions 11 do not adhere to each other and are not stacked, and an area that contacts the sulfuric acid solution or the like can be secured.

  In particular, in the present embodiment, the distance from the axis N (maximum distance from the axis N) H1 at the center in the axis N direction and the distance from the axis N (minimum distance from the axis N) H2 at the end in the axis N direction. The difference H1-H2 is set within a range of 0.01 × L ≦ H1−H2 ≦ 0.15 × L with respect to the total length L of the plating copper material 10, and more specifically, 0. 1 mm ≦ H1-H2 ≦ 15 mm, and the ridgeline formed by the cylindrical wall portion 11 in the cross section along the axis N has a convex curve shape that is convex outward in the radial direction. The radius of curvature r1 is set within a range of 0.525 × L ≦ r1 ≦ 2.0 × L, and in the present embodiment, 5.25 mm ≦ r1 ≦ 200 mm. It is possible to reliably prevent contact between the surface area S and volume V. It is possible to secure the S / V, can promote the dissolution of copper into the plating solution.

  Further, the end wall portion 15 protrudes outward in the direction of the axis N in the vicinity of the axis N and extends in a direction orthogonal to the axis N, and the outer periphery of the disc portion 16 and the cylindrical wall Since the convex curved part 17 which connects the axial direction N direction edge part of the part 11 is provided, even when it is a case where the some copper material 10 for plating is inserted in the baskets 23 and 43 grade | etc., The end wall part 15 It is possible to secure an area that comes into contact with the sulfuric acid solution and the like, since they are not closely stacked. Therefore, copper is easily dissolved in a plating solution such as a sulfuric acid solution, and copper ions can be supplied more efficiently into the plating solution.

  In particular, in the present embodiment, the protruding length M of the disc portion 16 protruding outward in the direction of the axis N in the vicinity of the axis N is 0.05 × L with respect to the total length L of the copper material 10 for plating. ≦ M ≦ 0.45 × L, more specifically, 0.5 mm ≦ M ≦ 45 mm, and the curvature of the convex curve formed by the convex curved portion 17 in the cross section along the axis N Since the radius r2 is in the range of 0.1 × L ≦ r2 ≦ 1.0 × L, more specifically 1 mm ≦ r2 ≦ 100 mm, it is ensured that the end wall portions 15 are in close contact with each other. In addition, it is possible to improve the handleability of the plating copper material 10.

  Furthermore, since the ratio D1 / D2 between the diameter D1 of the disc portion 16 and the maximum diameter D2 of the end wall portion 15 is set within the range of 0 ≦ D1 / D2 ≦ 0.7, the disc portion 16 Even when they are in close contact with each other, the other portion (convex curved portion 17) of the end wall portion 15 comes into contact with the plating solution, and the dissolution of copper can be promoted. In addition, when the close_contact | adherence of the end wall parts 15 is considered, it is preferable not to have the disc part 16. FIG.

Furthermore, in the manufacturing method of the copper plating material using the copper material 10 for plating which is this embodiment, the copper material 10 for plating melt | dissolves efficiently in the plating solution 2, and copper ion is supplied in the plating solution 2. Therefore, copper plating can be performed efficiently.
Moreover, as shown in FIG. 5, when the copper ion supply apparatus 40 is used, also in the manufacturing method of the copper plating material using the insoluble anode 33, the copper material 10 for plating which is this embodiment is used. can do.

As mentioned above, although the copper material for plating which is embodiment of this invention and the manufacturing method of the copper plating material using the copper material for plating of this invention were demonstrated, this invention is not limited to this, Changes can be made as appropriate without departing from the technical idea.
For example, the ridgeline formed by the cylindrical wall portion in the cross section along the axis N has been described as having a convex curve shape that is convex outward in the radial direction, but the present invention is not limited thereto, and the axis line A cylindrical surface extending along the axis N may be provided at the center in the N direction. However, the convex curve having the aforementioned curvature radius r1 needs to occupy 50% or more of the ridgeline formed by the cylindrical wall portion.

Moreover, although the copper material for plating was demonstrated as what is produced by forging the copper bar material which consists of a low oxygen copper or an oxygen-free copper, it is not limited to this and phosphorus is 0.03 mass%. You may forge the copper bar which consists of a phosphorus containing copper alloy containing 0.08 mass% or less above. In this case, the plating copper material is smoothly dissolved, and a uniform plating film can be formed.
Furthermore, the copper material for plating may be made of tough pitch copper (TPC) or high-purity copper (5N copper, 6N copper, etc.) having a purity of 99.999% or more excluding gas components.

Moreover, about the to-be-plated material 6, it does not specifically limit, In the copper plating with respect to various to-be-plated materials, the copper material for plating of this invention can be used. For example, it can be used for copper plating on printed wiring boards, copper plating for semiconductors, copper plating on plastic materials, copper plating on steel plates, and the like.

  Furthermore, although it demonstrated as what produces a copper bar by the continuous casting rolling means using a belt wheel type continuous casting machine, it is not limited to this, A copper bar is made by other means, such as extrusion molding. It may be produced.

Moreover, the structure of the plating apparatus which performs copper plating is not limited to what was described in FIG.4 and FIG.5, and can change a design suitably.
Furthermore, in the copper ion supply apparatus of the present embodiment, copper ions are generated by an electrolysis method, but the present invention is not limited to this, and the copper material is heated to concentrated sulfuric acid (for example, temperature 70 ° C., concentration 98%) It is good also as a structure which produces | generates a copper ion using the method of making it soak and dissolve.

  Furthermore, the structure of the die | dye and punch used when manufacturing the copper material for plating which is this embodiment is not limited to description of embodiment. For example, a flat portion is provided at the center of the bottom surface of the die, and a concave curved portion is formed on the outer peripheral side of the flat portion so as to gradually increase in diameter toward the opening of the die. A flat part and a concavely curved part formed in the same shape as the flat part and the concavely curved part provided at the bottom of the die may be used so as to face the bottom part of the die. In this case, a disk part is formed on the end wall part of the copper material for plating so as to correspond to the flat part of the die and the punch, and the pressing force is sufficiently loaded by this disk part. This makes it possible to efficiently produce the copper material for plating.

The ratio S / V between the surface area S and the volume V was calculated for the copper material for plating of the present invention and the conventionally used copper balls for plating.
The conventional example was a copper ball for plating having a diameter of 11 mm, which is generally used widely.
As an example of the present invention, a copper rod material having a diameter of 8.0 mm was made to have the same volume as the above-described copper ball for plating, and a copper material for plating having a roughly barrel shape was produced by forging. Here, in the copper material for plating of the present invention example, the length L in the direction of the axis N = 12.4 mm, the maximum length R in the direction perpendicular to the axis N = 9.4 mm, and the convex curve formed by the ridgeline of the cylindrical wall portion Radius of curvature r1 = 15 mm, protrusion length M = 1.6 mm of the disk part, diameter D1 of the disk part = 3.6 mm, maximum diameter D2 of the end wall part = 8.1 mm, convex curve formed by the convex curve part The radius of curvature r2 is 8 mm.

  In the above-described example of the present invention, the ratio S / V of the surface area S to the volume V is about 1.1 times that of the conventional example, and the contact area with the plating solution increases, so It was confirmed that the dissolution of was promoted.

2 Plating solution 6 Material to be plated 10 Copper material for plating 11 Tube wall 15 End wall 20, 30 Plating equipment 21, 31 Plating tank 23, 43 Basket 33 Insoluble anode 40 Copper ion supply device

Claims (5)

It is a copper material for plating used when supplying copper ions into the plating solution,
Extend along the axis, comprises a cylindrical wall section perpendicular to said axis forms a circular, an end wall portion positioned at both ends of the cylindrical wall portion,
The cylindrical wall portion protrudes so that the axial center portion is separated from the axial line rather than the axial end portion,
A copper material for plating, wherein a ratio L / R between the axial length L and the maximum length R in a direction orthogonal to the axial line is set to L / R> 1.
  The ratio L / R between the axial length L and the maximum length R in the direction orthogonal to the axial line is set within a range of 1.05 ≦ L / R ≦ 1.35. The copper material for plating according to claim 1.   3. The copper material for plating according to claim 1, wherein the end wall portion has a portion in the vicinity of the axis that protrudes outward in the axial direction. In the plating tank in which the plating solution is stored, the material to be plated is immersed as a cathode, a soluble anode is immersed in the plating tank, and the anode and the cathode are energized to deposit copper on the surface of the material to be plated. A method for producing a copper plating material,
The copper material for plating as described in any one of Claims 1-3 as the said soluble anode is immersed in the said plating tank, The manufacturing method of the copper plating material characterized by the above-mentioned. In the plating tank in which the plating solution is stored, the material to be plated is immersed as a cathode, the insoluble anode is immersed in the plating tank, and the anode and the cathode are energized to deposit copper on the surface of the material to be plated. A method for producing a copper plating material,
A plating solution supplied with copper ions is generated by dissolving the copper material for plating according to any one of claims 1 to 3, and the plating solution is supplied to the plating tank. A method for producing a copper plating material.

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