JP5440729B2 - Combination of IC tag and attached object - Google Patents

Description

  The present invention relates to a combination of an IC tag and a pasting target that can communicate with an external device without contact.

IC tags and IC cards are also referred to as RFID (Radio Frequency Identification), have an IC chip that holds information that can identify an individual, and read information in a non-contact manner by wireless communication using a dedicated reader. Is possible.
Since IC tags and IC cards are small and can be recognized individually, in recent years, they are used in a wide variety of fields, such as process management at the factory of products, distribution information management, electronic payment systems, etc. Has been. With the expansion of the field of use, IC tags and IC cards are used in various environments, and therefore, various structures for attaching to objects, durability, and the like have been devised.
For example, Patent Document 1 describes an IC tag attachment structure in which an IC tag is detachably attached to an object.

JP 2007-241781 A

Along with the spread of the field of use, there are various objects to which IC tags can be attached, and some objects cannot be attached using screws or the like. In such a case, the IC tag is bonded and attached to an object with an adhesive or the like.
In recent years, IC tags have been miniaturized, and when an IC tag is attached to an object using an adhesive or the like, there is a problem that the adhesive strength is reduced due to the reduction in the area of the joint surface with the object due to the miniaturization. It has become to. In particular, when IC tags are affixed to objects that are expected to be used outdoors, such as logistics materials such as containers and pallets, buildings, etc., they are exposed to harsh environments such as high and low temperatures and rain. Further improvement is required for the adhesive strength.

  An object of the present invention is to provide a combination of an IC tag and an object to be pasted that can obtain sufficient adhesive strength even when downsized.

  The present invention solves the above problems by the following means. In addition, in order to make an understanding easy, although the code | symbol corresponding to embodiment of this invention is attached | subjected and demonstrated, it is not limited to this.

The invention of claim 1 includes an IC tag (80) that can communicate with an external device in a non-contact manner, and an application target (300) to which the IC tag is attached via an adhesive. The IC tag is formed on at least a part of the outer periphery of the main body part, the main body part (11) containing the inlet, the joining surface (13) joined to the pasting object, The hook-shaped portion (82 (82a, 82b, 82c)), the hook-shaped portion is formed to extend in parallel in three directions orthogonal to each other, and the joint surface is at least partially rough. A surface is formed, and one surface of the bowl-shaped portion in the thickness direction of the IC tag serves as the bonding surface, and the sticking object is a concave corner formed by surfaces extending in parallel in three directions orthogonal to each other. IC tag characterized by having a portion A combination of object to be adhered.
According to a second aspect of the present invention, in the combination of the IC tag according to the first aspect and the object to be pasted, a concave portion (14) that can be filled with the adhesive is formed on the joint surface (13). The combination of an IC tag characterized by the above and an object to be pasted.
The invention according to claim 3 is a combination of an IC tag and an object to be pasted, characterized in that in the combination of the IC tag and the object to be pasted according to claim 2, the concave portion has an undercut shape. .
According to a fourth aspect of the present invention, in the combination of the IC tag according to the second or third aspect, the one surface of the bowl-shaped portion has a substantially planar shape other than the concave portion. This is a combination of an IC tag and an object to be pasted.

  Note that the configuration described with reference numerals may be modified as appropriate, and at least a part of the configuration may be replaced with another component.

According to the present invention, the following effects can be obtained.
(1) Since the joint surface of the IC tag according to the present invention has a concave portion that is at least partially roughened and can be filled with an adhesive, the surface area of the joint surface of the IC tag increases, and the concave portion Thus, a thick part of the adhesive is formed on a part of the joint surface. Accordingly, the adhesive strength of the IC tag to the object to be attached can be increased. In addition, by providing the recess, shape followability to a curved surface such as a cylindrical surface or the inside of a pipe can be obtained, so that the ease of attachment and adhesion of the IC tag can be improved. Furthermore, by providing a convex shape corresponding to a part of the concave portion on the object to be pasted side, positioning and orientation when attaching the IC tag are facilitated.

(2) The shape of the recess is a shape corresponding to the shape of the joint portion of the object to be pasted with the IC tag, so that the IC tag can be easily positioned and oriented, and can be easily attached to the object to be pasted. Yes.

(3) Since the recess has an undercut shape, the effect of improving the adhesive strength can be further enhanced.

(4) Since it has a hook-shaped part formed on at least a part of the outer periphery of the main body part, and the surface on the bonding surface side of the hook-shaped part in the thickness direction of the IC tag is a bonding surface to the pasting object, The area of the surface can be increased, and the adhesive strength of the IC tag to the pasting object can be further increased.

(5) The bonding surface of the IC tag according to the present invention has a bowl-shaped part formed on at least a part of the outer periphery of the main body part with a rough surface formed at least partially, and a bowl-like shape in the thickness direction of the IC tag. Since the surface on the bonding surface side of the part becomes the bonding surface, the surface area of the bonding surface can be increased, and the adhesive strength of the IC tag to the pasting object can be further increased.

(6) Since the concave portion that can be filled with the adhesive is formed on the joint surface, the thickness of the adhesive is increased in the region where the concave portion is formed. Accordingly, the adhesive strength of the IC tag to the object to be attached can be increased. In addition, by providing the recess, shape followability to a curved surface such as a cylindrical surface or the inside of a pipe can be obtained, so that the ease of attachment and adhesion of the IC tag can be improved. Furthermore, by providing a convex shape corresponding to a part of the concave portion on the object to be pasted side, positioning and orientation when attaching the IC tag are facilitated.

(7) Since the recess has an undercut shape, the effect of improving the adhesive strength can be further enhanced.
(8) Since the hook-shaped portion has a shape corresponding to the shape of the joint portion of the object to be pasted with the IC tag, the adhesive strength to the object to be pasted can be increased, and the IC tag is easily pasted. .

(9) Since the surface on the bonding surface side of the bowl-shaped portion forms the same plane as the bonding surface, the area of the bonding surface can be increased. Further, since the surface on the bonding surface side of the hook-shaped portion forms the same plane as the bonding surface, the surface on the bonding surface side of the hook-shaped portion does not coplanar with the bonding surface, that is, the main body portion of the formed IC tag. Compared to the case where the hook-shaped part is formed in the middle part in the thickness direction (that is, the part other than the end part), the shape is simple. Can be done.

(10) Since a part of the joint surface has a smooth surface, for example, if a region to be a smooth surface is formed in a part of the outer peripheral part, the part has a lower adhesive strength than the other outer peripheral part. It can be used as a trigger for removing the IC tag from the object to be pasted when the IC tag is exchanged or collected.

(11) The joint surface of the IC tag according to the present invention has a concave portion that is at least partially roughened and can be filled with an adhesive, and is on the joint surface side of the bowl-shaped portion in the thickness direction of the IC tag. Since the surface becomes a bonding surface, the surface area of the bonding surface of the IC tag is increased, and a thick portion of the adhesive is formed on a part of the bonding surface by the recess. Accordingly, the adhesive strength of the IC tag to the object to be attached can be increased. In addition, by providing the concave portion, shape followability to a curved surface can be obtained, so that the ease of attachment and adhesion of the IC tag can be improved. Furthermore, by providing a convex shape corresponding to a part of the concave portion on the object to be pasted side, positioning and orientation when attaching the IC tag are facilitated.

It is a figure explaining IC tag 10 of a 1st embodiment. It is sectional drawing which shows a mode that the IC tag 10 of 1st Embodiment is joined to the sticking target object 100. FIG. It is a figure explaining IC tag 20 of a 2nd embodiment. It is a figure which shows the deformation | transformation form of an IC tag. It is a figure which shows the deformation | transformation form of an IC tag. It is a figure which shows the deformation | transformation form of an IC tag.

Embodiments of the present invention will be described below with reference to the drawings.
In addition, each figure shown below including FIG. 1 is the figure shown typically, and the magnitude | size and shape of each part are exaggerated suitably for easy understanding.
In addition, the numerical values such as the dimensions of the respective members and the material names described in the present specification are examples of the embodiment, and are not limited thereto, and may be appropriately selected and used.

(First embodiment)
FIG. 1 is a diagram illustrating an IC tag 10 according to the first embodiment.
Fig.1 (a) is the perspective view which looked at IC tag 10 of 1st Embodiment from the opposite side (main-body part 11 side) to the joining surface 13 which joins the sticking target object 100, FIG.1 (b). These are the perspective views which looked at the IC tag 10 from the joint surface 13 side.

The IC tag 10 of the first embodiment has a substantially rectangular parallelepiped main body 11 and a thickness that is thinner than the main body 11, along the outer periphery of the main body 11 on one end side in the thickness direction of the main body 11. And a flange 12 formed.
The IC tag 10 is an RFID that can communicate with an external device (not shown) in a contactless manner.
In the IC tag 10, the flange portion 12 and the main body portion 11 are integrally formed by enclosing an inlet (not shown) in the main body portion 11 and injection-molding polyphenylene sulfide resin (PPS) or the like.

The main body 11 includes an inlet (not shown) including an IC chip and a multilayer substrate in which a plurality of antennas formed on an insulating substrate are stacked. The inlet has a substantially rectangular planar shape, and its dimensions are about 5 mm × 5 mm to 15 mm × 15 mm, and is very small compared to conventional card type or stick type inlets. The IC tag 10 has a substantially rectangular planar shape and a size of about 10 mm × 10 mm to 20 mm × 20 mm, and the IC tag is very small as compared with the conventional IC tag.
The inlet of this embodiment has a substantially rectangular planar shape, a dimension of about 5.5 mm × 5.5 mm, and a thickness of 0.8 mm. The IC tag 10 has a main body portion. The planar shape is about 7 mm × 7 mm, the planar shape including the flange portion is about 10 mm × 10 mm, and the overall thickness is about 3.8 mm. In addition, although the inlet of this embodiment used the thing with a substantially rectangular planar shape, it is not restricted to this, For example, you may select and use the thing of shapes, such as a substantially circular shape, etc. suitably.

The collar portion 12 is a collar-like portion that is thinner than the main body portion 11 and is formed along the outer periphery of the main body portion 11. As shown to Fig.1 (a), one end surface of the collar part 12 and the one end surface of the main-body part 11 form the same plane, The surface joins to the sticking target object 100 mentioned later. This is the joint surface 13.
In addition, a concave portion 14 that is concave with respect to the bonding surface 13 (with respect to the pasting object 100 when bonded to the pasting object 100) is formed in the approximate center of the bonding surface 13 of the IC tag 10. .
The recess 14 is formed so that the planar shape seen from the normal direction of the joint surface 13 is substantially rectangular, and its area is smaller than the planar shape of the main body 11 seen from the normal direction of the joint surface 13. Has been.
Note that the depth of the concave portion 14 and the planar shape and area viewed from the normal direction of the joining surface 13 and the roughness of the rough surface S can be selected freely according to the shape of the object to be pasted and the characteristics of the adhesive. You can do it. For example, in the present embodiment, the planar shape of the recess 14 viewed from the normal direction of the bonding surface 13 is smaller than the planar shape of the main body 11 viewed from the normal direction of the bonding surface 13. Although formed, it is not restricted to this, For example, you may provide so that the area may become larger than the planar shape of the main-body part 11. FIG.

The entire surface of the IC tag including the bonding surface 13 is a rough surface S due to graining.
The depth by general embossing is in the range of about 0.002 to 0.1 mm. In this embodiment, the fine unevenness of the rough surface S has a depth from the peak to valley of the unevenness of about 0.00. 04 mm.

FIG. 2 is a cross-sectional view showing a state in which the IC tag 10 of the first embodiment is joined to the pasting object 100. In order to facilitate understanding, in FIG. 2, the inlet and the like in the IC tag 10 are omitted, and the portion that is the rough surface S on the surface of the IC tag 10 is hatched.
The IC tag 10 is bonded to a predetermined area of the sticking object 100 having a substantially planar shape via a bonding layer 200 made of an adhesive or the like.
The bonding layer 200 is formed by applying a resin such as an adhesive to the bonding surface 13 or the pasting object 100.

The IC tag 10 is bonded, for example, by applying an adhesive or the like to the bonding surface 13 and then pressing it onto a predetermined position of the pasting object 100. At this time, since the bonding surface 13 including the concave portion 14 is a rough surface S, an adhesive or the like enters the fine irregularities. Therefore, since the surface area in contact with the adhesive on the IC tag 10 side is increased, an improvement in the adhesive strength between the IC tag 10 and the object 100 can be expected.
Moreover, the anchor effect with respect to an adhesive agent is also expectable by the fine unevenness | corrugation of the rough surface S of the joint surface 13. FIG. Therefore, it is possible to further improve the adhesive strength by combining the increase in the surface area of the joint surface with the anchor effect.

Furthermore, since the area of the bonding surface 13 itself is increased by providing the flange portion 12, the area to be bonded through the adhesive is further expanded, and the adhesive strength can be improved.
In addition, a recess 14 is formed in the joint surface 13. Therefore, as shown in FIG. 2, the adhesive or the like enters the concave portion 14 and is filled when stuck on the sticking object 100. Therefore, the thickness of the bonding layer 200 is greater in the portion where the recess 14 is formed than in other portions. Thereby, adhesive strength can be raised more.

Therefore, according to this embodiment, the adhesive strength of the IC tag 10 to the object to be attached 100 can be improved, and both the miniaturization of the IC tag and the improvement of the adhesive strength to the object to be attached can be achieved. it can.
In addition, the rough surface S can be applied by embossing or the like, and is easier to form than other machining directions such as electric discharge machining.
Further, the surface of the IC tag 10 has fine irregularities formed by embossing on the entire surface, and the rough surface S is also formed on the exposed portion other than the joint surface 13. It is possible to prevent the exposed portion from being damaged and to improve the appearance design. Further, since the surface of the IC tag 10 has fine irregularities formed by embossing on the entire surface, the surface is difficult to slip, and even a small IC tag 10 is easy to handle.

(Second Embodiment)
FIG. 3 is a diagram illustrating the IC tag 20 according to the second embodiment. FIG. 3A is a perspective view of the IC tag 20 as viewed from the bonding surface 13 side, and FIG. 3B is a cross-sectional view illustrating a state in which the IC tag 20 is bonded to the object to be pasted. . In order to facilitate understanding, in FIG. 3B, the inlet and the like inside the IC tag 20 are omitted as in FIG. 2, and the portion of the IC tag 20 that is the rough surface S is hatched. It is shown.
The IC tag 20 of the second embodiment is different from the IC tag 10 shown in the first embodiment in that a convex portion 25 is formed at the approximate center of the joint surface 13. Accordingly, parts having the same functions as those of the IC tag 10 according to the first embodiment described above are denoted by the same reference numerals or the same reference numerals at the end, and redundant description is appropriately omitted.

The IC tag 20 has a main body part 11 and a flange part 12, and a convex part 25 is formed at the approximate center of the joining surface 13 that joins the pasting object 100. Therefore, the other portion of the joint surface 13 is a recess 25a with respect to the protrusion 25.
The convex portion 25 has a substantially rectangular planar shape when viewed from the normal direction of the joint surface 13, and its area is smaller than the planar shape of the main body portion 11 when viewed from the normal direction of the joint surface 13. Is formed.
The entire surface of the IC tag 20 is a rough surface S.

As with the IC tag 10 of the first embodiment, the IC tag 20 can be affixed to a planar portion of the affixing object 100. However, as shown in FIG. This is more effective when bonded to 100 concave surfaces 100a.
First, as shown in FIG. 3 (b), an adhesive or the like enters and fills a space (dent 25a) formed by the concave surface 100a of the object 100 to be pasted and the convex part 25 and the flange part 12 of the IC tag 20. Therefore, the thickness of the bonding layer 200 corresponding to the recess 25a is thicker than that of the other portions. Therefore, in a part of the region corresponding to the recess 25a, the bonding layer 200 is thicker than the other part, and the adhesive strength can be improved.
Further, compared to an IC tag in which the convex portion 25 is not formed (for example, the IC tag 10 of the first embodiment), the convex portion 25 is present, so that it easily follows the shape of the concave surface 100a, and more than necessary. In addition, it is not necessary to increase the thickness of the bonding layer, and the bonding operation can be easily performed.
From the above, it can be said that the IC tag 20 is effective from the viewpoints of adhesive strength, workability, and the like when bonded to the concave surface 100a of the object 100 to be pasted.

Therefore, according to the present embodiment, it is not easy to join the flat IC tag having a convex portion on the joining surface, and joining to the concave surface 100a of the pasting object 100 can be easily performed.
Note that the height of the convex portion 25 of the IC tag 20 and the planar shape viewed from the normal direction of the bonding surface 13 can be appropriately designed and provided in accordance with the curvature of the concave surface 100a. For example, in this embodiment, the planar shape of the convex portion viewed from the normal direction of the bonding surface 13 is smaller than the planar shape of the main body portion 11 viewed from the normal direction of the bonding surface 13. Although the example in which it was formed was shown, it is not restricted to this, You may provide so that the area may become large. Further, the size of the convex portion 25 can be appropriately designed in the same manner, and may be formed larger than the size of the main body portion 11.

(Deformation)
Without being limited to the embodiments described above, various modifications and changes are possible, and these are also within the scope of the present invention. In addition, although each embodiment and the modification shown below can also be used in combination suitably, detailed description is abbreviate | omitted. Further, the present invention is not limited by the embodiments described above.

(1) In each embodiment, although the rough surface S showed the example formed in the whole surface of IC tag 10 and 20, it is not restricted to this, What is necessary is just to be formed in the joint surface 13 at least.
Moreover, in each embodiment, although the rough surface S showed the example currently formed in the whole surface of the joining surface 13, it is not restricted to this, For example, the rough surface S is an outer peripheral part, four corners, etc. of the joining surface 13. Others may be provided on a part of the joint surface 13 to be a smooth surface, or a rough surface may be formed on substantially the whole surface of the joint surface 13 and a smooth surface may be formed on a part thereof.
4, 5 and 6 are diagrams showing modifications of the IC tag. FIG. 4A shows an IC tag 30 in which a smooth surface H is formed on a part of the outer peripheral portion of the joint surface 13 and a region other than the smooth surface H is a rough surface S.
The portion where the smooth surface H is formed has slightly lower adhesive strength than the portion where the rough surface S is formed. Therefore, if it is set as such a form, the smooth surface H can be utilized as a trigger at the time of removing the IC tag 30 from a sticking target object at the time of collection | recovery, replacement | exchange, etc. of an IC tag.

(2) In each embodiment, an example in which one concave portion or convex portion is formed on the joint surface is shown. However, the present invention is not limited thereto, and a plurality of concave portions and convex portions may be formed. You may form combining a convex part. When a plurality of recesses and projections are formed, a plurality of recesses and projections may be arranged in a one-dimensional direction, a plurality of depressions and projections may be arranged in a two-dimensional direction, or may be formed radially.
Moreover, in each embodiment, although the recessed part and the convex part showed the example whose cross-sectional shape is substantially rectangular shape, for example, it may have a semicircular shape or a triangular cross-sectional shape. Good.
4B and 4C show, as an example, cross sections of modified IC tags 40 and 50 in which a plurality of concave portions 44 and 54 are formed in the joint surface 13 in a one-dimensional direction, and FIG. These show the figure which looked at the IC tag 90 of the deformation | transformation form which made the some recessed part 94 radial from the bonding surface 13 side. In FIGS. 4B and 4C, the oblique lines indicating the rough surface S are omitted.

The IC tag 40 shown in FIG. 4B is formed with a plurality of groove-shaped recesses 44 having a substantially rectangular cross-section in a one-dimensional direction on the joint surface 13.
The IC tag 50 shown in FIG. 4C is formed with a plurality of groove-shaped recesses 54 having a substantially semicircular cross-section in the one-dimensional direction on the joint surface 13.
The IC tag 90 shown in FIG. 4D has a plurality of groove-shaped recesses 94 formed radially on the joint surface 13.
Thus, by forming the plurality of recesses 44, 54, 94 on the joint surface 13, the surface area of the joint surface 13 can be increased, and the adhesive strength can be improved. Further, as shown in FIGS. 4B to 4D, the concave portions 44, 54, 94 are also formed in the vicinity of the outer peripheral portion of the joining surface 13, and therefore, when joined to the object to be pasted using an adhesive. The thick portion of the bonding layer is also formed in the vicinity of the outer peripheral portion of the bonding surface 13, and the adhesive strength can be further increased.

In addition, as shown in FIG. 4D, when the plurality of recesses 94 are formed radially, the wet spread of the liquid adhesive on the joint surface can be made uniform.
Therefore, it is possible to suppress insufficient filling of the adhesive between the bonding surface 13 of the IC tag 90 and the surface of the object to be pasted and a decrease in the adhesive force due to remaining bubbles, and the appearance of the adhesive protrudes. The IC tag can be easily attached without damaging it.

(3) In 1st Embodiment, although the surface of the sticking target object 100 with which the IC tag 10 is adhere | attached showed the example which is substantially planar shape, it is not restricted to this, For example, it is a recessed part in the surface of a sticking target object. A convex shape corresponding to a part of the 14 shapes may be provided.
By providing such a convex shape, it is possible to easily perform positioning and orientation when the IC tag is attached to the pasting object.

(4) In 1st Embodiment, although the IC tag 10 showed the example (refer FIG. 2) affixed so that the main-body part 11 may protrude outward with respect to the surface of the sticking target object 100, this is shown. Not only, but it may be joined to the concave embedding part 100b formed in the pasting object 100 in a form in which the main body part 11 side is embedded.
FIG. 5A shows a cross section of the IC tag 60 in a form in which the main body portion 11 side is embedded in a concave embedded portion 100b formed in the pasting object 100. FIG. In FIG. 5A, the inlet and the like in the IC tag 60 are omitted, and the portion where the surface of the IC tag 60 is a rough surface S is shown by hatching.
The IC tag 60 has a form in which the main body portion 11 side is embedded in the embedded portion 100b, and the side surface and the top surface of the main body portion 11 that become the bonding surface 63 with respect to the pasting object 100, and the main body portion 11 side of the collar portion 12 A rough surface S is formed on this surface. In addition, a concave portion 64 is formed at the approximate center of the surface (the surface facing the bottom surface of the embedded portion 100 b) serving as the convex top surface of the main body 11.

By setting it as such a form, the area of the joint surface 63 to the sticking target object 100 of the IC tag 60 is increased, and the surface area of the joint surface 63 is also increased by the rough surface S, so that the adhesive strength is further improved. Can be made.
Moreover, since only the collar part 12 thinner than the main body part 11 protrudes from the surface of the sticking object 100 and the thicker main body part 11 does not protrude, the IC tag 60 is damaged by an external impact. It is possible to prevent damage or detachment from the object 100 to be applied.
The IC tag 10 shown in the first embodiment can also be used by embedding the main body 11 side in the embedding part 100 b of the pasting object 100 like the IC tag 60.

(5) In each embodiment, although the main body part 11 showed the example which is a substantially rectangular parallelepiped shape, it is not restricted to this, For example, a substantially cubic shape may be sufficient, polygonal column shape other than a rectangle may be sufficient, and a cylinder A shape or a disk shape (button type) may be used, and the shape may be freely selected from the viewpoint of the shape of the inlet, the shape of the object to be pasted, the purpose of use, the designability, and the like. For example, when the shape of the main body is a substantially cylindrical shape or a substantially disk shape, when the IC tag is affixed to the object to be affixed, the direction of the main body part relative to the affixing object can be affixed without any particular limitation, The pasting work becomes easy and the working time can be shortened.

(6) In each embodiment, although the example in which the collar part 12 is provided so that it may lap | rotate along the outer periphery of the main-body part 11 was shown, it does not restrict to this, For example, it forms only in two opposing directions etc. Alternatively, the collar portion 12 may be formed in accordance with the shape of the pasting area of the object to be pasted, or may not be provided with the collar portion 12, and the shape may be adjusted according to the shape of the object to be pasted or the use environment. The shape may be appropriately selected.
FIGS. 5B and 5C show variations of the shape of the collar.
In the IC tag 70 shown in FIG. 5B, the flange 72 is formed only in two opposing directions. With such a configuration, it is possible to cope with a case where the pasting area of the pasting object is narrow, and the production cost can be reduced.
The IC tag 80 shown in FIG. 5C has its flanges 82 (82a, 82b, 82c) formed in three directions orthogonal to each other. If it is set as such a form, IC tag 80 can be easily arrange | positioned in the corner | corner of the corner inside box-type sticking target 300, etc. And since the area of a joint surface can be enlarged more by a collar part, adhesive strength can be increased.

(7) In each embodiment, although the rough surface S showed the example provided by embossing, it does not restrict to this, For example, a rough surface is formed using blast processing, electric discharge processing, chemical treatment, etc. Alternatively, the rough surface may be formed by polishing with sandpaper or the like.

(8) In each embodiment, the concave portion 14 and the convex portion 25 have a convex shape or a concave shape, that is, a so-called undercut shape that cannot be released by movement in one direction when the molded product of the IC tag is taken out from the mold. Also good.
FIG. 6 shows a modified form of the IC tag in which the concave and convex portions have an undercut shape.
In the IC tag 110 of FIG. 6A, the recess 114 formed in the approximate center of the joint surface 13 has an undercut shape. The concave portion 114 is a plane of a portion (opening surface of the concave portion 114) 114b in which the planar shape of the main body portion 11 side (the bottom surface of the concave portion 114) 114a of the concave portion 114 is the pasting object side as viewed from the normal direction of the bonding surface 13. Bigger than shape.
In the IC tag 120 of FIG. 6B, the convex portion 125 formed at the approximate center of the joint surface 13 has an undercut shape. As for the convex part 125, the planar shape of the surface 125b used as the sticking target object side seen from the normal line direction of the joint surface 13 is larger than the planar shape of the part 125a by the side of the main-body part 11 of the convex part 125. FIG.

Further, the IC tag 130 of FIG. 6C is formed by arranging a plurality of groove-shaped recesses 134 having a substantially circular cross-sectional shape in a one-dimensional direction. The recess 134 is formed such that the center 134a of the circle having a cross-sectional shape is located closer to the main body 11 than the portion 134b serving as the opening surface on the pasting object side.
Further, in the IC tag 140 of FIG. 6D, the concave portion 144 formed at the approximate center of the bonding surface 13 has a fine concave-convex shape 144c such as a screw thread shape on its side surface.
By forming such undercut concave and convex portions, in addition to increasing the surface shape of the bonding surface, the bonding layer formed by the adhesive that has entered the concave portion is difficult to peel off from the IC tag. Further, the adhesive strength can be further improved.
The undercut shape is not limited to the above example, and can be appropriately selected and used. Further, a plurality of recesses and protrusions having an undercut shape may be provided, and the arrangement method thereof may be appropriately selected and used.

DESCRIPTION OF SYMBOLS 10,20 IC tag 11 Main-body part 12 collar part 13 joining surface 14 recessed part S rough surface 100 sticking target object 100a concave surface 200 joining layer

Claims (4)

A combination of an IC tag and a pasting object, comprising an IC tag that can communicate with an external device in a non-contact manner, and a pasting object to which the IC tag is pasted via an adhesive,
The IC tag is
A main body containing the inlet;
A bonding surface to be bonded to the pasting object;
A bowl-shaped part formed on at least a part of the outer periphery of the main body part;
Have
The hook-shaped portion is formed extending in parallel to three directions orthogonal to each other,
The joint surface is formed with a rough surface at least partially,
One surface of the bowl-shaped portion in the thickness direction of the IC tag becomes the bonding surface,
The pasting object has concave corners formed by surfaces extending in parallel to three directions orthogonal to each other;
A combination of an IC tag and an object to be pasted. In the combination of the IC tag according to claim 1 and the pasting object,
A concave portion that can be filled with the adhesive is formed on the joint surface,
A combination of an IC tag and an object to be pasted. In the combination of the IC tag according to claim 2 and the pasting object,
The recess has an undercut shape;
A combination of an IC tag and an object to be pasted. In the combination of the IC tag according to claim 2 or claim 3 and the pasting object,
The one surface of the bowl-shaped part has a substantially planar shape other than the concave part,
A combination of an IC tag and an object to be pasted.

Images