JP2007048168A - Reinforcing plate for ic chip, and paper - Google Patents

Reinforcing plate for ic chip, and paper Download PDF

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JP2007048168A
JP2007048168A JP2005233888A JP2005233888A JP2007048168A JP 2007048168 A JP2007048168 A JP 2007048168A JP 2005233888 A JP2005233888 A JP 2005233888A JP 2005233888 A JP2005233888 A JP 2005233888A JP 2007048168 A JP2007048168 A JP 2007048168A
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chip
reinforcing plate
recess
fixed
product
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JP4845179B2 (en
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Yoshiharu Hino
吉晴 日野
Hiromi Uchimura
浩美 内村
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Maxell Seiki Ltd
National Printing Bureau
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Maxell Seiki Ltd
National Printing Bureau
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Abstract

<P>PROBLEM TO BE SOLVED: To reliably protect an IC chip even if the IC chip is built in a flexible sheet product. <P>SOLUTION: A hard reinforcing plate 6 for fixing an IC chip 3 is built in a flexible sheet product such as an IC card. The reinforcing plate 6 has in an upper surface a recess 11 for storing the IC chip 3, and the IC chip 3 is fixed in the bottom of the recess 11. A depth dimension H of the recess 11 is set larger than a thickness dimension L1 of the IC chip 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、ＩＣチップを固定した状態で、柔軟なシート状の製品に内蔵されるＩＣチップの補強板およびその補強板を内蔵した用紙に関する。   The present invention relates to an IC chip reinforcing plate incorporated in a flexible sheet-like product in a state where the IC chip is fixed, and a paper incorporating the reinforcing plate.

特許文献１〜５には、ＩＣカードなどのシート状の製品にＩＣチップを内蔵し、そのＩＣチップを補強部材で囲むことで、製品の撓み変形によるＩＣチップの破損などを防止するものが開示されている。特許文献６には、下部紙層と上部紙層との間にＩＣチップを内包した不織布をすき込んだ多層すき合わせ紙が開示されている。   Patent Documents 1 to 5 disclose that an IC chip is incorporated in a sheet-like product such as an IC card and the IC chip is surrounded by a reinforcing member to prevent damage to the IC chip due to bending deformation of the product. Has been. Patent Document 6 discloses a multilayer laminated paper in which a nonwoven fabric containing an IC chip is inserted between a lower paper layer and an upper paper layer.

特許文献１では、フレキシブル基板に固定したＩＣチップを保護キャップで覆って保護している。特許文献２では、オーバーシートに固定したＩＣチップの周囲をリング状の補強用枠体で囲って保護している。特許文献３では、基板に固定したＩＣチップをエポキシ樹脂で被覆するとともに、該エポキシ樹脂の上側に補強板を配している。特許文献４・５では、基板（シート）に固定したＩＣチップの上面に補強材を固定してある。   In Patent Document 1, an IC chip fixed to a flexible substrate is covered with a protective cap for protection. In Patent Document 2, the periphery of the IC chip fixed to the oversheet is surrounded and protected by a ring-shaped reinforcing frame. In Patent Document 3, an IC chip fixed to a substrate is covered with an epoxy resin, and a reinforcing plate is disposed on the upper side of the epoxy resin. In Patent Documents 4 and 5, a reinforcing material is fixed to the upper surface of an IC chip fixed to a substrate (sheet).

特開平１１−１１０６１号公報（段落番号００２７−００２８、図６）JP-A-11-11061 (paragraph numbers 0027-0028, FIG. 6) 特開２００１−７６１１０号公報（段落番号００１７−００１８、図１−２）JP 2001-76110 A (paragraph number 0017-0018, FIG. 1-2) 特開２００３−１４１４９４号公報（図１−２）Japanese Patent Laying-Open No. 2003-141494 (FIG. 1-2) 特開２００３−２９６６８６号公報（段落番号００２６、図１）Japanese Patent Laying-Open No. 2003-296686 (paragraph number 0026, FIG. 1) 特開２００４−１９２５６８号公報（図１−３）Japanese Patent Laid-Open No. 2004-192568 (FIGS. 1-3) 特開２００５−１７１３９６号公報（図１）Japanese Patent Laying-Open No. 2005-171396 (FIG. 1)

特許文献１〜５では、ＩＣチップが基板やオーバーシートに固定されている分だけ基板やオーバーシートの撓み変形の影響を受けて破損し易い。しかも、特許文献３では、ＩＣチップをエポキシ樹脂で被覆したうえで、該エポキシ樹脂が固まる前に補強板を配することになり、その作業が容易ではない。特許文献６では、抄紙の際にＩＣチップを不織布に内包した状態で下部紙層と上部紙層との間に挿入してすき込んでいるが、ＩＣチップを保護するための補強部材を有していないため、その後の用紙製造工程、さらには印刷工程における各種のロールなどの荷重によってＩＣチップが破損するおそれがある。   In Patent Documents 1 to 5, the IC chip is easily damaged by being affected by the bending deformation of the substrate or oversheet as much as the IC chip is fixed to the substrate or oversheet. Moreover, in Patent Document 3, after the IC chip is covered with an epoxy resin, a reinforcing plate is disposed before the epoxy resin is hardened, which is not easy. In Patent Document 6, the IC chip is inserted and inserted between the lower paper layer and the upper paper layer in a state where the IC chip is encapsulated in the non-woven fabric at the time of paper making, but has a reinforcing member for protecting the IC chip. Therefore, the IC chip may be damaged by loads of various rolls in the subsequent paper manufacturing process and further in the printing process.

本発明の目的は、ＩＣチップが柔軟なシート状の製品に内蔵されていても、ＩＣチップを確実に保護でき、またその保護のための作業が容易なＩＣチップの補強板を提供することにある。   An object of the present invention is to provide an IC chip reinforcing plate that can reliably protect an IC chip even if the IC chip is incorporated in a flexible sheet-like product and that can be easily protected. is there.

本発明は、図１に示すごとく、ＩＣチップ３を固定した状態で、柔軟なシート状の製品に内蔵される硬質の補強板６であって、ＩＣチップ３を収容する凹部１１を上面に設けてあって、凹部１１の底面にＩＣチップ３を固定するようになっており、凹部１１の深さ寸法Ｈが、ＩＣチップ３の厚さ寸法Ｌ１よりも大きくなるよう設定されていることを特徴とする。ここでの製品には、ＩＣカード、各種の入場券、商品タグあるいは各種の証明書などが該当する。   As shown in FIG. 1, the present invention is a rigid reinforcing plate 6 built in a flexible sheet-like product in a state where the IC chip 3 is fixed, and a concave portion 11 for accommodating the IC chip 3 is provided on the upper surface. Therefore, the IC chip 3 is fixed to the bottom surface of the recess 11, and the depth dimension H of the recess 11 is set to be larger than the thickness dimension L 1 of the IC chip 3. And The product here corresponds to an IC card, various admission tickets, product tags, various certificates, and the like.

ＩＣチップ３は、その上面にアンテナコイル５の端部１０を接合したものであってもよい。その場合、補強板６の上面には、アンテナコイル５が通る溝１２を凹部１１から補強板６の周縁まで設けておく。凹部１１の深さ寸法Ｈは、ＩＣチップ３の厚さ寸法よりも大きくなるよう設定する。ＩＣチップ３の上面に、アンテナコイル５の端部１０が接合されるバンプ９を設けてある場合には、前記ＩＣチップ３の厚さ寸法は、ＩＣチップ３の下面からバンプ９の上面までの厚さ寸法Ｌ２が該当する。   The IC chip 3 may be one in which the end 10 of the antenna coil 5 is joined to the upper surface thereof. In that case, a groove 12 through which the antenna coil 5 passes is provided from the recess 11 to the periphery of the reinforcing plate 6 on the upper surface of the reinforcing plate 6. The depth dimension H of the recess 11 is set to be larger than the thickness dimension of the IC chip 3. When the bump 9 to which the end portion 10 of the antenna coil 5 is bonded is provided on the upper surface of the IC chip 3, the thickness dimension of the IC chip 3 is from the lower surface of the IC chip 3 to the upper surface of the bump 9. This corresponds to the thickness dimension L2.

前記溝１２は、所定間隔を隔てて少なくとも２本形成し、隣り合う溝１２・１２間に中間壁部１６を存在させることができる。   At least two grooves 12 may be formed at a predetermined interval, and an intermediate wall portion 16 may be present between the adjacent grooves 12 and 12.

補強板６は、柔軟性を有するフィルム状の基板２に保持された状態で製品に内蔵することができる。また、補強板６は、不織布で形成した基板２にすき込まれて保持されてもよい。   The reinforcing plate 6 can be incorporated in the product while being held on the flexible film-like substrate 2. Further, the reinforcing plate 6 may be held and held in the substrate 2 formed of a nonwoven fabric.

かかるＩＣチップ３を固定した補強板６又はその補強板６をすき込んだ不織布を紙層にすき込んで用紙２２を形成することができる。   The reinforcing plate 6 to which the IC chip 3 is fixed or the nonwoven fabric into which the reinforcing plate 6 is inserted can be inserted into the paper layer to form the paper 22.

本発明によれば、ＩＣチップ３が補強板６の凹部１１の底面に固定されており、その凹部１１の深さ寸法ＨをＩＣチップ３の厚さ寸法Ｌ１よりも大きく設定してあるので、ＩＣチップ３は凹部１１内に完全に収容されている。したがって、ＩＣチップ３の全体が機械的強度の高い補強板６でしっかりと保護され、製品が撓み変形してもＩＣチップ３に破損などが生じることはない。しかも、ＩＣチップ３を補強板６の凹部１１の底面に固定するだけでよいので、ＩＣチップ３の保護のための作業が容易である。   According to the present invention, the IC chip 3 is fixed to the bottom surface of the recess 11 of the reinforcing plate 6, and the depth dimension H of the recess 11 is set larger than the thickness dimension L1 of the IC chip 3. The IC chip 3 is completely accommodated in the recess 11. Therefore, the entire IC chip 3 is firmly protected by the reinforcing plate 6 having high mechanical strength, and even if the product is bent and deformed, the IC chip 3 is not damaged. In addition, since the IC chip 3 only needs to be fixed to the bottom surface of the recess 11 of the reinforcing plate 6, the work for protecting the IC chip 3 is easy.

ＩＣチップ３の上面にアンテナコイル５を接合するバンプ９を有するときに、凹部１１の深さ寸法Ｈが、ＩＣチップ３の下面からバンプ９の上面までの厚さ寸法Ｌ２よりも大きく設定されていると、製品が撓み変形してもＩＣチップ３の破損などを防止できるとともに、ＩＣチップ３からバンプ９が剥がれることも確実に防止できる。   When the bump 9 for joining the antenna coil 5 is provided on the upper surface of the IC chip 3, the depth dimension H of the recess 11 is set larger than the thickness dimension L 2 from the lower surface of the IC chip 3 to the upper surface of the bump 9. As a result, even if the product is bent and deformed, the IC chip 3 can be prevented from being damaged and the bumps 9 can be reliably prevented from being peeled off from the IC chip 3.

補強板６の上面に、アンテナコイル５を通す少なくとも２本の溝１２・１２が設けられているときに、隣り合う溝１２・１２間に中間壁部１６が存在すると、この中間壁部１６・１６の上面で補強板６の凹部１１および溝１２の上側を覆う外装シート７を支持するので、補強板６の上側の外装シート７上に荷重が加わっても、その荷重がＩＣチップ３やバンプ９に加わることが低減される。   When at least two grooves 12 and 12 for passing the antenna coil 5 are provided on the upper surface of the reinforcing plate 6, if there is an intermediate wall 16 between the adjacent grooves 12 and 12, the intermediate wall 16. Since the upper surface 16 supports the outer sheet 7 that covers the recesses 11 and the grooves 12 of the reinforcing plate 6, even if a load is applied to the upper outer sheet 7 of the reinforcing plate 6, the load is applied to the IC chip 3 and the bumps. 9 is reduced.

本発明は、アンテナコイル５と、ＩＣチップ３を固定した補強板６とがフィルム状の基板２などに保持されることで製品がより柔軟になっていても、ＩＣチップ３を確実に保護することができる。   The present invention reliably protects the IC chip 3 even if the product becomes more flexible by holding the antenna coil 5 and the reinforcing plate 6 to which the IC chip 3 is fixed on the film-like substrate 2 or the like. be able to.

ＩＣチップ３を固定した補強板６又はその補強板６をすき込んだ不織布をすき込んだ用紙２２は、その用紙２２に内蔵したＩＣチップ３を確実に保護することができる。   The paper 22 in which the reinforcing plate 6 to which the IC chip 3 is fixed or the non-woven fabric into which the reinforcing plate 6 is inserted can securely protect the IC chip 3 built in the paper 22.

（実施例１） 図１ないし図３は、本発明に係る補強構造を適用したインレットの実施例１を示しており、インレット１は、図１に示すごとく、柔軟性を有するフィルム状の基板２と、メモリや通信制御部などを有するＩＣチップ３と、ＩＣチップ３に接合したアンテナコイル５と、前記ＩＣチップ３を固定する硬質の補強板６とを含む。インレット１の表裏に、柔軟性を有する外装シート７・７をそれぞれ積層することにより、インレット１は、柔軟性を有する非接触型ＩＣカードなどの製品に加工される。つまり、ＩＣチップ３とアンテナコイル５と補強板６とは、柔軟なシート状の製品に内蔵されることになる。 (Embodiment 1) FIGS. 1 to 3 show an embodiment 1 of an inlet to which a reinforcing structure according to the present invention is applied. The inlet 1 is a film-like substrate 2 having flexibility as shown in FIG. And an IC chip 3 having a memory, a communication control unit, and the like, an antenna coil 5 joined to the IC chip 3, and a hard reinforcing plate 6 for fixing the IC chip 3. By laminating flexible exterior sheets 7 and 7 on the front and back of the inlet 1, the inlet 1 is processed into a product such as a non-contact IC card having flexibility. That is, the IC chip 3, the antenna coil 5, and the reinforcing plate 6 are built in a flexible sheet-like product.

基板２は、紙や各種繊維製の不織布で形成され、アンテナコイル５と、ＩＣチップ３が固定された補強板６とを保持する。つまり、アンテナコイル５と補強板６とは、基板２上に接着剤などで貼り付ける。なお、アンテナコイル５と、ＩＣチップ３を固定した補強板６とは、基板２を構成する不織布にすき込んで保持してもよい。   The substrate 2 is formed of paper or a nonwoven fabric made of various fibers, and holds the antenna coil 5 and the reinforcing plate 6 to which the IC chip 3 is fixed. That is, the antenna coil 5 and the reinforcing plate 6 are attached to the substrate 2 with an adhesive or the like. Note that the antenna coil 5 and the reinforcing plate 6 to which the IC chip 3 is fixed may be held in a nonwoven fabric constituting the substrate 2.

ＩＣチップ３は、平面視で正方形状になっており、上面の対角位置にバンプ９・９がそれぞれ設けられている。バンプ９・９は、ニッケルや金をＩＣチップ３の上面にメッキすることで形成する。アンテナコイル５は、銅線をポリエチレンテレフタレート樹脂（ＰＥＴ）などで被覆したアンテナ線で形成してあり、このアンテナ線は、ＩＣチップ３を囲む四重の螺旋状に配した。アンテナコイル５の端部１０・１０は、平行に配して加熱圧着によってバンプ９・９にそれぞれ接合されている。   The IC chip 3 has a square shape in plan view, and is provided with bumps 9 and 9 at diagonal positions on the upper surface. The bumps 9 and 9 are formed by plating nickel or gold on the upper surface of the IC chip 3. The antenna coil 5 is formed of an antenna wire in which a copper wire is covered with polyethylene terephthalate resin (PET) or the like, and this antenna wire is arranged in a quadruple spiral shape surrounding the IC chip 3. End portions 10 and 10 of the antenna coil 5 are arranged in parallel and joined to the bumps 9 and 9 by thermocompression bonding, respectively.

図３において、ＩＣチップ３の厚さ寸法Ｌ１は３０μｍ、各バンプ９の厚さ寸法は２０μｍとした。つまり、ＩＣチップ３の下面からバンプ９の上面までの厚さ寸法Ｌ２は、５０μｍとした。アンテナコイル５の外形寸法は４０μｍとした。   In FIG. 3, the thickness dimension L1 of the IC chip 3 is 30 μm, and the thickness dimension of each bump 9 is 20 μm. That is, the thickness dimension L2 from the lower surface of the IC chip 3 to the upper surface of the bump 9 was 50 μm. The outer dimension of the antenna coil 5 was 40 μm.

補強板６は、ステンレス板に対してエッチング加工やプレス加工を行うことで形成される。補強板６の上面中央には、図１および図２に示すごとく、ＩＣチップ３を収容する凹部１１を設けてある。凹部１１の向かい合う二辺１１ａ・１１ｂから補強板６の周縁までは、アンテナコイル５の端部１０・１０を通すために４本の溝１２が形成されている。凹部１１の一辺１１ａ側において隣り合う溝１２・１２と、凹部１１の他辺１１ｂ側において隣り合う溝１２・１２とはそれぞれ所定間隔を隔てており、隣り合う溝１２・１２間に中間壁部１６がそれぞれ存在する。凹部１１および各溝１２は、ハーフエッチング加工で形成する。ＩＣチップ３は、凹部１１の底面に両面テープで接着固定する。   The reinforcing plate 6 is formed by etching or pressing a stainless steel plate. As shown in FIGS. 1 and 2, a recess 11 for accommodating the IC chip 3 is provided in the center of the upper surface of the reinforcing plate 6. Four grooves 12 are formed from the opposite sides 11 a and 11 b of the recess 11 to the peripheral edge of the reinforcing plate 6 in order to pass the end portions 10 and 10 of the antenna coil 5. The adjacent grooves 12 and 12 on the one side 11a side of the recess 11 and the adjacent grooves 12 and 12 on the other side 11b side of the recess 11 are spaced apart from each other by a predetermined distance. There are 16 each. The recess 11 and each groove 12 are formed by half etching. The IC chip 3 is bonded and fixed to the bottom surface of the recess 11 with a double-sided tape.

補強板６は、縦横の寸法を2.５mm、厚さ寸法を１２０μｍとした。凹部１１は、縦横の寸法を1.５mm、深さ寸法Ｈを８０μｍとした。溝１２は、幅寸法を0.５mm、深さ寸法を凹部１１に等しい８０μｍとした。凹部１１にＩＣチップ３を接着固定するための前記両面テープの厚さ寸法は１０μｍとした。つまり、ＩＣチップ３および各バンプ９は、補強板６の上側へは飛び出さないようになっている（図３参照）。尤も、凹部１１内に配したアンテナコイル５は、補強板６内に収容されることが好ましいが、補強板６の上側に一部飛び出していてもよい。   The reinforcing plate 6 has a vertical and horizontal dimension of 2.5 mm and a thickness dimension of 120 μm. The recess 11 has a vertical and horizontal dimension of 1.5 mm and a depth dimension H of 80 μm. The groove 12 had a width dimension of 0.5 mm and a depth dimension of 80 μm, which is equal to the recess 11. The thickness of the double-sided tape for bonding and fixing the IC chip 3 to the recess 11 was 10 μm. That is, the IC chip 3 and each bump 9 do not protrude to the upper side of the reinforcing plate 6 (see FIG. 3). However, the antenna coil 5 disposed in the recess 11 is preferably accommodated in the reinforcing plate 6, but may partially protrude above the reinforcing plate 6.

外装シート７・７は、それぞれ合成樹脂や不織布などからなり、図３に示すごとく上下の外装シート７・７の間にインレット１を挟み込んだ状態で、上下一対のロール１３・１３を押し付けて熱圧着することにより、上下の外装シート７・７とインレット１とを一体化する。この後、外装シート７・７の外面に所定の印刷などを施して製品化する。その製品としては、先のＩＣカードのほか、各種の入場券、商品タグあるいは証明書などの書類１５（図４参照）などを含む。前記書類１５の場合には、インレット１は書類１５の隅部分などに配される。   Each of the exterior sheets 7 and 7 is made of a synthetic resin, a nonwoven fabric, or the like. With the inlet 1 sandwiched between the upper and lower exterior sheets 7 and 7 as shown in FIG. The upper and lower exterior sheets 7 and 7 and the inlet 1 are integrated by pressure bonding. Thereafter, the outer surface of the exterior sheets 7 and 7 is subjected to predetermined printing or the like to produce a product. The products include various admission tickets, product tags or documents 15 such as certificates (see FIG. 4) in addition to the previous IC card. In the case of the document 15, the inlet 1 is arranged at a corner portion of the document 15.

ＩＣチップ３および各バンプ９が補強板６の凹部１１に収容されることにより、上下のロール１３・１３が押し付けられた際に、該ロール１３・１３の荷重は補強板６の上下面で受け止められる。したがって、前記ロール１３・１３の荷重がＩＣチップ３および各バンプ９に直に加わることが低減され、前記ロール１３・１３の荷重によってＩＣチップ３が割れたり、各バンプ９が剥がれたりすることなどを防ぐことができる。製品化したのちにその製品が撓み変形してもＩＣチップ３に破損などが生じることもない。   Since the IC chip 3 and each bump 9 are accommodated in the recess 11 of the reinforcing plate 6, when the upper and lower rolls 13 and 13 are pressed, the load of the rolls 13 and 13 is received by the upper and lower surfaces of the reinforcing plate 6. It is done. Accordingly, it is possible to reduce the load of the rolls 13 and 13 being directly applied to the IC chip 3 and the bumps 9, and the IC chip 3 is broken or the bumps 9 are peeled off by the load of the rolls 13 and 13. Can be prevented. Even if the product is bent after being commercialized, the IC chip 3 is not damaged.

補強板６の隣り合う溝１２・１２間に中間壁部１６・１６が存在しているので、中間壁部１６・１６の上面でも補強板６の凹部１１および溝１２の上側を覆う外装シート７が支持される。したがって、製品化したのちに補強板６の上側の外装シート７上にペン先などが当たっても、ペン先などの荷重がＩＣチップ３および各バンプ９に加わることが低減される。   Since the intermediate wall portions 16 and 16 exist between the adjacent grooves 12 and 12 of the reinforcing plate 6, the outer sheet 7 that covers the concave portion 11 of the reinforcing plate 6 and the upper side of the groove 12 also on the upper surface of the intermediate wall portions 16 and 16. Is supported. Therefore, even if the pen tip hits the exterior sheet 7 on the upper side of the reinforcing plate 6 after commercialization, the load on the IC chip 3 and each bump 9 is reduced.

（実施例２） 実施例２では、図５に示すごとく、補強板６の前記溝１２の幅寸法を大きくして、中間壁部１６・１６を省略した。その他の点は、実施例１と同じであるので説明を省略する。 (Example 2) In Example 2, as shown in FIG. 5, the width dimension of the said groove | channel 12 of the reinforcement board 6 was enlarged, and the intermediate wall parts 16 and 16 were abbreviate | omitted. Since the other points are the same as those of the first embodiment, description thereof is omitted.

実施例２においても、製品が撓み変形してもＩＣチップ３の破損などをよく防止でき、ロール１３・１３の荷重は補強板６の上下面で受け止めるので、製造時にＩＣチップ３が割れたり、各バンプ９が剥がれたりすることなどを防止できる。   Even in the second embodiment, even if the product is bent and deformed, the IC chip 3 can be prevented from being damaged, and the load of the rolls 13 and 13 is received by the upper and lower surfaces of the reinforcing plate 6. It is possible to prevent the bumps 9 from being peeled off.

（実施例３） 図６および図７は本発明の実施例３を示しており、補強板６の各溝１２の深さ寸法Ｍを凹部１１の深さ寸法Ｈよりも小さく設定した。その他の点は、実施例１と同じであるので説明を省略する。 Example 3 FIG. 6 and FIG. 7 show Example 3 of the present invention, in which the depth dimension M of each groove 12 of the reinforcing plate 6 is set smaller than the depth dimension H of the recess 11. Since the other points are the same as those of the first embodiment, description thereof is omitted.

実施例３においても、実施例１と同様に、製品が撓み変形してもＩＣチップ３の破損などをよく防止できるうえ、ロール１３・１３やペン先などの荷重がＩＣチップ３および各バンプ９に加わることが低減される。しかも、アンテナコイル５のアンテナ線を各溝１２の底面が受け止めて、アンテナ線が各バンプ９と各溝１２との間で上下に折れ曲がることを防ぐことができる。   Also in the third embodiment, similarly to the first embodiment, even if the product is bent and deformed, the IC chip 3 can be prevented from being damaged, and the load of the rolls 13 and 13 and the pen tip is applied to the IC chip 3 and each bump 9. Is reduced. Moreover, the antenna wire of the antenna coil 5 is received by the bottom surface of each groove 12, and the antenna wire can be prevented from bending up and down between each bump 9 and each groove 12.

（実施例４） 図８は本発明の実施例４を示しており、補強板６の各溝１２の深さ寸法を凹部１１の深さ寸法よりも小さく設定するとともに、各溝１２によって補強板６の上部の四隅を切り欠くように形成した。その他の点は、実施例１と同じであるので説明を省略する。 (Embodiment 4) FIG. 8 shows Embodiment 4 of the present invention. The depth dimension of each groove 12 of the reinforcing plate 6 is set to be smaller than the depth dimension of the recessed portion 11, and the reinforcing plate is formed by each groove 12. The upper four corners of 6 were formed to be cut out. Since the other points are the same as those of the first embodiment, description thereof is omitted.

実施例４においても、製品が撓み変形してもＩＣチップ３の破損などをよく防止できるうえ、ロール１３・１３の荷重は補強板６の上下面で受け止められるので、製造時にＩＣチップ３が割れたり、各バンプ９が剥がれたりすることなどを防止することができる。   Also in the fourth embodiment, even if the product is bent and deformed, the IC chip 3 can be well prevented from being damaged, and the load of the rolls 13 and 13 can be received by the upper and lower surfaces of the reinforcing plate 6. It is possible to prevent the bumps 9 from being peeled off.

補強板６は、曲げ強度などの機械的強度の高い硬質材であればよく、アルミニウムなどの金属、プラスチック、セラミックあるいはガラスなどで形成されてもよい。アンテナコイル５は、銅線を合成樹脂などで被覆して形成してもよく、アルミニウム板や銅板などをエッチングして形成してもよく、銀ペーストなどを基板２上に印刷して形成してもよい。アンテナコイル５の端部１０・１０を短くした場合には、溝１２は２本だけ形成したものでもよい。   The reinforcing plate 6 may be a hard material having high mechanical strength such as bending strength, and may be formed of a metal such as aluminum, plastic, ceramic, or glass. The antenna coil 5 may be formed by coating a copper wire with a synthetic resin or the like, may be formed by etching an aluminum plate or a copper plate, or may be formed by printing a silver paste or the like on the substrate 2. Also good. When the end portions 10 and 10 of the antenna coil 5 are shortened, only two grooves 12 may be formed.

（実施例５） 図９は本発明の補強板を内蔵した用紙を実施例５として示しており、補強板６により保護されたＩＣチップ３を不織布１９・１９に内包して、下部紙層２０と上部紙層２１との間になるようにすき込んで製造した用紙２２を示している。これにより、用紙２２にはＩＣチップ３が埋め込まれる。 Example 5 FIG. 9 shows a sheet incorporating a reinforcing plate of the present invention as Example 5. The IC chip 3 protected by the reinforcing plate 6 is encapsulated in nonwoven fabrics 19 and 19, and the lower paper layer 20 And the paper 22 manufactured by being inserted so as to be between the upper paper layer 21 and the upper paper layer 21. As a result, the IC chip 3 is embedded in the paper 22.

この用紙２２は、本願出願人が既に出願した特開２００３−１３３９５号や特開２００５−１７１３９６号に示した製造方法を用いることで製造できる。その他の点は、実施例１と同じであるので説明を省略する。   This paper 22 can be manufactured by using the manufacturing method shown in Japanese Patent Application Laid-Open Nos. 2003-13395 and 2005-171396 filed by the present applicant. Since the other points are the same as those of the first embodiment, description thereof is omitted.

この用紙製造方法においては、図９に示すごとく用紙２２がロール１３・１３間を通過することが多いが、先の実施例３や実施例４と同様にロール１３・１３の荷重は補強板６の上下面で受け止められるので、製造時にＩＣチップ３が割れたり、アンテナコイル５が各バンプ９と共に剥がれたりすることなどを防止することができる。   In this paper manufacturing method, the paper 22 often passes between the rolls 13 and 13 as shown in FIG. 9, but the load of the rolls 13 and 13 is the same as that of the third and fourth embodiments. Therefore, it is possible to prevent the IC chip 3 from being cracked during manufacture or the antenna coil 5 from being peeled off together with the bumps 9.

なお、用紙２２は、アンテナコイル５と、ＩＣチップ３が固定された補強板６とを先のフィルム状の基板２に保持した状態で不織布１９・１９に内包して、下部紙層２０と上部紙層２１との間になるようにすき込んで製造してもよい。   The paper 22 is encapsulated in the nonwoven fabric 19 and 19 while holding the antenna coil 5 and the reinforcing plate 6 to which the IC chip 3 is fixed on the film-like substrate 2. It may be manufactured by interposing it between the paper layer 21.

インレットの斜視図Inlet perspective view 補強板の実施例１の斜視図The perspective view of Example 1 of a reinforcement board 図１のＡ−Ａ線断面図AA line sectional view of FIG. インレットの使用例を示す平面図Plan view showing usage example of inlet 補強板の実施例２の斜視図The perspective view of Example 2 of a reinforcement board 補強板の実施例３の斜視図The perspective view of Example 3 of a reinforcement board 図６のＢ−Ｂ線断面図BB sectional view of FIG. 補強板の実施例４の斜視図The perspective view of Example 4 of a reinforcement board 用紙を示す実施例５の断面図Sectional drawing of Example 5 which shows paper

符号の説明Explanation of symbols

１ インレット
２ 基板
３ ＩＣチップ
５ アンテナコイル
６ 補強板
９ バンプ
１０ アンテナコイルの端部
１１ 凹部
１２ 溝
１６ 中間壁部
２２ 用紙 DESCRIPTION OF SYMBOLS 1 Inlet 2 Board | substrate 3 IC chip 5 Antenna coil 6 Reinforcement board 9 Bump 10 End part 11 of an antenna coil Recess 12 Groove 16 Intermediate wall part 22 Paper

Claims (6)

ＩＣチップを固定した状態で、柔軟なシート状の製品に内蔵される硬質の補強板であって、
前記ＩＣチップを収容する凹部を上面に設けてあって、前記凹部の底面に前記ＩＣチップを固定するようになっており、
前記凹部の深さ寸法が、前記ＩＣチップの厚さ寸法よりも大きくなるよう設定されていることを特徴とするＩＣチップの補強板。 A rigid reinforcing plate built in a flexible sheet-like product with the IC chip fixed,
A concave portion for accommodating the IC chip is provided on the upper surface, and the IC chip is fixed to the bottom surface of the concave portion,
An IC chip reinforcing plate, wherein a depth dimension of the recess is set to be larger than a thickness dimension of the IC chip. アンテナコイルの端部が上面に接合されるＩＣチップを固定した状態で、柔軟なシート状の製品に内蔵される硬質の補強板であって、
前記ＩＣチップを収容する凹部を上面に設けてあるとともに、前記アンテナコイルが通る溝を前記凹部から周縁まで設けてあり、
前記凹部の底面に前記ＩＣチップを固定するようになっており、
前記凹部の深さ寸法が、前記ＩＣチップの厚さ寸法よりも大きくなるよう設定してあることを特徴とするＩＣチップの補強板。 A rigid reinforcing plate built in a flexible sheet-like product with the IC chip bonded to the upper surface of the end of the antenna coil fixed,
A recess for accommodating the IC chip is provided on the upper surface, and a groove through which the antenna coil passes is provided from the recess to the periphery,
The IC chip is fixed to the bottom surface of the recess,
An IC chip reinforcing plate, wherein a depth dimension of the recess is set to be larger than a thickness dimension of the IC chip. 前記溝は、所定間隔を隔てて少なくとも２本形成してあり、
隣り合う前記溝間に中間壁部が存在する請求項２記載のＩＣチップの補強板。 At least two grooves are formed at a predetermined interval,
3. The IC chip reinforcing plate according to claim 2, wherein an intermediate wall portion exists between the adjacent grooves. 柔軟性を有するフィルム状の基板に保持された状態で前記製品に内蔵される請求項１ないし３記載のＩＣチップの補強板。   4. The IC chip reinforcing plate according to claim 1, wherein the reinforcing plate is incorporated in the product while being held on a film-like substrate having flexibility. 前記基板が、不織布で形成されており、
前記基板にすき込まれて保持されるようになっている請求項４記載のＩＣチップの補強板。 The substrate is formed of a nonwoven fabric;
5. The IC chip reinforcing plate according to claim 4, wherein the reinforcing plate is held by being inserted into the substrate. 請求項１ないし５記載のＩＣチップの補強板をすき込んだことを特徴とする用紙。   6. A sheet comprising a reinforcing plate for an IC chip according to claim 1 inserted therein.
JP2005233888A 2005-08-12 2005-08-12 IC chip reinforcing plate and paper Expired - Fee Related JP4845179B2 (en)

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JP2008210233A (en) * 2007-02-27 2008-09-11 Dainippon Printing Co Ltd Rf-id tag label loaded with reinforcing plate
JP2008299465A (en) * 2007-05-30 2008-12-11 Dainippon Printing Co Ltd Non-contact type ic tag and method for manufacturing non-contact type ic tag

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JP2008210222A (en) * 2007-02-27 2008-09-11 Dainippon Printing Co Ltd Rf-id tag card loaded with reinforcing plate
JP2008210233A (en) * 2007-02-27 2008-09-11 Dainippon Printing Co Ltd Rf-id tag label loaded with reinforcing plate
JP2008299465A (en) * 2007-05-30 2008-12-11 Dainippon Printing Co Ltd Non-contact type ic tag and method for manufacturing non-contact type ic tag

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