JP5790259B2 - IC tag and manufacturing method thereof - Google Patents

Description

  The present invention relates to an IC tag that can be used by being attached to a curved or uneven article such as a gas cylinder or a flexible container, a garment such as a uniform, or a flexible article such as linen, and a method for manufacturing the same.

  As is well known, the IC tag is mainly composed of a linear antenna made of a conductor and an IC chip connected to the antenna. Various information can be stored in the IC chip, and such information can be exchanged with an external reader / writer through an antenna. In general, an IC tag is configured by an inlet having the antenna and the IC chip, and an exterior member that accommodates the inlet.

  Such an IC tag is used to attach information to various products and products and store information related to the product or products. The information stored in the IC chip includes, for example, product and product materials, processing methods, quality, production locations, producers and sellers, product and product handling methods, and precautions related thereto. These pieces of information are stored in the IC chip and read out as necessary during the distribution process of the product or the product or after the sale.

  There are various types of products and products to which IC tags are attached. For example, Patent Documents 1 and 2 exemplify clothes. An RFID (Radio Frequency IDentification) tag attached to the clothes is subjected to external force such as pressure, tapping, and itching by washing and cleaning. For this reason, the RFID tag must be able to withstand these external forces and prevent mechanical damage.

In addition, when an RFID tag is attached to a flexible container, for example, the RFID tag can withstand external force at high temperatures because the container may be washed at a high temperature in the manufacturing process or the product filling and sealing process. And mechanical damage must be prevented.
Here, in Patent Document 1, at least the periphery of the circuit chip and a part of the antenna wiring are covered with a chip reinforcing body, and the circuit chip and the antenna wiring including the chip reinforcing body are more flexible than the chip reinforcing body. A technique of covering with a covering is superior. Patent Document 2 discloses a technique for making a chip reinforcing body covering at least the periphery of a circuit chip and a part of an antenna wiring into a concave-convex shape in a plan view and intersecting the concave portion with the antenna wiring. Has been.

JP 2009-277256 A JP 2008-040950 A

  By the way, in the technique disclosed in Patent Document 1, when a bending load is applied to the RFID, there is a possibility that the end of the chip reinforcing body serves as a fulcrum and the RFID is bent. At this time, since the end portion of the chip reinforcing member is strongly pressed against the antenna, the antenna may be damaged and disconnected. In addition, the technique disclosed in Patent Document 2 is effective in preventing disconnection of the antenna, but since the covering as in Patent Document 1 is not provided, the load on the circuit chip may not be sufficiently reduced. was there.

  Therefore, the present invention has been made in view of such circumstances, and while reducing the possibility of the IC chip being broken or the antenna being disconnected due to the bending load, while ensuring the flexibility of the entire RFID tag. An object of the present invention is to provide an IC tag and a method for manufacturing the same.

In order to solve the above problems, an IC tag according to one embodiment of the present invention includes a base material, an antenna disposed on the base material, and an IC chip disposed on the base material and connected to the antenna. An inlet, a soft exterior member that accommodates the inlet therein, a first reinforcing member disposed on the front surface side of the inlet, and a second reinforcing member disposed on the back surface side of the inlet, Provided, and the shape of the exterior member in a plan view is a rectangle, and the first reinforcing member and the second reinforcement member are disposed in a state of being displaced in at least the longitudinal direction of the rectangular exterior member in a plan view. by the Rukoto, the rear surface of the inlet with said first reinforcing member and the second reinforcing member and overlapping the reinforcing region overlapping in a plan view, the first reinforcing member to the surface side of the inlet is present Including a region in which the second reinforcing member is not present in, and a first region in which the reinforcing member is not present on the surface side of the inlet with the second reinforcing member on the back side of the inlet to exist and one-sided reinforcement areas, is formed, the IC chip is characterized in that positioned in the overlapping reinforcing region in plan view.

  If it is such a structure, the rigidity of the area | region (namely, overlapping reinforcement area | region) where the 1st reinforcement member and the 2nd reinforcement member overlap in planar view among IC tags is high, and the 1st reinforcement member or The rigidity of the region where only one of the second reinforcing members is arranged in plan view (that is, the one-side reinforcing region) is lower than that of the overlapping reinforcing region. Therefore, when a bending load (that is, a force to bend) is applied to the RFID tag, the overlapping reinforcing region is difficult to bend and the IC chip is difficult to be loaded. Thereby, it is possible to reduce the possibility that the IC chip breaks due to the bending load.

Moreover, if it is said structure, the one side reinforcement area | region will bend more easily than a duplication reinforcement area | region, and a bending load can be relieve | moderated because the one side reinforcement area | region curves gently as a whole. For this reason, the first reinforcing member and the second reinforcing member can be prevented from being strongly pressed against the antenna, and a bending load is applied to a portion of the antenna adjacent to the first reinforcing member and the second reinforcing member. It can prevent concentration. Thereby, it is possible to reduce the possibility that the antenna is damaged and disconnected due to the bending load.

The “IC tag” of the present invention corresponds to any one of RFID tags 100, 200, and 300 described later, for example. As the “base material”, for example, the inlet base material 10 described later corresponds. As the “first reinforcing member”, for example, a first reinforcing plate 30 described later corresponds. As the “second reinforcing member”, for example, a second reinforcing plate 40 described later corresponds.
In the IC tag, the first reinforcing member and the second reinforcing member may be made of a material having a Young's modulus higher than that of the exterior member. With such a configuration, since the first and second reinforcing members are made of a material that is less likely to bend than the exterior member, the rigidity of the overlapping reinforcing region is increased while the first and second reinforcing members are not bent. Each thickness can be reduced.

Further, in the above IC tag, prior Symbol antennas, the outer and extends in the longitudinal direction of the rectangular member, at least the longitudinal direction, the side reinforcing region is formed on both sides of the overlapping reinforcing region It may be characterized by being. Here, the “rectangle” includes a rectangle having round corners (that is, a rounded rectangle) in addition to a rectangle having a right corner. In addition, “at least the longitudinal direction” means either the longitudinal direction alone or the direction including both the longitudinal direction and the short direction perpendicular to the longitudinal direction in plan view (ie, the oblique direction). It is meant to include.

With such a configuration, when bending is added in the longitudinal direction of the rectangle (that is, the extending direction of the antenna), the one-side reinforcing region may be curved in a gentle curve in the long side direction. it can. For this reason, it can prevent that a bending load concentrates on one part of the antenna extended in the long side direction.
In addition, an IC tag according to an aspect of the present invention includes a base, an antenna disposed on the base, an IC chip disposed on the base and connected to the antenna, and the inlet A soft exterior member, a first reinforcing member disposed on the front surface side of the inlet, and a second reinforcing member disposed on the back surface side of the inlet. The reinforcing member and the second reinforcing member include an overlapping reinforcing region where the first reinforcing member and the second reinforcing member overlap in a plan view, and the first reinforcing member and the second reinforcing member. And the IC chip is positioned in the overlapping reinforcement region in a plan view, and the shape of the exterior member in a plan view is a rectangle. The antenna is rectangular The longitudinal direction (i.e., extending direction of the antenna) are extended, at least the longitudinal direction, wherein on both sides of the overlapping reinforcing region is one reinforcing region is formed, the first reinforcing member, the The second reinforcing member is arranged so as to intersect with the longitudinal direction in plan view, and the second reinforcing member is arranged so as to intersect with the longitudinal direction in plan view and also intersect with the first reinforcing member. It is characterized by that.
With such a configuration, when bending is added in the longitudinal direction of the rectangle, the bending load can be reduced by bending the one-side reinforcing region in a gentle curve in the longitudinal direction. Further, both end portions in the longitudinal direction of the first reinforcing member and both end portions in the longitudinal direction of the second reinforcing member can be prevented from overlapping with the antenna in plan view. Therefore, even when a bending load is applied in the longitudinal direction, these both end portions are not pressed against the antenna. Thereby, the possibility that the antenna is disconnected can be further reduced.

  In the above IC tag, the first reinforcing member may be directed from one end side to the other end side in the short side direction of the rectangle as it goes from one side in the longitudinal direction to the other side. The second reinforcing member is arranged so as to go from the other end side in the lateral direction toward the one end side as it goes from the one side in the longitudinal direction to the other side. It may be characterized by being. With such a configuration, the one-side reinforcing regions can be disposed on both sides of the antenna extending in the longitudinal direction of the rectangle. The bending load can be reduced by bending the one-side reinforcing regions on both sides of the antenna.

Also, an IC tag manufacturing method according to another aspect of the present invention includes a base material, an antenna disposed on the base material, and an IC chip disposed on the base material and connected to the antenna. A step of accommodating the inlet in an exterior member having a rectangular shape in a soft plan view , a step of arranging a first reinforcing member on the front surface side of the inlet, and a rear surface side of the inlet Disposing a second reinforcing member, and in the step of disposing the first reinforcing member and the step of disposing the second reinforcing member, the first reinforcing member and the second reinforcing member duplicate reinforcement of the Rukoto arranged in a state of being displaced in the least the longitudinal direction of the reinforcing member and the rectangular of the outer member in a plan view, and the first reinforcing member and the second reinforcing member overlap in a plan view and the area, before And the second region where the reinforcing member is not present in the back surface side of the inlet with said first reinforcing member to the surface side of the inlet is present, together with the second reinforcing member exists on the back surface side of the inlet wherein a region in which the front surface side of the inlet first reinforcing member is not present, and the one-sided reinforcement areas including, are formed, one 且, so that the IC chip is located on the overlapping reinforcing region in plan view, the The arrangement positions of the first reinforcing member and the second reinforcing member are adjusted.
With such a manufacturing method, it is possible to manufacture an IC tag that can reduce the possibility that the IC chip is broken or the antenna is disconnected due to the bending load.

  According to the present invention, while ensuring the flexibility of the whole RFID tag, it is possible to reduce the possibility that the IC chip is broken or the antenna is disconnected due to the bending load.

The figure which shows the structural example of the RFID tag 100 which concerns on 1st Embodiment. The figure which shows the state before shape | molding the exterior member 20 of the RFID tag 100. FIG. The figure which shows the manufacturing method of the RFID tag. The figure which shows the structural example of the RFID tag 200 which concerns on 2nd Embodiment. The figure which shows the structural example of the RFID tag 300 which concerns on 3rd Embodiment. The figure which shows the 1st, 2nd reinforcement original board 130,140 which concerns on 3rd Embodiment. The figure which shows the 1st, 2nd reinforcement original plate 230,240 which concerns on 4th Embodiment. The figure which shows the structural example of the RFID tag 400 which concerns on 5th Embodiment. The figure which shows the dimension etc. of the RFID tag 300 used for verification of the effect of this invention, and the RFID tag 500 used as a comparative example. The figure which shows the verification method (1 cycle of bending motion) of the effect of this invention. The figure which shows the verification result of the effect of this invention.

Hereinafter, as an example of an IC tag according to the present invention, an RFID tag and a manufacturing method thereof will be described with reference to the drawings. Note that, in each drawing described below, parts having the same configuration are denoted by the same reference numerals, and repeated description thereof may be omitted. 1A, 3B and 3C, FIG. 4A, FIG. 5A, and FIGS. 6B to 8B, the complication of the drawing is avoided. Therefore, the inlet accommodated inside the exterior member is indicated by a solid line.
(1) First Embodiment FIGS. 1A and 1B are a plan view showing a configuration example of an RFID tag 100 according to a first embodiment of the present invention, and the plan view taken along line X1-X′1. It is sectional drawing cut | disconnected. FIG. 2 is a cross-sectional view of the RFID tag 100 before the exterior member 20 is molded. As shown in FIGS. 1A and 1B, the RFID tag 100 includes an inlet 10, a soft exterior member 20 that houses the inlet 10, and a first surface attached to the surface 20 a of the exterior member 20. 1 reinforcing plate 30, and a second reinforcing plate 40 attached to the back surface 20 b side of the exterior member 20.

The inlet 10 includes an inlet base 11, an antenna 13 formed on the inlet base 11, and an IC chip 15 attached on the inlet base 11 and connected to the antenna 13.
The inlet substrate 11 is made of, for example, a synthetic resin film such as polyethylene terephthalate (PET) and has a thickness of about 50 μm. The thickness of the inlet base material 11 is sufficiently thinner than the exterior member 20. Moreover, the shape (henceforth planar shape) of the inlet base material 11 by planar view is a rounded rectangle, for example. In the inlet 10, for example, a linear antenna 13 made of a conductor is formed on such an inlet base 11, and then an IC chip 15 is bonded on the antenna 13 with an anisotropic conductive adhesive. Is formed by.

  The antenna 13 is formed by using, for example, a metal foil as a material and bonding the metal foil to the inlet base material 11. Next, this metal foil is etched into a linear shape by, for example, photolithography. Thereby, the linear antenna 13 can be formed. In addition, the antenna may be formed by other methods. For example, the linear antenna 13 may be formed by printing conductive ink on the surface of the inlet base material 11 in an antenna shape. The linear antenna 13 may be a dipole antenna or a loop antenna, for example.

Further, the shape of the IC chip 15 is, for example, a rectangle in plan view, and the size thereof is about 0.5 mm to 1.0 mm on a side and about 100 to 500 μm in thickness.
The exterior member 20 protects the inlet 10 from the external environment. For example, the exterior member 20 protects the inlet 10 from external force, dirt, and the like. The exterior member 20 is made of a soft material. Examples of the soft material include various synthetic rubbers such as silicone rubber, EPDM, nitrile rubber, and fluororubber having a hardness of about 80 to 90 (JIS K6253), thermoplastic elastomers, and the like. Examples of the thermosetting elastomer include silicone rubber, fluorine rubber, urethane rubber, ethylene-propylene-diene rubber, nitrile rubber, and polyisobutylene.

  The exterior member 20 made of such a soft material is molded by laminating and integrating the exterior upper member 21 and the exterior lower member 23. As shown in FIG. 2, when the thickness of the exterior upper member 21 before molding is t1, and the thickness of the exterior lower member 23 before molding is t2, the thicknesses t1 and t2 are 0.5 mm to 1. It is about 0 mm. Further, as shown in FIG. 1B, when the thickness of the exterior member 20 after joining the exterior upper member 21 and the exterior lower member 23 with the inlet 10 interposed therebetween (that is, after molding) is T, The thickness T is about 1.0 to 2.0 mm. As shown in FIG. 1A, the planar shape of the molded exterior member 20 is, for example, a rounded rectangle, and its size (area) is larger than the planar shape of the inlet 10. Thereby, the inlet 10 can be completely accommodated in the exterior member 20 without exposing it to the outside.

  Each of the first reinforcing plate 30 and the second reinforcing plate 40 prevents an excessive load from being applied to the IC chip 15 when a bending load is applied to the RFID tag 100, and an excessive load is applied to the antenna 13. It plays the role of not concentrating on one part. Here, the excessive load is, for example, a load large enough to destroy the IC chip 15 and the antenna 13.

  In order to fulfill such a role, unlike the IC chip 15, the first reinforcing plate 30 and the second reinforcing plate 40 can be bent when a bending load is applied, and the exterior member 20. Compared to, a plate-shaped resin material that is difficult to bend (that is, has a high Young's modulus) is suitable. By using a plate-shaped resin material having a higher Young's modulus as compared with the exterior member 20, the thicknesses of the first reinforcing plate 30 and the second reinforcing plate 40 can be reduced.

  For example, as the 1st reinforcement board 30 and the 2nd reinforcement board 40, PET sheet, a polyethylene naphthalate (PEN) sheet, a polycarbonate (PC) sheet, a polyimide sheet other than glass fiber resin can be used. Among these, a PET sheet is preferable in terms of price and durability. The thickness of the first reinforcing plate 30 and the second reinforcing plate 40 is preferably about 0.1 mm, for example.

Moreover, even if it is the same material as the exterior member 20, if it has a high hardness compared with the exterior member 20, and a rigidity is high, it can be used suitably as a reinforcement board.
Adhesion between the first reinforcing plate 30 and the exterior member 20 and adhesion between the second reinforcing plate 40 and the exterior member 20 are performed by, for example, an adhesive (not shown). As the adhesive, an appropriate type of adhesive can be used according to the material of each of the first reinforcing plate 30, the second reinforcing plate 40, and the exterior member 20. For example, if the material of the exterior member 20 is a synthetic rubber, a vulcanized adhesive can be used as the adhesive.

  In the RFID tag 100, the planar shape of the first reinforcing plate 30 and the second reinforcing plate 40 is, for example, a rectangle (a rounded rectangle may be used). The first reinforcing plate 30 and the second reinforcing plate 40 have the same planar shape and the same size. Its size is larger than that of the IC chip 15. The first reinforcing plate 30 and the second reinforcing plate 40 partially overlap in a plan view, and the IC chip 15 is disposed in the partially overlapping region (that is, the overlapping reinforcing region) A1. That is, the first reinforcing plate 30 is disposed on the front surface side of the IC chip 15, and the second reinforcing plate 40 is disposed on the back surface side of the IC chip 15. The IC chip 15 is sandwiched between the reinforcing plates 40.

  With such a structure, the overlap reinforcement region A1 is enhanced in rigidity by the first reinforcement plate 30 and the second reinforcement plate 40, and even when a bending load is applied to the RFID tag 100, the overlap reinforcement region A1. Since A1 is difficult to bend, it is possible to prevent an excessive load from being applied to the IC chip 15. Thereby, the possibility that the IC chip 15 is broken due to the bending load can be reduced.

  In addition, the region where only one of the first reinforcing plate 30 and the second reinforcing plate 40 is arranged in plan view (that is, the one-side reinforcing region A2) has a lower rigidity than the overlapping reinforcing region A1 and is bent. easy. For this reason, when a bending load is applied to the RFID tag 100, the one-side reinforcing region is gently curved as a whole, and the bending load can be reduced. Thereby, it is possible to prevent an excessive load from being concentrated on one part of the antenna 13.

  This point will be described more specifically. For example, as shown in FIG. 1A, in the RFID tag 100, the first reinforcing plate 30 and the second reinforcing plate 40 are displaced in the longitudinal direction (X direction) of the exterior member 20 in a plan view. In the longitudinal direction, both sides of the overlapping reinforcing region A1 are one-side reinforcing regions A2. Here, the longitudinal direction is also the extending direction of the antenna 13.

  Further, in the longitudinal direction, the overlapping reinforcing region A1 and the one-side reinforcing region A2 are further provided on both sides of the first reinforcing plate 30 and the second reinforcing plate 40 (that is, the non-reinforcing region) A3. It has become. Since the reinforcing plate is not provided in the non-reinforcing region A3, the rigidity is lower than that of the one-side reinforcing region A2, and it is easy to bend. In other words, the rigidity of the RFID tag 100 is such that the overlapping reinforcing area A1> the one-side reinforcing area A2> the non-reinforcing area A3.

  For this reason, in FIG. 1B, when a bending load that bends the RFID tag 100 into a convex shape or a concave shape in a cross-sectional view is applied to the RFID tag 100, compared with the overlapping reinforcing region A1, one-side reinforcement is performed. The region A2 can be gently bent to reduce the bending load. Further, the non-reinforcing region A3 can be further curved than the one-side reinforcing region A2. That is, when a bending load is applied in the longitudinal direction of the RFID tag 100, the one-side reinforced region A2 and the non-reinforced region A3 of the RFID tag 100 draw a gentle curve with a large curvature radius in the long side direction. Can be curved. Therefore, for example, compared to the case where the one-side reinforcing region A2 does not exist (that is, the overlapping reinforcing region and the non-reinforcing region are directly adjacent to each other, the RFID tag 500 according to a comparative example described later), the RFID tag It is possible to prevent the bending load from being concentrated on one part of 100.

  For example, the bending load in the longitudinal direction is concentrated between the end portion 31 of the first reinforcing plate 30 and the antenna 13, or concentrated between the end portion 41 of the second reinforcing plate 40 and the antenna 13. This can prevent the antenna 13 from being bent at an acute angle due to the concentration of the bending load. For this reason, it is possible to reduce the possibility that the antenna 13 is damaged and disconnected due to the bending load.

Note that the RFID tag 100 includes three types of members, for example, the inlet 10, the exterior member 20 (the exterior upper member 21 and the exterior lower member 23), and the reinforcing plate (the first reinforcing plate 30 and the second reinforcing plate 40). However, the production can be performed by multiple imposition with a press machine and singulation with a punching press.
Specifically, as shown in FIG. 3A, an exterior lower member 23 made of a soft material is prepared, and a plurality of inlets 10 are arranged on the exterior lower member 23 at regular intervals. Next, as shown in FIG. 3B, the exterior upper member 21 made of a soft material is disposed on the exterior lower member 23 with the inlet 10 interposed therebetween. And the exterior lower member 23 and the exterior upper member 21 are pressed with the preset temperature and pressure with a press. Thereby, the exterior lower member 23 and the exterior upper member 21 are integrated, and the exterior member 20 is molded.

  Next, as shown in FIG. 3C, the first reinforcing plate 30 is attached to the front surface 20 a side of the exterior member 20, and the second reinforcing plate is attached to the back surface side of the exterior member 20. This attachment is performed using an adhesive as described above. Thereafter, the exterior member 20 is punched into a rounded rectangular shape indicated by a broken line in FIG. Thereby, the RFID tag 100 shown in FIGS. 1A and 1B is completed.

  As described above, according to the first embodiment of the present invention, even when a bending load is applied to the RFID tag 100, the overlapping reinforcing region A1 is unlikely to be bent, so that the IC chip 15 is not easily loaded. Thereby, the possibility that the IC chip 15 is broken due to the bending load can be reduced. Further, the second region is more easily bent than the overlapping reinforcing region A1, and the bending load can be reduced by gently bending the one-side reinforcing region A2, so that the bending load is concentrated on one part of the RFID tag 100. Can be prevented. Thereby, while ensuring the flexibility of the whole RFID tag, the possibility that the antenna 13 is damaged and disconnected due to the bending load can be reduced.

(2) Second Embodiment In the first embodiment, the first reinforcing plate 30 and the second reinforcing plate 40 are displaced in the longitudinal direction (X direction) of the exterior member 20 in plan view. The case where it is arrange | positioned was illustrated. However, the present invention is not limited to this. The 1st reinforcement board 30 and the 2nd reinforcement board 40 may be arrange | positioned in the state shifted in the transversal direction (Y direction) of the exterior member 20 by planar view. Alternatively, the first reinforcing plate 30 and the second reinforcing plate 40 are each displaced in a direction (ie, an oblique direction) including both the longitudinal direction and the short direction of the exterior member 20 as components in plan view. May be arranged.

FIGS. 4A and 4B are a plan view showing a configuration example of an RFID tag 200 according to the second embodiment of the present invention, and a cross-sectional view of the plan view cut along line X4-X′4. As shown in FIG. 4A, in the RFID tag 200, the first reinforcing plate 30 and the second reinforcing plate 40 are arranged in a state of being displaced in the oblique direction of the exterior member 20 in plan view. Yes.
Similar to the RFID tag 100 described in the first embodiment, also in the RFID tag 200, both sides of the overlapping reinforcing region A1 are one-side reinforcing regions A2 at least in the longitudinal direction. Further, the size of the rigidity is the overlapping reinforcing area A1> one-side reinforcing area A2> non-reinforcing area A3, and the overlapping reinforcing area A1 in which the rigidity is enhanced by the first reinforcing plate 30 and the second reinforcing plate 40. The IC chip 15 is disposed on the board. For this reason, the possibility that the IC chip 15 is broken due to the bending load can be reduced.

Further, similarly to the RFID tag 100 described in the first embodiment, also in the RFID tag 200, the bending load can be reduced by gently bending the one-side reinforcing region A2. That is, in FIG. 4B, when a bending load is applied to the RFID tag 200 so as to bend the RFID tag 200 into a convex shape or a concave shape in a cross-sectional view, compared to the overlapping reinforcing region A1, the one-side reinforcing region A2 Can be gently curved as a whole to relieve the bending load, and the RFID tag 200 has a gentle bending shape with a large radius of curvature. For this reason, it is possible to reduce the possibility that the antenna 13 is damaged and disconnected due to the bending load.
Furthermore, in the second embodiment, as compared with the first embodiment, the one-side reinforcing region exists in the direction parallel to the short side (short side direction), so that the bending including the component in the short side direction is prevented. However, there is also an effect that the disconnection can be reduced while securing the flexibility.

(3) Third Embodiment In the first and second embodiments described above, the planar shapes of the first reinforcing plate 30 and the second reinforcing plate 40 are each rectangular, and these are the longitudinal direction or diagonal of the exterior member 20. The case where it has been arrange | positioned in the state which shifted in the direction was shown. However, in the present invention, the planar shape and the arrangement of the first reinforcing plate and the second reinforcing plate are not limited to this.

5A and 5B are a plan view showing a configuration example of an RFID tag 300 according to the third embodiment of the present invention, and a cross-sectional view of the plan view cut along a line X5-X'5.
As shown in FIG. 5A, in the RFID tag 300, the planar shape of the first reinforcing plate 30 and the second reinforcing plate 40 is, for example, a parallelogram. The first reinforcing plate 30 is disposed so as to obliquely intersect with the longitudinal direction (or short direction) of the exterior member 20 in plan view. The second reinforcing plate 40 is also arranged so as to obliquely intersect with the longitudinal direction (or short direction) of the exterior member 20 and also obliquely intersect with the first reinforcing plate 30 in plan view. ing.

  For example, the first reinforcing plate 30 has one end in the short direction as it goes from one side in the longitudinal direction (left side in FIG. 5A) to the other side (right side in FIG. 5A). It arrange | positions so that it may go to the other side (lower side in Fig.5 (a)) from the side (upper side in Fig.5 (a)). Moreover, the 2nd reinforcement board 40 is arrange | positioned so that it may go to the one end side from the other end side of a transversal direction as it goes to the other side from the one side of a longitudinal direction.

Further, the first reinforcing plate 30 and the second reinforcing plate 40 are bilaterally symmetric about a line parallel to the longitudinal direction (or short direction) and passing through the center of the IC chip 15 in plan view. Are arranged as follows. In each RFID tag 300, the area ratio between the overlapping reinforcing area A1 and the one-side reinforcing area A2 is, for example, about 1: 2 to 4.
Similar to the RFID tags 100 and 200 described in the first and second embodiments, also in the RFID tag 300, both sides of the overlapping reinforcing region A1 are one-side reinforcing regions A2 at least in the longitudinal direction. In addition, the size of the rigidity is the overlap reinforcement region A1> one-side reinforcement region A2> non-reinforcement region A3, and the overlap reinforcement region A1 in which the IC chip 15 is disposed includes the first reinforcement plate 30 and the second reinforcement. The rigidity is increased by the plate 40. Therefore, the possibility that the IC chip 15 is broken due to the bending load can be reduced.

  Similarly to the RFID tags 100 and 200 described in the first and second embodiments, in the RFID tag 300, when bending is added in the longitudinal direction, the one-side reinforcing region A2 is gently curved. The bending load can be reduced. That is, in FIG. 5B, when a bending load that bends the RFID tag 300 into a convex shape or a concave shape in a cross-sectional view is applied to the RFID tag 300, the one-side reinforcing region A2 is compared with the overlapping reinforcing region A1. Is gently curved as a whole, and the RFID tag 300 has a gentle bending shape with a large curvature radius. Since the one-side reinforcing region A2 is curved on both sides of the antenna 13, the bending load can be reduced.

  Further, as shown in FIGS. 5A and 5B, both end portions 31 in the longitudinal direction of the first reinforcing plate 30 and both end portions 41 in the longitudinal direction of the second reinforcing plate 40 are planar with the antenna 13. You can avoid overlapping with your eyes. When bending is added in the longitudinal direction, the load is most easily collected at both end portions 31 and 41. However, since both end portions 31 and 41 are located away from the antenna 13, both end portions 31 and 40 are connected to the antenna. 13 is not pressed against. Therefore, the possibility that the antenna 13 is disconnected can be further reduced.

As with the RFID tags 100 and 200 described in the first and second embodiments, the RFID tag 300 can also be manufactured by multi-faceting using a press machine and singulation using a punching press.
For example, as shown in FIG. 3A, an exterior lower member 23 made of a soft material is prepared, and a plurality of inlets 10 are arranged on the exterior lower member 23 at regular intervals. Next, as shown in FIG. 3B, the exterior upper member 21 made of a soft material is disposed on the exterior lower member 23 with the inlet 10 interposed therebetween. And the exterior lower member 23 and the exterior upper member 21 are pressed with the preset temperature and pressure with a press. Thereby, the exterior lower member 23 and the exterior upper member 21 are integrated, and the exterior member 20 is molded.

  Thereafter, the first reinforcing plate 30 is attached to the front surface 20 a of the exterior member 20, and the second reinforcing plate 40 is attached to the back surface side of the exterior member 20. Here, as shown in FIG. 6, as the first reinforcing plate 30 and the second reinforcing plate 40, a first reinforcing original plate 130 having a zigzag planar shape and a second reinforcing plate are used. An original plate 140 can be used. The first reinforcing original plate 130 and the second reinforcing original plate 140 are attached using, for example, an adhesive. Thereafter, the first reinforcing original plate 130, the second reinforcing original plate 140, and the exterior member 20 are punched into a rounded rectangular shape indicated by a broken line by a punching press and separated into individual pieces. As a result, the first reinforcing plate 30 is die-cut from the first reinforcing original plate 130, and the second reinforcing plate 40 is die-cut from the second reinforcing original plate 140, as shown in FIGS. 5 (a) and 5 (b). The RFID tag 300 shown is completed.

(4) Fourth Embodiment In the third embodiment described above, the method of manufacturing the RFID tag 300 using the reinforcing original plate having a flat (and zigzag) planar shape is shown. However, in the present invention, the manufacturing method of the RFID tag 300 shown in FIGS. 5A and 5B is not limited to this. For example, the RFID tag 300 can be manufactured using a linear (that is, tape-shaped) reinforcing original plate extending in one direction.

  For example, as shown in FIG. 7, a plurality of inlets 10 are arranged on the exterior lower member 23 made of a soft material at a constant interval, and the longitudinal direction of the inlets 10 is an oblique direction with respect to the X direction or the Y direction. Arrange so that Next, an exterior upper member 21 (not shown) made of a soft material is disposed on the exterior lower member 23 with the inlet 10 interposed therebetween. And the exterior lower member 23 and the exterior upper member 21 are pressed with the preset temperature and pressure with a press. Thereby, the exterior lower member 23 and the exterior upper member 21 are integrated, and the exterior member 20 is molded.

Next, the tape-shaped first reinforcing original plate 230 is attached to the surface 20 a of the exterior member 20, and the tape-shaped second reinforcing original plate 240 is attached to the back surface side of the exterior member 20. These attachments are performed using, for example, an adhesive. Thereafter, the first reinforcing original plate 230, the second reinforcing original plate 240, and the exterior member 20 are punched into a rounded rectangular shape indicated by a broken line by a punching press,
Divide into pieces. As a result, the first reinforcing plate 30 is die-cut from the first reinforcing original plate 230, and the second reinforcing plate 40 is die-cut from the second reinforcing original plate 240, as shown in FIGS. 5 (a) and 5 (b). The RFID tag 300 shown is completed.
According to the manufacturing method according to the fourth embodiment, since the reinforcing original plate is not in a zigzag but in a tape shape, the reinforcing original plate is attached to the exterior member 20 as compared with the manufacturing method described in the third embodiment. Is easy.

(5) Fifth Embodiment In the first and second embodiments described above, the case where the planar shape and the size of the first reinforcing plate 30 and the second reinforcing plate 40 are the same is illustrated. However, in the present invention, the planar shape and the size of the first reinforcing plate 30 and the second reinforcing plate 40 may be different from each other.

  FIGS. 8A and 8B are a plan view showing a configuration example of an RFID tag 400 according to the fifth embodiment of the present invention, and a cross-sectional view taken along line X8-X′8. As shown in FIG. 8A, in the RFID tag 400, the planar shape of the first reinforcing plate 30 is a square, and the planar shape of the second reinforcing plate 40 is a rectangle. In this example, one side of the square of the first reinforcing plate 30 has the same length as the short side of the rectangle of the second reinforcing plate 40.

  Similar to the RFID tag 100 described in the first embodiment, also in this RFID tag 400, both sides of the overlapping reinforcing region A1 are one-side reinforcing regions A2 in the longitudinal direction. Further, the size of the rigidity is the overlapping reinforcing area A1> one-side reinforcing area A2> non-reinforcing area A3, and the overlapping reinforcing area A1 in which the rigidity is enhanced by the first reinforcing plate 30 and the second reinforcing plate 40. The IC chip 15 is disposed on the board. For this reason, the possibility that the IC chip 15 is broken due to the bending load can be reduced.

  Further, similarly to the RFID tag 100 described in the first embodiment, also in the RFID tag 400, the bending load can be reduced by gently bending the one-side reinforcing region A2. That is, in FIG. 8B, when a bending load that bends the RFID tag 400 into a convex shape or a concave shape in a cross-sectional view is applied to the RFID tag 400, the one-side reinforcing region A2 is compared with the overlapping reinforcing region A1. Can be gently curved as a whole to relieve the bending load, and the RFID tag 400 has a gentle bending shape with a large curvature radius. For this reason, it is possible to reduce the possibility that the antenna 13 is damaged and disconnected due to the bending load.

(6) Other Embodiments In the above first to fifth embodiments, the first reinforcing plate 30 and the second reinforcing plate 40 are attached to the outside of the exterior member 20 (that is, the outer surface of the RFID tag). Explained. However, in the present invention, the attachment position of the first and second reinforcing plates is not limited to the outer surface of the exterior member 20, and may be the inner surface of the exterior member 20.

  Even in such a configuration, as in the first to fifth embodiments, the first reinforcing plate 30 is located on the front surface 10a side of the inlet, and the second reinforcing plate 40 is on the back surface 10b side of the inlet 10. Located in. The rigidity of the RFID tag in this case is the overlap reinforcement area A1> one-side reinforcement area A2> non-reinforcement area A3, and the rigidity of the overlap reinforcement area A1 where the IC chip 15 is disposed is the first It is enhanced by the reinforcing plate 30 and the second reinforcing plate 40. For this reason, it is possible to reduce the possibility that the antenna 13 is damaged and disconnected due to the bending load. Further, since the bending load can be relaxed by gently bending the one-side reinforcing region A2, the possibility that the antenna 13 is damaged and disconnected due to the bending load can be reduced.

  In the present invention, the front surface 10a side and the back surface 10b side of the inlet 10 are each covered with a protective sheet made of synthetic resin, and the inlet 10 covered with the protective sheet is accommodated in the exterior member 20. Good. The protective sheet and the front surface 10a and the back surface 10b of the inlet 10 may be bonded. In that case, for example, an adhesive may be used. Even if it is such a structure, there can exist an effect similar to said each embodiment.

(7) Verification of Effect FIGS. 9A and 9B are plan views showing dimensions and the like of the RFID tag 300 used for verification of the effect of the present invention and the RFID tag 500 as a comparative example.
As shown in FIG. 9A, the planar shape of the RFID tag 300 is a rounded rectangle, and the dimensions thereof are 60 mm in the longitudinal direction (X direction) and 60 mm in the short direction (Y direction). The arc of the corner 20 mm is R8 (radius 8 mm). The length of the first reinforcing plate 30 and the second reinforcing plate 40 in the horizontal direction (X direction) is 10 mm. Moreover, the thickness of the exterior member 20 is 1.2 mm. Each configuration of the RFID tag 300 is as described in the third embodiment.

  On the other hand, as shown in FIG. 9B, the planar shape of the RFID tag 500 as a comparative example is a rounded rectangle, and the dimensions thereof are 60 mm in the longitudinal direction (X direction) and the short direction (Y (Direction) is 20 mm in length, and the arc of the corner is R8 (radius 8 mm). The length of the first reinforcing plate 30 and the second reinforcing plate 40 in the horizontal direction (X direction) is 10 mm. Moreover, the thickness of the exterior member 20 is 1.2 mm. In the RFID tag 500, the first reinforcing plate and the second reinforcing plate face each other via the inlet, and their arrangement is not displaced in plan view. That is, only the overlapping reinforcing area A1 ′ and the non-reinforcing area A3 ′ exist, and there is no one-side reinforcing area.

  10 (a) to 10 (d) are conceptual diagrams showing a method for verifying the effect of the present invention. As shown in FIGS. 10A to 10D, in the verification performed by the present inventor, the RFID tag 300 is attached to the tip of the robot arm 90, and the portion of the RFID tag 300 where the IC chip is mounted (IC Using the vicinity of the mounting part) as a fulcrum, a bending load was applied alternately by 180 ° on the front and back sides, and repeated bending motions were performed. Then, the RFID tag 300 was inspected every certain number of times to confirm its durability. As a confirmation method, the communication distance was measured using a reader / writer with an output of 1 W. Although not shown, as a comparative example, the same operation as described above was performed for the RFID tag 500.

FIG. 11 is a diagram illustrating a verification result of the effect of the present invention. In FIG. 11, the horizontal axis indicates the number of times of bending [times], and the vertical axis indicates the communication distance [cm]. Here, each of the bending motions shown in FIGS. 10B and 10D was counted as one bend. That is, the number of times of bending when one cycle of bending motion is performed in the order of FIGS. 10A to 10D is two.
As shown in FIG. 11, when the bending resistances of the RFID tags 300 and 500 are compared, the RFID tag 300 did not show a decrease in communication distance even when the number of bendings reached 1200. On the other hand, in the RFID tag 500, when the number of times of bending exceeds 500 times, the communication distance is significantly reduced. The decrease in communication distance is thought to be due to the disconnection of the antenna.

  In the RFID tag 300, since the first reinforcing plate 30 and the second reinforcing plate 40 are not facing each other, when the RFID tag 300 is bent, the RFID tag 300 becomes a gently bent shape, and the antenna 13 It is considered that there is no disconnection because the burden on the vehicle is reduced. This verification demonstrated that the RFID tag 300 has excellent bending resistance.

  The IC tag of the present invention can be used by being attached to any product or product. However, since the bending resistance is excellent, the IC tag is suitable for an application where a bending load is expected to be applied. For example, it is suitable for uses that are attached to a curved or uneven article such as a gas cylinder or a flexible container, clothing such as linen or uniform, a foot cleaning mat, and the like.

10 inlet 10a (inlet) surface 10b (inlet) back surface 11 inlet base material 13 antenna 15 IC chip 20 exterior member 20a (exterior member) surface 20b (exterior member) back surface 21 exterior upper member 23 exterior lower member 30 Reinforcing plate 31 End portion 40 of first reinforcing plate Second reinforcing plate 41 End portion 90 of second reinforcing plate Robot arm 100, 200, 300 RFID tag 130, 230 First reinforcing original plate 140 , 240 Second reinforcing original plate A1 Overlapping reinforcing region A2 One side reinforcing region A3 Non-reinforcing region

Claims (6)

An inlet having a substrate, an antenna disposed on the substrate, and an IC chip disposed on the substrate and connected to the antenna;
A soft exterior member that houses the inlet;
A first reinforcing member disposed on the surface side of the inlet;
A second reinforcing member disposed on the back side of the inlet,
The shape of the exterior member in plan view is a rectangle,
Said first reinforcing member and the second reinforcing member, in plan view, the Rukoto arranged in a state of being displaced in the least the longitudinal direction of the rectangular of the outer member, wherein the first reinforcing member and the second and overlapping the reinforcing region and the reinforcing member overlap in a plan view of a region where the second reinforcing member on the back side of the inlet is not present together with the first reinforcing member is present on the surface side of the inlet, the inlet said second reinforcing member is formed and a side reinforcing region comprising a region in which the first reinforcing member is not present on the surface side of the inlet with exists on the back side of,
The IC tag, wherein the IC chip is located in the overlap reinforcement region in a plan view.   2. The IC tag according to claim 1, wherein each of the first reinforcing member and the second reinforcing member is made of a material having a Young's modulus higher than that of the exterior member. The antenna extends in the longitudinal direction of the rectangle of the exterior member ,
The IC tag according to claim 1 or 2, wherein the one-side reinforcing region is formed on both sides of the overlapping reinforcing region at least in the longitudinal direction. An inlet having a substrate, an antenna disposed on the substrate, and an IC chip disposed on the substrate and connected to the antenna;
A soft exterior member that houses the inlet;
A first reinforcing member disposed on the surface side of the inlet;
A second reinforcing member disposed on the back side of the inlet,
The first reinforcing member and the second reinforcing member are:
The overlapping reinforcing region where the first reinforcing member and the second reinforcing member overlap in a plan view, and one-side reinforcement in which only one of the first reinforcing member and the second reinforcing member exists in a plan view And arranged to form a region,
The IC chip is located in the overlap reinforcement region in plan view,
The shape of the exterior member in plan view is a rectangle,
The antenna extends in the longitudinal direction of the rectangle;
At least in the longitudinal direction, the one-side reinforcing region is formed on both sides of the overlapping reinforcing region,
The first reinforcing member is disposed so as to intersect the longitudinal direction in plan view,
Said second reinforcing member, said longitudinal and cross in a plan view, and, I C tag you characterized in that it is arranged so as to intersect with the first reinforcing member. The first reinforcing member is
As it goes from one side of the longitudinal direction to the other side, it is arranged so as to go from one end side of the rectangular short direction to the other end side,
The second reinforcing member is
5. It arrange | positions so that it may go to the said one end side from the said other end side of the said transversal direction as it goes to the said other side from the said one side of the said longitudinal direction. IC tag. Preparing an inlet having a base material, an antenna disposed on the base material, and an IC chip disposed on the base material and connected to the antenna;
A step of accommodating the inlet in an exterior member having a rectangular shape in a soft plan view ;
Disposing a first reinforcing member on the surface side of the inlet;
Arranging a second reinforcing member on the back side of the inlet,
In the step of disposing the first reinforcing member and the step of disposing the second reinforcing member, at least the first exterior member having a rectangular shape in plan view is formed by the first reinforcing member and the second reinforcing member. the Rukoto arranged in a state of being displaced in the longitudinal direction, the first reinforcing member and the second reinforcing member and overlapping the reinforcing region overlapping in a plan view, the first reinforcing member to the surface side of the inlet a region where the second reinforcing member on the back side of the inlet does not exist with but present, the first reinforcement on the surface side of the inlet with the second reinforcing member on the back side of the inlet to exist a region in which member is not present, the one-sided reinforcement areas including, are formed, one 且, so that the IC chip is located on the overlapping reinforcing region in plan view, the first reinforcing member and the second reinforcing Component placement Method of manufacturing an IC tag which is characterized by adjusting the location.

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