JP5435095B2 - Circuit board and method for manufacturing circuit board - Google Patents

Circuit board and method for manufacturing circuit board Download PDF

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JP5435095B2
JP5435095B2 JP2012200724A JP2012200724A JP5435095B2 JP 5435095 B2 JP5435095 B2 JP 5435095B2 JP 2012200724 A JP2012200724 A JP 2012200724A JP 2012200724 A JP2012200724 A JP 2012200724A JP 5435095 B2 JP5435095 B2 JP 5435095B2
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metal
circuit board
method
melting point
manufacturing
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JP2013012770A (en
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誠樹 作山
浩基 内田
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富士通株式会社
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Description

  The present invention relates to a circuit board manufacturing method for forming a high-density conductor circuit on a printed wiring board.

  As a conductive material for forming such a conductor circuit, it is required to be chemically stable and to have a small electric resistance. However, a conductive material that has been used conventionally and satisfies these conditions is used. There wasn't.

  Under such circumstances, there is a demand for a conductive material that is chemically stable and has low electrical resistance.

  Conductor circuits formed on printed wiring boards on which electronic components are mounted are required to be formed with high density. In recent years, conductive materials are embedded in through holes or via holes to connect upper and lower wiring layers. In addition, printed wiring boards capable of mounting electronic components at high density by providing inner via holes (IVH), blind via holes, and the like with high density are used.

  As a method of forming a conductor circuit on such a printed wiring board, a material in which a metal film to be a conductor circuit is formed on the entire surface of the printed wiring board is removed by etching the unnecessary metal film using a photolithography technique. In order to reduce the cost, a conductive paste containing conductive material particles such as silver, copper, and carbon and a binder dissolved in a solvent is used. A method is used in which a film is formed on the surface of a printed wiring board by screen printing or in an inner via hole (IVH) or a blind via hole, and a conductor circuit is formed by a curing process.

Also, a conductive material comprising a plurality of particles, each particle having a conductive coating, the coating melts to form a conductive coating on adjacent particles, and forms a network of molten particles. It is disclosed in Japanese Patent Application Laid-Open No. 08-227613.
Japanese Patent Laid-Open No. 08-227613 Paragraph 0017.

In the conventional method of forming a conductor circuit by screen printing as described above, when the conductive material used for the conductive paste is silver, the electric resistance value is 5.0 × 10 −5 Ω · Although the conductivity is excellent at cm, there is a problem that it reacts with sulfur to become silver sulfide or causes migration, and when the conductive material used for the conductive paste is copper, it is shown in FIG. Thus, there is a problem that the electrical resistance value is 2.5 × 10 −4 Ω · cm and the conductivity is inferior to silver, and when the conductive material used in the conductive paste is carbon, it reacts with sulfur and sulfide However, there is a problem that the electrical resistance is 3.0 × 10 −2 Ω · cm and the conductivity is inferior to copper as shown in FIG.

  An invention relating to a conductive metal paste used for a terminal electrode of a multilayer ceramic electronic component has been disclosed in Japanese Patent Application Laid-Open No. 02-46603. In this invention, a composite metal powder coated with zinc on the surface of a copper powder is laminated with a multilayer ceramic. Since it is used as a terminal electrode for electronic parts, when it is sintered at 500 to 600 ° C., interdiffusion proceeds between zinc and copper, and the zinc part becomes brass and a high-density sintered body can be obtained. By surrounding the copper powder with brass, the surface of the copper terminal electrode is prevented from being oxidized.

  This known example is an invention that utilizes the fact that the melting point of an alloy formed between two types of metal elements is lower than the melting point of each element.

  On the other hand, the melting point of the intermetallic compound formed between the two types of metal elements is higher than the lower melting point of the two types of metal elements.

  In view of the above situation, the present invention provides a circuit board having a conductive material made of an intermetallic compound that has a melting point higher than the heat resistance temperature of the insulating board of the printed wiring board and can withstand the soldering temperature of electronic components. The purpose is to provide a manufacturing method.

  According to one aspect of the present invention, the via hole of the substrate includes a plurality of particles made of the first metal and a plurality of particles made of the second metal having a melting point lower than the melting point of the first metal. A circuit board for supplying an electrically conductive paste and heating the substrate to form an intermetallic compound of the first metal and the second metal having a melting point higher than that of the second metal. Provided is a method for manufacturing a circuit board, wherein an electronic component can be mounted using solder on the substrate, and the melting point of the intermetallic compound is higher than the melting temperature of the solder. Is done.

  A conductor circuit having a melting point higher than the heat resistant temperature of the substrate can be formed at a low temperature.

Schematic diagram showing the configuration of the conductive material of the present invention The schematic diagram which shows the structure of the intermetallic compound formed in the electrically-conductive material of this invention Schematic diagram showing the configuration of another conductive material of the present invention The figure which shows the electrical resistance value of the conductor circuit formed by the Example of this invention The figure which shows the electrical resistance value of the conventional conductor circuit

  In the following embodiments, the metal that is the core of the conductive material in the conductive paste and the metal that is formed as a coating on the surface of the core are a low temperature that is not higher than the heat resistance temperature (260 ° C.) of the insulating substrate of the printed wiring board. In this case, the melting point of the intermetallic compound between the core metal and the metal formed as a coating film forms a conductor circuit composed of the intermetallic compound. It is higher than the heat resistance temperature of the insulating substrate and is thermally stable, and it does not remelt at the soldering temperature (220 ° C to 240 ° C) when mounting electronic components on a printed wiring board. Moreover, since the electrical resistance value of the intermetallic compound has a value that can be used as a conductor circuit of a printed wiring board, a conductor circuit formed using the conductive material and conductive paste of the following embodiment is provided. Electronic components can be mounted on the printed wiring board.

  In addition, a conductive material composed of a plurality of types of metal particles melts at a temperature equal to or lower than the heat resistance temperature (260 ° C.) of the insulating substrate of the printed wiring board and forms an intermetallic compound. The melting point of the intermetallic compound of at least two of the metals is higher than the heat resistance temperature of the insulating substrate on which the conductor circuit made of the intermetallic compound is formed, and is thermally stable. It does not remelt at the soldering temperature (220 ° C to 240 ° C) when mounted on a plate. Moreover, since the electrical resistance value of the intermetallic compound has a value that can be used as a conductor circuit of a printed wiring board, a conductor circuit formed using the conductive material and conductive paste of the following embodiment is provided. Electronic components can be mounted on the printed wiring board.

  Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS.

  FIG. 1 is a schematic diagram showing the configuration of the conductive material of the present invention, FIG. 2 is a schematic diagram showing the configuration of an intermetallic compound formed in the conductive material of the present invention, and FIG. 3 is another conductive material used in the present invention. FIG. 4 is a diagram showing the electrical resistance value of the conductor circuit formed by the embodiment of the present invention.

  In the first embodiment of the present invention, 900 g of a conductive filler in which a 1 μm thick indium film is formed on the surface of copper particles having a diameter of about 5 μm by electroless plating, 50 g of bisphenol A, and diaminodiphenylmethane. 5g and 45g of ethylene glycol diglycidyl ether are mixed to make a conductive paste, and this conductive paste is a glass cloth base epoxy resin substrate (hereinafter abbreviated as glass epoxy substrate) by screen printing method (heat-resistant temperature 260 ° C) After printing on the surface, the substrate was heated for 180 seconds to form a conductor circuit made of an intermetallic compound of copper and indium having a line width of 150 μm and a thickness of 10 μm. Since the melting point of this intermetallic compound is much higher than the melting temperature of the solder (220 to 240 ° C), it cannot be remelted at the soldering temperature (220 ° C to 240 ° C) when mounting electronic components on a printed wiring board. Absent.

  The conductive paste was embedded in a 150 μm diameter via and heated at 210 ° C. for 180 seconds.

The value of this conductor circuit and via measured by the four probe method was 5.0 × 10 −6 Ω · cm as shown in FIG.

In the second embodiment of the present invention, 900 g of a conductive filler in which a 1 μm thick tin film is formed on the surface of the same copper particles as in the first embodiment by an electroless plating method; A conductive paste is made by mixing the same chemicals as in the example, and the conductive paste is formed by screen printing in the same manner as in the first embodiment to form a conductive circuit and a via. Measured by the method. The measured value was 8.0 × 10 −6 Ω · cm as shown in FIG.

In the third embodiment of the present invention, 900 g of a conductive filler in which an indium film having a thickness of 1 μm is formed on the surface of silver particles different from that of the second embodiment by an electroless plating method, A conductive paste is prepared by mixing the same chemicals as in the example, and a conductive circuit and a via are formed by screen printing in the same manner as in the first example. It was measured by the terminal method. The measured value was 5.0 × 10 −6 Ω · cm as shown in FIG.

In the fourth embodiment of the present invention, 900 g of a conductive filler in which a 1 μm thick tin film is formed on the surface of the same silver particles as in the third embodiment by electroless plating, A conductive paste is made by mixing the same chemicals as in the example, and the conductive paste is formed by screen printing in the same manner as in the first embodiment to form a conductive circuit and a via. Measured by the method. The measured value was 8.0 × 10 −6 Ω · cm as shown in FIG.

In the fifth embodiment of the present invention, 900 g of a conductive filler in which an indium film having a thickness of 1 μm is formed on the surface of nickel particles by an electroless plating method and the same chemical as in the first embodiment are mixed. Then, a conductive paste was prepared, and a conductive circuit and a via were formed by the screen printing method in the same manner as in the first embodiment, and the conductive circuit and the via were similarly measured by a four-terminal method. The measured value was 8.0 × 10 −6 Ω · cm as shown in FIG.

In the sixth embodiment of the present invention, 900 g of a conductive filler in which a 1 μm-thick tin film is formed on the surface of the same nickel particles as in the fifth embodiment by an electroless plating method; A conductive paste is made by mixing the same chemicals as in the example, and the conductive paste is formed by screen printing in the same manner as in the first embodiment to form a conductive circuit and a via. Measured by the method. The measured value was 9.0 × 10 −6 Ω · cm as shown in FIG.

In the seventh embodiment of the present invention, 900 g of a conductive filler in which an indium film having a thickness of 1 μm is formed on the surface of the same copper particles as in the first or second embodiment by an electroless plating method, A conductive paste was prepared by mixing the same chemicals as in Example 1, and a via having a diameter of 150 μm was formed from this conductive paste. Similarly, this via was measured by the four-terminal method. The measured value was 5.0 × 10 −6 Ω · cm as shown in FIG.

In the eighth embodiment of the present invention, 900 g of a conductive filler in which a 1 μm-thick indium film is formed on the surface of the same silver particles as in the third or fourth embodiment by electroless plating, A conductive paste was prepared by mixing the same chemicals as in Example 1, and a via having a diameter of 150 μm was formed from this conductive paste. Similarly, this via was measured by the four-terminal method. The measured value was 5.0 × 10 −6 Ω · cm as shown in FIG.

In the ninth embodiment of the present invention, 900 g of a conductive filler in which a 1 μm-thick indium film is formed on the surface of the same nickel particles as in the fifth or sixth embodiment by electroless plating, A conductive paste was prepared by mixing the same chemicals as in Example 1, and vias were formed from the conductive paste. Similarly, the vias were measured by the four-terminal method. The measured value was 8.0 × 10 −6 Ω · cm as shown in FIG.

  In the tenth embodiment of the present invention, 450 g of a conductive filler in which a tin film having a thickness of 1 μm is formed on the surface of a copper particle having a diameter of about 5 μm by an electroless plating method, and silver having a diameter of about 5 μm. A conductive paste was prepared by mixing 450 g of conductive filler formed by electroless plating with a 1 μm thick indium film on the surface of particles, 50 g of bisphenol A, 5 g of diaminodiphenylmethane and 45 g of ethylene glycol diglycidyl ether. After this conductive paste was printed on the surface of the glass epoxy substrate by a screen printing method, it was heated at 210 ° C. for 180 seconds to form a conductor circuit having a line width of 150 μm and a thickness of 10 μm.

  The conductive paste was embedded in a 150 μm diameter via and heated at 210 ° C. for 180 seconds.

The value of this conductor circuit and via measured by the four probe method was 8.0 × 10 −6 Ω · cm as shown in FIG.

  In an eleventh embodiment of the present invention, 600 g of copper particles having a diameter of 0.1 to 0.5 μm, 300 g of tin particles having a diameter of 0.1 to 0.3 μm, 50 g of bisphenol A, 5 g of diaminodiphenylmethane, and ethylene glycol diester. A conductive paste is made by mixing 45 g of glycidyl ether, and this conductive paste is printed on the surface of the glass epoxy substrate by screen printing, and then heated at 210 ° C for 180 seconds to produce a conductor circuit with a line width of 150 µm and a thickness of 10 µm. Formed.

The conductive paste was embedded in a 150 μm diameter via and heated at 210 ° C. for 180 seconds. The value of this conductor circuit and via measured by the four probe method was 9.0 × 10 −6 Ω · cm as shown in FIG.

  As is apparent from the above description, according to the present invention, a conductor having a melting point higher than the heat resistance temperature of the insulating substrate is formed on the insulating substrate of the printed wiring board using the conductive material and conductive paste having a very simple structure. Circuits can be formed at low temperatures.

DESCRIPTION OF SYMBOLS 1 1st metal particle 2 2nd metal film 3 Intermetallic compound film 4 3rd metal particle 5 4th metal film

Claims (16)

  1. Supplying a conductive paste containing a plurality of particles made of a first metal and a plurality of particles made of a second metal having a melting point lower than the melting point of the first metal into a via hole of the substrate; And a plurality of particles made of the first metal are dispersed in an intermetallic compound of the first metal and the second metal having a melting point higher than that of the second metal. A method of manufacturing a circuit board for forming a conductor ,
    An electronic component can be mounted on the substrate using solder, and the melting point of the intermetallic compound is higher than the melting temperature of the solder.
  2. In the manufacturing method of the circuit board according to claim 1,
    The first metal includes at least one of Cu, Ni, and Ag,
    The method of manufacturing a circuit board, wherein the second metal includes a metal that forms the intermetallic compound with the first metal.
  3. In the manufacturing method of the circuit board of Claim 2,
    The first metal is Cu;
    The method of manufacturing a circuit board, wherein the second metal is Sn.
  4. In the manufacturing method of the circuit board of Claim 2,
    The first metal is Ag;
    The method of manufacturing a circuit board, wherein the second metal is Sn.
  5. In the manufacturing method of the circuit board of Claim 2,
    The circuit board manufacturing method, wherein the second metal contains In.
  6. In the manufacturing method of a circuit board given in any 1 paragraph of Claims 1 thru / or 5,
    The method of manufacturing a circuit board, wherein the conductive paste is supplied into the via hole by a screen printing method.
  7.   7. The method of manufacturing a circuit board according to claim 1, further comprising soldering the electronic component at a temperature higher than a heating temperature of the board.
  8. A substrate having a via hole;
    A conductor formed in the via hole and having a plurality of particles made of the first metal dispersed in an intermetallic compound of the first metal and a second metal having a melting point lower than that of the first metal;
    With
    The intermetallic compound has a melting point higher than the melting point of the second metal;
    An electronic component can be mounted on the substrate using solder, and the melting point of the intermetallic compound is higher than the melting temperature of the solder.
  9. The circuit board according to claim 8,
    The first metal includes at least one of Cu, Ni, and Ag,
    The circuit board, wherein the second metal includes a metal that forms the intermetallic compound with the first metal.
  10. The circuit board according to claim 9,
    The first metal is Cu;
    The circuit board, wherein the second metal is Sn.
  11. The circuit board according to claim 9,
    The first metal is Ag;
    The circuit board, wherein the second metal is Sn.
  12. The circuit board according to claim 9,
    The circuit board, wherein the second metal contains In.
  13. The circuit board according to any one of claims 8 to 12,
    The circuit board, wherein the conductor further contains a resin.
  14. The circuit board according to any one of claims 8 to 13,
    A circuit board on which the electronic component is soldered.
  15. In the manufacturing method of the circuit board of any one of Claims 1 thru | or 7,
    A method for producing a circuit board, wherein a soldering temperature of the electronic component to the board is 220 ° C to 240 ° C.
  16. The circuit board according to any one of claims 8 to 14,
    A circuit board, wherein a soldering temperature of the electronic component to the board is 220 ° C to 240 ° C.
JP2012200724A 2012-09-12 2012-09-12 Circuit board and method for manufacturing circuit board Expired - Lifetime JP5435095B2 (en)

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Publication number Priority date Publication date Assignee Title
JPS6216038B2 (en) * 1980-12-25 1987-04-10 Sony Corp
JPH0813424B2 (en) * 1991-05-27 1996-02-14 住友軽金属工業株式会社 Spot welding electrodes
TW340132B (en) * 1994-10-20 1998-09-11 Ibm Structure for use as an electrical interconnection means and process for preparing the same
JPH09122967A (en) * 1995-10-25 1997-05-13 Tanaka Denshi Kogyo Kk Composite solder material

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