CN117156731A - Single-sided multilayer aluminum substrate and preparation method thereof - Google Patents
Single-sided multilayer aluminum substrate and preparation method thereof Download PDFInfo
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- CN117156731A CN117156731A CN202311428963.7A CN202311428963A CN117156731A CN 117156731 A CN117156731 A CN 117156731A CN 202311428963 A CN202311428963 A CN 202311428963A CN 117156731 A CN117156731 A CN 117156731A
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- 239000000758 substrate Substances 0.000 title claims abstract description 57
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 38
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000010410 layer Substances 0.000 claims abstract description 207
- 229910052751 metal Inorganic materials 0.000 claims abstract description 77
- 239000002184 metal Substances 0.000 claims abstract description 77
- 238000007639 printing Methods 0.000 claims abstract description 56
- 238000000034 method Methods 0.000 claims abstract description 32
- 239000007921 spray Substances 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 20
- 238000012545 processing Methods 0.000 claims abstract description 19
- 238000003466 welding Methods 0.000 claims abstract description 19
- 239000011241 protective layer Substances 0.000 claims abstract description 17
- 238000005530 etching Methods 0.000 claims abstract description 9
- 238000011161 development Methods 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000011889 copper foil Substances 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000003365 glass fiber Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000012943 hotmelt Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000005553 drilling Methods 0.000 abstract description 5
- 238000011049 filling Methods 0.000 abstract description 3
- 239000000047 product Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 239000002699 waste material Substances 0.000 description 5
- 238000003912 environmental pollution Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000011410 subtraction method Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009766 low-temperature sintering Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000320 mechanical mixture Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The application discloses a single-sided multilayer aluminum substrate and a preparation method thereof, wherein the preparation method comprises the steps of adopting an exposure development etching process to process a first conductive layer on a substrate layer, so that the first conductive layer is formed into a first layer metal circuit; dividing a first region, a second region and a third region in the region where the substrate layer is positioned; processing an insulating layer in the range of the first area by adopting a printing or spray printing mode; dividing a fourth area in the area of the substrate layer, and processing a second conductive layer in the area of the fourth area by adopting a printing or spray printing mode; an insulating protective layer is processed on the surface of the second layer of metal circuit, and a welding protective layer is processed on the third area of the first layer of metal circuit for welding electronic elements. The application adopts a printing or spray printing mode to directly process the insulating layer and the second conductive layer by layer without drilling and filling, and has high manufacturing efficiency and high yield.
Description
Technical Field
The application belongs to the technical field of aluminum substrates, and particularly relates to a single-sided multilayer aluminum substrate and a preparation method thereof.
Background
The conventional aluminum substrate is usually in a single-layer structure, the price of the aluminum substrate in the single-layer structure is usually 130 yuan per square meter, and as circuits are more and more complex, a multi-layer circuit structure is required to be processed on the surface of the aluminum substrate, and as circuits of each layer are required to be connected, the conventional processing mode is a subtractive method, a first layer of metal is prepared on the aluminum substrate through an exposure, development and etching process, then a PP sheet and a copper foil are attached to the first layer of metal through an attaching process, then the PP sheet and the copper foil are drilled through a drilling mode, and then metal is electroplated in holes for conducting, and as the depth of the holes is deeper and the diameter is smaller, the metal can be prepared in the holes only through a high pollution electroplating process.
The following problems exist in this processing mode: the machining efficiency is low, each connecting point needs to be accurately drilled and refilled or plated with metal, time and labor are wasted, the yield of products is low, meanwhile, waste of raw materials can be caused, and finally the production cost of the products is increased. The aluminum substrate manufactured by the processing method is usually 1300-1500 yuan per square meter, and the use cost is high. In addition, in this processing method, multiple steps such as photoresist covering, photoresist exposing, developing, photoresist etching, photoresist removing are required, wherein the photoresist waste liquid, the etching waste liquid and the developing waste liquid are all pollutants, and the environmental pollution degree is high.
However, additive methods, such as printing, still have drawbacks in manufacturing metal lines: due to printing limitations, the thickness of the printed metal can only reach 10 microns at maximum; secondly, the printed material contains resin, which causes that the printed layer cannot be effectively welded with solder paste at high temperature, and the traditional gold, silver and tin melting processes cannot be adopted to protect the metal circuit; the above drawbacks have led to a broad limit in the application of printing processes in the circuit board industry.
Disclosure of Invention
The present application aims to solve at least one of the technical problems existing in the prior art.
Therefore, the application provides the single-sided multilayer aluminum substrate and the preparation method thereof, and the preparation method of the single-sided multilayer aluminum substrate has the advantages of high production efficiency, low product manufacturing cost, high yield in manufacturing and long service life.
The preparation method of the single-sided multilayer aluminum substrate according to the embodiment of the application comprises the following steps: step one: processing the first conductive layer on the substrate layer by adopting an exposure development etching process, so that the first conductive layer is formed into a first layer metal circuit; step two: dividing a first region, a second region and a third region in the region where the substrate layer is located, wherein the second region and the third region fall on the first layer metal line, and the first region, the second region and the third region do not have intersection; step three: processing an insulating layer in the range of the first area by adopting a printing or spray printing mode; step four: dividing a fourth area in the area of the substrate layer, and processing a second conductive layer in the area of the fourth area by adopting a printing or spray printing mode, wherein the second conductive layer is formed into a second layer of metal circuit, and the second layer of metal circuit and the first layer of metal circuit are connected in the area of the second area; step five: an insulating protective layer is processed on the surface of the second layer of metal circuit, and a welding protective layer is processed on the third area of the first layer of metal circuit for welding electronic elements.
According to one embodiment of the application, in the third step, the insulating layer is processed by a mode of printing or spray printing layer by layer for a plurality of times, and when the insulating layer is printed or spray-printed layer by layer for a plurality of times, the edge of the printing or spray-printed area gradually contracts from outside to inside.
According to one embodiment of the present application, in the third step, a first mesh plate is manufactured, the mesh openings formed in the first mesh plate correspond to the outline shape of the first area, the first mesh plate is attached to the first layer metal wire, and then insulating paste is printed or sprayed in the mesh openings, and the insulating layer is formed after drying.
According to one embodiment of the application, the insulating paste is insulating ink, and the insulating ink contains 1% -15% of hot melt resin or 0.1% -20% of glass fibers.
According to an embodiment of the present application, in the fourth step, a second mesh plate is first manufactured, the mesh openings formed on the second mesh plate correspond to the outline shape of the second layer of metal circuit, the second mesh plate is attached to the insulating layer, the conductive paste is printed or sprayed in the mesh openings, and the second layer of metal circuit is formed after drying and curing.
According to one embodiment of the application, the insulating protective layer and the welding protective layer are processed by printing or spray printing or coating.
According to one embodiment of the application, the conductive paste is one of silver paste and copper paste, and the curing or sintering temperature of the conductive paste is lower than 300 ℃.
According to one embodiment of the application, the first conductive layer is copper foil, the first layer metal lines are used for soldering electronic components, and the first layer metal lines are also used for passing high current or high voltage.
According to one embodiment of the application, the second layer metal line is used as a bridge line, and the second layer metal line is also used for passing low voltage or low current.
According to one embodiment of the application, the single-sided multilayer aluminum substrate is prepared by the preparation method of the single-sided multilayer aluminum substrate.
The application has the beneficial effects that the first conductive layer and the second conductive layer are arranged on the substrate layer to form a multi-layer metal circuit, the first conductive layer and the second conductive layer are isolated by the insulating layer, and meanwhile, the parts of the first conductive layer and the second conductive layer which need to be connected are connected together; the first conductive layer is the traditional copper foil, the width and the thickness of the circuit are larger, the conductivity is better, the welding protective layer is arranged on the first conductive layer to weld electronic elements, the problem of poor welding effect of the second conductive layer is avoided, in addition, the insulating layer and the second conductive layer can be prepared into any shape and size, full coverage is not needed, and raw materials are saved; the application integrates the advantages of the addition method and the subtraction method, avoids the respective defects, greatly improves the processing efficiency of the circuit board product, greatly reduces the price of the product, improves the environmental pollution, and has great social and economic values.
Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and may be readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic structural view of a single-sided multi-layered aluminum substrate according to the present application;
FIG. 2 is a schematic view of a manufacturing process of a single-sided multi-layered aluminum substrate according to the present application;
FIG. 3 is a schematic view of the locations of different areas in a single-sided multi-layer aluminum substrate according to the present application;
reference numerals:
a substrate layer 1, a bonding layer 2, a first conductive layer 3, an insulating layer 4, a second conductive layer 5, an insulating protection layer 6 and a welding protection layer 7.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
The single-sided multi-layered aluminum substrate and the method of manufacturing the same according to the embodiment of the present application are specifically described below with reference to the accompanying drawings.
As shown in fig. 1, 2 and 3, the method for manufacturing a single-sided multi-layered aluminum substrate according to an embodiment of the present application includes: step one: processing the first conductive layer 3 on the substrate layer 1 by adopting an exposure development etching process, so that the first conductive layer 3 is formed into a first layer metal circuit; step two: dividing a first region, a second region and a third region in the region range of the substrate layer 1, wherein the second region and the third region fall on the first layer metal line, and the first region, the second region and the third region do not have intersection; step three: processing the insulating layer 4 in the range of the first area by adopting a printing or spray printing mode; step four: dividing a fourth area in the area of the substrate layer 1, and processing a second conductive layer 5 in the area of the fourth area by adopting a printing or spray printing mode, wherein the second conductive layer 5 is formed into a second-layer metal circuit, and the second-layer metal circuit and the first-layer metal circuit are connected in the area of the second area; step five: an insulating protective layer 6 is processed on the surface of the second metal line layer, and a welding protective layer 7 is processed on the third area of the first metal line layer for welding electronic components.
In other words, the second area needs to expose the first metal line for connection with the second metal line, the third area needs to expose the first metal line for soldering the electronic component, so the second area and the third area fall within the first metal line, the first area needs to be designed according to the actual line shape, and the insulating layer 4 covers the substrate layer 1 except the first metal line, so after the first metal line is manufactured, the portion of the first metal line needing insulation protection and the portion of the substrate layer 1 needing insulation are divided into the first area together, and the insulating layer 4 is processed in the first area, then only the second area and the third area are exposed on the first metal line; then, a fourth area is continuously divided above the substrate layer 1 for processing the second layer of metal circuit according to the actual circuit design requirement, and at this time, the second area falls in the fourth area, so that the connection between the second layer of metal circuit and the first layer of metal circuit is completed in the second area.
In the third step, the insulating layer 4 is processed by multiple layer-by-layer printing or spray printing, and the edge of the printing or spray printing area gradually contracts from outside to inside during multiple layer-by-layer printing or spray printing of the insulating layer 4. The thickness of the insulating layer 4 is at least more than 100 micrometers to prevent leakage and interference to a signal line, and after the insulating layer 4 is thickened, the insulating layer is processed by adopting a mode of multiple layer-by-layer printing or spray printing; because the thickness of the insulating layer 4 is thicker, the height difference between the first layer metal circuit and the second layer metal circuit is larger, and the connection is difficult, and after the edge of the printing or jet printing area is gradually contracted from outside to inside, the edge of the insulating layer 4 forms a stepped structure, so that the first layer metal circuit on the side surface of the insulating layer 4 is connected with the second layer metal circuit above the insulating layer 4.
In the third step, the specific printing or spray printing process is that a first screen plate is firstly manufactured, meshes formed in the first screen plate correspond to the outline shape of the first area, the first screen plate is attached to the first layer metal line, the first area is exposed out of the meshes, then insulating slurry is printed or spray printed in the meshes, and the insulating layer 4 is formed after drying. When drying, the whole product is required to be placed in a vacuum box for defoaming treatment, so that the insulating paste printed or sprayed is ensured to contain no bubbles, and short circuit or electric field abnormality caused by the bubbles is avoided.
Further, the insulating paste is insulating ink, the insulating ink is epoxy resin, and the insulating ink contains 1% -15% of hot melt resin or 0.1% -20% of glass fiber.
The insulating layer 4 should be paid attention to adhesion to the second conductive layer 5, and if necessary, a hot-melt resin (for example, PVDF) may be added to the insulating ink, and the adhesion may be improved by heat fusion when the conductive paste is thermally cured or thermally sintered. The proportion of the common additive is 1% -15%, and the original characteristics can be influenced by excessive additive.
When the thickness of the insulating layer 4 is increased, since it is not consistent with the thermal expansion and contraction of the metal aluminum substrate, glass fiber may be added to adjust the mechanical characteristics thereof so as to maintain the flatness or strength of the circuit board in use or processing. The glass fiber is added in a proportion of 0.1% -20%.
Since the insulating ink is formed by mixing a liquid resin with a filler, the edge of the insulating layer 4 is likely to have a phenomenon in which a liquid component oozes out. A safe spacing of at least 100 microns between different regions of the insulating layer 4 is required.
In the fourth step, a second mesh plate is manufactured first, meshes formed in the second mesh plate correspond to the outline shape of the second layer metal circuit, the second mesh plate is attached to the insulating layer 4, conductive paste is printed or sprayed in the meshes, and the second layer metal circuit is formed after drying and solidification.
Further, the conductive paste is one of silver paste and copper paste, and the curing or sintering temperature of the conductive paste is lower than 300 ℃. Since the insulating layer 4 is not resistant to high temperature, the conductive paste cured at low temperature is selected in this embodiment, and the curing temperature is 130-150 ℃, or the photo-sintering copper paste can be selected, and the paste can be sintered and cured by illumination.
Since heating is required when curing the insulating layer 4 and the second conductive layer 5, at this time, oxidation of the copper foil of the first conductive layer 3 may be caused, and the process may be placed in a vacuum oven having a pumping function or a nitrogen oven having a pumping function, the latter being preferable in view of uniformity.
According to one embodiment of the application, the first conductive layer 3 is copper foil and the third area on the first layer of metal lines is used for soldering electronic components and the first layer of metal lines is also used for passing high currents or voltages. The second layer of metal lines is used as bridging lines, and the second layer of metal lines is also used for passing low voltage or low current.
That is, the second conductive layer 5 is printed or spray-printed by conductive paste, and the cross-section size is smaller due to the process limitation, so that the conductive performance is poorer, meanwhile, the non-metal substances are contained in the conductive paste, so that the welding performance is poorer, the first conductive layer 3 is copper foil, and the conductive performance and the welding performance are both stronger than those of the second conductive layer 5, and the first conductive layer 3 is used for welding electronic elements and passing larger current or voltage, and the second conductive layer 5 is used for bridging and passing smaller current or voltage, so that the aluminum substrate has longer service life and is easier to process.
The insulating protective layer 6 and the welding protective layer 7 are processed by printing, spray printing or coating. The insulating protective layer 6 is mainly for preventing the second conductive layer 5 from being oxidized and corroded.
In other words, since the second conductive layer 5 is processed from the conductive paste by printing or jet printing. In general, the conductive paste is a thick paste of a mechanical mixture composed of conductive particles, an adhesive, a solvent and an auxiliary agent, and therefore, although it can conduct electricity, it contains non-metal impurities, resulting in poor soldering effect, and electronic components are difficult to be soldered with the second conductive layer 5.
Therefore, the application forms a multi-layer metal circuit by arranging the first conductive layer 3 and the second conductive layer 5 on the substrate layer 1, isolates the first conductive layer 3 from the second conductive layer 5 by utilizing the insulating layer 4, and simultaneously connects the part of the first conductive layer 3 and the second conductive layer 5 which needs to be connected in the second area.
The application also discloses a single-sided multilayer aluminum substrate, which is prepared by adopting the preparation method of the single-sided multilayer aluminum substrate. Of course, the conductive layers in this embodiment are not limited to two layers, and a third conductive layer may be disposed after an insulating layer is disposed on the second conductive layer 5. The substrate layer 1 is usually an aluminum plate, the bonding layer 2 is usually a PP layer, on one hand, the first conductive layer 3 can be fixed on the substrate layer 1, on the other hand, an insulating effect can be achieved, and short circuit caused by conduction of the first layer metal circuit by the aluminum plate is avoided. The insulating layer 4 and the second conductive layer 5 are directly processed by printing or jet printing, and drilling and hole filling are not needed, so that waste of raw materials is avoided, processing steps are reduced, and processing efficiency is improved.
In this embodiment, in the first step, the aluminum substrate semi-finished product compounded by the substrate layer 1, the bonding layer 2 and the first conductive layer 3 may be directly purchased, and then unnecessary portions are removed by an exposure etching process, so as to form the first metal line.
The conventional circuit forming process includes: forming a first layer of circuit, pressing copper materials, drilling, electroplating through holes, pressing films, exposing, developing, etching, removing films, and dissolving tin and gold to obtain a product; the circuit forming process of the application comprises the following steps: the first layer of circuit is formed, an insulating layer is printed, a conductive material is printed, and the product is obtained through low-temperature sintering. That is, the application does not print at the place needing to open holes when printing the insulating layer, thereby forming 'holes', and can directly fill metal in the 'holes' when printing the conductive material, so that the metal in the 'holes' and the second layer of metal circuit are manufactured simultaneously, the whole process is greatly reduced, and the material cost, the energy cost, the equipment cost and the pollutant treatment cost in the process are reduced correspondingly, thereby reducing the price of the product from 1300-1500 yuan per square meter to 400 yuan per square meter.
In summary, the application adopts the technical scheme of combining an addition method and a subtraction method, utilizes the subtraction method to process the copper foil into a first layer of metal circuit, and then utilizes the addition method to print or spray the insulating layer 4 and the second conductive layer 5 in sequence, so that drilling and hole filling operations are not needed, the production efficiency is improved, the production cost is reduced, and the yield of products is improved; on the other hand, the selective processing can be carried out by adopting a printing or spray printing mode, so that part of the first conductive layer 3 is conveniently exposed to weld the electronic component, the welding effect is better, the electronic component is not easy to fall off, the service life of the product is longer, the environmental pollution is reduced, and the manufacturing cost of the product is greatly reduced; the first conductive layer 3 is a traditional copper foil, the width and the thickness of a circuit are large, the conductivity is good, the welding protective layer 7 is arranged on the first conductive layer 3 to weld electronic elements, the problem of poor welding effect of the second conductive layer 5 is avoided, in addition, the insulating layer 4 and the second conductive layer 5 can be prepared into any shape and size, full coverage is not needed, and raw materials are saved; the application integrates the advantages of the addition method and the subtraction method, avoids the respective defects, greatly improves the processing efficiency of the circuit board product, greatly reduces the price of the product, improves the environmental pollution, and has great social and economic values.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A preparation method of a single-sided multilayer aluminum substrate is characterized by comprising the following steps of,
step one: processing the first conductive layer (3) on the substrate layer (1) by adopting an exposure development etching process, so that the first conductive layer (3) is formed into a first layer metal circuit;
step two: dividing a first region, a second region and a third region in the region range of the substrate layer (1), wherein the second region and the third region fall on the first layer metal line, and the first region, the second region and the third region do not have intersection;
step three: an insulating layer (4) is processed in the range of the first area by adopting a printing or spray printing mode;
step four: dividing a fourth area in the area of the substrate layer (1), and processing a second conductive layer (5) in the area of the fourth area by adopting a printing or spray printing mode, wherein the second conductive layer (5) is formed into a second-layer metal circuit, and the second-layer metal circuit and the first-layer metal circuit are connected in the area of the second area;
step five: an insulating protective layer (6) is processed on the surface of the second layer metal circuit, and a welding protective layer (7) is processed on the third area of the first layer metal circuit for welding electronic elements.
2. The method for producing a single-sided multi-layered aluminum substrate according to claim 1, wherein in the third step, the insulating layer (4) is processed by a multi-layer printing or spray printing method, and the edge of the printing or spray printing area gradually shrinks from outside to inside during the multi-layer printing or spray printing of the insulating layer (4).
3. The method for manufacturing a single-sided multi-layer aluminum substrate according to claim 1, wherein in the third step, a first mesh plate is manufactured, meshes formed on the first mesh plate correspond to the outline shape of the first area, the first mesh plate is attached to the first layer metal wire, then insulating slurry is printed or sprayed in the meshes, and the insulating layer (4) is formed after drying.
4. The method of producing a single-sided multi-layered aluminum substrate according to claim 3, wherein the insulating paste is an insulating ink containing 1% -15% of a hot melt resin or 0.1% -20% of glass fibers.
5. The method for manufacturing a single-sided multi-layer aluminum substrate according to claim 1, wherein in the fourth step, a second mesh plate is manufactured, meshes formed on the second mesh plate correspond to the outline shape of the second layer metal circuit, the second mesh plate is attached to the insulating layer (4), conductive paste is printed or sprayed in the meshes, and the second layer metal circuit is formed after drying and solidification.
6. The method for producing a single-sided, multi-layered aluminum substrate according to claim 1, characterized in that the insulating protective layer (6) and the solder protective layer (7) are processed by printing or spray printing or coating.
7. The method for producing a single-sided multilayer aluminum substrate according to claim 5, wherein the conductive paste is one of silver paste and copper paste, and the curing or sintering temperature of the conductive paste is lower than 300 ℃.
8. The method for manufacturing a single-sided multi-layered aluminum substrate according to claim 1, wherein the first conductive layer (3) is copper foil, the first layer metal wiring is used for soldering electronic components, and the first layer metal wiring is also used for passing high current or high voltage.
9. The method of manufacturing a single-sided multi-layered aluminum substrate according to claim 7, wherein the second-layer metal wiring is used as a bridge wiring, and the second-layer metal wiring is further used for passing a low voltage or a low current.
10. A single-sided multilayer aluminum substrate, characterized in that it is produced by the production method of the single-sided multilayer aluminum substrate according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311428963.7A CN117156731A (en) | 2023-10-31 | 2023-10-31 | Single-sided multilayer aluminum substrate and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| US20030138610A1 (en) * | 2002-01-23 | 2003-07-24 | Siemens Vdo Automotive Corporation | Printed circuit board incorporating enchanced conductive ink |
| CN103200782A (en) * | 2013-04-18 | 2013-07-10 | 汕头超声印制板（二厂）有限公司 | Manufacturing method of full-inkjet printed-circuit board |
| CN103763854A (en) * | 2014-01-18 | 2014-04-30 | 上海美维电子有限公司 | Printed circuit board and manufacturing method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030138610A1 (en) * | 2002-01-23 | 2003-07-24 | Siemens Vdo Automotive Corporation | Printed circuit board incorporating enchanced conductive ink |
| CN103200782A (en) * | 2013-04-18 | 2013-07-10 | 汕头超声印制板（二厂）有限公司 | Manufacturing method of full-inkjet printed-circuit board |
| CN103763854A (en) * | 2014-01-18 | 2014-04-30 | 上海美维电子有限公司 | Printed circuit board and manufacturing method thereof |
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Application publication date: 20231201 |