JP5433190B2 - Manufacturing management apparatus and method, and manufacturing management program - Google Patents

Description

  The present invention manages at least processing, inspection, and the like for a target object such as a semiconductor wafer performed in a plurality of apparatuses arranged in a production line, and inventory management of the target object such as a semiconductor wafer flowing in the plurality of apparatuses. The present invention relates to a manufacturing management apparatus, a method thereof, and a manufacturing management program.

  For example, a plurality of devices are arranged in a semiconductor wafer production line. Each of these apparatuses performs an exposure process, an etching process, and the like on the semiconductor wafer. In addition, these apparatuses perform inspection such as dimension measurement on a semiconductor wafer subjected to exposure processing, etching processing, and the like. Such a semiconductor wafer production line is provided with a manufacturing management system (MES: Manufacturing Executing System). The manufacturing management apparatus manages at least processing, inspection, and the like for semiconductor wafers respectively performed by a plurality of apparatuses arranged on the manufacturing line, and manages inventory of a plurality of semiconductor wafers flowing through the plurality of apparatuses. In semiconductor wafer inventory management, a plurality of semiconductor wafers are stored and transported in a container such as a hoop on the production line, and therefore, a plurality of semiconductor wafers stored and transported in a container such as a hoop are managed as a lot unit. . For example, Patent Documents 1 to 6 are technologies related to inventory management of semiconductor wafers and the like.

On the other hand, in order to prevent a decrease in the yield of semiconductor wafer manufacturing, an external inspection system provided outside the manufacturing line detects a semiconductor wafer defect that cannot be detected by a normal inspection. For example, a scanning electron microscope (SEM) is provided in the plurality of apparatuses arranged in the production line. The external inspection system receives the image data of the semiconductor wafer acquired by the scanning electron microscope of the apparatus on the production line, and compares the image data of the semiconductor wafer with the reference image data to form a pattern formed on the semiconductor wafer. Measure the dimensions, etc.
Japanese Patent Laid-Open No. 7-182424 JP-A-8-227432 JP 2000-263388 A JP 2003-133192 A JP 2003-133193 A JP 2003-133199 A

However, the progress of semiconductor wafer inventory management managed in units of lots is not synchronized with the start and end of inspection in the external inspection system. For this reason, when a semiconductor wafer is inspected in the external inspection system, the manufacturing management apparatus cannot recognize the semiconductor wafer inspected by the external inspection system, and the semiconductor wafer inventory management cannot be performed accurately.
For this reason, when the semiconductor wafer is defective (NG) as a result of the inspection by the external inspection system, the progress of the inventory management of the semiconductor wafer in units of lots cannot be stopped. However, it is necessary to separately manage the semiconductor wafer inventory management for each lot and the inspection by the external inspection system. Therefore, in order to maintain the product quality of the semiconductor wafer, a very large number of work steps are required.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a manufacturing management apparatus, a method thereof, and a manufacturing management program capable of accurately grasping and managing a stock of semiconductor wafers and the like even when an object to be processed such as a semiconductor wafer is inspected in an external inspection system. Is to provide.

A production management device according to a main aspect of the present invention manages at least processing for a workpiece to be performed by at least one device arranged in a production line, and also processes a workpiece to be processed by at least one device. and performs production management, are placed outside the production line, and an external processing system for performing different processing from the processing for the object to be processed, when performing the processing of the object to be processed by an external processing system, the by the external processing system Reservation start for performing another process on the processing object, loading of the object to be processed into the external processing system, starting of another process, completion of another process, and unloading of the object from the external processing system create each instruction and loading, handling processing for the object to be processed by the external processing system by a process of the production line, and obtained by the external processing system Comprising a dummy step creating unit capturing physical results, and a management control unit that recognizes the processing of the object to be processed by the external processing system dealing by a process of a production line for managing the object to be processed by the dummy process creation unit Each of the start reservation, load, start, completion, and unload commands created by the dummy process creation unit is issued to at least one device, start reservation, load, start, It is the same as each command for completion and unloading, and the management control unit performs processing on the production line by the dummy process creation unit based on each command for load and unload created by the dummy process creation unit. Based on the processing result of the object to be processed in the handled external processing system, it is determined whether or not the object to be processed is transported on the production line .

A manufacturing management method according to a main aspect of the present invention manages at least processing for a workpiece to be performed by at least one device arranged in a production line, and also processes a workpiece to be processed by at least one device. It intended to manufacture, by the external processing system which is arranged outside the production line when performing different processing from the processing for the object to be processed, and starts reservation for performing different processing on the object to be processed by the external processing system Create commands for loading the workpiece to the external processing system, starting another process, completing another process, and unloading the workpiece from the external processing system. A dummy process that handles the processing for the object to be processed as a process on the production line and captures the processing result acquired by the external processing system, and the production line Possess a management control step of performing processing as dealing with external processing system processing object processes recognize and manage the object to be processed in accordance with the construction reservation created by the dummy step, a load, and a construction, completion And unload commands are the same as start reservation, load, start, completion, and unload commands issued to at least one device, respectively. Based on the processing result of the object to be processed in the external processing system treated as a process on the production line by the dummy process based on the load and unload commands created by the process, the object to be processed on the production line It is determined whether or not to carry .

A manufacturing management program according to a main aspect of the present invention is executed by a computer, manages at least processing for a workpiece to be performed by at least one device arranged in a manufacturing line, and is processed by at least one device. that performs the manufacturing of the object, when performing different processing from the processing for the object to be processed by an external processing system located outside the production line, perform another process on the object to be processed by the external processing system Create commands for starting construction, loading the workpiece to the external processing system, starting another processing, completing another processing, and unloading the workpiece from the external processing system. treats the processing for the object to be processed by the external processing system by a process of the production line, and process result obtained by the external processing system A dummy function Maseru Captures, a management control function recognizes the processing of the workpiece to perform the management of the object to be processed by the external processing system dealing by a process of the production line, it is created by the dummy function Start reservation, load, start, complete, and unload commands are the start reservation, load, start, complete, and unload commands issued to at least one device, respectively. The management control function is the processing result of the object to be processed in the external processing system treated as a process on the production line by the dummy function based on the load and unload commands created by the dummy function. Based on the above, it is determined whether or not to convey the object to be processed on the production line .

  ADVANTAGE OF THE INVENTION According to this invention, even if it inspects to-be-processed objects, such as a semiconductor wafer, in an external test | inspection system, the manufacturing management apparatus which can grasp | ascertain correctly the inventory etc. of a semiconductor wafer, and its management, and a manufacturing management program Can provide.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is an overall configuration diagram of a manufacturing management apparatus. A plurality of wafer processing apparatuses 1-1 to 1-3 are arranged on the production line. Note that the number of the wafer processing apparatuses 1-1 to 1-3 is not limited to three, and a plurality of wafer processing apparatuses 1-1 to 1-3 are arranged depending on the processing of the semiconductor wafer 2. A plurality of semiconductor wafers 2 are housed in a container 3 called a hoop and flow to the production line. A plurality of semiconductor wafers 2 accommodated in the container 3 are defined as one lot.

  Each of these wafer processing apparatuses 1-1 to 1-3 performs, for example, resist coating, exposure, development, and the like on the semiconductor wafer 2, and inspects the pattern dimensions and the like on the semiconductor wafer 2 on which these processes have been performed. I do. Each of the wafer processing apparatuses 1-1 to 1-3 includes a scanning electron microscope (SEM) 4. The scanning electron microscope 4 acquires an SEM image in which the semiconductor wafer 2 is enlarged. In FIG. 1, the scanning electron microscope 4 is shown only in the wafer processing apparatus 1-2 in order to avoid the complexity shown in the figure. In each of the wafer processing apparatuses 1-1 to 1-3, an SEM image of the semiconductor wafer 2 is acquired by a scanning electron microscope, and the pattern dimensions and the like of the semiconductor wafer 2 are inspected based on the SEM image.

A manufacturing management apparatus (MES: Manufacturing Executing System) 5 is, for example, resist coating, exposure, and the like on the semiconductor wafer 2 performed by each of the wafer processing apparatuses 1-1 to 1-3 arranged in the manufacturing line by computer processing. Manages processing such as development and inspection of pattern dimensions.
At the same time, the manufacturing management apparatus 5 manages the progress of manufacturing of the semiconductor wafer 2 based on the inventory of the plurality of semiconductor wafers 2 flowing through the wafer processing apparatuses 1-1 to 1-3. In manufacturing management of the semiconductor wafer 2 and the like, a plurality of semiconductor wafers 2 are stored in a container 3 such as a hoop and transferred to a production line. Manage separately.

  The manufacturing management device 5 includes a dummy process creation unit 6 and a management control unit 7 by executing a manufacturing management program by a computer. The manufacturing management program is a manufacturing management program for managing at least processing for an object to be processed which is respectively performed by at least one apparatus arranged on the manufacturing line and for manufacturing an object to be processed which is processed by at least one apparatus. When processing different from the processing for the object to be processed is performed by the external processing system arranged outside the production line, the processing for the object to be processed by the external processing system is treated as processing on the manufacturing line, and the external processing system The processing result acquired by the above is captured, the processing of the object to be processed by the external processing system handled as the process on the production line is recognized, and the object to be processed is managed.

  The external processing system 8 is provided outside the manufacturing line in order to prevent a decrease in the yield of manufacturing the semiconductor wafer 2 on the manufacturing line. The external processing system 8 detects a defect of the semiconductor wafer 2 that cannot be detected by, for example, a normal pattern dimension inspection in each of the wafer processing apparatuses 1-1 to 1-3. The external processing system 8 receives the SEM image of the semiconductor wafer 2 acquired by the scanning electron microscope of each of the wafer processing apparatuses 1-1 to 1-3 on the production line, and receives the SEM image of the semiconductor wafer 2 and the reference image data. And the dimension of the pattern formed on the semiconductor wafer 2 is measured with high accuracy.

  Specifically, the external processing system 8 receives SEM images of the semiconductor wafer 2 acquired by the scanning electron microscopes of the respective wafer processing apparatuses 1-1 to 1-3, and the SEM image and the reference image data R as shown in FIG. And the degree of coincidence of the shapes is obtained. The external processing system 8 determines that the semiconductor wafer 2 is a non-defective product if the degree of coincidence of the shapes obtained by comparing the SEM image and the reference image data R is equal to or higher than a preset judgment coincidence, and is set in advance. If it is equal to or less than the determined matching degree, the semiconductor wafer 2 is determined as a defective product. For example, if the determination matching degree is set to 50%, the semiconductor wafer 2 is determined as a non-defective product if the matching degree of the shape obtained by comparing the SEM image and the reference image data R is 50% or more. If the degree of coincidence is 50% or less, the semiconductor wafer 2 is determined as a defective product.

  The external processing system 8 has been described as an inspection apparatus that determines whether the semiconductor wafer 2 is a non-defective product or a defective product. However, the present invention is not limited to this. Measure the dimensions of the wiring and contact holes formed on the semiconductor wafer 2 based on the SEM image, and compare the dimension measurement results of these wirings and contact holes with the preset reference dimension values. The quality of the wiring, contact holes, etc. on the semiconductor wafer 2 may be judged. In addition, the external processing system 8 may perform an electrical check on the shape of the wiring formed on the semiconductor wafer 2 or the current value or voltage value of the semiconductor wafer 2.

  The dummy process creation unit 6 handles the processing on the semiconductor wafer 2 by the external processing system 8 as processing on the production line when the processing of the pattern size of the semiconductor wafer 2 is performed by the external processing system 8, and the external processing system The processing result acquired by 8, for example, the determination result of a non-defective product or a defective product of the semiconductor wafer 2, the degree of coincidence of the shape between the SEM image and the reference image data R, and the like are fetched from the external processing system 8.

  For example, the dummy process creating unit 6 has a high result such as a determination result of a non-defective product or a defective product of the semiconductor wafer 2 by the external processing system 8, a degree of coincidence of the shape between the SEM image and the reference image data R, a pattern dimension with respect to the semiconductor wafer 2, In order to perform accuracy processing, start of construction, loading of the semiconductor wafer 2 to the external processing system 8, start of high-precision processing such as pattern dimensions by the external processing system 8, and pattern dimensions by the external processing system 8 Dummy commands for completion of high-precision processing and unloading of the semiconductor wafer 2 from the external processing system 8 are created on the arithmetic processing of the computer. The start reservation, load, start, finish, and unload commands created by the dummy process creation unit 6 are actually issued to the wafer processing apparatuses 1-1 to 1-3. It has the same contents as the reservation, load, start, complete, and unload commands. That is, the manufacturing management apparatus 5 issues instructions for starting reservation, loading, starting, completion, and unloading to each of the wafer processing apparatuses 1-1 to 1-3. For example, processes such as resist coating, exposure, development, and pattern dimension processing on the semiconductor wafer 2 in -1 to 1-3 are managed.

The management control unit 7 recognizes the inspection of the semiconductor wafer 2 by the external processing system 8 handled as a process on the production line by the dummy process creation unit 6 and manages, for example, the inventory of the semiconductor wafer 2. Specifically, the management control unit 7 manages the semiconductor wafer 2 on the basis of instructions for loading and unloading dummy to the external processing system 8 created by the dummy process creation unit 6.
In addition, the management control unit 7 determines the processing results from the external processing system 8 captured by the dummy process creation unit 6, for example, the determination result of a non-defective product or a defective product of the semiconductor wafer 2, and the shape of the SEM image and the reference image data R. Based on the degree of coincidence, it is determined whether or not to transfer the semiconductor wafer 2 onto the production line.
If the data of the processing result of the semiconductor wafer 2 from the external processing system 8 handled as processing on the production line by the dummy process creation unit 6 is not written by the dummy process creation unit 6, the management control unit 7 issues a warning to that effect.
When the management control unit 7 receives the determination result that the semiconductor wafer 3 is defective from the external processing system 8, the management control unit 7 excludes the semiconductor wafer 3 determined to be defective from management of inventory of the semiconductor wafer 3 without counting. In this case, since the management control unit 7 manages the semiconductor wafer 3 in units of a plurality of lots, the management of the lot including the semiconductor wafer 3 determined to be defective is excluded, or the semiconductor determined to be defective from the corresponding lot. Only the wafer 3 is not counted.

Next, manufacturing management of the semiconductor wafer 2 by the apparatus configured as described above will be schematically described with reference to a manufacturing management flowchart shown in FIG.
In step S1, for example, the manufacturing management apparatus 5 instructs the wafer processing apparatus 1-2 to perform processing such as resist coating, exposure, and development.
Next, in step S2, the wafer processing apparatus 1-2 performs processes such as resist coating, exposure, and development.
Next, in step S3, the manufacturing management apparatus 5 confirms that the processes such as resist coating, exposure, and development have been completed in the wafer processing apparatus 1-2.

Next, in step S <b> 4, the manufacturing management apparatus 5 registers the dummy process in the dummy process creation unit 6 after confirming the completion of processing such as resist application, exposure, and development in the wafer processing apparatus 1-2.
At the same time, the wafer processing apparatus 1-2 performs the SEM inspection 4 using the scanning electron microscope 4 without notifying the wafer processing apparatus 1-3 in step S5.

Next, in step S6, the dummy process creation unit 6 creates dummy instructions such as start reservation, load, start, completion of external processing, unload, and the like.
Next, the external processing system 8 performs external processing in step S7. For example, the external processing system 8 receives the SEM images of the semiconductor wafer 2 acquired by the scanning electron microscopes of the wafer processing apparatuses 1-1 to 1-3, and the SEM image and the reference image data R as shown in FIG. Are compared with each other to obtain the degree of coincidence of the shape. If the degree of coincidence is equal to or higher than a predetermined determination coincidence, the semiconductor wafer 2 is determined as a non-defective product. The wafer 2 is determined as a defective product.

Next, in step S8, the management control unit 7 receives the processing result of the external processing system 8, that is, the determination result of whether the semiconductor wafer 2 is a good product or a defective product.
Next, the dummy process creating unit 6 deletes the dummy command in step S9.
Next, when the semiconductor wafer 2 is a non-defective product from the processing result of the external processing system 8 in step S10, the management control unit 7 counts the non-defective semiconductor wafer 2 that is the target, while the semiconductor wafer 2 is When it is determined as defective, the manufacturing management apparatus 5 is notified without counting the defective semiconductor wafer 2 as the target.

Next, in step S <b> 11, the management control unit 7 determines whether or not the target semiconductor wafer 2 is to be transferred when the semiconductor wafer 2 is defective from the processing result of the external processing system 8.
Next, in step S12, the manufacturing management apparatus 5 receives a notification from the management control unit 7. If the semiconductor wafer 2 is a non-defective product, the manufacturing management apparatus 5 counts the number of processes for the semiconductor wafer 2 and sends it to the wafer processing apparatus 1-2. Instructions for processing such as resist coating, exposure, and development are given.
Next, in step S13, the manufacturing management apparatus 5 receives a notification from the management control unit 7. If the semiconductor wafer 2 is defective, the manufacturing management apparatus 5 does not count the number of processes for the semiconductor wafer 2, and the wafer processing apparatus 1- 3 is instructed for processing such as resist application, exposure, and development.

Next, manufacturing management of the semiconductor wafer 2 will be specifically described.
A plurality of semiconductor wafers 2 are stored in a container 3 called a hoop. A plurality of semiconductor wafers 2 accommodated in the container 3 are defined as one lot. The container 3 is flowed to a production line in which a plurality of wafer processing apparatuses, for example, three wafer processing apparatuses 1-1 to 1-3 are arranged.

  In this state, the manufacturing management device 5 performs, for example, resist coating, exposure, development, etc. on the semiconductor wafer 2 performed by each of the wafer processing devices 1-1 to 1-3 arranged on the manufacturing line by computer processing. Manage inspections of processing, pattern dimensions, etc. Accordingly, each of the wafer processing apparatuses 1-1 to 1-3 performs, for example, resist coating, exposure, development, and the like on the semiconductor wafer 2.

Specifically, as shown in FIG. 4, the manufacturing management apparatus 5 gives commands for starting reservation, loading, starting, completion, and unloading to each of the wafer processing apparatuses 1-1 to 1-3. For example, processes such as resist coating, exposure, and development, and pattern dimensions are performed on the semiconductor wafer 2 in each of the wafer processing apparatuses 1-1 to 1-3.
First, among the wafer processing apparatuses 1-1 to 1-3, for example, the wafer processing apparatus 1-1 receives a start reservation instruction from the manufacturing management apparatus 5 and receives a plurality of semiconductor wafers 2 stored in the container 3. For example, a reservation for processing such as resist coating, exposure, and development is accepted.
Next, the wafer processing apparatus 1-1 loads the container 3 flowing into the production line in response to a load command from the production management apparatus 5.
Next, the wafer processing apparatus 1-1 receives, for example, a start instruction from the manufacturing management apparatus 5 and applies, for example, resist coating, exposure, development, and the like to the plurality of semiconductor wafers 2 housed in the container 3 loaded therein. Process.
Next, the wafer processing apparatus 1-1 completes the process indicating that the processes such as resist coating, exposure, and development have been completed for the plurality of semiconductor wafers 2 housed in the container 3 with respect to the manufacturing management apparatus 5. The command is issued.
Next, the wafer processing apparatus 1-1 receives an unload instruction from the production management apparatus 5 and unloads the container 3 to the production line in a state where a plurality of semiconductor wafers 2 are stored in the container 3.

  Similarly to the wafer processing apparatus 1-1, the other wafer processing apparatuses 1-2 to 1-3 include start reservation, load, start, completion, and unload issued from the production management apparatus 5, respectively. In response to each command, the semiconductor wafer 2 is subjected to processing such as resist application, exposure, and development.

  As described above, the manufacturing management apparatus 5 starts, reserves, loads, starts, completes, and unloads for each container 3 flowing on the manufacturing line with respect to each of the wafer processing apparatuses 1-1 to 1-3. By issuing a command, the progress of the manufacture of a plurality of semiconductor wafers 2 for each lot stored in each container 3 is managed.

  Further, the manufacturing management apparatus 5 determines whether the semiconductor wafer 2 has been subjected to processing such as resist coating, exposure, and development by the wafer processing apparatuses 1-1 to 1-3, and the SEM It manages the inspection of the degree of coincidence of the shape of the image and the reference image data R, the pattern size, and the like. That is, for example, the scanning electron microscope 4 is provided in the wafer processing apparatus 1-2. The scanning electron microscope 4 acquires an SEM image in which the semiconductor wafer 2 is enlarged. This SEM image is sent to the external processing system 8.

  The external processing system 8 detects a defect of the semiconductor wafer 2 that cannot be detected by, for example, a normal pattern dimension inspection in the wafer processing apparatus 1-2. The external processing system 8 receives the SEM image of the semiconductor wafer 2 from the scanning electron microscope 4 provided in, for example, the wafer processing apparatus 1-2 on the production line, and uses the SEM image of the semiconductor wafer 2 and the reference image data. By comparison, the dimension of the pattern formed on the semiconductor wafer 2 is measured with high accuracy.

Specifically, the external processing system 8 receives the SEM image of the semiconductor wafer 2 acquired by the scanning electron microscope 4 provided in the wafer processing apparatus 1-2. For example, as shown in FIG. 2, the SEM image and the reference image data are received. The degree of coincidence of the shape is obtained by comparing with R. If the degree of coincidence of the shapes obtained by comparing the SEM image and the reference image data R is equal to or higher than a predetermined judgment coincidence (for example, 50%), the external processing system 8 sets the semiconductor wafer 2 as a non-defective product. judge.
On the other hand, if the degree of coincidence of the shapes obtained by comparing the SEM image and the reference image data R is equal to or less than a predetermined judgment coincidence (for example, 50%), the external processing system 8 will cause the semiconductor wafer 2 to Are judged as defective.

  As described above, when the external processing system 8 determines whether the semiconductor wafer 2 is good or defective, the dummy process creation unit 6 included in the manufacturing management apparatus 5 performs processing on the semiconductor wafer 2 by the external processing system 8 on the manufacturing line. The processing result obtained by the external processing system 8, for example, the determination result of the non-defective product or the defective product of the semiconductor wafer 2, the degree of coincidence of the shape between the SEM image and the reference image data R, etc. Capture from.

At this time, as shown in FIG. 5, the dummy process creation unit 6 included in the manufacturing management apparatus 5 performs, for example, a determination result of a non-defective product or a defective product of the semiconductor wafer 2 by the external processing system 8 and the SEM image and the reference image data R. matching degree, etc. of the shape, construction contracts and for performing high-precision processing, such as pattern dimensions for the semiconductor wafer 2, and the load the semiconductor wafer 2 to the external processing system 8, a high precision such as pattern dimensions by the external processing system 8 On the computer's arithmetic processing, the completion of high-precision processing such as pattern dimensions by the external processing system 8 and the unloading of the semiconductor wafer 2 from the external processing system 8 To do.

That is, first, the dummy process creation unit 6 determines the pattern for the semiconductor wafer 2 such as the determination result of the non-defective product or the defective product of the semiconductor wafer 2 by the external processing system 8, the degree of coincidence of the shape between the SEM image and the reference image data R, and the like. In order to perform processing with high accuracy such as dimensions, a start reservation command is generated, and a dummy start reservation command for accepting a reservation to the dummy process creation unit 6 is generated.
Next, the dummy process creation unit 6 generates a dummy command for loading the semiconductor wafer 2 to the external processing system 8.
Next, the dummy process creation unit 6 generates a dummy instruction for starting a high-precision process such as a pattern dimension by the external processing system 8.
Next, the dummy process creation unit 6 generates a dummy command for completion of high-precision processing such as pattern dimensions by the external processing system 8.
Next, the dummy process creation unit 6 generates a dummy command for unloading the semiconductor wafer 2 from the external processing system 8.

  The start reservation, load, start, finish, and unload commands created by the dummy process creation unit 6 are actually issued to the wafer processing apparatuses 1-1 to 1-3. It has the same contents as the reservation, load, start, complete, and unload commands.

  However, the management control unit 7 treats the dummy process creation unit 6 as a process on the production line based on the instructions for loading and unloading the dummy to the external processing system 8 created by the dummy process creation unit 6. The inspection of the semiconductor wafer 2 by the external processing system 8 is recognized and, for example, the inventory of the semiconductor wafer 2 is managed.

That is, the management control unit 7 determines the processing results from the external processing system 8 captured by the dummy process creation unit 6, for example, the determination result of a non-defective product or a defective product of the semiconductor wafer 2, and the shape of the SEM image and the reference image data R. Based on the degree of coincidence, it is determined whether or not to transfer the semiconductor wafer 2 onto the production line.
Further, the management control unit 7 issues a warning to the effect that data of the processing result of the semiconductor wafer 2 from the external processing system 8 handled as processing on the production line by the dummy process creation unit 6 is not written.
In addition, when the management control unit 7 receives the determination result that the semiconductor wafer 3 is defective from the external processing system 8, the management control unit 7 does not count the semiconductor wafer 3 determined to be defective and excludes the semiconductor wafer 3 from the management of the inventory of the semiconductor wafer 3. In this case, since the management control unit 7 manages the semiconductor wafer 3 in units of a plurality of lots, the management of the lot including the semiconductor wafer 3 determined to be defective is excluded, or the semiconductor determined to be defective from the corresponding lot. Only the wafer 3 is not counted.

  However, the manufacturing management device 5 uses the external process system 8 on the basis of the start reservation, load, start, complete, and unload commands created in the dummy process creation unit 6, that is, the computer processing. It is possible to manage the progress of manufacturing of a plurality of semiconductor wafers 2 in units of one lot stored in each processed container 3.

As described above, according to the above-described embodiment, the external processing system 8 arranged outside the production line performs, for example, processing such as inspection, which is different from processing such as resist coating, exposure, and development, on the semiconductor wafer 2. Sometimes, processing by the external processing system 8 on the semiconductor wafer 2 is handled as processing on the manufacturing line, and processing results acquired by the external processing system 8 are taken in and processed by the external processing system 8 as processing on the manufacturing line. The processing of the wafer 2 is recognized and the semiconductor wafer 2 is managed.
In particular, the start reservation, load, start, complete, and unload commands created by the dummy process creation unit 6 are sent from the manufacturing management apparatus 5 to the wafer processing apparatuses 1-1 to 1-3. The same contents as the start reservation, load, start, completion, and unload commands that are actually issued.

Thereby, even if the progress of inventory management of the semiconductor wafer 2 managed in units of lots and the start and end of the inspection in the external inspection system 8 are not synchronized, the manufacturing management apparatus 5 performs the inspection by the external inspection system 8. The semiconductor wafer 2 can be recognized, and inventory management of the semiconductor wafer 2 can be accurately performed. For example, as a result of inspection by the external inspection system 8, even if the semiconductor wafer 2 is defective (NG), it is not necessary to stop the progress of inventory management of the semiconductor wafer 2 in lot units.
Therefore, even if the semiconductor wafer 2 is inspected by the external inspection system 8, the stock of the semiconductor wafer 2 can be accurately grasped and managed.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

The block diagram which shows one Embodiment of the manufacturing management apparatus which concerns on this invention. The figure which shows the determination of the quality goods and inferior goods of the semiconductor wafer by the external processing system in the apparatus. The manufacturing management flowchart in the same apparatus. The figure which shows each instruction | command of the start reservation with respect to the wafer processing apparatus in the same apparatus, load, start of construction, completion, and unload. The figure which shows each instruction | command of the construction reservation, load, construction, completion, and unloading created by the dummy process creation part in the same apparatus.

Explanation of symbols

  1-1 to 1-3: A plurality of wafer processing apparatuses, 2: Semiconductor wafers, 3: Containers, 4: Scanning electron microscope, 5: Manufacturing management apparatus (MES), 6: Dummy process creation unit, 7: Management control unit 8: External processing system.

Claims (10)

A manufacturing management device that manages at least processing for a target object to be processed by at least one device arranged in a manufacturing line, and that manages manufacturing of the target object to be processed by the at least one device;
An external processing system that is disposed outside the production line and performs processing different from the processing for the object to be processed;
When processing the object to be processed by the external processing system, a reservation for starting the other processing for the object to be processed by the external processing system and loading the object to be processed into the external processing system Each of the start of the another process, the completion of the other process, and the unloading of the object to be processed from the external processing system, and the process for the object to be processed by the external processing system. A dummy process creation unit that handles the process on the production line and captures the processing result acquired by the external processing system;
A management control unit for recognizing the process of the object to be processed by the external processing system handled as a process on the production line by the dummy process creating unit and managing the object to be processed;
Equipped with,
Each of the start reservation, the load, the start, the completion, and the unload created by the dummy process creation unit is a start reservation that is issued to each of the at least one device, It is the same as each command of load, start of construction, completion of construction, and unload,
In the external processing system, the management control unit is treated as a process on the production line by the dummy process creation unit based on each command of the load created by the dummy process creation unit and the unload. Determining whether to transfer the object to be processed on the production line based on the processing result of the object to be processed;
A manufacturing management device characterized by that.   The management control unit notifies the fact that at least the processing result data of the object to be processed from the external processing system handled as processing on the production line by the dummy process creation unit is not written. The manufacturing management apparatus according to claim 1, wherein The object to be processed is a semiconductor wafer,
The external processing system is a dimension measuring device,
The dimension measuring apparatus receives the image data of the semiconductor wafer obtained by the inspection of the apparatus, compares the image data with reference image data to obtain a coincidence, and based on the coincidence, the semiconductor wafer Judge pass / fail,
The manufacturing management apparatus according to claim 1.   4. The management control unit, when receiving a determination result of a defect of the semiconductor wafer from the dimension measuring device, removes the semiconductor wafer determined to be defective from the management without counting. Manufacturing management equipment.   4. The manufacturing management apparatus according to claim 3, wherein the management control unit manages the semiconductor wafer in units of a plurality of lots. A manufacturing management method for managing at least processing for an object to be processed respectively performed by at least one apparatus arranged in a production line and manufacturing the object to be processed processed by the at least one apparatus,
When the external processing system arranged outside the manufacturing line performs a process different from the process for the object to be processed, a start reservation for performing the another process for the object to be processed by the external processing system; Create commands for loading the object to be processed into the external processing system, starting another process, completing the other process, and unloading the object from the external processing system. a dummy step, and capturing the said by external processing system handles the processing for the object to be processed by a process of the production line, and the external processing process result obtained by the system,
A management control step for managing the object to be processed by recognizing the process of the object to be processed by the external processing system treated as a process on the production line;
I have a,
The start reservation created by the dummy process, the load, the start of construction, the completion of construction, and the unload are each given to the at least one device, the start of construction reservation, and the load. It is the same as each command of construction, completion, unloading,
In the management control step, the object to be processed in the external processing system treated as a process on the production line by the dummy process based on the instructions of the load and unload created by the dummy process. Determining whether to transfer the object to be processed on the production line based on the processing result of
The manufacturing management method characterized by the above-mentioned.   In the management control step, when data of at least the processing result of the object to be processed is not written from the external processing system handled as processing on the manufacturing line by the dummy step, the fact is notified. The manufacturing management method according to claim 6.   The management control step, when receiving a determination result that the object to be processed is defective from the dummy step, removes the object to be processed determined to be defective from the management without counting. 6. The production management method according to 6.   The manufacturing management method according to claim 6, wherein the management control step manages the object to be processed in units of a plurality of lots. A manufacturing management program for managing at least processing for an object to be processed which is executed by a computer and is respectively performed by at least one apparatus arranged on a manufacturing line, and for manufacturing the object to be processed which is processed by the at least one apparatus Because
When the external processing system arranged outside the manufacturing line performs a process different from the process for the object to be processed, a start reservation for performing the another process for the object to be processed by the external processing system; Create commands for loading the object to be processed into the external processing system, starting another process, completing the other process, and unloading the object from the external processing system. and, said external processing the by the system handles the processing for the object to be processed by a process of the production line, and the external processing takes process result obtained by the system write Maseru dummy feature,
A management control function for recognizing the processing of the object to be processed by the external processing system treated as a process on the manufacturing line and managing the object to be processed;
Have
The start reservation created by the dummy function, the load, the start of construction, the completion of construction, and the unload are each given a start of construction reservation, a load, and a load that are issued to the at least one device, respectively. It is the same as each command of construction, completion, unloading,
The management control function includes: the object to be processed in the external processing system that is treated as a process on the production line by the dummy function based on the load and unload commands created by the dummy function. Whether to transfer the object to be processed on the production line based on the processing result of
A manufacturing management program characterized by that.

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