JP5424458B2 - Substrate processing apparatus and data display method for substrate processing apparatus - Google Patents

Description

  The present invention relates to a substrate processing apparatus for processing a substrate such as a semiconductor substrate or a glass substrate.

In a substrate processing apparatus such as a single wafer apparatus, an error may occur due to degradation of the apparatus or failure of parts. Normally, when an error occurs, the device stops production. For this reason, it is necessary to quickly determine the cause of the error and take measures. In general, an operation unit of a controller for device control has a log acquisition function, and data relating to processes such as gas pressure and gas flow rate can often be acquired and stored by the log acquisition function. However, when the operation unit receives data from a host controller via a network such as Ethernet, and the host controller receives data from multiple lower controllers via a network, the log acquisition cycle Will be long.
By the way, errors occurring in the substrate processing apparatus range from easy to difficult to find the cause. For example, when a sensor fails, the state where the failure is detected continues, and the error is not canceled until the operator or maintenance personnel (maintenance personnel) replaces the failed sensor. In such a case, it is relatively easy to determine the cause of the error. On the other hand, when the apparatus is used for a long period of time, the tweezers may vibrate during conveyance due to deterioration or drooping of the robot mechanism or backlash. When the tweezer vibrates, the output signal of the wafer (substrate) detection sensor is repeatedly turned on and off. In such a case, an error is detected and the apparatus stops. However, since the vibration of the tweezers stops after a certain period of time, the error is often canceled when the operator or maintenance staff confirms after stopping the apparatus. Since the log acquisition cycle is longer than the tweezer vibration time, it is often difficult to determine the cause of the error caused by the tweezer vibration even if the log acquisition function of the operation unit is used.

  An object of the present invention is to provide a substrate processing apparatus capable of efficiently collecting data for error analysis and performing error analysis with high accuracy.

  In order to achieve the above object, a substrate processing apparatus according to the present invention has a processing unit that performs processing on a substrate, a state of a transport unit that transports the substrate, and a detection unit that detects these operations, and controls them. A substrate processing apparatus comprising a lower controller and a host controller having a control unit that controls the lower controller and an operation unit that displays output content from the detection unit, wherein the host controller outputs from the detection unit If the content includes an error, the lower controller is notified of the error, and the lower controller is in a period shorter than the data transfer period from the upper controller to the operation unit, and the detection unit before and after the error notification. The output content from is stored.

  According to the substrate processing apparatus of the present invention, the data indicating the apparatus state can be sampled at high speed by acquiring the apparatus state log by the lower controller close to the hardware of the apparatus. This high-speed sampling makes it easy to find fluctuations in sensor signals and short-time pressure fluctuations that were difficult to find by log acquisition by a conventional host controller, and makes it easier to grasp the cause of an error. Further, by referring to the data indicating the device status retroactively from the occurrence of the error, it is possible to know how the device has changed and the error has occurred, which is effective for error countermeasures.

1 is a schematic cross-sectional view for explaining an asher apparatus according to a first embodiment of the present invention. It is a schematic longitudinal cross-sectional view for demonstrating the asher apparatus which concerns on the 1st Embodiment of this invention. It is a figure which further demonstrates the plasma processing unit of the asher apparatus concerning the 1st Embodiment of this invention. It is a figure explaining the case where an error does not generate | occur | produce in the asher apparatus which concerns on the 1st Embodiment of this invention. It is a figure explaining the case where an error generate | occur | produces in the asher apparatus which concerns on the 1st Embodiment of this invention. It is a figure explaining the case where it is difficult to specify the cause of the error which generate | occur | produces in the asher apparatus which concerns on the 1st Embodiment of this invention. It is a figure explaining another case where it is difficult to identify the cause of the generated error in the asher device according to the first embodiment of the present invention. It is a figure which shows the memory area of PLC connected to the asher apparatus which concerns on the 2nd Embodiment of this invention. It is a figure which shows the memory area of PLC connected to the asher apparatus which concerns on the 2nd Embodiment of this invention. It is a sequence diagram which shows the operation | movement of each apparatus when an error is detected with the asher apparatus which concerns on the 2nd Embodiment of this invention, and the log at the time of an error being notified is acquired.

[First embodiment]
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In an embodiment of the present invention, a semiconductor device manufacturing method is realized by an asher device used as a plasma processing apparatus and used as a semiconductor manufacturing apparatus.
FIG. 1A is a schematic cross-sectional view for explaining an asher device according to the first embodiment of the present invention, and FIG. 1B is a schematic for explaining the asher device according to the first embodiment of the present invention. It is a longitudinal cross-sectional view.
Hereinafter, in each drawing, the same reference numerals are given to substantially the same components.

  As shown in FIGS. 1A and 1B, the asher apparatus 1 includes an EFEM (Equipment Front End Module) 100, a load lock chamber unit 200, a transfer module unit 300, and a process used as a processing chamber in which an ashing process is performed. And a chamber portion 400.

The EFEM 100 includes a FOUP (Front Opening Unified Pod) 110 and an atmospheric transfer robot 120 that transfers a wafer from each of the FOUPs 110 to the load lock chamber unit 200.
For example, 25 wafers are mounted on the FOUP 110, and the arm unit of the atmospheric transfer robot 120 extracts, for example, five wafers 500 from the FOUP 110. Here, the wafer 500 is a substrate to be processed.

  The load lock chamber unit 200 includes a load lock chamber 210 and a buffer unit 220 that holds the wafer 500 transferred from the FOUP 110 in the load lock chamber 210. The buffer unit 220 includes a boat 230 and an index assembly 240 below the boat 230. The boat 230 and the index assembly 240 under the boat 230 rotate simultaneously in a direction around the θ axis (the direction indicated by the arrow in FIG. 1).

  The transfer module unit 300 includes a transfer module 310 that is used as a transfer chamber. A load lock chamber 210 is attached to the transfer module 310 via a gate valve 250. The transfer module 310 is provided with a vacuum arm robot unit 320 that transfers the wafer 500 to the process chamber unit 400.

  The process chamber unit 400 includes a plasma processing unit 410 used as a processing chamber. The plasma processing unit 410 is attached to the transfer module 310 via the gate valve 250.

Hereinafter, the plasma processing unit 410 of FIGS. 1A and 1B will be further described with reference to FIG.
The plasma processing unit 410 is a high-frequency electrodeless discharge type plasma processing unit that performs ashing on a semiconductor substrate or semiconductor element by dry processing. The plasma processing unit 410 includes a plasma source unit 412 for generating plasma, a processing chamber 414 that accommodates a wafer 500 such as a semiconductor substrate, and a high-frequency power source 416 that supplies high-frequency power to the plasma source unit 412 (particularly a resonance coil). And a frequency matching unit 418 that controls the oscillation frequency of the high-frequency power source 416.

  The plasma processing unit 410 includes a horizontal base plate 420 used as a gantry, and the base plate 420 is configured by disposing a plasma source unit 412 at an upper portion and a processing chamber 414 at a lower portion. Further, the resonance coil 422 and the outer shield 424 constitute a spiral resonator.

The plasma source unit 412 is configured to be depressurized, and is disposed on the outer periphery of the reaction vessel 426 to which the reaction gas for plasma is supplied, the resonance coil 422 wound around the outer periphery of the reaction vessel, and the resonance coil 422. And an outer shield 424 that is grounded.
Details of the resonance coil 422, the high frequency power source 416, and the frequency matching unit 418 will be described later.

  The reaction vessel 426 is usually a so-called chamber formed in a cylindrical shape with high-purity quartz glass or ceramics. The reaction vessel 426 is usually arranged so that the axis is vertical, and the upper and lower ends are hermetically sealed by the top plate 428 and the processing chamber 414. A susceptor 432 supported by a plurality of (for example, four) support columns 430 is provided on the bottom surface of the processing chamber 414 below the reaction vessel 426. The susceptor 432 heats the susceptor table 434 and the wafer 500 on the susceptor 432. A substrate heating unit 436 is provided.

  An exhaust plate 438 is disposed below the susceptor 432. The exhaust plate 438 is supported by the bottom plate 442 via the guide shaft 440, and the bottom plate 442 is airtightly provided on the lower surface of the processing chamber 414. An elevating substrate 444 is provided to move up and down with the guide shaft 440 as a guide. The lift board 444 supports at least three lifter pins 446.

The lifter pin 446 passes through the susceptor 432. A wafer support 448 that supports the wafer 500 is provided on the top of the lifter pins 446.
Wafer support 448 extends in the center direction of susceptor 432. By lifting and lowering the lifter pins 446, the wafer 500 can be placed on the susceptor table 434 or lifted from the susceptor table 434. The lift shaft 450 of the lift drive unit (not shown) is connected to the lift substrate via the bottom plate 442, and the lift drive unit lifts the lift shaft 450 so that the wafer passes through the lift substrate 444 and the lifter pins 446. The support part 448 moves up and down.

  A cylindrical baffle ring 452 is provided between the susceptor 432 and the exhaust plate 438. The baffle ring 452, the susceptor 432, and the exhaust plate 438 form a first exhaust chamber 454, and the first exhaust chamber 454 is partitioned from the processing chamber 414. Further, the first exhaust chamber 454 communicates with the processing chamber through a large number of uniform vent holes provided in the baffle ring 452.

  The first exhaust chamber 454 communicates with the second exhaust chamber 458 through an exhaust communication hole 456 provided in the exhaust plate. An exhaust pipe 460 is communicated with the second exhaust chamber 458, and an exhaust device 462 is provided in the exhaust pipe 460.

  A gas supply pipe 462 extending from the gas supply unit and supplying a required plasma reaction gas is attached to the top plate 428 above the reaction vessel 426 via a gas inlet 466. The gas supply unit has a function of controlling the gas flow rate. Specifically, the gas supply unit includes a mass flow controller 468 and an on-off valve 470 which are flow rate control units, and controls the mass flow controller 468 and the on-off valve 470 to control the gas supply amount.

  Further, a baffle plate 472 made of quartz is provided in the reaction vessel 426 in a substantially disc shape for allowing the reaction gas to flow along the inner wall of the reaction vessel 426. Note that the pressure in the processing chamber 414 is adjusted by adjusting the supply amount and the exhaust amount by the flow rate control unit 468 and the exhaust device 462.

In addition, this apparatus is not restricted to the above structure, You may comprise the susceptor 432 as follows.
That is, a columnar susceptor support part that supports the susceptor 432 is further provided at the center of the lower surface of the susceptor 432, and a heater, a heater wire that supplies power to the heater, and the like are stored inside the susceptor support part. May be configured. With such a configuration, since each line is not exposed to plasma or processing gas, the resistance of the susceptor 432 can be improved.

Since the resonance coil 422 forms a standing wave having a predetermined wavelength, the winding diameter, the winding pitch, and the number of turns are set so as to resonate in a constant wavelength mode. That is, the electrical length of the resonance coil 422 corresponds to an integral multiple (1 times, 2 times,...), Half wavelength, or ¼ wavelength of one wavelength at a predetermined frequency of power supplied from the high frequency power source. Set to length.
For example, the length of one wavelength is about 22 meters at 13.56 MHz, about 11 meters at 27.12 MHz, and about 5.5 meters at 54.24 MHz.
The resonance coil 422 is formed of an insulating material in a flat plate shape, and is supported by a plurality of supports erected vertically on the upper end surface of the base plate 420.

  Both ends of the resonance coil 422 are electrically grounded, but at least one end of the resonance coil 422 is finely adjusted when the asher device 1 is first installed or when processing conditions are changed. Therefore, it is grounded via the movable tap 474. Reference numeral 476 in FIG. 3 indicates the other fixed ground. Further, in order to finely adjust the impedance of the resonance coil 422 when the asher apparatus 1 is first installed or when processing conditions are changed, a power feeding unit is provided between the grounded ends of the resonance coil 422 by a movable tap 474. Composed.

  That is, the resonance coil 422 includes a ground portion that is electrically grounded at both ends, and includes a power feeding portion that is supplied with power from the high-frequency power source 416, and at least one of the ground portions is The position-adjustable variable ground part is used, and the power feeding unit is a position-adjustable variable power feeding part. When the resonance coil 422 includes a variable ground unit and a variable power supply unit, the resonance frequency and load impedance of the plasma source unit 412 can be adjusted more easily.

  The outer shield 424 is provided to shield leakage of electromagnetic waves to the outside of the resonance coil 422 and to form a capacitance component necessary for constituting a resonance circuit with the resonance coil. The outer shield 424 is generally formed in a cylindrical shape using a conductive material such as aluminum alloy, copper, or copper alloy. The outer shield 424 is disposed at a distance of, for example, about 5 to 150 mm from the outer periphery of the resonance coil 422.

  An RF sensor 478 is installed on the output side of the high frequency power supply 416 to monitor traveling waves, reflected waves, and the like. The reflected wave power monitored by the RF sensor 478 is input to the frequency matching unit 418. The frequency matching unit 418 controls the frequency so that the reflected wave is minimized.

  The asher apparatus 1 has a plurality of controllers 600. Here, one of the plurality of controllers 600 is illustrated, and this controller 600 is, for example, a PLC (Programmable Logical Controller), and is connected to a sensor (not shown) that detects the amount of power supplied by the high-frequency power source 416. The high frequency power supply 416 is controlled while acquiring data indicating the amount of power. Although not shown, the remaining controller 600 is connected to a sensor that detects the transfer state of the wafer 500, a sensor that detects the temperature in the processing chamber 414, and a sensor that detects the gas pressure in the processing chamber 414 (all not shown). Each component is controlled while acquiring data (device state data) indicating the state of each component (actuator or the like) in the processing chamber 414 of the asher apparatus 1. The device status data acquired by the controller 600 is acquired at a time by the host controller 700 at a predetermined cycle. The host controller 700 performs automatic control and is communicably connected to the controller 600.

  Further, a terminal device 800 having a function as a general computer is connected to the host controller 700 via a LAN cable or the like. Here, the terminal device 800 is, for example, an HMI (Human Machine Interface), and can receive device status data acquired by the controller 600 from the host controller 700 and provide it to an operator via a display or the like.

Here, the controller 600 that is a PLC (particularly, the CPU unit in the PLC) will be briefly described (details of the controller 600 will be described later with reference to FIGS. 5A and 5B).
In the PLC 600, the state of each component in the processing chamber 414 of the asher apparatus 1 is reflected at the sampling period of the PLC 600. That is, the host controller 700 does not detect a change in the state of a component that has occurred in a short period of time equal to or shorter than the sampling period of the PLC 600.

Here, a plurality of controllers 600 are connected to the host controller 700 and the host controller 700 is connected to the terminal device 800. However, a sub controller or the like is further connected between the plurality of controllers 600 and the host controller 700. Alternatively, one controller 600 having the functions of each of the plurality of controllers 600 may be connected to the host controller 700.
The asher device 1, the controller 600, the host controller 700, and the terminal device 800 may be provided in the same device, or any of them may be provided in another device.

  In the asher apparatus 1 configured as described above, the wafer 500 is transferred to the load lock chamber 210, and is evacuated (vacuum replaced) in the load lock chamber 210. From the load lock chamber 210 through the transfer module 310, The resist is removed by the plasma processing unit 410 (resist removal process), and again transferred to the load lock chamber 210 via the transfer module 310.

  At this time, the atmospheric transfer robot 120 rotates in the θ-axis direction (the direction indicated by the arrow in FIG. 1A), and the wafer 500 is mounted on the boat 230 of the buffer unit 220. At this time, the boat 230 receives 25 wafers 500 from the atmospheric transfer robot 120 by the operation of the boat 230 in the Z-axis direction (the direction indicated by the arrow in FIG. 1B). After receiving the 25 wafers 500, the boat 230 is moved in the Z-axis direction so that the wafer 500 in the lowermost layer of the boat 230 matches the height position of the transfer module unit 300.

  In the load lock chamber 210, the wafer 500 held by the buffer unit 220 in the load lock chamber 210 is mounted on the fingers of the vacuum arm robot unit 320. The vacuum arm robot unit 320 is rotated in the θ-axis direction, the fingers are further extended in the Y-axis direction (the direction indicated by the arrow in FIG. 1A), and transferred onto the susceptor table 434 in the plasma processing unit 410.

  In order to transfer the wafer onto the susceptor table 434 from the fingers, the fingers of the vacuum arm robot unit 320 and the lifter pins 446 are cooperated. Further, by the reverse operation, the processed wafer 500 is transferred from the susceptor table 434 to the buffer unit 220 in the load lock chamber 210 by the vacuum arm robot unit 320.

  In the plasma processing unit 410, the finger carrying the wafer 500 enters the processing chamber 414, and the lifter pins 446 are raised. The finger places the wafer 500 on the raised lifter pins 446.

  After the wafer 500 held at room temperature is placed, an ashing gas is supplied from the gas supply pipe 464 to the plasma source unit 412. The ashing gas is, for example, oxygen, hydrogen, water, ammonia, carbon tetrafluoride (CF4), or the like. After the ashing gas is supplied, the high frequency power supply 416 supplies power to the resonance coil 422.

  Inside the resonance coil 422, an induced magnetic field is excited to accelerate free electrons, and the free electrons collide with gas molecules to excite gas molecules to generate plasma. In this way, the ashing apparatus 1 performs the ashing process using the plasmad ashing gas.

Hereinafter, with reference to FIG. 3 and FIG. 4, an error that occurs in the asher apparatus 1 will be described.
FIG. 3 is a diagram illustrating a case where the cause of the error that occurs in the asher device 1 can be easily identified.
First, a case where no error occurs in the asher device 1 will be described with reference to FIG. 3A. 3A shows a part of a processing flow performed in the asher apparatus 1 (for example, processing in which the vacuum arm robot unit 320 in FIG. 1A transports a wafer from the load lock chamber unit 200 to the process chamber unit 400), It is the figure which showed the state of the wafer detection sensor installed in the joint part vicinity with the load lock chamber part 200, the presence or absence of a wafer, and the output signal of a wafer detection sensor for every step of processing flow (henceforth, FIG. 3B). The same applies to FIGS. 4A and 4B).
As shown in FIG. 3A, in the step of starting the process, since there is no wafer in the robot arm, the output signal from the detection sensor indicates “no wafer”. In the step in which the arm of the robot takes out the wafer from the transfer source, the wafer is placed on the arm, so the output signal from the detection sensor indicates “with wafer”. In the step where the robot arm moves to the transfer destination and the step where the robot arm places the wafer on the transfer destination, the arm on which the wafer is placed is moving, so the output signal from the detection sensor is “no wafer” Indicates.

Next, a case where an error occurs in the asher device 1 will be described with reference to FIG. 3B.
As shown in FIG. 3B, when the detection sensor fails, the output signal of the detection sensor does not always accurately indicate the wafer placement status indicating whether or not the wafer is placed on the robot arm. However, if the ground detection sensor fails and the output signal always indicates OFF, it can be seen that there is an abnormality in the output signal at the step of starting the process, and that the detection sensor has failed.

FIG. 4A is a diagram illustrating a case where it is difficult to specify the cause of an error that occurs in the asher device 1.
When the tweezers vibrate while the robot arm transports the wafer due to deterioration of the robot arm or the like, as shown in FIG. 4A, in the step of the robot arm taking out the wafer from the transport source, the detection sensor The vibration of tweezers is transmitted to the sensor, and the output signal of the detection sensor repeatedly turns on and off. When the host controller 700 (FIG. 2) receives such an output signal via the controller 600 (FIG. 2), it detects an error and notifies the controller 600 and the terminal device 800 of the error. The controller 600 stops the asher device 1 based on the notified error. The operator recognizes that an error has occurred in the asher device 1 due to the error displayed on the terminal device 800 and the stop of the asher device 1, and confirms the state of the asher device 1. However, usually, the asher device 1 and the terminal device 8 are often installed in physically separated locations. In addition, since the host controller 700 collectively receives the device state data from each of the plurality of controllers 600, each of the plurality of controllers 600 acquires the device state data during the period in which the host controller 700 acquires the device state data. It is often longer than the period. Therefore, the operator confirms the state of the asher device 1 after a time has elapsed since an error occurred in the asher device 1. In addition, since the vibration of the tweezer is attenuated after the apparatus is stopped, the vibration of the tweezer is often already suppressed after a lapse of time after the occurrence of the error. Therefore, even if the operator confirms the state of the asher device 1, the cause of the error is often difficult to identify.

FIG. 4B is a diagram illustrating another case where the cause of the error that occurs in the asher device 1 is difficult to identify.
The gas used in the asher apparatus 1 is supplied from a gas supply facility in the factory by opening and closing the on-off valve 470 of FIG. An abnormality in the gas pressure is detected by a sensor provided in the on-off valve 470. When the volume of gas supplied by the gas supply facility is small and close to the volume of gas used in the asher device 1, when the gas supply facility supplies gas to the asher device 1, the pressure of the gas in the asher device 1 is descend. When the gas pressure falls below a threshold value (for example, a threshold value for detecting an error in gas pressure drop) and an error is detected, the operator recognizes that an error has occurred in the asher device 1 and Check the status. However, as in the case described with reference to FIG. 4A, the operator confirms the state of the asher device 1 after a time has elapsed since an error occurred in the asher device 1. After a lapse of time from the occurrence of the error, the on-off valve 470 is closed by the interlock, and the gas pressure returns to a normal value. Therefore, even if the operator confirms the state of the asher device 1, the cause of the error is Often difficult to identify.

As described above, even if an error is detected, it may be difficult to identify the cause of the error.
The second embodiment of the present invention described below has been improved to cope with such a case.

[Second Embodiment]
Hereinafter, an asher device according to a second embodiment of the present invention will be described.
FIG. 5A is a diagram showing a memory area of a controller 600 that is a PLC connected to the asher device according to the second embodiment of the present invention. As shown in FIG. 5A, the memory area of the PLC 600 has device state data (for example, a signal value indicating an on / off state of the sensor, or the like) received from each sensor provided in the asher device 1 via the input module of the PLC 600. Device state area (device state area) 602 for storing temperature, pressure, etc.), and a log of the device state area 602 by storing a copy of the data in the device state area 602 for each sampling period of the PLC 600. Log areas (log areas) 604-1 to 604-n. The device status data indicating the current device status is updated at the sampling period of the PLC 600. Here, the sampling period means a period for acquiring a log, and the shortest sampling period is a period (cycle time) in which a program (not shown) is executed in the PLC 600.
A device status area (device status area) 602 for storing device status data and log areas (logging areas) 604-1 to 604-n for storing copies of device status data are configured. By executing a program (not shown) in the PLC 600, a logging area 604 for storing a log of the received device status data is secured in the memory area of the PLC 600. Specifically, the device status data stored in the logging area 604-1 is discarded, and the log of the device status data stored in the logging areas 604-2 to 604-n is recorded in the logging areas 604-1 to 604- (n -1). In this way, the logging area 604-n is secured, and the log of the received device status data is stored in the logging area 604-n.
For example, when 100 logging areas 604-1 to 604-100 are secured and the sampling period of the PLC 600 is 50 msec, the device status for 5 seconds from the present time is stored in the logging areas 604-1 to 604-100. Remembered.
When normal, the program is executed by the PLC 600 and a log is acquired. However, when an error occurs, the program is stopped so that the device status data at the time of the error is not discarded. When the log is acquired at a constant cycle, the program may be executed by the PLC 600 using the switching of the clock pulse in the PLC 600 as a trigger.
As described above, by acquiring the device status data log by the PLC 600, the log can be acquired in a shorter cycle compared to the case of acquiring the device status data log by the host controller, and refer to this log. Thus, the cause of the error that has occurred in the asher device 1 can be identified. Therefore, the time required to start the error recovery process can be shortened, and as a result, the operating rate of the asher device 1 can be increased.
If it is difficult to identify an error (such as described with reference to FIG. 4A and FIG. 4B above), refer to the device status data log even after the asher device 1 recovers normally. By doing so, the cause of the error can be identified.

FIG. 5B is a diagram illustrating a memory area of the controller 600 that is a PLC. As shown in FIG. 5B, the memory area of the PLC 600 includes a device state area (device state area) 602 for storing device state data and a log area (logging area) 604 for storing a copy of the device state data, as in FIG. 5A. -1 to 604-n. By executing a program (not shown) in the PLC 600, the memory area of the PLC 600 is stored in the logging areas 604-1 to 604-n at this time, triggered by an error notification from the host controller 700. Are output as a single log file (here, log file 1) to the external memory. In addition, in order to grasp the change in the state of the asher device 1 after the error occurs, not only the log at the time when the error is notified from the host controller 700 but also a predetermined value after the error is notified from the host controller 700. Logs that have passed over time may be output to external memory as log files.
In this way, by outputting the log file to the external memory, it is possible to have the device manufacturer confirm the log file and identify the cause of the error, so the operator can directly confirm the state of the asher device 1. Therefore, compared with the case of identifying the cause of the error, the time required to identify the cause of the error can be shortened, and the cost required to identify the cause of the error can be reduced.
Here, the log file names are log file 1, log file 2,..., But the date and time when the error was notified and an identifier (error ID) for identifying the error are included in the log file name. It doesn't matter.

FIG. 6 shows each device (the asher device 1 and the controller 600) when the error notification date and time and the log ID are included in the log file name when the log at the time when the error is detected and notified by the asher device 1 is acquired. FIG. 9 is a sequence diagram showing operations of the host controller 700 and the terminal device 800). FIG. 6A is a sequence diagram when an error notification date and time is included in the log file name, and FIG. 6B is a sequence diagram when an error ID is included in the log file name.
As shown in FIG. 6A, in step 100 (S100), the terminal device 800 functions as an NTP (Network Time Protocol) server, and transmits a time synchronization signal to the controller 600, whereby the controller 600 and the time Synchronize. In step 102 (102), the Asher device 1 transmits device status data to the controller 600. In step 104 (S104), the controller 600 writes a copy of the device status data received in step 102 in the log area. In step 106 (S106), the controller 600 transmits the apparatus status data received in step 102 to the host controller 700. In step 108 (S108), the host controller 700 detects an error based on the device status data received in step 106. In steps 110 and 112 (S110 and 112), the host controller 700 notifies the controller 600 and the terminal device 800 of the error detected in step 108. In step 114 (S114), the controller 600 outputs the device status data written in the log area when the error is notified to the external memory as a log file. At this time, the controller 600 includes the date and time when the error was notified in step 110 in the name of the log file. In step 116 (S116), the terminal device 800 displays the error notified in step 112 together with the date and time when the error was notified.
As described above, by synchronizing the times of the controller 600 and the terminal device 800, the log file output from the controller 600 and the error displayed on the terminal device 800 can be linked by the error notification date and time. Therefore, even when a plurality of errors occur, the log file can be specified.

In steps 200 to 208 (S200 to 208) in FIG. 6B, the same processing as in steps 102 to 112 (S102 to 112) in FIG. 6A is performed. In step 210 (S210), the terminal device 800 assigns an error ID to the error notified in step 208, and displays the error together with the error ID. In step 212 (S212), the terminal device 800 notifies the controller 600 of the error ID assigned in step 210. In step 214 (S214), the controller 600 outputs the log when the error ID is notified in step 212 to the external memory as a log file. At this time, the controller 600 includes the error ID notified in step 212 in the name of the log file.
In this way, by notifying the controller 600 of the error ID assigned by the terminal device 800, the log file output by the controller 600 and the error displayed by the terminal device 800 are linked by the error ID. be able to. Therefore, even when a plurality of errors occur, the log file can be specified.

  The asher apparatus 1 according to the embodiment of the present invention is applied not only to a semiconductor manufacturing apparatus but also to an apparatus for processing a glass substrate such as an LCD apparatus. The asher apparatus 1 according to the embodiment of the present invention is also applied to an exposure apparatus, a coating apparatus, a drying apparatus, a heating apparatus, and the like, which are other substrate processing apparatuses. In addition, the asher apparatus 1 according to the embodiment of the present invention is not limited to the process in the furnace, and includes a process for forming a CVD, PVD, oxide film, nitriding powder, and a process for forming a film containing a metal. Membrane treatment can be performed. Furthermore, the asher apparatus 1 according to the embodiment of the present invention can perform an annealing process, an oxidation process, a nitriding process, a diffusion process, and the like.

  Preferably, the lower-level controller stores the output content from the detection unit after the error notification as a log file, and the reference time for saving the log file is output to the operation unit from the detection unit. Synchronize with the reference time to display the contents.

  Preferably, after an error is notified to the lower controller, the operation unit assigns an identifier (ID) for identifying the error, displays the output content from the detection unit together with the identifier, and displays the identifier on the lower controller. To be notified.

  Preferably, after the identifier is notified to the lower controller, the lower controller stores the output content from the detection unit after the error notification as a log file with a name including the identifier.

  Preferably, the lower controller stores the output content from the detection unit at the time of the error notification as a log file.

  In order to achieve the above object, a substrate processing method according to the present invention includes a processing unit that performs processing on a substrate, a state of a transport unit that transports the substrate, and a detection unit that detects these operations, and controls them. When an error is included in the output content from the detection unit in a substrate processing apparatus including a lower controller and a host controller having a control unit that controls the lower controller and an operation unit that displays the output content from the detection unit The step of notifying the lower controller of an error and the step of storing the output content from the detection unit before and after the error notification in a cycle shorter than the data transfer cycle from the upper controller to the operation unit. This is a substrate processing method to be executed.

1 Asher device 100 EFEM
110 FOUP
120 atmospheric transfer robot 200 load lock chamber section 210 load lock chamber 220 buffer unit 230 boat 240 index assembly 250 gate valve 300 transfer module section 310 transfer module 320 vacuum arm robot unit 400 process chamber section 410 plasma processing unit 412 plasma source section 414 processing Chamber 416 High-frequency power source 418 Frequency matching unit 420 Base plate 422 Resonant coil 424 Outer shield 426 Reaction vessel 428 Top plate 430 Post 432 Susceptor 434 Susceptor table 436 Substrate heating unit 438 Exhaust plate 440 Guide shaft 442 Bottom plate 444 Lifting substrate 446 Lifter pin 448 Lifter pin 448 Part 450 Lifting shaft G 452 Baffle ring 454 First exhaust chamber 456 Exhaust communication hole 458 Second exhaust chamber 460 Exhaust pipe 462 Exhaust device 464 Gas supply pipe 466 Gas inlet 468 Mass flow controller 470 Open / close valve 472 Baffle plate 474 Movable tap 476 Fixed ground 478 RF sensor 500 Wafer 600 Controller 602 Device status area 604 Log area 700 Host controller 800 Terminal device

Claims (5)

A processing unit that performs processing on the substrate, a state of the transport unit that transports the substrate, and a detection unit that detects these operations, and a lower controller that controls them,
A substrate processing apparatus comprising: a control unit that controls the lower controller; and an upper controller that includes an operation unit that displays output content from the detection unit;
The lower controller stores the data in the device status area in a log area for each sampling period shorter than the period in which the output content is acquired from the lower controller by the upper controller,
The upper controller, when an error is included in the output content from the detection unit, notifies the lower controller of the error,
The lower controller stores the data stored in the log area in association with the date and time when the error was notified ,
The operation unit displays the error together with a date and time when the error is notified . 2. The lower controller synchronizes with a reference time for saving data stored in the log area as a log file and a reference time for displaying output contents from the detection unit on the operation unit. Substrate processing equipment. The substrate processing apparatus according to claim 1, wherein after the error is notified to the lower-level controller, the operation unit assigns an identifier for identifying the error, and displays the output content from the detection unit together with the identifier. The substrate processing apparatus according to claim 3, wherein after the identifier is notified to the lower controller, the lower controller stores a name including the identifier in association with the error. A processing unit that performs processing on the substrate, a state of the transport unit that transports the substrate, and a detection unit that detects these operations, and a lower controller that controls them,
A data processing method for a substrate processing apparatus, comprising: a control unit that controls the lower controller and an upper controller that includes an operation unit that displays output content from the detection unit,
The lower controller stores the data in the device status area in a log area for each sampling period shorter than the period in which the output content is acquired from the lower controller by the upper controller,
The host controller, when an error is included in the output content from the detection unit, notifies the lower controller of the error,
The lower controller stores the data stored in the log area in association with the error and the date and time when the error was notified,
A data display method for a substrate processing apparatus, wherein the operation unit displays the error together with a date and time when the error is notified.

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