JP5406805B2 - Method for producing substrate with adhesive layer - Google Patents

Description

  The present invention relates to a method for producing a substrate with an adhesive layer.

  As a technique for applying a coating solution to a fine portion, for example, a screen printing method, an ink jet method, or the like is known. These techniques are used for manufacturing printed circuits and liquid crystal displays.

  As an example of applying a coating solution to a fine part, the upper surface of a structure (also referred to as a partition wall, spacer, or rib) erected on the base material so as to bond the two base materials while keeping the distance between them constant The use which apply | coats an adhesive agent as a coating liquid is mentioned. In this case, the structure and the substrate that are adherends are fixed via an adhesive.

  In Patent Document 1, as a method of applying an adhesive to a spacer of an electrophoretic display panel, a transfer roll having an adhesive attached to its surface is driven to rotate, and the transfer roll and the substrate on which the spacer is formed are moved relative to each other. Thus, a method of applying an adhesive on the upper surface of the spacer has been proposed.

  Patent Document 2 proposes a method of transferring a hot melt adhesive that is solid in a standard state and exhibits adhesiveness only under specific conditions as a method of applying an adhesive to a spacer of an electrophoretic display panel. Has been.

JP 2006-184893 A JP 2008-225063 A

  However, in the method using a transfer roll, the situation where the coating solution wets and spreads in areas other than the desired coating portion can occur as the coating solution having higher wettability is used. Moreover, in the case of application | coating, the situation where the coating liquid splashes and the coating liquid is applied to an unintended place may occur. Alternatively, when the cell is filled with ink or a medium other than the coating liquid, such as an LCD or an electrophoretic display panel, the medium and the coating liquid are compatible or the coating liquid elutes in the medium. This can happen.

  Further, in the method of transferring the adhesive, there is a large amount of adhesive remaining on the transfer source base material, which may cause a waste of the adhesive. Moreover, the situation where the adhesiveness of the transferred adhesive is weak may occur.

  The present invention has been made in view of such points, and in particular, in a place where a medium other than the coating liquid and the coating liquid are in contact, the coating liquid can be selectively applied to the intended place, It is an object of the present invention to provide a method for producing a substrate with an adhesive layer by a coating method that has good adhesion to an adherend and can be efficiently coated in terms of coating amount.

  The method for producing a substrate with an adhesive layer according to the present invention includes a step of forming a structure on the surface of a first substrate and a step of forming a coating film of a thermoplastic material on the surface of a second substrate. And contacting the thermoplastic material layer formed on the surface of the second base material with the upper surface of the structure standing on the surface of the first base material, heating the thermoplastic material layer, The step of bonding the structure and the thermoplastic material layer, and peeling the second substrate from the first substrate in a state where the thermoplastic material layer is heated, the thermoplastic material layer is placed on the upper surface of the structure. And a step of transferring to the substrate.

In the manufacturing method of the base material with an adhesive layer of the present invention, it is preferable that the first base material side is selectively heated in the step of bonding the structure and the thermoplastic material layer. Moreover, in the manufacturing method of the base material with an adhesive layer of this invention, in the process of bonding a structure and a thermoplastic material layer, it is preferable that heating temperature is more than the softening point of a thermoplastic material. Moreover, in the manufacturing method of the base material with an adhesive layer of this invention, in the process of bonding a structure and a thermoplastic material layer, the part near a 1st base material reaches a softening point among thermoplastic resin layers. It is preferable that the portion separated from the first base material is in a state where the softening point is not reached.

  In the method for producing a substrate with an adhesive layer of the present invention, in the step of transferring the thermoplastic material layer to the upper surface of the structure, the heating temperature is preferably equal to or higher than the softening point of the thermoplastic material.

In the method for producing a base material with an adhesive layer of the present invention, in the step of transferring the thermoplastic material layer to the upper surface of the structure, the temperature of the second base material is higher than the temperature of the first base material. High is preferred. Moreover, in the manufacturing method of the base material with an adhesive layer of this invention, it is preferable to selectively heat the 2nd base material side in the process of transferring a thermoplastic material layer to the upper surface of a structure. In the method for producing a substrate with an adhesive layer according to the present invention, in the step of transferring the thermoplastic material layer to the upper surface of the structure, a portion of the thermoplastic resin layer that contacts the second substrate is used as a softening point. It is preferable to make it the state which reached | attained and to make it the state which does not reach the softening point in the part which is separated from the 2nd base material.

In the method for producing a substrate with an adhesive layer of the present invention, in the step of bonding the structure and the thermoplastic material layer, a load is applied from the outside so as to press the first substrate and the second substrate. Is preferred. In the method for producing a substrate with an adhesive layer of the present invention, the contact angle at the interface between the structure and the thermoplastic material layer is set to be equal to or less than the contact angle at the interface between the second substrate and the thermoplastic material layer. It is preferable.

  According to the present invention, the coating liquid can be selectively applied to an intended location, has good adhesion to an adherend, and can be efficiently applied in terms of coating amount. The manufacturing method of the base material with an adhesive bond layer can be provided.

The figure explaining the manufacturing method of the base material with an adhesive bond layer concerning embodiment. The figure explaining an example of the manufacturing method of the base material with an adhesive bond layer concerning embodiment. The schematic diagram which shows the relationship between the transfer amount of a thermoplastic material layer, and an adhesive bond layer. The figure explaining an example of the manufacturing method of the electrophoretic display medium using the base material with an adhesive layer which concerns on embodiment.

The present inventor uses a thermoplastic material as an adhesive, and bonds the film on which the thermoplastic material layer is formed to the upper surface side of the structure formed on the substrate in the manufacturing process of the adhesive layer by the transfer method. The amount of the thermoplastic material transferred to the structure can be increased by softening the thermoplastic material layer by heating twice at the time of peeling from the structure body. It has been found that the agent can be prevented from dissolving in a medium other than the coating solution.
Below, an example of the manufacturing method of the base material with an adhesive layer of this invention is demonstrated.

The manufacturing method of the base material with an adhesive layer shown in this embodiment includes a step of forming a structure on the surface of the first base material, and a coating of a thermoplastic material on the surface of the second base material. A step of forming, a step of bringing the thermoplastic material layer formed on the surface of the second base material into contact with the upper surface of the structure standing on the surface of the first base material, and heating the thermoplastic material layer Then, the structure and the thermoplastic material layer are bonded together, and the thermoplastic material layer is peeled off from the first base material while the thermoplastic material layer is heated, so that the thermoplastic material layer is structured. And transferring to the upper surface of the body.
Below, each process is demonstrated concretely with reference to drawings.

<Cell formation process>
In the cell formation step, a plurality of cells 104 made of an insulating structure 103 standing on the first electrode substrate 100 are formed (see FIG. 1A). The plurality of cells 104 are separated from each other by a standing structure 103 and can be provided in various shapes such as a circle, a rectangle (rectangle, square), and a hexagon. The structure 103 is sometimes called a “rib” or a “spacer”.

  The first electrode substrate 100 may be a substrate having electrodes. For example, the first electrode substrate 100 can have a structure in which the first electrode layer 102 is provided over the first base material 101. In this case, the structure body 103 is formed over the first electrode layer 102.

The first substrate 101 is made of a transparent inorganic material such as glass, quartz, sapphire, MgO, LiF, CaF _2, or an organic material such as fluororesin, polyester, polycarbonate, polyethylene, polyethylene terephthalate, polyethylene naphthalate, or polyethersulfone. It can be formed using a polymer film or ceramic.

The first electrode layer 102 is made of a transparent conductive material such as ITO, ZnO, SnO ₂ , aluminum (Al), gold (Au), platinum (Pt), copper (Cu), silver (Ag), nickel (Ni ), A metal such as chromium (Cr). Further, conductive polymers such as PODET / PVS and PODET / PSS, and transparent conductive materials such as titanium oxide, zinc oxide, and tin oxide may be used. Using these materials, the first electrode layer 102 can be formed by a method such as vapor deposition, ion plating, or sputtering.

  In addition, the shape of the first electrode layer 102 can be appropriately selected according to the shape of the second electrode layer serving as the counter electrode. Note that the first electrode layer 102 may be provided in contact with the first base material 101, or an element (transistor or the like) that drives an electrophoretic display medium is provided over the first base material 101. It may be provided on the element.

  In the electrophoretic display medium, when the first electrode substrate 100 is a front-side electrode substrate, display of characters and the like formed from the electrophoretic ink is visually recognized through the first electrode substrate 100. Therefore, the first base material 101 and the first electrode layer 102 are preferably formed using a light-transmitting material.

  The structure 103 can be formed using a resin material such as a PET film. For example, a plurality of cells 104 can be formed by performing laser processing on a synthetic resin such as a PET film having a certain thickness to form a square, hexagon, circle, or the like. Alternatively, after forming an insulating layer over the first electrode layer 102, the plurality of cells 104 can be formed by patterning the insulating layer by a photolithography method. In addition, a thermoplastic resin can be formed over the first electrode layer 102, and the cell 104 made of the cross-shaped structure 103 can be formed by a method such as hot embossing.

<Thermoplastic material layer forming step>
Subsequently, in the thermoplastic material layer forming step, a coating film of a thermoplastic material is formed on the surface of the film-like substrate 110 to form the thermoplastic material layer 111.

  The thermoplastic material is preferably a material that is in a liquid state at the stage of application to the surface of the substrate 110 and that only the thermoplastic material remains when the solvent is removed after the coating film is formed.

  As the thermoplastic material layer 111, a hot melt adhesive, a paraffin wax that is solid in the operating temperature range, a polyethylene resin, or the like can be used.

<Adhesive transfer process>
Subsequently, in the adhesive transfer step, an adhesive layer 112 is formed on the upper surface of the structure 103 by a transfer method (see FIG. 1C).

  First, the thermoplastic material layer 111 formed on the surface of the film-like substrate 110 is brought into contact with the upper surface of the structure 103 (see FIGS. 1A and 1B). Then, the thermoplastic material layer 111 and the upper surface of the structure 103 are bonded together while heating so that the temperature of the thermoplastic material layer 111 is equal to or higher than the softening point.

  Here, the thermoplastic material layer 111 is heated by selectively heating the first electrode substrate 100 side. Therefore, the thermoplastic material layer 111 becomes a thermoplastic material layer 111a in which a portion close to the first electrode substrate 100 has reached the softening point, and a portion in which the thermoplastic material layer 111 is away from the first electrode substrate 100 does not reach the softening point. The material layer 111b is formed (see FIG. 2A). Since the portion of the thermoplastic material layer 111 that is in contact with the structure body 103 becomes the thermoplastic material layer 111a that has reached the softening point, the adhesion of the thermoplastic material layer 111 to the structure body 103 can be increased.

  In the adhesive transfer step, the timing of softening the thermoplastic material layer 111 may be after the solidified thermoplastic material layer 111 is brought into contact with the upper surface of the structure 103, or the thermoplastic material layer 111 may be structured. It may be before contacting the upper surface of 103. However, since the layer thickness of the thermoplastic material layer 111 may be disturbed at the standby position, it is preferably softened immediately before contact or after contact.

  Furthermore, in this bonding step, a load may be applied from the outside of the substrate 110 so as to press the structural body 103 and the thermoplastic material layer 111. For example, a load can be applied from the outside by pressing the base 110 and the first electrode substrate 100 with a roller-shaped pressing body so that the thermoplastic material layer 111 and the upper surface of the structure 103 are in contact with each other. By applying a load from the outside, the adhesion between the structure 103 and the thermoplastic material layer 111 can be increased.

  Thereafter, the base material 110 is peeled off from the upper surface of the structure body 103, whereby a part of the thermoplastic material layer 111 is transferred to the upper surface of the structure body 103, and an adhesive layer 112 is formed on the upper surface of the structure body 103 ( (Refer FIG.1 (c)). At the time of peeling, the thermoplastic material layer 111 is heated to a temperature equal to or higher than the softening point of the thermoplastic material.

  Here, the thermoplastic material layer 111 is heated by selectively heating the substrate 110 side. Therefore, the thermoplastic material layer 111 becomes the thermoplastic material layer 111a in which the part close to the base material 110 has reached the softening point, and the thermoplastic material layer 111b in which the part away from the base material 110 does not reach the softening point ( (Refer FIG.2 (b)). Since the portion of the thermoplastic material layer 111 that is in contact with the structure body 103 becomes the thermoplastic material layer 111b that does not reach the softening point, the transfer amount of the thermoplastic material layer 111 to the structure body 103 can be increased. As the amount of the thermoplastic material layer 111 transferred to the structure 103 increases, the thickness of the adhesive layer 112 increases, and the adhesive strength increases accordingly.

  In this peeling step, the amount of the thermoplastic material layer 111 transferred to the structure 103 can be increased by raising the temperature of the base 110 higher than that of the first electrode substrate 100. Since the base material 110 is selectively heated, the temperature is usually higher than that of the first electrode substrate 100. Further, the first electrode substrate 100 may be selectively cooled to make a temperature difference.

  As described above, in the adhesive transfer step, by transferring the thermoplastic material using a thermal laminating apparatus or the like, it is possible to suppress misalignment of the adhesive layer 112 and improve productivity. .

  The thickness of the adhesive layer 112 is determined by the thickness and type of the thermoplastic material layer 111 formed on the substrate 110, the temperature of the thermal laminating apparatus, the load of the roller-shaped pressing body, and the like. The adhesive layer 112 has a desired thickness by interposing a spacer for adjusting the distance between the pressing body and the first electrode substrate 100 or the distance between the pressing body and the base holding the first electrode substrate 100. You can get it.

  FIG. 3 is a schematic diagram showing the relationship between the transfer amount of the thermoplastic material layer 111 to the structure 103 and the adhesive layer 112 formed on the upper surface of the structure 103. FIG. 3A shows the adhesive layer 112 when the thermoplastic material layer 111 is transferred so as to cover the entire top surface of the structure 103.

  FIG. 3B shows the adhesive layer 112 when the amount of the thermoplastic material layer 111 transferred to the structure 103 is small compared to the case shown in FIG. If the adhesive layer 112 covers at least ¼ of the entire area of the upper surface of the structure 103, the adhesive layer 112 can function as the adhesive layer 112. In this case, the adhesive layer 112 having good adhesion to the structure can be formed with a small amount of the thermoplastic material layer 111.

  FIG. 3C shows the adhesive layer 112 when the amount of the thermoplastic material layer 111 transferred to the structure 103 is larger than in the case shown in FIG. The adhesive layer 112 can exhibit the function as the adhesive layer 112 as long as the adhesive width d2 is shorter than twice the structure width d1, that is, the relationship d2 <d1 × 2 is satisfied. . In this case, the adhesive force of the adhesive layer 112 can be further improved.

  As described above, according to the method for manufacturing a base material with an adhesive layer according to the embodiment, while the thermoplastic material layer 111 is heated so that the temperature of the thermoplastic material layer 111 becomes equal to or higher than the softening point, the structure of the thermoplastic material layer 111 and the structure Since the upper surface of the body 103 is attached, the adhesion of the thermoplastic material layer 111 to the structure 103 can be increased. In addition, since the thermoplastic material layer 111 is peeled off from the upper surface of the structure 103 while heating so that the temperature of the thermoplastic material layer 111 is equal to or higher than the softening point, the transfer amount of the thermoplastic material layer 111 to the structure 103 can be increased. Can be increased. As a result, it is possible to manufacture a base material with an adhesive layer that has good adhesion to the structure 103 and can suppress a decrease in adhesive force.

  Below, an example of the manufacturing method of the electrophoretic display medium using the base material with an adhesive layer obtained by the said process is demonstrated.

<Electrophoresis ink filling process>
In the electrophoresis ink filling step, each cell 104 formed on the first electrode substrate 100 is filled with the electrophoresis ink 120 (see FIG. 4A). As a method for filling the electrophoretic ink 120, for example, various methods such as coating using a die coater, a printing method using screen printing, or filling using an inkjet or a dispenser can be used.

  Note that the adhesive layer 112 formed on the upper surface of the structure 103 needs to be solidified before the electrophoretic ink 120 is filled in the cell 104. In order to solidify the adhesive layer 112, for example, the adhesive layer 112 may be cooled after the adhesive transfer step. As described above, by solidifying the adhesive layer 112 before filling the electrophoretic ink 120, the adhesive layer in the electrophoretic ink 120 even when the electrophoretic ink 120 touches the adhesive layer 112. It can suppress that 112 begins to melt | dissolve.

  The timing of solidifying the adhesive layer 112 is after the substrate 110 is peeled off from the upper surface of the structure 103 in the adhesive transfer step and before the electrophoresis ink 120 is filled in the electrophoresis ink filling step.

  The electrophoretic ink 120 only needs to include at least one type of electrophoretic particles. For example, it can be formed from white particles that are positively charged, black particles that are negatively charged, and a dispersion medium in which these particles are dispersed. As the white particles, white pigments such as titanium oxide, white resin particles, or resin particles colored in white can be used. As the black particles, black pigments such as titanium black and carbon black, resin particles colored black, and the like can be used. These particles can be arbitrarily used in various colors as long as the contrast can be displayed, and can be a combination of white and red, white and blue, yellow and black, and the like. Alternatively, only one type of charged particle such as only white particles or only black particles may be used.

<Board bonding process>
In the substrate bonding step, the first electrode substrate 100 and the second electrode substrate 200 are disposed to face each other, and the upper surface of the structure 103 and the second electrode substrate 200 are bonded via the adhesive layer 112. Then, the electrophoretic ink 120 is sealed in the cell 104 (see FIG. 4B). At this time, the adhesive layer 112 is softened to a state where it can be bonded by heat treatment, and then bonded to the second electrode substrate 200. That is, the adhesive layer 112 once solidified before the electrophoresis ink filling process is softened again.

  In order to seal the electrophoretic ink 120 in the cell 104, for example, after the adhesive layer 112 and the second electrode substrate 200 are brought into contact with each other, the temperature of the adhesive layer 112 is set to a temperature equal to or higher than the softening point, and a roller-shaped press The adhesive layer 112 may be cooled and solidified after the first electrode substrate 100 and the second electrode substrate 200 are pressed and bonded together (after thermocompression bonding) with a body.

  The second electrode substrate 200 may be formed using a substrate provided with an electrode. For example, a structure in which the second electrode layer 202 is provided over the second base material 201 can be employed. Note that the second base 201 may be formed using any one of the materials shown in the description of the first base 101. The second electrode layer 202 may be formed using any of the materials described in the description of the first electrode layer 102.

  In the electrophoretic display medium, when the second electrode substrate 200 is a front-side electrode substrate, the display of characters and the like formed from the electrophoretic ink is visually recognized through the second electrode substrate 200. Therefore, the second base 201 and the second electrode layer 202 are preferably formed using a light-transmitting material.

  In the substrate bonding step, the temperature (T2) for softening the adhesive layer 112 is preferably lower than the boiling point (T3) of the electrophoretic ink 120 (T3> T2). This is because when the temperature equal to or higher than the boiling point of the electrophoretic ink 120 is applied to the adhesive layer 112, the electrophoretic ink 120 volatilizes and decreases in weight. Therefore, it is preferable to select each material so that the softening point of the thermoplastic material layer 111 is smaller than the boiling point of the electrophoretic ink 120.

  In the substrate bonding step, the temperature (T2) for softening the adhesive layer 112 is lower than the temperature (T1) for softening the thermoplastic material layer 111 to a transferable state in the adhesive transfer step (T1> T2). Is preferred. In the adhesive transfer step, it is preferable to apply a high temperature (T1) in order to sufficiently dissolve the thermoplastic material layer 111 and peel it from the base material 110, while in the substrate bonding step. This is because, since the shape of the adhesive layer 112 is required to be maintained, it is necessary to soften the adhesive layer 112 at a temperature (T2) at which the adhesive layer 112 is not melted.

Furthermore, it is preferable that the wettability between the structure body 103 and the thermoplastic material layer 111 is greater than the wettability between the base material 110 and the thermoplastic material layer 111 in order to improve the transfer reliability. That is, the contact angle (θ ₁ ) at the interface between the structure 103 and the thermoplastic material layer 111 is equal to or less than the contact angle (θ ₂ ) at the interface between the substrate 110 and the thermoplastic material layer 111 (θ ₁ ≦ θ ₂ ). Thus, it is preferable to select each material.

  By adhering the adhesive layer 112 formed on the upper surface of the structure 103 and the second electrode substrate 200, the cell 104 is sealed, and thus aggregation or uneven distribution of the electrophoretic particles contained in the electrophoretic ink 120 is prevented. It becomes possible to suppress.

  Next, examples carried out for clarifying the effects of the present invention will be described, but the present invention is not limited thereto.

<Thermoplastic material layer forming step>
Using a comma roll, a thermoplastic material (hot melt resin) diluted with a solvent was applied on a substrate (PET film with a release agent) to a film thickness of 12 μm and then dried.

<Cell formation process>
After laminating an acrylate resist film on the first electrode substrate (ITO-PET film) using a laminator, a structure was formed by a photoresist method.

<Contact process>
The thermoplastic material layer on the surface of the base material was brought into contact with the upper surface of the structure provided on the surface of the first electrode substrate.

<Adhesive transfer process>
The first electrode substrate and the base material are passed through a 120-degree thermal laminator, and the base material is peeled off in a heated state, whereby a part of the thermoplastic material layer formed on the base material surface is removed from the structure body. Transferred to the upper surface. The film thickness of the adhesive layer transferred to the upper surface of the structure was about 6 to 8 μm.

<Electrophoresis ink filling process>
Next, after the thermoplastic material formed on the upper surface of the structure is cured, the electrophoresis ink is applied to the ITO-PET film using a die coater, thereby filling the cells made of the structure with the electrophoresis ink. . As a result of observing the upper surface of the structure after applying the electrophoretic ink, it was confirmed that the thermoplastic material formed on the upper surface of the structure remained without being dissolved or discharged.

  Next, an ultraviolet curable adhesive was formed on the outer periphery of the portion to which the electrophoretic ink was applied (cell forming portion).

<Board bonding process>
Next, the ITO-PET film coated with the electrophoretic ink and the second electrode substrate (FPC substrate) were bonded together through an 80 ° C. thermal laminator, and then the outer periphery of the cell forming portion was irradiated with ultraviolet rays. An electrophoretic display panel was produced by curing an ultraviolet curable adhesive.

DESCRIPTION OF SYMBOLS 100 1st electrode substrate 101 1st base material 102 1st electrode layer 103 Structure 104 Cell 110 Base material 111 Thermoplastic material layer 111a Thermoplastic material layer which reached the softening point 111b Thermoplastic material which does not reach the softening point Layer 112 Adhesive layer 120 Electrophoretic ink 200 Second electrode substrate 201 Second base material 202 Second electrode layer

Claims (10)

Forming a structure on the surface of the first substrate;
Forming a coating film of a thermoplastic material on the surface of the second substrate;
Bringing the thermoplastic material layer formed on the surface of the second base material into contact with the upper surface of the structure provided upright on the surface of the first base material;
Heating the thermoplastic material layer and bonding the structure and the thermoplastic material layer;
A step of transferring the thermoplastic material layer to the upper surface of the structure by peeling the second substrate from the first substrate while the thermoplastic material layer is heated. The manufacturing method of a base material with an agent layer. The manufacturing method of the base material with an adhesive layer of Claim 1 which selectively heats the said 1st base material side in the process of bonding the said structure and the said thermoplastic material layer. In the step of bonding the said thermoplastic material layer and the structure, the heating temperature is above the softening point of the thermoplastic material, the manufacture of the adhesive layer with the base material according to claim 1 or claim 2 Method. In the step of bonding the structure and the thermoplastic material layer, a portion of the thermoplastic resin layer that is close to the first base material is brought into a softening point, and is separated from the first base material. The manufacturing method of the base material with an adhesive layer in any one of Claims 1 thru | or 3 which makes the state which does not reach the softening point the part which has it. In the step of transferring the thermoplastic material layer on the upper surface of the structure, the heating temperature is above the softening point of the thermoplastic material, with an adhesive layer according to any one of claims 1 to claim 4 A method for producing a substrate. In the step of transferring the thermoplastic material layer on the upper surface of the structure, than the temperature of the first substrate, the higher the temperature of the second substrate, one of the claims 1 to 5 The manufacturing method of the base material with an adhesive layer of crab. The base material with an adhesive layer according to any one of claims 1 to 6, wherein in the step of transferring the thermoplastic material layer to the upper surface of the structure, the second base material side is selectively heated. Manufacturing method. In the step of transferring the thermoplastic material layer to the upper surface of the structure, the portion of the thermoplastic resin layer that is in contact with the second base material has reached a softening point, and The manufacturing method of the base material with an adhesive layer in any one of Claim 1 thru | or 7 which makes the state which has left | separated the state which does not reach a softening point. In the step of bonding the said thermoplastic material layer and the structure, applying a load from the outside so as to press the second substrate and the first substrate, to one of the claims 1 to 8 The manufacturing method of the base material with an adhesive layer of description. The contact angle at the interface between the structure and the thermoplastic material layer is set to be equal to or smaller than the contact angle at the interface between the second base material and the thermoplastic material layer. The manufacturing method of the base material with an adhesive layer of description.

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