JP5401070B2 - Processing device management system - Google Patents

Processing device management system Download PDF

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JP5401070B2
JP5401070B2 JP2008261369A JP2008261369A JP5401070B2 JP 5401070 B2 JP5401070 B2 JP 5401070B2 JP 2008261369 A JP2008261369 A JP 2008261369A JP 2008261369 A JP2008261369 A JP 2008261369A JP 5401070 B2 JP5401070 B2 JP 5401070B2
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JP2010093047A (en
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永博 井上
明雄 梅沢
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Ulvac Inc
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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本発明は、所定の処理を行う複数の処理装置にて行われる各プロセスを統括管理するための処理装置の管理システムに関する。   The present invention relates to a management system for a processing apparatus for comprehensively managing each process performed by a plurality of processing apparatuses that perform predetermined processing.

半導体製造工程においては、シリコンウエハ等の一枚の処理基板に対して、ＰＶＤ法、ＣＶＤ法等による成膜処理、イオン注入処理、熱処理やエッチング処理などの各種の処理を経て所望のデバイス構造を有する製品が作製される。このように一枚の処理基板に対して各種の処理を施す間、これらの処理が適切に行われているか、つまり、処理装置毎にその作動状況を管理することが製品歩留りを向上させる上で重要となる。   In a semiconductor manufacturing process, a desired device structure is formed on a single processing substrate such as a silicon wafer through various processes such as a film formation process by a PVD method, a CVD method, an ion implantation process, a heat treatment and an etching process. The product that has it is made. In this way, while various processes are performed on a single processing substrate, whether these processes are properly performed, that is, managing the operation status for each processing apparatus improves the product yield. It becomes important.

従来、このような製品管理を行う処理装置の管理システムとして、半導体の製造工程ラインに設けられた各種の処理装置から予め決められた管理情報を連続して収集するセンサを備え、このセンサにより収集された管理情報を時系列の測定値パターンとして監視し、例えば、上記処理装置にてある定常状態から次の定常状態へ遷移する期間（信号波形の立ち上げまたは立ち下げの期間）において、管理情報に応じた測定値パターンと、予め登録されている設定値パターンとを比較し、比較の結果、測定値パターンの設定値パターンからの逸脱が検出された場合、異常検知するものが例えば特許文献１で知られている。   Conventionally, as a management system for a processing apparatus that performs such product management, a sensor that continuously collects predetermined management information from various processing apparatuses provided in a semiconductor manufacturing process line has been provided. The monitored management information is monitored as a time-series measurement value pattern. For example, in the period during which the processing apparatus transitions from one steady state to the next steady state (period of signal waveform rise or fall), the management information For example, Patent Document 1 discloses an apparatus that detects an abnormality when a measured value pattern corresponding to the measured value pattern is compared with a preset value pattern and a deviation from the measured value pattern is detected as a result of the comparison. Is known.

上記特許文献１記載のものでは、各処理装置での作動手順等（レシピ）に応じた処理条件が同一であれば、略同等の品質を持った製品が作製でき、不良の発生原因である処理条件のばらつきが、各処理装置の作動のばらつきに相当するとして、センサを介して、処理条件の内容たる管理情報を連続取得し、この取得したデータをグラフ化し、処理装置の作動手順等であるレシピに基づき予め作成された設定値パターンの波形データと重ね合わせることにより、安定性や経時変化のトレンド等を確認する。   In the above-mentioned Patent Document 1, if the processing conditions according to the operation procedure and the like (recipe) in each processing apparatus are the same, a product having substantially the same quality can be manufactured, and the process that is the cause of the occurrence of the defect Assuming that the variation in conditions corresponds to the variation in operation of each processing apparatus, management information that is the content of the processing conditions is continuously acquired via a sensor, the acquired data is graphed, and the operating procedure of the processing apparatus, etc. Overlap with the waveform data of the set value pattern created in advance based on the recipe, the stability and the trend of change with time are confirmed.

然し、上記特許文献１記載のものでは、１つのレシピに応じた１つの管理情報について、異常検知のための１つの設定値パターンとその閾値とを個々に設定していく必要がある。このため、複数の処理工程における全レシピについて、このように設定値パターンを作成する作業、具体的には登録手段へのデータ入力作業を行うのでは、その作業が面倒であり、しかも、レシピ毎の登録では、当初に登録させておくデータ量が多大となり、結果として、使い勝手が悪いという問題がある。このような問題は処理工程が増加するに従い一層顕著になる。
特開２０００−２６９１０８号公報 However, in the one described in Patent Document 1, it is necessary to individually set one set value pattern for detecting an abnormality and its threshold value for one piece of management information corresponding to one recipe. For this reason, it is troublesome to create the setting value pattern in this way for all recipes in a plurality of processing steps, specifically, to perform the data input operation to the registration means. However, there is a problem that the amount of data to be initially registered is large, and as a result, the usability is poor. Such problems become more pronounced as the number of processing steps increases.
JP 2000-269108 A

本発明は、以上の点に鑑み、設定値パターンの入力を簡素化しつつデータ量を少なくできるようにした使い勝手のよい処理装置の管理システムを提供することをその課題とするものである。   In view of the above, it is an object of the present invention to provide an easy-to-use processing apparatus management system that can reduce the amount of data while simplifying input of a set value pattern.

上記課題を解決するために、本発明は、所定の処理を行う複数の処理装置にて行われる各処理を統括管理するための処理装置の管理システムであって、各処理装置に設けたセンサを介して取得した管理情報の取得波形データと、取得しようする管理情報に対応して予め記憶された設定波形データとを比較し、所定の閾値を超えて設定波形データから取得波形データが逸脱すると、異常検知と判断するようにしたものにおいて、前記設定波形データの全てが初期状態から定常状態に向う上昇波形データと定常状態たる安定波形データとに区分され、この区分された上昇波形データ及び安定波形データ毎に、取得波形データとの比較による異常検知の判断を行うことを特徴とする。   In order to solve the above-described problems, the present invention provides a management system for a processing apparatus for comprehensively managing each process performed by a plurality of processing apparatuses that perform a predetermined process, and includes a sensor provided in each processing apparatus. When the acquired waveform data deviates from the set waveform data exceeding the predetermined threshold, the acquired waveform data of the management information acquired through the comparison with the set waveform data stored in advance corresponding to the management information to be acquired, In the detection of abnormality, all of the set waveform data is divided into rising waveform data from the initial state to the steady state and stable waveform data in the steady state, and the divided rising waveform data and stable waveform It is characterized in that determination of abnormality detection is performed for each data by comparison with acquired waveform data.

本発明によれば、１枚の基板に対して各種の処理を施して所望の製品を作製する場合、各処理装置のレシピに応じて、基板加熱冷却温度、基板ステージやターゲットに投入される電力や真空度等の管理情報を連続して取得すると、これらの情報は、通常、処理時間に対して、初期状態から定常状態に向い、そして、定常状態で略一定に保持され、次に、定常状態から初期状態等の処理終了状態へ向うように変化する波形パターンを描くこととなる。   According to the present invention, when a desired product is manufactured by performing various processes on a single substrate, the substrate heating / cooling temperature, the electric power supplied to the substrate stage and the target according to the recipe of each processing apparatus If management information such as the degree of vacuum or the like is continuously acquired, the information is normally directed from the initial state to the steady state with respect to the processing time, and is kept substantially constant in the steady state. A waveform pattern that changes from the state toward the processing end state such as the initial state is drawn.

そこで、本発明においては、各処理装置のレシピにそれぞれ応じた設定波形データを少なくとも上昇波形データと安定波形データとに区分し、この区分された上昇波形データ及び安定波形データ毎に取得波形データとの比較による異常検知を判断することで、レシピの数に関係なく、２個の波形データのみで各処理装置での異常検知を集約管理できる。結果として、個々のレシピに応じて設定波形データや閾値を設定して管理するものと比較してデータ量を少なくできる。   Therefore, in the present invention, the set waveform data corresponding to the recipe of each processing apparatus is divided into at least rising waveform data and stable waveform data, and the acquired waveform data is divided into the divided rising waveform data and stable waveform data. By determining abnormality detection by comparison, it is possible to centrally manage abnormality detection in each processing apparatus using only two waveform data regardless of the number of recipes. As a result, the amount of data can be reduced as compared with those in which set waveform data and threshold values are set and managed according to individual recipes.

また、本発明においては、前記設定波形データに、定常状態から処理終了状態へ向う下降波形データを更に含むものであれば、処理開始から終了までの一連の処理を３つに区分して集約管理できる。   In the present invention, if the set waveform data further includes falling waveform data from the steady state to the process end state, the series of processes from the start to the end of the process is divided into three to be integrated and managed. it can.

さらに、前記上昇波形データ、安定波形データ及び下降波形データ毎に、所定の基準値とこの基準値からプロセス上許容し得る変化量が予め設定でき、取得しようとする管理情報に応じて基準値及び変化量を入力すると、異常と判断する閾値が設定されるようにしておけば、設定波形データを登録するための作業、つまり、異常検知の条件を入力する作業が簡素化できてよい。   Further, for each of the rising waveform data, the stable waveform data, and the falling waveform data, a predetermined reference value and a change amount allowable in the process can be set in advance from the reference value. If a threshold value for determining an abnormality is set when a change amount is input, an operation for registering set waveform data, that is, an operation for inputting an abnormality detection condition may be simplified.

この場合、前記変化量を基準値に対する変化割合で設定できるようにしておけば、その入力が一層容易になってよい。   In this case, if the change amount can be set at a change rate with respect to the reference value, the input may be made easier.

以下、図面を参照して、半導体製造工程にて所望のデバイス構造を得るための複数の処理装置１を統括管理するものを例に本発明の実施の形態の管理システムを説明する。処理装置１としては、ＰＶＤ法、ＣＶＤ法等による成膜処理、イオン注入処理、熱処理やエッチング処理などを行うものが挙げられる。   Hereinafter, a management system according to an embodiment of the present invention will be described with reference to the drawings, taking as an example a system that collectively manages a plurality of processing apparatuses 1 for obtaining a desired device structure in a semiconductor manufacturing process. Examples of the processing apparatus 1 include an apparatus that performs a film forming process, an ion implantation process, a heat treatment, an etching process, and the like by a PVD method, a CVD method, and the like.

図１に示すように、管理システムは、各処理装置１の図示省略のコントローラと通信自在である公知のマイクロコンピュータからなる制御手段２と、処理装置１の作動状況や設定値入力等の際に所定の情報などを表示する表示手段３と、メモリやハードディスクからなり、後述のように処理の異常検知を行うための設定波形データが予め登録されている登録手段４とを備える。また、登録手段４には、パーソナルコンピュータ等の入力手段Ｐを用いて各処理装置１の制御内容たる処理装置の作動手順が予めプログラム登録されており、制御手段２に処理装置１作動の実行信号が入力されると、各処理装置２に設けた図示省略のコントローラを介して上記プログラムに基づいて各処理装置１の作動をシーケンス制御するようになっている。   As shown in FIG. 1, the management system performs control means 2 including a known microcomputer that can communicate with a controller (not shown) of each processing apparatus 1, and the operating status and setting value input of the processing apparatus 1. A display unit 3 for displaying predetermined information and the like, and a registration unit 4 including a memory and a hard disk and pre-registered with set waveform data for detecting a process abnormality as will be described later. The registration means 4 is pre-programmed with the operation procedure of the processing apparatus, which is the control content of each processing apparatus 1, using the input means P such as a personal computer. Is input, the operation of each processing apparatus 1 is sequence-controlled based on the program via a controller (not shown) provided in each processing apparatus 2.

また、制御手段２には、インターフェイスケーブル５を介して各処理装置１に設けた各種のセンサ６が接続され、各処理装置１にて所定の処理を実施している間、当該センサ６を通して当該処理が適切に行われているかを判断するために、各処理装置１の作動手順等たるレシピに応じて所定の管理情報が連続して取得される。そして、この取得された情報が適宜アナログ／デジタル変換された後、制御手段２に入力されて取得波形データとされる（図２参照）。   Various sensors 6 provided in each processing apparatus 1 are connected to the control means 2 via the interface cable 5, and the predetermined processing is performed in each processing apparatus 1 through the sensor 6. In order to determine whether the processing is appropriately performed, predetermined management information is continuously acquired according to a recipe such as an operation procedure of each processing apparatus 1. The acquired information is appropriately converted from analog to digital, and then input to the control means 2 to obtain acquired waveform data (see FIG. 2).

センサ６としては、熱電対、液体または気体の流量計や電圧または電流計が挙げられる。なお、センサ６から管理情報を取得する場合、制御手段２に直接ネットワーク接続するようにしてもよい。   Examples of the sensor 6 include a thermocouple, a liquid or gas flow meter, and a voltage or ammeter. In addition, when acquiring management information from the sensor 6, you may make it connect with a network directly to the control means 2. FIG.

また、レシピとは、例えばＣＶＤ装置における基板加熱を例に説明すれば、ヒータ作動による加熱開始直後から、成膜時の基板の設定温度までの到達時間（昇温速度）、設定温度での処理時間や設定温度から処理終了までの冷却時間（降温速度）である。そして、このような場合における管理情報は、熱電対で取得された基板の温度であり、当該熱電対がセンサ６となる。他方、例えばスパッタリング装置におけるターゲットへの電力投入を例に説明すれば、ＤＣ電源作動によるターゲットの電圧印加開始から、設定電圧までの到達時間、設定電圧での処理時間（成膜時間）である。このような場合における管理情報は、スパッタ電源からの出力に設けられた電圧計で取得された電圧であり、当該電圧計がセンサ６となる。   In addition, for example, the recipe is explained with reference to the substrate heating in the CVD apparatus, for example, the arrival time (temperature increase rate) from immediately after the start of heating by the heater operation to the set temperature of the substrate at the time of film formation, processing at the set temperature This is the cooling time (temperature decrease rate) from the time or set temperature to the end of processing. The management information in such a case is the temperature of the substrate acquired by the thermocouple, and the thermocouple becomes the sensor 6. On the other hand, for example, the case where power is supplied to the target in the sputtering apparatus will be described as an example. The time from the start of voltage application to the set voltage by the DC power supply operation to the set voltage, and the processing time (deposition time) at the set voltage. The management information in such a case is a voltage acquired by a voltmeter provided at an output from the sputtering power supply, and the voltmeter becomes the sensor 6.

ここで、図２に示すように、各処理装置１のレシピに応じて、上記のように基板加熱冷却、基板ステージやターゲットに印加する電力だけなく、ガス導入の制御や真空度等の管理情報を連続して取得すると、これら取得した取得波形データＡＷ（図２中実線で示すもの）は、通常、処理時間に対して初期状態から定常状態に向い、そして、定常状態で略一定に保持され、次に、定常状態から初期状態等の処理終了状態へ向うように変化する波形パターンを描くこととなる。   Here, as shown in FIG. 2, according to the recipe of each processing apparatus 1, not only the substrate heating and cooling, the power applied to the substrate stage and the target as described above, but also the management information such as the control of gas introduction and the degree of vacuum. Are acquired continuously, the acquired waveform data AW (shown by a solid line in FIG. 2) is normally directed from the initial state to the steady state with respect to the processing time, and is held substantially constant in the steady state. Next, a waveform pattern that changes from the steady state to the processing end state such as the initial state is drawn.

そこで、異常検知の判断のために登録手段１に設定される設定波形データＳＷをレシピ毎に上昇波形データｕｗ、安定波形データｎｗ及び下降波形データｄｗにそれぞれ区分し（図２中点線で示すもの）、レシピを問わず、これら区分した上昇波形データｕｗ、安定波形データｎｗ及び下降波形データｄｗ毎に管理情報たる処理状況を登録、管理することとした。   Therefore, the set waveform data SW set in the registration means 1 for determination of abnormality detection is divided into ascending waveform data uw, stable waveform data nw and descending waveform data dw for each recipe (indicated by the dotted line in FIG. 2). ) Regardless of the recipe, the processing status as management information is registered and managed for each of the divided rising waveform data uw, stable waveform data nw, and falling waveform data dw.

登録手段４への設定波形データＳＷの入力に際しては、図３に示すように、登録手段４に予め登録された設定値入力フォームＦを表示手段３に表示させながら入力手段Ｐを介して行い得る。この入力フォームＦにおいては、上昇波形データｕｗ、安定波形データｎｗ及び下降波形データｄｗ毎に、レシピに対応した基準値と、この基準値から処理上許容し得る変化量が予め設定できるようになっている。ここで、基準値とは、上記ＣＶＤ装置やスパッタリング装置の例では、基板の設定温度や設定電圧をいう。また、変化量は、基準値に対する変化割合（％）で設定できるようになっている。   When the setting waveform data SW is input to the registration unit 4, as shown in FIG. 3, the setting value input form F registered in advance in the registration unit 4 can be displayed on the display unit 3 through the input unit P. . In this input form F, for each of the rising waveform data uw, the stable waveform data nw, and the falling waveform data dw, a reference value corresponding to the recipe and an amount of change allowable in processing from the reference value can be set in advance. ing. Here, the reference value refers to the set temperature and set voltage of the substrate in the above CVD apparatus and sputtering apparatus examples. The change amount can be set as a change rate (%) with respect to the reference value.

そして、上記基準値及び変化量を入力すると、異常検知を判断する閾値が設定される。即ち、図２中の安定波形データｎｗを例に説明すると、入力フォームＦにおいて設定温度（図示例では５００℃）及び処理時間及び上記変化量の上限及び下限の変化割合をそれぞれ入力すると（図示例では±５％）、制御手段２により演算処理され、処理上許容し得る閾値が算出される（上限５２５℃、下限４７５℃）。この状態で入力フォームＦ上で図示省略の確定コマンドを入力すると、変化量が設定される。これにより、安定波形データｎｗと共に、当該処理時間における上限、下限の閾値が登録手段４に登録される。この場合、図２中、一点鎖線で示す仮想の閾値ラインを表示手段３に表示させるようにしてもよい。なお、特に図示しないが、処理時間は、センサ６から出力された実測温度が所定温度に到達後や基板加熱を開始し、所定時間経過後からカウントする等、任意に設定できるようにすればよい。   When the reference value and the change amount are input, a threshold value for determining abnormality detection is set. That is, the stable waveform data nw in FIG. 2 will be described as an example. When the set temperature (500 ° C. in the illustrated example), the processing time, and the change rate of the upper limit and the lower limit of the above change amount are input in the input form F (illustrated example Then, ± 5%) is calculated by the control means 2 to calculate a threshold that is acceptable for processing (upper limit 525 ° C., lower limit 475 ° C.). When a confirmation command (not shown) is input on the input form F in this state, the amount of change is set. Thereby, the upper and lower thresholds in the processing time are registered in the registration unit 4 together with the stable waveform data nw. In this case, a virtual threshold line indicated by a one-dot chain line in FIG. 2 may be displayed on the display means 3. Although not particularly illustrated, the processing time may be arbitrarily set such that the measured temperature output from the sensor 6 reaches a predetermined temperature or starts heating the substrate and counts after the predetermined time has elapsed. .

上記においては、安定波形データｎｗを例に説明したが、上昇波形データｕｗや下降波形データｄｗに対しても同様の手順で登録手段４に登録できる。この場合、上昇波形データｕｗや下降波形データｄｗは、センサ６で取得する値が処理時間に対して連続変化することから、これらの登録に際しては、図４に示すように、例えば、処理開始からある処理時間（基準点）において設定温度からの温度差を基準値とし、この基準値から処理上許容し得る変化量を設定して、その上限、下限の閾値を設定することができる。また、単位時間当たりの変化量（図示例では、５℃／ｍｉｎ）を基準値として設定してもよい。   In the above description, the stable waveform data nw has been described as an example, but the rising waveform data uw and the falling waveform data dw can be registered in the registration means 4 in the same procedure. In this case, as the rising waveform data uw and the falling waveform data dw are continuously acquired with respect to the processing time, the values acquired by the sensor 6 change, for example, from the start of processing as shown in FIG. It is possible to set the upper and lower thresholds by setting a temperature difference from the set temperature at a certain processing time (reference point) as a reference value and setting an amount of change allowable in processing from this reference value. Further, the amount of change per unit time (in the illustrated example, 5 ° C./min) may be set as the reference value.

次に、レシピとして真空チャンバ内に配置されたステージ上に保持された基板を当該ステージに内蔵されたヒータを介して５００℃まで加熱する場合を例に本実施の形態の管理システムの作動を説明する。   Next, the operation of the management system according to the present embodiment will be described by taking as an example a case where a substrate held on a stage arranged in a vacuum chamber is heated to 500 ° C. as a recipe through a heater built in the stage. To do.

先ず、入力手段Ｐを介して設定波形データを入力する。この入力に際しては、上述のように、上昇波形データｕｗ、安定波形データｎｗ及び下降波形データｄｗ毎に基準値及び変化量を決定して登録手段４に登録する。これにより、図２に示すように設定波形パターンが作成される。   First, set waveform data is input via the input means P. At the time of this input, as described above, the reference value and the change amount are determined for each of the rising waveform data uw, the stable waveform data nw, and the falling waveform data dw and registered in the registration unit 4. As a result, a set waveform pattern is created as shown in FIG.

次に、当該レシピに応じたヒータの作動実行信号が制御手段２に入力されると、登録手段４に登録されたプログラムに沿ってヒータが作動する。このとき、センサ６たる熱電対より基板温度が連続して測定され、制御手段２に入力される。そして、制御手段２にて、センサ６により取得された取得波形データが設定波形データと比較され、設定された閾値を超えると、異常検知と判断される。   Next, when a heater operation execution signal corresponding to the recipe is input to the control means 2, the heater is operated in accordance with a program registered in the registration means 4. At this time, the substrate temperature is continuously measured by the thermocouple as the sensor 6 and input to the control means 2. Then, the control means 2 compares the acquired waveform data acquired by the sensor 6 with the set waveform data, and when it exceeds a set threshold value, it is determined that an abnormality has been detected.

このように本実施の形態においては、各処理装置１のレシピにそれぞれ応じた設定波形データＳＷを上昇波形データｕｗと、安定波形データｎｗ及び下降波形データｄｗとに区分し、区分された波形データ毎に取得波形データとの比較による異常検知を判断することで、レシピの数に関係なく、２個の波形データのみで各処理装置１での異常検知を集約管理できる。結果として、各レシピに応じて個別の設定波形データや閾値を設定して管理するものと比較してデータ量を少なくできる。   As described above, in the present embodiment, the set waveform data SW corresponding to the recipe of each processing apparatus 1 is divided into the rising waveform data uw, the stable waveform data nw, and the falling waveform data dw, and the divided waveform data. By determining abnormality detection by comparison with acquired waveform data every time, abnormality detection in each processing apparatus 1 can be centrally managed with only two waveform data regardless of the number of recipes. As a result, the amount of data can be reduced as compared with those in which individual set waveform data and threshold values are set and managed according to each recipe.

また、取得しようとする管理情報に応じて基準値及び変化量を入力すると、異常と判断する閾値が設定されるため、入力手段Ｐを介して設定波形データを登録手段４に登録するための作業を簡素化できる。さらに、下降波形データを更に含む構成を採用したことで、処理開始から終了までの一連の処理を集約管理でき、特に、例えば、基板加熱停止後（所定の処理終了後）に、真空計にて処理装置内の圧力を管理すれば、真空ポンプの排気能力の経時変化を知ることもできる。   In addition, when a reference value and a change amount are input according to management information to be acquired, a threshold value for determining an abnormality is set. Therefore, an operation for registering set waveform data in the registration unit 4 via the input unit P Can be simplified. Furthermore, by adopting a configuration that further includes falling waveform data, a series of processes from the start to the end of the process can be integrated and managed, for example, with a vacuum gauge after the substrate heating is stopped (after the predetermined process is completed). If the pressure in the processing apparatus is managed, it is possible to know a change with time of the exhaust capacity of the vacuum pump.

なお、本実施の形態では、処理装置１のレシピから設定波形データＳＷが上昇波形データｕｗと、安定波形データｎｗ及び下降波形データｄｗとに変化するものを例に説明したが、例えば、基板を加熱する場合に、設定温度より低い温度で所定時間だけ保持するように処理がある。このような場合には、設定温度より低い温度で保持する範囲を別の安定波形データと見做し、設定波形データを入力できるようにしておけばよい。   In the present embodiment, the setting waveform data SW changes from the recipe of the processing apparatus 1 to the rising waveform data uw, the stable waveform data nw, and the falling waveform data dw. In the case of heating, there is a process for holding for a predetermined time at a temperature lower than the set temperature. In such a case, the set waveform data may be input by regarding the range held at a temperature lower than the set temperature as another stable waveform data.

本発明の処理装置の管理システムの構成を模式的に説明する図。The figure which illustrates typically the structure of the management system of the processing apparatus of this invention. 本発明の管理システムを用いた異常検知を説明する図。The figure explaining abnormality detection using the management system of the present invention. 設定波形データの入力画面を説明する図。The figure explaining the input screen of setting waveform data. 設定波形データの設定を具体的に説明する図。The figure explaining the setting of setting waveform data concretely.

符号の説明Explanation of symbols

１ 処理装置
２ 制御手段
４ 登録手段
６ センサ
ＡＷ 取得波形データ
ＳＷ 設定波形データ
ｕｗ 上昇波形データ
ｎｗ 安定波形データ
ｄｗ 下降波形データ
Ｆ 入力フォーム


DESCRIPTION OF SYMBOLS 1 Processing apparatus 2 Control means 4 Registration means 6 Sensor AW Acquisition waveform data SW Setting waveform data uw Rising waveform data nw Stable waveform data dw Falling waveform data F Input form


Claims (2)

所定の処理を行う複数の処理装置にて行われる各処理を統括管理するための処理装置の管理システムであって、
各処理装置に設けたセンサを介して取得した管理情報の取得波形データと、取得しようする管理情報に対応して予め記憶された設定波形データとを比較し、所定の閾値を超えて設定波形データから取得波形データが逸脱すると、異常検知と判断するようにしたものにおいて、
前記設定波形データの全てが初期状態から定常状態に向う上昇波形データと定常状態たる安定波形データと定常状態から処理終了状態へ向う下降波形データとに区分され、この区分された上昇波形データ、安定波形データ及び下降波形データ毎に、取得波形データとの比較による異常検知の判断を行い、
前記上昇波形データ、安定波形データ及び下降波形データ毎に、所定の基準値とこの基準値からプロセス上許容し得る変化量が予め設定でき、取得しようとする管理情報に応じて基準値及び変化量を入力すると、異常検知を判断する閾値が設定されるようにしたことを特徴とする処理装置の管理システム。 A processing device management system for overall management of each processing performed in a plurality of processing devices that perform predetermined processing,
The acquired waveform data of the management information acquired through the sensor provided in each processing device is compared with the set waveform data stored in advance corresponding to the management information to be acquired, and the set waveform data exceeds a predetermined threshold value. When the acquired waveform data deviates from the above,
All the setting waveform data is divided into a falling waveform data toward the rising waveform data and the steady state serving stable waveform data and the steady state toward the initial state to the steady state to the processing end status, the segmented rising waveform data, stable for each waveform data and the falling waveform data, it has rows determination of the abnormality detection by comparison with the acquisition waveform data,
For each of the rising waveform data, the stable waveform data, and the falling waveform data, a predetermined reference value and a change amount allowable in the process can be set in advance from the reference value, and the reference value and the change amount are determined according to management information to be acquired. A management system for a processing apparatus, wherein a threshold value for determining abnormality detection is set when an error is input . 前記変化量を基準値に対する変化割合で設定することを特徴とする請求項１記載の処理装置の管理システム。
Management system of the processing apparatus according to claim 1, wherein setting the pre SL variation in rate of change with respect to the reference value.
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