JP5374341B2 - Manufacturing method of grinding tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a grinding tool, capable of efficiently manufacturing the grinding tool of aligning the abrasive grain tip without performing truing. <P>SOLUTION: This method of manufacturing the grinding tool is provided for manufacturing the grinding tool for grinding a work. The grinding tool of fixing an abrasive grain 14 to base metal 11 of the grinding tool by a plating layer 13, is manufactured by growing the plating layer 13 on a surface of the base metal 11 of the grinding tool, by making an electroless plating liquid 31 flow to a clearance between a die 21 and the base metal 11 of the grinding tool, by arranging the die 21 arranged with the abrasive grain 14 and the base metal 11 of the grinding tool in a plating liquid tank 32 for storing the electroless plating liquid 31, by arranging the base metal 11 of the grinding tool by opposing the die 21 and having a clearance d1 to the die 21, by arranging the abrasive grain 14 of the grinding tool on the die 21. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a method for manufacturing a grinding tool.

  BACKGROUND ART A grinding tool in which hard particles such as diamond abrasive grains and cBN (cubic boron nitride) abrasive grains are fixed to a base metal grinding part (action part) by an electrodeposition method is used for finishing a steel casting or the like.

  By the way, by aligning the abrasive grain tips, not only the dimensional accuracy and surface roughness of the workpiece (a grinding wheel when a grinding tool is used as a dresser) is improved, but the number of working abrasive grains (the abrasive grains involved in grinding) It is known that the life of the grinding tool is also improved.

  For example, as shown in FIG. 5, abrasive grains 104 fixed to a fixed plating layer 103 via a base plating layer 102 on a surface of a base 101 of the grinding tool 100, specifically, a base metal 101 of the grinding tool 100, By truing 105 with the action part 111 of the truer 110 such as a rotary dresser, the tips of the irregular abrasive grains 104 are scraped off to align the abrasive grain tips. When this method is used, the abrasive grain tip 105a becomes flat (broken state) like the abrasive grain 105, and the sharpness falls. When the abrasive grains 104 and 105 of the grinding tool 100 are diamond, the working part (diamond abrasive grains) 111 of the truer is heavily worn, and much time and cost are required for truing.

  In order to solve such a problem, various grinding tool manufacturing methods have been developed in which the truing process is omitted. For example, in Patent Document 1, a low melting point alloy layer and a platinum plating layer are sequentially formed on a tooth surface of a base metal, and then a space formed by melting and removing the low dielectric alloy layer is filled with abrasive grains. A method for manufacturing a dress gear is disclosed in which abrasive grains are bonded to a tooth surface by electroplating, and then the platinum plating layer is removed to align the tips of the abrasive grains.

Japanese Patent Laid-Open No. 06-106481 (see, for example, paragraphs [0014] to [0019], [FIG. 7], [FIG. 9], [FIG. 10], etc.)

  However, in the dress gear manufacturing method disclosed in Patent Document 1, the current density is not uniform over the entire surface of the base plating, and the growth rate of the fixed plating varies, and the base metal and the platinum electrode are short-circuited. There was a possibility. Since the base metal and the platinum electrode are arranged close to each other, there is a possibility that the base metal and the platinum electrode may be short-circuited due to a shift of the base metal or a foreign substance of a conductor mixed in the plating solution. It was. Therefore, a great deal of work is required, such as observation of the fixed plating layer, fixing of the base metal, and removal of foreign substances from the conductor in the plating solution.

  In view of the above, the present invention has been made to solve the above-described problems, and a grinding tool manufacturing method capable of efficiently manufacturing a grinding tool in which the abrasive grain tips are aligned without truing. The purpose is to provide.

A manufacturing method of a grinding tool according to the first invention for solving the above-described problem is as follows.
Place the abrasive grains of the grinding tool to grind the workpiece on the mold,
The base of the grinding tool is arranged with a gap with respect to the mold and facing the mold,
The mold in which the abrasive grains are arranged and the base metal are arranged in a plating solution tank in which an electroless plating solution is stored,
A method for producing a grinding tool for producing a grinding tool in which the electroless plating solution is poured into the gap, a plating layer is grown on the surface of the base metal, and the abrasive grains are fixed to the base metal by the plating layer. And
When the plating layer is grown on the surface of the base metal, the gap is enlarged after a predetermined time has elapsed .

A manufacturing method of a grinding tool according to the second invention for solving the above-described problem is as follows.
A manufacturing method of a grinding tool according to a first invention,
As the base metal, a base metal surface treated with a base plating is used.

A method for manufacturing a grinding tool according to the third invention for solving the above-described problem is as follows.
A manufacturing method of a grinding tool according to the first or second invention,
The mold is characterized in that an adhesive is applied to the surface of the mold.

A method for manufacturing a grinding tool according to the fourth invention for solving the above-described problem is as follows.
A grinding tool manufacturing method according to any one of the first to third inventions,
The gap is adjusted with a spacer or a support.

  According to the method for manufacturing a grinding tool according to the present invention, by manufacturing the grinding tool according to the above-described procedure, it is possible to efficiently manufacture a grinding tool in which the abrasive grain tips are aligned without truing.

It is a figure for demonstrating the procedure of the manufacturing method of the grinding tool which concerns on 1st embodiment of this invention, Comprising: A pre-processing process is shown to Fig.1 (a), a preparatory process is shown to FIG.1 (b), 1 (c) shows a first abrasive grain fixing process, and FIG. 1 (d) shows a second abrasive grain fixing process. It is II-II arrow sectional drawing in FIG.1 (b). It is a figure for demonstrating an example of the 1st abrasive grain fixation processing process. It is the schematic of a grinding tool, Comprising: The front surface is shown to Fig.4 (a), the back surface is shown in FIG.4 (b), and the side surface is shown in FIG.4 (c). It is a figure for demonstrating the process of truing the abrasive grain of the conventional grinding tool with a dresser, Comprising: The outline is shown to Fig.5 (a), FIG.5 (b) shows the surrounding line V in Fig.5 (a). Indicates enlargement.

  The manufacturing method of the grinding tool which concerns on this invention is demonstrated concretely in 1st and 2nd embodiment.

[First embodiment]
A method for manufacturing a grinding wheel according to the first embodiment of the present invention will be described in detail with reference to FIGS. 1 and 2.

First, as shown in FIG. 1A, a base 11 of a grinding tool and a mold 21 on which abrasive grains 14 of a grinding tool to be described later can be mounted in a predetermined arrangement state are prepared. On the surface 21 a of the mold 21, a plurality of abrasive grains 14 are arranged in a single layer instead of a plurality of layers.

  Here, as the base metal 11, a pretreatment (alkali cleaning, electrolytic cleaning, acid cleaning, base plating process) that has been performed in advance and the base plating layer 12 is formed on the surface 11 a of the base metal 11 is used. Examples of the material of the base plating layer 12 include nickel plating produced by an electroplating method. Thereby, the fixed plating layer 13 to be described later can be efficiently grown on the surface 12a of the base plating layer 12. In addition, it is also possible to use the base metal 11 that is not subjected to the base plating process on the surface 11a of the base metal 11, and in this case, a plating resist is applied to a place not subjected to the fixed plating process described later Can be used.

  A mold 21 having a surface 21a precisely machined into a required shape is used. Adhesion having a weaker adhesive force than the force of temporarily fixing the abrasive grains 14 to the surface 21a (surface on which the abrasive grains 14 are disposed) of the mold 21 and fixing the abrasive grains 14 to the base metal 11 by the fixed plating layer 13 described later. It is also possible to apply an agent, such as an epoxy thermosetting resin. Thereby, a plurality of abrasive grains 14 can be reliably mounted in one layer instead of a plurality of layers, and in the process of growing the fixed plating layer 13 described later, the abrasive grains are caused by the flow of the electroless plating solution 31. 14 can be prevented from shifting. Examples of the material of the mold 21 include a material that forms a nonconductive film and is difficult to be electrolessly plated, such as SUS304.

  Subsequently, the surface 21 a on which the abrasive grains 14 are disposed on the mold 21 and the surface 12 a on which the base plating layer 12 is applied to the base metal 11 are disposed to face each other, and the surface 21 a of the mold 21 and the base metal 11 are arranged. A predetermined distance d1, for example, a total of 50 μm added to the average particle diameter of the abrasive grains 14 (average particle diameter of the abrasive grains 14 +50 μm) is arranged apart from the surface 12a of the base plating layer 12. As a method of arranging the mold 21 and the base metal 11 in this way, for example, as shown in FIG. 2, a method of inserting a spacer 15 corresponding to the size of the required gap between the base metal 11 and the mold 21, For example, a method of supporting the base metal 11 in a plating bath 32 described later with a support member may be used. Examples of the spacer 15 include a material made of a nonconductive film that is difficult to be electrolessly plated, such as SUS304. Thereby, the adjustment of the size of the gap becomes unnecessary, and the work efficiency is improved accordingly.

  Subsequently, the mold 21 and the base metal 11 arranged in the above-described positional relationship are arranged in the plating solution tank 32 in which the electroless plating solution 31 is stored. Examples of the electroless plating solution 31 include Ni alloy electroless plating such as Ni-P and Ni-B.

  Subsequently, the electroless plating solution 31 is forced to flow through the gap between the mold 21 and the base 11. For example, in FIG. 1 (c), on the left side in the figure, from the direction indicated by the arrow F11 to the right side in the figure, it flows through the gap between the base metal 11 and the mold 21, and on the right side in the figure. Then, the metal is circulated in the direction indicated by the arrow F12 from the gap between the base metal 11 and the mold 21 to the outside. At this time, the flow rate of the electroless plating solution 31 between the base plating layer 12 of the base metal 11 and the surface 21a of the mold 21 is a speed in the range of 0.5 m / s or less faster than the average flow rate of 0 m / s. Thus, the fixed plating layer 13 can be grown only on the surface 12 a of the base plating layer 12 of the base metal 11. This is because if the flow rate of the electroless plating solution 31 is higher than 0.5 m / s, the growth of the fixed plating layer by the electroless plating solution 31 is hindered. Examples of means for forcibly circulating the electroless plating solution 31 include a pump. In the first and second abrasive grain fixing treatment steps described later, the electroless plating solution 31 is circulated on the surface 12 a of the base plating layer 12 of the base metal 11.

  The fixed plating layer 13 grows and reaches the abrasive grains 14, and further the fixed plating layer 13 grows and the abrasive grains 14 are filled with the fixed plating layer 13 by about 10% (first abrasive grain fixing treatment step). When the abrasive grains 14 are filled with the fixed plating layer 13 as described above, the mold 21 is moved away from the base 11, where it is taken out from the plating solution tank 32 and the fixed plating layer 13 is subsequently grown ( Second abrasive grain fixing process). In other words, when the fixed plating layer 13 is grown on the surface of the base metal 11, the gap is enlarged after a predetermined time has elapsed, and the fixed plating layer 13 is continuously grown in this state. Thereby, the fall of the growth rate of the fixed plating layer 13 can be suppressed. When the abrasive grains 14 are buried in the fixed plating layer 13 by about 60%, the base metal 11 is taken out from the plating solution tank 32 and the base metal 11 is washed to complete a grinding tool (grinding grindstone).

  By manufacturing the grinding tool according to the above-described procedure, a plurality of abrasive grains 14 are arranged in advance in one layer on the surface 21a of the mold 21, and the grinding tool is opposed to the mold 21 and has a gap with respect to the mold 21. The base metal 11 is disposed, the mold 21 on which the abrasive grains 14 are disposed, and the base metal 11 are disposed in the plating solution tank 32 in which the electroless plating solution 31 is stored, and the electroless plating solution is allowed to flow through the gap. In this state, a fixed plating layer 13 is grown on the surface 12a of the base plating layer 12 of the base metal 11, and a grinding tool in which the abrasive grains 14 are fixed to the base metal 11 of the grinding tool by the fixed plating layer 13 is manufactured. Become. Thereby, the protrusion amount of the abrasive grain 14 fixed to the base metal 11 is made uniform. As a result, after the abrasive grains 14 are fixed to the base metal 11, it is not necessary to perform a truing operation for uniforming the protruding amount of the abrasive grains. When the fixed plating layer 13 for fixing the abrasive grains 14 to the base metal 11 is grown, since the method by electroplating is not used, the work for preventing the short circuit such as the prevention of mixing of the conductor into the plating solution is performed. There is no need to do it. In this way, the work is reduced, and the grinding tool can be manufactured efficiently correspondingly.

[Second Embodiment]
The manufacturing method of the grinding tool which concerns on 2nd embodiment of this invention is demonstrated concretely with reference to FIG. 3 and FIG.
This embodiment demonstrates the case where it applies to the grinding wheel provided with the grinding | polishing part in the edge part vicinity of both the side parts by the disk-shaped base metal as a grinding tool. Moreover, in this embodiment, only the 1st abrasive grain fixing process process in 1st embodiment mentioned above is changed.

  In the present embodiment, in the first abrasive grain fixing process, the mold 61 on which the abrasive grains 58 of the base 51 of the grinding tool can be mounted in a predetermined arrangement state, and the mold 61 has a predetermined gap. Then, a support 70 for supporting the base 51 of the grinding tool on the mold 61 is used.

  The upper surface 61 a of the mold 61 is formed in a shape having a surface facing the base 51 of the grinding tool, and includes a flat part 62 at the center and an inclined part 63 continuous with the flat part 62. The inclined portion 63 fixes the base metal 51 to the support tool 70, and when the support tool 70 is fixed to the mold 61, a predetermined size between the base metal 51 and the inclined portion 56, for example, abrasive grains 58. The average particle size is 50 μm plus the average particle size (average particle size of abrasive grains 58 +50 μm). The mold 61 is provided with a fixing hole 64 into which a fixing part 72 of the support tool 70 described later can be inserted, and a communication hole 65 that allows the flat part 62 and the side part 61b of the mold 61 to communicate with each other. One opening 65 b of the communication hole 65 is connected to the pump 91 through a pipe 92. A discharge pipe 93 is connected to the pump 91. As a result, the electroless plating solution 31 circulates through the communication hole 65, the pipe 92, the pump 91, and the discharge pipe 93.

  The support tool 70 includes a support part 71 and a fixing part 72. The support portion 71 is formed in a flat plate shape along one side portion 51 a of the base metal 51. The fixed portion 72 is continuous with the support portion 71 and formed in a shaft shape.

  Prior to the first abrasive grain fixing treatment step, the plurality of abrasive grains 58 are arranged on the inclined portion 63 of the mold 61 in a state where the plurality of abrasive grains 58 are arranged in a single layer without being stacked.

  In the first abrasive grain fixing process, first, the base 51 of the grinding tool is fixed to the support portion 71 of the support 70 by the fasteners 80 of the bolts 81 and the nuts 82.

  Subsequently, the fixing portion 72 of the support tool 70 is inserted into the fixing hole 64 of the mold 61, and the base metal 51 is supported by the mold 61 via the support tool 70. As described above, since the position (height) of the base 51 is adjusted in advance by the support tool 70, the size between the inclined portion 56 on the side 51 b side of the base 51 and the inclined portion 63 of the die 61. There is no need to adjust the height. In addition, the some abrasive grain 58 can also be arrange | positioned as needed in the edge part 51c vicinity of the edge part 51c of the base 51 of a grinding tool, and the other side part 51a.

  In the state described above, the electroless plating solution 31 is circulated by the pump 91 between the inclined portion 56 of the base metal 51 and the inclined portion 63 of the die 61. Thereby, the fixed plating layer grows, and the plurality of abrasive grains 58 can be fixed to the inclined portion 63 of the base metal 61 in a state where the plurality of abrasive grains 58 are arranged in a single layer without being stacked. . Subsequently, the fixed plating layer is grown, and after a predetermined time has elapsed, the mold 61 is removed from the plating solution tank 32 to increase the gap, and the fixed plating layer is further grown. By taking out and cleaning the base metal 51, as shown in FIG. 4, it is possible to easily manufacture the grinding tool 50 including the abrasive part 59 in which the abrasive grains 58 are fixed in the vicinity of the edge part. Further, since the base metal 51 is fixed to the mold 61 by the support tool 70, the base metal 51 of the grinding tool and the mold 61 can be aligned with high accuracy.

  The method for manufacturing a grinding tool according to the present invention is useful for the machine tool industry because a grinding tool having a uniform abrasive grain tip can be efficiently manufactured without truing.

11 Base Metal 12 Base Plating Layer 13 Fixed Plating Layer 14 Abrasive Grain 21 Type 31 Electroless Plating Solution 32 Plating Solution Tank 50 Grinding Tool 51 Base Metal 61 Type 70 Supporting Tool 80 Fastener 91 Pump 100 Grinding Tool 101 Base Metal 102 Base Plating Layer 103 Fixed plating layer 104 Abrasive grain 106 Grinding part 110 Truer 111 Action part

Claims (4)

Place the abrasive grains of the grinding tool to grind the workpiece on the mold,
The base of the grinding tool is arranged with a gap with respect to the mold and facing the mold,
The mold in which the abrasive grains are arranged and the base metal are arranged in a plating solution tank in which an electroless plating solution is stored,
A method for producing a grinding tool for producing a grinding tool in which the electroless plating solution is poured into the gap, a plating layer is grown on the surface of the base metal, and the abrasive grains are fixed to the base metal by the plating layer. And
The method for manufacturing a grinding tool , wherein, when the plating layer is grown on the surface of the base metal, the gap is enlarged after a predetermined time has elapsed . It is a manufacturing method of the grinding tool according to claim 1,
A method for manufacturing a grinding tool, wherein the base metal is a base metal whose surface is treated with a base plating. A method for producing a grinding tool according to claim 1 or 2,
A method for manufacturing a grinding tool, wherein the mold is a mold whose surface is coated with an adhesive. It is a manufacturing method of the grinding tool given in any 1 paragraph of Claims 1 thru / or 3 ,
The said clearance gap is adjusted with a spacer or a support tool, The manufacturing method of the grinding tool characterized by the above-mentioned.

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