JP5361036B2 - Position adjusting device and emission spectroscopic analyzer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a position adjusting device capable of easily performing the adjustment of a position, and to provide an emission spectral analyzer. <P>SOLUTION: Adjusting mark projecting parts 12b and 12c project adjusting pointers 14b and 14c at positions near the reference point P, displayed by a reference point pointer 13 as the position in the Z-direction of the surface 3a of an object 3 to be measured, is located near the focal position of a laser beam. Accordingly, it can indicate whether the position of the surface 3a in the Z-direction coincides with the focal position of the laser beam, depending on whether the crossing point of two adjusting pointers 14 coincides with the reference point P. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a position adjusting device and an emission spectroscopic analyzer, and more particularly to a position adjusting device and an emission spectroscopic analyzer that can easily adjust the position.

  2. Description of the Related Art An emission spectroscopic analysis apparatus that identifies elemental components and concentrations in an object to be measured by irradiating the object to be measured with laser light, converting it into plasma, and measuring element-specific light emission generated in the plasma is known. . According to such an emission spectroscopic analyzer, for example, the element can be quantitatively analyzed from the intensity of the spectrum (luminance spectrum) appearing in the emission spectrum.

  FIG. 7 is a diagram schematically showing a relationship between laser light irradiation and plasma generated by the laser light irradiation in a conventional emission spectroscopic analyzer. As shown in FIG. 7, in the conventional emission spectroscopic analysis apparatus, the laser light 100 emitted from the light source is condensed by the lens 102 and guided to the measured part 104.

  Here, as shown in FIG. 7A, if the focal position of the laser beam condensed by the lens 102 and the surface position of the object 104 to be measured match, the laser beam is intensively irradiated, A sufficiently large plasma 105 can be generated on the surface of the object 104 to be measured. On the other hand, as shown in FIG. 7B, if the surface of the object 104 to be measured is separated from the focal position of the laser beam, the energy of the laser beam is dispersed and a sufficiently large plasma 105 is generated. I can't.

Therefore, Patent Document 1 discloses an analyzer configured to be able to monitor a laser irradiation position using a CCD camera. In this way, the operator can work while visually recognizing the plasma emission shape, and the measurement reliability can be improved.
JP 2004-226252 A

  However, in the technique disclosed in Patent Document 1 described above, the operator himself / herself must determine whether or not the plasma emission shape is in a correct state, and an inexperienced operator makes an accurate adjustment. There was a problem that it was difficult.

  Note that analyzers and measuring devices that require accurate alignment of the inspection object are not limited to emission spectroscopic analyzers, and there are a wide variety. For example, a spectroscopic analyzer such as an infrared spectroscopic analyzer and a spectrofluorometer, a fluorescent X-ray analyzer, and an X-ray diffractometer can be used. Furthermore, by analyzing image data obtained by photographing the inspection object with a camera or the like, the inspection object is accurately aligned even in an analysis apparatus or a measurement apparatus that analyzes the physical properties of the inspection object. Is required.

  There are many devices that require alignment of an object in addition to an analysis device and a measurement device. For example, in various processing apparatuses such as a laser processing apparatus, it may be required to accurately align a processing object. Even in these various apparatuses that require alignment, there is a problem that it is difficult for an operator with little experience to perform accurate alignment, as in the above-described analysis apparatus.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a position adjusting device and an emission spectroscopic analyzer that can easily adjust the position.

In order to achieve this object, the position adjusting device according to claim 1 includes a reference point indicating means for indicating a predetermined reference point on the adjustment target surface, and the adjustment target surface in the first direction intersecting the adjustment target surface. position is closer to the default position, in a position closer to the reference point which is marked by the reference point indication means, and an adjustment mark projection means for projecting the adjustment marks of the linear, the adjustment mark projection means Projects the linear adjustment mark onto the reference point indicated by the reference point indicating means in a state where the predetermined position and the first direction position of the reference point on the adjustment target surface coincide with each other. A direction oblique to the plane parallel to the longitudinal direction of the line-shaped adjustment mark projected through the reference point and having the first direction as a normal line, and the first direction. Lay going to Jo of light, by irradiating toward the adjustment target surface, and characterized in that projecting the adjustment marks of the line-shaped.

Position adjustment device according to claim 2, wherein, in the position adjusting device according to claim 1, wherein the adjustment marks projecting means for projecting at least two linear adjustment marks crossing each other to the adjustment target surface When the first direction position of the reference point on the adjustment target surface coincides with the predetermined position, the at least two line-shaped adjustment marks intersect at the reference point.

Position adjustment device according to claim 3, wherein, in the position adjusting device according to claim 1 or 2, wherein said reference point indication means, the cross-shaped marking marks the intersection of the reference point on the adjustment target surface, the adjustment It projects on a target surface, It is characterized by the above-mentioned.

The emission spectroscopic analyzer according to claim 4 irradiates the object to be measured with laser light, converts the component contained in the object to be measured into plasma, and analyzes the component contained in the object to be measured. And a position adjusting device according to any one of claims 1 to 3, a laser light source that emits laser light, and a light guide optical system that guides the laser light from the laser light source to an object to be measured. The adjustment target surface is a surface of the object to be measured .

  According to the position adjustment apparatus of the first aspect, the adjustment mark projecting unit projects the adjustment mark at a position closer to the reference point as the position of the adjustment target surface in the first direction is closer to the predetermined position. Therefore, the adjustment target surface in the first direction is adjusted by adjusting the positional relationship between the first direction position of the adjustment target surface and the predetermined position so that the adjustment mark projected on the adjustment target surface approaches the reference point. Can be brought close to the default position. Further, the adjustment target surface in the first direction is adjusted by adjusting the positional relationship between the first direction position of the adjustment target surface and the predetermined position so that the adjustment mark projected on the adjustment target surface is away from the reference point. Can be separated from the default position. Therefore, there is an effect that the position can be easily adjusted using the adjustment mark as a mark.

Further, according to the position adjusting device according to claim 1, and already fixed position, a first direction positions of the reference points on the adjusted surface in matching condition, adjustment marks are projected on the reference point. Therefore, the first direction position and the default position of the adjustment target surface can be easily adjusted by adjusting the position between the first direction position and the default position of the adjustment target surface so that the adjustment mark is projected onto the reference point. This has the effect that can be matched.

Furthermore, according to the position adjusting device according to claim 1, as adjustment marks of the line-like passes through the reference point, adjusts the positional relationship between the first direction position and the default position of the adjustment target surface, facilitating that With the simple operation, there is an effect that the first direction position of the adjustment target surface can be matched with the predetermined position.

In addition, according to the position adjusting device according to claim 1, before Symbol adjustment marks projecting means, relative to a plane parallel to the longitudinal direction and the first direction of adjustment marks projected on the adjustment target surface By projecting the line-shaped light traveling in an oblique direction toward the adjustment target surface, the line-shaped adjustment mark is projected, and therefore the projection position of the line-shaped mark is in the first direction. This is in accordance with the position of the adjustment target surface. Therefore, there is an effect that how much the position of the adjustment target surface in the first direction is deviated from the predetermined position can be expressed by the positional relationship between the reference point and the line-shaped adjustment mark.

According to the position adjusting device according to claim 2, in addition to the effects of the position adjusting device according to claim 1, wherein, when the first direction position of the reference point in the adjustment target surface and the default position coincides, at least two Since the line-shaped adjustment marks intersect at the reference point, there is an effect that it is possible to visually recognize whether or not the position in the first direction of the adjustment target surface matches the predetermined position.

According to the position adjusting device of the third aspect , in addition to the effect produced by the position adjusting device according to the first or second aspect, the reference point marking means is a cross-shaped having the reference point on the adjustment target surface as an intersection. Since the marking mark is projected onto the adjustment target surface, there is an effect that the reference point can be displayed in a visually easy-to-understand manner.

According to the emission spectroscopic analysis apparatus of claim 4 , in addition to the effect produced by the position adjustment apparatus of claim 1 or 3, the adjustment mark projecting means has the position of the adjustment target surface in the optical axis direction of the laser light, The closer to the focal position of the laser beam guided by the light guide optical system, the more the adjustment mark is projected at a position closer to the reference point marked by the reference point marking means. Therefore, the laser beam can be easily adjusted by adjusting the positional relationship between the position in the optical axis direction of the object to be measured and the focal position of the laser beam so that the adjustment mark projected on the adjustment target surface approaches the reference point. The position of the surface to be adjusted in the direction of the optical axis can be brought close to the focal position of the laser beam, and the position can be adjusted easily. In addition, when the adjustment target surface is intentionally shifted from the focus position of the laser beam to reduce the density of the laser beam irradiated to the investigation target surface, the measurement target is set so that the adjustment mark is shifted from the reference point. Since the positional relationship between the position of the object in the optical axis direction and the focal position of the laser beam may be adjusted, the position can be easily adjusted in this case as well.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a block diagram showing a schematic configuration of an emission spectroscopic analysis apparatus 1 which is a first embodiment of a position adjusting apparatus and an emission spectroscopic analysis apparatus of the present invention.

  FIG. 1 is a diagram showing a schematic configuration of an emission spectroscopic analysis apparatus 1 according to the first embodiment. The emission spectroscopy analyzer 1 is an emission analysis device using a laser microprobe emission analyzer (LMA), which irradiates a measurement object 3 with a laser beam, and converts components contained in the measurement object 3. It is an apparatus that can measure the content of the component to be measured contained in the DUT 3 by converting it into plasma and analyzing it. In particular, the emission spectroscopic analysis apparatus 1 of the present embodiment is configured so that the position of the object to be measured 3 can be easily adjusted.

  As shown in FIG. 1, an emission spectroscopic analysis apparatus 1 includes a laser oscillator 2 that emits laser light, an objective lens 4 that guides laser light from the laser oscillator 2 to an object 3 to be measured, and a target that has received the laser light. A condenser lens 6 that condenses plasma light emitted from the plasma 5 generated by the measurement object 3, and a spectrometer 8 that measures the plasma light collected by the condenser lens 6 and outputs the spectrum to the computer 10. The measurement result of the device under test 3 based on the gate controller 9 for controlling the timing at which the laser oscillator 2 outputs the laser light and the timing at which the spectrometer 8 measures the plasma light, and the spectrum input from the spectrometer 8 The computer 10 that calculates and displays the value, the stage 11 that holds the object 3 to be measured, and the pointer projection unit that projects the alignment pointer onto the surface 3a of the object 3 to be measured. And a Tsu door 12.

  When a laser control signal is input from the gate controller 9 described later, the laser oscillator 2 outputs, for example, YAG laser light having a laser energy of 30 mJ and a pulse width of 10 ns. The objective lens 4 is a lens for condensing the laser beam output from the laser oscillator 2 and irradiating the object 3 to be measured. In the present embodiment, a direction parallel to the optical axis L of the laser light guided by the objective lens 4 is referred to as a Z direction.

  When the device under test 3 receives the laser beam condensed by the objective lens 4, a part of the surface 3 a of the device under test 3 is evaporated and excited to generate plasma 5. The plasma 5 starts recombination with the end of the laser beam irradiation, and the constituent element of the object 3 to be measured becomes an atom in an excited state for several μs to several tens of μs, and this atom in the excited state is at a lower level. At the time of transition, plasma light proportional to the number of atoms is emitted. That is, each atom emits plasma light having a specific wavelength. Therefore, by measuring the intensity of the plasma light emitted from the plasma 5 at a predetermined wavelength, the content of the target component to be measured is obtained. be able to.

  The condensing lens 6 is a lens for condensing the plasma light of the plasma 5 generated by the DUT 3 and inputting it to the spectroscope 8. The condensing lens 6 is focused on a portion off the primary plume 5a. Rather than focusing the primary plume 5a and condensing the plasma light, focusing the plasma light on the part out of the primary plume 5a suppresses measurement noise measured by the spectroscope 8. Therefore, it is possible to measure with high accuracy.

  The spectroscope 8 measures the plasma light collected by the condenser lens 6 when a measurement control signal is input from a gate controller 9 described later, and generates a spectrum of the measured plasma light. The spectroscope 8 outputs the generated spectrum to the computer 10. In the computer 10, the content of the measurement target component is calculated using the spectral line intensity value of the spectrum input from the spectroscope 8.

  When a trigger signal is input from the computer 10 to be described later, the gate controller 9 outputs a laser control signal for instructing the start of laser beam output to the laser oscillator 2, and also measures a measurement time zone for measurement of plasma light (measurement start) A measurement control signal that defines a timing and a measurement time width is output to the spectrometer 8.

  The stage 11 has a table for placing the object 3 to be measured and a Z-direction transport motor (not shown) for transporting the table in the Z direction, and a position control command input from the personal computer 10. Accordingly, the table can be moved to an arbitrary position in the Z direction. That is, the DUT 3 also moves with the movement of the table. Therefore, the surface of the object to be measured 3 is adjusted by appropriately adjusting the position of the stage 11 so that the position of the surface 3a of the object to be measured 3 in the Z direction matches the focal position of the laser light guided by the objective lens 4. The laser beam 3a is intensively irradiated to generate a sufficiently large plasma 5 to realize a highly accurate analysis.

  The pointer projection unit 12 is for projecting a positioning pointer onto the surface 3 a of the object to be measured 3. Although details of the pointer projection unit 12 will be described later with reference to FIG. 2, the pointer projection unit 21 of the present embodiment is configured to irradiate pointer light for projecting the pointer onto the surface 3a from three directions. Is done. However, in order to avoid complication of the drawing, only pointer light emitted from one direction is shown in FIG.

  FIG. 2 is a diagram schematically showing the relationship between the pointer projection unit 12 and the pointer projected onto the surface 3 a of the object 3 to be measured by the pointer projection unit 12. In particular, FIG. 2A is a perspective view and a top view showing a state in which the position of the surface 3a in the Z direction and the focal position of the laser light coincide with each other, and FIG. It is the perspective view and top view which show the state where the position of the surface 3a and the focus position of a laser beam do not correspond. In the present embodiment, one direction perpendicular to the Z direction is referred to as an X direction, and a direction perpendicular to the Z direction and the X direction is referred to as a Y direction.

  As shown in FIG. 2, the pointer projection unit 12 is provided with a marking mark projection unit 12a composed of a red semiconductor laser light source and adjustment mark projection units 12b and 12c also composed of a red semiconductor laser light source. .

  The marking mark projection unit 12a projects the point-like reference point pointer 13 onto the surface 3a by irradiating the pointer light 15 toward the surface 3a of the object 3 to be measured. Here, the pointer light 15 irradiated by the marking mark projection unit 12 a is adjusted in advance so that the optical axis thereof coincides with the laser light for plasma generation collected by the objective lens 4.

  Therefore, the reference point pointer 13 projected onto the surface 3a by the pointer light 15 is projected onto a point P (hereinafter referred to as the reference point P) to which the laser light condensed by the objective lens 4 is irradiated. As shown in FIGS. 2A and 2B, the reference point pointer 13 is always projected onto the reference point P regardless of the position of the surface 3a in the Z direction, and indicates the reference point P. Therefore, the user can easily know the laser irradiation position on the surface 3 a by the reference point pointer 13. Accordingly, by appropriately adjusting the X direction position or the Y direction position of the measurement object 3 so that the reference point pointer 13 is projected, the measurement object 3 can be aligned with the irradiation position of the laser beam. Further, if the pointer light 15 is irradiated in a state where the DUT 3 is not placed, the reference point pointer 13 is projected on the stage 11, so the user can project the projection position of the reference point pointer 13. What is necessary is just to mount the to-be-measured object 3 on top.

  In addition, while the laser beam for plasma generation is emitted from the laser oscillator 2, the marking mark projection unit 12a is configured to be retracted from the optical path of the laser beam. In this way, it is possible to suppress the marking mark projection unit 12a from being shaded during laser light irradiation.

  The adjustment mark projection unit 12b projects the line-shaped adjustment pointer 14b onto the surface 3a by irradiating the surface 3a with the line-shaped pointer light 16b whose longitudinal direction is the X direction. The adjustment mark projection unit 12c projects the line-shaped adjustment pointer 14c onto the surface 3a by irradiating the surface 3a with the line-shaped pointer light 16c whose longitudinal direction is the Y direction. Therefore, two adjustment pointers 14b and 14c that intersect each other are projected onto the surface 3a.

  As shown in FIG. 2 (a), the adjustment mark projections 12b and 12c have two adjustment pointers 14b in a state where the Z-direction position of the reference point P on the surface 3a coincides with the focal position of the laser beam. , 14c project the adjustment pointers 14b, 14c so that the two adjustment pointers 14b, 14c intersect at the reference point P indicated by the reference point pointer 13, respectively. To do.

  That is, depending on whether or not the intersection of the two adjustment pointers 14b and 14c and the reference point P coincide with each other, whether or not the Z-direction position of the surface 3a coincides with the focal position of the laser beam is controlled. Can be visually recognized clearly.

  Then, the adjustment mark projection units 12b and 12c project the adjustment pointers 14b and 14c at positions farther from the reference point P as the position in the Z direction of the surface 3a is further away from the focal position of the laser beam. In other words, as the position of the surface 3a in the Z direction and the focal position of the laser beam are closer, the adjustment marks 14b and 14c are closer to the reference point P indicated by the reference point pointer 13 than the adjustment mark 14b. , 14c.

  Therefore, for example, by adjusting the position of the stage 11 in the Z direction so that the intersection of the adjustment pointers 14b and 14c approaches the reference point P, the position of the surface 3a in the Z direction and the focal position of the laser light are made closer. Can do. Therefore, for example, even an inexperienced worker can easily adjust the position using the adjustment pointers 14b and 14c as marks. That is, the position of the surface 3a in the Z direction and the focal position of the laser beam can be matched by an easy operation of adjusting the position so that the intersection of the adjustment pointers 14b and 14c is projected onto the reference point P. it can. Depending on the type of element to be measured, it may be preferable to deviate the surface 3a from the focal position of the laser beam and reduce the density of the laser beam irradiated to the surface 3a. Even in such a case, according to the emission spectroscopic analysis apparatus 1 of the present embodiment, the user adjusts the position so that the intersection of the adjustment pointers 14b and 14c deviates from the reference point P, so that the user has an appropriate positional relationship. Can be determined.

  FIG. 3 is a diagram schematically showing the relationship between the traveling direction of the pointer light 16b irradiated by the adjustment mark projection unit 12b and the adjustment pointer 14b projected by the pointer light 16b. ) Is a diagram showing a state in which the position of the surface 3a in the Z direction and the focal position of the laser beam coincide with each other, and FIG. 3 (b) shows a mismatch between the position of the surface 3a in the Z direction and the focal position of the laser beam. It is a figure which shows the state which is. As described with reference to FIG. 2, the emission spectroscopic analyzer 1 projects the two adjustment pointers 14b and 14c onto the surface 3a by the adjustment mark projection unit 12b and the adjustment mark projection unit 12c. However, in order to make the drawings easier to see and understand, the illustration of the adjustment mark projection unit 12c and the adjustment pointer 14c is omitted in FIGS. 3 (a) and 3 (b). doing.

  3A and 3B show a plane 17 for explaining the traveling direction of the pointer light 16b. As shown in FIGS. 3A and 3B, the plane 17 is a plane parallel to the longitudinal direction and the Z direction of the adjustment pointer 14b projected by the pointer light 16b. The plane 17 is a virtual plane assumed for explaining the characteristics of the direction of travel of the pointer light 16 and does not need to be physically provided in the emission spectroscopic analyzer 1.

  As shown in FIGS. 3A and 3B, the adjustment mark projection unit 12b of the present embodiment is a pointer light that travels in an oblique direction (that is, non-parallel to the plane 17) with respect to the plane 17. 16b is irradiated.

  In this way, the line-shaped adjustment pointer 14b is projected onto the intersection line between the surface made of the pointer light 16b traveling in the oblique direction and the surface 3a. Therefore, if the position of the surface 3a in the Z direction changes, the projection position of the adjustment pointer 14b on the surface 3a changes accordingly.

  For example, when the position of the surface 3a in the Z direction coincides with the focal position of the laser beam, the adjustment pointer 14b is projected onto the reference point P as shown in FIG. On the other hand, the farther the position of the surface 3a in the Z direction is from the focal position of the laser light, the farther the adjustment pointer 14b on the surface 3a is from the reference point P, as shown in FIG.

  As described above, according to the emission spectroscopic analysis apparatus 1 of the present embodiment, the position of the reference point P and the adjustment pointer 14b indicates how much the position in the Z direction of the surface 3a is shifted from the focal position of the laser beam. It can be expressed as a relationship.

  Further, according to the emission spectroscopic analysis apparatus 1 of the present embodiment, the projection position of the adjustment pointer 14b changes according to the position of the surface 3a in the Z direction. The adjustment pointer 14b is distorted according to the shape. On the other hand, when the surface 3a is completely flat and the surface 3a is parallel to the XY plane, the adjustment pointer 14b is projected as a straight line parallel to the X direction. Although not shown in FIG. 3, the adjustment pointer 14c is also projected as a straight line parallel to the Y direction.

  FIG. 4A is a diagram showing adjustment pointers 14b and 14c projected on the surface 3a and the stage 11 when the surface 3a is parallel to the XY plane. As shown in FIG. 4A, when the surface 3a is parallel to the XY plane, the adjustment pointer 14b is parallel to the X direction and the adjustment pointer 14c is parallel to the Y direction. , 14c intersect each other vertically on the surface 3a.

  FIG. 4B is a side view and a top view showing the DUT 3 when the surface 3a is inclined with respect to the XY plane. As described above, the projection positions of the adjustment pointers 14b and 14c vary according to the Z direction position of the surface 3a. Therefore, when the surface 3a is inclined as shown in FIG. 4B, the adjustment pointer 14c projected onto the surface 3a has an inclination with respect to the X direction.

  As a result, as shown in FIG. 4B, the adjustment pointers 14b and 14c projected on the surface 3a do not intersect vertically. As described above, according to the emission spectroscopic analysis apparatus 1 of the present embodiment, whether or not the surface 3a is a plane parallel to the XY plane is determined based on whether or not the adjustment pointers 14b and 14c intersect each other vertically. Can be represented. Further, the user changes the inclination of the object 3 to be measured, for example, by changing the angle of the stage 11 while looking at the adjustment pointers 14b and 14c, so that the surface 3a becomes parallel to the XY plane. Can be adjusted.

  Next, with reference to FIG. 5, the emission spectroscopic analyzer 1 of the second embodiment will be described. In the emission spectroscopic analysis apparatus 1 according to the first embodiment described above, the reference point pointer 13 projected by the marking mark projection unit 12a on the surface 3a is point-like. In contrast, in the emission spectroscopic analysis apparatus 1 of the second embodiment, the indication mark projection units 22a and 22b that project the cross-shaped reference point pointer 20 instead of the point-like reference point pointer 13 include the indication mark projection unit. It is provided in place of 12a. The marking mark projection units 22a and 22b are configured by a red semiconductor laser light source that outputs line-shaped pointer light.

  Note that in the emission spectroscopic analysis apparatus 1 of the second embodiment, the same configurations and operations as those of the emission spectroscopic analysis apparatus 1 of the first embodiment are denoted by the same reference numerals, and description and illustration are omitted.

  FIG. 5A shows marking mark projection units 22a and 22b provided in the emission spectroscopic analysis apparatus 1 of the second embodiment, and reference point pointers 20a and 20b projected on the surface 3a by the marking mark projection units 22a and 22b. It is a figure which shows typically the relationship. As in the emission spectroscopic analysis apparatus 1 of the first embodiment, line-shaped adjustment pointers 14b and 14c are also projected on the surface 3a. However, in FIG. 5A, adjustment is made to make the drawing easier to see. The pointers 14b and 14c are not shown.

  As shown to Fig.5 (a), the marking mark projection part 22a irradiates the surface 3a with the pointer light 23a which makes a Y direction a longitudinal direction. Therefore, a linear reference point pointer 20a having the Y direction as the longitudinal direction is projected onto the surface 3a by the pointer light 23a.

  Here, the marking mark projection unit 22b emits pointer light 23a that travels in parallel to the YZ plane from a YZ plane (not shown) passing through the reference point P. Accordingly, the line-shaped reference point pointer 20a passing through the reference point P and having the Y direction as the longitudinal direction is projected by the pointer light 23a. The projection position of the reference point pointer 20a is always constant regardless of the position of the surface 3a in the Z direction.

  Similarly, the marking mark projection unit 22b emits pointer light 23b that travels in parallel with the ZX plane from a ZX plane (not shown) passing through the reference point P. This pointer light 23b is a linear pointer light whose longitudinal direction is the X direction. Therefore, a linear reference point pointer 20b passing through the reference point P and having the X direction as the longitudinal direction is projected onto the surface 3a by the pointer light 23b. The projection position of the reference point pointer 20b is always constant regardless of the position of the surface 3a in the Z direction.

  According to the emission spectroscopic analysis apparatus 1 of the second embodiment, the reference point pointers 20a and 20b always intersect at the reference point P regardless of the position of the surface 3a in the Z direction. That is, a cross-shaped marking mark whose intersection is the reference point P on the surface 3a can be projected onto the surface 3a. Therefore, according to the emission spectroscopic analysis apparatus 1 of the second embodiment, the reference point P can be marked by the reference points 20a and 20b in a visually easy-to-understand manner.

  With reference to FIG. 5B, a state in which the adjustment pointers 14b and 14c are projected together with the reference point pointers 20a and 20b will be described.

  FIG. 5B is a perspective view showing the DUT 3 on which the adjustment pointers 14b and 14c are projected together with the reference point pointers 20a and 20b in the emission spectroscopic analysis apparatus 1 of the second embodiment.

  As described in the first embodiment, the adjustment pointers 14b and 14c intersect at the reference point P when the position of the surface 3a in the Z direction matches the focal position of the laser beam. On the other hand, when the position of the surface 3a in the Z direction and the focal position of the laser beam do not match, the intersection of the adjustment pointers 14b and 14c is deviated from the reference point P.

  Therefore, as shown in FIG. 5 (b), whether or not the reference point P indicated by the reference point pointers 20a and 20b coincides with the intersection of the adjustment pointers 14b and 14c, that is, the surface 3a in the Z direction. It is possible to visually determine clearly whether or not the position of the laser beam and the focal position of the laser beam coincide with each other, and the position adjustment operation can be facilitated.

  In the second embodiment, the marking mark projection units 22a and 22b that project line-shaped pointers are used. Instead, a member that projects a cross-shaped pointer may be used. good. In this way, the number of parts of the pointer projection unit 12 can be reduced.

  Although the present invention has been described based on the embodiments, the present invention is not limited to the above-described embodiments, and various improvements and modifications can be easily made without departing from the spirit of the present invention. Can be inferred.

  For example, in the above-described embodiment, it has been described that the user visually confirms the adjustment pointers 14b and 14c and adjusts the stage 11 so that the intersection thereof coincides with the reference point P. The adjustment may be realized.

  For example, the positional relationship between the adjustment pointers 14b and 14c and the reference point P is calculated by photographing the surface 3a with a camera and analyzing the image data obtained by the photographing with the computer 10, and according to the calculated positional relationship. The Z-direction movement amount of the stage 11 may be determined, and the Z-direction position of the stage 11 may be automatically adjusted using the movement amount. In this way, highly accurate position adjustment can be automatically performed, and the operation burden on the user is reduced. That is, the amount of deviation between the reference point P and the adjustment marks 14b and 14c in the X direction and the Y direction correlates with the amount of deviation between the focal position of the laser beam and the surface 3a in the Z direction. By measuring the amount of deviation 14b, 14c, or by measuring the number of pixels on the CCD screen, the amount of deviation between the focal position of the laser beam and the surface 3a can be quantitatively and easily measured. Therefore, it becomes easy to adjust the surface 3a to the focal position of the laser beam. In order to reduce the irradiation density of the laser beam, the surface 3a may be intentionally separated from the focal position of the laser beam. In such a case, the focal position of the laser beam and the surface measured quantitatively are also included. It is possible to move to a desired defocus position using the amount of deviation from 3a.

  In the embodiment described above, the stage 11 is moved to change the position of the surface 3a in the Z direction, and the relative positional relationship between the surface 3a and the focal position of the laser light is adjusted. Instead, the emission spectroscopic analysis apparatus 1 may be configured to adjust the positional relationship between the position of the surface 3a in the Z direction and the focal position of the laser light by changing the focal position of the laser light. . However, in this case, the adjustment mark projection units 12b and 12c use the adjustment mark projection units 12b and 12c in accordance with the change in the focus position of the laser beam so that the laser beam focus position after the change matches the intersection of the adjustment pointers 14b and 14c. It is necessary to change the irradiation angle of the pointer lights 16b and 16c.

  In the above embodiment, the reference point pointer 13 or the reference point pointers 20a and 20b are projected onto the surface 3a. Instead of projecting the reference point pointer, for example, a reference point pointer is placed on the stage 11 or the like. You may comprise so that it may attach beforehand.

  FIG. 6 is a diagram schematically showing the relationship between the reference point pointer 24 of the modification and the DUT 3 placed on the intersection of the reference point pointer 24. As shown in FIG. 6, for example, a cross-shaped reference point pointer 24 whose intersection is the point where the optical axis of the laser light emitted from the laser oscillator 2 (see FIG. 1) and the stage 11 intersect is placed on the stage 11. It is good also as a structure given beforehand. In this case, the operator places the object 3 to be measured at the intersection of the cross-shaped reference point pointer 24. In this way, the intersection portion of the cross-shaped reference point pointer 24 becomes invisible by placing the DUT 3, but the user predicts the intersection position from the visible range of the reference point pointer 24, It is possible to predict the reference point P of the surface 3a that is directly above the intersection position. Then, by adjusting the position so that the intersection of the adjustment pointers 14b and 14c projected on the surface 3a coincides with the predicted reference point P, the focal position of the laser beam and the surface are adjusted as in the above embodiment. The positional relationship with the Z direction position of 3a can be adjusted suitably.

  Moreover, although the said embodiment demonstrated the case where this invention was applied to the emission-spectral-analysis apparatus 1 using a laser microprobe emission-spectroscopic-analysis method (LMA: Laser Microprobe Analyzer), alignment, positioning, and position adjustment are performed. Image processing that requires focusing of all necessary devices, for example, spectroscopic analyzers such as fluorescent X-ray analyzers, X-ray diffractometers, infrared spectroscopic analyzers and spectrofluorometers, laser processing devices, and imaging devices The present invention can be applied to various apparatuses such as analyzers using the above.

In the above-described embodiment, the two adjustment pointers 14b and 14c intersecting each other are projected, but one adjustment pointer may be projected. In this case, the Z-direction position of the surface 3a is made to coincide with the focal position of the laser beam by an easy operation of adjusting the Z-direction position of the surface 3a so that the linear adjustment pointer passes the reference point P. be able to. Note that three or more adjustment pointers may be projected.
<Others>
<Means>
In the position adjustment device described in the technical idea 1, the position of the adjustment target surface in the first direction intersecting the adjustment target surface and the reference point indicating means for indicating a predetermined reference point on the adjustment target surface is close to a predetermined position. The adjustment mark projecting unit projects the adjustment mark at a position close to the reference point marked by the reference point marking unit.
The position adjusting apparatus described in the technical idea 2 is the position adjusting apparatus described in the technical idea 1, wherein the adjustment mark projecting unit has the predetermined position and a first direction position of a reference point on the adjustment target surface. In the matching state, the adjustment mark is projected onto a reference point marked by the reference point marking means.
The position adjustment apparatus described in the technical idea 3 is the position adjustment apparatus described in the technical idea 2, wherein the adjustment mark projecting unit projects a line-shaped adjustment mark onto the adjustment target surface.
The position adjusting device described in the technical idea 4 is the position adjusting device described in the technical idea 3, wherein the adjustment mark projecting means includes a longitudinal direction of the line-shaped adjustment mark projected on the adjustment target surface and the first adjustment mark. The line-shaped adjustment mark is projected by irradiating a line-shaped light traveling in an oblique direction with respect to a surface parallel to one direction toward the surface to be adjusted.
The emission spectroscopic analyzer described in the technical idea 5 is an apparatus for analyzing a component contained in a measurement object by irradiating the measurement object with laser light and converting the component contained in the measurement object into plasma and analyzing it. A laser light source that emits laser light, a light guide optical system that guides the laser light from the laser light source to the object to be measured, and a reference point on the adjustment target surface that is the surface of the object to be measured are indicated. The reference point indicating means and the position of the adjustment target surface in the optical axis direction of the laser light that are indicated by the reference point indicating means are closer to the focal position of the laser light guided by the light guide optical system. Adjustment mark projecting means for projecting the adjustment mark at a position close to the reference point.
<Effect>
According to the position adjustment apparatus described in the technical idea 1, the adjustment mark projecting unit projects the adjustment mark at a position closer to the reference point as the position of the adjustment target surface in the first direction is closer to the predetermined position. Therefore, the adjustment target surface in the first direction is adjusted by adjusting the positional relationship between the first direction position of the adjustment target surface and the predetermined position so that the adjustment mark projected on the adjustment target surface approaches the reference point. Can be brought close to the default position. Further, the adjustment target surface in the first direction is adjusted by adjusting the positional relationship between the first direction position of the adjustment target surface and the predetermined position so that the adjustment mark projected on the adjustment target surface is away from the reference point. Can be separated from the default position. Therefore, there is an effect that the position can be easily adjusted using the adjustment mark as a mark.
According to the position adjusting device described in the technical idea 2, in addition to the effect of the position adjusting device described in the technical idea 1, in a state where the predetermined position and the first direction position of the reference point on the adjustment target surface coincide with each other. The adjustment mark is projected onto the reference point. Therefore, the first direction position and the default position of the adjustment target surface can be easily adjusted by adjusting the position between the first direction position and the default position of the adjustment target surface so that the adjustment mark is projected onto the reference point. This has the effect that can be matched.
According to the position adjusting device described in the technical idea 3, in addition to the effect produced by the position adjusting device described in the technical idea 2, the first direction position of the adjustment target surface so that the line-shaped adjustment mark passes through the reference point. There is an effect that the first direction position of the adjustment target surface can be matched with the predetermined position by an easy operation of adjusting the positional relationship between the predetermined position and the predetermined position.
According to the position adjusting device described in the technical idea 4, in addition to the effect produced by the position adjusting device described in the technical idea 3, the adjustment mark projecting unit is configured to provide a longitudinal direction of the adjustment mark projected on the adjustment target surface. And the line-shaped adjustment mark is projected by irradiating the line-shaped light traveling in a direction oblique to the plane parallel to the first direction toward the adjustment target surface. The projected position of the mark is in accordance with the position of the adjustment target surface in the first direction. Therefore, there is an effect that how much the position of the adjustment target surface in the first direction is deviated from the predetermined position can be expressed by the positional relationship between the reference point and the line-shaped adjustment mark.
According to the emission spectroscopic analyzer described in the technical idea 5, the adjustment mark projecting unit is such that the position of the adjustment target surface in the optical axis direction of the laser light is close to the focal position of the laser light guided by the light guide optical system. The adjustment mark is projected at a position closer to the reference point marked by the reference point marking means. Therefore, the laser beam can be easily adjusted by adjusting the positional relationship between the position in the optical axis direction of the object to be measured and the focal position of the laser beam so that the adjustment mark projected on the adjustment target surface approaches the reference point. The position of the surface to be adjusted in the direction of the optical axis can be brought close to the focal position of the laser beam, and the position can be adjusted easily. In addition, when the adjustment target surface is intentionally shifted from the focus position of the laser beam to reduce the density of the laser beam irradiated to the investigation target surface, the measurement target is set so that the adjustment mark is shifted from the reference point. Since the positional relationship between the position of the object in the optical axis direction and the focal position of the laser beam may be adjusted, the position can be easily adjusted in this case as well.

It is a block diagram which shows schematic structure of the emission-spectral-analysis apparatus of 1st Embodiment. (A) is a perspective view which shows the state where the Z direction position of the surface of a to-be-measured object and the focus position of a laser beam correspond, (b) is the Z direction position and the laser of the surface of a to-be-measured object. It is a perspective view which shows the state in which the focus position of light does not correspond. It is a figure which shows typically the relationship between the advancing direction of pointer light, and the direction of the pointer for adjustment projected with the pointer light. (A) is a figure which shows the pointer for adjustment projected on the surface and the stage 11 when the surface is parallel to the XY plane, and (b) is a case where the surface has an inclination with respect to the XY plane. It is the side view and top view which show the to-be-measured object. (A) is a figure which shows typically the relationship between the marking mark projection part provided in the emission-spectral-analysis apparatus of 2nd Embodiment, and the reference point pointer projected on the surface by a marking mark projection part, (b) ) Is a perspective view showing an object to be measured on which an adjustment pointer is projected together with a reference point pointer in the emission spectroscopic analysis apparatus of the second embodiment. It is a figure which shows typically the relationship between the reference point pointer of a modification, and the to-be-measured object mounted on the intersection of a reference point pointer. It is a figure which shows typically the relationship between the irradiation of the laser beam in the conventional emission-spectral-analysis apparatus, and the plasma generated by the irradiation of the laser beam.

1 Analyzer (position adjustment device)
2 Laser oscillator (laser light source)
3 surface to be measured 3a surface (surface to be adjusted)
4 Objective lens (light guiding optical system)
5 Plasma 12a Marking mark projection unit (reference point marking means)
12b, 12c Adjustment mark projection unit (adjustment mark projection means)
14b, 14c Adjustment pointer (adjustment mark)
16 Line-shaped light 17 Plane (surface)
22a, 22b Marking mark projection unit (reference point marking means)
24 Reference point pointer (reference point marking means)
P reference point

Claims (4)

A reference point marking means for marking a predetermined reference point on the surface to be adjusted;
As the position of the adjustment target surface in the first direction intersecting the adjustment target surface is closer to the predetermined position, a line-shaped adjustment mark is projected at a position closer to the reference point indicated by the reference point indicating means. Adjustment mark projection means ,
The adjustment mark projection means includes:
The line-shaped adjustment mark is projected onto a reference point marked by the reference point marking means in a state where the predetermined position and the first direction position of the reference point on the adjustment target surface coincide with each other. And
A linear shape that travels in an oblique direction with respect to a plane parallel to the longitudinal direction of the line-shaped adjustment mark projected through the reference point and having the first direction as a normal line and the first direction. The position adjusting apparatus , wherein the line-shaped adjustment mark is projected by irradiating light toward the surface to be adjusted. The adjustment mark projection means includes:
And at least two linear adjustment marks crossing each other designed to project into the adjustment target surface,
If the first direction position of the reference point in the adjustment target surface coincides with said predetermined position, said at least two line-shaped adjustment marks of, according to claim 1, wherein the intersecting at said reference point Positioning device. The reference point marking means is
3. The position adjusting apparatus according to claim 1, wherein a cross-shaped marking mark having a reference point on the adjustment target surface as an intersection is projected onto the adjustment target surface. An emission spectroscopic analysis apparatus that analyzes a component contained in a measurement object by irradiating the measurement object with laser light and converting the component contained in the measurement object into plasma and analyzing it,
The position adjusting device according to any one of claims 1 to 3,
A laser light source for emitting laser light;
A light guide optical system for guiding laser light from the laser light source to the object to be measured;
With
The emission spectroscopic analyzer characterized in that the surface to be adjusted is the surface of the object to be measured .

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