JP5350885B2 - Electrode separation state inspection method, apparatus thereof, and electronic device manufacturing method - Google Patents

Description

The present invention relates to a method for inspecting the separation state of an electrode of an electronic device formed on a substrate, an apparatus for the same, and a method for manufacturing the electronic device. The present invention relates to an electrode separation state inspection method, an apparatus thereof, and an electronic device manufacturing method.

As an electronic device, for example, a thin film solar cell is manufactured by the following process. First, a transparent electrode film (for example, SnO ₂ ) is vapor-deposited on a transparent substrate such as glass and separated into strips using a laser beam or the like to form a plurality of surface electrodes. On the upper surface of the surface electrode, a photoelectric conversion layer (solar cell body) is generated by a thin film layer such as amorphous silicon, and the thin film layer is divided to form strip-shaped solar cells. Since the back electrode and the surface electrode of one adjacent cell are connected, a solar cell panel is obtained by a plurality of solar cells connected in series on one transparent substrate.

  Here, when the adjacent surface electrodes are short-circuited, the optical-electrical conversion efficiency is reduced. Therefore, after the transparent electrode film is divided by laser light or the like, the separation state between the surface electrodes is inspected. It is essential.

Regarding the separation state between the surface electrodes, Patent Document 1 discloses conversion of an integrated thin-film solar cell if there is not sufficient separation resistance between the transparent electrodes (usually several megaohms or more, preferably 10 megaohms or more). It has been pointed out that the efficiency decreases due to the leakage current between patterns.

JP 2000-114555 A (paragraph 0009, etc.)

  By the way, since many solar cells are formed in series in one solar cell in order to raise power supply efficiency, the surface electrode is produced | generated according to the number of cells.

  For this reason, in the inspection of the separation state between the conventional surface electrodes, as shown in FIG. 18, from a plurality of electrodes 201, 202, 203,... 20n, for example, between each electrode 201-202, 202-203,. The voltage source 302 and the ammeter 304 are connected in series by the probe 306, the current is detected, and the insulation resistance is calculated. In this case, switches 308 and 310 are interposed between each probe 306 and the voltage source 302 and ammeter 304. In the measurement of the insulation resistance, when the number of electrodes is n, the number of times of measurement is n-1, and when the number of electrodes is large, the measurement time becomes long.

  Further, after applying the voltage, it takes a certain time until the flowing current is stabilized. For example, there is an example in which the current does not become stable even after nearly 10 seconds have passed since the voltage application, and it takes experience from several tens of seconds to several minutes until the current becomes stable.

  For this reason, in the case of measuring between the electrodes, a time is required until the current stabilizes every time, so that the measurement time becomes longer according to the number of electrodes. In order to save time by performing sequential measurement, switches 308 and 310 interposed between the probes 306, the voltage source 302, and the ammeter 304 are switched as shown in FIG. Can do. However, since the time until the current stabilizes is often longer than the time taken by performing sequential measurement, the measurement time cannot be significantly shortened.

  If the measurement time is extended for a long time by continuously performing such measurement, an error due to an environmental change such as ambient temperature and ambient humidity increases between the first measurement and the last measurement, and the inspection accuracy is lowered.

  In addition, when the number of electrodes increases, a measurement person's error that the measurement electrodes are mistaken reduces the inspection accuracy and the efficiency of the inspection work.

  Accordingly, an object of the present invention relates to an electrode separation state inspection method or apparatus for inspecting the separation state of a plurality of electrodes such as surface electrodes of a thin film solar cell, and to shorten inspection time and improve inspection accuracy. There is.

Another object of the present invention relates to a method for manufacturing an electronic device. By using the electrode separation state inspection method or apparatus according to the present invention for an inspection process, an electronic device such as a thin film solar cell having high reliability can be obtained. The purpose is to enable production and to shorten the production time.

  In order to solve the above-described problems, the electrode separation state inspection method, apparatus, or electronic device manufacturing method of the present invention is as follows.

  An electrode separation state inspection method according to a first aspect of the present invention is an electrode separation state inspection method for inspecting the separation state of a plurality of electrodes arranged at intervals on a substrate, The connected power supply wiring and the measuring means are alternately connected, and the power supply wiring further comprises a first power supply wiring and a second power supply wiring, and the first power supply wiring and the second power supply wiring are provided. Alternately connecting the electrodes to which the measuring means is connected to the electrodes, applying a test voltage from the first power wiring to the electrodes to which the first power wiring is connected, and supplying the second power By applying the same voltage as the input of the measurement means from the second power supply wiring to the electrode connected to the wiring, the electrode connecting the first power supply wiring and the electrode connecting the measurement means The current flowing between A test voltage is applied to the electrode connected to the second power supply wiring from the second power supply wiring, and the electrode connected to the first power supply wiring is connected to the electrode from the first power supply wiring. Measuring the current flowing between the electrode connected to the second power supply wiring and the electrode connected to the measuring means by applying the same voltage as the input of the measuring means by the measuring means; Is to include.

  In the electrode separation state inspection method, a step of connecting a measurement circuit including a power source and a measuring instrument to a part of the electrode, a step of moving a connection point of the measurement circuit and the electrode, And the step of measuring the separation state between all the electrodes in a divided manner.

An electrode separation state inspection apparatus according to a second aspect of the present invention is an electrode separation state inspection apparatus that inspects the separation state of a plurality of electrodes arranged at intervals on a substrate, and measures current. Measuring means to be connected, power supply wiring connected to the electrodes, the power supply wiring and the measurement means are alternately connected, and the power supply wiring further includes a first power supply wiring and a second power supply wiring, The first power supply wiring and the second power supply wiring are alternately connected to the electrodes with the electrodes connected to the measuring means interposed therebetween, and the electrodes connected to the first power supply wiring or the second power supply wiring are Each of which is one or more measuring circuits, a test voltage is applied from the first power supply wiring to the electrode connected to the first power supply wiring, and the electrode connected to the second power supply wiring is connected to the electrode Apply the same voltage as the input of the measuring means from the second power supply wiring. The current flowing between the electrode connected to the first power supply wiring and the electrode connected to the measurement means is measured by the measurement means, and the second power supply wiring is connected to the electrode connected to the second power supply wiring. By applying a test voltage to the electrode from the second power supply wiring, and applying the same voltage as the input of the measuring means from the first power supply wiring to the electrode connected to the first power supply wiring, The measurement means measures the current flowing between the electrode connected to the second power supply wiring and the electrode connected to the measurement means.

  In the electrode separation state inspection apparatus, a measurement circuit including a power source and measurement means connected to a part of the electrode, a movement means for moving a connection point between the measurement circuit and the electrode, And measuring means for measuring the separation state between all the electrodes in a batch.

An electronic device manufacturing method according to a third aspect of the present invention is an electronic device manufacturing method including a plurality of electrodes arranged at intervals on a substrate, and is arranged at intervals on the substrate. A step of forming a plurality of electrodes, and a step of inspecting a separation state between the electrodes using the separation state inspection method or the separation state inspection device.

  According to the present invention, the following effects can be obtained.

  (1) Even if the number of electrodes to be inspected is increased, the number of inspections can be reduced, the inspection time can be shortened, and an optimal inspection can be performed on a plurality of electrodes.

  (2) Since the number of inspections can be reduced even if the number of electrodes to be inspected increases, the inspection accuracy can be improved, and an optimal inspection can be performed on a plurality of electrodes.

  (3) The maximum allowable measurement time, the number of power supplies and measuring instruments (size / cost), the number of probes (cost), and the presence / absence of the probe group moving mechanism (cost) are in a trade-off relationship with each other. According to the present invention, an optimal apparatus configuration can be selected according to the number of electrodes to be inspected, and an optimal inspection can be performed.

(4) According to the method of manufacturing an electronic device according to the present invention, according to (1) to (3), the manufacturing efficiency is improved by shortening the inspection time, and the electronic device such as a thin film solar cell having high reliability is improved by improving the inspection accuracy. Devices can be manufactured.

It is a figure which shows the electrode of a thin film solar cell. It is a figure which shows an example of the test | inspection circuit of the electrode which concerns on 1st Embodiment. It is a figure which shows the inspection between electrodes. It is a figure which shows the inspection between electrodes. It is a figure which shows the test | inspection system which concerns on 2nd Embodiment. It is a flowchart which shows the process sequence of a test | inspection. It is a figure which shows an example of the test | inspection circuit between electrodes. It is a flowchart which shows the process sequence of the test | inspection which concerns on 3rd Embodiment. It is a figure which shows an example of the test | inspection circuit based on 4th Embodiment. It is a figure which shows an example of the test | inspection circuit based on 5th Embodiment. It is a figure which shows an example of the test | inspection circuit based on 6th Embodiment. It is a figure which shows an example of the test | inspection circuit based on 7th Embodiment. It is a figure which shows an example of the test | inspection circuit based on 8th Embodiment. It is a figure which shows an example of the test | inspection circuit based on 9th Embodiment. It is a figure which shows an example of the test | inspection circuit based on 10th Embodiment. It is a figure which shows an example of the test | inspection circuit based on 11th Embodiment. It is a figure which shows the manufacturing process of the thin film solar cell which concerns on 12th Embodiment. It is a figure which shows the isolation | separation state inspection of the conventional electrode.

[First Embodiment]

  The first embodiment of the present invention will be described with reference to FIG. 1, FIG. 2, FIG. 3, and FIG. FIG. 1A is a diagram showing an electrode with a part cut away, FIG. 1B is a diagram showing a cross section taken along line 1B-1B, FIG. 2 is a diagram showing an electrode separation state inspection device, FIG. 3 and FIG. It is a figure which shows a test | inspection circuit. The configuration shown in FIGS. 1 to 4 is an example, and the present invention is not limited to such configuration.

As an example of an electronic device, a thin-film solar cell uses a flat transparent substrate such as glass as shown in FIGS. 1A and 1B, and a plurality of transparent substrates (hereinafter simply referred to as “substrates”) 2 are used. Strip-shaped surface electrodes (hereinafter simply referred to as “electrodes”) 41, 42, 43... 4 n are formed. These electrodes 41, 42, 43... 4n are patterned into strips by using, for example, laser light as a cutting means from a transparent electrode film (not shown) formed by vapor-depositing SnO ₂ on one surface of the substrate 2, for example. , Cut and separated. Between the electrodes 41, 42, 43... 4n, an insulation interval 5 is formed by cutting and separating. Each insulation interval 5 determines the separation state of each electrode 41, 42, 43... 4n, and this separation state can be known by the amount of insulation resistance (impedance).

  In this embodiment, the separation state of the electrodes 41, 42, 43... 4n formed on the substrate 2 made of an insulator, that is, the insulation resistance is an inspection object. This inspection is performed before the production of the semiconductor thin film and the back electrode in the manufacturing process of the thin film solar cell. In this embodiment, among the plurality (n) of electrodes 41, 42, 43... 4n, the electrode 41 is the first electrode, the electrode 42 is the second electrode,. In this case, the i-th electrode is the electrode 4i, which is defined as 1 ≦ i ≦ n. However, n is an integer.

  Therefore, in this embodiment, for ease of explanation, FIG. 2 exemplifies five electrodes 41 to 45 from countless electrodes 41 to 4n. In this case, n = 5 and 1 ≦ i ≦ 5 (= n).

  In this inspection apparatus 10, a first power source 21, a second power source 22, a first measuring device 31, a second measuring device 32 as measuring means, and a plurality (n = 5) probes as connecting means. Are provided with voltage application probes 51, 52, 53, and current measurement probes 61, 62, and the probes 51, 52, 53, 61, 62 are respectively connected to the electrodes 41-45 by a probe support 70 which is a support means. It is supported with a corresponding spacing. Therefore, the probe support 70 corresponds to the substrate 2, and the number of probes may be the same as the number of electrodes on the substrate 2, but may be different, or a plurality of probes may be provided for each electrode. It may be used. That is, each probe 51, 52, 53, 61, 62 may be single or plural.

  The power sources 21 and 22 are a DC power source or an AC power source capable of applying a voltage (that is, a test voltage) between the electrodes. In the case of an AC power source, an AC output having an appropriate frequency may be obtained. The measuring devices 31 and 32 are configured with a current measuring device having a current measuring function. In this case, the input resistances of the measuring devices 31 and 32 are ideally 0 [Ω], and the voltages of the current measuring probes 61 and 62 are 0 [V] with respect to the reference voltage.

  The power supplies 21 and 22 and the measuring instruments 31 and 32 are connected in common by a wiring 72, and a reference voltage is set. In this case, the reference voltage is 0 [V]. The reference voltage is generally set to the ground potential = 0 [V], but a voltage other than 0 [V] may be used as the reference voltage as necessary.

  A power source 21 is connected to the probes 51 and 53 by a wiring 74 as a power source wiring (first power source wiring), and a power source 22 is connected to the probe 52 by a wiring 76 as a power source wiring (second power source wiring). The measuring instrument 31 is connected to 61 by a wiring 78, and the measuring instrument 32 is connected to the probe 62 by a wiring 80. Such a connection forms a measurement circuit.

  In the measurement, the probe support 70 and the substrate 2 are overlapped to bring the probe 51-electrode 41, probe 61-electrode 42, probe 52-electrode 43, probe 62-electrode 44, and probe 53-electrode 45 into contact with each other. Connect electrically. That is, the first measurement circuit is configured.

Therefore, in the first measurement (first measurement circuit) as the inspection between the electrodes, as shown in FIG. 3, the output voltage of the power source 21 is set to V [V], and this is output as the applied voltage. The output voltage of the power supply 22 is set to 0 [V]. Accordingly, the voltage V is applied between the voltage application probe 51 and the current measurement probe 61, and the voltage V is applied between the voltage application probe 53 and the current measurement probe 62. At this time, the voltage at the current measurement probes 61 and 62 and the voltage at the voltage application probe 52 are both 0 [V], and no voltage is applied between them. As a result, the measuring device 31 (current measuring device) can measure the current I ₁ flowing between the electrodes between the voltage applying probe 51 and the current measuring probe 61, and the measuring device 32 can measure the voltage applying probe 53 and the current measuring probe. The current I ₂ flowing between the electrodes between 62 can be measured.

Next, as shown in FIG. 4, the output voltage of the power source 21 is switched to 0 [V], and the output voltage of the power source 22 is switched to V [V]. As a result, a second measurement circuit is configured, and the voltage V is applied between the voltage application probe 52 and the current measurement probe 61, and the voltage V is applied between the voltage application probe 52 and the current measurement probe 62. Is applied. At this time, no voltage is applied between the voltage application probe 51 and the current measurement probe 61 and between the voltage application probe 53 and the current measurement probe 62. Therefore, the measuring device 31 can measure the current I ₃ flowing between the electrodes between the voltage application probe 52 and the current measurement probe 61, and the measurement device 32 can measure the voltage application probe 52 and the current measurement probe 62. The current I ₄ flowing between the electrodes can be measured.

As described above, the current I ₁ between all the electrodes, that is, the current 41 between the electrodes 41 and 42 and the current I ₂ between the electrodes 45 and 44 can be obtained only by switching the voltage of the power supplies 21 and 22 once (FIG. 3). The current I ₃ between the electrode 43 and the electrode 42 and the current I ₄ between the electrode 43 and the electrode 44 (FIG. 4) can be measured.

[Second Embodiment]

  Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a diagram showing the configuration of the inspection system, FIG. 6 is a flowchart showing the processing procedure, and FIG. 7 is a diagram showing a specific inspection circuit example. The configurations shown in FIGS. 5 to 7 are examples, and the present invention is not limited to such configurations. In FIG. 5, the same reference numerals are given to the common parts with FIG. 2.

  The inspection system 90 is an example of an electrode separation state inspection method or apparatus according to the present invention, and is configured by a computer. The inspection system 90 includes a controller 92, a power supply group 20, a measuring instrument group 30, a voltage application probe group 50, a measurement probe group 60, and an input / output unit 94. The DUT 40 is a plurality of electrodes 41, 42, 43... 4n that is an electrode group.

  In the inspection system 90, measurement conditions such as an output voltage of the power supply group 20 and a measurement time are input using the input / output unit 94. The controller 92 controls the output of the power supply group 20 based on the input measurement conditions. The output voltage of the power supply group 20 is applied to the device under test 40 via the voltage application probe group 50. The current flowing from the voltage application probe group 50 to the device under test 40 is given to the measuring instrument group 30 via the measurement probe group 60, and the current between the electrodes is measured. The measurement value measured by the measuring instrument group 30 is taken into the controller 92, and the calculation result such as the current and the insulation resistance value obtained from the current is output from the input / output unit 94.

  If a system using two power supplies is used in this inspection system 90 (FIGS. 2 to 4), the measurement between all the electrodes can be performed only by switching the power supply voltage once, and the measurement can be speeded up.

  Therefore, referring to FIG. 6 for the processing procedure of the inspection using this inspection system 90, this processing procedure is used for the measurement processing shown in FIGS. In this case, first, measurement conditions are specified from the input / output unit 94 (step S11).

  As the first measurement (measurement by the first measurement circuit), a predetermined voltage is set for one power supply 21 and 0 [V] is set for the other power supply 22 (step S12). The outputs of both the power supplies 21 and 22 are turned on, and a voltage is applied between the electrodes of half of all the electrodes (n / 2 when n is even and n / 2 ± 0.5 when n is odd) (step S13). ), And waits until a specified condition such as the measured current value is settled (step S14). Current flowing between half of all the electrodes is measured by the measuring devices 31 and 32 (step S15). The measurement data is AD (analog-digital) converted and output from the input / output unit 94 (step S16). Here, the outputs of the power supplies 21 and 22 are turned off.

  Next, as a second measurement (measurement by the second measurement circuit), a predetermined voltage is set in one power supply 22 and 0 [V] is set in the other power supply 21 (step S17). The outputs of both the power sources 21 and 22 are turned on, a voltage is applied between the remaining electrodes of half of all the electrodes for the second measurement (step S18), and the process waits until the specified condition is reached (step S19). Current flowing between half of all the electrodes is measured by the measuring devices 31 and 32 (step S20). The measurement data is AD (analog-digital) converted and output from the input / output unit 94 (step S21). Thereafter, the outputs of the power supplies 21 and 22 are turned off.

  As described above, each of the currents between the electrodes can be measured only by switching the voltage of the power supplies 21 and 22 once as described above.

  Next, referring to FIG. 7 for a specific test circuit example, the power sources 21 and 22 are power sources for applying a voltage between the electrodes. As described above, the power sources 21 and 22 may use not only a DC power source but also an AC power source having an appropriate frequency.

  The substrate 2 is a transparent substrate on which surface electrodes are formed, and the electrodes 41, 42, 43, 44, 45, and 46 are surface electrodes made of transparent electrodes formed on the substrate 2 (FIGS. 1A and 1B). .

  The current measuring devices 301, 302, and 303 are an example of current measuring means that is an example of the measuring devices 31 and 32, and are configured by IV amplifiers that measure the current flowing between the measuring device surface electrodes. The present invention is not limited to the IV amplifier, and general current measuring means can be freely adopted. R is an insulation resistance existing between the electrodes, and C is a capacitance existing between the electrodes. These insulation resistance R and capacitance C exist between all the electrodes.

  In this case, the power source 21 is a power source that applies a voltage for the first time, and the power source 22 is a power source that applies a voltage for the second time. Inputs of the current measuring devices 301 to 303 are controlled to a reference voltage (for example, 0 [V]).

  Therefore, in the first voltage application, a predetermined applied voltage is output from the power source 21 and a reference voltage (0 [V]) is output from the power source 22. Thereby, a predetermined voltage is applied between the electrodes 41-42, 45-44, and 45-46. On the other hand, the electrodes 42, 44, and 46 are set to 0 [V] by the current measuring devices 301, 302, and 303, respectively. The electrode 43 is set to 0 [V] by the power source 22.

  Therefore, no voltage is applied between the electrodes 43-42 and 43-44. As a result, a current flowing between the electrodes 41-42 flows through the current measuring device 301. Similarly, a current flowing between the electrodes 45-44 flows through the current measuring device 302, and only a current flowing between the electrodes 45-46 flows through the current measuring device 303. In this way, the measurement results of the current measuring devices 301 to 303 are output, and the first measurement is completed.

  In the second voltage application, a predetermined applied voltage is output from the power supply 22, and a reference voltage (0 [V]) is output from the power supply 21. Thus, a predetermined voltage is applied between the electrodes 43-42 and 43-44, and no voltage is applied between the other electrodes. The current flowing between the electrodes 43-42 is measured by the current measuring device 301, and the current flowing between the electrodes 43-44 is measured by the current measuring device 302. In this way, the measurement results by the current measuring devices 301 and 302 are output, and the second measurement is also completed.

  As described above, the current flowing between all the electrodes can be measured, and the applied voltage is a known value, so that the insulation resistance between all the electrodes can be calculated from the voltage and current.

[Third Embodiment]

  Next, FIG. 8 is referred about the 3rd Embodiment of this invention. FIG. 8 is a flowchart showing a processing procedure according to the third embodiment.

  The present invention can perform the same inspection even when the number of power supplies is increased to N. In this embodiment, the number of groups is set to N (an integer of 2 or more). The same effect can be obtained.

  In this processing procedure, the power source is increased and the electrodes are connected in N groups. In this embodiment, I indicates the group number being measured.

  Therefore, in this processing procedure, the number of groups N (N ≧ 2) is set (step S31), first, I = 1 is set and measurement is started (step S32). The power supply is set so that a voltage can be applied only to the I-th group (step S33). The output of each power source is turned on, a voltage is applied between the electrodes (step S34), and the current flowing between the predetermined electrodes is measured with a current measuring instrument (step S35).

  The number of measurements is incremented (step S36), and steps S35 to S36 are repeated until I is 1 to N, that is, until the measurement of all groups is completed (step S37).

  As a result, the current value between all the electrodes can be measured, and the insulation resistance can be obtained from the applied voltage and current.

[Fourth Embodiment]

  Next, FIG. 9 is referred about the 4th Embodiment of this invention. FIG. 9 is a diagram illustrating a test circuit example according to the fourth embodiment. The configuration illustrated in FIG. 9 is an example, and the present invention is not limited to such a configuration. In FIG. 9, the same reference numerals are given to the common parts with FIG. 2 and FIG. 7.

  The power sources 21, 22... 2N are power sources for applying a voltage between the electrodes. The current measuring devices 301, 302,... 30m are composed of, for example, an IV amplifier as described above. The number of electrodes is a half of the number n of electrodes (n / 2 when n is an even number and n / 2 ± 0.5 when n is an odd number). R is an insulation resistance existing between the electrodes, and C is a capacitance existing between the electrodes, and exists between all the electrodes.

  The current measuring devices 301, 302,... Are connected to the even-numbered electrodes 42, 44,... To form a measuring circuit, and the power supplies 21, 22,. Connect to form a measurement circuit. In this case, the same operation can be obtained even if the odd / even is replaced, and the same effect can be obtained.

  Therefore, the power source 21 is a power source for applying a voltage to the electrodes of group 1, the power source 22 is a power source for applying a voltage to the electrodes of group 2, and the power source 2N is a power source for applying a voltage to the electrodes of group N.

  In the group 1 measurement, the applied voltage is output from the power source 21 and the reference voltage (0 [V]) is output from the other power sources. The current measuring devices 301 to 30m are composed of IV amplifiers, and are controlled to a reference voltage (0 [V]).

  At this time, a voltage is applied between the electrodes 41-42, between the electrodes 47-46, between the electrodes 47-48, and between the electrodes 413-412, and no voltage is applied between the other electrodes. Therefore, in the current measuring device 301, the current flowing between the electrodes 41-42, in the current measuring device 303, the current flowing between the electrodes 47-46, and in the current measuring device 304, the current flowing between the electrodes 47-48 is measured. In the vessel 30m, the current flowing between the electrodes 413-412 is measured. In other current measuring devices, no current measurement is performed because there is no gap between electrodes to which a voltage is applied.

  In the measurement of group 2, the applied voltage is output from the power source 22, the reference voltage (0 [V]) is output from the other power source, the electrodes 43-42, the electrodes 43-44, and the electrodes 49-48. A voltage is applied only between the electrodes 49-410, and current measurement is performed by the current measuring devices 301, 302, 304, 305 connected to the electrodes.

  Thus, the same measurement can be repeated up to the power source 2N to measure the current between all the electrodes, and similarly, the insulation resistance between the electrodes can be obtained.

  FIG. 9 shows an example in which the power supply wires are connected to the electrodes in the order of the power supply 21, the power supply 22 and the power supply 2N. However, this order is arbitrary under the condition that the same power supply wires are not continuous. As an example, when N = 3, the power supply 21, the power supply 22, the power supply 23, the power supply 22, the power supply 21, the power supply 22. If power supply 21 is followed by power supply 21, power supply 22 is followed by power supply 22, and power supply 23 is followed by power supply 23, power supply wiring is arranged in an arbitrary order as long as the sequential order is not included. Is possible.

  FIG. 9 shows an example in which the test voltage is applied to only one system among the power supply wirings. However, the insulation resistance between all the electrodes can also be obtained by applying the test voltage to two or more power supply wirings. Is possible.

  In this case, if a test voltage is simultaneously applied to two power supply wires adjacent to each other across the electrode to which the measuring instrument is connected, current flows from both sides of the electrode to which the measuring instrument is connected, and normal measurement cannot be performed. It is necessary to prevent the test voltage from being applied simultaneously to two adjacent power supply wires across the electrode to which the measuring instrument is connected.

[Fifth Embodiment]

  Next, FIG. 10 is referred about the 5th Embodiment of this invention. FIG. 10 is a diagram illustrating a configuration example of an inspection circuit according to the fifth embodiment. 10, the same parts as those in FIG. 7 are denoted by the same reference numerals.

  In this inspection circuit, as a simpler example, instead of a power source for setting the electrode potential to 0 [V], it is connected to a reference potential point (which is an example of a power source), and a single power source for voltage application is used. It has become.

  A single power source 21 is a power source that applies a voltage between the electrodes, and 220 is a reference potential point as a power source. The switches SW1 and SW2 are switching means for switching the power source. Since other configurations are the same as those in the above embodiment, common reference numerals are used and description thereof is omitted.

  The switches SW1 and SW2 are switched, the voltage is applied by connecting the power source 21 to the electrodes 41 and 45, the reference potential point 220 is connected to the electrode 43, and the reference potential is set. As described above, the current measuring devices 301, 302, and 303 are configured by, for example, IV amplifiers, and a reference potential similar to that of the reference potential point 220 is set as the input. The first or second measurement circuit is formed by switching the switches SW1 and SW2.

  As a result, a voltage is applied between the electrodes 41-42, between the electrodes 45-44, and between the electrodes 45-46, and no voltage is applied between the electrodes 42-43 and between the electrodes 43-44.

  In this case, the current measuring device 301 measures the current flowing between the electrodes 41-42, the current measuring device 302 measures the current flowing between the electrodes 45-44, and the current measuring device 303 measures the current flowing between the electrodes 46-45. .

  Next, the switches SW 1 and SW 2 are switched to connect the power source 21 to the electrode 43 and apply a voltage, and the electrodes 41 and 45 are connected to the reference potential point 220.

  In this case, the voltage is applied between the electrodes 43-42 and between the electrodes 43-44, and no voltage is applied between the electrodes 41-42, 45-44, and 45-46.

  Therefore, the current measuring device 301 measures the current flowing between the electrodes 43-42, and the current measuring device 302 measures the current flowing between the electrodes 43-44.

  FIG. 10A shows an example in which two power supply wirings are switched by switches SW1 and SW2 as connection switching means. This method can also be applied to power supply wiring of three or more systems. For example, as shown in FIG. 10B, switches SW1, SW2, and SW3 can be used as connection switching means for power supply wiring of three systems, and the same idea is applied to power supply wiring exceeding three systems. Is also applicable. In this case, the connection between the power supply wiring and the electrode is omitted in FIG. 10B, but it is only necessary that the power supply wiring and the measuring instrument are alternately connected and the same power supply wiring is not in the order. This is the same as the embodiment.

  FIG. 10 shows an example in which a test voltage is applied to only one power supply line using a single power supply. However, a plurality of power supplies can be used, or a test voltage can be applied to two or more power supply lines. It is also possible to obtain the insulation resistance between all the electrodes by configuring the switching means to apply.

  In this case, if a test voltage is simultaneously applied to two power supply wires adjacent to each other across the electrode to which the measuring instrument is connected, current flows from both sides of the electrode to which the measuring instrument is connected, and normal measurement cannot be performed. It is necessary to prevent the test voltage from being applied simultaneously to two adjacent power supply wires across the electrode to which the measuring instrument is connected.

  In this embodiment, the reference potential point as a kind of power source is used. However, a separate power source can be used.

[Sixth Embodiment]

  Next, FIG. 11 is referred about the 6th Embodiment of this invention. FIG. 11 is a diagram illustrating a configuration example of an inspection circuit according to the sixth embodiment. In FIG. 11, the same parts as those in FIG.

  In this embodiment, a method is shown in which a voltage is applied simultaneously between all electrodes by all independent power sources, and a current flowing between the electrodes from each power source is measured.

  In this inspection circuit as a measurement circuit, power sources 21, 22, 23, and 24 are connected between all electrodes, and current measuring devices 31, 32, 33, and 34 are inserted. For this reason, the power supplies 21 to 24 and the current measuring devices 31 to 34 require n-1 pieces, respectively, where n is the number of electrodes 41 to 45. In the above embodiments (first to fifth embodiments), the current measuring device may be half or half ± 1 of the number of surface electrodes. However, according to the inspection circuit and method of this embodiment, the power supply Since switching is not necessary, measurement can be speeded up.

[Seventh Embodiment]

  Next, FIG. 12 is referred about the 7th Embodiment of this invention. FIG. 12 is a diagram illustrating a configuration example of an inspection circuit according to the seventh embodiment. In FIG. 12, the same parts as those in FIG.

  In this embodiment, the same current is applied to all the electrodes, and the voltage between the electrodes is measured.

  When a constant current is passed between all electrodes, the power source 21 needs a very high voltage constant current power source. In this case, although five examples of electrodes are shown in the electrodes 41 to 45, actually, for example, when 101 surface electrodes are present on one glass substrate, there are 100 between each electrode. In the case of applying [V], a constant current power source capable of outputting a high voltage of 10,000 [V] to the power source 21 is required. The measuring device 31 is a current measuring device, and the measuring devices 32 to 35 are voltage measuring devices, and the number of electrodes minus 1 is required. In the above embodiments (first to fifth embodiments), the current measuring device only needs to be half or half ± 1 of the number of surface electrodes, but in this method, switching of the power source is not necessary, so measurement Can be speeded up.

[Eighth Embodiment]

  Next, FIG. 13 is referred about the 8th Embodiment of this invention. FIG. 13 is a diagram illustrating a configuration example of a test circuit according to the eighth embodiment. In FIG. 13, the same parts as those in FIG.

  In this embodiment, in order to compensate for the disadvantage of the seventh embodiment that a high-voltage power supply is required, all the electrodes are divided into an electrode for current injection and an electrode for current outflow. Wiring is performed so that the electrodes are alternately arranged.

  In this embodiment, measuring devices 31 to 35 for measuring current are connected to the electrodes 41 to 45, and the inflow current and the outflow current are measured. The current flowing between the electrodes can be calculated from the inflow current and the outflow current as follows.

Assuming that the current flowing between the electrodes 41-42 is I ₁₂ and the current flowing between the electrodes 43-42 is I ₃₂ , the current measuring device 31 measures the current I ₁₂ , and the current measuring device 32 measures I ₁₂ + I _32. Is done. The current I ₃₂ can be obtained from the difference between the measured values of the current measuring device 32 and the current measuring device 31.

Thereafter, the current I ₃₄ flowing between the electrodes 43 and 44 and the current I ₅₄ flowing between the electrodes 45 and 44 can be obtained by the same method.

  In this method, only one power source 21 is required, but the number of measuring devices 31 to 35 for measuring current is the same as the number of all electrodes. Further, since the two accumulated values of the inflow current and the outflow current are used, an error is accumulated and the measurement error is slightly increased. However, in this embodiment, it is not necessary to switch the power source.

[Ninth Embodiment]

  In the first to eighth embodiments, the relative positions of the probe and the surface electrode are not changed during the measurement. If at least one of the transparent substrate on which the surface electrode is generated and the probe can be moved, the number of power supplies, current measuring devices (voltage measuring devices in the seventh embodiment) and probes can be reduced. However, the number of measurements increases in proportion to the number of movements. Therefore, in the ninth embodiment, the relative position between the probe and the surface electrode is changed during measurement, and the first embodiment is movably modified.

  The ninth embodiment will be described with reference to FIG. FIG. 14 is a diagram illustrating an example of an inspection circuit according to the ninth embodiment. In FIG. 14, the same parts as those in FIG. This embodiment can be similarly applied to the second to fifth embodiments.

  In this embodiment, a plurality of probe groups P1, P2,... Pm, each of which includes three probes 51, 61, 52 corresponding to three consecutive electrodes of a plurality (n) of electrodes 41 to 4n. Is set on the probe support 70 with a gap corresponding to one electrode, the probes 51 and 52 are set as voltage application probes, and the probe 61 is set as a current measurement probe. The measuring devices 31, 32... 3m are current measuring devices. Since other configurations are the same as those of the first embodiment, the same reference numerals are given and the description thereof is omitted.

  In this embodiment, as shown in FIG. 14A, probes 51, 61, 52 are connected to each electrode as a unit like electrodes 41, 42, 43, 45. After measuring the current flowing between them, as shown in FIG. 14B, the probe support 70 is moved by two electrodes, and the same interelectrode current can be measured.

  In this embodiment, an example in which the movement amount is minimized (for two electrodes) by using the minimum configuration (three probes) in the first embodiment as a unit, and the movement is performed once is shown.

  If more probes are used as a unit, the total number of probes can be reduced, but the amount of movement becomes larger. For example, it is possible to move by four electrodes in units of five probes. If even greater movement is possible, about half of the number of electrodes can be used as a unit, about half of the entire electrode can be moved, and the total number of probes can be reduced.

  In this embodiment, the substrate 2 side is fixed and the probe side is moved. However, the probe side may be fixed and the substrate 2 side may be moved, or both may be moved.

[Tenth embodiment]

  In the tenth embodiment, the sixth embodiment is movable three times.

  FIG. 15 is referred to for the tenth embodiment. FIG. 15 is a diagram illustrating an example of an inspection circuit according to the tenth embodiment. 15, the same parts as those in FIG. 11 are denoted by the same reference numerals.

  In this embodiment, a plurality of probe groups P1, P2,... Pm, each including two pairs of probes 51, 61 corresponding to two consecutive electrodes of a plurality (n) of electrodes 41 to 4n, are set to two. A space for two electrodes is provided on the probe support 70, the probe 51 is set as a voltage application probe, and the probe 61 is set as a current measurement probe. The measuring devices 31, 32... 3m are current measuring devices. Since other configurations are the same as those of the sixth embodiment, the same reference numerals are given and description thereof is omitted.

  In this embodiment, as shown in FIGS. 15A to 15D, the same interelectrode current can be measured by moving the probe support 70 one electrode at a time.

  In this embodiment, as compared with the sixth embodiment, the number of measuring instruments and power supplies is about 1/4.

  If the number of times of movement is increased, the number of measuring instruments and power supplies can be reduced, but the time required for measurement is increased. If the number of movements is the maximum (number of electrodes −1), it will be substantially the same as the prior art shown in FIG. 18, and this is not included in this embodiment.

[Eleventh embodiment]

  In the eleventh embodiment, the seventh embodiment is movable twice.

  FIG. 16 is referred to for the eleventh embodiment. FIG. 16 is a diagram illustrating an example of a test circuit according to the eleventh embodiment. In FIG. 16, the same parts as those in FIG.

  In this embodiment, a plurality of probe groups P1, P2,..., Pm, each including a pair of probes 61, 62 corresponding to two consecutive electrodes of a plurality (n) of electrodes 41-4n. It is attached to the probe support 70 with an interval corresponding to two electrodes and is movably installed with the probe support 70, and includes probes 51 and 52. The probes 51 and 52 are current supply probes. In this embodiment, the power source 21 is connected between the electrode 41 and the electrode 4n, and the power source 21 is a constant current source.

  Probes 61 and 62 of the probe groups P1, P2... Pm are probes for voltage measurement, and measuring instruments 32, 33... 3m + 1 connected between the probes 61 and 62 are voltage measuring instruments.

  According to such a configuration, a constant current source is connected between the electrodes 41-4n of the substrate 2 to supply a constant current, and the probes 61, 62 are moved for each of the probe groups P1, P2,. The voltage drop between the electrodes can be measured.

  In this embodiment, compared with the seventh embodiment, the number of measuring devices is about 1/3, but the measurement is three times. If the number of times of movement is increased, the number of measuring instruments can be reduced, but more time is required for measurement.

  As illustrated in the ninth to eleventh embodiments, “the presence / absence of movement and the number of movements”, “the number of measurements”, and “the number of measuring instruments and power supplies” are in a trade-off relationship, and The number of necessary probes is also different. When carrying out the present invention, “cost of moving mechanism”, “acceptable number of measurements (allowable maximum measurement time)”, “number of power supply / measuring instruments (size and cost)”, “number of probes and cost” In consideration of the above, it is possible to select an optimum configuration in accordance with the number of surface electrodes generated on one transparent substrate.

  In this way, if we consider “cost of moving mechanism”, “acceptable number of measurements (allowable maximum measurement time)”, “number of power supplies / measuring instruments (size and cost)”, “number and cost of probes”, etc. Thus, an effect that an optimum configuration can be selected is obtained.

[Twelfth embodiment]

  Next, FIG. 17 is referred about the 12th Embodiment of this invention. FIG. 17 is a diagram illustrating a manufacturing process of a thin-film solar cell including an inspection process according to the twelfth embodiment.

The manufacturing process of the thin film solar cell is an example of the manufacturing method of the electronic device of the present invention. As shown in (A), the transparent electrode film 4 is, for example, SnO ₂ on a transparent or translucent substrate 2 such as glass. It is formed by vapor deposition. The transparent electrode film 4 is patterned to form a plurality of electrodes 41, 42, 43... Separated into strips as shown in FIG.

  As described above, the separation state between the electrodes 41, 42, 43... Is inspected using the inspection circuit and the inspection method described in the above embodiment.

  After passing through this inspection process, as shown in (C), a thin film layer 106 such as amorphous silicon, a back electrode layer 108, etc. are formed on the electrodes 41, 42, 43. Is formed, and a thin film solar cell is manufactured.

Thus, according to the manufacturing method of the present invention, since the separation state between the electrodes described above can be inspected quickly and accurately, the manufacturing time can be shortened and a thin film solar cell with high product quality can be manufactured. .

INDUSTRIAL APPLICABILITY The present invention can efficiently and accurately inspect the separation state between a large number of electrodes of an electronic device such as a thin film solar cell, and is useful for improving inspection efficiency and product quality.

2 Substrate 41, 42, ... 4n Electrode 21, 22, ... 2n Power supply 31, 32 ... 3n Measuring instrument 51, 52, 53, 61, 62, 63 ... Probe SW1, SW2 switch

Claims (5)

An electrode separation state inspection method for inspecting a separation state of a plurality of electrodes arranged at intervals on a substrate,
The power supply wiring connected to the electrode and the measuring means are alternately connected, and the power supply wiring further includes a first power supply wiring and a second power supply wiring, and the first power supply wiring and the second power supply wiring are provided. A step of alternately connecting the power supply wiring to the electrode across the electrode to which the measuring means is connected;
A test voltage is applied from the first power supply wiring to the electrode connected to the first power supply wiring, and the input of the measuring means is input from the second power supply wiring to the electrode connected to the second power supply wiring. Measuring the current flowing between the electrode connected to the first power supply wiring and the electrode connected to the measuring means by the measuring means by applying the same voltage as
A test voltage is applied from the second power supply wiring to the electrode connected to the second power supply wiring, and the input of the measuring means is input from the first power supply wiring to the electrode connected to the first power supply wiring. Measuring the current flowing between the electrode connected to the second power supply wiring and the electrode connected to the measuring means by the measuring means by applying the same voltage as
An electrode separation state inspection method comprising: Connecting a measuring circuit consisting of a power source and a measuring instrument to a part of the electrode;
Moving a connection point between the measurement circuit and the electrode;
A step of measuring the separation state between all electrodes divided into a plurality of times along with the movement;
The electrode separation state inspection method according to claim 1, further comprising: An electrode separation state inspection device for inspecting the separation state of a plurality of electrodes arranged at intervals on a substrate,
Measuring means for measuring current;
Power supply wiring connected to the electrodes;
The power supply wiring and the measuring means are alternately connected, and the power supply wiring further includes a first power supply wiring and a second power supply wiring, and the first power supply wiring and the second power supply wiring are provided. A measurement circuit in which electrodes connected to the first power supply wiring or the second power supply wiring are each one or more, alternately connected to electrodes across the electrodes to which the measurement means is connected;
A test voltage is applied from the first power supply wiring to the electrode connected to the first power supply wiring, and the measurement is performed from the second power supply wiring to the electrode connected to the second power supply wiring. By applying the same voltage as the input of the means, the current flowing between the electrode connected to the first power supply wiring and the electrode connected to the measuring means is measured by the measuring means, and A test voltage is applied from the second power supply wire to the electrode connected to the second power supply wire, and the electrode connected to the first power supply wire is connected to the input of the measuring means from the first power supply wire. Separation of electrodes characterized in that, by applying the same voltage, a current flowing between the electrode connected to the second power supply wiring and the electrode connected to the measuring means is measured by the measuring means. Condition inspection device A measuring circuit consisting of a power source and measuring means connected to a part of the electrode;
Moving means for moving a connection point between the measurement circuit and the electrode;
Measuring means for measuring the separation state between all electrodes divided into multiple times with the movement,
The electrode separation state inspection apparatus according to claim 3 , comprising: A method for manufacturing an electronic device comprising a plurality of electrodes arranged at intervals on a substrate,
Forming a plurality of electrodes arranged at intervals on the substrate;
Inspecting the separation state between the electrodes using the separation state inspection method according to claim 1 or claim 2 , the separation state inspection device according to claim 3 or claim 4 , and
A method for manufacturing an electronic device, comprising:

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