JP5340248B2 - Light emitting semiconductor device connector - Google Patents

Description

  The present invention relates to a connector for connecting a light-emitting semiconductor element that can be connected to an LED module on which a light-emitting semiconductor element (LED) is mounted.

Conventional examples of connectors for connecting light emitting semiconductor elements (hereinafter referred to as LED connectors) include those disclosed in Patent Documents 1 and 2, for example.
The LED connector disclosed in Patent Document 1 includes a metal base shell mounted on a circuit board and having an upper surface opened, and a contact housed in the base shell that is electrically connected to the circuit board and has an insulated surface. A member and a metal cover shell connected to the base shell while closing the upper surface of the base shell. When an LED module, which is an integrated body of a light emitting semiconductor element (LED) and an LED board, is inserted into the space formed by the base shell and the cover shell, the terminals of the LED board are electrically connected to the circuit board through the contact member, and the LED is It is exposed to the outside through an opening formed in the cover shell.
On the other hand, the LED connector of Patent Document 2 includes a heat sink and a board socket having a contact fixed to the upper surface of the heat sink, and a terminal portion formed at the end of the contact is connected to the circuit board. doing. When the LED module is inserted into the space formed between the heat sink and the board socket, the terminals of the LED board are electrically connected to the circuit board through the contacts, and the LED board is in contact with the heat sink.

In the market, since it is required to increase the luminance of the LED as an illumination device, it is an issue to increase the light emission efficiency per LED. The LED has a characteristic that the heat generation amount increases as the light emission efficiency increases, and on the other hand, the light emission efficiency and the lifetime decrease when the temperature of the LED increases as the heat generation amount increases. Therefore, in this type of connector, a heat dissipating function for efficiently dissipating heat generated in the LED is important.
In the LED connector disclosed in Patent Document 1, heat generated in the LED is transmitted from the LED substrate to the fins formed on the base shell and the cover shell through the contact member, and is radiated from the base shell and the cover shell.
On the other hand, in the LED connector disclosed in Patent Document 2, heat generated in the LED is transmitted from the LED substrate to the heat radiating plate and is radiated from the heat radiating plate.

Japanese Patent No. 4391555 JP 2006-107838 A

In Patent Document 1, the LED substrate and the shell are not directly contacted, but a contact member is interposed between the LED substrate and the base shell, and the fins of the base shell and the cover shell (portions that contact the contact member) are small. Therefore, the heat transfer efficiency from the LED substrate to the base shell and the cover shell is not sufficient, and the heat of the LED cannot be efficiently radiated from the base shell and the cover shell.
The LED connector of Patent Document 2 has a structure in which an LED module is inserted into and fitted into a board socket from a lateral direction (a direction parallel to the circuit board), and thus the LED module is allowed to move laterally. It is necessary to secure a working space in the periphery on the same plane as the board socket. For this reason, when the board socket is positioned at the approximate center of the heat sink (or the circuit board on which the board socket is mounted), another part of the heat sink (or the circuit board) faces the work space. Board sockets and components cannot be mounted. Therefore, the board socket and the above components cannot be mounted with a space in the module insertion / removal direction narrowed with respect to the heat sink (or circuit board).

  An object of the present invention is to provide a connector for connecting a light-emitting semiconductor element that can efficiently dissipate heat generated in an LED than before and that can be easily attached / detached without being restricted by the layout of a mounted product on a circuit board. There is to do.

A connector for connecting a light-emitting semiconductor element according to the present invention includes a single plate-like substrate support portion for mounting an LED and supporting an LED substrate having terminals directly or via a member having thermal conductivity, and the substrate support A metal base member having a mounting portion that is provided on a pair of side edge portions of the portion facing each other so as to be positioned around the LED substrate and soldered to the circuit board, and is relatively moved to the substrate support portion An insulator that is fixedly disabled and that forms an insertion groove into which the LED board is inserted and removed between the board support portion, and the terminal of the LED board that is supported by the insulator and is inserted into the insertion groove. And a contact conducting with the circuit pattern on the circuit board.
Furthermore, when the LED substrate is inserted into the insertion groove, the terminal may be positioned in the insertion groove, and the contact may be fixedly mounted on the circuit pattern.
The mounting portion may include a positioning protrusion made of a plate material facing the side surface of the LED substrate and orthogonal to the LED substrate.

  In the vicinity of the peripheral portion of the substrate support portion, a thermal expansion absorbing portion including a through hole or a concave portion arranged in a direction orthogonal to the mounting portion and the extending direction of the peripheral portion may be formed.

  When viewed in the orthogonal direction, the mounting part arranged in the direction orthogonal to the thermal expansion absorption part may be positioned between both ends of the thermal expansion absorption part in the extension direction.

  You may have two or more said mounting parts.

According to the present invention, since the substrate support portion that supports the entire LED substrate directly or through a member having thermal conductivity is large (to the extent that it supports the entire portion between both side edges of the LED substrate), Can efficiently dissipate heat generated from the substrate. Moreover, since the heat of the LED is efficiently transmitted from the substrate support portion to the mounting portion connected to the substrate support portion, the heat can also be radiated from the mounting portion.
Furthermore, since heat is efficiently transmitted from the mounting portion to the circuit board, the heat is also effectively radiated from the circuit board.
In addition, since the LED board can be attached to and detached from the connector from above, the LED board can be easily attached and detached even when other connectors and components are mounted on the same circuit board at a narrow interval. .

It is the perspective view seen from the front diagonal upper direction of the connector for LED of one Embodiment of this invention. It is the perspective view seen from the front slanting lower part of the connector for LED. It is sectional drawing which follows the III-III arrow line of FIG. It is the disassembled perspective view seen from the front diagonally upper direction of the connector for LED. It is the disassembled perspective view seen from the back diagonally downward of the connector for LED. It is the disassembled perspective view seen from the back diagonally downward of the connector for LED when an insulator and a contact are integrated. It is the perspective view seen from the back diagonally upward when making the LED board approach from the front, making the LED board diagonal. It is the perspective view seen from the front diagonal upper direction when an LED board is connected to the connector for LED. It is sectional drawing similar to FIG. 3 when an LED board is connected to the connector for LED. It is a perspective view similar to FIG. 1 of a modification. It is a perspective view similar to FIG. 1 of another modification.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. In the following description, front and rear, left and right, and up and down directions are based on the directions of arrows in the figure.
A light emitting semiconductor element connector (hereinafter referred to as “LED connector”) 10 according to the present embodiment includes a base member 15, an insulator 30, and contacts 40 and 41 as large components.
The base member 15 is a pressed product of a plate made of a metal having excellent thermal conductivity (for example, phosphor bronze, brass, stainless steel, iron, aluminum). The base member 15 includes a flat plate-like substrate support portion 16 that is long in the front-rear direction. A rectangular hole 17 having a rectangular shape that is long in the left-right direction is formed in a portion located behind the substrate support portion 16. A pair of left and right press-fitting pieces 18 projecting upward are projected from the rear edge of the rectangular hole 17, and a pair of left and right positioning pieces (L-shaped left and right positioning pieces) are formed on the left and right edges of the rectangular hole 17. Positioning protrusions) 19 project upward, and upper portions of the left and right positioning pieces 19 are retaining pieces 20. A pair of left and right mounting portions 22 extending rearward is projected from the rear edge portion of the base member 15, and a mounting portion 23 extending forward is projected from the front edge portion of the base member 15. . Fixed latches 24 are provided on both the left and right sides of the mounting portion 23 at the front edge portion of the base member 15 so as to extend upward and have bent portions 25 whose front end portions are bent downward. Five mounting portions 27 extending in the left-right direction are juxtaposed in the front-rear direction from the left and right side edges of the substrate support portion 16. Furthermore, left and right positioning protrusions (positioning protrusions) 28 extending upward are projected from the rear end of the first, third, and fifth positions from the front of the left and right mounting parts 27 by bending. It is. At the end of the left and right positioning protrusions 28 on the substrate support 16 side, an inclined surface is formed for guiding an LED substrate 50 described later to the substrate support 16 side. The mounting part 22, the mounting part 23, and the mounting part 27 (parts excluding the left and right positioning projection pieces 28) are all located on the same plane located slightly below the board support part 16.

  The insulator 30 is obtained by injection molding an insulating and heat resistant synthetic resin material. A pair of left and right arm portions 31 positioned at a position one step lower than the upper surface of the insulator 30 are provided at both left and right end portions of the insulator 30. The rear end portion of the insulator 30 is provided with a rear end protrusion 32 having a narrower left-right width than the front portion of the insulator 30 and having a lower surface positioned one step above the lower surface of the arm portion 31. On the lower surface of 32, six mounting through holes 33 extending upward are formed side by side in the left-right direction. An insertion groove 35 whose front surface is opened is recessed in the front half of the lower surface of the insulator 30, and a portion located between the insertion groove 35 and the rear end protrusion 32 on the lower surface of the insulator 30 faces upward. A pair of left and right fixing through holes 36 extending is formed. Further, on the lower surface of the insulator 30, three contact mounting grooves 37 extending in the front-rear direction extending from the front end of the insulator 30 to the front portion of the rear end protrusion 32 are recessed. The front end is open at the front and top surfaces of the insulator 30.

Both the two contacts 40 and the one contact 41 are made of a copper alloy (for example, phosphor bronze, beryllium copper, titanium copper) having spring elasticity or a thin plate of a Corson-based copper alloy in the form shown in the drawing mold (stamping). The surface is formed by nickel plating on the surface and then gold-plated.
The two contacts 40 are symmetrical with each other. The base piece 42, the tail piece 43 extending rearward after hanging from the rear end portion of the base piece 42, and the front edge portion of the base piece 42 forward. An elastically deformable piece 44 that extends and a pair of left and right fixed pieces 46 that extend upward from the front edge of the base piece 42 are provided. The elastic deformation piece 44 once extends upward from the base piece 42 and then extends obliquely downward to the front, and a contact protrusion 45 that curves downward is formed near the tip. The contact 41 located in the center includes a base piece 42, a tail piece 43 extending rearward from the rear end portion of the base piece 42, an elastic deformation piece 44 and a fixing piece 46 extending forward from the front edge portion of the base piece 47, It has.

The contacts 40 and 41 are fixed to the lower surface of the insulator 30 from below (see FIG. 6). That is, a pair of left and right fixing pieces 46 of the contacts 40 and 41 are press-fitted from below into a corresponding pair of mounting through holes 33 formed on the lower surface of the rear end protrusion 32. Since the minute protrusions formed on the side surface of each fixed piece 46 bite into the inner surface of the corresponding mounting through-hole 33, the contacts 40 and 41 have the base piece 42 and the base piece 47 in contact with the lower surface of the rear end protrusion 32. It is fixed to the insulator 30 in a state. Further, each elastic deformation piece 44 is located inside the corresponding contact mounting groove 37, and each contact protrusion 45 is located in the insertion groove 35 when each elastic deformation piece 44 is in a free state (see FIG. 3).
When the insulator 30 and the contacts 40 and 41 are integrated in this manner, the lower surfaces of the left and right arm portions 31 are pressed while the pair of press-fitting pieces 18 of the base member 15 are press-fitted into the pair of fixing through holes 36 on the lower surface of the insulator 30. It is placed on the left and right side edges of the rear part of the upper surface of the base member 15 (the part located outside the left and right positioning pieces 19). Since the front and rear dimensions of the press-fit piece 18 and the fixing through hole 36 are substantially the same, the back and forth movement of the insulator 30 relative to the base member 15 is restricted by the press-fit piece 18 and the fixing through hole 36. Further, a minute protrusion is formed on the side surface of the press-fitting piece 18, and this minute protrusion bites into the inner surface of the corresponding fixing through hole 36, so that a fixed fixing force generated between the press-fitting piece 18 and the fixing through hole 36 is used. The upward movement of the insulator 30 relative to the base member 15 is restricted. Further, since the retaining pieces 20 of the left and right positioning pieces 19 are bent outward (plastically deformed) and placed on the upper surface of the arm portion 31 (FIGS. 1, 2, and 8), the left and right retaining pieces 20 The upward relative movement of the insulator 30 with respect to the base member 15 is completely restricted.

  To mount the LED connector 10 assembled as described above on the upper surface of a circuit board CB (not shown in FIGS. 9 to 11) formed of a base material having high heat transfer and heat dissipation such as ceramic and aluminum. The upper surface of the insulator 30 (the portion where the mounting through hole 33 and the fixing through hole 36 are not formed) or the upper surface of the substrate support surface 16 is sucked by suction means (not shown) located above the LED connector 10. Then, by moving the suction means, the tail pieces 43 of the contacts 40, 41 are placed on a circuit pattern (not shown) coated with a predetermined amount of solder paste on the circuit board CB, and the mounting portion 22, mounting portion 23, Then, the mounting portion 27 is placed on a ground pattern (not shown) coated with a predetermined amount of solder paste on the circuit board CB. Then, each solder paste is heated and melted in a reflow furnace, each tail piece 43 is soldered to the circuit pattern, and the mounting portion 22, the mounting portion 23, and the mounting portion 27 are soldered to the ground pattern.

The LED substrate 50 that is a connection target is a flat plate that is made of a material having a high heat transfer and heat dissipation property such as a rectangular ceramic material that is long in the front-rear direction and aluminum, and the left and right dimensions thereof are substantially the same as those of the substrate support 16. The front-rear dimension is longer than that of the substrate support 16. A circuit pattern (not shown) and three terminals 51 connected to the circuit pattern are formed on the surface (upper surface) of the LED substrate 50. Further, an LED (Light Emitting Diode) 52 is provided on the surface of the LED substrate 50, and a terminal (not shown) of the LED 52 is electrically connected to the circuit pattern.
When connecting the circuit board CB to the LED connector 10, first, as shown in FIG. 7, the LED board 50 integrated with the LED 52 is approached to the LED connector 10 obliquely from the upper front while tilting the rear end downward. Then, the rear end portion of the LED substrate 50 is inserted into the space formed by the rear portion of the upper surface of the base member 15 and the insertion groove 35 of the insulator 30, and then the lower surface of the LED substrate 50 is brought into contact with the substrate support portion 16 (see FIG. 8, see FIG. Further, the front end portion of the upper surface of the LED substrate 50 is sandwiched between the pair of bent portions 25 and the substrate support portion 16 by sliding the LED substrate 50 slightly forward (see FIG. 9), and the rear end surface of the LED substrate 50 Is positioned immediately before the rear surface (rear wall) of the insertion groove 35. Then, due to the fixed latch 24 (bending portion 25) and the rear surface of the insertion groove 35, the allowable range of back and forth movement of the LED substrate 50 with respect to the base member 15 is limited to a minute range in which the contact state between each contact protrusion 45 and each terminal 51 is maintained. Is done. Further, since the gaps between the left and right side surfaces of the LED substrate 50 and the inner surfaces of the left and right left and right positioning pieces 19 and the front end portions (inclined surfaces) of the left and right positioning projection pieces 28 become a minute distance, The left and right allowable range is limited to a minute range in which the contact state between each contact protrusion 45 and each terminal 51 is maintained.
Further, each terminal 51 of the LED substrate 50 contacts the contact protrusion 45 while elastically deforming the elastic deformation piece 44 of the corresponding contact 40, 41 slightly upward, so that the terminal of the LED 52, the circuit pattern of the LED substrate 50, The LED 52 and the circuit pattern of the circuit board CB are electrically connected via the terminal 51 and the contacts 40 and 41. Therefore, when a switch (not shown) is switched to the ON side, power generated by a power supply (not shown) flows from the circuit board CB to the LED 52, and the LED 52 emits light. In addition, since the ground pattern of the circuit board CB is grounded to the same potential in the mounting part 22, the mounting part 23, and the mounting part 27 of the base member 15, external noise enters the circuit pattern of the LED board 50. It is possible to prevent the noise of the circuit pattern and the contacts 40 and 41 from leaking to the outside.

The heat generated by the LED 52 is directly transmitted from the lower surface of the LED substrate 50 to the upper surface of the substrate support portion 16 and also transmitted from the substrate support portion 16 to the plurality of mounting portions 22, 23, and 27. Furthermore, a part of the heat is radiated from the substrate support part 16 and the mounting parts 22, 23, 27 constituting the heat transfer path. Since the substrate support portion 16 is a large-sized member that supports most of the LED substrate 50, the heat transfer efficiency from the LED substrate 50 is high and the total area of the mounting portions 22, 23, 27 is large. And the heat transfer effect by the mounting parts 22, 23, and 27 is also large. The heat transmitted to the plurality of mounting parts 22, 23, 27 is transferred from the mounting parts 22, 23, 27 to the circuit board CB and efficiently radiated from the circuit board CB. As described above, the heat generated in the LED board 50 is efficiently transferred from the base member 15 (the board support part 16 and the mounting parts 22, 23, 27) to the circuit board CB, and then radiated from the base member 15 and the circuit board CB. Therefore, heat dissipation is good compared with the conventional LED connector.
Further, most of the upper surface of the LED substrate 50 is exposed, and the side of the LED substrate 50 is held as much as possible by making the end of the left and right positioning protrusions 28 on the substrate support portion 16 side an inclined surface. Therefore, heat can be prevented from being accumulated in the LED connector 10 without inhibiting heat dissipation from the LED substrate 50.
Further, since the plurality of mounting portions 22, 23, 27 are fixed to the circuit board CB by soldering, the mounting strength of the LED connector 10 with respect to the circuit board CB can be increased.
Further, since the LED board 50 can be attached to and detached from the LED connector 10 from above, the attaching and detaching work of the LED board 50 can be performed without being influenced by other members mounted on the same circuit board CB. Therefore, a plurality of LED connectors 10 and other components can be freely arranged on the circuit board CB, so that the degree of freedom in optical design can be increased.

  Note that after the switch is turned off and the current supply to the LED 52 is cut off, the fixing latch 24 is elastically deformed forward to the extent that it is separated from the LED board 50 by using a jig or the like. If the entire LED substrate 50 is moved forward while lifting the LED upward, the LED substrate 50 can be easily pulled out from the LED connector 10.

As mentioned above, although this invention was demonstrated based on the said embodiment, this invention is not limited to the said embodiment, It can implement, giving various deformation | transformation.
For example, like the LED connector 10 ′ shown in FIG. 10, the front and rear faces the mounting portion 27 (excluding the first one from the front) in the vicinity of the left and right side edges and the front edge of the board support portion 16 in the left-right direction. The thermal expansion absorbing portion 55 formed of a through long hole extending in the direction and the thermal expansion absorbing portion 56 formed of a through long hole extending in the left-right direction facing the mounting portion 23 in the front-rear direction may be formed. Each thermal expansion absorption part 55 is longer in the front-rear length than the opposing mounting part 27, the front end of each thermal expansion absorption part 55 is located in front of the front end of the opposing mounting part 27, and the rear end of each thermal expansion absorption part 55 is It is located behind the rear end of the mounting portion 27 that faces the mounting portion 27. Further, the thermal expansion absorption part 56 is longer in the left and right length than the mounting part 23, the left end of the thermal expansion absorption part 56 is located to the left of the left end of the mounting part 23, and the right end of the thermal expansion absorption part 56 is higher than the right end of the mounting part 23. Located on the right.
When the LED substrate 50 is turned on (light emitting state), the LED substrate 50 generates a large amount of heat while rapidly raising the temperature, and this heat is transmitted to the base member 15, so that the base member 15 undergoes thermal expansion. On the other hand, when the LED substrate 50 is turned off (extinguishes), the base member 15 is cooled by the surrounding outside air, and thus heat shrinks. And since the LED board 50 is used repeatedly ON and OFF, the base member 15 repeats thermal expansion and thermal contraction. Usually, the base member 15 and the circuit board CB are made of different materials (having different thermal expansion coefficients). Therefore, when the base member 15 repeats thermal expansion and thermal contraction, the mounting portion 22, Cracks may occur in the solder between the circuit board CB and the circuit board CB (particularly when the temperature rises suddenly or when both the left and right and front and rear ends are fixed) The stress becomes quite large and cracks are likely to occur).
However, in the modified example of FIG. 10, the thermal expansion absorbing portions 55 and 56 absorb the dimensional change of the substrate support portion 16 and the mounting portions 22, 23, and 27, so that the mounting portions 22, 23, and 27 move greatly with respect to the solder. There is nothing. Therefore, it is possible to reduce the possibility of cracks occurring in the solder between the mounting portions 22, 23, 27 and the circuit board CB.

FIG. 11 is a modification similar to FIG.
Long thermal expansion absorbing portions 57 extending in the front-rear direction are recessed in the vicinity of the left and right side edges of the substrate support portion 16 of the LED connector 10 ''. The front end position of the thermal expansion absorption part 57 is ahead of the front end of the second mounting part 27 from the front side, and the rear end position of the thermal expansion absorption part 57 is rearward of the rear end of the fifth mounting part 27 from the front side. Further, in the vicinity of the front edge portion of the substrate support portion 16, a thermal expansion absorption portion 58 whose left end position is on the left side of the left end of the mounting portion 23 and whose right end position is on the right side of the right end of the mounting portion 23 is recessed.
Similarly to FIG. 10, this modified example also absorbs the dimensional change of the board support part 16 and the mounting parts 22, 23, 27 because the thermal expansion absorption parts 57, 58 absorb the mounting parts 22, 23, 27 and the circuit board CB. It is possible to reduce the possibility of cracks occurring in the solder in between. Moreover, since the thermal expansion absorption part 57 of the modification of FIG. 11 is longer than the total value of the four thermal expansion absorption parts 55 of FIG. 10, the board | substrate support part 16 and the mounting part 22, compared with the modification of FIG. The dimensional change of 23 and 27 can be absorbed effectively.
Note that the thermal expansion absorbing portions 55 and 56 in FIG. 10 may be recessed, and the thermal expansion absorbing portions 57 and 58 in FIG. 11 may be through long holes.
Further, the size, shape, number, etc. of the thermal expansion absorbing portions 55, 56, 57, 58 are not limited to those described above, but in any case, the thermal expansion absorbing portions 55, 56, 57, 58 are formed in the vicinity of the mounting portion of the substrate support portion 16 and mounted. It is important that the part can follow the circuit board CB.

Further, a heat conductive member (for example, a heat conductive sheet or a heat conductive grease) having thermal conductivity between the lower surface of the LED substrate 50 and the upper surface of the substrate support portion 16 or between the lower surface of the substrate support portion 16 and the upper surface of the circuit board CB. ) To transmit the heat of the LED board 50 to the board support 16 and the circuit board CB through the heat conducting member.
Furthermore, the base material of the LED substrate 50 may be a glass epoxy substrate such as FR-4 or a glass composite substrate such as CEM-3.

10 10 '10 "LED connector (connector for light emitting semiconductor element connection)
15 Base member 16 Substrate support portion 17 Rectangular hole 18 Press-fit piece 19 Left-right positioning piece (positioning protrusion)
20 retaining piece 22 23 mounting portion 24 fixing latch 25 bent portion 27 mounting portion 28 right and left positioning protrusion (positioning protrusion)
30 Insulator 31 Arm 32 Rear end protrusion 33 Mounting through hole 35 Insertion groove 36 Fixing through hole 37 Contact mounting groove 40 41 Contact 42 Base piece 43 Tail piece 44 Elastic deformation piece 45 Contact protrusion 46 Fixing piece 47 Base piece 50 LED board 51 Terminal 52 LED
55 56 57 58 Thermal expansion absorber CB Circuit board

Claims (6)

A flat plate-like single substrate support portion for mounting an LED and supporting an LED substrate having a terminal directly or via a member having thermal conductivity, and a pair of side edge portions of the substrate support portion facing each other A metal base member that has a mounting portion that protrudes so as to be positioned around the LED substrate and is soldered to the circuit board;
An insulator that is fixed to the substrate support portion so as not to move relative to the substrate support portion, and that forms an insertion groove into and out of the LED substrate; and
A contact that is supported by the insulator, contacts the terminal of the LED board inserted into the insertion groove, and is electrically connected to a circuit pattern on the circuit board;
A connector for connecting a light emitting semiconductor element, comprising: In the connector for light emitting semiconductor element connection of Claim 1,
When the LED board is inserted into the insertion groove, the terminal is located in the insertion groove,
A connector for connecting a light emitting semiconductor element, wherein the contact is mounted on the circuit pattern in a fixed state . In the connector for light emitting semiconductor element connection of Claim 1 or 2 ,
A connector for connecting a light-emitting semiconductor element , wherein the mounting part includes a positioning protrusion made of a plate material facing the side surface of the LED substrate and orthogonal to the LED substrate . In the connector for light emitting semiconductor element connection of any one of Claim 1 to 3,
A connector for connecting a light-emitting semiconductor element, wherein a thermal expansion absorption part comprising a through hole or a recess arranged in a direction orthogonal to the mounting part and the extending direction of the peripheral part is formed in the vicinity of the peripheral part of the substrate support part . The light emitting semiconductor element connection connector according to claim 4,
A connector for connecting a light-emitting semiconductor element, wherein the mounting part arranged in the direction orthogonal to the thermal expansion absorption part is located between both ends of the extension direction of the thermal expansion absorption part when viewed in the orthogonal direction . In the connector for light emitting semiconductor element connection of any one of Claim 1 to 5,
  A connector for connecting a light-emitting semiconductor element having a plurality of the mounting portions.

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