JP5336448B2 - Electronic control unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic controller in which a plurality of high heating elements can be positioned on a heat sink. <P>SOLUTION: In an electronic controller 1, a plurality of high heating elements 41 can be positioned on a heat sink 40 and fixed thereto while holding the orientation of terminals 47 in an appropriate state by means of each terminal holding part 52b of holding/fixing means 42. Consequently, each high heating element 41 can be connected easily to a first circuit board 21 without correcting the position thereof. Consequently, assembly workability of the device 1 can be enhanced, and manufacturing cost of the device 1 can be reduced. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to an electronic control device mounted on, for example, an automobile and used for controlling an engine, a brake, and the like.

  As a conventional electronic control device, for example, one described in Patent Document 1 below is known.

  In this electronic control device, by disposing a plurality of high heat-generating elements such as MOS-FETs having high heat generation properties in contact with a heat sink disposed on the side of the casing, heat dissipation of each high heat-generating element is achieved. Yes.

JP-A-8-181472

  However, since the conventional electronic control device employs a structure in which the high heat generating elements are connected to the circuit board and then fixed to the heat sink, the high heat generating elements are first fixed to the heat sink. The positioning between each high heat generating element and the heat sink is not considered at all. Therefore, when connecting each high heat generating element to the circuit board, the posture of each high heat generating element must be corrected. In other words, there is a problem that the assembly of the apparatus becomes complicated.

  The present invention has been devised in view of such technical problems, and an object thereof is to provide an electronic control device capable of easily connecting a plurality of high-heat-generating elements after being fixed to a heat sink to a circuit board. .

  The present invention is a circuit board that is housed and fixed in a housing and electrically connected to a plurality of high heat generating elements, and is provided separately from the housing, and is disposed in proximity to each high heat generating element. A heat sink for radiating heat from each of the high heat generating elements and a terminal holding portion for holding terminals of the high heat generating elements, and a non-conductor positioned and fixed to the heat sink together with the high heat generating elements. And an element holding means.

  According to the present invention, since the plurality of high heat generating elements can be positioned and fixed to the heat sink with the terminal orientation being held by the element holding means, the posture of each high heat generating element after the fixing is corrected. And can be easily connected to the circuit board.

It is the perspective view which looked at the electronic control unit concerning a 1st embodiment of the present invention from the front side. It is the perspective view which looked at the electronic control unit concerning the present invention concerning the embodiment from the back side. FIG. 2 is an exploded perspective view of the electronic control device shown in FIG. 1. It is the sectional view on the AA line of FIG. FIG. 2 is a perspective view showing a state where a cover of the electronic control device shown in FIG. 1 is removed. FIG. 4 is a perspective view showing a single case shown in FIG. 3. It is the perspective view which looked at the circuit board unit single-piece | unit shown in FIG. 3 from the front side. It is the perspective view which looked at the circuit board unit single-piece | unit shown in FIG. 3 from the rear surface side. FIG. 8 is an exploded perspective view of the circuit board unit shown in FIG. 7. FIG. 8 is a perspective view showing a state where the first circuit board of the circuit board unit shown in FIG. 7 is removed. It is the perspective view which looked at the connector simple substance shown in FIG. 3 from the front side. It is the perspective view which looked at the connector simple substance shown in FIG. 3 from the rear surface side. It is the BB sectional view taken on the line of FIG. It is CC sectional view taken on the line of FIG. It is the DD sectional view taken on the line of FIG. FIG. 10 is a perspective view showing a single heat sink unit shown in FIG. 9. It is the EE sectional view taken on the line of FIG. FIG. 17 is a perspective view showing a single heat sink shown in FIG. 16. FIG. 17 is a perspective view showing a single high heat generating element shown in FIG. 16. It is the perspective view which looked at the holding | maintenance fixing means simple substance shown in FIG. 16 from the front side. It is the perspective view which looked at the holding | maintenance fixing means simple substance shown in FIG. 16 from the rear surface side. It is a perspective view showing the state which assembled | attached the high heat generating element to the holding | maintenance fixing means shown in FIG. It is the perspective view which looked at the circuit board unit single-piece | unit of the electronic controller which concerns on 2nd Embodiment of this invention from the front side. It is the FF sectional view taken on the line of FIG. It is the perspective view showing the heat sink single-piece | unit shown in FIG. It is the perspective view which looked at the electronic control unit concerning a 3rd embodiment of the present invention from the front side. FIG. 27 is an exploded perspective view of the electronic control device shown in FIG. 26. FIG. 28 is a perspective view showing a state in which the first circuit board of the circuit board unit shown in FIG. 27 is removed. It is a perspective view equivalent to FIG. 20 showing other embodiment of the element holding means based on this invention.

  Embodiments of an electronic control device according to the present invention will be described below in detail with reference to the drawings. In the following embodiments, the electronic control device is applied to automobile engine control.

  1 to 22 show a first embodiment of an electronic control device according to the present invention. As shown in FIGS. 1 to 4, the electronic control device 1 is a predetermined resin that is lighter than a metal material. It is mainly composed of a case 10 made of a material and a circuit board unit 20 that is accommodated in the case 10 and fixed with a plurality of screws B1.

  The housing 10 is fitted into the case 11 so as to close and close the case 11 (first member according to the present invention) for accommodating and fixing the circuit board unit 20 and the upper opening thereof. The case 11 and the cover 12 are fixed with a plurality of screws B2. The cover 12 is a substantially plate-like cover 12 (second member according to the present invention). The front and back surfaces of the housing 10 are provided with first and second window portions 10a and 10b having substantially the same trapezoidal shape, and the first window portion 10a is closed by a connector 30 described later. Thus, the second window portion 10b is closed by a heat sink 40 described later.

  Here, as shown in FIG. 4, in the electronic control device 1, a fluid adhesive 13 is interposed between the joint portions of the case 11, the cover 12, the connector 30 and the heat sink 40 described later. Thus, the joints are sealed in a liquid-tight manner, thereby suppressing the intrusion of moisture and dust into the housing 10 from the outside.

  As shown in FIGS. 5 and 6, the case 11 is disposed on each side of the bottom wall 14 covering the lower surface of the circuit board unit 20 on the front and rear surfaces of the case 11. A pair of first and second side walls 15 and 16 in which first and second notch portions 15a and 16a defining 10a and 10b are formed, and third and fourth side walls 17 and 16 disposed on both side surfaces thereof. 18 is standing upright, and has a box shape configured to open upward.

  And in each corner part (four corners) of this case 11, the cover attachment part 11a used for attachment fixation with the cover 13 is projected outward, and the upper end surface of each of these cover attachment parts 11a is respectively Female screw holes 11b into which the screws B2 are respectively screwed are provided. Further, a plurality of board mounting portions 17a and 18a for mounting and fixing the circuit board unit 20 are formed on the inner side of the third and fourth side walls 17 and 18, and the board mounting portions 17a and 18a are provided. Female screw holes 17b and 18b are provided on the upper end surface, respectively, into which the screws B1 are screwed.

  Further, as shown in FIG. 5, in the state where the circuit board unit 20 is accommodated and fixed to the case 11, seal grooves provided in the connector 30 and the heat sink 40 described later are formed on the upper end surfaces of the side walls 15 to 18, respectively. A pair of seal groove constituting portions 19a which form a series of seal grooves 19 which are linked to the constituting portions 19b and 19c and form a ring shape as a whole are notched.

  Further, as shown in FIG. 6, the first and second cutout portions 15a and 16a are respectively provided with engaging protrusions 26a and 45a provided on the connector 30 and the heat sink 40, respectively, on the upper end surfaces thereof. The first and second engaging grooves 15b and 16b to be joined are provided so as to be continuous with the both seal groove constituting portions 19a. Thus, the formability of the case 11 is improved by providing each of the engaging grooves 15b and 16b so as to form a series of grooves with the pair of seal groove constituting portions 19a.

  Here, the notches 15a and 16a are configured so as to be inclined so that both sides thereof are not vertical. By providing the both inclined portions 15c and 16c, the notches 15a and 16a are provided in the engaging grooves 15b and 16b. The effect of gravity on the adhesive 13 when the adhesive 13 is filled is alleviated, and when the adhesive 13 is filled, the adhesive 13 flows down to the lowest portions 15d and 16d of the engagement grooves 15b and 16b. The malfunction which will be suppressed is suppressed.

  As shown in FIGS. 3 and 4, the back surface of the cover 12 is reinforced by a predetermined rib (not shown), and a series of engagement with the seal groove 19 is provided on the peripheral edge of the back surface. The protrusion 12a is formed to protrude downward so as to be continuous in the circumferential direction, and the protrusion 13a is engaged with the seal groove 19 in a state where the adhesive 13 is filled in the seal groove 19, whereby the adhesive 13 It is fixed to the case 11 via. Further, at each corner (four corners) of the cover 12, a case connecting portion 12b for mounting and fixing with the case 12 is projected outward, and each of the cover attaching portions 12b Screw insertion holes 12c through which the screws B2 are inserted are formed so that the screws B2 inserted into the screw insertion holes 12c are screwed into the female screw holes 11b of the case 11, whereby the cover 12 is It will be completely fixed to the case 11.

  As shown in FIGS. 7 to 10, the circuit board unit 20 includes first and second circuit boards 21 and 22 that are superposed on each other and predetermined various electronic components 23 that are mounted on the first circuit board 21. And a connector unit 24 fixed to both circuit boards 21 and 22 with a plurality of screws B3 and connected to both circuit boards 21 and 22, and a plurality of screws B4 on both circuit boards 21 and 22. The heat sink unit 25 fixed in the sandwiched state is integrated (so-called subassembly).

  The first and second circuit boards 21 and 22 are so-called printed wiring boards. For example, wiring circuit patterns (not shown) are formed on the front and back surfaces of a plate material made of, for example, glass epoxy resin, or the like. The various electronic components 23 are electrically connected to the pattern by solder or the like. Here, the wiring circuit pattern not shown in the figure is connected to each circuit board 21 in accordance with a connection destination (predetermined external device) connected via a connector 30 (first and second connector terminals 31 and 32) described later. , 22 and necessary circuits are provided for each connection destination. Specifically, in this embodiment, the first circuit board 21 is a power system board, and the second circuit board 22 is a second circuit board 22. It is configured to be a control system substrate.

  Further, in the vicinity of the outer periphery of the first circuit board 21, screw insertion holes 21a through which the respective screws B1 are inserted are formed at positions corresponding to the female screw holes 17b and 18b of the respective board mounting portions 17a and 18a. The circuit board unit 20 is completely fixed to the case 11 by screwing the screws B1 inserted through the screw insertion holes 21a into the female screw holes 17b and 18b of the case 11.

  Here, as the various electronic components 23, for example, capacitors, coils, transistors, and the like are used. In the following, among these electronic components 23, an electronic component with particularly high heat generation (for example, a MOS-FET or an inverter) is referred to as a high heat generating element 41.

  The connector unit 24 is provided for attachment to both the circuit boards 21 and 22 and the housing 10 as shown in FIGS. The first and second circuit boards 21 and 22 that face the outside of the housing 10 by being protruded from the outer surface of the mounting base 26 and that are housed therein Three first to third connection ports 27 to 29 connected to connectors (not shown) of external devices (for example, various sensors and pumps) together with the first and second connector terminals 31 and 32 to be connected. A bus bar terminal 33 that connects the circuit boards 21 and 22 is insert-molded into the connector 30 formed of a resin material, and is integrally formed.

  As shown in FIGS. 11 and 12, the mounting base portion 26 has a pair of board connecting portions 34 and 35 projectingly formed on the inner side thereof for connection to the circuit boards 21 and 22, respectively. The upper and lower end surfaces 34a, 34b, 35a, 35b of the board connecting portions 34, 35 are respectively provided with female screw holes 34c, 35c into which the screws B3 are screwed, and the upper and lower end surfaces of the board connecting portions 34, 35, respectively. In a state where 34a, 34b, 35a, 35b are sandwiched between the circuit boards 21, 22, the screws B3 are fixed to the circuit boards 21, 22 (see FIG. 13). Each of the female screw holes 34c and 35c may be provided in a bag shape that is vertically separated or may be provided so as to penetrate vertically.

  In addition, as shown in FIGS. 1, 5 and 11, the mounting base 26 is formed in a substantially trapezoidal shape corresponding to the first window portion 10a. A series of engaging ridges 26a that can be engaged with 15b are formed to protrude outward, and the engaging ridges 26a engage with the first engaging grooves 15b via the adhesive 13, whereby the connector The unit 24 is bonded and fixed to the case 11. Further, a seal groove constituting portion 19b constituting a part of the seal groove 19 is formed in the upper end portion of the mounting base portion 26 in cooperation with the seal groove constituting portion 19a of the case 11, and the seal groove is formed. When the protrusion 12a of the cover 12 is engaged with the component 19b via the adhesive 13, the connector unit 24 and the cover 12 are bonded and fixed.

  As shown in FIGS. 11 to 13, each of the first connector terminals 31 is formed by bending a metal plate into a substantially L shape, and one end side thereof is connected to the first circuit board 21 that is the power system board. On the other hand, the other end side is configured to face the outside by being inserted into the first and second connection ports 27 and 28 from the back surface of the connector 30.

  As shown in FIGS. 11, 12, and 14, the second connector terminal 32 is formed by bending a metal rod into an approximately L shape, and each bent portion 32 a protrudes from the inner surface of the mounting base portion 26. One end side is connected to the second circuit board 22, which is the control system board, while being held by the connector terminal holding portion 36, and the other end side is inserted into the third connection port 29 from the back surface of the connector 30. It is configured to face the outside.

  Here, as described above, necessary circuits (wiring circuit patterns) for each of the external devices are distributed and concentrated on the circuit boards 21 and 22, and the connector terminals 31 and 32 are respectively connected to different circuit boards 21. , 22, the connection between the circuit boards 21 and 22 can be minimized. As a result, the assembly work of the apparatus 1 can be facilitated, and the wiring circuit pattern can be shortened, contributing to the downsizing of the circuit boards 21 and 22.

  As shown in FIGS. 11, 12, and 15, the bus bar terminal 33 is formed by slightly bending both ends of the metal rod, and the linear intermediate portion 33 a is an inner surface of the mounting base portion 26. The one end side is connected to the first circuit board 21 while the other end side is connected to the second circuit board 22 while being held by the bus bar terminal holding portion 37 projecting from the two circuit boards 21, It is comprised so that 22 may be connected. Accordingly, a drive (control) signal is transmitted from the control-system second circuit board 22 to the power-system first circuit board 21, while the power-system first circuit board 21 is transmitted to the control-system second circuit board 22. A status signal is transmitted (feedback).

  Here, each end side of the bus bar terminal 33 is bent in accordance with the bus bar insertion holes 21b and 22b of the circuit boards 21 and 22, so that the bus bar terminal 33 is connected to the bus bar insertion holes 21b and 22b. Contact between the bus bar terminal 33 and the inner peripheral portion of each of the bus bar insertion holes 21b and 22b during insertion is suppressed, so that when the bus bar terminal 33 and each of the circuit boards 21 and 22 are connected, A problem that stress is generated in each connection portion is suppressed.

  In addition, since both the circuit boards 21 and 22 are connected by the bus bar terminal 33 integrated with the connector 30 (connector unit 24) as described above, the workability conventionally used for the connection between the boards is improved. Served to abolish or reduce bad flat cables. This can contribute to facilitating the assembling work of the apparatus 1 and can reduce the area where the mounting of the various electronic components 23 on the circuit boards 21 and 22 is restricted by the flat cable. The circuit boards 21 and 22 can be reduced in size.

  As shown in FIGS. 16 to 22, the heat sink unit 25 is fixed in a sandwiched state between the circuit boards 21 and 22 and is bonded and fixed to the housing 10, mainly for heat dissipation of the high heat generating elements 41. A heat sink 40 to be provided, six high heat generating elements 41 disposed in contact with the inner side surface 40a of the heat sink 40 via a known insulating sheet 43, and holding fixing for holding and fixing the high heat generating elements 41 integrally. And means 42 (corresponding to the element holding means according to the present invention).

  As shown in FIGS. 2 and 8, the heat sink 40 is formed in a substantially rectangular plate shape with a metal material having excellent heat dissipation such as iron or aluminum, and is connected to the circuit boards 21 and 22. Mainly composed of a board connecting portion 44 to be provided and a housing connecting portion 45 that extends to the outside of the board connecting portion 44 and constitutes a part of the rear surface of the housing 10 when attached to the housing 10. ing.

  As shown in FIGS. 16 and 18, the substrate connecting portion 44 is provided with female screw holes 44c into which the screws B4 are respectively screwed on the upper and lower end surfaces 44a and 44b, and the upper and lower end surfaces 44a and 44b. Is fixed to the circuit boards 21 and 22 with the screws B4 (see FIGS. 13 to 15). Each female screw hole 44c may be provided in a bag shape that is vertically separated, or may be provided so as to penetrate vertically. Furthermore, six positioning holes 44d used for positioning of the holding and fixing means 42 and three female screw holes 44e used for fixing the holding and fixing means 42 are provided on the inner side surface of the board mounting portion 44, respectively. It is provided in parallel with a predetermined interval on a straight line along the direction. Each of the positioning holes 44d and the female screw holes 44e are formed in a non-penetrating bag shape on the outside.

  As shown in FIGS. 2, 5, and 8, the housing connecting portion 45 is formed in a substantially trapezoidal shape corresponding to the second window portion 10 b, and the second engaging groove is formed on both side portions and the lower portion thereof. A series of engaging ridges 45a that can be engaged with 16b are formed to protrude outward. The engaging ridges 45a are engaged with the second engagement grooves 16b via the adhesive 13, whereby the heat sink. The unit 25 is bonded and fixed to the case 11. Further, as shown in FIGS. 5, 16, and 17, the heat sink 40 has a seal groove configuration that forms part of the seal groove 19 in cooperation with the seal groove configuration portion 19 a of the case 11. The portion 19c is notched, and the heat sink unit 25 and the cover 12 are bonded and fixed by engaging the protrusion 12a of the cover 12 via the adhesive 13 with the seal groove constituting portion 19c. .

  As shown in FIGS. 19 and 22, each of the high heat generating elements 41 includes a component main body 46 in which a predetermined electronic component (not shown) forming the core of each component 41 is built, and an electronic component not shown in the drawing. Three terminals 47 provided for connection to the first circuit board 21 and a heat sink portion 48 disposed in contact with an electronic component outside the drawing and used for heat dissipation of the electronic component outside the drawing are integrally formed with a resin mold 49. It is configured.

  Each of the terminals 47 has the same shape and is configured to have a stepped width from the proximal end side to the distal end side, and a stepped portion 47c between the widened portion 47a on the proximal end side and the reduced width portion 47b on the distal end side. And each of the high heating elements 41 is electrically connected to the first circuit board 21 by being soldered in a state where the 47b is inserted into the terminal insertion hole 21c of the first circuit board 21. Will be connected.

  Like the heat sink 40, the heat sink portion 48 is formed in a substantially rectangular plate shape with a metal material having excellent heat dissipation such as iron or aluminum, and most of the heat sink portion 48 is exposed on the back surface of each high heat generating element 41. It is provided to do. The heat sink portion 48 is disposed in contact with the inner side surface of the heat sink 40 via the insulating sheet 43, so that heat of the electronic component (not shown) is radiated from the heat sink portion 48 to the outside via the heat sink 40. It is like that. Further, a positioning hole 48 a is provided in the lower end side of the heat sink portion 48 so as to penetrate the high heating elements 41 by the holding and fixing means 42.

  As shown in FIGS. 16, 17, and 20 to 22, the holding and fixing means 42 is a series of mounting and fixing to the heat sink 40 while positioning the high heating elements 41 in the vertical and horizontal directions. The so-called mounting base 51 and six alignment holding portions 52 that are arranged in parallel along the longitudinal direction of the mounting base 51 and that serve to hold the alignment of the high heat-generating elements 41 are integrally formed of a resin material. In the brace member 50, a reinforcing member 53 made of a metal material is insert-molded inside (inside) the attachment base 51, and is fixed to the inner surface of the heat sink 40 with three screws B5 via the attachment base 51. Yes. As described above, both the weight reduction and the strength are achieved by inserting the reinforcing member 53 while the majority is formed of the resin material.

  The mounting base 51 includes the first to sixth positioning portions 54 to 59 for positioning the high heating elements 41, and the first and second positioning portions. Three first to third attachment portions 61 to 63 disposed between the portions 54 and 55, between the third and fourth positioning portions 56 and 57, and between the fifth and sixth positioning portions 58 and 59. 21, the entire inner portion shown in FIG. 21 is covered with a resin material, while the outer portion shown in FIG. 20 is covered with a resin material only at portions corresponding to the positioning portions 54 to 59. About the part corresponding to the attaching parts 61-63, the reinforcement member 53 is in the exposed state. In other words, the holding and fixing means 42 can be firmly fixed to the heat sink 40 by exposing the metal reinforcing member 53 at the portion that comes into contact (pressure contact) with the head of each screw B5.

  As shown in FIGS. 17 and 21, the positioning portions 54 to 59 are inserted into the positioning holes 48 a of the high heat generating elements 41, respectively, so First to sixth positioning protrusions 54a to 59a that perform positioning in both directions are provided. With this configuration, each of the high heat generating elements 41 is inserted into the positioning holes 44d with the positioning protrusions 54a to 59a inserted into the positioning holes 48a. The inner side surface 51 a of the mounting base 51 and the inner side surface 40 a of the heat sink 40 are sandwiched and fixed via the heat sink portions 48.

  As shown in FIG. 20 and FIG. 21, screw insertion holes 61 a to 63 a through which the screws B <b> 5 are inserted are respectively formed through the mounting portions 61 to 63, and the screw insertion holes 61 a to 63 a are penetrated. The holding and fixing means 42 is fixed to the heat sink 40 by screwing the inserted screws B5 into the female screw holes 44e.

  As shown in FIGS. 17 and 20 to 22, each of the alignment holding portions 52 extends in the vertical width direction (vertical direction) of the mounting base 51 from the upper end of the positioning portion 54 to 59 of the mounting base 51. And a support wall 52a that supports each terminal holding portion 52b to be described later, and is provided at the tip of the support wall 52 so as to protrude inward with respect to the support wall 52. 52c, and a terminal holding portion 52b for holding each terminal 47 of each high heat generating element 41, and each of the alignment holding portions 52 and the mounting base portion 51. A concave component housing portion 60 for housing each of the high heat generating elements 41 is formed.

  Each terminal holding portion 52b has three terminal insertion holes set to have an inner diameter such that the reduced width portion 47b of each terminal 47 can be inserted and the high heating elements 41 can be positioned in the rotational direction. 52c is provided in parallel along the left-right width direction (longitudinal direction of the mounting base 51).

  And from this structure, as shown in FIG. 22, each said high heat generating element 41 has each said terminal 47 inserted in each said terminal insertion hole 52c, and each said each positioning hole 48d of each said heat sink part 48. The positioning protrusions 54a to 59a are inserted, so that they are temporarily fixed (so-called sub-assemblies) to the holding / fixing means 42 in a state where the positioning protrusions 54a to 59a are positioned. Hereinafter, the temporarily fixed member is referred to as a brace assembly BA.

  Hereinafter, an assembly method (procedure) of the electronic control device 1 configured as described above will be described with reference to the drawings.

  First, the brace assembly BA is constructed. That is, as shown in FIGS. 19, 21, and 22, the front surface (surface on the resin mold 49 side) of each high heating element 41 is made to face the inner surface of each support wall 52 a of the holding and fixing means 42. Then, after inserting the reduced width portions 47b of the terminals 47 into the terminal insertion holes 52c, the positioning protrusions 54a to 59a of the holding and fixing means 42 are inserted into the positioning holes 48a of the heat sink portions 48. As a result, the high heating elements 41 are temporarily fixed to the holding and fixing means 42 to constitute the brace assembly BA.

  Subsequently, the heat sink unit 25 is configured. That is, after affixing the insulating sheet 43 to a predetermined position on the inner surface 40a of the heat sink 40, the brace assembly BA is inserted into the positioning holes 44d by inserting the positioning protrusions 54a to 59a into the bracing assembly. After positioning the BA, the screws B5 are screwed into the female screw holes 44e through the screw insertion holes 61a to 63a, thereby fixing the brace assembly BA to the heat sink 40, and the heat sink unit. 25 will be configured.

  Next, the circuit board unit 20 is configured. Specifically, first, as shown in FIG. 9, the heat sink unit 25 is screwed to the rear end portion of the second circuit board 22 with the screws B4. Subsequently, after connecting one end of the second connector terminal 32 and the other end of the bus bar terminal 33 to the front end of the second circuit board 22 to which the heat sink unit 25 is attached, respectively, the connector unit 24 is The second circuit board 22 is screwed with the screws B3. In this way, the first circuit board 21 on which the predetermined various electronic components 23 are mounted is placed on the connector unit 24 and the heat sink unit 25 that are respectively attached and fixed to the second circuit board 22. One end of the first connector terminal 31 and one end of the bus bar terminal 33 are connected to the front end, and the terminals 47 of the high heat generating elements 41 are connected to the rear end of the first circuit board 21 by soldering. Thereafter, the circuit board unit 20 is configured by connecting the first circuit board 21, the connector unit 24 and the heat sink unit 25 with the screws B3 and B4.

  Subsequently, after the assembly of the circuit board unit 20 is completed, the circuit board unit 20 is accommodated and fixed in the case 11. That is, as shown in FIGS. 3, 5, and 6, after the engagement grooves 15 b and 16 b of the case 11 are filled with the adhesive 13, the engagement grooves 15 b and the filling grooves 13 b are filled with the adhesive 13. The circuit board unit 20 is inserted into the case 11 so that the engaging protrusions 26a and 45a of the connector 30 and the heat sink 40 are engaged with 16b. Then, by inserting the screws B1 into the screw insertion holes 21a of the first circuit board 21 and screwing the screws B1 into the female screw holes 17b and 18b of the case 11, the circuit board unit 20 is It will be completely fixed to the case 11.

  Finally, the cover 12 is attached and fixed to the case 11 in which the circuit board unit 20 is accommodated. That is, after the seal groove 19 formed on the outer periphery of the upper end of the case 11 in which the circuit board unit 20 is accommodated is filled with the adhesive 30, the cover 12 protrudes into the seal groove 19 filled with the adhesive 30. The cover 12 is placed on the upper part of the case 11 so as to engage the strip 12a. The cover 12 is completely fixed to the case 11 by inserting the screws B2 into the screw insertion holes 12c of the cover 12 and screwing the screws B2 into the female screw holes 11b of the case 11. Thus, the assembly of the electronic control device 1 is completed.

  Thus, by adopting a structure in which the circuit boards 21 and 22, the connector 30 and the heat sink 40 can be subassembled as the circuit board unit 20, when the electronic control device 1 is assembled, the case 11, the cover 12, The circuit board unit 20 can be assembled in a so-called laminated state. Thereby, at the time of the assembly of the electronic control device 1, since the operation of inverting the device 1 after applying the adhesive 13 can be abolished, there is no risk of causing poor adhesion of the case 11, the cover 13, etc. Good waterproofness of the device 1 can be ensured. Further, such sub-assembly makes it easy to handle the electronic control device 1 during assembly, and also serves to improve the assembly workability of the device 1.

  As described above, in the electronic control device 1 according to the present embodiment, each of the high heat generating elements 41 is held by the terminal holding portions 52b of the holding and fixing means 42 while holding the orientation of the terminals 47 in an appropriate state. 40, the terminals 47 can be inserted into the terminal insertion holes 21b of the first circuit board 21 without correcting the posture of the high heat generating elements 41. As a result, the high heat generating elements 41 and the first circuit board 21 can be easily connected. As a result, the assembly workability of the device 1 can be improved, and the cost of the device 1 can be reduced.

  In addition, the holding and fixing means 42 has a structure in which all the high heat generating elements 41 are fixed to the heat sink 40 in a state where all the high heat generating elements 41 are positioned. Compared with the case where it fixes to, it can perform the said fixing operation | work smoothly and easily. Thereby, the further improvement of the assembly workability | operativity of the apparatus 1 can be aimed at.

  Furthermore, in the present embodiment, the holding and fixing means 42 is provided with positioning protrusions 54a to 59a related to positioning with respect to the heat sink 40 in addition to the screw insertion holes 61a to 63a related to the mounting and fixing. By positioning each of the positioning protrusions 54a to 59a into the positioning hole 48a of each of the high heat generating elements 41, the positioning of the holding and fixing means 42 and each of the high heat generating elements 41 is achieved. Positioning can be performed, and the protrusions 54a to 59a can be fitted into the positioning holes 44d of the heat sink 40 so that the holding and fixing means 42 can be positioned at a high position with respect to the heat sink 40. As a result, the positioning of each of the high heat generating elements 41 with respect to the heat sink 40 is also improved. Thereby, the high positioning property of each of the high heat generating elements 41 with respect to the first circuit board 21 is obtained, and the both 21 and 41 can be smoothly connected.

  Moreover, by forming the positioning holes 48a of the high heat generating elements 41 and the positioning holes 44d of the heat sink 40 in a circular shape, these can be formed with high accuracy. The positioning will be further improved by the positioning protrusions 54a to 59a.

  In addition, in the past, when fixing a high heat generating element to a heat sink, it was decided to screw it from the outside through a through hole provided with the heat sink, so to adopt a waterproof structure, fix the high heat generating element to the heat sink. Although it was necessary to seal each of the through holes later, in this embodiment, the holding and fixing means 42 is screwed from the inside of the heat sink 40 with the bag-shaped female screw hole 44e that does not penetrate the outer surface of the heat sink 40. Thus, when adopting the waterproof structure, the waterproof process after fixing the high heat generating element as in the conventional case can be omitted. Therefore, from this point of view, the assembly workability of the apparatus 1 can be improved.

  Further, in the present embodiment, since the heat sink 40 is configured as a part of the casing 10, the area of the casing 10 can be effectively used, and compared with a case where the heat sink is superposed on the side wall of the casing. 1 can be reduced in weight, and the heat sink 40 can be brought into direct contact with the outside air.

  Moreover, in the present embodiment, the casing 10 and the heat sink 40 are configured separately, and only the heat sink 40 is formed of a metal material having excellent heat dissipation, and the casing 10 occupying most of the exterior is made of metal. Since the resin material is lighter than the material, the device 1 can be significantly reduced in weight while ensuring the heat dissipation required by the heat sink 40.

  Furthermore, since the casing 10 according to the exterior having a large area as a component is formed of the resin material, it can contribute to further cost reduction of the device 1.

  23 to 25 show a second embodiment of the electronic control device according to the present invention. In this embodiment, the shape of the heat sink 40 according to the first embodiment is changed. In this embodiment as well, the basic configuration is the same as that according to the first embodiment. Therefore, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description will be given. Is omitted.

  That is, in this embodiment, the heat sink 40 according to the first embodiment is formed so as to have a substantially L-shaped cross section, and the lower portion of the heat sink 40 is extended inward. The lower surface 64 a is configured to be in contact with the front surface 22 a of the second circuit board 22.

  With this configuration, the heat sink 40 can be used for heat dissipation of the other high heat generating element 65 mounted on the second circuit board 22. That is, as shown in FIGS. 23 and 24, another high heat generating element 65 is arranged on the back surface 22b of the second circuit board 22 so as to overlap with the extending portion 64 of the heat sink 40 with the board 22 interposed therebetween. Thus, the heat of the other high heat generating element 65 can be radiated to the outside through the heat sink 40. In other words, the provision of the extending portion 64 also serves to dissipate heat from other high heat generating elements 65 connected to the second circuit board 22 that is not disposed in contact with the heat sink 40. Thereby, the further improvement of the heat dissipation of the apparatus 1 can be aimed at.

  26 to 28 show a third embodiment of the electronic control device according to the present invention. In this embodiment, the second circuit board 22 according to the first embodiment is abolished and the circuit board is replaced with the first one. This is configured by only one circuit board 21 and the arrangement of the heat sink 40 according to the embodiment is changed. In this embodiment as well, the basic configuration is the same as that according to the first embodiment. Therefore, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description will be given. Is omitted.

  That is, in the present embodiment, the entire housing 10 is formed of a metal material having excellent heat dissipation, and the heat sink 40 is accommodated inside the housing 10 that is not a part of the housing 10, so that the first circuit board is formed. The structure is arranged at approximately the center position of 21. In the heat sink 40, the upper end surface 44a of the board connecting portion 44 is fixed to the first circuit board 21 by a predetermined method such as a screw (not shown), and the lower end face 44b contacts the bottom wall 14 of the case 11. It is provided so that it may contact or be close.

  Further, in the heat sink 40, the high heat generating elements 41 are arranged in contact with the inner side surface 40a, and other high heat generating elements 66 mounted on the first circuit board 21 are arranged in close proximity to the outer side surface 40b. The heat of each of the high heat generating elements 41 and 66 is radiated through the heat sink 40.

  Therefore, according to this configuration, the heat of each of the high heat generating elements 41 and 66 is transferred to the case 11 through the heat sink 40 and is radiated to the outside through the case 11.

  Therefore, even if it is a structure like this embodiment, the said housing | casing 10 whole is formed with a metal material, This heat dissipation of each said high heat generating elements 41 and 66 by this metal housing | casing 10 (especially case 11). The effects similar to those of the first embodiment can be obtained except for the effects related to the weight reduction of the device 1.

  In addition, arrangement | positioning of the heat sink 40 which concerns on this embodiment is an example, Comprising: It does not necessarily need to be the center position vicinity of a board | substrate, The arrangement | positioning will be especially limited if it accommodates in the inside of metal housings 10. It is not something.

  The present invention is not limited to the configuration of each of the above embodiments. For example, the shape of the housing 10, the connector 30, and the heat sink 40 depends on the specifications of the electronic control device 1, the specifications of the automobile to be applied, and the like. It can be changed arbitrarily.

  In addition to the resin material, the housing 10 may be formed of a metal material having excellent heat dissipation, similar to the heat sink 40. In this case, although the device 1 cannot be significantly reduced in weight, the heat dissipation of the device 1 can be greatly improved accordingly. In other words, the material of the housing 10 can be arbitrarily changed according to the specifications of the electronic control device 1 and the specifications of the automobile to be applied.

  Further, the holding and fixing means 42 does not necessarily require that all the support walls 52a be linked to the mounting base 51 as in the above embodiments. For example, as shown in FIG. It is possible to form a substantially frame shape by integrating only the support walls 52 a located at both ends with the mounting base 51 and integrating the terminal holding portions 52. In the intermediate region excluding the above, as long as each of the terminal holding portions 52 is not limited to each of the support walls 52a, the same operational effects as those of the above-described embodiments can be obtained, and all of the respective support The wall 52a need not be linked to the mounting base 51. In other words, the holding and fixing means 42 only needs to be configured so that it can be temporarily fixed in a state where the respective high heat generating elements 41 are positioned. The specific shape of the holding and fixing means 42 depends on the specification, cost, etc. Can be changed freely.

  Further, in each of the embodiments, the circuit board 21 and 22 are connected to each other by the bus bar terminal 33. However, in the case where only the collective arrangement of the wiring circuit patterns is sufficient, The connection between the circuit boards 21 and 22 by the bus bar terminal 33 can be omitted. In other words, the connection between the circuit boards 21 and 22 by the bus bar terminal 33 is not necessarily a necessary configuration, and can be arbitrarily changed according to the specifications of the electronic control device 1 or the specifications of the vehicle to be applied. it can.

  Moreover, in each said embodiment, although what was called a breathing hole used for the internal pressure adjustment of the said housing | casing 10 and the breathing filter attached to this was provided in the said housing | casing 10 as an example, the specification of the electronic control apparatus 1 was demonstrated. Or it is good also as a structure which provides the said breathing hole etc. according to the specification etc. of the motor vehicle used as application object. Such a breathing hole or the like is only required to be provided at any part of the housing 10 and the position thereof can be freely set.

10 ... Case 21 ... First circuit board (circuit board)
22 ... 2nd circuit board 40 ... Heat sink 41 ... High heat generating element 42 ... Holding fixing means 52a ... Terminal holding part

Claims (3)

A circuit board to which a plurality of high-heat-generating elements, which are housed and fixed inside the housing and arranged in an aligned state, are electrically connected;
A heat sink provided to form a part of the housing separately from the housing, and provided to dissipate heat of each high heat generating element by being disposed in proximity to each high heat generating element,
An element holding means made of a resin material having a terminal holding portion for holding a terminal of each of the high heat generating elements and positioned and fixed to the heat sink together with the high heat generating elements without holding the element body of each of the high heat generating elements When,
A metal reinforcing member inserted in the element holding means so as to extend along the alignment direction of the high heat generating elements, and used for suppressing deformation of the element holding means;
Equipped with a,
The electronic control apparatus , wherein the element holding means is fastened to the heat sink through a plurality of non-penetrating holes provided on an inner surface of the heat sink . The element holding means has an engaging protrusion that engages with the hole of the heat sink on a surface facing the heat sink, and positioning with respect to the heat sink is performed using the engaging protrusion. The electronic control device according to 1. The reinforcing member is provided so that a part thereof is exposed from the element holding means, and is fixed to the heat sink by the fastening member through a through hole formed in the exposed portion. The electronic control device according to 1 or 2.

Images